JP2001158961A - Sputtering equipment - Google Patents

Abstract

(57) [Summary] An object of the present invention is to make a sputtered film thickness contributing to use uniform. A vacuum vessel (1) having an exhaust means, a target (7) disposed in the vacuum vessel (1), and a vacuum vessel (1)
A substrate holder 5 for holding an object to be processed and an annular inner moving magnet 3 for generating lines of magnetic force on the target 7.
3, a magnet mechanism 32 including a fixed magnet 34 and an outer moving magnet 35, a vertical drive mechanism 37 for vertically moving a specific ring magnet among the magnets, and a magnet rotation drive motor 46 for rotating the ring magnet. A sputtering apparatus, comprising:

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering apparatus for forming a thin film on a surface of a workpiece such as a disk or a substrate.

[0002]

2. Description of the Related Art As is well known, a sputtering apparatus has a function of, for example, irradiating Ar ions to a target during glow discharge and depositing emitted particles on a disk (or substrate) to form a thin film on the disk. .

Incidentally, in such a sputtering apparatus, a method using a magnet is employed in order to increase the plasma density near the surface of the target and to increase the sputtering efficiency. 6 and 7 show a conventional sputtering apparatus. FIG. 6 is an explanatory view of a main part of the sputtering apparatus, and FIG. 7 is an explanatory view of a magnet rotating mechanism of FIG.

[0004] Reference numeral 1 in the figure denotes a vacuum vessel divided into an unload chamber 2, a load chamber 3, and a sputtering chamber 4. A substrate holder 5 that moves up and down is placed in the vacuum vessel 1.
The substrate 6 and the target (cathode) 7 supported on the substrate are arranged in parallel with each other. The substrate 6 is transported from the unload chamber 2 to the load chamber 3 by the substrate transport mechanism 8. In the vacuum chamber 1, a gas introduction system 9 is connected to the sputtering chamber 4, and a vacuum exhaust system 10 is connected to the load chamber 3.

A magnet rotating mechanism 11 is mounted on the back side of the target 7. Details of the magnet rotating mechanism 11 are as shown in FIG. In FIG. 7, reference numeral 12 denotes a drive motor, and a gear box 13 having a deceleration function is connected to the drive motor 12. The drive motor 12 and the gear box 13 are supported by a plate 14 having an open central portion via an annular base 15.

A rotation base 17 having a cylindrical portion is attached to a central opening of the plate 14 via a bearing 16. An output shaft 18 from the gearbox 13 is connected to a rotation base 17 by a screw (not shown).
Is fixed to the metal fitting 19 mounted on the cylindrical portion of the. A magnet 21 is mounted on the rotation base 17 via a magnet mounting plate 20.

[0007]

By the way, in the conventional sputtering apparatus, the magnet is rotated, the height is increased or decreased, and the target is reduced (erosion).
To make the film thickness of the sputter film formed on the disk and the substrate uniform. However, according to the conventional sputtering apparatus, there is a limit to the uniformity of film formation, and the film thickness in the central portion, which should contribute to the use range, tends to be thicker than in other parts.

The present invention has been made in view of such circumstances, and therefore has a magnet mechanism having at least a triple annular magnet for generating magnetic lines of force on a target, and moves a specific annular magnet among the annular magnets up and down. It is an object of the present invention to provide a sputtering apparatus which can make a sputtered film on a processing object contributed to use uniform by having a structure.

[0009]

According to the present invention, there is provided a vacuum vessel having an exhaust means, a target placed in the vacuum vessel, and a target placed in the vacuum vessel so as to face the target. A substrate holder for holding a processed object, a magnetic mechanism having at least a triple annular magnet that generates magnetic lines of force on the target, and a vertical drive mechanism for vertically moving a specific annular magnet among the annular magnets, A rotating mechanism for rotating the annular magnet.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. In the present invention, as the magnet mechanism,
For example, a vertically moving annular inner moving magnet, a non-vertically moving annular fixed magnet arranged outside the inner moving magnet, and an outer moving fixed magnet arranged outside the fixed magnet and opposite to the inner moving magnet. And an annular outer moving magnet that moves up and down. These magnets rotate together by means of rotary bearings. The magnet may be circular or non-circular, and may be continuous or intermittent.

In the present invention, the up-and-down movement drive mechanism is
A linear motion device such as an air cylinder or a hydraulic cylinder, or a motor feed screw mechanism may be used. For example, in the embodiments described later, an air cylinder and a link mechanism are shown, but a method using two or more air cylinders and not using a link mechanism is also possible.

The operation of the present invention is as follows. Here, a case where the magnet mechanism is formed of a triple annular magnet (a case where the magnet mechanism is formed of an inner moving magnet, a fixed magnet, and an outer moving magnet from the inside) will be described as an example. That is, in this case, an intermediate fixed magnet, for example, an N pole is used. Further, the inner moving magnet and the outer moving magnet can be alternately moved up and down, and this is set as the S pole.

Lines of magnetic force run from the N pole of the fixed magnet to the S pole of the inner moving magnet and the outer moving magnet. Here, when the inner moving magnet is lowered and the outer moving magnet is raised, the part with the strong magnetic field lines formed inside approaches the target, and the part with the strong magnetic lines formed outside moves away from the target. Then, in the target, the magnetic field lines on the inner side are strengthened. At this time, when sputtering is performed, the plasma is concentrated on the inner side, the erosion on the inner side increases, and the film thickness on the disk (or substrate) increases on the inner side.

Conversely, when the inner moving magnet is raised and the outer moving magnet is lowered, the outer sputtered film becomes thicker. If this is performed in both cases, the film thicknesses of the sputtered films become uniform because they are offset. A more uniform film thickness can be obtained by controlling the sputtering time when the inside is strengthened and the sputtering time when the outside is strengthened. The sputter may be intermittent on the inside and the outside, or may be continuous sputter.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A sputtering apparatus according to one embodiment of the present invention will be described below with reference to FIGS. Here, FIG. 1 is a schematic overall view of a sputtering apparatus according to the present embodiment, FIG. 2 is an explanatory view in a case where an inner moving magnet, which is a configuration of the sputtering apparatus, is lowered and inner erosion occurs, and FIG. FIG. 3 is an explanatory diagram showing a case where an outer erosion occurs due to a lowering of an outer moving magnet of the apparatus. However, FIG.
The same members as (conventional) are denoted by the same reference numerals and description thereof is omitted.

Reference numeral 31 in the figure denotes an upper cover provided in the sputtering chamber 4 of the vacuum vessel 1.

A magnet mechanism 32 is arranged on the upper lid 31 above the target 7. The magnet mechanism 32 includes an annular inner moving magnet 33 arranged near the target 7, an annular fixed magnet 34 arranged outside the inner moving magnet 33,
And a ring-shaped outer moving magnet 35 disposed outside of the magnet.

The inner moving magnet 33 includes a vertical linear motion shaft 36.
It can be moved up and down by an up-down drive mechanism 37 connected via. The annular fixed magnet 34 is attached to a lower portion of the fixed column 38 so as to rotate but not move up and down. Also, the outer moving magnet 35
The vertical linear motion shaft 4 is connected to a fixed support 38, a link 39 and the like.
0, and moves up and down with the fixed support 38 as a fulcrum. That is, if the inner moving magnet 33 moves upward, the outer moving magnet 35 moves downward, and the inner moving magnet 3 moves.
When 3 moves down, the outer moving magnet 35 moves up.

The upper and lower linear motion shafts 36 and 40 pass through a plate 42 disposed between the side walls of the upper lid 31 via a rotary bearing 41. The vertical translation shaft 3 at the lower part of the plate 42
Linear motion bearings 43 and 44 are attached to 6 and 40, respectively. A ring 45 having a biting portion on the outer peripheral side surface is fixed on the plate 42. This ring 45
Is engaged with a gear 47 connected to a magnet rotation drive motor 46. Here, the ring 45 and the plate 42 are respectively rotated by the magnet rotation drive motor 46, whereby the inner moving magnet 33, the fixed magnet 34, and the outer moving magnet 35 are rotated.
Is designed to rotate. Reference numeral 48 in the drawing indicates a tubular body disposed on the upper lid 31, and reference numeral 49 indicates an upper plate provided on the tubular body 48 and on which the vertical drive mechanism 37 is mounted.

The operation of the sputtering apparatus having such a configuration is as follows. Note that the intermediate fixed magnet 34 has, for example, an N pole, and the inner moving magnet 33 and the outer moving magnet 35 have, for example, S poles.

First, lines of magnetic force run from the N pole of the fixed magnet 34 to the S pole of the inner moving magnet 33 and the outer moving magnet 35. Here, the inner moving magnet 33 is lowered as shown in FIG.
When the outer moving magnet 35 is raised, the magnetic field lines 50 formed on the inner side
The part with strong a approaches the target 7, and the part with strong magnetic lines of force 50 b formed outside moves away from the target 7. Then, in the target 7, the inner magnetic field lines 50a are strengthened,
If sputtering is performed at this time, the plasma concentrates on the inside and the erosion on the inside increases, and the thickness of the sputtered film 51 on the disk (or substrate) 6 increases on the inside (see FIG. 2B).

Conversely, as shown in FIG. 3A, when the inner moving magnet 33 is raised and the outer moving magnet 35 is lowered, the outer sputtered film 51 becomes thicker. If you do this in both,
As a result, the thickness of the sputtered film 51 becomes uniform except for the central portion of the disk 6, as shown in FIG.

According to the above embodiment, the inner movable magnet 33, the outer movable magnet 35, and the fixed magnet 34 which move up and down in conjunction with each other.
And a vertical drive mechanism 37 for vertically moving the inner moving magnet 33 and the outer moving magnet 35, and each of the magnets 33, 34 and 35
Is provided with a magnet rotation drive motor 46 for rotating the disk, thereby controlling the magnitude of erosion due to the lines of magnetic force 50 on the outside and inside of the disk (or substrate) 6, thereby forming a sputter film 51 formed on the disk 6. As shown in FIG. 4, it can be formed uniformly except for the central portion other than the range of use.

In the above embodiment, the spatter time when the inner side of the disk (or the substrate) is strengthened and the sputter time when the outer side is strengthened are not controlled, but by controlling these times, A more uniform film thickness can be obtained.

Further, in the above embodiment, the case where the magnet mechanism is constituted by the triple annular magnet of the inner moving magnet, the fixed magnet and the outer moving magnet has been described. However, the present invention is not limited to this. For example, FIG. As described above, the annular first and second inner moving magnets 52 and 53 and the inner moving magnets 5
The first and second inner moving magnets 52 and 53 may be arranged outside of the first and second inner magnets 53 and 53.
However, any of the magnets 52 to 55 can be moved up and down. Specifically, the first and second inner moving magnets 52, 53
Move up and down, the first and second outer moving magnets 54 and 55
Moves up and down opposite to the magnets 52 and 53.

[0026]

As described above in detail, according to the present invention, there is provided a magnet mechanism having at least a triple annular magnet for generating magnetic lines of force on a target, and a specific annular magnet among the annular magnets is moved up and down. With this configuration, it is possible to provide a sputtering apparatus capable of uniforming a sputtered film on a substrate or a disk that contributes to use.

[Brief description of the drawings]

FIG. 1 is a schematic overall view of a sputtering apparatus according to one embodiment of the present invention.

FIG. 2 is an explanatory view of a case where an inner moving magnet, which is one configuration of the apparatus, moves downward in the apparatus of FIG. 1;

FIG. 3 is an explanatory view of a case where an outer moving magnet which is one configuration of the apparatus in FIG. 1 is moved downward;

FIG. 4 is an explanatory diagram showing a state of a film thickness distribution of a sputtered film when both the states shown in FIGS. 2B and 3B are combined.

FIG. 5 is an explanatory view of an annular magnet for sputtering according to another embodiment of the present invention.

FIG. 6 is a schematic diagram of a conventional sputtering apparatus.

FIG. 7 is an explanatory view of a magnet rotating mechanism part of the apparatus of FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Vacuum container, 2 ... Unloading chamber, 3 ... Loading chamber, 4 ... Sputtering chamber, 5 ... Substrate holder, 6 ... Disk (or substrate), 7 ... Target, 8 ... Substrate transfer mechanism, 9 ... Gas introduction system, DESCRIPTION OF SYMBOLS 10 ... Vacuum exhaust system, 31 ... Top lid, 32 ... Magnet mechanism, 33, 52, 53 ... Inside moving magnet, 34 ... Fixed magnet, 35, 54, 55 ... Outside moving magnet, 36, 40 ... Vertical linear motion shaft, 37: vertical drive mechanism, 38: fixed support, 46: magnet rotation drive motor, 50, 50a, 50b: magnetic lines 51: sputtered film.

Claims (2)

[Claims] 1. A vacuum vessel having an exhaust means, a target placed in the vacuum vessel, and a substrate for holding an object to be processed, placed in the vacuum vessel so as to face the target. A holder, a magnet mechanism having at least a triple annular magnet for generating lines of magnetic force on the target, a vertical drive mechanism for vertically moving a specific annular magnet among the annular magnets, and a rotating mechanism for rotating the annular magnet A sputtering apparatus comprising: 2. The apparatus according to claim 1, wherein the magnet mechanism includes a vertically moving annular inner moving magnet, a non-vertically moving annular fixed magnet disposed outside the inner moving magnet, and an outer side of the fixed magnet. The sputtering apparatus according to claim 1, further comprising an annular outer moving magnet that is arranged and moves up and down in reverse to the inner moving magnet.