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JP2001188155A - Image sensor fixing means - Google Patents

Image sensor fixing means

Info

Publication number
JP2001188155A
JP2001188155A JP37314999A JP37314999A JP2001188155A JP 2001188155 A JP2001188155 A JP 2001188155A JP 37314999 A JP37314999 A JP 37314999A JP 37314999 A JP37314999 A JP 37314999A JP 2001188155 A JP2001188155 A JP 2001188155A
Authority
JP
Japan
Prior art keywords
socket
holder
image sensor
pickup device
image pickup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP37314999A
Other languages
Japanese (ja)
Inventor
Hiroshi Amano
廣志 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUURII COMPONENTS KK
Shinten Sangyo Co Ltd
Original Assignee
KUURII COMPONENTS KK
Shinten Sangyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUURII COMPONENTS KK, Shinten Sangyo Co Ltd filed Critical KUURII COMPONENTS KK
Priority to JP37314999A priority Critical patent/JP2001188155A/en
Publication of JP2001188155A publication Critical patent/JP2001188155A/en
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/804Containers or encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors

Landscapes

  • Mounting And Adjusting Of Optical Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】 【課題】 自動組立が可能な撮像素子の固定手段を提供
する。 【解決手段】 撮像素子(CMOSセンサ)24の外周
に嵌合するソケット30に撮像素子24の外部接続端子
28に下面から弾接する接点46を設け、この接点46
よりソケット30外部に延在する外部端子44をプリン
ト基板48の端子パターン52に半田付けして固定す
る。撮像素子24をソケット30が画定する空間25に
嵌入し、レンズホルダ10を被せ、レンズホルダ10の
ロック部22をソケット30の相手ロック部22,23
に咬合して一体に結合することにより撮像素子24を固
着する。
(57) [Problem] To provide an image pickup device fixing means that can be automatically assembled. A socket (30) fitted around the outer periphery of an image sensor (CMOS sensor) is provided with a contact (46) that resiliently contacts an external connection terminal (28) of the image sensor (24) from below.
The external terminals 44 extending outside the socket 30 are fixed to the terminal patterns 52 of the printed circuit board 48 by soldering. The image pickup device 24 is fitted into a space 25 defined by the socket 30, the lens holder 10 is covered, and the lock portion 22 of the lens holder 10 is engaged with the mating lock portions 22 and 23 of the socket 30.
The image sensor 24 is fixed by being engaged with and integrally connected to the image pickup device.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はCCD、CMOSま
たはこれと同等の光センサまたは半導体撮像素子に係わ
り、特にこれら半導体撮像素子のプリント基板への取付
けに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CCD, a CMOS or an equivalent optical sensor or a semiconductor image pickup device, and more particularly to the mounting of such a semiconductor image pickup device on a printed circuit board.

【0002】[0002]

【従来の技術】図9に示すように、従来の半導体撮像素
子700は、素子基盤701に配列された各端子702
を、プリント回路基板703に配列した対応する端子7
04のそれぞれに半田付けで固定した後、レンズホルダ
705の位置合せポスト706をプリント基板703の
位置決め孔707に挿入して組合わせ、光軸を整合させ
て固定する。
2. Description of the Related Art As shown in FIG. 9, a conventional semiconductor image pickup device 700 includes a plurality of terminals 702 arranged on an element substrate 701.
Are connected to the corresponding terminals 7 arranged on the printed circuit board 703.
After fixing to each of the components 04 by soldering, the positioning posts 706 of the lens holder 705 are inserted into the positioning holes 707 of the printed circuit board 703 and assembled, and the optical axes are aligned and fixed.

【0003】しかしながら、半導体撮像素子700は一
般的に熱の影響を受け易く、特にCMOSセンサのレン
ズ部は熱に弱いので、リフロー半田付け等による自動半
田作業には対応できない。従って、半導体撮像素子70
0のプリント回路基板703への取付けは手半田で行わ
れ、性能確保に重要な光センサとレンズとの光軸調整が
すべて手作業によるので極めて作業効率が悪く、製造コ
ストに大きな影響を与えている。
However, the semiconductor imaging device 700 is generally susceptible to heat, and the lens portion of the CMOS sensor is particularly vulnerable to heat, so that it cannot cope with automatic soldering work such as reflow soldering. Therefore, the semiconductor imaging device 70
0 is attached to the printed circuit board 703 by hand soldering, and the optical axis adjustment between the optical sensor and the lens, which is important for ensuring the performance, is all performed by hand. I have.

【0004】[0004]

【発明が解決しようとする課題】そこで本発明の目的
は、半導体光センサ素子に半田付け処理等による熱的影
響を与えることなく基板に固定でき、組合せの過程で光
学的整合が自然に調整ができる撮像素子固定手段の提供
である。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to fix a semiconductor optical sensor element to a substrate without exerting a thermal influence by soldering or the like, and to naturally adjust optical alignment in the process of combination. It is an object of the present invention to provide an image sensor fixing means that can be used.

【0005】[0005]

【課題を解決するための手段】上記の目的を達成するた
めに、本発明に係わる撮像素子の固定手段は、撮像素子
の外周に嵌合するフレームの内縁側に上記撮像素子の複
数の外部接続端子とそれぞれ電気的接触を保つ複数の接
点と、この各接点から延在する複数の外部端子を前記フ
レーム外縁側に備えるソケットと、前記撮像素子の受光
面に影像を投影する光学レンズを保持するホルダとから
なり、前記ソケットに前記ホルダとが互いに精密に嵌合
するとともに互いに咬合するロック部をそれぞれに備え
る。
In order to achieve the above object, a fixing means for an image pickup device according to the present invention comprises a plurality of externally connected image pickup devices on an inner edge of a frame fitted to an outer periphery of the image pickup device. A plurality of contacts for maintaining electrical contact with the terminals, a socket provided on the outer edge side of the frame with a plurality of external terminals extending from the respective contacts, and an optical lens for projecting a shadow image on a light receiving surface of the image sensor are held. It comprises a holder, and each of the sockets is provided with a lock portion in which the holder and the holder are precisely fitted to each other and are engaged with each other.

【0006】前記ソケットとホルダのロック部は、それ
ぞれを合成樹脂材料で一体成形しても、いずれか一方を
金属材料で構成してもよい。そして、前記接点は前記ソ
ケットの底面側に配設され、嵌入される前記撮像素子を
押戻す方向に弾性付勢される。
The lock portion of the socket and the holder may be integrally formed of a synthetic resin material, or one of the lock portions may be formed of a metal material. The contact is disposed on the bottom side of the socket and is elastically urged in a direction to push back the image sensor to be fitted.

【0007】さらに、前記ホルダは前記レンズに対する
光学的整合面を備え、前記ソケット嵌入時において前記
接点の弾性付勢で嵌入方向に変位自在に支持されている
前記撮像素子は、前記ホルダの咬合によって前記ソケッ
ト内に押入され、前記受光面が前記光学的整合面に圧着
される。前記ホルダとソケットとの嵌合に先立ち、前記
撮像素子を前記ホルダに固定することも好適である。
Further, the holder has an optical alignment surface with respect to the lens, and the image pickup device, which is supported so as to be displaceable in a fitting direction by elastic biasing of the contacts when the socket is fitted, is engaged with the holder by engagement of the holder. The light receiving surface is pressed into the socket and the light receiving surface is pressed against the optical alignment surface. It is also preferable that the image sensor is fixed to the holder before the holder and the socket are fitted.

【0008】[0008]

【発明の実施の形態】以下に本発明に係わる撮像素子の
固定手段の実施の形態を図面に基づいて説明する。図1
は本発明の第一実施例を示す分解斜視図である。10は
ホルダで、鏡筒12と箱型嵌合枠14とからなる。そし
て、鏡筒12には光学レンズ16が保持され、箱型嵌合
枠14の四周を囲む外壁18のそれぞれには、各辺の長
さの中央部に設けた一対のスリット20により、弾性を
有するフック状のロック部22(図2参照)が一体に成
形される。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of an image sensor fixing means according to the present invention. FIG.
1 is an exploded perspective view showing a first embodiment of the present invention. Reference numeral 10 denotes a holder, which comprises a lens barrel 12 and a box-shaped fitting frame 14. An optical lens 16 is held in the lens barrel 12, and each of the outer walls 18 surrounding the four circumferences of the box-shaped fitting frame 14 has elasticity by a pair of slits 20 provided at the center of each side. The hook-shaped lock portion 22 (see FIG. 2) is integrally formed.

【0009】24は撮像素子で、図中上面が受光面26
で下面に複数の外部接続端子28が延在する。30はソ
ケットで、撮像素子24に嵌合する内壁面32によって
撮像素子24を受容する空間25を画定する。さらに、
ソケット30の四周を囲む外壁面34は、ホルダ10の
箱型嵌合枠14の内壁面36(図2参照)に精密に嵌合
し、各外壁面34のそれぞれには、ロック部22との対
応位置に相手ロック部23としてテーパ状の切欠き38
が形成される。
Reference numeral 24 denotes an image sensor, the upper surface of which is a light receiving surface 26 in the figure.
, A plurality of external connection terminals 28 extend on the lower surface. Reference numeral 30 denotes a socket, which defines a space 25 for receiving the image sensor 24 by an inner wall surface 32 fitted to the image sensor 24. further,
An outer wall surface 34 surrounding the four circumferences of the socket 30 is precisely fitted to an inner wall surface 36 (see FIG. 2) of the box-shaped fitting frame 14 of the holder 10. At the corresponding position, a tapered notch 38 is formed as the mating lock portion 23.
Is formed.

【0010】ソケット外壁面34の下部40ではそれぞ
れの壁厚が縮減されて、内向きに段42が形成され、段
42の下端から複数の外部端子44が外向きに延在す
る。特に図示しないが、外部端子44は別設のICソケ
ット対応ピンを下向きに延在させてもよい。複数の外部
端子44は各個にソケット内部に延在する複数の接点4
6に導通している。
In the lower portion 40 of the outer wall surface 34 of the socket, the thickness of each wall is reduced, and a step 42 is formed inward, and a plurality of external terminals 44 extend outward from the lower end of the step 42. Although not particularly shown, the external terminal 44 may have a separately provided IC socket corresponding pin extending downward. The plurality of external terminals 44 each include a plurality of contacts 4 extending inside the socket.
6 is conducted.

【0011】さらに接点46は図3に模式的断面で示す
ように自らの弾性により自然状態で上向きに変位(図中
矢印U)しており、下向きの強制偏倚により上向の弾性
付勢力の作用のもとで嵌入方向(上下方向)に距離sの
間は変位自在である。このため、ソケット30に嵌入さ
れた撮像素子24は、接点46により弾性的な浮動状態
で支持される。
Further, the contact 46 is naturally displaced upward (arrow U in the figure) due to its own elasticity as shown by a schematic cross section in FIG. 3, and an upward elastic biasing force is exerted by a downward forced bias. Is displaceable in the fitting direction (vertical direction) for a distance s. For this reason, the image sensor 24 fitted into the socket 30 is supported by the contact points 46 in an elastic floating state.

【0012】そこで本実施の形態では先ず、プリント基
板48のプリント回路50の端子パターン52にソケッ
ト30の外部端子44をそれぞれ半田付けする。ソケッ
ト30は自動半田作業に十分対応できる。図3に示すよ
うに撮像素子24をソケット30の空間25に嵌入する
と、接点46の弾性支持で上下に浮動状態の撮像素子2
4は、受光面26がソケット面54に対してほぼ平行に
支持される。
Therefore, in the present embodiment, first, the external terminals 44 of the socket 30 are soldered to the terminal patterns 52 of the printed circuit 50 on the printed circuit board 48, respectively. The socket 30 can sufficiently cope with an automatic soldering operation. As shown in FIG. 3, when the image sensor 24 is fitted into the space 25 of the socket 30, the image sensor 2 floats up and down by the elastic support of the contact point 46.
4, the light receiving surface 26 is supported substantially parallel to the socket surface 54.

【0013】ホルダ10を受光面26側(図中上方)よ
りソケット30に被せ、ソケット外壁面34にホルダ内
壁面36を嵌合させ、両壁面34,36に沿って双方を
近接させると、撮像素子24の受光面26はホルダ10
の内面に設けたレンズ16に対する光学的整合面56に
圧着して自動調心され、そのまま接点46を強制変形さ
せる方向の平行移動でロック部22,23が機能し、定
位置に内設される。
When the holder 10 is placed on the socket 30 from the light receiving surface 26 side (upper side in the figure), the holder inner wall surface 36 is fitted to the socket outer wall surface 34, and both are brought close to each other along both wall surfaces 34, 36, the image is taken. The light receiving surface 26 of the element 24 is
The lock portions 22 and 23 function by parallel movement in a direction in which the contact 46 is forcibly deformed by being pressed against the optical alignment surface 56 with respect to the lens 16 provided on the inner surface of the lens 16 and is installed in a fixed position. .

【0014】この操作で、ホルダ10のフック58は、
摺接斜面60が相手ロック23のソケット外壁面34に
形成された切欠き38のテーパ面62に沿って外向きに
弾性変形しながら移動し、フックの顎部64が切欠き3
8下端の段42に咬合するとフック58の弾性復帰でホ
ルダ10とソケット30とは確実に係合する。撮像素子
24の各外部接続端子28はソケット30の各接点46
とそれぞれ弾接して確実な電気接続を達成し、撮像素子
24の受光面26は正確にレンズ16と光学的整合を果
たす(図4参照)。
By this operation, the hook 58 of the holder 10
The sliding slope 60 moves outward while elastically deforming along the tapered surface 62 of the notch 38 formed in the socket outer wall surface 34 of the mating lock 23, and the jaw 64 of the hook is notched 3.
When the hook 58 is engaged with the step 42 at the lower end of the holder 8, the holder 10 and the socket 30 are securely engaged by the elastic return of the hook 58. Each external connection terminal 28 of the image sensor 24 is connected to each contact 46 of the socket 30.
The light receiving surface 26 of the image sensor 24 accurately optically matches the lens 16 (see FIG. 4).

【0015】[0015]

【実施例】以下にその他の実施例について説明する。図
2に二点鎖線で示される第二実施例では、ホルダ10内
でレンズ16と光学的に整合するように位置調整した撮
像素子24をその位置に接着固定した後、ホルダ10を
撮像素子24とともにソケット30に係合させてもよ
い。
Embodiments Hereinafter, other embodiments will be described. In the second embodiment shown by a two-dot chain line in FIG. 2, the image pickup device 24 whose position has been adjusted so as to be optically aligned with the lens 16 in the holder 10 is bonded and fixed at that position, and then the holder 10 is attached to the image pickup device 24. Together with the socket 30.

【0016】また、図5に示す第三実施例のように、ホ
ルダ310とソケット330との係合は、ロック部32
2の向きをソケット面354と平行に設け、撮像素子2
4を、接点46の弾性付勢力に抗してソケット330内
に押込み、受光面26がソケット面354と同一面とな
る位置に保持して、ホルダ310をソケット330の側
方から矢印Y方向に摺動させて嵌入してもよい。図5で
は、第三実施例における部材で、第一実施例の変形に相
当する部材は三桁の数字の最上位に符号3を付して示
す。
Further, as in the third embodiment shown in FIG.
2 is provided in parallel with the socket surface 354, and the image sensor 2
4 is pressed into the socket 330 against the elastic urging force of the contact 46, and the light receiving surface 26 is held at a position where the light receiving surface 26 is flush with the socket surface 354. It may be slid and fitted. In FIG. 5, the members in the third embodiment, which correspond to the modifications of the first embodiment, are indicated by adding the reference numeral 3 to the top of the three-digit number.

【0017】この第三実施例のホルダ310では、箱型
嵌合枠314は三面が外壁318aで形成され、残り一
面318bが開放されており、この開放された面318
b側からソケット330に嵌入する。開放された面31
8bを介して相対する二面318aの開端部(開放面3
18b側)からソケット面354と平行に適当な長さの
スリット320を設けて、ホルダ310の下部340に
ロック部322としてフック358を形成する。
In the holder 310 of the third embodiment, the box-shaped fitting frame 314 has three surfaces formed by the outer wall 318a, and the remaining one surface 318b is open.
The socket 330 is fitted into the socket 330 from the side b. Open surface 31
8b opposed to each other via the open end (open surface 3)
A slit 320 having an appropriate length is provided in parallel with the socket surface 354 from the 18b side), and a hook 358 is formed as a lock portion 322 in the lower portion 340 of the holder 310.

【0018】フック358の幅は、ソケット下部340
で厚みを減縮した部分の幅に嵌合するように形成され、
ソケット下部340にはホルダ310のロック部322
に対応させてテーパ面362と段342を備える相手ロ
ック部323を突設する。ホルダ310のフック358
は、ソケット下部340に沿って図中右側面の外壁33
4側から嵌入される。
The width of the hook 358 is the lower portion 340 of the socket.
It is formed to fit the width of the part with reduced thickness,
Lock portion 322 of holder 310 is provided in socket lower portion 340.
A mating lock portion 323 having a tapered surface 362 and a step 342 is provided in a protruding manner. Hook 358 of holder 310
The outer wall 33 on the right side in FIG.
Fitted from four sides.

【0019】フック358の摺接斜面360は、ソケッ
ト330のテーパ面362との相互作用でフック358
を外向きに弾性変形しながら相手ロック部323を越
え、ホルダ310が支持するレンズ16の光軸が撮像素
子24の受光軸に一致する位置で、フックの顎部364
がソケット下部340に突設した段342と咬合し、ホ
ルダ310とソケット330とは確実に係止される。第
三実施例では開放面318が設けられた挿入方向の長さ
が節減でき、固定手段の小形化に有利である。
The sliding slope 360 of the hook 358 interacts with the tapered surface 362 of the socket 330 so that the hook 358
The jaw 364 of the hook is positioned at a position where the optical axis of the lens 16 supported by the holder 310 coincides with the light receiving axis of the image sensor 24 while elastically deforming outwardly over the partner lock portion 323.
Engages with the step 342 projecting from the socket lower part 340, and the holder 310 and the socket 330 are securely locked. In the third embodiment, the length in the insertion direction in which the open surface 318 is provided can be reduced, which is advantageous for downsizing the fixing means.

【0020】図6に示す第四実施例では、ソケット43
0の相手ロック部423が外壁面434の四隅に設けら
れる。しかも、この四隅のうちの一箇所は45°の斜面
をなす第5の外壁面435が形成され、撮像素子24の
方向とプリント回路端子パターン52の方向とを一致さ
せる位置決め指標となる。従って、この第5の外壁面4
35にテーパ状の切欠き439を設けて第四のロック部
422aとする。図6では第四実施例における部材で、
第一実施例の変形に相当する部材は三桁の数字の最上位
に符号4を付して示す。
In the fourth embodiment shown in FIG.
Zero counterpart lock portions 423 are provided at the four corners of the outer wall surface 434. In addition, one of the four corners is formed with a fifth outer wall surface 435 forming a 45 ° slope, and serves as a positioning index for matching the direction of the image sensor 24 with the direction of the printed circuit terminal pattern 52. Therefore, this fifth outer wall surface 4
35 is provided with a tapered notch 439 to form a fourth lock portion 422a. FIG. 6 shows members in the fourth embodiment,
The members corresponding to the modification of the first embodiment are indicated by adding the reference numeral 4 to the top of the three-digit number.

【0021】ホルダ410のロック部422は第一実施
例と同様のフック状で摺接斜面460および顎部464
が形成される。図7(a)は図6のA−A線に沿って示
したフック458aの断面図で、図7(b)は図6のB
−B線に沿って示したフック458bの断面図である。
ソケット430が相手ロック部423のテーパ面と協働
する機能は、第一実施例と同様であるので説明を省略す
る。第四実施例ではロック部422,423を外周の四
隅に設けたことにより、ホルダ410およびソケット4
30の外形を第一実施例より小さく形成できるので、装
置の小形化に有利である。
The lock portion 422 of the holder 410 has a hook shape similar to that of the first embodiment, and has a sliding slope 460 and a jaw portion 464.
Is formed. FIG. 7A is a cross-sectional view of the hook 458a taken along the line AA in FIG. 6, and FIG.
It is sectional drawing of the hook 458b shown along the -B line.
The function in which the socket 430 cooperates with the tapered surface of the mating lock portion 423 is the same as that of the first embodiment, and a description thereof will be omitted. In the fourth embodiment, since the lock portions 422 and 423 are provided at the four corners on the outer periphery, the holder 410 and the socket 4
Since the outer shape of 30 can be made smaller than in the first embodiment, it is advantageous for downsizing the device.

【0022】図8は第五実施例でソケット530の相手
ロック部523は、金属フック片565をインサート形
成したもので、中央のスリット566により両側面に対
称に突出する鉤部567の先端距離を弾性変形で強制的
に縮めることができ、ホルダ510のロック部522と
して成形した角孔568に鉤部567を強圧して貫通さ
せると、鉤部567は弾性復帰して角孔568の両端部
を強固に係止する。
FIG. 8 shows a fifth embodiment in which a mating lock portion 523 of a socket 530 has a metal hook piece 565 insert-formed therein, and the center distance of a hook 567 projecting symmetrically on both sides by a slit 566 is determined. When the hook 567 is forcibly pushed through the square hole 568 formed as the lock portion 522 of the holder 510, the hook 567 is elastically restored, and both ends of the square hole 568 are elastically deformed. Lock firmly.

【0023】この場合、鉤部567の首部570の長さ
を角孔568の深さに正確に一致させるか、鉤部567
に強制的な変形を加えてソケット530とホルダ510
との結合を強固にしてもよい。図示しないが、逆に首部
570の長さを角孔568の深さに正確に一致させた金
属フック片565をホルダ510側にインサートモール
ドし、ソケット530側に角孔568を成形すると、ロ
ックした鉤部567をソケット内に隠すことができる。
In this case, the length of the neck 570 of the hook 567 is made to exactly match the depth of the square hole 568, or
The socket 530 and the holder 510 are forcibly deformed.
May be strengthened. Although not shown, the metal hook piece 565 having the length of the neck portion 570 exactly matched with the depth of the square hole 568 is insert-molded on the holder 510 side, and locked when the square hole 568 is formed on the socket 530 side. The hook 567 can be hidden in the socket.

【0024】本発明の望ましい実施例を図示に基づいて
説明したが、上記実施例は本発明を限定するものではな
く、特許請求の範囲内で多種多様の構成や実施例の組合
わせが可能であることは当然である。
Although the preferred embodiments of the present invention have been described with reference to the drawings, the above embodiments are not intended to limit the present invention, and various configurations and combinations of embodiments are possible within the scope of the claims. It is natural.

【0025】[0025]

【発明の効果】以上の説明で明らかなように、本発明に
係わる撮像素子の固定手段によれば、撮像素子に熱の影
響を与えることなく、光学系との整合は自然に調整され
てプリント基板に確実に固定できるので、組立ての自動
化が可能になる。
As is apparent from the above description, according to the fixing means of the image pickup device according to the present invention, the alignment with the optical system is naturally adjusted without affecting the image pickup device by heat, and the printing is performed. Since it can be securely fixed to the substrate, the assembly can be automated.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係わる撮像素子の固定手段の第一実施
例を示す分解斜視図である。
FIG. 1 is an exploded perspective view showing a first embodiment of an image sensor fixing means according to the present invention.

【図2】本発明に係わる撮像素子の固定手段におけるレ
ンズホルダを図1の反対側から見た斜視図で、第二実施
例が二点鎖線で示される。
FIG. 2 is a perspective view of a lens holder of the image sensor fixing means according to the present invention as viewed from the opposite side of FIG. 1, and a second embodiment is indicated by a two-dot chain line.

【図3】本発明に係わる撮像素子の固定手段においてソ
ケットに撮像素子を嵌入した状態を示す模式的断面図で
ある。
FIG. 3 is a schematic cross-sectional view showing a state in which the image pickup device is fitted into the socket in the image pickup device fixing means according to the present invention.

【図4】本発明に係わる撮像素子の固定手段の第一実施
例を一部断面で示した組立図である。
FIG. 4 is an assembly view showing a first embodiment of a fixing means of an image sensor according to the present invention in a partial cross section.

【図5】本発明に係わる撮像素子の固定手段の第三実施
例で、(a)は一部断面で示した組立図、(b)は組立
説明の側面図である。
FIGS. 5A and 5B show a third embodiment of the image sensor fixing means according to the present invention, wherein FIG. 5A is an assembly view showing a partial cross section, and FIG.

【図6】本発明に係わる撮像素子の固定手段の第四実施
例の平面図である。
FIG. 6 is a plan view of a fourth embodiment of the image sensor fixing means according to the present invention.

【図7】本発明に係わる撮像素子の固定手段の第四実施
例におけるフック部分を拡大図示した側面図で、(a)
は図6のA−A線に沿って示した断面図、(b)は図6
のB−B線に沿って示した断面図である。
FIG. 7 is an enlarged side view of a hook portion in a fourth embodiment of the image sensor fixing means according to the present invention, and FIG.
6 is a cross-sectional view taken along the line AA in FIG. 6, and FIG.
FIG. 3 is a cross-sectional view taken along line BB of FIG.

【図8】本発明に係わる撮像素子の固定手段の第五実施
例を部分的に示す分解斜視図である。
FIG. 8 is an exploded perspective view partially showing a fifth embodiment of the image sensor fixing means according to the present invention.

【図9】従来の撮像素子の固定手段を示す分解斜視図で
ある。
FIG. 9 is an exploded perspective view showing a conventional image sensor fixing means.

【符号の説明】[Explanation of symbols]

10 ホルダ 12 鏡筒 14 箱型嵌合枠 16 光学レンズ 18 外壁(ホルダ) 22 ロック部 23 相手ロック部 24 撮像素子 28 外部接続端子 30 ソケット 32 内壁面(ソケット) 34 外壁面(ソケット) 36 内壁面(ホルダ) 38 切欠き 44 外部端子 48 プリント基板 52 端子パターン 58 フック DESCRIPTION OF SYMBOLS 10 Holder 12 Lens tube 14 Box-shaped fitting frame 16 Optical lens 18 Outer wall (holder) 22 Lock part 23 Partner lock part 24 Image sensor 28 External connection terminal 30 Socket 32 Inner wall surface (socket) 34 Outer wall surface (Socket) 36 Inner wall surface (Holder) 38 Notch 44 External terminal 48 Printed circuit board 52 Terminal pattern 58 Hook

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H05K 1/18 H01L 27/14 D 5E336 Fターム(参考) 2H043 AB02 AB08 AB10 AB14 AB35 AE05 AE11 AE17 AE23 4M118 AA10 AB01 BA10 BA14 GD02 HA20 HA23 HA24 5C022 AC42 AC51 AC54 AC70 AC78 5C024 CY49 EX22 EX42 GY01 GY31 5E024 CA14 5E336 AA04 AA09 BB01 CC32 CC58 DD12 DD16 DD26 DD28 DD38 EE15 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H05K 1/18 H01L 27/14 D 5E336 F term (Reference) 2H043 AB02 AB08 AB10 AB14 AB35 AE05 AE11 AE17 AE23 4M118 AA10 AB01 BA10 BA14 GD02 HA20 HA23 HA24 5C022 AC42 AC51 AC54 AC70 AC78 5C024 CY49 EX22 EX42 GY01 GY31 5E024 CA14 5E336 AA04 AA09 BB01 CC32 CC58 DD12 DD16 DD26 DD28 DD38 EE15

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 撮像素子の外周に嵌合するフレームの内
縁側に上記撮像素子の複数の外部接続端子とそれぞれ電
気的接触を保つ複数の接点と、この各接点から延在する
複数の外部端子を前記フレーム外縁側に備えるソケット
と、前記撮像素子の受光面に影像を投影する光学レンズ
を保持するホルダとからなり、前記ソケットに前記ホル
ダとが互いに精密に嵌合するとともに互いに咬合するロ
ック部をそれぞれに備えることを特徴とする撮像素子の
固定手段。
1. A plurality of contacts for maintaining electrical contact with a plurality of external connection terminals of the image sensor on an inner edge side of a frame fitted to an outer periphery of the image sensor, and a plurality of external terminals extending from the respective contacts. And a holder for holding an optical lens that projects an image on the light-receiving surface of the image sensor, and the holder is precisely fitted to the socket and is engaged with each other. A fixing means for the image pickup device, wherein
【請求項2】 前記ソケットとホルダのロック部は、そ
れぞれを合成樹脂材料で一体成形したことを特徴とする
請求項1記載の撮像素子の固定手段。
2. The image pickup device fixing means according to claim 1, wherein said lock portion of said socket and said holder is integrally formed of a synthetic resin material.
【請求項3】 前記ソケットとホルダのロック部は、い
ずれか一方を金属材料で構成したことを特徴とする請求
項1記載の撮像素子用ソケットとホルダ。
3. The imaging device socket and holder according to claim 1, wherein one of the locking portion of the socket and the holder is made of a metal material.
【請求項4】 前記接点は前記ソケットの底面側に配設
され、嵌入される前記撮像素子を押戻す方向に弾性付勢
されていることを特徴とする請求項1記載の撮像素子の
固定手段。
4. The image pickup device fixing means according to claim 1, wherein said contact is disposed on a bottom surface side of said socket, and is elastically urged in a direction of pushing back said image pickup device to be fitted. .
【請求項5】 前記ホルダは前記レンズに対する光学的
整合面を備え、前記ソケット嵌入時において前記接点の
弾性付勢で嵌入方向に変位自在に支持されている前記撮
像素子は、前記ホルダの咬合によって前記ソケット内に
押入され、前記受光面が前記光学的整合面に圧着される
ことを特徴とする請求項1記載の撮像素子の固定手段。
5. The image pickup device, wherein the holder has an optical alignment surface with respect to the lens, and the image pickup device, which is supported so as to be displaceable in a fitting direction by elastic biasing of the contact point when the socket is fitted, is engaged by the holder. 2. The image pickup device fixing means according to claim 1, wherein the light receiving surface is pressed into the socket and the light receiving surface is pressed against the optical alignment surface.
【請求項6】 前記ホルダとソケットとの嵌合に先立
ち、前記撮像素子を前記ホルダに固定したこと特徴とす
る請求項1記載の撮像素子の固定手段。
6. The means for fixing an image sensor according to claim 1, wherein the image sensor is fixed to the holder before the holder is fitted to the socket.
JP37314999A 1999-12-28 1999-12-28 Image sensor fixing means Ceased JP2001188155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP37314999A JP2001188155A (en) 1999-12-28 1999-12-28 Image sensor fixing means

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP37314999A JP2001188155A (en) 1999-12-28 1999-12-28 Image sensor fixing means

Publications (1)

Publication Number Publication Date
JP2001188155A true JP2001188155A (en) 2001-07-10

Family

ID=18501662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP37314999A Ceased JP2001188155A (en) 1999-12-28 1999-12-28 Image sensor fixing means

Country Status (1)

Country Link
JP (1) JP2001188155A (en)

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