JP2001168152A - Semiconductor carrier film and semiconductor package manufacturing method - Google Patents

Abstract

(57) [Problem] To provide a carrier film which is free from generation of cut chips and cracks in a cured resin layer when cutting a film, has no wrinkles at the time of lamination, and has excellent alignment accuracy. SOLUTION: In a carrier film in which a thermo-ultraviolet curable resin layer 1 is formed on a polyimide resin film 3 having a conductor wiring pattern 2, the heat of a film cutting portion 5 and a film punching portion together with a conduction opening such as a via 4 are provided. A semiconductor carrier film, wherein an ultraviolet curable resin layer is shielded from light by a photomask at the time of exposure to ultraviolet light and removed by development. Also, when using a high elastic modulus copper foil or a polyimide film of 30 to 70 μm,
Prevents wrinkles and improves alignment accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier film suitable for high-density mounting of a semiconductor and to manufacture the same at a high yield, and a method of manufacturing a semiconductor package using the same.

[0002]

2. Description of the Related Art In response to demands for miniaturization and weight reduction of portable telephones and portable personal computers, an increase in the amount of information to be processed, and an increase in the speed of the processing, flexible applications centering on copper-clad laminates using polyimide resin as a substrate film. A face-down type chip size package (CSP) in which a circuit is formed on a circuit board and a chip electrode is connected to the circuit side is becoming the center of the memory. In this method, the distance between the chip electrode and the solder bump can be shortened, so that when the data transfer speed is increased, noise is reduced and stable operation is guaranteed. In such connection, it is important to reduce the cost by extending the life of the board connection and improving the mounting throughput (reference material: Nikkei Micro Devices, April 1999).
Monthly, pp. 74-78).

[0003] In response to such demands, thermo-ultraviolet curable resins have been used as cover resists and adhesive resins. For example, as the adhesive resin, a non-photosensitive hot melt type thermoplastic polyimide or an epoxy resin containing an underfill material is known. The former has a problem of a popping phenomenon at the time of solder mounting due to moisture absorption by polyimide, and the latter has an increase in the cost of the package due to the material cost and the number of steps for mixing the underfill material. So we developed a through-hole type CSP,
Conventional laser processing or photolithography using a photosensitive resin is employed to form the through holes. In laser processing, since through holes are formed one by one, the productivity is low and the cost of the package increases.
On the other hand, photolithography using a photosensitive resin can cope with miniaturization of wiring and is excellent in productivity. It is said that the same applies to a solder resist layer used for mounting a solder ball and a cover resist layer for protecting a conductor.

A method of mounting a chip in a state where a photosensitive resin is semi-cured by ultraviolet light and fixing the chip by heat curing is described in, for example, JP-A-59-113691, JP-A-60-152091, and JP-A-60-152091. JP-A-62-72194, JP-A-62-72195, JP-A-1-297885, JP-A-4-7383 and the like, all of which have an ultraviolet-curable compound having an acroyl group and a light. A thermophotopolymerizable resin composition obtained by mixing a polymerization initiator and a thermosetting epoxy resin is used. In any of the documents, a rigid substrate such as a glass-epoxy substrate is used as a substrate, and there is no description of occurrence of cracks or peeling after exposure. Further, JP-A-11-67849 describes a carrier film characterized by forming a cover resist layer made of an epoxy acrylate resin having a fluorene skeleton on a heat-resistant resin film having a conductor wiring pattern. I have. This is 180-26
It is said that a carrier film having excellent flexibility can be obtained by heating and curing at 0 ° C. However, there is no mention of the occurrence of cut chips when cutting this.

On the other hand, for forming a circuit and mounting a cover resist and an adhesive on the circuit, it is most preferable to unwind the flexible circuit board from the reel and to continuously manufacture the reel (reel process) for improving the throughput. However, the thermo-UV curing resin has the following problems with this production method. (1) The cured thermo-ultraviolet curable resin is generally brittle, causing cracks in the thermo-ultraviolet curable resin layer when the carrier tape is cut into a semiconductor package size, and causes contamination of a clean room due to cut chips. (2) The carrier tape expands or shrinks during lamination of the ultraviolet curable layer, causing wrinkles, lowering the alignment accuracy at the time of exposure, narrowing the collective exposure range, and lowering the throughput. In particular, the second problem is a serious problem as the thickness of the copper foil is reduced from 18 μm to 12 μm and further to 9 μm due to the demand for finer conductor wiring.

[0006]

SUMMARY OF THE INVENTION Accordingly, the present invention is directed to a carrier film in which a thermo-ultraviolet curable resin layer is formed on a polyimide resin film having a conductor wiring pattern. It is an object of the present invention to provide a carrier film which is free from cracks in the layers and free from wrinkles during lamination and has excellent alignment accuracy.

[0007]

Means for Solving the Problems As a result of intensive studies, the present inventors have found that in a carrier film in which a thermo-ultraviolet curable resin layer is formed on a polyimide resin film having a conductor wiring pattern, a film cutting portion is formed together with an opening for conduction. In addition, the present inventors have found that a semiconductor carrier film in which the heat-ultraviolet curable resin layer at the punched portion is shielded from light by a photomask at the time of exposure to ultraviolet light and is removed by development achieves the object. In addition, it has been found that the thickness of the polyimide resin film and the elastic modulus of the conductor are related to the prevention of wrinkles during lamination and the alignment accuracy.

According to the present invention, there is provided a carrier film in which a thermo-ultraviolet curable resin layer is formed on a polyimide resin film having a conductor wiring pattern. A semiconductor carrier film, which is shielded from light by a photomask at the time of exposure to ultraviolet light and removed by development. Further, the present invention is the above-mentioned semiconductor carrier film, wherein the thickness of the polyimide resin film is 30 to 70 μm, or the conductor constituting the conductive wiring pattern is an electrolytic copper foil having an elastic modulus of 30 GPa or more. Further, the present invention provides a carrier film in which a thermo-ultraviolet curable resin layer is formed on a polyimide resin film having a conductor wiring pattern, wherein the relationship between the elastic modulus of the conductor constituting the conductor wiring pattern and the thickness of the polyimide resin film is polyimide. When the resin film is less than 30 μm, the elastic modulus of the conductor is 30 GPa or more, and the elastic modulus of the conductor is 30 GPa or more.
When it is less than GPa, the semiconductor carrier film satisfies the relationship that the thickness of the polyimide resin film is 30 μm or more. Also, the present invention
The thermo-ultraviolet curable resin constituting the thermo-ultraviolet curable resin layer includes (1) an addition product of an epoxy acrylate resin having a fluorene skeleton and a polybasic acid anhydride, (2) a polyfunctional acrylate monomer, and (3) light. Polymerization initiator and (4)
The semiconductor carrier film described above is an alkali developing type resin composition essentially including an epoxy resin having two or more epoxy groups in one molecule. Further, the present invention is characterized in that after the semiconductor is mounted on the semiconductor carrier film, the film cut portion which is shielded from light by a photomask at the time of exposure to ultraviolet light and from which the thermo-ultraviolet curable resin layer is removed by development is cut. Is a method of manufacturing a semiconductor package.

The carrier film in the present invention is preferably a substrate made of a polyimide resin having excellent flexibility and heat resistance, and has a wiring pattern formed of a conductor such as copper on at least one surface thereof. The wiring pattern is formed by a known method. For example, by forming a photoresist pattern on a copper foil and forming a conductor wiring pattern by stripping the resist following copper etching, or forming a circuit by electroplating a photoresist pattern on a copper foil, A method of removing the resist can be exemplified.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The schematic structure of the carrier film of the present invention is shown in FIGS. Thermal UV-curable resin layer 1
May be either the surface on the conductor wiring pattern 2 side or the insulating film surface on the polyimide resin film 3 side. For example,
FIG. 1 shows a case where the chip component 8 is mounted on the conductor wiring pattern surface. A thermo-ultraviolet curable resin layer 1 is applied to a conductor wiring pattern 2 on a conductor wiring pattern and a flexible substrate in which a solder ball mounting opening 6 is provided on the polyimide film surface in advance. 5 is a carrier film in which an opening corresponding to No. 5 is formed by a photolithography method. At the time of mounting a chip component, a bump 7 in which a gold bump is previously formed on a chip electrode with a gold wire or the like.
Thereby, the chip component 8 is joined. On the other hand, FIG. 2 shows a case where a chip component is mounted on a polyimide insulator surface. In the flexible substrate on which the conductor wiring pattern 2 is formed,
A thermo-ultraviolet curable resin 1 is applied to the surface of an insulator made of a polyimide resin film 3, and an opening 5 corresponding to a via 4 and a film cutting portion 5 is formed in a predetermined conductive portion by photolithography. A thermo-ultraviolet curable resin layer 1 is also formed on the side surface, and a solder ball mounting opening 6 and an opening 5 corresponding to a cut film portion are formed by photolithography to form a carrier film. At the time of mounting a chip component, a gold bump is formed on a chip electrode by a gold wire or the like, and is bonded to a chip component 8. Although the embodiment of FIG. 1 has a simple layer structure, since the number of layers constituting the substrate is one less than that of the embodiment of FIG. 2, wrinkles and curls are more likely to occur due to the lamination of the thermo-ultraviolet curable resin layers.

Although a known polyimide resin film can be used, its thickness is 30 to 70 μm, more preferably 40 to 70 μm, and warpage and wrinkling can be prevented by the rigidity of the polyimide film. When an adhesive layer such as an epoxy resin is provided between the conductor and the polyimide film, the thickness including the adhesive layer may be considered. Thickness 3
When the thickness falls below 0 μm, when coated with a thermo-ultraviolet curable resin,
Wrinkles are likely to occur due to the shrinkage during drying, and it may not be possible to accurately align the exposure position between the photomask and the substrate when blocking the vias for the bumps and the cut portions of the film.

On the other hand, as the conductor forming the conductor pattern, a copper foil is excellent, and a known copper foil can be used, but its thickness is 18 μm in accordance with the thinning of the conductor pattern for high density. To 12 μm or even 9 μm, and the elastic modulus of the copper foil is 3 to prevent wrinkles when laminating a thermo-ultraviolet curable resin layer.
0 GPa (about 300000 kgf / cm ² ) or more, preferably 35 GPa
(About 3500 kgf / cm ² ) or more is preferable. In particular,
High-strength copper foil used for tab mounting is suitable, and the former has an elastic modulus of 35 GPa (about 3500 k).
gf / cm ² ) or more, and the latter has 40 GPa (about 4000 kgf / cm ² ) or more. The relationship between the elastic modulus of the conductor constituting the conductor wiring pattern and the thickness of the polyimide resin film is such that when the polyimide resin film is less than 30 μm, the elastic modulus of the conductor is 30 GPa or more, and the elastic modulus of the conductor is 30 GPa or more.
When it is less than GPa, it is advantageous to satisfy the relationship that the thickness of the polyimide resin film is 30 μm or more.

As the thermo-ultraviolet curable resin used in the present invention, a resin curable by both ultraviolet and heat can be used, and a known resin may be used. Specifically, a composition in which a compound or resin having a boiling point of 100 ° C. or more having two or more polymerizable unsaturated groups in one molecule and a photopolymerization initiator and a thermal polymerization initiator, Examples thereof include a composition in which a compound or resin having a boiling point of 100 ° C. or more having two or more polymerizable unsaturated groups and a photopolymerization initiator and a thermopolymerizable epoxy compound are mixed. Any of these constituents may be known ones. Preferred specific examples thereof include a carboxyl group and photopolymerization in the same molecule as disclosed in JP-A-60-152091 and JP-A-8-146311. Compound or resin having a possible unsaturated group, polyfunctional acrylate having three or more acroyl groups or methacryloyl groups in the same molecule, photopolymerization initiator and epoxy compound having two or more oxirane rings in the molecule And more preferably a resin having a weight average molecular weight of 1,000 or more having a carboxyl group and a photopolymerizable unsaturated group in the same molecule, and a photopolymerization initiator and two in the molecule. A resin composition containing the above epoxy compound having an oxirane ring. In particular, it is an alkali-developable resin composition containing the following components as essential components. (1) an addition product of an epoxy acrylate resin having a fluorene skeleton and a polybasic acid anhydride; (2) a polyfunctional acrylate monomer; (3) a photopolymerization initiator; and (4) two or more epoxy groups in one molecule. Epoxy resin,

The adduct of an epoxy acrylate resin having a fluorene skeleton and a polybasic acid anhydride has an acid value indicating the carboxyl group content of 70 to 170 mgKOH / g due to the necessity of pattern formation by alkali development. It is an oligomer having a weight average molecular weight of 3,000 or more. Specific examples include V259M and V301M manufactured by Nippon Steel Chemical Co., Ltd., which are epoxy acrylate acid adducts having a fluorene skeleton such as epoxy acrylate of 9,9-bisphenolfluorene, and cresol novolac manufactured by Nippon Kayaku Co., Ltd. An epoxy acrylate acid adduct can be exemplified. The former has a bulky fluorene skeleton, and thus its cured product exhibits a high glass transition temperature, and thus can be suitably used in this application field. In addition, since two or more carboxyl groups and a polymerizable unsaturated group are simultaneously contained in one molecule, a high resolution near an aspect ratio of 1 is exhibited. As a method for forming the thermo-ultraviolet curable resin layer, a liquid varnish may be applied by curtain coating or printing and dried, or a dry film adhesive layer may be laminated by lamination. When covering the wiring pattern surface, lamination of a dry film is preferably used in view of the flatness of the surface of the adhesive layer.

After the formation of the thermo-ultraviolet curable resin layer, as shown in FIG. 3, a via hole forming portion, a film cutting portion 5 where a film is cut, and a punching process using a die are performed. Using a photomask in which the film punching portion 9 as a portion is shielded from light, and
Irradiation at 1000 mJ is performed, and the unexposed portion is developed with a dilute alkaline aqueous solution such as sodium carbonate or tetraethylammonium hydroxide to remove the thermo-ultraviolet curable resin layer. By doing so, when the carrier film is subsequently cut into strips, or when sizing to the size of a semiconductor package, the cut portion such as a cut chip or No cracks occur.

As described above, after the development, it is preferable to immediately perform a heat treatment at 80 to 140 ° C. for 5 to 30 minutes before subjecting to the next step. By performing this heat treatment, the bending resistance of the adhesive layer and the adhesion to the flexible substrate are improved, and cracks are generated even when the substrate is bent during the transfer of the heat treatment or when the substrate reel is wound or stored after winding. And a flexible circuit board which does not peel off from the substrate can be provided. If the heat treatment temperature is lower than 80 ° C, the above effect is not remarkable,
At a heat treatment temperature exceeding ℃, the adhesion strength cannot be maintained in the subsequent chip thermocompression bonding. The heat treatment time is
The higher the processing temperature, the shorter it may be.
3 to 30 minutes.

Next, a method for bonding chip components to a carrier film with an adhesive layer as shown in FIG. 1 will be described. A thermo-ultraviolet curable resin layer is formed by using a substrate in which an opening for mounting a solder ball is formed in a conductive circuit and a polyimide substrate by a known method. Apply thin-film gold plating to increase the reliability of bump bonding by neutral cyan gold plating, etc.
A chip component on which a gold bump is formed in advance is mounted on the chip electrode, and is fixed by heating and curing at the time of mounting and / or thereafter. Specifically, using a commercially available die bonder,
With the chip electrode facing down and the carrier film with the adhesive layer facing upward, the chip and the electrode of the carrier film are aligned, and a 0.5 to 3 mm silicon rubber sheet is applied under the carrier film, and 260 to 310 ° C from the back side of the chip electrode. , Preferably at 280-300 ° C, 0.5-2 MPa (about 5-20 kg / c
m ² ), preferably 0.8 to 1.5 MPa (about 8 to 15 kg / cm ² )
Thermocompression bonding at a pressure of 1 to 20 seconds, preferably 5 to 10 seconds. After thermocompression bonding, it has sufficient adhesion strength as it is, but heat treatment is performed at 160 to 250 ° C., preferably 160 to 230 ° C. for 5 to 60 minutes to further improve reliability. Potting the liquid encapsulant on the chip parts and then 140-180
Seal at ℃. Sizing by cutting the carrier film can be done before or after chip mounting,
In the present invention, no cracks or cut chips are generated because there is no thermal ultraviolet curing resin layer in the cut portion. Cracks in the thermal ultraviolet curing resin layer impair the reliability of the semiconductor package,
The occurrence of cut chips causes a decrease in cleanliness and an obstacle during mounting, which causes a reduction in yield.

[0018]

The present invention will be described below in detail with reference to examples. Example 1 [Preparation of thermo-ultraviolet curable adhesive resin] 30 parts by weight of a modified caprolactone of dipentaerythritol hexaacrylate (trade name KAYARAD DPCA-60, manufactured by Nippon Kayaku), a fluorene epoxy-type acrylate / acid anhydride addition polymer 56.5
wt% -propylene glycol monomethyl ether acetate solution (trade name of Nippon Steel Chemical Co., Ltd .: an equal weight mixture of V259ME and V301ME) 124 parts by weight (70 parts by weight as solid content), tetramethylbiphenyl type epoxy resin (oil (Product name: XY4000H), 15 parts by weight, 1.2 parts by weight of a silane coupling agent (trade name: S510, manufactured by Chisso Corporation) for the purpose of imparting adhesion to a substrate, and 4,4 parts as a photopolymerization initiator component
0.2 parts by weight of 4'-bisdiethylaminobenzophenone (manufactured by Hodogaya Chemical Industries, trade name: EAB-F) and 2-methyl-
1- [4- (methylthio) phenyl] -2-morpholino-propan-1-one 3 parts by weight (trade name: Irgacure 907, manufactured by Ciba Specialty Chemicals Co., Ltd.); Irganox 1010 (Ciba Specialty Chemicals as a thermal polymerization inhibitor) (Produced by Nissan Chemical Co., Ltd.), 0.38 parts by weight, and 6 parts by weight of propylene glycol methyl ether acetate as a solvent and 58 parts by weight of ethyl acetate were blended to prepare a hot ultraviolet curable resin composition.

This composition was coated with a die coater to a thickness of 25.
μm, applied to polyester film 600mm wide, 8
Continuous 4 set at 0-90-100-120 ° C respectively
Dry with hot air in a multi-stage drying oven and have a residual solvent ratio of 4% 3
A photopolymerizable layer having a thickness of 0 μm was obtained. Thickness 6 on the dried coating
Laminating a 0 μm polyethylene protective film,
A dry film resist (abbreviated as DFR) was prepared.

[Lamination on single-sided copper-clad laminate and exposure operation] Electrolytic copper foil manufactured by Mitsui Kinzoku Co., Ltd. having a thickness of 18 μm and cut into a 60 mm square (elastic modulus of about 36 to 40 GPa (about 3600 to 4000 kg)
f / mm ² )) and a copper-clad laminate (ESPANEX manufactured by Nippon Steel Chemical Co., Ltd.) in which 40 μm low thermal expansion polyimide resin is laminated, on a copper surface having a comb-shaped circuit formed on a copper surface at a pitch of 1 mm at 50 mm square, Using a vacuum press laminator (manufactured by Meiki Seisakusho), the thermal ultraviolet curable resin layer is peeled off while removing the protective film of the DFR, the degree of vacuum is 306 Pa (about 2.3 Torr), the press temperature is 80 ° C., and the substrate pressure is about 0.3 MPa (about Lamination was performed at 3 kgf / cm ² ) for 5 seconds. After lamination, the space between the wirings was observed with a microscope. As a result, it was found that there was no air bubbles and the filling was good. Subsequently, after the support film was peeled off, a quartz mask was adhered to the thermo-ultraviolet curable resin layer, and an ultra-high pressure mercury lamp (Hitec Co., Ltd., illuminance 11
(mJ / cm ² , I-ray standard) at 300 mJ / cm ² , and further developed with a 1% aqueous solution of tetramethylammonium oxide at 25 ° C. for 90 seconds to obtain a copper-clad laminate with a flexible adhesive layer It was created. The undulation of the developed laminate was observed on a flat desk, but no noticeable undulation was observed. In addition, the height from the desk to the upper surface of the laminate resin was measured as an index of waviness and wrinkles, and all were less than 0.5 mm.

Examples 2 to 6 and Comparative Example 1 A copper-clad laminate with a resin layer was prepared in the same manner as in Example 1 except that the thickness of the polyimide was changed to 25 μm or 40 μm and 50 μm, or the type of copper foil having a different elastic modulus was changed. Create the swell
Wrinkles were observed. Table 1 shows the structure of the copper-clad laminate and the evaluation results. The copper foil used was an electrolytic SLP foil manufactured by Nihon Denki Co., Ltd. (elastic modulus: about 40 to 60 GPa) in Examples 2 to 4.
Example 5 and Comparative Example 1 are rolled copper foils (elastic modulus: about 25 to 27 GPa) manufactured by Mitsui Kinzoku Co., and Example 6 is electrolytic copper foils (elastic modulus: about 40 to 60 GPa) manufactured by Mitsui Kinzoku Co., Ltd. It is. The evaluation criteria for the swell are as follows. Less than 0.5mm in height from the desk to the top surface of the laminated resin ○ At least 0.5mm in height from the desk to the top surface of the laminated resin ×

[0022]

[Table 1]

According to Table 1, when a copper foil having an elastic modulus of about 30 GPa or more was used, generation of waviness and wrinkles did not occur regardless of the thickness of the polyimide. However, when a copper foil having a low elastic modulus was used, undulation became a problem. On the other hand, it was also good in the examples in which the thickness of the polyimide was 40 μm or 50 μm, and it was found that in this case, it did not depend on the elastic modulus of the copper foil.

Example 7 An 18 μm-thick electrolytic copper foil manufactured by Mitsui Kinzoku Co., Ltd. cut into a 30 mmW × 100 mmL square (elastic modulus of about 36,000 to 40,000 MP)
a (3600-4000 kgf / mm ² )) and a 40-μm low thermal expansion polyimide resin-laminated copper-clad laminate (ESPANEX manufactured by Nippon Steel Chemical Co., Ltd.) in the same manner as in Example 1 using a DFR protective film. While peeling off, the circuit surface of the thermal ultraviolet curable resin layer was coated using a vacuum press laminator (manufactured by Meiki Seisakusho). Next, a 100 μm line was used around the circuit, and a negative mask was used in which light was cut off at 100, 80, 60, 50, 40, 30, and 20 μm at the punched portion of the transport hole on the side of the tape, the via diameter, and the space portion of the line & space. Exposure and development operations were performed in the same manner as in Example 1 to prepare a circuit board with a resin in which the substrate cut portion and the punched portion were not covered with resin as shown in FIG. Further, this was heat-treated at 110 ° C. for 20 minutes. When the unexposed portion where the resin was dissolved and removed was observed with a microscope, it was confirmed that the via diameter was 40 μm, the line & space was formed at 30 μm, and no resin remained in the unexposed portion around the circuit. Subsequently, this circuit board with a resin layer was cut for each model circuit using a mold, but since there was no resin layer in the cut portion, the occurrence of cut chips, cracks and peeling of the resin layer caused by the resin layer did not occur. Not observed.

Comparative Example 2 A circuit board with a resin layer was prepared in the same manner as in Example 1 except that the entire surface was exposed without using an exposure mask, and the board was cut from the resin layer side using a mold. Observation of the cut end surface with a microscope revealed that cracks occurred along the cut surface.
When the polyimide was cut from the side, when the cut cross section was observed with a microscope, peeling was observed in a part between the copper foil surface and the resin surface, and it was observed that a part of the resin layer was missing.

Examples 8 to 9 Electrolytic copper foil (made by Mitsui Kinzoku Co., Ltd.) having a thickness of 18 μm and having a modulus of elasticity of about 36 to 40 GPa (about 3600
40004000 kgf / mm ² )) and a copper-clad laminate obtained by laminating 40 μm low thermal expansion polyimide resin (ESPANEX manufactured by Nippon Steel Chemical Co., Ltd .; Example 8) or a 50 μm thick Iupisel (Ube Industries, Ltd .; Example 8) Using a copper-clad laminate with
A copper-clad laminate having 3 x 8 16 mm x 16 mm model circuits and a transport hole formed in the end face in the tape long axis direction was prepared. Also,
As shown in FIG. 4, cross alignment marks having a width of 50 μm are formed at four corners of the circuit board. Example 1
While removing the protective film of DFR in the same manner as described above, the circuit surface of the thermo-ultraviolet curable resin layer was coated at 80 ° C. using a vacuum press laminator (manufactured by Meiki Seisakusho). Next, the alignment mark and a quartz negative mask with 65 μm vias were opened at 160 μm proximity from the resin top surface,
After aligning the alignment marks at the four corners between the circuit board and the negative mask, exposure was performed at 300 mJ / cm ² (I-line reference). The exposure machine used was MA-140 manufactured by Dainippon Screen Co., Ltd.
It is 0. Further, a developing operation was performed in the same manner as in Example 1 to prepare a circuit board with resin. Then, at 110 ° C,
A partial heat treatment was performed. Table 2 shows a dimensional change between the alignment marks on the circuit board before and after the formation of the resin layer. In the table, as shown in FIG. 4, the alignment mark distance in the long axis direction was defined as A, the alignment mark distance in the short axis direction was defined as B, and the alignment mark distance in the diagonal direction was defined as C. No undulation was observed in the obtained circuit board with a resin layer. Although a slight shrinkage was observed after the formation of the resin layer, it was as small as 0.02 to 0.036 mm in the major axis direction. Furthermore, it was confirmed that a 45 μm via was formed on the circuit board. The mask size is A = 126.495mm, B = 51.997m
m, C = 136.762 mm, and via diameter 65 μm.

[0027]

[Table 2]

[0028]

According to the present invention, in a carrier film in which a thermo-ultraviolet curable resin layer is formed on a polyimide resin film having a conductor wiring pattern, cut chips are generated when the film is cut, and a cured resin layer is formed. The present invention provides a carrier film that is free from cracks and has excellent alignment accuracy without wrinkles during lamination, thereby contributing to an improvement in the yield and reliability of a chip size package.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an example of an embodiment.

FIG. 2 is a schematic sectional view showing another example of the embodiment.

FIG. 3 is a schematic plan view showing an example of the embodiment.

FIG. 4 is an explanatory diagram showing a measurement direction of a dimensional change.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 thermo-ultraviolet curable resin layer 2 conductor wiring pattern 3 polyimide resin film 4 via 5 film cut section 6 semi-elastic ball and mounting opening 7 bump 8 chip 9 film punching section

Continuation of the front page (72) Inventor Shinji Inaba 1 Tsukiji, Kisarazu-shi, Chiba F-term in Nippon Steel Chemical Co., Ltd. Electronic Materials Development Center (reference) 2H025 AA10 AA13 AB16 AC01 AD01 BC74 BC83 CB30 DA19 DA20 5F044 KK03 KK25 LL11 MM03 MM07 MM16 MM31 MM48 NN07 RR17

Claims (6)

[Claims] In a carrier film in which a thermo-ultraviolet curable resin layer is formed on a polyimide resin film having a conductor wiring pattern, the relationship between the elastic modulus of the conductor constituting the conductor wiring pattern and the thickness of the polyimide resin film is determined by the polyimide resin. When the film is less than 30 μm, the elastic modulus of the conductor is 30 GPa or more, and the elastic modulus of the conductor is 30 GPa.
A semiconductor carrier film which satisfies the relationship that the thickness of the polyimide resin film is 30 μm or more when it is less than GPa. 2. A carrier film in which a thermo-UV curing resin layer is formed on a polyimide resin film having a conductor wiring pattern, wherein the heat-curing resin layer at the film cutting portion and the film punching portion together with the conduction opening is formed of an ultraviolet ray. A semiconductor carrier film, which is shielded from light by a photomask during exposure and removed by development. 3. A polyimide resin film having a thickness of 30 to 7
3. The semiconductor carrier film according to claim 2, which has a thickness of 0 μm. 4. The semiconductor carrier film according to claim 2, wherein the conductor constituting the conductor wiring pattern is made of an electrolytic copper foil having an elastic modulus of 30 GPa or more. 5. A thermo-ultraviolet curable resin constituting a thermo-ultraviolet curable resin layer, wherein (1) an addition product of an epoxy acrylate resin having a fluorene skeleton and a polybasic acid anhydride,
An alkali development type resin composition comprising (2) a polyfunctional acrylate monomer, (3) a photopolymerization initiator, and (4) an epoxy resin having two or more epoxy groups in one molecule. The semiconductor carrier film according to any one of the above. 6. A film cutting method comprising, after mounting a semiconductor on the semiconductor carrier film according to any one of claims 1 to 5, being shielded from light by a photomask at the time of exposure to ultraviolet light, and removing the thermo-ultraviolet curable resin layer by development. A method of manufacturing a semiconductor package, comprising cutting a portion.