JP2001189364A - Transport system - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a transport system capable of efficiently performing single-wafer transport in in-process transport. SOLUTION: In a transport system of a semiconductor or liquid crystal production line, transport between a process is performed by cassette transport and transport in a process is performed by single wafer transport. , 8C are independently formed in a plurality of stages in the vertical direction,
Sheet-fed transport vehicles 7A, 7B, and 7C each having a mounting table 73 on which the substrate 6 is mounted are arranged on A, 8B, and 8C so that they can travel independently without interfering with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer system for a semiconductor or liquid crystal manufacturing line, wherein transfer between processes is performed by cassette transfer, and transfer within a process is performed by single wafer transfer. The present invention relates to a transport system capable of efficiently performing single-wafer transport in transport.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor or liquid crystal manufacturing line, a semiconductor or liquid crystal substrate (hereinafter, simply referred to as a "substrate" in the present specification) is mainly processed in a cassette. A cassette transfer system for transferring between and within a process has been adopted.

[0003]

In the cassette transfer method, the substrate is transferred in a state of being housed in a cassette, so that the substrate can be transferred in a clean state without dust or the like adhering to the substrate. was there.

However, with the recent increase in size of substrates, cassettes have become larger and heavier, and equipment such as a transport trolley and a stocker for transporting and storing cassettes has become larger. Construction costs of facilities including buildings,
There was a problem that the maintenance cost would rise extremely.

In the case of transporting a large and heavy cassette, it is difficult to shorten the tact time because it is difficult to increase the transport speed in terms of safety and the like. There was a problem that it was not possible.

[0006] On the other hand, it has been proposed that, with the increase in the size of the substrate, the inter-process transfer is performed by cassette transfer and the intra-process transfer is performed by single-sheet transfer.
Has been put to practical use. This single-wafer transfer has the advantage that the transfer speed can be increased because the substrates are transferred one by one, thereby reducing the tact time as compared with the cassette transfer, but using the conventional transfer system as it is, If only the intra-process conveyance is changed from the cassette conveyance to the single-wafer conveyance, the conveyance capacity becomes insufficient. For example, if one cassette containing 20 glass substrates is transported at 3-minute intervals in the conventional cassette transport, the required transport time per glass substrate is 3 minutes / 20 = 180 Seconds / 20 sheets = 9 seconds / 1 sheet. If this is used for single-wafer transport, it is necessary to transport the glass substrate at intervals of 9 seconds. However, in the method in which the single-wafer transport vehicle travels on a one-lane travel path, it is difficult to perform high-speed and stable transport at 9-second intervals, and it is apparent that the transport capability is insufficient.

SUMMARY OF THE INVENTION The present invention has been made in view of the problems of a conventional semiconductor or liquid crystal manufacturing line transfer system in which transfer between processes is performed by cassette transfer and transfer within a process is performed by single wafer transfer. It is an object of the present invention to provide a transport system capable of efficiently performing single-wafer transport in internal transport.

[0008]

In order to achieve the above object, a transport system according to the present invention comprises a semiconductor or liquid crystal which transports between processes by cassette transport, and transports in process by single wafer transport. In the transport system of the manufacturing line, the traveling path of the in-process transport path is configured independently in a plurality of stages in the vertical direction, and in each traveling path, a sheet-fed transport vehicle having a mounting table on which a substrate is placed is provided. Are arranged so that they can run independently without interfering with each other.

In this transport system, a single-wafer transport vehicle is provided in which a traveling path of an in-process transport path is independently formed in a plurality of stages in a vertical direction, and a loading table for mounting a substrate on each travel path. Because they are arranged so that they can travel independently without interfering with each other, the transport capacity can be increased without substantially increasing the space of the travel path of the in-process transport path or increasing the transport speed of the single-wafer transport vehicle. Therefore, it is possible to efficiently perform the single-wafer transfer in the in-process transfer.

[0010] In this case, the positions of the mounting table and the supporting table of the single-wafer transport vehicle arranged on each traveling path can be differently arranged in the height direction and the horizontal direction.

[0011] This makes it possible to avoid the interference of the sheet-feeding vehicles arranged on each traveling path with a simple mechanism.

In addition, a cover can be provided above the mounting table of the single wafer transport vehicle.

Thus, it is possible to prevent dust and the like from adhering to the substrate and to carry the substrate in a clean state.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a transfer system according to an embodiment of the present invention.

FIGS. 1 to 3 show an example of a semiconductor or liquid crystal manufacturing line transfer system in which transfer between processes is performed by cassette transfer and transfer within a process is performed by single wafer transfer.

In the transport system of this semiconductor or liquid crystal production line, an inter-process transport path 1 for transporting a cassette is laid so that a transport vehicle 2 on which a cassette 3 is mounted can run along the production line. This inter-process transport path 1
In-process transfer path 8 for performing single-sheet transfer in a direction intersecting with the above.

One or a plurality (two in this embodiment) of inter-process transport paths 1 are laid in accordance with a semiconductor or liquid crystal production line. Alternatively, a plurality of transport vehicles 2 are arranged. The transport vehicle 2 is configured to be able to deliver a cassette 3 containing a plurality of substrates at a predetermined position on a production line.

A single-wafer transport vehicle 7 is disposed in the in-process transport path 8 for performing single-wafer transport, and a stocker 4 is disposed at an intersection of the inter-process transport path 1 and the in-process transport path 8. Thereby, the substrate accommodated in the cassette 3 transported along the inter-process transport path 1 can be transferred to the in-process transport path 8 side. For this reason, a transfer machine 5 for transferring the substrates 6 stored in the cassette 3 is provided in the stocker 4, while a load port 9 is provided at a predetermined position along the in-process transfer path 8. It is arranged so that the substrates 6 can be transferred one by one to and from a single wafer transport vehicle 7 traveling along the in-process transport path 8.

As shown in FIG. 2, a plurality of (in this embodiment, three) traveling paths 8A, 8B,
8C. The in-process transport path 8 composed of the traveling paths 8A, 8B, and 8C is configured to be substantially the same as a closed space of the conventional in-process transport path in plan view. Then, on each of the traveling paths 8A, 8B, 8C, the single-wafer transport vehicles 7A, 7B, which transport the substrates one by one,
7C are arranged so that they can run independently without interfering with each other.

Each of the single-wafer carriers 7A, 7B, 7C can be basically the same except for a configuration that enables independent traveling without interfering with each other, which will be described later.

Therefore, here, a description will be given of the single-wafer transporting vehicle 7A traveling along the traveling path 8A. Single wafer carrier 7
A is a carriage main body 71 configured to travel along the traveling path 8A, a support base 72 protruding from the side of the carriage main body 71, and a vertically movable upper part of the support base 72 with a predetermined stroke. A mounting table 73 for mounting the substrate 6 provided thereon,
A mounting table 73 that prevents the downflow from directly hitting the substrate 6 mounted on the mounting table 73 to attach dust and the like to the substrate 6 and enables the substrate 6 to be transported in a clean state. And a cover 74 provided above.

Then, each of the single-wafer transport vehicles 7A, 7B, 7C
In this embodiment, the mounting positions of the mounting table 73 and the cover 74 provided on each of the single-wafer transport vehicles 7A, 7B, and 7C and the positions of the support tables 72 are set so that they can travel independently without interfering with each other. It is arranged to be different from each other in the horizontal direction and the horizontal direction. More specifically, the placement positions of the mounting table 73 and the cover 74 are increased in the order of the single-wafer transport vehicles 7C, 7B, and 7A, and the support table 72 is protruded largely to the side of the bogie main body 71. To do.

A load port 9 is installed at a predetermined position along the in-process transfer path 8. This load port 9
As shown in FIG. 2 to FIG. 3, a support 91 established on a fixed side such as a floor surface, and a support 91 is provided on the support 91 so as to be able to turn by a turning device (not shown). 7B, 7C
And a receiving table 92, 93, 94 for transferring the substrate 6 to and from a mounting table 73 which can be raised and lowered. The receiving tables 92, 93, and 94 are arranged at positions (three in this embodiment) corresponding to the mounting tables 73 of the single-wafer transport vehicles 7A, 7B, and 7C on the in-process transport path 8. I do.

Each of the receiving trays 92, 93, 94 is basically
Since the configuration is the same, here, the uppermost pedestal 92 will be described. The receiving base 92 is formed of a frame body having a space formed in the center thereof, and a notch 92a through which a thinly formed arm portion 73a of the mounting table 73 can be inserted.
And a recess recessed downward so that the fork 11 of the transfer device 10 disposed in the process (on the side of the manufacturing apparatus) can be inserted into the other side connected to the side having the notch 92a. 92b is formed.

The transfer device 10 disposed adjacent to the load port 9 is constructed so that the fork 11 can be moved up, down, in and out, and turned three times in combination. The transfer of the substrate 6 can be performed between the substrates 93 and 94.

Hereinafter, the operation of the transport system of the present invention will be described. Transport vehicle 2 traveling along the inter-process transport path 1
The cassette 3 conveyed by is placed on the stocker 4. The transfer machine 5 provided in the stocker 4 takes out the substrates 6 stored in the cassette 3 one by one, and removes the substrates 6 from the single-wafer transport vehicle 7A traveling on the traveling paths 8A, 8B, 8C of the in-process transport path 8. , 7B, and 7C, is mounted on the mounting table 73 of the sheet-fed transport vehicle that is running in the sky closest to the transfer machine 5.

In this transport system, the traveling paths 8A, 8B, 8C of the in-process transport path 8 are independently constituted in a plurality of stages in the vertical direction, and each traveling path 8A, 8B, 8
Since the single-wafer transport vehicles 7A, 7B, and 7C provided with the mounting table 73 on which the substrate 6 is mounted are arranged so as to be able to travel independently without interfering with each other, the traveling of the in-process transport path 8 is performed. The transport capacity can be increased without substantially increasing the planar space of the roads 8A, 8B, and 8C and without increasing the transport speed of the single-wafer transport vehicles 7A, 7B, and 7C. It can be performed efficiently.

The sheet transport vehicles 7A, 7B, 7C having the substrate 6 mounted on the mounting table 73 travel along predetermined traveling paths 8A, 8B, 8C of the process transporting path 8. At this time,
The cover 74 provided above the mounting table 73 allows the substrate 6
This prevents dust or the like from adhering to the substrate 6 due to the direct flow of the down flow, whereby the substrate 6 can be transported while being kept in a clean state.

When the single-wafer transport vehicles 7A, 7B, 7C on which the substrate 6 is mounted on the mounting table 73 reach the designated position of the load port 9, the single-wafer transport vehicles 7A, 7B, 7C stop,
The substrate 6 is transferred from the mounting table 73 of the sheet transport vehicles 7A, 7B, 7C to the receiving tables 92, 93, 94 of the load port 9.

This transfer operation will be described with reference to FIG.
Here, the single-wafer transport vehicle 7A will be described, but basically the same operation is performed for the other single-wafer transport vehicles 7B and 7C.

A sheet transporting vehicle 7A on which the substrate 6 is mounted on the mounting table 73 travels along a predetermined traveling path 8A of the process transporting path 8 (FIG. 3A). When the position is reached, the sheet-feeding vehicle 7A stops (FIG. 3).
(B)). At this time, by driving a turning device (not shown) of the load port 9, the corresponding receiving table 92 is turned so as to be positioned below the mounting table 73. The cradle 92 can also be turned after the single-wafer transport vehicle 7A stops. Next, by lowering the mounting table 73, the mounting table 73 is passed through the inside of the frame of the frame-shaped receiving table 92, and the substrate 6 is transferred from the mounting table 73 of the single-wafer carrier 7A to the receiving table 92 of the load port 9. Transfer (FIGS. 3C and 3D).
Then, by lowering the mounting table 73, when the transfer of the substrate 6 from the receiving table 73 of the single-wafer transport vehicle 7 </ b> A to the receiving table 92 of the load port 9 is completed, the substrate 6 is transferred for transferring another substrate 6. By starting traveling of the transport vehicle 7A and driving a turning device (not shown) of the load port 9,
By rotating the pedestal 92, the substrate 6 is transferred to the transfer device 1
0 (see FIG. 3).
(E), (F)). Note that the start of the traveling of the single-wafer transport vehicle 7A and the turning of the cradle 92 may be independently performed.

Then, the substrate 6 is supplied from the receiving table 92 of the load port 9 into the process (on the side of the manufacturing apparatus) by using the transfer apparatus 10. This transfer device 10 has three types: lifting, moving up and down, and turning.
Fork 11 configured to perform a combination of operations
In a state where the fork 11 is submerged, the fork 11 turns so as to face the cradle 92 of the load port 9, and the fork 11 is moved up and down.
Is adjusted to a position where it can be inserted into the dent 92b of the pedestal 92, and then the fork 11 is protruded and inserted into the dent 92b of the pedestal 92. Then, when the fork 11 is raised, the substrate 6 is transferred from the receiving table 92 of the load port 9 to the fork 11, and the fork 11 is turned in the opposite direction to supply the substrate 6 into the process (the manufacturing apparatus side). .

When the substrate 6 is transferred from the process (from the manufacturing apparatus side) to the mounting table 73 of the single-wafer transporting vehicle 7A via the transfer apparatus 10 and the receiving table 92 of the load port 9, the above operation is performed. Perform the reverse operation.

Thus, even when the single-wafer transport vehicle 7A is performing the transfer operation of the substrate 6 at the position of the load port 9, the other single-wafer transport vehicles 7B and 7C are performing the transfer operation. It overruns the sheet-fed transport vehicle 7A and travels.
The other single-wafer transport vehicles 7B and 7C can perform the transfer operation of the substrate 6 at the same or another position of the load port 9, and can efficiently perform the single-wafer transfer in the in-process transfer including the transfer operation of the substrate 6. It can be done in a practical way.

[0035]

According to the transfer system of the present invention, the travel paths of the in-process transport paths are independently formed in a plurality of stages in the vertical direction, and each of the travel paths is provided with a mounting table for mounting a substrate. The single-wafer transport vehicles are arranged so that they can travel independently without interfering with each other, so that the space of the traveling path of the in-process transport path is substantially increased or the transport speed of the single-wafer transport vehicle is increased. The transfer capacity can be increased without any need, and the single-wafer transfer in the in-process transfer can be performed efficiently, and the inter-process transfer is performed by the cassette transfer, and the intra-process transfer is performed by the single-sheet transfer. The transport system of the semiconductor or liquid crystal production line can be smoothly operated.

Further, the mounting positions of the single-wafer transporting vehicles and the supporting bases arranged on the respective traveling paths are arranged differently in the height direction and the horizontal direction, so that they are arranged on the respective traveling paths. Interference of the single-wafer carrier can be avoided by a simple mechanism.

Further, by providing a cover above the mounting table of the single-wafer transport vehicle, it is possible to prevent dust and the like from adhering to the substrate and to transport the substrate in a clean state.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an example of a transport system of a semiconductor or liquid crystal production line.

FIG. 2 is an explanatory diagram of the main part.

FIG. 3 is an explanatory diagram of the operation.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Inter-process conveyance path 2 Car carrier 3 Cassette 4 Stocker 5 Transfer machine 6 Substrate 7, 7A, 7B, 7C Single wafer carrier 71 Car body 72 Support stand 73 Mounting table 8 In-process conveyance path 8A, 8B, 8C 9 Load port 91 Support 92, 93, 94 Cradle 10 Transfer device

Claims (3)

[Claims] In a semiconductor or liquid crystal manufacturing line transfer system in which inter-process conveyance is performed by cassette conveyance and intra-process conveyance is performed by single-wafer conveyance, a traveling path of an intra-process conveyance path is moved up and down. A plurality of stages independently in a plurality of directions, and on each traveling path, a single-wafer carrier equipped with a mounting table for mounting a substrate is arranged so as to be capable of independent traveling without interfering with each other. system. 2. The mounting table and the supporting table of the single-wafer transport vehicle arranged on each traveling path are arranged at different positions in a height direction and a horizontal direction, respectively.
The transport system as described. 3. The transport system according to claim 1, wherein a cover is provided above the mounting table of the single wafer transport vehicle.