JP2001168005A - Liquid crystal display substrate coating removal equipment - Google Patents

Abstract

(57) [Summary] [Problem] To prevent the occurrence of thinner spatter even if the glass substrate has warpage or variation in regulation, or the balance between the amount of thinner blown out and the exhaust capacity is degraded, and to effectively prevent the end face of the glass substrate. Provided is a film removing device for a liquid crystal display substrate, which can remove a harmful film such as a resist film adhered to a liquid crystal display substrate. SOLUTION: A nozzle table 7, 8 sandwiching one side of a glass substrate 1 with a vertical interval, and a chemical solution disposed on a surface of the nozzle table 7, 8 opposed to the glass substrate 1 for dissolving the coating film have different flow rates. The nozzle bases 7 and 8 are configured to sweep in a fixed direction while sandwiching the end surface of the glass substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for removing a film from a liquid crystal display substrate, and more particularly to a method for removing a film such as a resist adhered to an end face of a glass substrate in a manufacturing process of the liquid crystal display substrate. It concerns the device.

[0002]

2. Description of the Related Art In recent years, in a photo-fabrication process of a liquid crystal display substrate, immediately after the application of a resist by a spin coater method or the like, a resist attached to an end face of a glass substrate is removed. This is because when the substrate is transported to the next process with the resist adhered to the glass substrate end surface, the resist is transferred to the substrate setting portion and stage portion of the next process unit, contaminating the device, and the transferred resist is cured. Doing so causes dust.

Hereinafter, a conventional apparatus for removing a film from a liquid crystal display substrate will be described with reference to the drawings. FIG. 3 is an explanatory view of a main part of a conventional film removing device for a liquid crystal display substrate, FIG. 4 is a side view of a nozzle base portion during operation of the conventional film removing device for a liquid crystal display substrate, and FIG. It is a state explanatory view of a thinner position at the time of operation of a nozzle stand part of a coat removal device.

In each of the drawings, reference numeral 1 denotes a glass substrate, 2 denotes a resist, 3 denotes a U-shaped nozzle table, and 4 denotes a nozzle for ejecting a thinner. The nozzles are installed inside and below the nozzle table 3 so as to face each other. 5 is a thinner outlet, and 6 is a thinner.

In such a configuration, as shown in FIG. 3, the nozzle base 3 sandwiches the end surface of the glass substrate 1 at a predetermined interval between U-shaped portions, By sweeping the glass substrate 1 in the direction of the arrow, the resist 2 attached to the end face is removed. This processing is performed on the four end surfaces of the glass substrate 1. Here, as shown in FIG. 4, the ejected thinner 6 is sucked into the thinner exhaust port 5 while hitting the end face of the glass substrate 1, and the above-described resist removing operation is performed. In some cases, a problem may occur depending on how the end face hits the end face.
That is, FIG. 5A shows a case where the thinner 6 sucked into the thinner exhaust port 5 and the end surface of the glass substrate 1 are in contact with each other, which is the most ideal shape. FIG. 5B shows the glass substrate 1.
This shows a case where the thinner 6 strikes the end face of the glass substrate 1 at an acute angle. In this form, the resist 2 adhering to the end face of the glass substrate 1 can be sufficiently removed. There is a danger that the glass substrate 1 will rebound to the surface of the glass substrate 1 without being sucked into the thinner exhaust port 5. Hereinafter, this phenomenon is referred to as thinner splash.
FIG. 5C shows a case where the thinner 6 hits the inside of the end face of the glass substrate 1. In this form, there is no danger of the thinner splash described above, but the resist 2 attached to the end face of the glass substrate 1 is removed. Will be insufficient. FIG. 5
Since the three shapes (a), (b), and (c) are determined by the amount of thinner blown out, the exhaust capacity of the thinner exhaust port, and the relative position between the end surface of the glass substrate 1 and the nozzle table 3, FIG.
In order to approach the ideal shape of (a), the ejection amount of the thinner 6, the exhaust capacity of the thinner exhaust port 5, and the relative position between the end surface of the glass substrate 1 and the nozzle table 3 are adjusted.

[0006]

However, such an arrangement requires a great deal of labor for long-term fine adjustment and confirmation to achieve the ideal shape shown in FIG. 5A. First, in the manufacturing process of a liquid crystal display substrate, a thin film is formed on a mother glass, a resist is applied in a photo process to form a resist pattern, and the thin film is etched to form a thin film pattern.
In order to repeat the process of peeling the resist and forming the next thin film layer several times, the warpage of the glass substrate is slightly different for each process, and the resist coating unit or this film removing unit This is because there is a variation in the regulation of the glass substrate when the glass substrate is transported.

For this reason, the relative position between the end face of the glass substrate 1 and the nozzle table 3 changes, resulting in the shape shown in FIG. 5B or 5C. Second, even if the relative position between the end face of the glass substrate and the nozzle table 3 can be kept constant, the balance between the amount of thinner blown out and the exhaust capability is poor.
FIG. 5B shows a case where the thinner ejection amount is large relative to the exhaust capacity or the exhaust capacity is small relative to the thinner ejection amount. In the case where the ejection amount is small, the shape is as shown in FIG.

As described above, there is a certain relationship between the amount of thinner blown out, the thinner exhausting ability, and the resist removing effect. FIG. 6 is a graph showing the relationship between the amount of thinner blown out and the exhaust capacity and the effect of removing the resist on the end face of the glass substrate in a conventional film removing apparatus for a liquid crystal display substrate.
(A) shows the relationship between the amount of thinner blown out and the effect of removing the resist on the end face of the glass substrate when the exhaust capacity is fixed. The effect of removing the resist on the end face of the glass substrate 1 is more effective as the amount of the thinner blown out is large, but if the amount of the thinner blown out is too large, the thinner splash is generated. On the other hand, if the amount of the thinner blown out is too small, the effect of removing the resist on the end face of the glass substrate 1 becomes insufficient.

FIG. 6B shows the relationship between the exhaust capacity and the effect of removing the resist on the end face of the glass substrate when the amount of thinner blown out is fixed. The smaller the pumping capacity is, the more effective the resist removal of the end face of the glass substrate 1 is. However, if the pumping capacity is too small, thinner splash occurs. On the other hand, if the exhaust capacity is too large, the effect of removing the resist on the end face of the glass substrate 1 will be insufficient. As described above, it is delicate and difficult to adjust the balance between the thinner ejection amount and the exhaust capacity.
Conventionally, operation was performed under condition A as shown in FIGS. For this reason, if the balance between the amount of ejected thinner and the exhaust capacity is lost, thinner spatters are generated, and pattern defects are caused by the dissolution of the resist. As a result, the glass substrate 1
The substrate was transported to the next process with the resist attached because the resist removal effect on the end face of the substrate was insufficient, and the resist was transferred to the substrate setting portion and stage portion of the next process unit, and the equipment was contaminated and transferred. The hardening of the resist causes dust. If dust adheres to the substrate surface before exposure, the dust under exposure becomes a mask during exposure, so that the resist under the dust becomes unexposed and a pattern remains. These pattern deficiencies and remaining patterns result in point defect defects when displayed as a display, which has been a major problem in yield.

The present invention has been made to solve the above-mentioned conventional problems, and it is possible to prevent the occurrence of thinner spatter even on a glass substrate having warpage or variation in regulation, or even when the balance between the amount of thinner spouted and the exhaust capacity is lost. It is an object of the present invention to provide a film removing apparatus for a liquid crystal display substrate which can prevent and effectively remove a harmful film such as a resist film adhered to an end of a glass substrate.

[0011]

According to the present invention, there is provided an apparatus for removing a coating film on a liquid crystal display substrate, comprising: a nozzle table sandwiching an end surface of the glass substrate at a vertical interval; And a plurality of nozzles for jetting a chemical solution for dissolving the coating at different flow rates, wherein the nozzle base is swept in a predetermined direction while sandwiching the end face of the substrate.

According to the present invention, even if there is a warpage of the glass substrate or a variation in the regulation of the glass substrate, or even if the balance between the amount of ejected thinner and the exhaust capacity is lost, the generation of thinner spatter is suppressed and the glass is effectively prevented. Since harmful films such as a resist film adhered to the end face of the substrate can be removed, it is possible to reduce point defect defects generated when displaying as a display, and to greatly improve the yield.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. Note that the same reference numerals are used for the same parts as those of the related art.

FIG. 1 is an explanatory view of a main part of one embodiment of a film removing apparatus for a liquid crystal display substrate according to the present invention, and FIG. 6 is a graph showing the relationship between the amount of thinner blown out and the effect of removing the resist at the end face of the glass substrate when the above condition is satisfied. In FIG. 1, 1 is a glass substrate,
2 is a resist, 7 is a U-shaped first nozzle base, 9
Is a nozzle having a diameter of 0.25 mm which ejects a thinner. The nozzles 9 are installed inside and below the first nozzle base 7 so as to face each other. Reference numeral 8 denotes a U-shaped second nozzle base, and reference numeral 10 denotes a nozzle having a diameter of 0.
It is an 18 mm nozzle. The nozzle 10 is the second nozzle base 8
It is installed in the form of facing each other up and down inside.

In such a configuration, first, the first nozzle base 7 sandwiches the end face of the glass substrate 1 between U-shapes at a predetermined interval, and for example, from the nozzle 9 having a diameter of 0.25 mm, for example, 25 ml / min. While blowing out the thinner at a flow rate of min, the thinner is swept in the direction of the arrow in the figure to swell the resist 2 attached to the end surface of the glass substrate 1.
Next, following the sweep of the first nozzle table 7, the second nozzle table 8 also sandwiches the end face of the glass substrate 1 between U-shapes at a predetermined interval from the nozzle 10 having a diameter of 0.18 mm. For example, by sweeping the thinner at a flow rate of 25 ml / min in the same direction as the first nozzle table 7 at the same speed, the swollen resist 2 on the end face of the glass substrate 1 is removed. This processing is performed on the four sides of the end face portion of the glass substrate 1. In this case, first, a diameter of 0.2
Immediately after the resist 2 is swollen by the thinner spouted from the nozzle 9 having a diameter of 5 mm, the thinner spouted from the nozzle 10 having a diameter of 0.18 mm and having a high flow rate is applied to the swollen resist 2 effectively. The resist 2 attached to the end face of the glass substrate 1 can be removed.
That is, as shown in FIG. 2, in the conventional example, the operation was performed under the condition A. However, in the present embodiment, the operation under the condition B becomes possible. Can be removed. In addition, even if the glass substrate 1 is warped or the glass substrate 1 is unevenly distributed, or if the balance between the amount of thinner spouted and the exhaust capability is lost, the generation of thinner spatter can be suppressed.

As described above, according to this embodiment, immediately after the resist is swollen by the thinner spouted from the 0.25 mm diameter nozzle, the swollen resist is spouted from the 0.18 mm diameter nozzle. By applying the supplied thinner having a high flow rate, the resist adhering to the end face of the glass substrate can be effectively removed. As means for varying the flow rates of the plurality of thinners applied to the resist, in addition to the means for varying the diameters of the plurality of nozzles, the flow rate of the thinner fed to each nozzle may be varied. Means are conceivable.
As described above, the resist adhered to the glass substrate end face can be effectively removed, thereby preventing the contamination of the next step due to the transfer of the substrate to the next step with the resist adhered to the glass substrate end face. be able to. Further, even if there is a warpage of the glass substrate or variation in the regulation of the glass substrate, or even if the balance between the amount of ejected thinner and the exhaust capability is lost, the generation of thinner splash can be suppressed. For this reason, the pattern residue due to dust and the pattern loss due to thinner splash are largely suppressed, so that point defect defects generated when displaying as a display are reduced, and the yield can be greatly improved.

[0017]

As described above, according to the present invention, the occurrence of thinner spatter is suppressed even if the glass substrate is warped or the glass substrate is unevenly distributed, or if the balance between the amount of thinner spouted and the exhaust capacity is lost. However, it is possible to effectively remove the harmful film adhered to the end surface of the glass substrate, to reduce point defect defects generated when displayed as a display, and to greatly improve the yield. An advantageous effect is obtained.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a main part of an embodiment of a film removing apparatus for a liquid crystal display substrate according to the present invention.

FIG. 2 is a graph showing the relationship between the amount of thinner blown out and the effect of removing the resist on the end face of the glass substrate when the pumping capacity is constant in one embodiment of the apparatus for removing a coating film on a liquid crystal display substrate of the present invention.

FIG. 3 is an explanatory view of a main part of a conventional film removing apparatus for a liquid crystal display substrate.

FIG. 4 is a side view of a nozzle base portion during operation of a conventional liquid crystal display substrate film removing apparatus.

FIG. 5 is an explanatory view showing a state of a thinner position during operation of a nozzle base portion of a conventional film removing apparatus for a liquid crystal display substrate.

FIG. 6 is a diagram showing the relationship between the amount of thinner blown out, the exhaust capacity, and the resist removal effect on the end face of the glass substrate in a conventional film removing apparatus for a liquid crystal display substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Resist 3 Nozzle stand 4 Nozzle 5 Thinner exhaust port 6 Thinner 7 First nozzle stand 8 Second nozzle stand 9 Nozzle 10 Nozzle

Claims (2)

[Claims] 1. An apparatus for removing a film adhered to an end face of a glass substrate in a manufacturing process of the liquid crystal display substrate, wherein the apparatus removes a film attached to the end face of the glass substrate. A nozzle base,
A plurality of nozzles disposed on the glass substrate facing surface of the nozzle table and jetting a chemical solution for dissolving the film at different flow rates, wherein the nozzle table sweeps in a certain direction while sandwiching the end surface of the substrate. An apparatus for removing a film on a liquid crystal display substrate. 2. The apparatus according to claim 1, wherein the film adhered to the end face of the glass substrate is a photoresist.