JP2001185641A - Modular substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To connect an end face electrode surely to a mother board even when a substrate is warped. SOLUTION: An end face through hole 13 comprising an end face opening groove 14, an end face electrode 15, and a rear surface electrode 17 is made in the end face 11C of a substrate 11 and wiring 16 connected with the end face electrode 15 is provided on the surface 11A of the substrate 11. A solder 18 is contained in the end face opening groove 14 and secured in place. Furthermore, a tape 19 covering the electrode joint 16A of the wiring 16 and the solder 18 is attached to the surface 11A of the substrate 11. The tape 19 prevents the solder 18 from being raised to the surface 11A side of the substrate 11 through surface tension of the thermally melted solder 18. The molted solder 18 touches the electrode pad of a mother board to connect the end face electrode 15 and the electrode pad.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module board for electrically connecting to a motherboard by soldering and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, electronic components such as semiconductor ICs, active components, and passive components mounted on a circuit board have been increasing in density along with miniaturization of electronic devices. For this reason, from the viewpoint of the importance of the intermediate inspection, ease of mounting, and the like, the electronic components are pre-assembled on the module substrate in advance, and the module substrate is attached to the motherboard using a joining means such as soldering (for example, JP-A-63-204693).

As shown in FIGS. 20 to 23, such a module board according to the prior art includes a board 1 composed of a substantially square-shaped insulating resin material and wiring made of a conductor, and a board 1 outside the board 1. A plurality of end face through-holes 2 are provided on the periphery in a concavely curved shape. Each of the end face through holes 2 has a substantially semicircular end face opening groove 2A and an end face opening groove 2A.
And an end surface electrode 2B provided on the inner wall surface of the substrate, and solder 2C is filled in the end surface opening groove 2A. Further, a wiring 3 provided on the front surface side of the substrate 1 is connected to the end surface electrode 2B, and the end surface electrode 2B is connected to an electronic component 4 provided at the center of the front surface side of the substrate 1 through the wiring 3.

Then, the module substrate thus configured is heated while being mounted on the motherboard 5. As a result, the solder 2C in the end face through hole 2 is melted and adheres to the electrode pad 6 on the mother board 5, so that the end face electrode 2B and the electrode pad 6 are soldered. As a result,
As shown in FIGS. 21 and 22, a fillet 7 in which the solder has a smooth curved shape is formed between the end face electrode 2B and the electrode pad 6.

[0005]

In the prior art described above, since the electronic components 4 mounted on the surface of the substrate 1 are electrically connected to the electrode pads 6 on the motherboard 5, the surface of the substrate 1 must be electrically connected. A wiring 3 made of a conductor is provided. Further, as the substrate 1, a multilayer substrate provided with a grounding wiring pattern for connecting the electronic component 4 to the ground may be used.

In this case, the wiring 3 or the like made of a conductor and the substrate 1
Since the coefficient of thermal expansion is different from that of the resin material constituting the substrate 1, a curved warp as shown in the direction of arrow A in FIG. There is. Similarly, the motherboard 5 may also be warped, and the end surface electrode 2B of the substrate 1 and the motherboard 5 may be warped.
In some cases, a gap may be formed between the first electrode pad 6 and the second electrode pad 6.

As a result, the solder 2C of the end face through hole 2
23, the solder 2C has a substantially spherical shape as shown in FIG. 23 and does not come into contact with the electrode pads 6 of the motherboard 5 due to the surface tension thereof, so that the end face electrodes 2B cannot be connected to the electrode pads 6. There's a problem.

Furthermore, in recent years, as electronic devices have become thinner,
There is a tendency for the substrate 1 and the motherboard 5 to be thin. For this reason, the warpage of the substrate 1 and the motherboard 5 increases, and a connection failure between the end face electrode 2B and the electrode pad 6 easily occurs.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide a module substrate capable of securely connecting an end face electrode to a motherboard even when a substrate or the like is warped. And a method for manufacturing the same.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a substrate on which an electronic component is mounted on a front side, and an electronic component provided on an end surface forming an outer peripheral edge of the substrate. The present invention is applied to a module substrate composed of connected end face electrodes.

A feature of the structure adopted by the invention of claim 1 is that a solder for connecting to a motherboard provided on the back side of the substrate is provided on the end face electrode, and the front side of the solder is provided on the front side of the board. That is, a cover member for covering the exposed portion is provided.

[0012] With this configuration, when the module substrate is heated while mounted on the motherboard, the solder provided on the end face electrodes is melted. At this time, the molten solder has a substantially spherical shape due to surface tension, and a part thereof tends to protrude above the surface of the substrate. On the other hand, since a cover member is provided on the front side of the board to cover the exposed portion of the front side of the solder, the solder protruding above the front side of the board can be held down, and that amount of solder can be applied to the back side of the board. Can be drooped. For this reason, even when a gap is formed between the substrate and the electrode pad of the motherboard, the end face electrode and the electrode pad can be connected by the molten solder, and a fillet is formed therebetween. Can be.

Further, the lid member according to the second aspect of the present invention is constituted by a tape made of a heat-resistant resin material.

Thus, by applying the tape to the front surface of the substrate, the solder can be pressed from the front surface of the substrate, and the molten solder can be promoted to hang down to the rear surface.

Further, the invention according to claim 3 is that the substrate is composed of a laminated substrate in which a plurality of layers made of a resin material are stacked, and the cover member is constituted by a surface-side layer of each layer of the laminated substrate. .

Thus, the solder can be pressed down from the front side of the board by the layer on the front side of the multilayer board without attaching another member to the board.

Further, the lid member according to the invention of claim 4 is constituted by a jig attached to the outer peripheral side of the substrate.

Thus, the solder can be pressed from the front side of the board by the jig attached to the outer peripheral side of the board, and the solder can be encouraged to hang down to the back side.

Further, the lid member according to the invention of claim 5 is constituted by a plate made of a thermosetting resin material.

Accordingly, the plate provided on the front surface side of the substrate can press the solder from the front surface side of the substrate, and can encourage the solder to hang down to the rear surface side.

The invention according to claim 6 is characterized in that the solder is configured to protrude below the back surface of the substrate.

Accordingly, even when the board is warped and a gap is formed between the end face electrode of the board and the electrode pad of the motherboard, the tip of the solder protruding to the back side of the board may be used as the electrode pad of the motherboard. Contact For this reason,
By melting the solder in this state, the end face electrode and the electrode pad can be connected, and a fillet can be formed therebetween.

Further, the invention according to claim 7 is characterized in that the solder is configured to protrude forward from the end face of the substrate.

Thus, when the solder is melted by heating, the portion of the melted solder that is in contact with the end face electrode is supported in a state of being attached to the substrate by the end face electrode, but protrudes forward from the end face of the board. The part that did
Since there is nothing to support, it hangs down on the back side of the substrate. Therefore, even when a gap is formed between the substrate and the motherboard, the end surface electrode and the electrode pad can be connected by the suspended solder.

The invention according to claim 8 is that the substrate is provided with an end face opening groove opened on the end face, and the end face electrode is provided on a part of the inner wall surface of the end face opening groove.

Thus, when the solder is melted by heating, the melted solder is supported in a state of being attached to the substrate by the end face electrodes provided on a part of the inner wall surface of the end face opening groove. On the other hand, a portion of the solder accommodated in the end surface opening groove that does not contact the end surface electrode has nothing to support, and therefore, hangs down to the back surface side of the substrate. For this reason, the end face electrode and the electrode pad can be connected by the dripped solder, and the gap formed between the substrate and the electrode pad of the motherboard can be compensated.

According to a ninth aspect of the present invention, the end face electrode comprises a flat electrode provided on an end face of the substrate, and the solder is attached to the flat electrode in a state of protruding forward from the end face of the substrate. It is in.

Thus, it is possible to dispose a flat electrode on the end face of the substrate without making holes or the like in the substrate. Then, since the solder is attached to the plane electrode in a state protruding toward the end face side of the substrate, the solder melted by heating hangs down on the back side of the substrate along the plane electrode to connect between the end face electrode and the electrode pad. be able to.

According to a tenth aspect of the present invention, on the front surface side of the substrate, an electrode connecting portion located near the end surface of the substrate and connected to the end face electrode and extending from the electrode connecting portion toward the electronic component. A line composed of a line portion is provided, and an electrode connection portion of the line is covered with a lid member.

Thus, the electrode connection portion of the wiring is covered by the cover member, so that the electrode connection portion does not come into contact with the solder. For this reason, when the solder is melted, the solder at the portion in contact with the end face electrode is attracted to the end face electrode and the joined state is maintained, but the solder at the other portion has no support, so that it is easily formed. It can be hung on the back side of the substrate.

[0031]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a module board according to an embodiment of the present invention will be described in detail with reference to FIGS.

First, FIGS. 1 to 10 show the first embodiment of the present invention.
In the figure, reference numeral 11 denotes a substrate made of a laminated body formed by alternately laminating wiring patterns (not shown) made of, for example, an insulating resin material and a conductor. A plurality of end surface through holes 13 to be described later are formed. The substrate 11 has a vertical and horizontal length of, for example, 3
It is formed in a substantially square shape of about 0 mm. On the center side of the surface 11A of the substrate 11, a semiconductor IC, an active component,
Alternatively, an electronic component 12 such as a passive component is mounted.

Are end-face through-holes provided in four end faces 11C forming the outer peripheral edge of the substrate 11, and the end-face through-holes 13 are end face opening grooves 14, end face electrodes 15, The back electrode 17 is provided.

.. Are end face opening grooves provided in the end face 11C of the substrate 11 in a concavely curved shape, and each of the end face opening grooves 14 is located at a center from the end face 11C of the substrate 11 as shown in FIG. A solder receiving portion 14A that extends substantially linearly with a constant width dimension W toward the portion and stores a solder 18 described later, and is provided on the groove bottom side continuously with the solder storing portion 14A and cooperates with the solder storing portion 14A. And a substantially semicircular electrode forming portion 14B that functions to accommodate the solder. Further, the inner diameter Φ1 of the electrode forming portion 14B is set to a value (Φ1 ≦ W) which is equal to or less than the width W of the solder accommodating portion 14A as shown in FIG. Therefore, the solder accommodating portion 14A and the electrode forming portion 14B
A step is formed between the two. The end face opening groove 14 is provided so as to penetrate in the thickness direction of the substrate 11.

Reference numerals 15, 15,... Denote substantially arc-shaped end surface electrodes provided on a part of the inner wall surface of the end surface opening groove 14. The end surface electrode 15 is located on the bottom side (rear side) of the end surface opening groove 14. And is formed so as to cover the electrode forming portion 14B. The end surface electrode 15 is connected to a wiring 16 provided on the front surface 11A of the substrate 11 and a back surface electrode 17 provided on the back surface 11B of the substrate 11.

Are wirings for connecting between the end face electrode 15 and the electronic component 12, and the wiring 16 is connected to the end face 11.
A substantially semicircular electrode connecting portion 16A which is located near the end face opening groove 14 near C and connected to the end face electrode 15, and an electronic component 12 extending from the electrode connecting portion 16A toward the center of the substrate 11 And a line portion 16B connected to the line.

Are back electrodes provided on the back surface 11B side of the substrate 11 around the end face opening groove 14, and the back electrode 17 has a substantially semicircular arc shape as shown in FIG. The end face opening groove 14 is provided around the electrode forming portion 14 </ b> B and is connected to the end face electrode 15. The outer diameter dimension Φ2 of the back electrode 17 is set, for example, to a value (Φ2 ≦ W) equal to or smaller than the width dimension W of the solder accommodating portion 14A.

Are solder having a substantially columnar shape which are accommodated and fixed in the respective end face opening grooves 14, and the solder 18 is
As shown in FIGS. 2 to 5, an electrode facing portion 18A which is located in the end face opening groove 14 and faces the end face electrode 15, and a rear face electrode 1 extending from the electrode facing portion 18A in the thickness direction of the substrate 11 is provided.
A lower protruding portion 18B which covers the lower surface 11 of the substrate 11 and protrudes below the back surface 11B of the substrate 11;
And a substantially arc-shaped front protruding portion 18C provided so as to protrude forward from the end face 11C.

The electrode facing portion 18A is connected to the end face electrode 15
Is in contact over the entire surface. On the other hand, the downward projection 18B
Has a substantially hemispherical shape and protrudes toward the back surface 11B side of the substrate 11, and the protrusion dimension L is, for example, 0.3 to 0.6 mm (L = 0.3 to 0.6 mm) from the back surface 11B of the substrate 11 as shown in FIG.
0.6 mm). And solder 18
The lower protruding portion 18B is the electrode pad 6 of the motherboard 5
Contact with the end surface electrode 15 and the electrode pad 6.
And a fillet 21 described later is formed between them.

Are tapes adhered to the surface 11A of the substrate 11, and the tape 19 is, for example, 250 ° C.
It is formed using a resin material having heat resistance up to the extent, and, for example, four sheets are arranged along four sides of the substrate 11. The tape 19 covers the electrode connection portion 16A of the wiring 16, and a part of the tape 19 becomes an eave portion 19A protruding forward from the end surface 11C of the substrate 11, so that the front projection portion 18A of the solder 18 is formed.
C is covered. As a result, the tape 19 is
The surface exposed portion of the solder 18 located on the surface 11A side is covered over substantially the entire surface.

After fixing the solder 18 to the end surface electrode 15 of the substrate 11, the tape 19 is
Side, and the solder 1 may be attached to the end surface electrode 15 of the substrate 11.
Before fixing 8, a solder 18 may be fixed to the end surface electrode 15 by pasting it to the surface 11 </ b> A side of the substrate 11 in advance.

The module board according to the present embodiment has the above-described configuration. Next, a case where the module board is joined to the motherboard 5 will be described with reference to FIGS.

First, a thin cream solder 20 is applied to the electrode pads 6 of the motherboard 5 in advance. Then, the module substrate is placed on the motherboard 5 in a state where the solder 18 and the electrode pads 6 are aligned as in the conventional technique, and the module substrate and the motherboard 5 are heated. As a result, the cream solder 20 on the electrode pad 6 is melted, and the solder 18 in contact with the melted cream solder 20 is melted by transmitting heat from the cream solder 20.

Here, when the board 11 and the motherboard 5 are warped, as shown in FIG.
Among them, for example, the solders 18 located at both ends are separated from the electrode pads 6 of the motherboard 5.

However, since a large number of solders 18 are melted in order from those in contact with the cream solder 20 on the electrode pads 6, the solder 18 is located closer to the center than the solders 18 located at both ends in the longitudinal direction of the substrate 11. The solder 18 located first melts. As a result, the substrate 11 descends by its own weight in the direction of arrow B in FIG. 7, and the solders 18 located at both ends of the substrate 11 also contact the electrode pads 6 of the motherboard 5.

As a result, a gap of, for example, about 0.1 to 0.4 mm is formed between the end surface electrode 15 of the substrate 11 and the electrode pad 6 of the motherboard 5 as in the case where the substrate 11 is warped. Even at this time, since the tips of all the solders 18 eventually come into contact with the cream solder 20 of the electrode pads 6 as shown in FIG. 7, the end surface electrodes 15 of the substrate 11 and the electrode pads 6 of the motherboard 5 are connected. Connection can be made by the molten solder 18, and a fillet 21 can be formed between them as shown in FIGS. 8 and 9.

In the present embodiment, the tape 19 covering the surface-side exposed portion of the solder 18 is provided on the surface 11 A of the substrate 11.
Is provided, when the solder 18 is melted by heating, the solder 18 does not protrude above the surface 11A of the substrate 11 due to surface tension.

However, as in the comparative example shown in FIG. 10, when the tape 19 is not provided on the substrate 11 and the surface 11A is exposed, the molten solder 18 ' It is deformed into a substantially spherical shape by the surface tension, and swells in the direction of arrow C.
It protrudes above 1A. Further, since the electrode connection portion 16A of the wiring 16 is also exposed, the molten solder 18 'tends to be attracted to the electrode connection portion 16A and spread in the direction of arrow D.

For this reason, the solder 18 'is attracted to the front surface 11A side of the substrate 11 by the surface tension and the electrode connection portion 16A, and the protrusion L protruding below the back surface 11B of the substrate 11 is caused by melting. Deformation tends to decrease like the protrusion dimension L '. As a result, the solder 18 'at a position where a relatively large gap is formed between the end face electrode 15 and the electrode pad 6 at the position where a relatively large gap is formed between the end face electrode 15 and the May not be able to be joined.

On the other hand, in the present embodiment, as shown in FIG. 4, the exposed portion on the front side of the solder 18 is covered by the tape 19 provided on the surface 11A side of the substrate 11, so that the molten solder 18 It does not protrude above the surface 11A of the substrate 11. Since the tape 18 also covers the electrode connection portion 16A of the wiring 16, the molten solder 1
8 does not contact the electrode connection portion 16A. For this reason, even when the solder 18 is melted, the shape of the solder 18 is maintained substantially before melting, and the protrusion L from the back surface 11B of the substrate 11 is also maintained at substantially the same size. As a result, even when a gap is formed between the substrate 11 and the mother boat 5, the lower protruding portion 18B of the solder 18 can be reliably brought into contact with the electrode pad 6 of the motherboard 5, and the lower protruding portion 18B allows the end face to be formed. A gap between the electrode 15 and the electrode pad 6 can be supplemented, and a fillet 21 can be formed therebetween.

Thus, in this embodiment, since the tape 19 is provided on the surface 11A side of the substrate 11 so as to cover the exposed portion of the solder 18 on the surface side, the molten solder 18 projects above the surface 11A of the substrate 11. And the solder 18 can be hung down on the back surface 11B side of the substrate 11. For this reason, even when a gap is formed between the substrate 11 and the electrode pad 6 of the motherboard 5, the end face electrode 15 and the electrode pad 6 can be connected by the molten solder 18, and Can be formed.

Further, since a tape 19 made of a heat-resistant resin material is used as a cover member for covering the solder 18,
By affixing the tape 19 to the surface 11A side of
The solder 18 can be pressed from the front surface 11A side of the substrate 11, and it is possible to promote the solder 18 to hang down to the back surface 11B side.

Further, the solder 18 is applied to the back surface 11 B of the substrate 11.
Since the substrate 11 and the like are configured to protrude downward, even when the substrate 11 or the like warps and a gap is formed between the end surface electrode 15 of the substrate 11 and the electrode pad 6 of the motherboard 5, the back surface of the substrate 11 The lower projecting portion 18B of the solder 18 projecting to the 11B side comes into contact with the electrode pad 6 of the motherboard 5. Therefore, by melting the solder 18 in this state, the end face electrode 15 and the electrode pad 6 can be connected, and the fillet 21 can be formed therebetween.

On the other hand, since the solder 18 is made to protrude forward from the end face 11 C of the substrate 11, the end face electrode 15 is not required as compared with the case where the solder 18 is provided only in the end face opening groove 14.
Can be attached with a large amount of solder 18. For this reason,
By melting the solder 18, a front protruding portion 18 of the solder 18 that protrudes forward from the end surface 11 </ b> C of the substrate 11.
Since B loses what it supports, the molten solder 18 hangs down to the back surface 11B side of the substrate 11 while continuing to the solder 18 joined to the end face electrode 15 side. As a result, even when a warp occurs in the substrate 11 or the like, and a gap is generated between the end surface through hole 13 of the substrate 11 and the electrode pad 6 of the mother board 5, the end surface through hole 13 and the electrode The connection with the pad 6 can be made, and the fillet 21 can be formed therebetween.

Further, since the end surface electrode 15 is provided at a part of the inner wall surface of the end surface opening groove 14, when the solder 18 is melted by heating or the like, the balance of the surface tension of the solder 18 is easily lost, and the solder 18 18 can be easily hung on the back surface 11B side of the substrate 11. Therefore, solder 1
8 absorbs the warpage of the substrate 11 and the like, so that the end face electrode 15 and the electrode pad 6 can be reliably connected.

Further, the end face opening groove 14 is constituted by the solder accommodating part 14A opened on the end face 11C of the substrate 11 and the electrode forming part 14B in which the end face electrode 15 is formed continuously with the solder accommodating part 14A. A larger amount of solder 18 can be applied to the end face opening groove 14 than when the end face electrode 15 is provided over the entire inner wall surface of the end face opening groove 14 as in the prior art.
Can be housed inside.

Therefore, when the solder 18 is melted, the solder 18 filled in the solder accommodating portion 14A is displaced from the front projecting portion 1A.
8B, the balance of the surface tension of the entire solder 18 melted is broken, and the end face electrode 1 provided in the electrode forming portion 14B is displaced.
5 and hang down on the back surface 11B side of the substrate 11. As a result, even when a relatively large gap is formed between the end face electrode 15 and the electrode pad 6, the gap therebetween can be reliably connected.

Since the electrode connection portion 16A of the wiring 16 provided on the surface 11A side of the substrate 11 is covered with the tape 19, the electrode connection portion 16A does not come into contact with the solder 18. For this reason, when the solder 18 is melted, the electrode facing portion 18A of the solder 18 that is in contact with the end face electrode 15 is attracted to the end face electrode 15 to maintain the joined state, but the front protruding portion 18C supports it. Therefore, the substrate 11 easily hangs on the back surface 11B side of the substrate 11.
Thereby, the protrusion dimension L of the solder 18 can be maintained or increased, and the gap between the end face electrode 15 and the electrode pad 6 can be reliably compensated.

Next, FIG. 11 shows a second embodiment of the present invention. This embodiment is characterized in that a laminated substrate in which two or more layers made of a resin material are stacked is used as a substrate.
The configuration is such that the solder is covered by a layer on the surface side of each layer of the laminated substrate.

Reference numeral 31 denotes a laminated substrate formed by sequentially stacking, for example, four layers 32 to 35 made of an insulating resin material from the surface 31A, and excluding the layer 32 located closest to the surface 31A in the laminated substrate 31. A plurality of end face through holes 32 to be described later are formed in 33 to 35. on the other hand,
Layer 32 located closest to surface 31A of laminated substrate 31
Covers the exposed portion on the front side of the solder 41 provided in the end surface through hole 36.

Are end face through holes provided on four end faces 31C forming the outer peripheral edge of the laminated substrate 31. Each end face through hole 36 has an end face opening groove 37 and an end face electrode 38 described later. , The back electrode 40.

Are the end faces 31 of the laminated substrate 31
The end face opening grooves 37 are provided in a concave curved shape on C, and each of the end face opening grooves 37 is provided by penetrating three layers 32 to 35 located on the back surface 31B side of the laminated substrate 31 in the thickness direction. And is covered with a layer 32 on the surface 31A side. The end face opening groove 37 is substantially the same as the end face opening groove 14 according to the first embodiment, and the solder accommodating portion 37A extends substantially linearly from the end face 31C toward the center.
And a substantially semicircular electrode forming portion 37B provided on the bottom side of the groove.

Reference numerals 38, 38,... Denote substantially arc-shaped end surface electrodes provided on a part of the inner wall surface of the end surface opening groove 37. The end surface electrode 38 is located at the bottom (rear side) of the end surface opening groove 37. At a position covering the electrode forming portion 37B. The end surface electrode 38 is connected to a wiring 39 provided between the layer 32 and the layer 33 and to a back surface electrode 40 provided on the back surface 31B of the laminated substrate 31.

Are wirings for connecting between the end face electrode 38 and an electronic component (not shown).
It is provided between the two layers 32 and 33 of the laminated substrate 31. The wiring 39 is located in the vicinity of the end face 31C, around the end face opening groove 37, and connected to the end face electrode 38 in a substantially semicircular electrode connection part 39A, and from the electrode connection part 39A to the central part of the laminated substrate 31. Line section 39B extending toward the side
And is constituted by.

Reference numerals 40, 40,... Are back electrodes provided on the back surface 31B side of the laminated substrate 31 at positions around the end face opening grooves 37, and the back electrodes 40 are provided around the electrode forming portion 37B. It is connected to the end face electrode 38.

, 41, 41,... Are substantially columnar solders which are accommodated and fixed in the respective end face opening grooves 37.
An electrode facing portion 41A located in the end face opening groove 37 and facing the end face electrode 38;
1 and extends over the back surface electrode 40 so as to cover the back electrode 40.
Projecting portion 41B projecting below the back surface 31B of
And the end face 31C of the laminated substrate 31 from the electrode facing portion 41A.
And a substantially arc-shaped front protruding portion 41C provided so as to protrude further forward. In addition, the portion excluding the front protruding portion 41C of the exposed portion on the front surface side of the solder 41 is:
The laminated substrate 31 is covered with a layer 32 on the outermost surface 31A side.

Thus, in the present embodiment, the same operation and effect as those of the first embodiment can be obtained. However, in the present embodiment, each of the layers 32 to 35 of the laminated substrate 31 is
Of the above, since the exposed portion on the front side of the solder 41 is partially covered by the layer 32 on the front surface 31A side, it is possible to prevent the solder 41 from rising to the front surface 31A side of the laminated board 31 when the solder 41 is melted. Can be. Also, the laminated substrate 31
Since the solder 41 is covered by the layer 32, there is no need to attach a member such as a tape to the laminated substrate 31 as in the first embodiment, and the manufacturing cost can be reduced.

In the second embodiment, the laminated substrate 3
Although the configuration is such that the solder 41 is covered by the layer 32 closest to the surface 31A among the layers 32 to 35 of the first layer,
The configuration may be such that the solder 41 is provided between the third and third layers 34 and covered with the second layer 33 from the surface 31A side.

Next, FIG. 12 shows a third embodiment of the present invention. The feature of this embodiment is that the jig attached to the outer peripheral edge of the substrate covers the solder. In addition,
In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

Reference numeral 51 denotes an end face 1 forming the outer peripheral edge of the substrate 11
The jig 51 is formed in a substantially rectangular frame shape and is fixed along the end face 11C of the substrate 11 on the 1C side and attached to the front surface 11A. Also, the jig 51
Covers the electrode connection portion 16A of the wiring 16 and the substrate 1
1 has an eaves portion 51A protruding forward from the end surface 11C, and the eaves portion 51A causes a front protruding portion 18C of the solder 18 to be formed.
Is covered. As a result, the jig 51 covers substantially the entire surface of the solder 18 that is exposed on the front surface 11A side of the substrate 11 (exposed portion on the front surface side).

Thus, in the present embodiment, the same operation and effect as in the first embodiment can be obtained. However, in the present embodiment, since the exposed portion on the front side of the solder 18 is covered by the jig 51 attached to the board 11, the jig 51 is removed from the board 11 after the board 11 and the motherboard 5 are joined. Can be removed. For this reason,
Since the jig 51 can be used repeatedly, the substrate 1
Compared to the case where a member such as tape is permanently attached to 1,
Manufacturing costs can be reduced.

FIG. 13 shows a fourth embodiment of the present invention, which is characterized in that the solder 18 is covered by a plate 61 made of a thermosetting resin material. Note that, in the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

Reference numeral 61 denotes a plate fixed to the surface 11 A of the substrate 11. The plate 61 is formed of a thermosetting resin material, and for example, four sheets (only one sheet) are formed along four sides of the substrate 11. (Shown). The plate body 61 covers the electrode connection portion 16A of the wiring 16 and a part of the plate body 61A serves as an eave portion 61A protruding forward from the end surface 11C of the substrate 11 to cover the front protruding portion 18C of the solder 18. . As a result, the plate body 61 covers the exposed portion on the front side of the solder 18 over substantially the entire surface.

Thus, in the present embodiment, the same operation and effect as those of the first embodiment can be obtained. However, in the present embodiment, since the solder 18 is covered with the plate 61 made of a thermosetting resin material, the resin material before curing is adhered to the surface 11A side of the substrate 11 so that the plate 61 Can be easily attached to the substrate 11. Further, when the substrate 11 and the motherboard 5 are heated to join them, the plate 61 is cured, so that the resin material or the like of the plate 61 does not mix into the solder 18, and 15 and the electrode pad 6 can be securely joined.

Next, FIG. 14 shows a fifth embodiment of the present invention. This embodiment is characterized in that an end surface electrode is provided on substantially the entire inner wall surface of the end surface opening groove, and solder is applied to the end surface. The configuration is such that it is located in the opening groove and protrudes below the back surface. Note that, in the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

Are end through holes provided on end faces 11C, 11C,... Formed of four sides forming the outer peripheral edge of the substrate 11, and each end face through hole 71 is an end face opening groove 72 described later. , An end face electrode 74 and a back face electrode 75.

Are substantially semicircular end face opening grooves provided in the end face 11C of the substrate 11 in a concavely curved shape, and the end face opening grooves 72 penetrate in the thickness direction of the substrate 11. And is open to the end face 11C.

Reference numerals 73, 73,... Denote end surface electrodes provided over the entire inner wall surface of the end surface opening groove 72.
Are formed in a substantially semi-cylindrical shape, and are connected to a wiring 74 and a back electrode 75 described later.

Are wirings for connecting between the end face electrodes 73 and electronic components (not shown).
A substantially semi-circular electrode connecting portion 74 which is located near the end surface opening groove 72 near the end surface 11C and connected to the end surface electrode 73.
A and a line portion 74B extending from the electrode connection portion 74A toward the center of the substrate 11.

Are back electrodes provided on the back surface 11B side of the substrate 11 around the end face opening groove 72, and the back electrode 72 is connected to the end face electrode 73.

Are soldered in a semi-cylindrical shape disposed in the respective end face opening grooves 72. The solder 76 is composed of an electrode facing face portion 76A facing the end face electrode 73 and an electrode facing face portion 76A.
A, the back surface 11B of the substrate 11 extending in the thickness direction of the substrate 11
And a lower protruding portion 76B protruding downward.

Reference numeral 77 denotes a tape adhered to the surface 11 A of the substrate 11. The tape 77 is formed of a heat-resistant resin material, and is, for example, four sheets (only one is shown) along four sides of the substrate 11. ) Is located. Further, the tape 77 has an end surface extending to a position corresponding to the end surface 11 </ b> C of the substrate 11. As a result, the tape 77 covers the electrode connecting portion 74A of the wiring 74 and also covers the exposed portion on the front side of the solder 76 over substantially the entire surface.

Thus, in this embodiment, the same operation and effect as those of the first embodiment can be obtained.

Next, FIGS. 15 to 17 show the sixth embodiment of the present invention.
The embodiment of the present invention, the feature of this embodiment is to provide an end surface electrode over substantially the entire inner wall surface of the end surface opening groove,
The configuration is such that the solder protrudes forward from the end face of the substrate. Note that, in the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

Are end face through-holes formed on four end faces 11C, 11C,... Which form the outer peripheral edge of the substrate 11. Each of the end face through holes 81 is an end face opening groove 82 described later. , An end face electrode 84 and a back face electrode 85.

, 82, 82,... Are substantially semicircular end opening grooves provided in the end surface 11C of the substrate 11 in a concavely curved shape. The end surface opening grooves 82 penetrate in the thickness direction of the substrate 11. And is open to the end face 11C.

Reference numerals 83, 83,... Denote end surface electrodes provided over the entire inner wall surface of the end surface opening groove 82.
Are formed in a substantially semi-cylindrical shape, and are connected to a wiring 84 and a back electrode 85 described later.

Are wirings for connecting between the end face electrodes 83 and electronic components (not shown).
A substantially semicircular electrode connection portion 84 which is located near the end surface opening groove 82 and connected to the end surface electrode 83 as the vicinity of the end surface 11C.
A and a line portion 84B extending from the electrode connection portion 84A toward the center of the substrate 11.

, 85, 85,... Are back electrodes provided on the back surface 11B side of the substrate 11 around the end face opening groove 82, and the back face electrode 82 is connected to the end face electrode 83.

Reference numerals 86, 86,... Denote substantially columnar solders disposed in the respective end surface opening grooves 82. The solder 86 is composed of an electrode facing surface portion 86A facing the end surface electrode 83 and an electrode facing surface portion 86.
A, a substantially arc-shaped front protruding portion 8 provided protruding forward from the electrode facing portion 86A from the end face 11C of the substrate 11 from A.
6B.

Reference numeral 87 denotes a tape adhered to the front surface 11A of the substrate 11. The tape 87 is formed of a heat-resistant resin material, and is, for example, four sheets (only one is shown) along four sides of the substrate 11. ) Is located. The tape 87 is connected to the wiring 8.
4 cover the electrode connection portion 84A, and a part thereof covers the substrate 1
An eaves portion 87A protruding forward from the end surface 11C of the first portion covers the front protruding portion 86B of the solder 86. As a result, the tape 87 covers the exposed portion on the front side of the solder 86 over substantially the entire surface.

Thus, in the present embodiment, the same operation and effect as those of the first embodiment can be obtained. In particular,
In the present embodiment, since the solder 86 does not protrude from the back surface 11B of the substrate 11, but protrudes forward from the end surface 11C of the substrate 11, when the substrate 11 or the like warps, the solder before melting is used. 86 does not contact the electrode pads 6 of the motherboard 5. However, in the present embodiment, since the solder 86 is configured to protrude forward from the end surface 11C of the substrate 11, the solder
A larger amount of solder 86 can be attached to the end face electrode 83 as compared with the case where the 6 is arranged only in the end face opening groove 82.

For this reason, when the solder 18 is melted by heating the substrate 11 and the like, the front protruding portion 86B of the solder 86 loses its support, and as shown in FIG. Break the balance. As a result, the molten solder 86 ′ continues to the solder 86 ′ joined to the end face electrode 83 side as shown by a two-dot chain line in FIG. At this time,
The back surface electrode 85 guides the molten solder 86 ′ to the back surface 11 B side of the substrate 11, and the solder 86 ′
Facilitates drooping to the side. Therefore, even when gaps are formed between the end surface electrodes 83 of the substrate 11 and the electrode pads 6, these gaps can be compensated for by the solder 86 'that hangs down during melting.

Further, since the tape 87 is configured to cover the electrode connection portion 84A of the wiring 84 together with the solder 86, the electrode connection portion 84A does not contact the solder 86. Therefore, when the solder 86 is melted, the solder 86 is not attracted to the electrode connecting portion 84A and does not protrude toward the front surface 11A. For this reason, although the electrode facing portion 18A of the solder 86 that has come into contact with the end surface electrode 15 is attracted to the end surface electrode 15 and the joined state is maintained, the front protruding portion 18B has no support. It can be easily hung on the back surface 11B side.

Next, FIG. 18 shows a module substrate according to the seventh embodiment, which is characterized in that the end face electrodes are provided on a part of the inner wall surface of the end face opening groove. In this embodiment, the same components as those in the above-described first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

.. Are end face through holes according to the seventh embodiment. Each end face through hole 31 forms the outer peripheral edge of the substrate 11 similarly to the end face through hole 13 according to the first embodiment. Provided on the four end surfaces 11C. The end face through hole 91 is formed by an end face opening groove 92 and an end face electrode 93 described later.

, 92,... Are end face opening grooves formed in the outer peripheral edge of the substrate 11 in a concavely curved shape. Each of the end face opening grooves 92 is formed in a semicircular long hole shape. 11
A solder accommodating portion 92A opened to the C side;
A and an electrode forming portion 92B provided on the bottom of the groove continuously from A.

Reference numerals 93, 93,... Denote electrodes provided on a part of the inner wall surface of the end face opening groove 92. The electrode 93 is located at the bottom (rear side) of the end face opening groove 92 to form an electrode. It is formed so as to cover the portion 92B.

Are wirings provided on the surface 11A of the substrate 11. The wirings 94 are arc-shaped and located near the end face 11C and around the end face opening groove 92 and connected to the end face electrode 93. The electrode connecting portion 94A and the electrode connecting portion 94
A line portion 94B extending from A to the center of substrate 11
And is constituted by.

Are solders accommodated and fixed in the respective end face opening grooves 92. The solders 95 are melted by being heated by a heating furnace or the like, and the tips of the solders 95 are mounted on the substrate 11.
On the back surface 11B side.

Reference numeral 96 denotes a tape adhered to the front surface 11A of the substrate 11. The tape 96 is formed using a heat-resistant resin material, and is, for example, four sheets (only one is shown) along four sides of the substrate 11. ) Is located. In addition, the tape 96 is disposed at a position corresponding to the end surface 11C of the substrate 11,
The electrode 94 covers the electrode connecting portion 94A of the wiring 94, and also covers the exposed portion of the solder 95 on substantially the entire surface.

Thus, in the present embodiment, the same operation and effect as in the first embodiment can be obtained. However, in the present embodiment, since the end surface opening groove 92 is provided with the end surface electrode 93 at a part of the inner wall surface, when the solder 95 is melted by heating, the end surface electrode 93 of the molten solder 95 is formed. Although the contacting part maintains the bonding state with the end face electrode 93, the solder 95 housed in the solder housing part 92A where the end face electrode 93 is not provided loses the supporting material and loses the supporting thing, and the back surface 11B side of the substrate 11 Droop. At this time, since the electrode connection portion 94A of the wiring 94 disposed on the surface 11A of the substrate 11 is covered with the tape 96, the molten solder 95 is not attracted to the surface 11A side of the substrate 11 by the electrode connection portion 94A. , Back surface 1 of substrate 11
It hangs down to 1B side surely. Thereby, even when the substrate 11 or the like is warped, the substrate 11 and the motherboard 5 can be joined.

Next, FIG. 19 shows an eighth embodiment of the present invention. The feature of this embodiment is that a flat plate electrode is provided on the end surface of the substrate as an end surface electrode and solder is attached to the flat plate electrode. And that Note that, in the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

Are the end surfaces 11 of the substrate 11.
A flat electrode as an end face electrode provided directly on C,
The plane electrode 101 is provided on the end face 11 </ b> C of the substrate 11 in a plane shape, and extends along the thickness direction of the substrate 11.

Are wirings for connecting between the plane electrode 101 and an electronic component (not shown).
Reference numeral 02 denotes a substantially semicircular electrode connecting portion 102A connected to the flat electrode 101 near the end face 11C of the substrate 11.
And a line section 102B extending from the electrode connection section 102A to the center of the substrate 11.

Are substantially semi-cylindrical solders attached to the flat electrode 101. The solder 103 extends in the thickness direction of the substrate 11 along the flat electrode 101, and the whole of the solder 103 And is disposed on the front side (front side) so as to protrude from the end face 11C.

Reference numeral 104 denotes a tape adhered to the front surface 11A of the substrate 11. The tape 104 is formed using a heat-resistant resin material, and is, for example, four sheets (only one is shown) along four sides of the substrate 11. ) Installed. Also, the tape 104
Covers an electrode connecting portion 102A of the wiring 102, and a part thereof serves as an eaves portion 104A protruding forward from an end surface 11C of the substrate 11, and covers the exposed portion on the front side of the solder 103 over the entire surface.

Thus, in the present embodiment, the same operation and effect as those of the first embodiment can be obtained. However, in the present embodiment, since the flat electrode 101 is directly formed on the end face 11C of the substrate 11, hole processing and the like of the substrate 11 can be omitted, and productivity can be improved. Further, electronic components and the like can be arranged over the entire surface 11A of the substrate 11, and the effective area of the substrate 11 can be increased as compared with a case where an end face opening groove or the like is provided in the substrate 11.

Further, a flat planar electrode 1 is used as an end face electrode.
Since 01 is used, the end face electrode does not surround the solder 103 as compared with the case where the end face electrode is formed in an arc shape or the like, and the surface tension acting on the solder 103 toward the surface 11A of the substrate 11 can be reduced. Further, the wiring 1 is connected by the tape 104.
Since the configuration is such that the electrode connection portion 102A of No. 02 is covered and the solder 103 is covered, the melted solder 103 does not contact the electrode connection portion 102A and does not protrude toward the surface 11A of the substrate 11. For this reason, the solder 103 can easily hang down on the back surface 11B side of the substrate 11, and the connection between the plane electrode 101 and the electrode pad can be reliably established.

Further, the solder 103 is provided on the end face 11 of the substrate 11.
C is located only on the front side of C.
A fillet can be formed on the front side of the end face 11C, and the shape of the fillet can be easily visually recognized, and the bonding state between the flat electrode 101 and the electrode pad can be easily confirmed by the solder 103.

In the first to seventh embodiments, the end face opening grooves 14, 37, 72, 82, 92 are formed in a semicircular hole shape, a semicircular shape, or the like. It may be formed in a square shape such as a square shape, or may be formed in an elliptical shape or the like.

Further, in the eighth and ninth embodiments,
Although the back electrode is not provided, the back electrode may be provided similarly to the first to seventh embodiments.
In this case, it is possible to promote that the solder melted by the back surface electrode hangs down to the back side of the substrate.

[0113]

As described above in detail, according to the first aspect of the present invention, the end face electrode is provided with solder for connection to the motherboard provided on the back side of the board, and the solder is provided on the front side of the board. Since the lid member is provided to cover the exposed portion on the front side, when the solder is melted by heating, the solder can be pressed from the front side of the board by the tape, and the solder rises to the front side of the board due to surface tension. Can be prevented. As a result, the solder can be reliably held or hung on the back side of the board, so that even when a gap is formed between the board and the electrode pad of the motherboard, the end face electrode and the electrode pad are melted. The connection can be made by using the solder, and a fillet can be formed between them.

According to the second aspect of the present invention, since the lid member is made of a tape made of a heat-resistant resin material, the solder is pressed from the front side of the substrate by attaching the tape to the front side of the substrate. It is possible to promote the dripping of the molten solder on the back side.

According to the third aspect of the present invention, the substrate is formed of a laminated substrate in which a plurality of layers made of a resin material are stacked, and the lid member is constituted by a surface-side layer of each layer of the laminated substrate. In addition, the solder can be pressed from the front surface side of the substrate by the layer on the front surface side of the multilayer substrate without attaching another member to the substrate.

According to the fourth aspect of the present invention, since the lid member is constituted by the jig attached to the outer peripheral side of the board, the solder is applied from the front side of the substrate by the jig attached to the outer peripheral side of the board. The solder can be pressed down, and the solder can be promoted to hang down to the back side.

According to the fifth aspect of the present invention, since the lid member is formed of a plate made of a thermosetting resin material, the solder is applied from the front side of the board by the plate provided on the front side of the board. The solder can be pressed down, and the solder can be encouraged to hang down to the back side.

According to the sixth aspect of the present invention, since the solder is configured to protrude below the back surface of the substrate, the substrate is warped, and between the end face electrode of the substrate and the electrode pad of the motherboard. Even when a gap is formed, the tip of the solder protruding toward the back surface of the substrate contacts the electrode pad of the motherboard. Therefore, by melting the solder in this state, the end face electrode and the electrode pad can be connected, and a fillet can be formed therebetween.
Further, since the cover member covers the solder, when the solder is melted, it is possible to prevent the solder from rising to the front surface side of the substrate due to the surface tension. For this reason, it is possible to maintain or increase the protrusion size of the solder protruding to the rear surface side of the board, and it is possible to reliably compensate for the gap between the board and the motherboard.

According to the seventh aspect of the present invention, since the solder is made to protrude forward from the end face of the substrate, when the solder is melted by heating, a portion of the melted solder that comes into contact with the end face electrode. Is supported by the end surface electrode in a state of being attached to the substrate, but the portion protruding forward from the end surface of the substrate has no support, and therefore hangs down to the back surface of the substrate. At this time, since the lid member covers the solder, it is possible to suppress the solder from rising to the front surface side of the substrate due to surface tension. For this reason, the molten solder can hang down reliably on the back side of the board, and even when a gap is formed between the board and the motherboard, the solder hangs between the end face electrode and the electrode pad. Can be connected.

According to the eighth aspect of the present invention, the substrate is provided with an end face opening groove opened on the end face, and the end face electrode is provided on a part of the inner wall surface of the end face opening groove. When the solder is melted, the melted solder is supported in a state of being attached to the substrate by end face electrodes provided on a part of the inner wall surface of the end face opening groove. On the other hand, a portion of the solder accommodated in the end surface opening groove that does not contact the end surface electrode has nothing to support, and therefore hangs down to the back surface side of the substrate. At this time, since the lid member covers the solder, it is possible to suppress the solder from rising to the front surface side of the substrate due to surface tension. For this reason, the end face electrode and the electrode pad can be connected by the dripped solder, and the gap formed between the substrate and the electrode pad of the motherboard can be compensated.

According to the ninth aspect of the present invention, the end face electrode is a flat electrode provided on the end face of the board, and the solder is attached to the flat electrode in a state of protruding forward from the end face of the board. Therefore, the flat electrode can be provided on the end surface of the substrate without performing a hole processing or the like on the substrate. In addition, since the solder is attached to the flat electrode in a state of protruding toward the end face side of the substrate, the solder melted by heating is dripped down to the back side of the substrate along the flat electrode. At this time, since the lid member covers the solder, it is possible to suppress the solder from rising to the front surface side of the substrate due to surface tension. This makes it possible to reliably cause the solder to hang down on the back side of the substrate and to connect between the end face electrode and the electrode pad.

According to the tenth aspect of the present invention, on the front surface side of the substrate, an electrode connection portion which is located near the end surface of the substrate and is connected to the end surface electrode, and is directed from the electrode connection portion to the electronic component. And the electrode connection portion of the wiring is covered by the cover member, so that the electrode connection portion of the wiring is covered by the cover member, so that the electrode connection portion does not come into contact with the solder. . For this reason, when the solder is melted, the solder at the portion in contact with the end face electrode is attracted to the end face electrode and the joined state is maintained, but the solder at the other portion has no support, so that it is easily formed. It can be hung on the back side of the substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a module substrate according to a first embodiment of the present invention.

FIG. 2 is an enlarged perspective view of an essential part showing an enlarged through hole of an end face in FIG. 1;

FIG. 3 is an enlarged plan view of a main part showing an end face through hole.

FIG. 4 is an enlarged sectional view of a main part of the through-hole at the end face, as viewed from the direction of arrows IV-IV in FIG. 3;

FIG. 5 is an enlarged back view of a main part of the through hole at the end face as viewed from the back side of the substrate.

FIG. 6 is a side view showing a state where the module substrate is mounted on a motherboard.

FIG. 7 is a side view showing a state in which the solder has been melted, following the state of being placed on the motherboard shown in FIG. 6;

8 is a side view showing a state in which the module substrate is joined to a motherboard, following a molten state of the solder shown in FIG. 7;

FIG. 9 is an enlarged cross-sectional view of the module substrate and the motherboard as viewed from the direction indicated by arrows IX-IX in FIG.

FIG. 10 is an enlarged cross-sectional view of a main part of an end face through hole according to a comparative example in the case where no tape is provided in the first embodiment, as viewed from the same position as in FIG. 4;

FIG. 11 is an enlarged perspective view of an essential part showing an enlarged end face through hole according to a second embodiment.

FIG. 12 is a perspective view illustrating a module substrate according to a third embodiment.

FIG. 13 is an enlarged perspective view of an essential part showing an enlarged end face through hole according to a fourth embodiment.

FIG. 14 is an enlarged perspective view of an essential part showing an end face through hole according to a fifth embodiment in an enlarged manner.

FIG. 15 is an enlarged perspective view of a main part, showing an end face through hole according to a sixth embodiment in an enlarged manner.

FIG. 16 is an enlarged plan view of a main part showing an end face through hole.

FIG. 17 shows through-holes at the end faces indicated by arrows XVII-XV in FIG.
FIG. 2 is an enlarged sectional view of a main part as viewed from a direction II.

FIG. 18 is an enlarged perspective view of an essential part showing an enlarged end face through hole according to a seventh embodiment.

FIG. 19 is an enlarged perspective view of an essential part showing a plane electrode, solder and the like according to an eighth embodiment in an enlarged manner.

FIG. 20 is a perspective view showing a module substrate according to the related art.

21 is a cross-sectional view showing a state where the module substrate in FIG. 20 is joined to a motherboard.

FIG. 22 is an enlarged cross-sectional view of a main part, showing an end face through hole in FIG. 21 in an enlarged manner.

FIG. 23 is an enlarged cross-sectional view of a main part at a position similar to FIG. 22 showing a state where a substrate is warped and a gap is generated between an end face through hole and an electrode pad.

[Explanation of symbols]

Reference Signs List 5 mother board 6 electrode pad 11 substrate 12 electronic component 13, 36, 71, 81, 91 end face through hole 14, 37, 72, 82, 92 end face open groove 14A, 92A solder accommodation part 14B, 92B electrode formation part 15, 38, 73, 83, 93 End face electrode 16, 39, 74, 84, 94, 102 Wiring 16A, 39A, 74A, 84A, 94A, 102A
Electrode connection part 16B, 39B, 74B, 84B, 94B, 102B
Line section 18, 41, 76, 86, 95, 103 Solder 18A, 76A, 86A Electrode facing section 18B, 76B Lower projecting section 18C, 86B Front projecting section 21 Fillet 101 Flat electrode

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Iku Nagai 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Inside Murata Manufacturing Co., Ltd. (72) Koichi Takehara 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Stock Company F-term in Murata Manufacturing (reference) 5E317 AA04 AA22 BB01 BB18 CC15 GG20

Claims (10)

[Claims] A substrate on which an electronic component is mounted on a front surface side;
In a module board comprising an end face electrode provided on an end face forming an outer peripheral edge of the board and connected to the electronic component, the end face electrode is provided with solder for connecting to a motherboard provided on the back side of the board. And a lid member provided on a front side of the substrate to cover an exposed portion of the solder on the front side. 2. The module substrate according to claim 1, wherein said lid member is made of a tape made of a heat-resistant resin material. 3. The substrate according to claim 1, wherein the substrate comprises a laminated substrate in which a plurality of layers made of a resin material are stacked, and wherein the lid member comprises a surface layer of each layer of the laminated substrate.
A module substrate according to claim 1. 4. The module substrate according to claim 1, wherein said lid member is constituted by a jig attached to an outer peripheral edge side of said substrate. 5. The module substrate according to claim 1, wherein the lid member is formed of a plate made of a thermosetting resin material. 6. The module substrate according to claim 1, wherein said solder is projected below the back surface of the substrate. 7. The module substrate according to claim 1, wherein the solder is projected forward from an end surface of the substrate. 8. The substrate according to claim 1, wherein an end face opening groove is provided on the end face, and the end face electrode is provided on a part of an inner wall surface of the end face opening groove. 6 or 7
A module substrate according to claim 1. 9. An end face electrode comprising a flat electrode provided on an end face of a substrate, and wherein said solder is attached to said flat electrode in a state protruding forward from an end face of the substrate.
8. The module substrate according to 2, 3, 4, 5, 6, or 7. 10. A wiring comprising, on the front surface side of the substrate, an electrode connecting portion located near the end surface of the substrate and connected to the end surface electrode, and a line portion extending from the electrode connecting portion to the electronic component. Wherein the electrode connection portion of the wiring is covered by a lid member.
10. The module substrate according to 7, 8, or 9.