JP2001110322A - Electrode for plasma display panel, electrode pattern forming apparatus for plasma display panel, and electrode pattern forming method - Google Patents

Abstract

(57) [Problem] To provide an electrode of a plasma display panel which has a good quality of an obtained electrode pattern and is low cost, an electrode pattern forming apparatus for forming the electrode, and an electrode pattern forming method according to the present invention. . SOLUTION: The present invention relates to an electrode of a plasma display panel, wherein the film thickness at the center of the electrode line is larger than the film thickness at the periphery of the electrode. The apparatus includes a printing plate having a predetermined electrode pattern, a roller for applying a material for forming the electrode pattern to the printing plate, a blanket roller for transferring the material from the printing plate, and a substrate for forming the electrode pattern. And a moving mechanism for relatively moving the blanket roller and the substrate mounting portion. The blanket roller and the substrate mounting portion are provided with a material for forming the electrode pattern. It has a mechanism for transferring and forming a predetermined electrode pattern on the substrate by being sandwiched between the substrate and the substrate mounted thereon. .

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel electrode, a plasma display panel electrode pattern forming apparatus, and an electrode pattern forming method.

[0002]

2. Description of the Related Art In recent years, electronic circuit boards and displays have been required to be larger. Under such circumstances, there is a demand that the line width after firing is about 30 to 250 μm and the thickness after firing is 1 μm or more, and that the electrode pattern is formed with extremely high precision. Therefore,
Although photolithography has been used for its production, the production process is complicated, the material loss is large, and the development cost and capital investment for large-scale exposure equipment are enormous. There are problems such as limitations on the application size of the mask and the specifications of the coating machine.

For this reason, cost reduction has been attempted by using a printing method which has a simple process and has high productivity. Various intaglio offset printing methods are considered to be the most suitable printing methods for forming fine patterns with high accuracy.

However, the intaglio used in the intaglio offset printing method or the like is an intaglio made of metal or an intaglio made of glass, and a doctor blade is generally used for filling the intaglio with ink. However, this doctor has problems such as durability.

[0005] Since the conductive ink is formed to be thin with a thickness of about 1 to 20 µm when the conductive ink is transferred due to the influence of dust, dust and the like, there is a problem that a pinhole is generated and a hole is formed in the electrode. There are various possible causes, but if organic matter such as dust adheres to the electrode surface and the organic matter is burned off in the baking process to make holes, or if the printing method is used, dust etc. adheres to the blanket roll and pinholes May occur.

If the edge of the sectional shape of the formed electrode pattern is sharp, there is a problem that the edge of the electrode pattern is exposed by breaking through a predetermined layer formed on the electrode pattern.

In particular, a dielectric layer is formed on an electrode of a plasma display panel. If the edge of the electrode pattern is sharp, the dielectric layer formed on the electrode pattern is broken and the edge is exposed. There are cases. Further, when the edge of the electrode pattern is curled, this exposure phenomenon is particularly remarkable.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and provides an electrode of a plasma display panel, an apparatus for forming an electrode pattern of a plasma display panel, and a method of forming an electrode pattern. The purpose is to:

[0009]

The electrode of the plasma display panel according to the present invention is characterized in that the film thickness at the center of the electrode line is larger than the film thickness at the periphery of the electrode.

The film thickness at the center of the electrode line is 1 to 4 μm.
m is desirable.

The specific resistance of this electrode line is 2 to 10 μΩ.
cm.

The swell of the line width of this electrode line is ± 1.
It is desirable that the thickness be within 0 μm.

It is desirable to form the electrode by offset printing.

An apparatus for forming an electrode pattern of a plasma display panel according to the present invention comprises: a printing plate having a predetermined electrode pattern; a roller for applying a material for forming the electrode pattern to the printing plate; A blanket roller for transferring, a substrate mounting portion for mounting a substrate on which the electrode pattern is formed, and a moving mechanism for relatively moving the blanket roller and the substrate mounting portion; A mechanism for transferring and forming a predetermined electrode pattern on the substrate by sandwiching a material to be formed between the blanket roller and the substrate placed on the substrate placing portion;

The printing plate is preferably an intaglio having releasability.

It is desirable that a cooling unit is provided in the substrate mounting unit.

Furthermore, it is desirable that the electrode pattern formed on the printing plate is larger than the electrode pattern formed on the plasma display panel.

The electrode pattern forming method according to the present invention is characterized in that a predetermined electrode pattern is formed again on a predetermined electrode pattern formed on a substrate.

In this method, it is desirable that after the predetermined electrode pattern formed on the substrate is cured, the predetermined electrode pattern is formed again.

It is preferable that the upper surface of the predetermined electrode pattern formed on the substrate is flattened and then the predetermined electrode pattern is formed again.

In this method, a step of mounting a substrate on which a predetermined electrode pattern is formed on a substrate mounting portion, a step of applying a material for forming the electrode pattern on a printing plate having the electrode pattern, Transferring the material from the printing plate to a blanket roller, relatively moving the blanket roller and the substrate mounting portion, and transferring the material for forming the electrode pattern onto the blanket roller and the substrate mounting portion. And transferring a predetermined electrode pattern onto the substrate by sandwiching the electrode pattern between the substrate and the substrate fixed to the substrate.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, as an example of an embodiment of the present invention, an apparatus for forming an electrode of a plasma display panel will be described in detail with reference to the drawings. Of course, the present invention need not be limited to the electrodes of the plasma display panel. It can be used for forming electrode patterns of various displays and various wirings.

FIG. 1 is a view showing an electrode pattern forming apparatus according to an embodiment of the present invention. FIG. 1A is a side view, and FIG. 1B is a plan view.

In the main structure of the electrode pattern forming apparatus shown in FIG. 1, 1 is a print head, 2 is a blanket roll, 3 is a first ink roll group, 4 is a second ink roll group, 5 is a guide rail, Reference numeral 7 denotes a printing plate, 8 denotes a printing platen, 9 denotes a substrate position, and 10 denotes a printing plate position. In addition,
It is constituted by a moving mechanism (not shown) for moving the print head 1.

The printing head 1 includes a blanket roll 2 for transferring a predetermined electrode pattern from a printing plate and a first inking roll group 3. The first inking roll group 3 includes a first ink kneading roller that swings in the rotation axis direction of the roll, and an inking roll that applies ink to a printing plate. The second inking roll group 4 includes an ink blade for storing ink, an ink discharging roll for discharging ink from the ink blade, and a second ink kneading roller that swings in the rotation axis direction of the roll.

Since the ink blade is fixed to one side of the electrode pattern forming apparatus as shown in FIG. 1, the supply of the conductive ink can be facilitated. Different from this configuration, the ink blade may be attached to the print head 1 without the second inking roll group 4.

A glass substrate for a plasma display panel, which is an object on which an electrode pattern is formed, is placed on a printing platen 8. The substrate is placed like substrate position 9. The printing plate on which the electrode pattern is formed is placed on the printing plate 7. The printing plate is placed like printing plate position 10.

The conductive ink which is an electrode forming material has a
Are held by the ink blades of the inking roll group 4. A necessary amount of the conductive ink held by the ink blade is taken out from an ink-discharge roll, and the printing plate is filled with the conductive ink while being kneaded by an ink kneading roller.
That is, the fluidity of the conductive ink is improved, and the filling of the printing plate is performed uniformly. As a result, there was no region where the specific resistance was partially increased, the power loss could be kept small, and the supply power that contributed to the light emission of the plasma display panel could be increased.

First, the print head 1 starts moving slowly on the guide rail 5 from the second inking roll group 4 side of the electrode pattern forming apparatus shown in FIG. The printing ink is filled with the conductive ink kneaded and uniformized by the second inking roll group 4 via the first inking roll group 3 of the print head 1.

Here, an intaglio is used as the printing plate. As the intaglio plate, a silicon plate, a waterless plate, or a printing plate obtained by subjecting a glass plate, a metal plate, or a ceramic plate to a release treatment can be used. The length and width of the electrode pattern formed on the printing plate are designed and manufactured to be slightly larger than the electrode pattern formed on the glass substrate after the firing step. The degree of the dimension at the time of this design is obtained by experiment in advance. Specifically, it is determined based on the type of the conductive material, the type of the glass substrate, the profile of the firing temperature, and the like when the electrode pattern is printed on the glass substrate of the plasma display panel to be manufactured. Also, since the electrode pattern shrinks during printing, it is necessary to consider the shrinkage ratio after printing. This enables more accurate printing of the electrode pattern of the plasma display panel.

After the printing plate is filled with the ink, the printing head 1 returns to the second inking roll group 4 while kneading the ink with the first inking roll group 3. At this time, the blanket roll is raised so as not to touch the printing plate or the like. This filling operation is performed once. However, when the depth of the concave portion of the intaglio plate is deep, it is preferable that the filling operation is repeated twice or more to sufficiently fill the intaglio plate with the conductive ink. Then, when returning to the second inking roll group 4 side, the conductive ink kneaded and uniformized by the second inking roll group 4 is transferred to the first inking roll group 3 of the print head 1. I do. Again, the print head 1 starts moving slowly on the guide rail 5 from the second inking roll group 4 side of the electrode pattern forming apparatus shown in FIG.

The conductive ink applied to the printing plate placed on the printing plate 7 is transferred to the blanket roll 2 of the printing head 1 according to the electrode pattern formed on the printing plate. The blanket material used here is silicon, NB
It is made of a material such as R, butyl rubber, urethane, etc., and has a surface hardness of 35 to 80 degrees and a surface gloss of 7 to 90 degrees.
Good degree. Then, a conductive ink is applied to the printing plate placed on the printing plate 7 by the first inking roll group 3 for the next printing.

The conductive ink transferred to the blanket roll 2 is transferred to a glass substrate of a plasma display panel placed on a printing platen 8 for printing. Thereby, the electrode pattern of the conductive ink in which the conductive particles are uniformly dispersed on the glass substrate is formed according to the electrode pattern formed on the printing plate. As a result, even if the conductive ink is transferred from the blanket, the line width of the electrode pattern transferred on the glass substrate does not become large and non-uniform, and no large meandering occurs. Here, when the print head 1 returns to the second inking roll group 4 side, the printing may be overlaid. In addition, when the print head 1 returns to the second inking roll group 4 side, the printing ink returns while transferring the conductive ink from the printing plate to the blanket roll, and when the print head 1 advances again, the conductive ink is overlaid on the blanket roll. May transfer. By doing so, the electrode pattern can be formed thick. Further, holes generated in the electrode pattern can be prevented.

In this way, by forming the same electrode pattern again on the electrode pattern formed on one glass substrate, holes generated in the electrode pattern can be prevented. The holes are regions where the conductive material generated on the electrode pattern is not applied. By eliminating holes as defects, the electrode pattern on the glass substrate can be a dense film after firing. As a result, the specific resistance of the formed electrode can be set to 2 to 10 μΩ · cm.

Although the above is repeated again, in the electrode pattern forming apparatus, the conductive ink stored in the ink blade is transferred to the printing plate on the printing plate 7 while moving the printing head 1, and then the blanket roll 2 is moved. Then, printing on the glass substrate on the printing platen 8 is repeated twice.
Of course, the same effect can be obtained even if it is repeated three or more times.

Of course, two sets of printing plates and blanket rolls having the same pattern are prepared, and conductive ink is transferred from each blanket roll to one glass substrate and printed twice or more times on the glass substrate to form electrodes. May be. In addition, using two printing plates having the same pattern, conductive ink was applied to each of the printing plates on a blanket roll.
The electrode may be formed by printing the conductive ink on the blanket roll, which has been transferred more than once, onto the glass substrate at one time.

Further, in order to facilitate overprinting,
After printing the electrode pattern once on the glass substrate, the electrode pattern may be crushed by the pressing roll to facilitate the second and subsequent printing. As the pressing roll at this time, it is preferable to use a silicon roll, a roll wound with a waterless plate, a silicon blanket, or the like.

As another example for facilitating overprinting, after printing an electrode pattern once on a glass substrate, the electrode pattern is heated and dried, or an ultraviolet curable resin is added to the ink. It is good to cure with ultraviolet rays. Of course, electron beam curing may be used. For example, the ultraviolet light source is installed above the printing platen 8 and
After forming an electrode pattern on the glass substrate by using, the shutter is opened to irradiate the electrode pattern on the glass substrate. Alternatively, the ultraviolet light source is installed above the printing platen 8 and forms an electrode pattern on the glass substrate with the print head 1 and then turns on to irradiate the electrode pattern on the glass substrate. In the case of heating, heating may be performed at all times.

Since there is a rotating portion such as a roll, it is necessary for the electrode pattern forming apparatus to prevent dust and dust from adhering. If a static eliminator is installed around the glass substrate, around the printing plate, and around the blanket roll, the yield rate is improved because dust and dust do not adhere to the glass substrate, the printing plate, and the blanket roll.

In order to prevent the conductive ink from adhering to the ink-unnecessary portions of the printing plate, a cooling unit may be provided to control the temperature of the printing plate 7 to 10 to 25 ° C. The cooling unit may be embedded in the printing plate 7. Further, by controlling the temperature around the printing plate, the printing plate 7 can
The temperature may be controlled so as to be about 25 ° C. The conductive ink adheres to the glass substrate as a result of the conductive ink adhering to the unnecessary portions. This causes a short circuit of the electrode pattern.

In addition, in order to suppress a change in ink viscosity due to a temperature change, a temperature adjusting unit may be provided in each roll or the like. Further, a temperature adjusting unit may be provided on the printing platen 8 in order to control the transfer amount of the conductive ink and the like.

The conductive ink forming the electrodes of the plasma display panel includes conductive particles of 60 to 90 wt.
%, Glass frit 0-10 wt%, organic component 9-30
%, and the total of these is 100 wt%. The tack value of the conductive ink is preferably 20 or more. As the type of ink, an ultraviolet curing type or an oxidative polymerization type is preferable. In addition, the conductive ink forming the electrodes of the plasma display panel includes conductive particles of 60 to 90 wt% and glass frit of 0 to 10 wt%.
%, An organic component of 9 to 30 wt%, and an inorganic component of 0 to 10
The conductive ink may be added in an amount of about wt%, and the total thereof may be 100 wt%.

The conductive particles used in this conductive ink are
The average particle size is preferably 0.01 to 2 μm, more preferably
Are conductive particles having an average particle size of 0.03 to 1 μm (specifically,
Is a powder of Ag, Au, Cu, Al, Pt, Ni, Pd, etc.
Or a mixture of the bodies). This conductive ink is recessed
When applied to the plate, conductive at the ink-free part of the intaglio
The repellency of the water-based ink improves, and the ink protrudes from the intaglio.
It is possible to accurately fill the intaglio without having to do so. Sa
In addition, since fine conductive particles are uniformly dispersed,
Eliminates damage such as scratches on the plate. Furthermore, this conductive
The conductive particles used in the ink have a tap density of 2 to 5 g / c.
m ^ThreeAnd a tap density of 3 to 5 g / c is more preferable.
m^ThreeIs good. The specific surface area is 0.3 to 5 m^Two/ G is good.
The shape of the conductive particles can be spherical, irregular, massive,
The shape may be a rake shape. It also reduces powder agglomeration.
Surface treatment on the powder,
The above effect is greater when the powder is added to the conductive ink.
You.

An electrode pattern is formed with a conductive ink containing glass frit, and the electrode is formed on a glass substrate by firing at 470 to 600 ° C. By forming the electrode on the glass substrate in this manner, the adhesion between the electrode and the glass substrate can be improved. The average particle size of the glass frit, 0.3 to 2 [mu] m C., and a softening point of four hundred and fifty to five hundred eighty ° C. C., the thermal expansion coefficient of the glass frit may have 70~95 × 10- ⁷ / ℃. The material of the glass frit is PbO / SiO containing no alkali component.
_{A 2} / B ₂ O ₃ -based or Bi ₂ O ₃ -based glass frit is preferred. Such a material is called alkali-free, and since there is no alkali component, deterioration of the electrode hardly occurs.

Then, the conductive ink is applied to an intaglio plate by an inking roll and filled. Two inking rolls are used. This makes it possible to apply and fill the conductive ink to the intaglio with the first inking roll, and to properly fill the intaglio with the second inking roll. In other words, the second inking roll can be additionally charged if the intaglio printing plate is insufficiently filled with the conductive ink. Conversely, if the amount of the conductive ink on the intaglio is large, it is removed, and while the conductive ink is kneaded again by the kneading roller, the fluid is maintained and maintained in a uniform flowability, viscosity, etc., and the intaglio is again coated and filled. Of course, it is also possible to use a roller having a larger diameter than the illustrated inking roll to fill the intaglio plate with the conductive ink using one inking roll. Also, 2
The number of inking rolls of the book may be three or more. However, ink can be applied with only one inking roll.

The substrate mounting portion is for mounting a glass substrate on which a predetermined electrode pattern is formed based on the intaglio, and then suction-fixing the glass substrate. It is used for a printing platen 8 on which a glass substrate of a plasma display panel is placed. Further, it can also be used for a printing plate 7 on which a printing plate for forming an electrode pattern is placed.

As shown in the plan view of the substrate mounting portion in FIG. 2A, in order to mount substrates of two sizes,
A first substrate position 25 with two corners in common as a reference point 20,
A second substrate position 26 is provided. Here, the position is determined such that each of the substrates is at a predetermined position with one vertical substrate positioning member 27 and two horizontal substrate positioning members 28. Of course, it is not limited to two types of substrates. Here, since each of the positioning members 27 and 28 is a cylindrical body, the point of contact with the glass substrate is determined at two points. For this reason, the position of the substrate is easier to determine than in the case of a rectangular parallelepiped contacting the substrate with a line. Further, at the time of positioning by the positioning members 27 and 28, one positioning member 27 and two positioning members 28 were determined.
If more than this number, it is difficult to adjust the position of the positioning member. For this reason, the position at which the positioning is performed may change depending on the size of the substrate. Further, a first suction groove 21, a second suction groove 22, a third suction groove 23, and a plurality of suction holes corresponding to each groove are selectively used according to the size of each substrate so that these substrates can be fixed. The hole 24 is machined.

The position of the substrate may be determined by using a CCD camera or the like without using the positioning members 27 and 28 to extract the alignment mark formed on the substrate or the edge of the substrate. May be used to control the position of the glass substrate to be printed next using the electrode pattern or alignment mark printed on the glass substrate.

FIG. 2B shows a first suction groove 21 and a third suction groove 23 formed on the substrate mounting portion and a plurality of suction holes 2.
4 shows a sectional view. Thus, the suction hole is formed in the bottom surface of the suction groove. When the glass substrate is placed on the first substrate position 25, the first suction groove 21 and the second suction groove 22 are selected, and these suction grooves 21 and 22 are selected.
Is selected to suck and fix the glass substrate placed on the first substrate position. Similarly, when a glass substrate is placed on the second substrate position 26, the first suction groove 21 and the third suction groove 23 are selected, and the suction corresponding to these suction grooves 21 and 23 is performed. The hole 24 is selected to suck and fix the glass substrate placed on the second substrate position.

FIG. 3 is a plan view of an electrode pattern formed on an intaglio printing plate. Of course, it is not limited to this pattern. Generally straight type, center split type,
There is a comb-shaped electrode pattern. Here, the electrode pattern 31 of the display section of the plasma display panel is formed in the center of the glass substrate as a predetermined electrode pattern, and the electrode pattern 3 of the terminal section provided for connection with an external circuit is formed.
2 are formed at opposite ends of the glass substrate, and alignment marks 33 for alignment used for sequentially superposing layers having various functions on the glass substrate to be formed to form a multilayer are formed. ing. By forming the intaglio in this way, the electrode pattern 31 of the main display portion, the electrode pattern 32 of the connection terminal portion, and the alignment mark 33 for positioning can be simultaneously formed in one electrode pattern forming operation. Thus, a predetermined electrode pattern can be formed at a time.

The electrode pattern forming operation is performed a plurality of times (2.
When the electrode pattern is formed by repeating the above (about 3 times), the electrode pattern can be further thickened, and the resistance of the electrode can be reduced. It also has the effect of reducing defects such as pinholes.

The intaglio plate as a printing plate is obtained by releasing a silicon plate, a waterless plate, or a glass plate, a metal plate, or a ceramic plate. In particular, the waterless version (Toray Industries, Inc.
Presstec). The plate depth is 1 to 10 μm
Is good. More preferably, it is 3 to 8 μm.

The conductive ink is transferred from the intaglio printing plate to the blanket roll by the electrode pattern forming apparatus shown in FIG. 1 having the intaglio plate and the substrate mounting portion as described above. A predetermined electrode pattern is formed on the glass substrate by being sandwiched between the glass substrate fixed to the substrate. Thus, the cross-sectional shape of the electrode pattern formed on the glass substrate becomes an electrode pattern 51 in which the film thickness at the center of the electrode is large and the film thickness at the periphery is thin as shown in FIG. By forming an electrode pattern on a glass substrate by the electrode pattern forming apparatus shown in FIG. 1, the edge of the cross-sectional shape of the formed electrode pattern is not sharp. At this time, the cross-sectional shapes of the electrode pattern 51 and the upper dielectric layer 54 are shown in FIG.
The result is as shown in FIG. Therefore, it is possible to prevent the problem that the edge of the electrode pattern is exposed from a predetermined layer such as a dielectric multilayer formed on the electrode pattern 52 as shown in FIG.

When any of the following processes is performed on the glass substrate on which the electrode pattern is printed, the wettability and the contact area between the glass substrate and the electrode can be controlled.
This process controls the wettability and the contact area between the glass substrate and the electrode. Of course, each process may be combined. By performing this process on a glass substrate, the thickness and shape of the electrode pattern can be controlled. Treatment 1: The surface of the glass substrate is made rough with irregularities. Treatment 2: A silane coupling agent is applied to the surface of the glass substrate. Treatment 3: A corona discharge treatment is performed on the surface of the glass substrate. Process 4: Antistatic treatment is performed on the surface of the glass substrate. Process 5: The surface of the glass substrate is coated with a resin. Process 6: Cleaning the surface of the glass substrate.

Hereinafter, although not shown, three examples are shown as examples at the time of overprinting. As type 1, a pressing roll is arranged behind the blanket roll of the print head 1. Thus, after the electrode pattern is formed on the glass substrate by the print head 1 of FIG. 1, the upper surface of the electrode pattern formed on the glass substrate is crushed by the pressing roll disposed behind the blanket roll of the print head 1. Thereby, the cross-sectional shape of the electrode pattern formed on the glass substrate becomes an electrode pattern having a flat upper surface and a curved periphery. In addition, the pressing roller that has been stained with the conductive ink can be cleaned with a cleaning roller. Thus, the upper surface of the electrode pattern formed on the glass substrate can be constantly crushed by the clean surface of the pressing roll, and dirt does not adhere to the electrode pattern.

As a type 2, a UV is provided above the printing platen 8.
Install the lamp. After transferring the conductive ink from the blanket roll 2 of the print head 1 to the glass substrate, UV irradiation is performed. In parallel with this, a photocurable resin such as a UV resin is used for the conductive ink. In this manner, the electrode pattern can be cured while the electrode pattern is formed on the glass substrate by the UV lamp provided above the printing platen 8.

As a type 3, a UV is provided above the printing platen 8.
Install the lamp. A press roll is provided behind the blanket roll 2 of the print head 1. In this way, after the conductive ink is transferred from the blanket roll 2 of the print head 1 to the glass substrate, UV irradiation is performed. Thus, after the electrode pattern is hardened, the upper surface of the electrode pattern may be flattened by a pressing roll to form an electrode pattern having a thin and curved periphery.

As described above, the three types include the pressing roll and the UV.
By expanding the function of the electrode pattern forming apparatus shown in FIG. 1 using a resin, an electrode pattern can be easily formed again on an electrode pattern formed on a glass substrate.

The components of the conductive ink used in the present invention will be described.

The organic components of the conductive ink used in the present invention may be selected from the following. Alkyd resin, modified alkyd resin, modified epoxy resin, urethane oil, rosin oil, maleated oil, polybutene resin,
Vegetable oil, mineral oil, maleic acid resin, diallyl phthalate resin, polyester resin, polyester oligomer, urethane resin, urethane oligomer.

As an additive to the conductive ink,
You can choose from the following: Dispersant, wetting agent, thickener, leveling agent, antifouling agent, silicone oil,
You may add a silicone resin, an antifoamer, a plasticizer, etc.

In the case of an oxidative polymerization type conductive ink, an oxidative polymerization catalyst, an oxidative polymerization inhibitor, a polymerization inhibitor and the like are used.

In the case of a UV type conductive ink, an initiator, a polymerization inhibitor and a monomer are used.

The initiator for the UV-type conductive ink is one which is volatilized and decomposed by firing and does not leave carbides in the film after firing. Specifically, benzphenone, methyl o-benzoylbenzoate, 4,4-
Bis (dimethylamine) benzephenone, 4,4-bis (diethylamine) benzephenone, α-amino acetophenone, 4,4-dichlorobenzephenone, 4-
Benzoyl-4-methyldiphenyl ketone, dibenzyl ketone, fluorenone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, p
-Tert-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyldimethylketal, benzylmethoxyethylacetal, benzoylmethylether, benzoinbutylether, anthraquinone, 2-
tert-butylanthraquinone, 2-amylanthraquinone, β-chloroanthraquinone, anthrone, benzanthraquinone, dibensuberone, methyleneanthrone, 4-azidobenzylacetophenone, 2,6-
Bis (p-azidobenzylidene) cyclohexane, 2,
6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2-phenyl-1,2-butadione-2
-(O-methoxycarbonyl) oxime, 1-phenyl-propanedione-2- (o-ethoxycarbonyl) oxime, 1,3-diphenyl-propanetrione-2-
(O-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxy-propanetrione-2- (o-benzoyl) oxime, Michler's ketone, 2-methyl- [4-
(Methylthio) phenyl] -2-morpholino-1-propane, 2-benzyl-2-dimethylamino-1- (4
-Morpholinophenyl) -butanone-1, naphthalenesulfonyl chloride, quinoline sulfonyl chloride, n-phenylthioacridone, 4,4-azobisisobutyronitrile, diphenyl disulfide, benzthiazole disulfide, triphenylphosphine, camphorquinone, Examples include a combination of a photoreducing dye such as carbon tetrabromide, tripromophenyl sulfone, benzoin peroxide, eosin, and methylene blue and a reducing agent such as ascorbic acid and triethanolamine. These can be used alone or in combination of two or more.

The monomers of the UV type conductive ink are those which do not volatilize and decompose upon firing and do not leave carbides in the film after firing, and include polyfunctional and monofunctional reactive monomers. be able to. Specifically, acrylic acrylate, benzyl acrylate, butoxyethyl acrylate, butoxyethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidin acrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl Propyl acrylate, isobonyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, decyl acrylate,
-Methoxyethyl acrylate, methoxyethylene glycol acrylate, phenoxyethyl acrylate,
Stearyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, 1,4
-Butanediol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,3-propanediol acrylate,
1,4-cyclohexanediol diacrylate, 2,
2-dimethylolpropane diacrylate, glycerol diacrylate, tripropylene glycol diacrylate, glycerol triacrylate, trimethylolpropane triacrylate, ethylene oxide-modified trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, triethylene glycol Diacrylate, propylene oxide-modified trimethylolpropane triacrylate, butylene glycol diacrylate, 1,2,4-butanetriol triacrylate,
2,2,4-trimethyl-1,3-pentadiol diacrylate, diallyl fumarate, 1,10-decanediol dimethyl acrylate, dipentaerythritol hexaacrylate, polyester acrylate, urethane acrylate, epoxy acrylate, and the above acrylate Converted to methacrylate, γ-
Methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone, and the like. In the present invention, the above monomers can be used as one kind or as a mixture of two or more kinds.

As the inorganic component of the conductive ink used in the present invention, an inorganic powder such as aluminum oxide, boron oxide, silica, titanium oxide, zirconia, magnesium oxide, calcium oxide, strontium oxide, barium oxide, and calcium carbonate is used. 10 per 100 parts by weight of particles
It can be contained in the range of not more than part by weight. Such an inorganic component has an average particle diameter of 0.005 to 3 μm.
The range of is preferred, to impart the thixotropy of the photosensitive conductive ink, conductive powder, or to suppress the sedimentation of glass frit,
In addition, it acts as an aggregate to prevent the pattern from flowing out during firing. Further, in order to improve the contrast, a fire-resistant black pigment may be contained as an inorganic powder. As a black pigment, Co-Cr-Fe, Co-Mn
-Fe, Co-Fe-Mn-Al, Co-Ni-Cr-
Fe, Co-Ni-Mn-Cr-Fe, Co-Ni-A
l-Cr-Fe, Co-Mn-Al-Cr-Fe-Si
And the like, and 1 to 2 parts by weight per 100 parts by weight of the conductive particles.
It can be contained in the range of 0 parts by weight.

[0067]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The electrode pattern of the back plate of a plasma display panel is printed on a glass substrate (model name: PD200) using an offset printing machine shown in FIG. An electrode pattern was formed.

First, the cooling unit installed inside the printing plate 7 was adjusted to set the temperature of the printing plate 7 to 20 ° C. An NBR blanket having a surface gloss (gloss value) of 70 degrees was used for the blanket roll. The printing plate is an intaglio plate having a depth of 4 μm and a waterless plate manufactured by Toray Industries, Inc. (model name: TAP2
4) was used. The composition of the conductive ink used at this time is shown below. The tack value of this ink was 30. (Composition) Ag powder (average particle size 0.3 μm, tap density 4.5 g / cm ³ ) 78 parts by weight Glass frit 2 parts by weight (Bi ₂ O ₃ type, alkali-free, coefficient of thermal expansion 90 × 10 ⁻⁷ / ° C.) Average particle size 0.8 μm, softening point 480 ° C., Tg 430 ° C.) 20 parts by weight of alkyd resin

Then, at a printing speed of 600 mm / sec,
The electrode pattern was superposed and printed on the glass substrate four times.
The thickness of the central part of the electrode pattern after printing was measured and found to be 6 μm. Thereafter, the glass substrate on which the electrode pattern was formed was fired at 570 ° C. As a result, the following electrode patterns could be formed on the glass substrate of the plasma display panel. The shape of the electrode pattern is shown in FIG.
It has a shape as shown in FIG.
m, the peripheral portion was thin and 1.0 μm or less. The line width of the electrode pattern was 70 μm. The undulation of the line width of the electrode pattern was within ± 5 μm. The specific resistance of the electrode pattern was 2.8 μΩ · cm. There were no defects such as disconnection, short circuit, and hole (also called pinhole), and a good electrode could be formed. For this reason, the defect shown in FIG. 4C did not occur in the dielectric layer formed on the electrode.

[0070]

According to the present invention, an electrode pattern of a plasma display panel is formed with high accuracy, that is,
It is easy to manufacture large products that faithfully express the line width and thickness of the electrode pattern desired. As a first effect, a large substrate desired in an electronic circuit board, a display, or the like can be manufactured at low cost. As a second effect, the material of the electrode pattern is completely transferred to the blanket, and a predetermined film thickness is obtained. As a third effect, the line width, which is the shape of the electrode pattern, becomes substantially uniform, and meandering can be suppressed. As a fourth effect, no hole is formed in the electrode even under the influence of dust, dust and the like. As a fifth effect, the edge of the sectional shape of the formed electrode pattern is gentle. Therefore, there is no possibility that the edge of the electrode pattern is exposed by breaking through a predetermined layer formed on the electrode pattern. As a sixth effect, a predetermined electrode pattern can be obtained even if the electrodes shrink after the firing step.

[Brief description of the drawings]

FIG. 1 is a diagram showing an electrode pattern forming apparatus according to an embodiment of the present invention.

FIG. 2 is a view showing a printing platen of the electrode pattern forming apparatus according to the embodiment of the present invention.

FIG. 3 is a diagram showing an electrode pattern according to the embodiment of the present invention.

FIG. 4 is a view showing a substrate on which an electrode pattern according to the embodiment of the present invention is formed.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 print head 2 blanket roll 3 inking roll group 4 guide rail 5 ink platen 6 printing plate 7 printing platen 8 substrate position 40 glass substrate 41 electrode pattern 44 dielectric layer

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yozo Kosaka 1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo Inside Dai Nippon Printing Co., Ltd. (72) Inventor Ken Sasaki 1-chome, Ichigaya-cho, Shinjuku-ku, Tokyo No. 1 Dai Nippon Printing Co., Ltd. F term (reference) 5C027 AA02 5C040 FA01 FA04 GB03 GC02 GC03 GC18 GC19 JA12 JA19 JA20 JA28 JA31 KA01 KA04 KA09 KA14 KB02 KB03 KB04 KB18 KB29 MA23 MA24 MA25 MA26 5C094 AA05 AA19 DA13 EA04 EA10 EB02 FB01 FB02 FB12 GB10 JA05 JA08

Claims (13)

[Claims] 1. An electrode for a plasma display panel, wherein a film thickness at a central portion of an electrode line is larger than a film thickness at a peripheral portion of the electrode. 2. The electrode according to claim 1, wherein the central part of the electrode line has a thickness of 1 to 4 μm. 3. The electrode line having a specific resistance of 2 to 10 μΩ · cm.
The electrode of the plasma display panel according to claim 1, wherein: 4. An undulation of a line width of an electrode line is ± 10 μm.
4. The electrode of the plasma display panel according to claim 1, wherein the distance is within m. 5. The electrode of a plasma display panel according to claim 1, wherein said electrode is formed by offset printing. 6. A printing plate having a predetermined electrode pattern, a roller for applying a material for forming the electrode pattern to the printing plate, a blanket roller for transferring the material from the printing plate, and forming the electrode pattern. And a moving mechanism for relatively moving the blanket roller and the substrate mounting section. A material for forming the electrode pattern is transferred to the blanket roller and the substrate mounting section. An electrode pattern forming apparatus for a plasma display panel, comprising: a mechanism for transferring and forming a predetermined electrode pattern on a substrate by sandwiching the electrode pattern between the substrate and a substrate mounted on a mounting portion. 7. The apparatus according to claim 5, wherein the printing plate is an intaglio plate having releasability. 8. The apparatus according to claim 5, wherein a cooling unit is provided in the substrate mounting unit. 9. The apparatus according to claim 5, wherein an electrode pattern formed on the printing plate is larger than an electrode pattern formed on the plasma display panel. 10. A method for forming an electrode pattern, wherein a predetermined electrode pattern is formed again on a predetermined electrode pattern formed on a substrate. 11. The method for forming an electrode pattern according to claim 9, wherein after the predetermined electrode pattern formed on the substrate is cured, the predetermined electrode pattern is formed again. 12. The electrode pattern forming method according to claim 9, wherein a predetermined electrode pattern is formed again after the upper surface of the predetermined electrode pattern formed on the substrate is flattened. 13. A step of mounting a substrate on which a predetermined electrode pattern is to be formed on a substrate mounting portion; a step of applying a material for forming the electrode pattern to a printing plate having the electrode pattern; Transferring from a printing plate to a blanket roller, relatively moving the blanket roller and the substrate mounting portion, and fixing a material for forming the electrode pattern on the blanket roller and the substrate mounting portion. And transferring a predetermined electrode pattern onto the substrate by sandwiching the electrode pattern between the substrate and the substrate.