JP2001185974A - Piezoelectric resonance components - Google Patents

Abstract

(57) [Problem] To provide a piezoelectric resonance component which is easy to manufacture, inexpensive, can effectively suppress unnecessary spurious components, and has good resonance characteristics. SOLUTION: A piezoelectric resonance element 2 includes package substrates 3 and 4.
Of the package substrates 3 and 4 of the piezoelectric resonance element 2
The piezoelectric resonance component 1, which is smaller than the Young's modulus of the piezoelectric material constituting the piezoelectric resonance component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a piezoelectric resonance component such as a piezoelectric resonator or a piezoelectric filter, and more particularly, to a piezoelectric resonance component having a structure in which a piezoelectric resonance element is fixed to a package substrate.

[0002]

2. Description of the Related Art Conventionally, there have been known piezoelectric resonance parts having various structures in which a piezoelectric resonance element for forming a piezoelectric resonator or a piezoelectric filter is fixed to a package substrate.

FIG. 8 is a sectional view showing an example of this type of piezoelectric resonance component. In the piezoelectric resonance component 101, package substrates 103 and 104 are stacked above and below an energy trapping type piezoelectric resonance element 102. Piezoelectric resonance element 102
Are the excitation electrodes 102 on the upper and lower surfaces of the piezoelectric plate 102a.
b, 102c are formed. The portion where the excitation electrodes 102b and 102c face each other via the piezoelectric plate 102a constitutes an energy trapping type resonance section. On the other hand, the package substrates 103 and 104
It has recesses 103a, 104a,
4a forms a space for preventing the vibration of the resonance part from being hindered.

[0004] By the way, in the piezoelectric resonance component 101,
In addition to the resonance characteristics to be used by the piezoelectric resonance element 102, unnecessary spurious components due to various vibration modes tend to occur.

In order to suppress the spurious due to the unnecessary vibration as described above, the following various methods have been tried. A first method is to apply a damping agent to the piezoelectric resonance element in order to attenuate spurious vibration.

As a second method, there is a method of forming an excitation electrode so as to have a shape in which spurious vibration is unlikely to occur. As a third method, there is a method of damping unnecessary spurious vibrations by controlling the shape and dimensions of a sealing portion around a space for preventing vibration of a resonance portion of the piezoelectric resonance element.

As a fourth method, Japanese Patent Laid-Open No. 6-14 / 1994
As described in Japanese Patent Publication No. 0868, a package substrate to be laminated on the piezoelectric resonance element is constituted by a composition obtained by blending bisphenol A epoxy resin, DDP novolak phenol resin and glass fiber, thereby alleviating curing shrinkage, There is disclosed a method for suppressing unnecessary vibration in portions other than the vibrating portion of the piezoelectric resonance element.

Japanese Patent Application Laid-Open No. 5-102778 discloses that in a structure in which a package substrate made of ceramics is laminated on a piezoelectric resonance element using piezoelectric ceramics, an external electrode electrically connected to an excitation electrode is made of a material such as a younger material than a ceramic material. A structure formed by a conductive adhesive having a low rate is disclosed. Here, it is described that unnecessary vibration is attenuated by the conductive adhesive, thereby reducing spurious.

Further, Japanese Patent Application Laid-Open No. 4-77011 discloses that a package substrate laminated on a piezoelectric resonance element has different materials in a thickness direction, and a material layer having a small Young's modulus is formed on the package substrate. A side-located structure is disclosed.

[0010]

In the above-mentioned first method, it is necessary to apply a damping agent only to suppress spurious, so that the cost has to be increased.

In the second method, it is necessary to change the shape of the excitation electrode. In this case, if the shape of the electrode is changed, the resonance characteristic to be used may be impaired. In addition, there is a possibility that another spurious due to the electrode shape may occur.

In the third method, the shape and dimensions of the sealing portion must be controlled so as not to hinder the main resonance characteristics to be used. Accordingly, high processing accuracy is required, which also causes an increase in cost. In addition, when the processing accuracy is not sufficient, the main resonance characteristics are affected, which may lead to deterioration of the characteristics and increase of defective products.

In the piezoelectric resonance component described in JP-A-6-140868, a thermosetting resin having the above specific composition including an inorganic filler such as silica and glass fiber is melted on the main surface of the piezoelectric substrate. A package layer is formed by applying and curing. Since the thermosetting resin must be applied so as not to reach the resonance part, the operation is complicated. In addition, curing shrinkage is mitigated by the addition of inorganic fillers and glass fibers, but due to variations in curing shrinkage, unnecessary spurs may still occur.

In the piezoelectric resonance component described in Japanese Patent Application Laid-Open No. 4-77011, a package material whose material changes in the thickness direction is used, and a portion having a small Young's modulus of the package material is arranged on the piezoelectric resonance element side. It is said that unwanted spurious is suppressed, but this method is not sufficient for suppressing spurious because it only vaguely states the magnitude of the Young's modulus and is not compared with a piezoelectric body. There was a problem.

Therefore, an aspect of the present invention is to solve the above-mentioned disadvantages of the prior art, to effectively suppress spurious vibrations without deteriorating the resonance characteristics and filter characteristics to be used, and to reduce the complexity. An object of the present invention is to provide a piezoelectric resonance component that can be easily manufactured without performing a complicated operation and that can be provided at low cost.

[0016]

According to a broad aspect of the present invention, a package substrate, a piezoelectric resonance element fixed on the package substrate, and a bonding material fixing the piezoelectric resonance element to the package substrate are provided. Wherein the Young's modulus of the package substrate is smaller than the Young's modulus of a piezoelectric body constituting the piezoelectric resonance element.

In a specific aspect of the present invention, the package substrate is a multilayer package substrate having at least two layers. In a more specific aspect of the present invention, the multilayer substrate includes a layer having a larger Young's modulus than the piezoelectric body and a layer having a smaller Young's modulus than the piezoelectric body.

In a more specific aspect of the present invention,
The layer with the lowest porosity is made of amorphous glass and ceramic powder.
And the layer having a large Young's modulus is Al
_TwoO _ThreeOr MgTiO_ThreeConsists of

According to a specific aspect of the present invention, the piezoelectric resonance element is an energy trapping type piezoelectric resonance element having a piezoelectric plate and a resonance part formed partially on the piezoelectric plate. The piezoelectric resonance component according to the present invention can be a component having various structures as long as it has the piezoelectric resonance element, the package substrate, and the bonding material.

In a specific aspect of the present invention, a package substrate is laminated on both sides of the piezoelectric resonance element so as not to hinder the vibration of the piezoelectric resonance element. Further, in another specific aspect of the present invention, a cap material joined to the package substrate is further provided so as to surround the piezoelectric resonance element fixed on the package substrate.

According to still another specific aspect of the present invention, the package substrate has a concave portion for accommodating the piezoelectric resonance element, and a lid member fixed to the package substrate so as to close the concave portion. Is further provided.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.

FIGS. 1A and 1B are a sectional view and an external perspective view showing a piezoelectric resonance component according to a first embodiment of the present invention. In the piezoelectric resonance component 1, first and second package substrates 3 and 4 are stacked above and below a rectangular plate-shaped piezoelectric resonance element 2.

In the piezoelectric resonance element 2, first and second excitation electrodes 5 and 7 are formed on both main surfaces of a rectangular plate-shaped piezoelectric substrate 5. The piezoelectric substrate 5 is made of a piezoelectric ceramic such as lead zirconate titanate-based ceramics or a piezoelectric single crystal such as quartz. The Young's modulus of this type of piezoelectric material is usually about 5.0 to 18, and preferably, when a third harmonic is used, the Young's modulus is 14.2 × 10 ^{10 to} 16.2.
A size of about × 10 ¹⁰ is used.

The excitation electrodes 6 and 7 are opposed to each other at the center of the piezoelectric plate 5, and the portion where the excitation electrodes 6 and 7 are opposed constitutes an energy trapping type piezoelectric resonance section. The excitation electrode 6 is extended to one end face of the structure in which the piezoelectric resonance element 2 and the package substrates 3 and 4 are stacked, and the excitation electrode 7 is extended to the other end face. External electrodes 8 and 9 are formed on both end surfaces of the laminated structure, respectively.

The excitation electrodes 6 and 7 are formed by applying a conductive material such as Ag or Cu by a thin film forming method such as vapor deposition, plating or sputtering. On the other hand, the external electrodes 8 and 9 are formed in the same manner, or by applying and curing a conductive paste.

The package substrates 3 and 4 include the piezoelectric resonance element 2
Have concave portions 3a and 4a on the side to be laminated. Recess 3a,
Reference numeral 4a is provided to form a space that does not hinder the vibration of the resonance section of the piezoelectric resonance element 2.

Although not shown in FIG. 1, the package substrates 3 and 4 are fixed to the piezoelectric resonance element 2 through a bonding material made of an insulating adhesive. The package substrates 3 and 4 are made of an insulating material having a Young's modulus lower than that of the piezoelectric body. As the insulating material, an insulating ceramic such as Al ₂ O ₃ or MgTiO ₃ or a composite material of non-crystallized glass and ceramic powder can be used. The Young's modulus of the package substrates 3 and 4 is not particularly limited as long as it is lower than the Young's modulus of the piezoelectric body, but is preferably 9.8 × 10 ¹⁰
Approximately 11.8 × 10 ¹⁰ is used.

Therefore, the ratio of the Young's modulus of the package substrate / the Young's modulus of the piezoelectric resonance element 2 is preferably in the range of 0.60 to 0.83. In this embodiment, the spurious vibration generated in the piezoelectric resonance element 2 is caused by a bonding material (not shown).
, But the spurious vibration is attenuated because the Young's modulus of the package substrates 3 and 4 is relatively small. Therefore, spurious components appearing on the resonance characteristics can be effectively suppressed.

The spurious suppression effect as described above can be obtained as long as the Young's modulus of the package substrates 3 and 4 is smaller than the Young's modulus of the piezoelectric body constituting the piezoelectric resonance element 2.
By setting the above preferable range, spurious can be suppressed more effectively.

For example, when a lead zirconate titanate-based piezoelectric ceramic is used as the piezoelectric body, its Young's modulus is 15.2 × 10 ¹⁰ , and the package substrates 3 and 4 are made of SiO ₂ as non-crystallized glass. -MgO-Al ₂
O ₃ and Al ₂ O ₃ or BaTiO as ceramic powder
_When using a composite material of ₃ or ZrO ₂ or the like, it is about 10.8 × 10 ¹⁰ , and when using Al ₂ O ₃ , it depends on the purity. 32.0 × 10 ¹⁰ .

FIG. 2 is a sectional view showing a piezoelectric resonance component according to a second embodiment. Piezoelectric resonance component 11 of second embodiment
In this example, an energy trapping type piezoelectric resonance element 2 is bonded onto a package substrate 12 on a substrate via conductive bonding materials 13 and 14 and fixed to the package substrate 12. The excitation electrode 6 is formed so as to reach the lower surface via the end surface of the piezoelectric plate 5, and is joined to the package substrate 12 by a conductive bonding material 13 at a portion of the excitation electrode 6 which reaches the lower surface of the piezoelectric body 5. ing.

Note that, on the upper surface of the package substrate 12, there are formed terminal electrodes 15 and 16 which are drawn out to the outside. The terminal electrodes 15 and 16 are made of the conductive bonding material 13 and 1.
4.

On the other hand, a cap 17 is bonded on the package substrate 12. The cap 17 has an opening below and is joined to the package substrate 12 via an insulating adhesive (not shown) so as to surround the piezoelectric resonance element 2.

The cap 17 has a structure in which at least the surface is made of a conductive material, for example, a metal or an insulating material and the surface is covered with a conductive film. By using such a cap 17 having at least a surface having conductivity, the piezoelectric resonance element 2 can be electromagnetically shielded. However, the cap 17 may be made of an insulating material.

Also in this embodiment, the Young's modulus of the package substrate 12 is smaller than the Young's modulus of the piezoelectric material constituting the piezoelectric plate 5 of the piezoelectric resonance element 2. Accordingly, similarly to the first embodiment, unnecessary spurious vibrations generated in the piezoelectric resonance element 2 are caused by the conductive bonding materials 13 and 14.
When the vibration propagates to the package substrate 12 through the package, the vibration is attenuated by the package substrate 12. Therefore, unnecessary spurious components in the resonance characteristics are effectively suppressed.

FIG. 3 is a sectional view showing a piezoelectric resonance component according to a third embodiment of the present invention. In the piezoelectric resonance component 21 of this embodiment, the package substrate 22 has the concave portion 22a, and the piezoelectric resonance element 2 is housed in the concave portion 22a. That is, the package substrate 22 has an opening that opens upward,
The inside of the opening forms a concave portion 22a. In the concave portion 22a, the piezoelectric resonance element 2 is fixed to the package substrate 22 via the conductive bonding materials 13 and 14, as in the second embodiment. Further, a lid member 23 is joined to the opening end surface of the package substrate 22 via an adhesive (not shown) so as to close the recess 22a.

In this embodiment, a flat package substrate 12 is used.
, A package substrate 22 having a concave portion 22 a is used, and a lid member 23 is used instead of the cap 17, and the configuration is the same as that of the second embodiment. . That is, since the Young's modulus of the package substrate 22 is smaller than the Young's modulus of the piezoelectric body constituting the piezoelectric plate 5 of the piezoelectric resonance element 2, unnecessary Young's The spurious is attenuated in the package substrate 22, and the spurious appearing on the resonance characteristic is effectively suppressed.

In the first to third embodiments, unnecessary spurious can be suppressed as described above only by selecting the Young's modulus of the piezoelectric resonance element and the package substrate. Therefore, the piezoelectric resonance components of the first to third embodiments can be easily manufactured, and unnecessary spurious can be suppressed without increasing the cost of the piezoelectric resonance component.

FIG. 4 is a sectional view showing a piezoelectric resonance component according to a fourth embodiment of the present invention. In the piezoelectric resonance component 31 according to the fourth embodiment, the first and second package substrates 32 and 33 are stacked above and below the piezoelectric resonance element 2. 4th
Is different from the first embodiment in that the first and second embodiments
Are constituted by a multilayer package substrate in which a plurality of material layers are stacked. The other points are the same as those of the first embodiment. Therefore, the same parts as those of the first embodiment are denoted by the same reference numerals, and the detailed description is omitted.

The package substrate 32 is made of first to fifth materials
It has a structure in which layers 32a to 32e are stacked. this house,
The first, third, and fifth material layers 32a, 32c, and 32e are
SiO_Two-MgO-Al_TwoO_ThreeThe second and fourth
The material layers 32b and 32d are made of Al _TwoO_ThreeConsists of Therefore,
The first, third, and fifth material layers 32a, 32c, and 32e
Forming SiO_Two-MgO-Al_TwoO_ThreeYoung's modulus is
8.01 × 10^TenAnd the second and fourth material layers 32b,
Al constituting 32d_TwoO_ThreeHas a Young's modulus of 32.0
× 10^TenIt is. In addition, the first, third, and fifth material layers 32
a, 32c, and 32e, and the second and fourth material layers 32.
By adjusting the thicknesses of b and 32d, in this embodiment,
Is that the Young's modulus of the entire first package substrate 32 is 1
0.8 × 10 ^TenIt has been. Similarly, the package substrate
33, the first to fifth material layers 33a to 33e
It has a laminated structure with a Young's modulus of 10.8 as a whole.
× 10 ^TenIt has been.

On the other hand, in the present embodiment, the piezoelectric plate 5 of the piezoelectric resonance element 2 is made of lead zirconate titanate-based ceramics, and its Young's modulus is 15.2 × 10 ¹⁰ . That is, the ratio of the Young's modulus of the package substrates 32 and 33 / the Young's modulus of the piezoelectric body is set to 0.71. Therefore, the first
Similarly to the preferred embodiment, when the spurious vibration generated in the piezoelectric resonance element 2 is transmitted to the package substrates 32 and 33 via a bonding material (not shown), the spurious vibration is attenuated by the package substrates 32 and 33. In addition, unnecessary spurious appearing on the resonance characteristics can be effectively suppressed.

The package substrates 32 and 33 can be easily obtained by laminating a green sheet mainly composed of a material made of non-crystallized glass and ceramic powder and a green sheet composed of Al ₂ O ₃ and firing them. it can.
That is, it can be easily obtained by using the method for manufacturing a ceramic multilayer substrate. Therefore, the cost of the piezoelectric resonance component 31 does not increase.

FIG. 5 is a sectional view showing a piezoelectric resonance component according to a fifth embodiment of the present invention. In the piezoelectric resonance component 41,
First and second package substrates 42 and 43 are stacked on both main surfaces of the piezoelectric resonance element 2. Package substrate 42,
The fifth embodiment is configured in the same manner as the fourth embodiment, except that the structure of 43 is different from that of the fourth embodiment.

That is, the first and second package substrates 4
Reference numerals 2 and 43 denote multilayer package substrates, which are different from the package substrates 32 and 33 shown in FIG.

Taking the first package substrate 42 as an example,
The first package substrate 42 has a concave portion 42a for preventing the vibration of the resonance section of the piezoelectric resonance element 2 from being hindered. The package substrate 42 has first to third material layers 42b to 42d. Each of the material layers 42b to 42d is
2a. In other words, in the cross-sectional view shown in FIG. 5, the first to third material layers 42b
To 42d have a substantially U-shape, and are configured so that their ends reach a portion to be joined to the piezoelectric resonance element 2. The same applies to the package substrate 43. As described above, when the package substrates 42 and 43 have a multilayer structure, each material layer can be configured in various forms.

Also in the fifth embodiment, since the whole Young's modulus of the first and second package substrates 42 and 43 is smaller than the Young's modulus of the piezoelectric body constituting the piezoelectric resonance element 2, the first and second package substrates 42 and 43 are different from each other. As in the fourth to fourth embodiments, the vibration spurious is attenuated by the package substrates 42 and 43, and as a result, unnecessary spurious appearing on the resonance characteristics can be effectively suppressed.

FIG. 6 is a sectional view showing a piezoelectric resonance component according to a sixth embodiment of the present invention. This piezoelectric resonance component 51
Corresponds to a modification of the second embodiment, and is different only in that a multilayer package substrate 52 is used instead of the flat package substrate 12 used in the second embodiment.

The package substrate 52 has a structure in which first to third material layers 52a to 52c are stacked. 1st, 3rd
Are made of SiO ₂ —MgO—Al ₂
Consist O _3, the second material layer 52b is made of Al ₂ O _3. Further, by adjusting the thickness of these material layers, in the present embodiment, the Young's modulus of the entire package substrate 52 is set to 10.8 × 10 ¹⁰ . Therefore, the ratio of the Young's modulus of the package substrate 52 / the Young's modulus of the piezoelectric body = 0.71.
It has been.

Therefore, as in the first to fifth embodiments, the spurious vibration generated in the piezoelectric resonance element 2 can be attenuated in the package substrate 52, and as a result, the spurious appearing on the resonance characteristics can be effectively reduced. Can be suppressed.

FIG. 7 is a sectional view showing a piezoelectric resonance component according to a seventh embodiment of the present invention. The piezoelectric resonance component 61 corresponds to a modified example of the third embodiment, and is different only in that a multilayer package substrate 62 is used instead of the package substrate 22.

The multilayer package substrate 62 has a structure in which first to fifth material layers 62a to 62c are stacked. First
The third and fifth material layers 62a, 62c and 62e are made of SiO ₂
Consists -MgO-Al ₂ O _3, the second, fourth material layer 6
2b and 62d are made of Al ₂ O ₃ . By adjusting the thicknesses of the first to fifth material layers 62a to 62e, the Young's modulus of the package substrate 62 becomes 10.8 × 10
It is assumed to be ¹⁰ .

Accordingly, since the ratio of the Young's modulus of the package substrate / the Young's modulus of the piezoelectric body is set to 0.71, the first to sixth piezoelectric elements are set.
As in the case of the third embodiment, unnecessary spurious vibration generated in the piezoelectric resonance element 2 is attenuated by the package substrate 62. Therefore, unnecessary spurious components appearing on the resonance characteristics can be effectively suppressed.

In the above-described first to sixth embodiments, the case where the energy trapping type piezoelectric resonance element 2 is used has been described as an example. In the present invention, the plurality of energy trapping type piezoelectric resonance elements are used as the piezoelectric resonance element. A piezoelectric filter element having a resonance section may be used.

Further, a counter electrode may be formed on a part of the piezoelectric resonance element, and another electronic component function section such as a capacitor section may be formed in addition to the piezoelectric resonance section.

[0056]

In the piezoelectric resonance component according to the present invention, since the Young's modulus of the package substrate is smaller than the Young's modulus of the piezoelectric body constituting the piezoelectric resonance element, the spurious vibration generated in the piezoelectric resonance element causes the bonding material to be deformed. Spurious vibration is attenuated in the package substrate even if the signal propagates to the package substrate via the substrate. Therefore, unnecessary spurious appearing on the resonance characteristics and the filter characteristics can be effectively suppressed.

According to the present invention, as described above, unnecessary spurious can be suppressed only by adjusting the Young's modulus of the piezoelectric material constituting the package substrate and the piezoelectric resonance element, and the manufacturing process becomes complicated. And the cost of the piezoelectric resonance component does not increase.

Therefore, it is possible to easily and inexpensively provide a piezoelectric resonance component having no spurious components and excellent characteristics. In the case where the package substrate is constituted by a multilayer package substrate having at least two layers, the material constituting each layer is easily adjusted by adjusting the number and thickness of the layers, so that the material can be easily used as compared with the piezoelectric body. A package substrate having a low rate and capable of effectively suppressing unnecessary spurious components can be configured.

When the multilayer package substrate has a layer having a higher Young's modulus than the piezoelectric body and a layer having a lower Young's modulus than the piezoelectric body, the overall Young's modulus is smaller than the Young's modulus of the piezoelectric body. The multilayer package substrate can be formed using various materials as long as the substrate is set at a low level. For example, even if the Young's modulus is large, the dimensional stability, heat resistance, and the like of the piezoelectric resonance component can be improved by stacking layers made of a material having excellent heat resistance and dimensional stability.

For example, such a structure is attained by using a composite material of non-crystallized glass and ceramic powder for the layer having a small Young's modulus and using Al ₂ O ₃ or MgTiO ₃ for the layer having a large Young's modulus. be able to.

When the piezoelectric resonance element is an energy-trapping type piezoelectric resonance element having an energy-trapping type resonance section, an inexpensive energy-trapping type piezoelectric resonance component with less unnecessary spurious can be provided according to the present invention.

When a package substrate is laminated on both sides of the piezoelectric resonance element, unnecessary spurious can be effectively suppressed on both sides of the piezoelectric resonance element. When a piezoelectric resonance element is fixed on a package substrate, and a cap material is bonded to the package substrate so as to surround the piezoelectric resonance element, unnecessary spurious can be suppressed by the package substrate, Thereby, the piezoelectric resonance element can be reliably sealed in the package structure including the package substrate and the cap material.

Similarly, when the package substrate has a concave portion for accommodating the piezoelectric resonance element and the lid member is fixed to the package material so as to close the concave portion, unnecessary spurious components are suppressed by the package substrate. In addition, the piezoelectric resonance element can be reliably sealed in a package structure including the package substrate and the lid member.

[Brief description of the drawings]

FIGS. 1A and 1B are a cross-sectional view and a perspective view showing an appearance of a piezoelectric resonance component according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a piezoelectric resonance component according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a piezoelectric resonance component according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing a piezoelectric resonance component according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing a piezoelectric resonance component according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view showing a piezoelectric resonance component according to a sixth embodiment of the present invention.

FIG. 7 is a sectional view showing a piezoelectric resonance component according to a seventh embodiment of the present invention.

FIG. 8 is a sectional view showing an example of a conventional piezoelectric resonance component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Piezoelectric resonance component 2 ... Energy trapping type piezoelectric resonance element 3,4 ... Package board 5 ... Piezoplate 6,7 ... Excitation electrode 11 ... Piezoelectric resonance component 12 ... Package board 13,14 ... Conductive bonding as joining material Material 17: Cap material 21: Piezoelectric resonance component 22: Package substrate 22a ... Depression 23 ... Lid material 31: Piezoelectric resonance component 32, 33 ... Multilayer package substrate 32a to 32e ... First to fifth material layers 33a to 33e ... First to fifth material layers 41 Piezoelectric resonance components 42, 43 Multilayer package substrates 42b to 42d First to third material layers 43b to 43d First to third material layers 51 Piezoelectric resonance components 52 Multilayer package substrates 52a to 52c: first to third material layers 61: piezoelectric resonance components 62: multilayer package substrates 62a to 62e: first to fifth material layers

Claims (8)

[Claims] 1. A piezoelectric resonance component comprising: a package substrate; a piezoelectric resonance element fixed on the package substrate; and a bonding material fixing the piezoelectric resonance element to the package substrate. However, the piezoelectric resonance component is smaller than the Young's modulus of the piezoelectric body constituting the piezoelectric resonance element. 2. The piezoelectric resonance component according to claim 1, wherein the package substrate is a multilayer package substrate having at least two layers. 3. The piezoelectric resonance according to claim 2, wherein the multilayer substrate has a layer having a higher Young's modulus than the piezoelectric body and a layer having a lower Young's modulus than the piezoelectric body. parts. 4. The method according to claim 3, wherein the low Young's modulus layer is made of a composite material of non-crystallized glass and ceramic powder, and the high Young's modulus layer is made of Al ₂ O ₃ or MgTiO ₃ . Piezoelectric resonance parts. 5. The piezoelectric resonance element according to claim 1, wherein the piezoelectric resonance element is an energy trapping type piezoelectric resonance element having a piezoelectric plate and a resonance part formed partially on the piezoelectric plate. parts. 6. The piezoelectric resonance component according to claim 1, wherein the package substrate is laminated on both surfaces of the piezoelectric resonance element so as not to hinder vibration of the piezoelectric resonance element. 7. The piezoelectric resonance component according to claim 1, further comprising a cap material joined to the package substrate so as to surround the piezoelectric resonance element fixed on the package substrate. 8. The package substrate according to claim 1, wherein the package substrate has a concave portion for accommodating the piezoelectric resonance element, and further includes a lid fixed to the package substrate so as to close the concave portion. Or a piezoelectric resonance component.