JP2001102158A - Heater structure - Google Patents
Heater structureInfo
- Publication number
- JP2001102158A JP2001102158A JP27793199A JP27793199A JP2001102158A JP 2001102158 A JP2001102158 A JP 2001102158A JP 27793199 A JP27793199 A JP 27793199A JP 27793199 A JP27793199 A JP 27793199A JP 2001102158 A JP2001102158 A JP 2001102158A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heater
- epoxy resin
- metal substrate
- glass layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 31
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 20
- 230000001681 protective effect Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 14
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 70
- 239000011241 protective layer Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract 2
- 239000000203 mixture Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910020617 PbO—B2O3—SiO2 Inorganic materials 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、水に直接浸漬して
も耐水性や耐腐食性に長期間優れるヒータの構造、およ
びかかる構造をもつ板状またはパイプ状ヒータに関す
る。特に、水を直接加熱し、短時間で温水を提供するた
めに使用するヒータに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heater having excellent water resistance and corrosion resistance even when immersed directly in water for a long period of time, and to a plate or pipe heater having such a structure. In particular, the present invention relates to a heater used to directly heat water and provide hot water in a short time.
【０００２】[0002]
【従来の技術】電気温水器や温水器付き便座などのよう
に、短時間で適度な温度の温水を提供する装置や器具が
ある。これらの装置においては、水道水を直ちに、可能
なら連続的に所望の温度まで上げるため、通常、セラミ
ックヒータを用いて直接加熱したり、電熱器を防水して
浸漬したり、さらには水の通ったパイプなどを外部から
間接的に加熱（熱交換）したりしている。2. Description of the Related Art There are devices and appliances which provide hot water of an appropriate temperature in a short time, such as an electric water heater or a toilet seat with a water heater. In these devices, in order to raise the tap water to the desired temperature immediately, if possible, continuously, it is usually heated directly by using a ceramic heater, or immersed by waterproofing the electric heater, or even by passing water through. Indirectly heating (heat exchange) pipes and the like from outside.
【０００３】しかし、セラミックヒータは高価であるほ
かヒートショックに弱く、短尺であり汎用性に欠け、電
熱器を防水して浸漬する方法は長期間の防水が困難であ
るほかヒータ自身の熱容量が大きいため熱交換率がわる
い。また、外部からの熱交換は熱効率に劣る。However, ceramic heaters are expensive and vulnerable to heat shock, are short and lack versatility, and the method of waterproofing and immersing an electric heater is difficult to waterproof for a long period of time, and the heat capacity of the heater itself is large. The heat exchange rate is poor. Further, heat exchange from the outside is inferior in heat efficiency.
【０００４】最近、セラミックヒータに代えて、板状の
金属基板の一方の表面上に絶縁ガラス層および銀−パラ
ジウム系の抵抗体層がこの順で積層されてなる発熱回路
を印刷したのち乾燥焼成し、最外層として保護ガラス層
を設けた板状ヒータが提案されている。[0004] Recently, instead of a ceramic heater, a heating circuit in which an insulating glass layer and a silver-palladium-based resistor layer are laminated in this order on one surface of a plate-shaped metal substrate is printed, and then dried and fired. A plate heater provided with a protective glass layer as the outermost layer has been proposed.
【０００５】この板状ヒータは、最外層の保護ガラス層
が耐水性に弱いという問題点があり、特に水に浸漬した
ままでは長期間にわたる耐水性、耐食性を維持できな
い。[0005] This plate-shaped heater has a problem that the outermost protective glass layer is poor in water resistance. In particular, it cannot maintain water resistance and corrosion resistance for a long period of time when immersed in water.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、水に浸漬し
たままであっても、耐水性や耐食性、防錆性、耐電圧な
どを長期間にわたって維持できる構造をもつヒータを提
供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a heater having a structure capable of maintaining water resistance, corrosion resistance, rust resistance, withstand voltage, etc. for a long period of time even when immersed in water. is there.
【０００７】[0007]
【課題を解決するための手段】すなわち本発明は、金属
基板、該金属基板の少なくとも一方の表面に絶縁ガラス
層および銀−パラジウム系の抵抗体層がこの順で積層さ
れてなる発熱部、ならびに該銀−パラジウム抵抗体層上
に保護用ガラス層、エポキシ樹脂層およびフッ素樹脂層
がこの順で積層されてなる保護部からなるヒータの構造
に関する。That is, the present invention relates to a heat generating portion comprising a metal substrate, an insulating glass layer and a silver-palladium-based resistor layer laminated in this order on at least one surface of the metal substrate; The present invention relates to a heater structure comprising a protective portion in which a protective glass layer, an epoxy resin layer and a fluororesin layer are laminated in this order on the silver-palladium resistor layer.
【０００８】かかるヒータの形状は、板状でもパイプ状
であってもよい。[0008] The shape of the heater may be plate-like or pipe-like.
【０００９】[0009]
【発明の実施の形態】図面にしたがって本発明の構造を
説明する。図１は本発明のヒータの構造を説明するため
の概略断面図である。図２は本発明の構造をもつヒータ
の概略平面図、図３は図２において本発明における保護
部を取り除いたときの概略平面図である。ただし、説明
を容易にするために、各層の寸法は拡大または縮小して
記載してある。DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of the present invention will be described with reference to the drawings. FIG. 1 is a schematic sectional view for explaining the structure of the heater of the present invention. FIG. 2 is a schematic plan view of a heater having the structure of the present invention, and FIG. 3 is a schematic plan view of the heater in FIG. However, the dimensions of each layer are enlarged or reduced for ease of explanation.
【００１０】図１において１は金属基板であり、この実
施態様では板状のものを使用している。金属基板として
は種々の金属が使用できるが、背面も加熱部として利用
する場合は熱伝導率の小さな金属が好ましい。具体例と
しては、たとえばステンレススチール、銅、アルミニウ
ム、鉄などがあげられ、特にステンレススチールが安価
でかつ耐食性がよいことから好ましい。金属基板の寸法
は、使用目的、使用箇所、要求特性などによって適宜決
めればよいが、板状の場合は約０．８〜３．０ｍｍ厚と
するのが好ましい。パイプ状の場合は後述する（図５お
よび図６）。In FIG. 1, reference numeral 1 denotes a metal substrate. In this embodiment, a plate is used. Various metals can be used as the metal substrate, but when the back surface is also used as a heating unit, a metal having a small thermal conductivity is preferable. Specific examples include, for example, stainless steel, copper, aluminum, iron, and the like. In particular, stainless steel is preferable because it is inexpensive and has good corrosion resistance. The dimensions of the metal substrate may be appropriately determined according to the purpose of use, the place of use, required characteristics, and the like. The case of the pipe shape will be described later (FIGS. 5 and 6).
【００１１】かかる金属基板１の少なくとも一方の表面
に絶縁ガラス層２を設ける。この絶縁ガラス層は、通常
厚さ０．０６〜０．１ｍｍ程度であり、ガラスの種類と
してはＢａＯ／ＳｉＯ2／ＣａＯ／ＳｒＯ（たとえば重
量比：３０〜５０／１５〜３０／１０〜２０／１〜５）
のガラス、特にこの組成の結晶化ガラスなどが使用でき
る。An insulating glass layer 2 is provided on at least one surface of the metal substrate 1. The insulating glass layer is usually in a thickness of about 0.06～0.1Mm, as the type of glass BaO / SiO 2 / CaO / SrO ( e.g. weight ratio: 30-50 / 15-30 / 10-20 / 1-5)
, Especially crystallized glass of this composition can be used.
【００１２】絶縁ガラス層２上には、銀−パラジウム系
の抵抗体層３がパターンとして設けられており（図２参
照）、両者で発熱部を構成している。抵抗体層３は端部
で銀を主体とする端子用の導電層４と電気的に接続され
ている。抵抗体層３の厚さは８〜１５μｍ程度である。
通常、抵抗体層３と端子用導電層４との接続部分は水に
浸漬されない。On the insulating glass layer 2, a silver-palladium-based resistor layer 3 is provided as a pattern (see FIG. 2), and both of them constitute a heating section. The resistor layer 3 is electrically connected to a terminal conductive layer 4 mainly composed of silver at an end. The thickness of the resistor layer 3 is about 8 to 15 μm.
Usually, the connection portion between the resistor layer 3 and the terminal conductive layer 4 is not immersed in water.
【００１３】つぎに本発明の重要な特徴である保護部を
説明する。保護部は抵抗体層３の上には保護用ガラス層
５とエポキシ樹脂層６とフッ素樹脂層７から構成され
る。Next, the protection part which is an important feature of the present invention will be described. The protection section is composed of a protection glass layer 5, an epoxy resin layer 6, and a fluororesin layer 7 on the resistor layer 3.
【００１４】まず、抵抗体層３の上に設けられる保護用
ガラス層５は、抵抗体層３を物理的、電気的に保護する
という働きをもつ。この保護用ガラス層５に用いるガラ
スの種類は、たとえばＰｂＯ−Ｂ2Ｏ3−ＳｉＯ2、Ｂａ
Ｏ−ＳｉＯ2−ＳｒＯ−ＣａＯなどがあげられるが、耐
水性に優れる点から特にそれらの結晶化ガラスが好まし
い。保護用ガラス層５の厚さは通常０．０２〜０．０７
ｍｍである。この保護用ガラス層５は少なくとも抵抗体
層３を完全に覆っていることが必要である。First, the protective glass layer 5 provided on the resistor layer 3 has a function of physically and electrically protecting the resistor layer 3. The type of glass used for the protective glass layer 5 is, for example, PbO—B 2 O 3 —SiO 2 , Ba.
O-SiO 2 -SrO-CaO and the like can be mentioned, but crystallized glass thereof is particularly preferable from the viewpoint of excellent water resistance. The thickness of the protective glass layer 5 is usually 0.02 to 0.07.
mm. The protective glass layer 5 needs to completely cover at least the resistor layer 3.
【００１５】保護用ガラス層５の上に設けられるエポキ
シ樹脂層６は、保護用ガラス層だけでは不充分な電気絶
縁性を確保するという働きをもつ。一般に樹脂類は熱伝
導性がわるいが、そのなかでもエポキシ樹脂は比較的熱
伝導性がよいものである。本発明においては、さらに熱
伝導性を向上させるために、Ａｌ2Ｏ3などの良熱伝導性
のアルミニウム系のセラミックス粉などの耐食性と電気
絶縁性に優れた添加材を配合してもよい。配合量はエポ
キシ樹脂１００重量部に対し、１０〜２００重量部、好
ましくは１８０〜２００重量部である。エポキシ樹脂と
しては、電気絶縁性に優れ、かつ熱伝導性が良好であれ
ば特に限定されない。また、電気絶縁性や熱伝導性を損
なわない限り、シリコーン樹脂などの他の樹脂を併用し
てもよい。なお、たとえば変性脂肪族ポリアミンなどの
硬化触媒や硬化促進剤などを適宜添加してもよい。エポ
キシ樹脂層６の厚さは、０．０５〜２．０ｍｍ、好まし
くは１．０〜１．５ｍｍである。これより薄くなりすぎ
ると必要な電気絶縁性が得られず、厚くなりすぎるとヒ
ータの熱効率が低下する。The epoxy resin layer 6 provided on the protective glass layer 5 has a function of securing insufficient electrical insulation by using the protective glass layer alone. Generally, resins have poor thermal conductivity, and among them, epoxy resins have relatively good thermal conductivity. In the present invention, in order to further improve the thermal conductivity, an additive excellent in corrosion resistance and electrical insulation such as aluminum-based ceramic powder having good thermal conductivity such as Al 2 O 3 may be blended. The compounding amount is 10 to 200 parts by weight, preferably 180 to 200 parts by weight, based on 100 parts by weight of the epoxy resin. The epoxy resin is not particularly limited as long as it has excellent electrical insulation properties and good thermal conductivity. Further, another resin such as a silicone resin may be used in combination, as long as the electrical insulation and the thermal conductivity are not impaired. In addition, a curing catalyst such as a modified aliphatic polyamine or a curing accelerator may be appropriately added. The thickness of the epoxy resin layer 6 is 0.05 to 2.0 mm, preferably 1.0 to 1.5 mm. If the thickness is too small, the required electrical insulation cannot be obtained, and if the thickness is too large, the thermal efficiency of the heater decreases.
【００１６】エポキシ樹脂層６の上にさらにフッ素樹脂
層７を設ける。これはエポキシ樹脂層６単独では長期に
わたる耐水性、耐食性が充分ではないからである。フッ
素樹脂層７に用いるフッ素樹脂としては、熱硬化させた
ときにエポキシ樹脂層や発熱部に悪影響を与えないため
に、硬化温度が２００℃以下であるフッ素樹脂組成物を
使用する。そのようなフッ素樹脂組成物としては、ポリ
テトラフルオロエチレン（ＰＴＦＥ）やテトラフルオロ
エチレン／ヘキサフルオロプロピレン共重合体（ＦＥ
Ｐ）などのフッ素樹脂とエポキシ樹脂（特にビスフェノ
ール系エポキシ樹脂との混合物などが好ましい。特に、
エポキシ樹脂層６との接着性が良好な点、耐水性に優れ
る点および硬化温度が低い点から、ＰＴＦＥとエポキシ
樹脂との混合物が好ましい。フッ素樹脂とエポキシ樹脂
との混合割合は、フッ素樹脂／エポキシ樹脂（重量比）
が７／３〜８／２であるのが好ましい。フッ素樹脂層７
の厚さは、通常０．０２〜０．０４ｍｍ、好ましくは
０．０３〜０．０４ｍｍである。A fluorine resin layer 7 is further provided on the epoxy resin layer 6. This is because the epoxy resin layer 6 alone does not have sufficient water resistance and corrosion resistance for a long time. As the fluororesin used for the fluororesin layer 7, a fluororesin composition having a curing temperature of 200 ° C. or less is used so as not to adversely affect the epoxy resin layer and the heat generating portion when cured by heat. Examples of such a fluororesin composition include polytetrafluoroethylene (PTFE) and tetrafluoroethylene / hexafluoropropylene copolymer (FE).
P) and a mixture of a fluororesin and an epoxy resin (especially a bisphenol-based epoxy resin).
A mixture of PTFE and an epoxy resin is preferred from the viewpoint of good adhesiveness with the epoxy resin layer 6, excellent water resistance, and low curing temperature. The mixing ratio of fluororesin and epoxy resin is fluororesin / epoxy resin (weight ratio)
Is preferably 7/3 to 8/2. Fluororesin layer 7
Is usually 0.02 to 0.04 mm, preferably 0.03 to 0.04 mm.
【００１７】なお、図１〜３および後述する図面におい
て、符号８は端子接続用銀線、９はロウ付け部である。In FIGS. 1 to 3 and the drawings described later, reference numeral 8 denotes a silver wire for terminal connection, and 9 denotes a brazing portion.
【００１８】本発明において、発熱部は金属基板の片面
または両面に設けることができるが、基板が金属で熱伝
導性が良好であるため、通常片面に設けるだけでよい。
しかし、本発明のヒータを水に浸漬して使用する場合は
背面からの水の侵入が生ずるので、発熱部を設けていな
い面にも保護層を設けることが好ましい。In the present invention, the heat generating portion can be provided on one side or both sides of the metal substrate. However, since the substrate is made of metal and has good thermal conductivity, it is usually sufficient to provide only one side.
However, when the heater of the present invention is used immersed in water, water enters from the back surface, so that it is preferable to provide a protective layer also on the surface where the heat generating portion is not provided.
【００１９】図４にその概略断面図を示すように、かか
る背面保護層８としては、前記エポキシ樹脂層６とフッ
素樹脂層７を延長したものでよい。もちろん、保護用ガ
ラス層５を設けてもよい。背面保護層８におけるエポキ
シ樹脂層６およびフッ素樹脂層７、さらに要すれば保護
用ガラス層５の組成や寸法（厚さなど）は発熱面側のそ
れらと同じでも異なっていてもよいが、作製のし易さの
点から同じ組成と構造にする方が好ましい。As shown in a schematic sectional view of FIG. 4, the back protective layer 8 may be formed by extending the epoxy resin layer 6 and the fluororesin layer 7. Of course, a protective glass layer 5 may be provided. The composition and dimensions (thickness, etc.) of the epoxy resin layer 6 and the fluororesin layer 7 in the back protective layer 8 and, if necessary, the protective glass layer 5 may be the same as or different from those on the heating surface side. It is preferable to have the same composition and structure in terms of ease of operation.
【００２０】つぎに製造方法について簡単に説明する。Next, the manufacturing method will be briefly described.
【００２１】まず、要すれば、サンドブラストなどの粗
面加工を金属基板に施したのち、基板をアルコールなど
の有機溶剤や洗剤で脱脂洗浄（たとえば超音波洗浄な
ど）する。この金属基板上に絶縁ガラスをコーティング
（刷毛塗り法、ロールコート法、ディスペンサー法、ス
クリーン印刷法など）し、乾燥後焼成して絶縁ガラス層
２を形成する。ついで基板の端部に銀ペーストを印刷
（スクリーン印刷法、ディスペンサー法など）し、乾
燥、焼成して銀端子部４を形成したのち、その上に一部
重なるように、銀−パラジウムペーストを印刷（スクリ
ーン印刷法、ディスペンサー法など）し、乾燥、焼成し
て抵抗体層３を形成する。その後保護用ガラス組成物を
コーティング、乾燥、焼成して保護用ガラス層５を形成
する。First, if necessary, the metal substrate is subjected to rough surface processing such as sand blasting, and then the substrate is degreased and cleaned with an organic solvent such as alcohol or a detergent (for example, ultrasonic cleaning). This metal substrate is coated with an insulating glass (a brush coating method, a roll coating method, a dispenser method, a screen printing method, etc.), dried and fired to form an insulating glass layer 2. Then, a silver paste is printed on the edge of the substrate (screen printing method, dispenser method, etc.), dried and fired to form a silver terminal part 4, and then a silver-palladium paste is printed thereon so as to partially overlap therewith. (Eg, a screen printing method or a dispenser method), followed by drying and firing to form the resistor layer 3. Thereafter, the protective glass composition is coated, dried, and fired to form the protective glass layer 5.
【００２２】つぎにエポキシ樹脂組成物をコーティング
（ディッピング法、刷毛塗り法、ロールコート法、ディ
スペンサー法、スクリーン印刷法など）し、乾燥後、２
００℃まで（たとえば１５０℃）の乾燥炉で約１５〜２
０分間加熱硬化させて、エポキシ樹脂層６を形成する。
図４に示すように、背面にもエポキシ樹脂層を形成する
場合は、コーティング法としてディッピング法が好まし
い。Next, the epoxy resin composition is coated (dipping method, brush coating method, roll coating method, dispenser method, screen printing method, etc.), dried, and dried.
About 15 to 2 in a drying oven up to 00 ° C (eg 150 ° C)
The epoxy resin layer 6 is formed by heating and curing for 0 minutes.
As shown in FIG. 4, when an epoxy resin layer is also formed on the back surface, a dipping method is preferable as a coating method.
【００２３】最後に最外層であるフッ素樹脂層７を形成
する。フッ素樹脂組成物をコーティング（スプレー法、
ディッピング法、刷毛塗り法、ロールコート法、ディス
ペンサー法、スクリーン印刷法など。スプレー法が一般
的である）し、ピンホールなどの発生を避けるために、
まず１００℃程度で１０分間一次硬化させたのち、２０
０℃程度の温度で二次硬化させる。図４に示すように、
背面にフッ素樹脂層を設ける場合も同様である。Finally, the outermost fluororesin layer 7 is formed. Coating fluoropolymer composition (spray method,
Dipping method, brush coating method, roll coating method, dispenser method, screen printing method, etc. Spraying is common) and to avoid pinholes,
After first hardening at about 100 ° C for 10 minutes,
Secondary curing is performed at a temperature of about 0 ° C. As shown in FIG.
The same applies when a fluororesin layer is provided on the back surface.
【００２４】つぎに本発明のパイプ状ヒータについて図
５および図６に基づいて説明する。図５は本発明のパイ
プ状ヒータの概略断面図、図６は保護部を取り除いたと
きの概略平面図である。図中の符号で前記図１〜４と同
じものは同じ要素を示す。Next, the pipe-shaped heater of the present invention will be described with reference to FIGS. FIG. 5 is a schematic cross-sectional view of the pipe-shaped heater of the present invention, and FIG. 6 is a schematic plan view when the protection unit is removed. The same reference numerals as those in FIGS. 1 to 4 denote the same elements.
【００２５】本発明のヒータは図５に示すとおり、金属
基板としてパイプ状の基板を使用したものであるほか
は、基本的に図１に示す構造を有している。また、図５
には図示していないが、図４に示す背面保護層をパイプ
の内面に設けてもよい。パイプの形状は中空であれば特
に限定されず、断面形状が円形、楕円形、矩形、多角形
でもよく、異形であってもよい。各層の形成は、印刷を
曲面印刷法で行なうほかは板状ヒータと同じである。As shown in FIG. 5, the heater of the present invention basically has a structure shown in FIG. 1 except that a pipe-shaped substrate is used as a metal substrate. FIG.
Although not shown, a back protective layer shown in FIG. 4 may be provided on the inner surface of the pipe. The shape of the pipe is not particularly limited as long as it is hollow, and the cross-sectional shape may be circular, elliptical, rectangular, polygonal, or irregular. The formation of each layer is the same as that of the plate heater except that printing is performed by a curved surface printing method.
【００２６】本発明のパイプ状ヒータの寸法としては、
断面形状が円形の場合、外径が８〜３００ｍｍ程度で、
長さが１０〜１０００ｍｍ程度のパイプの外表面に抵抗
体層印刷面（図６の符号１１）として長さ８〜９９０ｍ
ｍ程度をもつようなものが適当である。このパイプ状ヒ
ータを単独で、または複数個（複数ユニット）連結して
使用することができる。The dimensions of the pipe-shaped heater of the present invention are as follows:
When the cross-sectional shape is circular, the outer diameter is about 8 to 300 mm,
On the outer surface of the pipe having a length of about 10 to 1000 mm, a length of 8 to 990 m as a resistor layer printing surface (reference numeral 11 in FIG. 6).
Those having about m are suitable. This pipe-shaped heater can be used alone or in combination with a plurality of (a plurality of units).
【００２７】[0027]
【発明の効果】本発明によれば、水に浸漬して直接加熱
するヒータであって、たとえば１０年を超える長期間に
わたって耐水性、耐食性、電気絶縁性、高熱交換率など
を維持できるヒータを提供することができる。According to the present invention, there is provided a heater which is directly immersed in water and directly heated, for example, capable of maintaining water resistance, corrosion resistance, electrical insulation, high heat exchange rate, etc. for a long period of time exceeding 10 years. Can be provided.
【図１】本発明の構造をもつ板状ヒータの概略断面図で
ある。FIG. 1 is a schematic cross-sectional view of a plate heater having the structure of the present invention.
【図２】本発明の板状ヒータの概略平面図である。FIG. 2 is a schematic plan view of the plate heater of the present invention.
【図３】図２において保護部を取り除いたときの概略平
面図である。FIG. 3 is a schematic plan view when a protection unit is removed in FIG.
【図４】本発明の板状ヒータの別の実施形態の概略断面
図である。FIG. 4 is a schematic sectional view of another embodiment of the plate heater of the present invention.
【図５】本発明のパイプ状ヒータの概略断面図である。FIG. 5 is a schematic sectional view of a pipe-shaped heater of the present invention.
【図６】本発明のパイプ状ヒータにおいて保護部を取り
除いたときの概略平面図である。FIG. 6 is a schematic plan view of the pipe-shaped heater according to the present invention when a protection unit is removed.
１ 金属基板 ２ 絶縁ガラス層 ３ 銀−パラジウム抵抗体層 ４ 端子用銀導電層 ５ 保護用ガラス層 ６ エポキシ樹脂層 ７ フッ素樹脂層 ８ 背面保護層 ９ 端子用銀線 １０ ロウ付け部 １１ 抵抗体層印刷面 DESCRIPTION OF SYMBOLS 1 Metal substrate 2 Insulating glass layer 3 Silver-palladium resistor layer 4 Silver conductive layer for terminal 5 Protective glass layer 6 Epoxy resin layer 7 Fluororesin layer 8 Back protective layer 9 Silver wire for terminal 10 Brazing part 11 Resistor layer Printing surface
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｂ 3/40 Ｈ０５Ｂ 3/40 Ａ Ｆターム(参考） 3K034 AA02 AA08 AA10 AA34 AA37 BA05 BA06 BA08 BA15 BA17 BA18 BB02 BB14 BC12 CA03 CA15 CA26 CA32 EA15 FA39 HA01 HA10 3K092 PP13 QA02 QA05 QB02 QB62 QB64 QB75 QB76 QC07 QC16 QC25 QC38 QC42 QC52 RA06 RD03 RD06 RD08 RD15 RD25 RD27 RD28 RD47 RF03 RF09 RF17 RF26 TT37 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI Theme coat ゛ (Reference) H05B 3/40 H05B 3/40 A F term (Reference) 3K034 AA02 AA08 AA10 AA34 AA37 BA05 BA06 BA08 BA15 BA17 BA18 BB02 BB14 BC12 CA03 CA15 CA26 CA32 EA15 FA39 HA01 HA10 3K092 PP13 QA02 QA05 QB02 QB62 QB64 QB75 QB76 QC07 QC16 QC25 QC38 QC42 QC52 RA06 RD03 RD06 RD08 RF17 RF09 RF09 RF09
Claims (4)
の表面に絶縁ガラス層および銀−パラジウム系の抵抗体
層がこの順で積層されてなる発熱部、ならびに該銀−パ
ラジウム抵抗体層上に保護用ガラス層、エポキシ樹脂層
およびフッ素樹脂層がこの順で積層されてなる保護部か
らなるヒータの構造。1. A heating section comprising a metal substrate, an insulating glass layer and a silver-palladium-based resistor layer laminated in this order on at least one surface of the metal substrate, and The structure of a heater comprising a protective portion in which a protective glass layer, an epoxy resin layer and a fluororesin layer are laminated in this order.
に請求項１記載の発熱部および保護部が設けられている
板状ヒータ。2. A plate heater having at least one of a plate-shaped metal substrate provided with the heat generating portion and the protection portion according to claim 1 on the surface.
に請求項１記載の発熱部および保護部が設けられている
パイプ状ヒータ。3. A pipe-shaped heater comprising the pipe-shaped metal substrate provided with the heat generating portion and the protection portion according to claim 1 on at least the outer surface.
記載のヒータ。4. The method according to claim 2, wherein the material is immersed in water for use.
The heater as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27793199A JP2001102158A (en) | 1999-09-30 | 1999-09-30 | Heater structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27793199A JP2001102158A (en) | 1999-09-30 | 1999-09-30 | Heater structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001102158A true JP2001102158A (en) | 2001-04-13 |
Family
ID=17590286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27793199A Pending JP2001102158A (en) | 1999-09-30 | 1999-09-30 | Heater structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001102158A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007125578A (en) * | 2005-11-02 | 2007-05-24 | Fujitsu Ltd | Reflow apparatus, reflow method, and semiconductor device manufacturing method |
| TWI399119B (en) * | 2009-04-24 | 2013-06-11 | Hon Hai Prec Ind Co Ltd | Linear heater |
| TWI399118B (en) * | 2009-04-24 | 2013-06-11 | Hon Hai Prec Ind Co Ltd | Method for making linear heater |
| TWI399121B (en) * | 2009-04-24 | 2013-06-11 | Hon Hai Prec Ind Co Ltd | Linear heater |
| TWI408989B (en) * | 2009-04-24 | 2013-09-11 | Hon Hai Prec Ind Co Ltd | Line heat source |
| TWI408990B (en) * | 2009-04-24 | 2013-09-11 | Hon Hai Prec Ind Co Ltd | Line heat source |
| US10917942B2 (en) | 2017-07-31 | 2021-02-09 | Samsung Electronics Co., Ltd. | Structure, planar heater including the same, heating device including the planar heater, and method of preparing the structure |
-
1999
- 1999-09-30 JP JP27793199A patent/JP2001102158A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007125578A (en) * | 2005-11-02 | 2007-05-24 | Fujitsu Ltd | Reflow apparatus, reflow method, and semiconductor device manufacturing method |
| US8336756B2 (en) | 2005-11-02 | 2012-12-25 | Fujitsu Semiconductor Limited | Reflow apparatus, a reflow method, and a manufacturing method of semiconductor device |
| US8490857B2 (en) | 2005-11-02 | 2013-07-23 | Fujitsu Semiconductor Limited | Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device |
| TWI399119B (en) * | 2009-04-24 | 2013-06-11 | Hon Hai Prec Ind Co Ltd | Linear heater |
| TWI399118B (en) * | 2009-04-24 | 2013-06-11 | Hon Hai Prec Ind Co Ltd | Method for making linear heater |
| TWI399121B (en) * | 2009-04-24 | 2013-06-11 | Hon Hai Prec Ind Co Ltd | Linear heater |
| TWI408989B (en) * | 2009-04-24 | 2013-09-11 | Hon Hai Prec Ind Co Ltd | Line heat source |
| TWI408990B (en) * | 2009-04-24 | 2013-09-11 | Hon Hai Prec Ind Co Ltd | Line heat source |
| US10917942B2 (en) | 2017-07-31 | 2021-02-09 | Samsung Electronics Co., Ltd. | Structure, planar heater including the same, heating device including the planar heater, and method of preparing the structure |
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