JP2001185601A - Disk support device - Google Patents
Disk support deviceInfo
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- JP2001185601A JP2001185601A JP37064799A JP37064799A JP2001185601A JP 2001185601 A JP2001185601 A JP 2001185601A JP 37064799 A JP37064799 A JP 37064799A JP 37064799 A JP37064799 A JP 37064799A JP 2001185601 A JP2001185601 A JP 2001185601A
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- disk
- support
- center
- supporting
- point
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
(57)【要約】
【課題】 3点以上の支持部によって円板を支持する場
合に、円板の上下方向の変形量を最小にすることができ
るような円板支持装置を提供する。
【解決手段】 ポアソン比が0から0.4999の範囲
にあるSi半導体ウェハ等の円板10を支持する円板支
持装置であって、円板10の周方向に等分した位置に3
箇所以上の支持部11を有している。この円板支持装置
は、支持部11が占める領域の中心と前記円板の中心と
を一致させかつ円板10を水平な姿勢で支持部11の上
に乗せるようにしている。円板10の直径をD0 、各支
持部11を通る円rの直径をDとしたとき、D/D0 が
0.677を中心値として0.6以上、0.7未満とな
る位置に各支持部11が設けられている。
(57) [Problem] To provide a disk supporting device capable of minimizing the amount of vertical deformation of a disk when the disk is supported by three or more support portions. SOLUTION: This is a disk supporting device for supporting a disk 10 such as a Si semiconductor wafer having a Poisson's ratio in a range of 0 to 0.4999.
It has more than one support portion 11. In this disk support device, the center of the area occupied by the support portion 11 and the center of the disk are matched, and the disk 10 is placed on the support portion 11 in a horizontal posture. Assuming that the diameter of the disc 10 is D 0 and the diameter of a circle r passing through each supporting portion 11 is D, the position where D / D 0 is 0.6 or more and less than 0.7 with 0.677 as a center value. Each support 11 is provided.
Description
【0001】[0001]
【発明の属する技術分野】この発明は、例えばSi半導
体ウェハ等の円板状の支持対象物を水平に支持するのに
好適な円板支持装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disk supporting device suitable for horizontally supporting a disk-shaped supporting object such as a Si semiconductor wafer.
【0002】[0002]
【従来の技術】円板を搬送アーム等によって下側から支
持する場合、搬送アームに設ける支持部の位置や数、円
板の外径(直径)、円板の板厚等によっては、円板が許
容限度を越えて撓むことがある。例えば外径が数十cm
で厚さ1mm以下のSi(シリコン)製の円板を、上に
凸の3箇所以上の支持部によって水平に支持する場合、
支持部の位置や数によっては、円板の自重により、円板
の一部(支持部以外の箇所)が上下方向に大きく変位
し、その結果、円板全体の変位量(自重変位とも称され
る)が許容限度を越えることがある。2. Description of the Related Art When a disk is supported from below by a transfer arm or the like, the position and number of supports provided on the transfer arm, the outer diameter (diameter) of the disk, the thickness of the disk, and the like depend on the disk. May bend beyond the permissible limits. For example, the outer diameter is several tens cm
When a circular plate made of Si (silicon) having a thickness of 1 mm or less is horizontally supported by three or more support portions that are upwardly convex,
Depending on the position and number of the support parts, a part of the disk (parts other than the support part) is greatly displaced in the vertical direction due to the weight of the disk, and as a result, the displacement amount of the entire disk (also referred to as its own weight displacement) May exceed the permissible limit.
【0003】そこで円板の上下方向変位をなるべく小さ
くするために、支持部の形態、すなわち支持部の数や、
円板中心から支持部までの距離を最適化する必要が生じ
た。支持部が3箇所以上ある場合の支持部の最適位置を
探るために幾何学的な計算を行なうと、以下に述べるよ
うな支持部の位置が算出される。In order to minimize the vertical displacement of the disk, the shape of the support, that is, the number of the support,
It became necessary to optimize the distance from the center of the disk to the support. When a geometric calculation is performed to find the optimum position of the support portion when there are three or more support portions, the position of the support portion described below is calculated.
【0004】ここで円板の直径をD0 、各支持部を通る
円の直径(この明細書では支持位置径と称することもあ
る)をDとし、支持部の数が円板の周方向に無限数存在
する(すなわち円周支持)と仮定する。また、各支持部
を通る円を境に、円の内側と外側の重量すなわち面積
が、内と外とで互いに等しいときに、円板の自重による
上下方向の変位が最小になると仮定し、円板中心から支
持部までの距離を幾何学的に求めると、D=D0 /√2
=0.707D0 となる。例えば直径30cmの円板で
は、支持位置径が約21.21cmとなるような位置に
支持部を設けることにより、自重変位をかなり小さくす
ることができる。Here, the diameter of the disc is D 0 , the diameter of a circle passing through each support portion (sometimes referred to as a support position diameter in this specification) is D, and the number of support portions is in the circumferential direction of the disc. Assume that there is an infinite number (ie, circumferential support). Also, assuming that the weight in the outside and the outside of the circle, that is, the area inside and outside of the circle are equal to each other between the inside and outside of the circle passing through each supporting portion, the vertical displacement due to the weight of the disc is minimized, When the distance from the center of the plate to the support is geometrically determined, D = D 0 / √2
= The 0.707D 0. For example, in the case of a disk having a diameter of 30 cm, by disposing the supporting portion at a position where the supporting position diameter becomes about 21.21 cm, the displacement of its own weight can be considerably reduced.
【0005】[0005]
【発明が解決しようとする課題】しかしながら本発明者
の研究によると、前述の幾何学的に求めた支持部の位置
は、当たらずとも遠からずといった程度で、必ずしも最
適なものとはいえず、後述するように、より最適な支持
位置が存在することが見出だされた。従って本発明の目
的は、3箇所以上の支持部によって円板を水平に支持す
る場合に、円板全体の上下方向変位をさらに少くするこ
とができるような円板支持装置を提供することにある。However, according to the study of the present inventor, the position of the above-mentioned support part geometrically determined is such that it does not hit but does not come far away, and is not necessarily the most suitable. As described below, it has been found that a more optimal support position exists. Therefore, an object of the present invention is to provide a disk supporting device that can further reduce the vertical displacement of the entire disk when the disk is horizontally supported by three or more supporting portions. .
【0006】[0006]
【課題を解決するための手段】本発明者は、3箇所以上
の支持部によって円板を水平に支持する場合に、自重変
位が最も少くなる位置を求めるために、前述の幾何学的
な計算に代ってFEM(有限要素法)による解析を行な
った。解析対象とした円板のポアソン比(ν)は
[0],[0.2],[0.33],[0.42],
[0.4999]の5種類とした。支持形態は、後述す
る等配3点支持、等配4点支持、等配5点支持、そして
円周支持(無限点)とした。SUMMARY OF THE INVENTION The present inventor has set forth the above-mentioned geometric calculation in order to determine the position where the own weight displacement becomes minimum when the disk is horizontally supported by three or more supporting portions. In place of the above, analysis by FEM (finite element method) was performed. The Poisson's ratio (ν) of the disk to be analyzed is [0], [0.2], [0.33], [0.42],
[0.4999]. The support forms were three-point support, four-point support, five-point support, and circumferential support (infinite point), which will be described later.
【0007】図1に、支持形態の一例として、等配4点
支持の場合の円板10と支持部11との位置関係を示
す。図中の符号10aは円板10の外周を示している。
符号rは、各支持部11を通る円を示している。図2は
等配4点支持における円板10のFEMモデルの変形形
態を斜視的に表したものである。FIG. 1 shows a positional relationship between a disk 10 and a support portion 11 in the case of four equally-pointed supports as an example of a support form. Reference numeral 10a in the figure indicates the outer periphery of the disk 10.
The symbol r indicates a circle passing through each support 11. FIG. 2 is a perspective view showing a modified example of the FEM model of the disk 10 in the equidistant four-point support.
【0008】上記円板を薄肉シェル要素で作り、前述の
各支持形態について、支持位置径Dを変化させたときの
円板の自重による円板各部の上下方向の変位量を求め
た。変位量は、円板をXY平面に配置し、Z方向正を
上、負を下、支持点位置をZ=0としたとき、円板のZ
方向(上下方向)の変位量を計算し、グラフに表した。
グラフプロット点は、以下に定義する“外周A”,“腹
Amax ”,“中心”,“腹Bmax ”,“外周B”,“全
変形(全体変形)”である。The above disk was made of a thin shell element, and for each of the above-mentioned support modes, the amount of vertical displacement of each part of the disk due to the weight of the disk when the support position diameter D was changed was determined. When the disc is arranged on the XY plane and the Z direction positive is up, the negative is down and the support point position is Z = 0, the displacement amount is Z
The amount of displacement in the direction (vertical direction) was calculated and represented in a graph.
The graph plot points are "periphery A", "belly Amax", "center", "belly Bmax", "peripheral B", and "full deformation (whole deformation)" defined below.
【0009】外周A:「互いに隣り合う支持点の中点と
円板中心を結んだ線」と円板外周との交点。 腹Amax :外周Aと中心の間の点で、外周Aと中心より
もZ方向変位が大きい場合、その最大変位点。 中心:円板の中心点であり、各支持点が占める領域の中
心でもある。 外周B:「支持点と円板中心を結んだ線」と円板外周と
の交点。 腹Bmax :外周Bと中心の間の点で、外周Bと中心より
もZ方向変位が大きい場合、その最大変位点。 全体変形:自重変形後のZ方向最大値と最小値の差。Outer circumference A: The intersection of the "line connecting the center of the support points adjacent to each other and the center of the disk" and the outer circumference of the disk. Antinode Amax: a point between the outer periphery A and the center, when the displacement in the Z direction is larger than the outer periphery A and the center, the maximum displacement point. Center: The center point of the disk and also the center of the area occupied by each support point. Outer circumference B: Intersection of the "line connecting the support point and the center of the disk" with the outer circumference of the disk. Antinode Bmax: a point between the outer periphery B and the center, when the displacement in the Z direction is larger than the outer periphery B and the center, the maximum displacement point. Overall deformation: the difference between the maximum and minimum values in the Z direction after the own weight deformation.
【0010】上記解析方法に基いて得られた結果を図3
から図20に示す。各図のグラフから読み取った最小変
位位置と最大変位位置と支持形態の関係をまとめたもの
が、下記の表1,2,3である。表4は、各ポアソン比
と支持形態ごとに、全変形が最小となるD/D0 値を示
している。図3〜図20の各グラフは横軸・縦軸とも無
次元表示であり、 横軸は(無次元支持位置径)=(支持位置径D)/(円
板外径D0 ) 縦軸は(Z方向無次元位置)=(変位量Z)/(中心1
点を支持したときの変位量Z0 )を示している。FIG. 3 shows the results obtained based on the above analysis method.
20 to FIG. The following Tables 1, 2, and 3 summarize the relationship between the minimum displacement position, the maximum displacement position, and the support mode read from the graphs in the drawings. Table 4 shows the D / D 0 value that minimizes the total deformation for each Poisson's ratio and support type. Each of the graphs in FIGS. 3 to 20 is a dimensionless display on both the horizontal axis and the vertical axis, and the horizontal axis is (dimensionless support position diameter) = (support position diameter D) / (disc outer diameter D 0 ). (Z-dimensional dimensionless position) = (Displacement Z) / (Center 1)
The displacement amount Z 0 ) when the point is supported is shown.
【0011】円板の自重変位は、円板の外径、板厚、ヤ
ング率、ポアソン比、密度によって変化する。しかし、
支持位置径と上下方向変位量(Z方向位置)を無次元化
すると、円板の外径、板厚、ヤング率、密度が変わって
も支持位置と変位の関係は変化しなくなる。The displacement of the disc's own weight changes depending on the outer diameter, the thickness, the Young's modulus, the Poisson's ratio, and the density of the disc. But,
When the support position diameter and the vertical displacement (Z direction position) are made dimensionless, the relationship between the support position and the displacement does not change even if the outer diameter, the plate thickness, the Young's modulus, and the density of the disk change.
【0012】[0012]
【表1】 [Table 1]
【0013】[0013]
【表2】 [Table 2]
【0014】[0014]
【表3】 [Table 3]
【0015】[0015]
【表4】 [Table 4]
【0016】図3〜図20と表1〜表3から分かるよう
に、支持部の数と支持位置径によって円板の変形形状が
様々に変化し、しかも各支持形態において、それぞれ全
体変形が最小となる最適位置が存在する。すなわち、D
/D0 が0.6以上、0.7未満となる位置に支持部を
設けた場合に、各々の支持形態において上下方向変位量
が最小値をとることができた。また、支持部の数だけ上
に凸の形状が現れるような支持形態、例えば図6〜図9
に示したFEMモデルの変形形態のときに、円板全体の
変形量が小さくなることも分かった。As can be seen from FIGS. 3 to 20 and Tables 1 to 3, the deformed shape of the disk changes variously depending on the number of support portions and the diameter of the support position. There is an optimal position where That is, D
When the support portion was provided at a position where / D 0 was 0.6 or more and less than 0.7, the amount of vertical displacement could take the minimum value in each support mode. In addition, a supporting form in which a convex shape appears upward by the number of the supporting portions, for example, FIGS.
In the case of the deformation mode of the FEM model shown in FIG.
【0017】とりわけ、支持部が3箇所もしくは4箇所
の等配支持において、外周B点が支持部と同等の高さと
なるような支持位置、すなわち図3,図4,図6,図
7,図10,図11において“外周B”を表す曲線が上
下方向変位=ゼロとなる支持位置、に支持部を設けた場
合に全体変形が最小になることが分かった。In particular, in the case of equidistant support of three or four support portions, a support position where the outer peripheral point B is at the same height as the support portion, that is, FIGS. 3, 4, 6, 7, and 10, it was found that the overall deformation was minimized when the support portion was provided at the support position where the curve representing the "outer circumference B" in the vertical direction = zero in FIG.
【0018】等配3点支持は、円板に対する支持部の接
触状態、すなわち円板のすわりが良い点では好ましいと
いえるが、3点支持は前述の外周Aと外周Bとの変位の
差が極端に大きく、全体変形も大きくなる。このため、
変形量をより少くするためには等配4点支持が推奨され
る。なお、等配3点支持の場合の変位量と等配4点支持
の場合の変位量との間には大きな差があるが、等配4点
支持と無限点支持(円周支持)との差は小さいので、実
用的には4点支持で十分である。It can be said that equidistant three-point support is preferable in terms of the contact state of the support portion with the disk, that is, that the disk has a good seat. However, three-point support has a difference in the displacement between the outer circumference A and the outer circumference B described above. Extremely large, the overall deformation is also large. For this reason,
In order to reduce the amount of deformation, it is recommended to use evenly distributed four-point supports. Note that there is a large difference between the displacement amount in the case of equidistant three-point support and the displacement amount in the case of equidistant four-point support. Since the difference is small, four-point support is sufficient for practical use.
【0019】支持部の数が5以上で円周支持を含むとき
に、図5,図8,図9,図12,図17〜図20に示さ
れるように、円板の中心の高さが外周A点と同等の高さ
になる位置に前記支持部を設けた場合に、全変形がほぼ
最小値をとる。When the number of the supporting portions is 5 or more and the circumferential support is included, as shown in FIGS. 5, 8, 9, 12, and 17 to 20, the height of the center of the disk is When the support portion is provided at a position having a height equivalent to the outer periphery point A, the total deformation takes a substantially minimum value.
【0020】支持部の数が3または4のとき、図3,図
4,図6,図7,図10,図11,図13〜図16に示
されるように、円板の中心の高さが外周A点と同等かそ
れ以上で、かつ中心の高さが支持部と同等かそれ以下と
なる位置に支持部を設けることによって、全変形を小さ
くすることができる。When the number of support portions is 3 or 4, as shown in FIGS. 3, 4, 6, 7, 10, 11, and 13 to 16, the height of the center of the disk is By providing the support portion at a position where is equal to or higher than the outer periphery point A and the height of the center is equal to or lower than the support portion, the total deformation can be reduced.
【0021】また支持部の数が5以上で円周支持を含む
とき、図5,図8,図9,図12,図17〜図20に示
されるように、支持部の高さが円板の中心と同等かそれ
以上であり、かつ、支持部の高さが外周B点と同等かそ
れ以上となる位置に支持部を設けることによって、全変
形を小さくすることができる。When the number of the support portions is 5 or more and includes the circumferential support, as shown in FIG. 5, FIG. 8, FIG. 9, FIG. 12, FIG. The total deformation can be reduced by providing the support portion at a position that is equal to or higher than the center of the above and the height of the support portion is equal to or higher than the outer peripheral point B.
【0022】また、ポアソン比に関しては、ポアソン比
が0から0.4999の範囲で変化したとしても、図3
〜図20あるいは表4に示されるように、円板の自重変
位の大きさは支持位置との関係では変化が小さく、いず
れの支持位置も、D/D0 が0.6以上、0.7未満の
支持位置において全体変形が最小値をとることができる
ため、ポアソン比による実質的な影響を無視することが
できる。Regarding the Poisson's ratio, even if the Poisson's ratio changes in the range of 0 to 0.4999, FIG.
As shown in FIG. 20 or Table 4, the magnitude of the weight displacement of the disc is small in relation to the support position, and D / D 0 is 0.6 or more and 0.7 or less at any of the support positions. Since the overall deformation can take the minimum value at the support position smaller than the above, the substantial influence by the Poisson's ratio can be neglected.
【0023】従って前記目的を果たすための本発明の円
板支持装置は、支持すべき円板の周方向に等分した位置
に3箇所以上の支持部を有し、これら支持部が占める領
域の中心と前記円板の中心とを対応させかつ前記円板を
水平な姿勢で前記支持部上に乗せる円板支持装置であっ
て、前記円板の直径をD0 、各支持部を通る円の直径を
Dとしたとき、D/D0 が0.6以上、0.7未満とな
る位置に前記支持部を設けたことを特徴とする。Therefore, the disk supporting apparatus of the present invention for achieving the above object has three or more supporting portions at equally-spaced positions in the circumferential direction of the disk to be supported. A disk supporting device that makes a center correspond to the center of the disk and places the disk on the support in a horizontal posture, wherein the diameter of the disk is D 0 , and the diameter of a circle passing through each support is when the diameter was D, D / D 0 is 0.6 or more, characterized by providing the supporting portion in a position less than 0.7.
【0024】本発明において、ポアソン比に関しては、
本発明者が解析を行なった0から、0.4999のポア
ソン比であれば、少くとも本発明の目的に沿うことが確
認されている。本発明は、前記円板がSi半導体ウェハ
であり、前記支持部を円板の周方向3箇所または4箇所
に設けることを含んでいる。支持部の数が3または4の
ときに、支持部の数だけ上に凸の形状が現れる支持形態
とすることにより、上下方向変位を小さくすることが可
能である。さらには、支持部の延長線上の円板外周(外
周B点)が支持部と同等の高さとなる位置に前記支持部
を設けることにより、上下方向変位を最小とすることが
できる。In the present invention, regarding the Poisson's ratio,
It has been confirmed that a Poisson's ratio of 0 to 0.4999, which was analyzed by the present inventor, at least meets the purpose of the present invention. The present invention includes providing the disk as a Si semiconductor wafer and providing the support portions at three or four positions in the circumferential direction of the disk. When the number of the support portions is three or four, by adopting a support form in which a convex shape appears upward by the number of the support portions, it is possible to reduce the vertical displacement. Further, by providing the support at a position where the outer periphery of the disk (point B of the outer periphery) on the extension of the support is at the same height as the support, vertical displacement can be minimized.
【0025】また支持部の数が5以上で円周支持を含む
ときに、円板の中心の高さが外周A点と同等の高さにな
る位置に前記支持部を設けることにより、全変形がほぼ
最小となる。支持部の数が3または4のときには、円板
の中心の高さが外周A点と同等かそれ以上で、かつ中心
の高さが支持部と同等かそれ以下となる位置に支持部を
設けることによって、全変形を小さくすることができ
る。Further, when the number of support portions is 5 or more and circumferential support is included, by providing the support portions at a position where the height of the center of the disk is equivalent to the height of the outer periphery point A, the entire deformation is achieved. Is almost minimized. When the number of the support portions is 3 or 4, the support portion is provided at a position where the height of the center of the disk is equal to or more than the outer peripheral point A and the height of the center is equal to or less than the support portion. Thereby, the total deformation can be reduced.
【0026】支持部の数が5以上で円周支持を含むとき
は、支持部の高さが円板の中心と同等かそれ以上で、か
つ、支持部の高さが外周B点と同等かそれ以上となる位
置に支持部を設けることによって、全変形を小さくする
ことができる。When the number of support portions is 5 or more and includes circumferential support, the height of the support portions is equal to or higher than the center of the disk, and the height of the support portions is equal to the outer peripheral point B. By providing the support portion at a position higher than that, the total deformation can be reduced.
【0027】[0027]
【発明の実施の形態】以下に本発明の一実施形態につい
て説明する。図21に示した円板支持装置20は、円板
(支持対象物)10の一例としてのSi半導体ウェハを
支持するものであり、円板10を乗せるボディ21と、
ボディ21の上面に形成された上に凸の4箇所の支持部
11を備え、支持部11の上に円板10を水平な姿勢で
乗せるようにしている。円板10は、全体にわたって密
度が均一であり、そのポアソン比(Poisson's ratio)
(νで表す)は、Si半導体ウェハのポアソン比に近い
値の0.42である。この円板10の直径D0は、一例
としてφ300mm、板厚=0.775mm、ヤング率
E=10890(kgf/mm2 )、密度ρ=2.3
8×10-10 (kgf・sec2 /mm4 )である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below.
Will be explained. The disk supporting device 20 shown in FIG.
(Supporting object) Si semiconductor wafer as an example of 10
A body 21 on which the disc 10 is mounted,
Four upwardly projecting support portions formed on the upper surface of the body 21
11 and the disk 10 is placed on the support 11 in a horizontal posture.
I try to put it on. The disk 10 is dense throughout.
Poisson's ratio is uniform
(Represented by ν) is close to the Poisson's ratio of a Si semiconductor wafer
The value is 0.42. The diameter D of this disk 100Is an example
Φ300mm, thickness = 0.775mm, Young's modulus
E = 10890 (kgf / mm2), Density ρ = 2.3
8 × 10-Ten(Kgf · secTwo/ MmFour ).
【0028】4箇所の支持部11は円板10の周方向、
すなわち支持部11を通る円rの周方向に4等分された
位置にあり、しかも支持部11を通る円rの直径すなわ
ち支持位置径Dは、前述した解析結果により、D/D0
が0.6以上、0.7未満となるように支持部11の位
置が設定されている。The four supporting portions 11 are arranged in the circumferential direction of the disk 10,
That is, the diameter of the circle r passing through the support portion 11 at the position divided by four in the circumferential direction of the circle r passing through the support portion 11, that is, the support position diameter D is D / D 0 according to the analysis result described above.
Is set to 0.6 or more and less than 0.7.
【0029】具体的には、円板10のポアソン比が0.
42で、等配4点支持の場合、前述した解析結果による
と、図11や表3から分かるように、支持部11の最適
位置は、D/D0 =0.677、すなわちD=203.
1mmであり、その場合の変位量Zは0.011mmで
あった。これに対し、現行品はD=246mm、ウェハ
全体の変位量Zは0.067mmである。すなわち本発
明の実施形態によって変位量が現行品の約6分の1程度
に減少した。なお、最適位置を幾何学的に求めた場合に
は、D=D0 /√2=0.707D0 =212.1mm
となり、前記実施形態よりも支持位置径が大となり、変
位量が大きくなってしまう。More specifically, the Poisson's ratio of the disk 10 is set to 0.
In the case of equidistant four-point support at 42, according to the above-described analysis results, as can be seen from FIG. 11 and Table 3, the optimal position of the support part 11 is D / D 0 = 0.677, that is, D = 203.
1 mm, and the displacement Z in that case was 0.011 mm. On the other hand, the current product has D = 246 mm, and the displacement Z of the entire wafer is 0.067 mm. That is, according to the embodiment of the present invention, the displacement amount is reduced to about one sixth of the current product. When the optimum position is geometrically obtained, D = D 0 /√2=0.707 D 0 = 212.1 mm
Therefore, the diameter of the support position becomes larger than that of the above embodiment, and the displacement amount becomes larger.
【0030】図3〜図20は、各支持部11が円板の周
方向に寸分たがわず等配分されていることを前提として
解析したが、実際の円板支持装置では、製造上の誤差
や、円板に対して支持部がある程度面接触になるなどの
事情もあって、厳密な意味での等配支持は有り得ず、多
少なりとも支持位置が理論上の等配支持点から広がりを
もつことになる。そこで支持点が周方向にずれた場合の
上下方向変位の変化を調べるために、図22に示すよう
に支持部の位置を等配支持点から周方向にずらしてゆ
き、支持点角度θとZ方向の変位量との関係を解析し
た。その結果を図23と図24に示す。いずれも4点等
配支持(θ=45°)である。FIGS. 3 to 20 have been analyzed on the assumption that the support portions 11 are equally distributed in the circumferential direction of the disk without any dimension. , Due to the fact that the support part comes into surface contact with the disk to some extent, it is not possible to have strictly equal support, and the support position is somewhat wider than the theoretical equal support point Will be. Therefore, in order to examine the change in vertical displacement when the support point is shifted in the circumferential direction, the position of the support portion is shifted in the circumferential direction from the equidistant support point as shown in FIG. The relationship with the direction displacement was analyzed. The results are shown in FIGS. 23 and 24. In each case, four points are equidistantly supported (θ = 45 °).
【0031】図23と図24において、 外周0°:4等配支持点を円板中心から見てθ=45°
としたとき、0°方向の外周の点。 腹0max :外周0°と中心を結んだ線上の点で、外周0
°と中心よりもZ方向変位が大きい場合、その最大変位
点。 中心:円板の中心点。 外周45°:4等配支持点を円板中心から見て45°と
したとき、45°方向の外周の点。 腹45max :外周45°と中心を結んだ線上の点で、外
周45°と中心よりもZ方向変位が大きい場合、その最
大変位点。 外周90°:4等配支持点を円板中心から見て45°と
したとき、90°方向の外周の点。 腹90max :外周90°と中心を結んだ線上の点で、外
周90°と中心よりもZ方向変位が大きい場合、その最
大変位点。 全体変形:自重変形後のZ方向最大値と最小値の差。In FIG. 23 and FIG. 24, the outer circumference 0 °: 4 equally distributed support points θ = 45 ° when viewed from the center of the disk.
And a point on the outer circumference in the 0 ° direction. Belly 0max: A point on the line connecting the outer circumference 0 ° and the center.
If the displacement in the Z direction is larger than ° and the center, the maximum displacement point. Center: The center point of the disk. Outer circumference 45 °: A point on the outer circumference in the 45 ° direction when the four equally spaced support points are 45 ° when viewed from the center of the disk. Antinode 45max: A point on the line connecting the outer circumference 45 ° and the center, and when the Z direction displacement is larger than the outer circumference 45 ° and the center, the maximum displacement point. Outer circumference 90 °: A point on the outer circumference in the 90 ° direction when the four equally-supported support points are 45 ° when viewed from the center of the disk. Antinode 90max: A point on the line connecting the outer periphery 90 ° and the center, and when the Z direction displacement is larger than the outer periphery 90 ° and the center, the maximum displacement point. Overall deformation: the difference between the maximum and minimum values in the Z direction after the own weight deformation.
【0032】図23に示されるように、D/D0 が0.
9の場合、θ=45°を中心として両側5°の範囲内で
あれば、θが変化してもほぼ同等の上下方向変位とな
り、この範囲を逸脱すると変位が急増する(角度θの変
化に対する感度が急増する)。また図24に示されるよ
うにD/D0 が0.68の場合には、θ=45°を中心
として両側2.5°(θ=42.5°と47.5°)の
範囲を越えると、上下方向変位が急増し、その傾向はD
/D0 が0.6〜0.7の範囲において認められた。こ
れらのことを考慮すると、本発明で言う等配支持とは、
厳密な意味での理論上の等配支持点を中心として、周方
向に±2.5°の範囲を含むものとする。As shown in FIG. 23, D / D 0 is 0.
In the case of No. 9, if the angle is within a range of 5 ° on both sides centered on θ = 45 °, the displacement in the vertical direction is substantially the same even if θ is changed. Sensitivity increases rapidly). Further, as shown in FIG. 24, when D / D 0 is 0.68, both sides of θ = 45 ° are out of the range of 2.5 ° (θ = 42.5 ° and 47.5 °). And the vertical displacement suddenly increases, and the tendency is D
/ D 0 was observed in the range of 0.6 to 0.7. In consideration of these, the equal distribution support referred to in the present invention,
A range of ± 2.5 ° in the circumferential direction is set around a theoretically equidistant support point in a strict sense.
【0033】なお、この発明を実施するに当たって、円
板の寸法や材質、あるいは支持部の形態など、この発明
を構成する各要素を適宜に変形して実施できることは言
うまでもない。例えば円板は半導体ウェハ以外の密度一
定の円板でもよいし、半導体ウェハの一部を加工したも
のであってもよい。In carrying out the present invention, it goes without saying that the components constituting the present invention, such as the size and material of the disk and the form of the support portion, can be appropriately modified and carried out. For example, the disk may be a fixed density disk other than a semiconductor wafer, or may be a partially processed semiconductor wafer.
【0034】[0034]
【発明の効果】本発明によれば、円板を支持する支持部
の位置を最適化させることができることにより、円板の
上下方向変位を最小限におさえることができる。According to the present invention, since the position of the supporting portion for supporting the disk can be optimized, the vertical displacement of the disk can be minimized.
【図1】 等配4点支持の場合の円板と支持部を示す平
面図。FIG. 1 is a plan view showing a disk and a support part in the case of equally-distributed four-point support.
【図2】 有限要素法における円板のFEMモデルを示
す斜視図。FIG. 2 is a perspective view showing an FEM model of a disk in the finite element method.
【図3】 ポアソン比が0.2で等配3点支持の場合の
支持位置径と上下方向変位との関係を示すグラフ。FIG. 3 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0.2 and equidistant three-point support is used.
【図4】 ポアソン比が0.2で等配4点支持の場合の
支持位置径と上下方向変位との関係を示すグラフ。FIG. 4 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0.2 and the equidistant four-point support is used.
【図5】 ポアソン比が0.2で円周支持の場合の支持
位置径と上下方向変位との関係を示すグラフ。FIG. 5 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0.2 and the case is circumferentially supported.
【図6】 ポアソン比が0.33で等配3点支持の場合
の支持位置径と上下方向変位との関係を示すグラフ。FIG. 6 is a graph showing a relationship between a support position diameter and a vertical displacement in the case of a Poisson's ratio of 0.33 and equidistant three-point support.
【図7】 ポアソン比が0.33で等配4点支持の場合
の支持位置径と上下方向変位との関係を示すグラフ。FIG. 7 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0.33 and the equidistant four-point support is used.
【図8】 ポアソン比が0.33で等配5点支持の場合
の支持位置径と上下方向変位との関係を示すグラフ。FIG. 8 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0.33 and the equidistant 5-point support is used.
【図9】 ポアソン比が0.33で円周支持の場合の支
持位置径と上下方向変位との関係を示すグラフ。FIG. 9 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0.33 and the case is circumferentially supported.
【図10】 ポアソン比が0.42で等配3点支持の場
合の支持位置径と上下方向変位との関係を示すグラフ。FIG. 10 is a graph showing the relationship between the support position diameter and the vertical displacement in the case of a Poisson's ratio of 0.42 and equidistant three-point support.
【図11】 ポアソン比が0.42で等配4点支持の場
合の支持位置径と上下方向変位との関係を示すグラフ。FIG. 11 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0.42 and the equidistant four-point support is used.
【図12】 ポアソン比が0.42で円周支持の場合の
支持位置径と上下方向変位との関係を示すグラフ。FIG. 12 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0.42 and the case is circumferentially supported.
【図13】 ポアソン比が0で等配3点支持の場合の支
持位置径と上下方向変位との関係を示すグラフ。FIG. 13 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0 and equidistant three-point support is used.
【図14】 ポアソン比が0.4999で等配3点支持
の場合の支持位置径と上下方向変位との関係を示すグラ
フ。FIG. 14 is a graph showing the relationship between the support position diameter and the vertical displacement in the case of a Poisson's ratio of 0.4999 and equidistant three-point support.
【図15】 ポアソン比が0で等配4点支持の場合の支
持位置径と上下方向変位との関係を示すグラフ。FIG. 15 is a graph showing the relationship between the support position diameter and the vertical displacement in the case of a Poisson's ratio of 0 and equidistant four-point support.
【図16】 ポアソン比が0.4999で等配4点支持
の場合の支持位置径と上下方向変位との関係を示すグラ
フ。FIG. 16 is a graph showing the relationship between the support position diameter and the vertical displacement in the case of a Poisson's ratio of 0.4999 and equidistant four-point support.
【図17】 ポアソン比が0で等配5点支持の場合の支
持位置径と上下方向変位との関係を示すグラフ。FIG. 17 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0 and the equidistant 5-point support is used.
【図18】 ポアソン比が0.4999で等配5点支持
の場合の支持位置径と上下方向変位との関係を示すグラ
フ。FIG. 18 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0.4999 and the equidistant 5-point support is used.
【図19】 ポアソン比が0で円周支持の場合の支持位
置径と上下方向変位との関係を示すグラフ。FIG. 19 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0 and the case is circumferentially supported.
【図20】 ポアソン比が0.4999で円周支持の場
合の支持位置径と上下方向変位との関係を示すグラフ。FIG. 20 is a graph showing the relationship between the support position diameter and the vertical displacement when the Poisson's ratio is 0.4999 and the case is circumferentially supported.
【図21】 本発明の一実施形態を示す円板支持装置の
平面図。FIG. 21 is a plan view of a disk supporting device according to an embodiment of the present invention.
【図22】 支持点を円板の周方向にずらした場合の支
持点角度θと支持位置径を示す平面図。FIG. 22 is a plan view showing the support point angle θ and the support position diameter when the support points are shifted in the circumferential direction of the disk.
【図23】 支持位置径が0.90の支持点を円板の周
方向に変化させた場合の上下方向変位の変化を示すグラ
フ。FIG. 23 is a graph showing a change in vertical displacement when a support point having a support position diameter of 0.90 is changed in the circumferential direction of the disk.
【図24】 支持位置径が0.68の支持点を円板の周
方向に変化させた場合の上下方向変位の変化を示すグラ
フ。FIG. 24 is a graph showing a change in vertical displacement when a support point having a support position diameter of 0.68 is changed in the circumferential direction of the disk.
10…円板 10a…円板の外周 11…支持部 10: disk 10a: outer periphery of disk 11: support
Claims (7)
3箇所以上の支持部を有し、これら支持部が占める領域
の中心と前記円板の中心とを対応させかつ前記円板を水
平な姿勢で前記支持部上に乗せる円板支持装置であっ
て、 前記円板の直径をD0 、各支持部を通る円の直径をDと
したとき、D/D0 が0.6以上、0.7未満となる位
置に前記支持部を設けたことを特徴とする円板支持装
置。1. A disk to be supported having three or more support portions at equally spaced positions in the circumferential direction, wherein the center of an area occupied by these support portions and the center of the disk correspond to each other, and a disc supporting device to put the plate in a horizontal posture on the supporting portion, the diameter of the disc D 0, when the diameter of the circle passing through the support portions and the D, D / D 0 is 0. A disk supporting device, wherein the supporting portion is provided at a position of 6 or more and less than 0.7.
支持部を前記円板の周方向3箇所または4箇所に設けた
ことを特徴とする請求項1記載の円板支持装置。2. A disk supporting apparatus according to claim 1, wherein said disk is a Si semiconductor wafer, and said supporting portions are provided at three or four positions in a circumferential direction of said disk.
3箇所以上の支持部を有し、これら支持部が占める領域
の中心と前記円板の中心とを対応させかつ前記円板を水
平な姿勢で前記支持部上に乗せる円板支持装置であっ
て、 前記支持部の数が3または4箇所のとき、支持点の延長
線上の円板外周(外周B点)が前記支持部と同等の高さ
となる位置に前記支持部を設けたことを特徴とする円板
支持装置。3. A disk to be supported having three or more support portions at equal positions in the circumferential direction of the disk, wherein the center of the area occupied by these support portions and the center of the disk correspond to each other, and A disk supporting device for placing a plate on the supporting portion in a horizontal posture, wherein when the number of the supporting portions is three or four, the outer circumference of the disk (point B of the outer circumference) on the extension of the supporting point is the support. A disk support device, wherein the support portion is provided at a position having a height equivalent to that of the support portion.
3箇所以上の支持部を有し、これら支持部が占める領域
の中心と前記円板の中心とを対応させかつ前記円板を水
平な姿勢で前記支持部上に乗せる円板支持装置であっ
て、 前記支持部の数だけ上に凸の形状が現れる支持形態であ
ることを特徴とする円板支持装置。4. A disk to be supported having three or more supporting portions at equal positions in the circumferential direction of the disk, wherein the center of the area occupied by these supporting portions and the center of the disk correspond to each other, and A disk support device for placing a plate on the support portion in a horizontal posture, wherein the disk support device has a support form in which a convex shape appears upward by the number of the support portions.
とき、前記円板の中心の高さが前記支持部間の中点の延
長線上の円板外周(外周A点)と同等の高さになる位置
に前記支持部を設けたことを特徴とする請求項4記載の
円板支持装置。5. When the number of said support portions is 5 or more and includes circumferential support, the height of the center of said disk is equal to the outer circumference of the disk (outer circumference point A) on the extension of the midpoint between said support portions. 5. The disk supporting device according to claim 4, wherein the supporting portion is provided at a position where the height is the same.
円板の中心の高さが前記支持部間の中点の延長線上の円
板外周(外周A点)と同等かそれ以上で、かつ、前記中
心の高さが前記支持部と同等かそれ以下となる位置に前
記支持部を設けたことを特徴とする請求項4記載の円板
支持装置。6. When the number of the support portions is three or four, the height of the center of the disk is equal to or greater than the outer periphery of the disk on the extension of the midpoint between the support portions (outer periphery A point). The disk support device according to claim 4, wherein the support portion is provided at a position where the height of the center is equal to or less than the height of the support portion.
とき、前記支持部の高さが前記円板の中心と同等かそれ
以上であり、かつ、前記支持部の高さが支持部の延長線
上の円板外周(外周B点)と同等かそれ以上となる位置
に前記支持部を設けたことを特徴とする請求項4記載の
円板支持装置。7. When the number of the support portions is 5 or more and includes circumferential support, the height of the support portions is equal to or higher than the center of the disk, and the height of the support portions is 5. The disk support device according to claim 4, wherein the support portion is provided at a position which is equal to or greater than the outer circumference of the disk (point B) on the extension of the support portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37064799A JP2001185601A (en) | 1999-12-27 | 1999-12-27 | Disk support device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37064799A JP2001185601A (en) | 1999-12-27 | 1999-12-27 | Disk support device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001185601A true JP2001185601A (en) | 2001-07-06 |
Family
ID=18497366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP37064799A Pending JP2001185601A (en) | 1999-12-27 | 1999-12-27 | Disk support device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001185601A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007010022A (en) * | 2005-06-30 | 2007-01-18 | Ckd Corp | Levitation simulator and non-contact support device manufacturing method |
| JP2007281030A (en) * | 2006-04-03 | 2007-10-25 | Sumco Corp | Method of holding silicon wafer |
| JPWO2013069088A1 (en) * | 2011-11-08 | 2015-04-02 | ミライアル株式会社 | Wafer storage container |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140508A (en) * | 1997-07-23 | 1999-02-12 | Sumitomo Metal Ind Ltd | Wafer support and vertical boat |
| JPH1167873A (en) * | 1997-08-26 | 1999-03-09 | Hitachi Ltd | Semiconductor wafer processing method and apparatus |
| JPH11165865A (en) * | 1997-11-28 | 1999-06-22 | Dainippon Screen Mfg Co Ltd | Substrate positioning device and substrate positioning method |
-
1999
- 1999-12-27 JP JP37064799A patent/JP2001185601A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140508A (en) * | 1997-07-23 | 1999-02-12 | Sumitomo Metal Ind Ltd | Wafer support and vertical boat |
| JPH1167873A (en) * | 1997-08-26 | 1999-03-09 | Hitachi Ltd | Semiconductor wafer processing method and apparatus |
| JPH11165865A (en) * | 1997-11-28 | 1999-06-22 | Dainippon Screen Mfg Co Ltd | Substrate positioning device and substrate positioning method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007010022A (en) * | 2005-06-30 | 2007-01-18 | Ckd Corp | Levitation simulator and non-contact support device manufacturing method |
| JP2007281030A (en) * | 2006-04-03 | 2007-10-25 | Sumco Corp | Method of holding silicon wafer |
| JPWO2013069088A1 (en) * | 2011-11-08 | 2015-04-02 | ミライアル株式会社 | Wafer storage container |
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