JP2001150462A - Molded body peeling method - Google Patents
Molded body peeling methodInfo
- Publication number
- JP2001150462A JP2001150462A JP33975599A JP33975599A JP2001150462A JP 2001150462 A JP2001150462 A JP 2001150462A JP 33975599 A JP33975599 A JP 33975599A JP 33975599 A JP33975599 A JP 33975599A JP 2001150462 A JP2001150462 A JP 2001150462A
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- release layer
- plate
- mold
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 238000007664 blowing Methods 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 229920005990 polystyrene resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 27
- 239000007789 gas Substances 0.000 description 30
- 239000000463 material Substances 0.000 description 22
- 238000005259 measurement Methods 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 11
- 239000003566 sealing material Substances 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 9
- 239000002904 solvent Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 239000007921 spray Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- -1 acrylate compound Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920006127 amorphous resin Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 101150059062 apln gene Proteins 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- FEKRGEXVMOWHGD-UHFFFAOYSA-N decane;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.CCCCCCCCCC FEKRGEXVMOWHGD-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- MZRQZJOUYWKDNH-UHFFFAOYSA-N diphenylphosphoryl-(2,3,4-trimethylphenyl)methanone Chemical compound CC1=C(C)C(C)=CC=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MZRQZJOUYWKDNH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 230000035876 healing Effects 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
(57)【要約】
【課題】 溥厚な成形体を、成形型から容易に剥離する
ことができる成形体の剥離方法を提供する。
【解決手段】 一対の剥離層を設けた板状成形型を、剥
離層を内面とし所定間隔をおいて対向させると共に周辺
部をシールしてキャビティーが形成される成形型を用
い、該キャビティーに液状樹脂を注入し、液状樹脂を硬
化させ成形体を製造し、次いで、成形型を型開きし、型
開きした板状成形型に剥離層を介して密着している成形
体を剥離する方法であって、成形体、剥離層、板状成形
体の周辺端部厚み方向面の少なくとも一方向より、板状
成形型との密着側の成形体と剥離層の境界に、あるい
は、剥離層と板状成形体の少なくとも一つ以上の境界
に、気体を吹きつけて成形体を板状成形型から剥離する
ことを特徴とする成形体の剥離方法。(57) [Problem] To provide a method of peeling a molded article capable of easily peeling a thick molded article from a molding die. SOLUTION: A plate-shaped mold provided with a pair of release layers is opposed to each other at a predetermined interval with the release layer as an inner surface, and a peripheral part is sealed to form a cavity. A method of injecting a liquid resin into the mold, curing the liquid resin to produce a molded body, then opening the mold, and peeling the molded body in close contact with the opened plate-shaped mold via a release layer. A molded body, a release layer, from at least one direction of the peripheral end portion thickness direction surface of the plate-shaped molded body, at the boundary between the molded body and the release layer on the close contact side with the plate-shaped mold, or with the release layer A method for peeling a molded article, comprising blowing a gas onto at least one or more boundaries of the plate-shaped molded article to peel the molded article from the plate-shaped molding die.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液状原料を硬化さ
せて樹脂シートを製造する場合、例えば、光硬化性樹脂
シートの製造に利用されるものである。詳しくは、本発
明は、成形した、薄い厚みのシート状成形体を、成形型
から容易に剥離することができる成形体の剥離方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for producing a resin sheet by curing a liquid material, for example, for producing a photocurable resin sheet. More specifically, the present invention relates to a method of peeling a molded article, which can easily peel a molded thin sheet-shaped molded article from a mold.
【０００２】[0002]
【従来の技術】光硬化性樹脂から薄い厚みのシート状成
形体を成形する方法として、従来、成形型のキャビティ
ーに光硬化性樹脂の原料溶液を注入し、硬化させた後、
成形型を型開きし、成形型と成形体を剥離している。こ
の成形体を成形型から剥離する場合、成形型に密着した
成形体の端部境界面に鋭利なヘラ等を差し込み、成形型
から成形体の端部境界面の一部あるいは全面を浮き上が
らせ、その部分を利用して剥離する方法が通常は考えら
れる。また、成形型のキャビティーに加圧気体を吹き込
みながら型開きすると同時に、あるいは型開き後成形体
の周辺より加圧気体を吹きつけ成形体を剥離する方法も
提案されている（特開平６−１３４７７４）。2. Description of the Related Art Conventionally, as a method of molding a sheet-like molded article having a small thickness from a photocurable resin, a raw material solution of a photocurable resin is injected into a cavity of a molding die, and then cured.
The mold is opened, and the mold and the molded body are separated. When peeling the molded body from the molding die, insert a sharp spatula or the like into the end boundary surface of the molded body in close contact with the molding die, and lift a part or the whole of the end boundary surface of the molded body from the molding die, A method of peeling using the portion is usually considered. Also, a method has been proposed in which the mold is opened while blowing the pressurized gas into the cavity of the molding die, or at the same time, after the mold is opened, the pressurized gas is blown from the periphery of the molded body to peel off the molded body (Japanese Patent Laid-Open No. Hei 6-1994). 134774).
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記の
成形型に密着した成形体の端部境界面に鋭利なヘラ等を
差し込むことは容易ではなく、また薄い厚みの場合ヘラ
等を差し込んだ際に成形体にクラックを生じ割れの原因
となる。また、この作業は熟練の手作業に頼るしかな
く、機械化による連続製造は困難である。また、上記の
特開平６−１３４７７４に記載の方法では、薄い厚みの
シート状成形体を成形する場合には加圧気体を吹き込む
キャビティーが狭くなり型開きに必要な力が得にくくな
る。また、成形体の剥離には成形型と成形体との線膨張
係数の差を利用しているため、均一に冷却する必要があ
るが、キャビティーが狭くなることで成形体を均一に冷
却することが難しくなるため、成形体にクラックが生じ
易くなる。これを防ぐためには冷却を徐々に行う必要が
あり、成形体を取り出す時間が長くなる問題がある。However, it is not easy to insert a sharp spatula or the like into an end boundary surface of the molded body which is in close contact with the above-described mold, and when the spatula or the like is inserted when the thickness is small. Cracks occur in the molded body, causing cracks. In addition, this operation depends only on skilled manual operations, and continuous production by mechanization is difficult. Further, in the method described in JP-A-6-134774, when forming a thin sheet-like molded product, the cavity into which the pressurized gas is blown becomes narrow, and it becomes difficult to obtain the force required for opening the mold. Also, since the difference in the coefficient of linear expansion between the molding die and the molded body is used to separate the molded body, it is necessary to cool the molded body uniformly, but the cavity is narrowed to cool the molded body uniformly. This makes it difficult to crack the molded body. In order to prevent this, it is necessary to gradually cool, and there is a problem that the time for taking out the molded body becomes long.
【０００４】以上のような問題は、成形体の厚さが薄い
場合、また、成形体の面積が大きい場合に特に顕著であ
る。そこで、本発明の課題は、成形体、特に厚みの薄い
シート状の成形体の成形型からの剥離が容易な方法であ
って、且つ、機械化も容易である成形体の剥離方法を提
供することにある。[0004] The above problems are particularly remarkable when the thickness of the molded article is small or when the area of the molded article is large. Therefore, an object of the present invention is to provide a method for easily peeling a molded article, particularly a thin sheet-shaped molded article from a mold, and a method for peeling a molded article that is easy to mechanize. It is in.
【０００５】[0005]
【課題を解決するための手段】かかる本発明は、一対の
剥離層を設けた板状成形型を、剥離層を内面とし所定間
隔をおいて対向させると共に周辺部をシールしてキャビ
ティーが形成される成形型を用い、該キャビティーに液
状樹脂を注入し、液状樹脂を硬化させ成形体を製造し、
次いで、成形型を型開きし、型開きした板状成形型に剥
離層を介して密着している成形体を剥離する方法であっ
て、成形体、剥離層、板状成形体の周辺端部厚み方向面
の少なくとも一方向より、板状成形型との密着側の成形
体と剥離層の境界に、あるいは、剥離層と板状成形体の
少なくとも一つ以上の境界に、気体を吹きつけて成形体
を板状成形型から剥離することを特徴とする成形体の剥
離方法である。According to the present invention, a cavity is formed by opposing a plate-shaped mold provided with a pair of release layers at a predetermined interval with the release layer as an inner surface and sealing the peripheral portion. Using a molding die to be injected with liquid resin into the cavity, the liquid resin is cured to produce a molded body,
Then, the mold is opened, and a method of peeling off the molded body that is in close contact with the opened plate-shaped mold via a release layer, comprising: a molded body, a release layer, and a peripheral end portion of the plate-shaped molded body. From at least one direction of the thickness direction surface, at the boundary between the molded body and the release layer on the close contact side with the plate-shaped mold, or at least one boundary between the release layer and the plate-shaped molded body, by blowing gas. This is a method for separating a molded body, comprising separating the molded body from a plate-shaped mold.
【０００６】[0006]
【発明の実施の形態】以下、本発明について更に詳細に
説明する。本発明に用いられる成形型１は、図１に示す
ように、一対の板状成形型２ａ、２ｂを所定の間隔をお
いて対向せしめ、その周辺部をシール材３でシールす
る。板状成形型２ａ、２ｂは、図に示すように平板とす
るほか、目的に応じて湾曲又は波形状の板状体に賦形す
ることができる。また、内面のみに波型、グレーティン
グレンズ構造等の物品形状又は模様等を付すこともでき
る。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail. As shown in FIG. 1, a molding die 1 used in the present invention has a pair of plate-like molding dies 2 a and 2 b opposed to each other at a predetermined interval, and a peripheral portion thereof is sealed with a sealing material 3. The plate-shaped molds 2a and 2b can be formed into a curved or corrugated plate according to the purpose, in addition to a flat plate as shown in the figure. Also, an article shape or pattern such as a corrugated or grating lens structure can be provided only on the inner surface.
【０００７】板状成形型２ａ、２ｂの材料は、用いる液
状樹脂を硬化させる条件に耐えうるもであればよく、例
えば、少なくとも一方は活性エネルギー線が透過し、熱
又は溶媒によって容易にその形状が変形しない材料が用
いられ、例えば、ガラス及びアクリル樹脂板等のプラス
チック板等が用いることができるが、これに限定するも
のではない。他方の板状成形型は同一材料であってもよ
く、また、金属板等の活性エネルギー線を透過しない材
料であってもよい。The material of the plate-shaped molds 2a and 2b may be any material that can withstand the conditions for curing the liquid resin to be used. For example, at least one of the materials is capable of transmitting active energy rays and is easily shaped by heat or a solvent. A material that does not deform is used. For example, glass and a plastic plate such as an acrylic resin plate can be used, but the material is not limited thereto. The other plate-shaped mold may be the same material, or may be a material that does not transmit active energy rays, such as a metal plate.
【０００８】対向して設けられた板状成形型２ａ、２ｂ
の周縁部をシールするシール材３の材料は、用いる液状
樹脂や使用溶媒、硬化させるための条件、例えば、活性
エネルギー線、熱等に耐え、容易にその形状が変形しな
い材料や液状樹脂にシール材の成分が溶け出さない材料
が用いられ、これら条件を満たすものであれば特に制約
されることはなく、通常は、ゴム、プラスチック、金属
等を用いられる。また、シール材３は、厚手のものを使
用すれば板状成形型２ａ、２ｂの間隔を規制するスペー
サーとしての作用をするが、必要に応じて板状成形型２
ａ、２ｂの間にスペーサー（図示せず）を介装しシール
材としてテープ等を用いることができる。[0008] Oppositely provided plate-shaped molds 2a, 2b
The material of the sealing material 3 for sealing the peripheral portion of the sealing material is a liquid resin used, a solvent used, a condition for curing, for example, a material or a liquid resin which withstands an active energy ray, heat, etc. and whose shape is not easily deformed. There is no particular limitation as long as a material that does not dissolve the components of the material is used and the material satisfies these conditions. Usually, rubber, plastic, metal or the like is used. If a thick seal material 3 is used, it acts as a spacer for regulating the interval between the plate-shaped molds 2a and 2b.
A spacer (not shown) is interposed between a and 2b, and a tape or the like can be used as a sealing material.
【０００９】本発明に用いる板状成形型２ａ、２ｂは、
その内面に剥離層４ａ、４ｂが形成されている。用いら
れる剥離層は、液状樹脂が硬化する条件、例えば活性エ
ネルギー線や熱、硬化時に発生する熱等により容易にそ
の形状を変形しないものであって、且つ、用いる液状樹
脂に溶け出す等により、成形中に剥離層としての機能を
失わないものが用いられる。例えば、液状樹脂に光硬化
性樹脂を用いる場合、板状成形型２ａ、２ｂの少なくと
も一方に用いられる剥離層は、光硬化性樹脂を硬化させ
るのに充分な活性エネルギー線を透過する材料が望まし
い。この目的に適する材料としては、ポリスチレン系樹
脂、環状ポリオレフィン系樹脂等の非晶性樹脂等で光硬
化性樹脂との接着性の低い熱可塑性樹脂を用いることが
できる。ポリスチレン系樹脂としてはスチレン、ジメチ
ルスチレン、ｏーメチルスチレン、ｍ−メチルスチレン
よりなる単独重合体および共重合体が挙げられ、環状ポ
リオレフィン系樹脂としては、日本ゼオン（株）製の商
品名「ゼオネックス」、三井石油化学（株）製の商品名
「アペル」等が挙げられる。また、その他の非晶性樹脂
としては、ポリカーボネート、ポリアリレート、ポリエ
ーテルスルフォン等が挙げられる。更に、パラフィン、
ゼラチン等熱によって溶融若しくは軟化する物質、又は
溶媒によって容易に溶解又は膨潤し得る材料を用いるこ
とができる。The plate-shaped molds 2a and 2b used in the present invention are:
On its inner surface, release layers 4a and 4b are formed. The release layer used is one that does not easily deform its shape due to the conditions under which the liquid resin cures, for example, active energy rays and heat, heat generated during curing, and dissolves in the liquid resin used. A material that does not lose its function as a release layer during molding is used. For example, when a photocurable resin is used as the liquid resin, the release layer used for at least one of the plate-shaped molds 2a and 2b is preferably made of a material that transmits active energy rays sufficient to cure the photocurable resin. . As a material suitable for this purpose, a thermoplastic resin having low adhesion to a photocurable resin such as an amorphous resin such as a polystyrene resin and a cyclic polyolefin resin can be used. Examples of the polystyrene-based resin include homopolymers and copolymers composed of styrene, dimethylstyrene, o-methylstyrene, and m-methylstyrene. Examples of the cyclic polyolefin-based resin include ZEONEX (trade name, manufactured by Zeon Corporation) "Apel" (trade name) manufactured by Mitsui Petrochemical Co., Ltd. and the like. Examples of other amorphous resins include polycarbonate, polyarylate, polyethersulfone, and the like. Furthermore, paraffin,
A substance that can be melted or softened by heat, such as gelatin, or a material that can be easily dissolved or swelled by a solvent can be used.
【００１０】剥離層４ａ、４ｂの形成方法としては、 １）剥離層形成材料をフィルム又はシート状に成形して
これを板状成形型２ａ、２ｂの内面に添着、または接着
剤によって接着する方法、 ２）剥離層形成材料を溶融して板状成形型２ａ、２ｂ内
面にコートする方法、 ３）剥離層形成材料を溶媒等に溶解した溶液をスピンコ
ーター、バーコーター等の塗布装置により塗布後硬化す
る方法 ４）剥離層形成材料の溶融物もしくは溶媒等に溶解した
溶液の中に浸漬させ、取り出した後硬化する方法、 ５）紫外線を照射した後その粘着力が低下する接着剤を
塗布したフイルム例えば接着剤付ＰＥＴフイルムをラミ
ネーターで板状成形型に貼り付け剥離層として用いる方
法、 等が挙げられるがこれらに限定されるものではない。ま
た、いずれの方法においても剥離層を均一になるように
形成するようにする。必要に応じて板状成形型２ａ、２
ｂの内面に離型剤を塗布することもできる。The method of forming the release layers 4a and 4b is as follows: 1) A method of forming a release layer forming material into a film or a sheet and attaching the material to the inner surfaces of the plate-like molds 2a and 2b or bonding them with an adhesive. 2) a method in which the material for forming the release layer is melted and coated on the inner surfaces of the plate-shaped molds 2a and 2b; 3) a solution obtained by dissolving the material for forming the release layer in a solvent or the like is applied by a coating device such as a spin coater or a bar coater. Method of curing 4) A method of immersing in a melt of a release layer forming material or a solution dissolved in a solvent, etc., taking out and curing, 5) Applying an adhesive whose adhesive strength is reduced after being irradiated with ultraviolet rays A method in which a film such as a PET film with an adhesive is adhered to a plate-shaped mold with a laminator and used as a release layer, etc., is not limited thereto. In any method, the release layer is formed to be uniform. If necessary, the plate-shaped mold 2a, 2
A release agent can be applied to the inner surface of b.
【００１１】剥離層４ａ、４ｂの厚さは、成形体を容易
に剥離が行える範囲であって、通常２０μｍ以下、好ま
しくは１〜１０μｍである。成形体を剥離する前の状態
が、例えば板状成形体２ｂ／剥離層４ｂ／成形体７／剥
離層４ａの構成で、板状成形体２ｂ／剥離層４ｂあるい
は剥離層４ｂ／成形体７の境界に気体を吹き付け成形体
７を剥離すると、剥離層４ｂ／成形体７／剥離層４ａ又
は成形体７／剥離層４ａの構成となるが、成形体７表面
の保護のため、成形体７には剥離膜４ａ、４ｂを密着さ
せておくのが良い。しかしながら、スペーサー３をシー
ル材として用いた場合、成形体７は板状成形型及び剥離
層の端面よりも内側に入り（図２参照）、成形体７表面
の保護のため剥離膜４ａ、４ｂを密着させた状態での剥
離が困難となる場合がある。剥離層の厚みを１μｍより
薄くすると、気体の吹き付け圧力により剥離層が成形体
の端部付近から破れ成形体に剥離層が密着した状態で剥
離できる（図３参照）。また、この剥離層の厚みが２０
μｍを超えると剥離層の強度が強くなり過ぎて上記のよ
うな剥離が困難となることがあるので好ましくない。
また、板状成形型と剥離層の密着強度は、型開きや成形
体の剥離が容易にできる程度の範囲を対象とし、通常
０．０１〜０．２Ｎ／25mmの範囲である。The thickness of the release layers 4a and 4b is within a range where the molded body can be easily released, and is usually 20 μm or less, preferably 1 to 10 μm. The state before the peeling of the molded body is, for example, a configuration of the plate-like molded body 2b / the peeling layer 4b / the molded body 7 / the peeling layer 4a, and the plate-like molded body 2b / the peeling layer 4b or the peeling layer 4b / the molded body 7 is formed. When the gas is blown to the boundary and the molded body 7 is peeled off, the structure of the peeling layer 4b / the molded body 7 / the peeling layer 4a or the molded body 7 / the peeling layer 4a is formed. It is preferable that the peeling films 4a and 4b are adhered to each other. However, when the spacer 3 is used as a sealing material, the molded body 7 enters inside the end faces of the plate-shaped molding die and the release layer (see FIG. 2), and the release films 4a and 4b are protected to protect the surface of the molded body 7. In some cases, peeling in the state of being in close contact may be difficult. When the thickness of the release layer is less than 1 μm, the release layer is torn from the vicinity of the end of the molded body by the blowing pressure of the gas and can be peeled off in a state where the release layer is in close contact with the molded body (see FIG. 3). The thickness of the release layer is 20
If the thickness exceeds μm, the strength of the release layer becomes too strong, and the above-described release may be difficult, which is not preferable.
The adhesion strength between the plate-shaped mold and the release layer covers a range in which the mold can be easily opened and the molded body can be easily peeled, and is usually in the range of 0.01 to 0.2 N / 25 mm.
【００１２】こうして得られた成形型１を用いて対向す
る板状成形型２ａ、２ｂと剥離層４ａ、４ｂ、シール材
３で作られたキャビティー５に液状樹脂を注入し、活性
エネルギー線又は熱等により液状樹脂を硬化させ成形体
とする。この際、必要に応じて成形型１を加熱あるいは
冷却することができる。このときの成形体の厚みは、通
常０．１〜３ｍｍ程度である。Using the mold 1 thus obtained, a liquid resin is injected into the cavity 5 formed by the plate-like molds 2a and 2b facing each other, the release layers 4a and 4b, and the sealing material 3, and the active energy rays or The liquid resin is cured by heat or the like to form a molded body. At this time, the mold 1 can be heated or cooled as needed. The thickness of the molded body at this time is usually about 0.1 to 3 mm.
【００１３】本発明に用いられる液状樹脂の例として、
紫外線等の活性エネルギー線の照射によって硬化する光
硬化性樹脂が用いられる。例えば、ラジカル反応性不飽
和結合を有するアクリレート化合物よりなる樹脂組成
物、ラジカル反応性不飽和結合を有するアクリレート化
合物とチオール基を有するメルカプト化合物よりなる樹
脂組成物、エポキシアクリレート、ウレタンアクリレー
ト、ポリエステルアクリレート、ポリエーテルアクリレ
ート等のオリゴマーを多官能アクリレートモノマーに溶
融せしめた樹脂組成物等が挙げられるがこれに限定する
ものではない。一般に、これら光硬化性樹脂は活性エネ
ルギー線によってラジカルを発生する光重合開始剤の存
在下に使用される。活性エネルギー線は、用いる液状硬
化性樹脂を硬化させるものであればよく、例えば、紫外
線等が挙げられる。As an example of the liquid resin used in the present invention,
A photocurable resin that is cured by irradiation with active energy rays such as ultraviolet rays is used. For example, a resin composition comprising an acrylate compound having a radical-reactive unsaturated bond, a resin composition comprising an acrylate compound having a radical-reactive unsaturated bond and a mercapto compound having a thiol group, epoxy acrylate, urethane acrylate, polyester acrylate, Examples include, but are not limited to, resin compositions in which oligomers such as polyether acrylate are melted into polyfunctional acrylate monomers. Generally, these photocurable resins are used in the presence of a photopolymerization initiator that generates radicals by active energy rays. The active energy ray may be any as long as it cures the liquid curable resin to be used, and examples thereof include ultraviolet rays.
【００１４】その後、成形型の型開き方法としては、板
状成形型２ａの板状成形型２ｂをそれぞれ真空吸着、又
は機械的に固定し引き離し力を加えて型開きする方法
や、板状成形型２ａ、２ｂと剥離層４ａ、４ｂあるいは
剥離層４ａ、４ｂとスペーサー３との間、型開き前にス
ペーサー３を除去していた場合は剥離層４ａ、４ｂの間
にヘラ、爪状の治具を挿入しこじる等により型開きする
方法があるが、これに限定するものではない。また、ス
ペーサー３をシール材として用いた場合には、成形体７
へのクラック発生防止等より、成形型１の型開き前ある
いは成形型７の剥離を行う前に取り除いておく方が望ま
しい。更に、型開きを効率よく行うための処理、例えば
成形型の加温、型開きから成形体取り出しまでの間の保
温、加温等を行ってもよい。After that, as a method of opening the molds, a method of opening the molds by vacuum suction or mechanically fixing the plate-like molds 2b of the plate-like molds 2a or mechanically fixing them and applying a separating force, or a method of opening the molds is used. Spatula and claw-shaped healing between the molds 2a and 2b and the release layers 4a and 4b or between the release layers 4a and 4b and the spacer 3 or between the release layers 4a and 4b when the spacer 3 is removed before opening the mold. There is a method of opening the mold by inserting and kneading a tool, but the method is not limited to this. When the spacer 3 is used as a sealing material, the molded product 7
In order to prevent the occurrence of cracks in the mold, it is preferable to remove the mold before opening the mold 1 or before peeling the mold 7. Further, a process for efficiently opening the mold, for example, heating of the mold, heat retention and heating from the mold opening to the removal of the molded body may be performed.
【００１５】成形体１を型開きした場合、型開きと同時
に成形体７の少なくとも一方に剥離層が密着した状態で
板状成形型２ａ、２ｂより剥離する場合もあるが、ほと
んどの場合、板状成形型２ａ、２ｂのどちらか一方に剥
離層を介して密着している。この時板状成形型に密着し
ていない面には剥離層がない場合もある。剥離層を介し
て、板状成形型２ａ，または２ｂに密着した成形体７を
剥離する方法は、成形体、剥離層、板状成形体の周辺端
部厚み方向面の少なくとも一方向から、吹き付け部が成
形体と剥離層の境界、あるいは、剥離層と板状成形体の
少なくとも一つ以上の境界に、気体を吹きつけて成形体
を板状成形型から剥離する（図５、６参照）。例えば、
型開き後板状成形体２ｂ／剥離層４ｂ／成形体７／剥離
層４ａの形態をとっていた場合の気体を吹きつける境界
としては、板状成形体２ｂ／剥離層４ｂ、あるいは剥離
層４ｂ／成形体７の少なくとも一つ以上の境界である。
そして、気体を吹きつける範囲が、吹き付け方向に面す
る成形体の大きさ以上に気体を吹きつけることが好まし
い。When the molded body 1 is opened, the mold may be peeled off from the plate-like molding dies 2a and 2b at the same time as the mold is opened, with the release layer being in close contact with at least one of the molded bodies 7. It is in close contact with one of the molds 2a, 2b via a release layer. At this time, there is a case where a release layer is not provided on a surface which is not in close contact with the plate-shaped mold. The method of peeling the molded body 7 in close contact with the plate-shaped molding die 2a or 2b via the peeling layer is performed by spraying from at least one direction of the thickness direction surface of the molded body, the release layer, and the peripheral edge of the plate-shaped molded body. The part is peeled from the plate-shaped mold by blowing gas to the boundary between the molded body and the release layer or at least one boundary between the release layer and the plate-shaped molded body (see FIGS. 5 and 6). . For example,
In the case of taking the form of the plate-shaped formed body 2b / release layer 4b / formed body 7 / release layer 4a after opening the mold, the boundary at which gas is blown is the plate-shaped formed body 2b / release layer 4b or release layer 4b. / At least one or more boundaries of the molded body 7.
Then, it is preferable that the range in which the gas is blown be such that the gas is blown to a size equal to or larger than the size of the molded body facing the spraying direction.
【００１６】また、吹き付ける気体の吹き付け角度Ｒ
は、成形体７と剥離層を介在した板状成形型との密着面
の端部境界面８を水平方向に延長した面９を基準とし、
通常３°以上から７０°以下、好ましくは５°以上か
ら６０°以下である（図４、５参照）。３°より小さい
場合、及び７０°より大きい場合は、気体が境界８ある
いは１０に当たりにくく気体の吹きつけ圧力を効率よく
利用できず剥離が起こりにくくなるので好ましくない。
また、剥離効率が低下して気体吹き付け時間が必要以上
に長くなると、成形体、剥離層、板状成形型の温度が高
温の場合、気体吹き付けによりる成形体に温度斑が生じ
割れの原因となるので注意を要する。The blowing angle R of the gas to be blown is
Is based on a surface 9 extending in a horizontal direction from an end boundary surface 8 of a contact surface between the molded body 7 and a plate-shaped mold having a release layer interposed therebetween,
It is usually from 3 ° to 70 °, preferably from 5 ° to 60 ° (see FIGS. 4 and 5). If the angle is smaller than 3 ° or larger than 70 °, the gas hardly hits the boundary 8 or 10, so that the gas blowing pressure cannot be used efficiently and the separation hardly occurs.
Also, if the gas spraying time becomes longer than necessary due to a decrease in the peeling efficiency, the temperature of the molded body, the peeling layer, and the plate-shaped mold is high, and the temperature unevenness of the molded body due to the gas spraying causes cracks. Be careful as it becomes.
【００１７】気体の吹き付け方法は、成形体と剥離層の
境界あるいは剥離層と板状成形体の境界に気体の吹き付
け圧力を効率よく加えることができれば特に制限はな
く、例えば、エアーナイフ、平行スリットノズル、小径
のパイプ等を平行に並べたノズル等が挙げられる（図
６、７参照）。成形体と剥離層の境界あるいは剥離層と
板状成形体の境界から気体吹き出し部までの距離は特に
限定しないが、できるだけ境界面に近づけた方がより効
率よく剥離できる。また、吹き付け気体は、成形体、剥
離層、板状成形体等に影響を及ぼさない非反応性の気体
であればよく、空気、酸素、窒素、炭酸ガス、アルゴン
ガス等が挙げられる。気体の吹き付け圧力は、剥離が起
こり得る範囲の圧力であればよく、通常５０〜３００ｋ
Ｐaの範囲等がある。吹き付け気体の温度は特に規定し
ないが、通常１０〜１００℃程度である。他に、必要に
応じて、成形体の剥離を効率よく行うための処理、例え
ば、成形型の加温、型開きから成形体取り出しまでの間
の保温、加温等を行ってもよい。The method of spraying the gas is not particularly limited as long as the gas blowing pressure can be efficiently applied to the boundary between the molded body and the release layer or the boundary between the release layer and the plate-like molded body. Nozzles and nozzles in which small-diameter pipes and the like are arranged in parallel (see FIGS. 6 and 7). The distance from the boundary between the molded body and the release layer or the boundary between the release layer and the plate-shaped molded body to the gas blowing portion is not particularly limited, but the more efficiently the surface can be separated as close to the boundary surface as possible. The blowing gas may be any non-reactive gas that does not affect the molded body, the release layer, the plate-like molded body, and the like, and examples thereof include air, oxygen, nitrogen, carbon dioxide gas, and argon gas. The blowing pressure of the gas may be any pressure within a range where peeling can occur, and is usually 50 to 300 k.
Pa range and the like. The temperature of the blowing gas is not particularly limited, but is usually about 10 to 100 ° C. In addition, if necessary, a process for efficiently removing the molded body may be performed, for example, heating of a molding die, heat retention from the opening of the mold to removal of the molded body, heating, and the like.
【００１８】以上の気体の吹き付けにより剥離された成
形体は、例えば、剥離前で板状成形体２ｂ／剥離層４ｂ
／成形体７／剥離層４ａの形態をとっていた場合、剥離
層４ｂ／成形体７／剥離層４ａまたは成形体７／剥離層
４ａの形態をとるが、成形体７表面の保護のため成形体
７には剥離膜４ａ、４ｂを密着させておくことが望まし
い。更に、成形体から剥離層を除去する方法は特に制限
はないが、例えば、加熱して剥離層を溶融又は軟化させ
ることによって剥離層と成形体を分離してもよいし、剥
離層を溶解させる溶媒に浸漬、又は溶媒を塗布すること
によって剥離層を溶解もしくは膨潤させて除去してもよ
い。The molded body peeled by blowing the gas is, for example, a plate-shaped molded body 2b / a peeled layer 4b before the peeling.
In the case of the form of / molding 7 / release layer 4a, it takes the form of release layer 4b / mold 7 / release layer 4a or molding 7 / release layer 4a. It is desirable that the release films 4a and 4b be adhered to the body 7. Further, the method of removing the release layer from the molded body is not particularly limited, for example, the release layer and the molded body may be separated by heating to melt or soften the release layer, or to dissolve the release layer The release layer may be dissolved or swelled and removed by dipping in a solvent or applying a solvent.
【００１９】[0019]
【実施例】以下、本発明の内容を実施例により更に詳細
に説明するが、本発明は、その要旨を越えない限り以下
の例に限定されるものではない。評価及び測定は以下の
方法により行った。 （１）外観 成形体を離型する際に、硬化後の成形体が破損しない
か、目視により確認した。 （２）剥離し易さ 成形体を剥離する時の剥離し易さを、下記の３段階で評
価した。 ○：容易に剥がれる。 △：少し剥がしにくい。 ×：
剥がしにくい。 （３）剥離層の厚さ 成形型の厚さと成形型上に完全硬化した剥離層が形成さ
れた厚さとの差を剥離層の厚さとした。測定機器はシッ
クネスゲージを使用した。 （４）エアー吹き付け角度 成形体と板状成形型との密着面の端部境界面８を水平方
向に延長した面９を基準としエアー吹き出し口の角度を
測定した。測定機器は、分度器を使用した（図４、５参
照）。EXAMPLES Hereinafter, the content of the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist. Evaluation and measurement were performed by the following methods. (1) Appearance When the molded product was released from the mold, it was visually confirmed whether or not the cured molded product was damaged. (2) Ease of peeling The ease of peeling when the molded body was peeled was evaluated in the following three stages. ：: easily peeled off. Δ: Slightly difficult to peel. ×:
Difficult to peel off. (3) Release Layer Thickness The difference between the thickness of the mold and the thickness of the completely cured release layer formed on the mold was defined as the thickness of the release layer. The measuring instrument used a thickness gauge. (4) Air Spray Angle The angle of the air outlet was measured with reference to a surface 9 extending horizontally from the end boundary surface 8 of the contact surface between the molded body and the plate-shaped mold. As a measuring instrument, a protractor was used (see FIGS. 4 and 5).
【００２０】実施例１ ガラス製平板（縦７５０ｍｍ×横７５０ｍｍ×厚み６ｍ
ｍ）に、剥離層としてゼオネックス（日本ゼオン（株）
社製、商品名ゼオネックス４８０）をメシチレンに溶解
させた溶液を、ガラス製平板上にスピンコーターを用い
て塗布し、その後キシレンを蒸発させ、ガラス製平板上
に厚さ１μｍのゼオネックス薄膜を成形させた。ゼオネ
ックス薄膜面が内面になるように対向させ、スペーサー
として幅５ｍｍ、厚さ０．４ｍｍのシリコン板を用いキ
ャビティーを形成させとともにシール材としても用い
た。周辺部をクリップで固定して成形型を形成した。な
お、測定幅２５ｍｍ、１８０°剥離、測定速度１０mm/m
inの条件でオートグラフを用いてこの成形型と剥離層の
密着強度を測定したところ、０．１Ｎ／25mmであった。
光硬化性樹脂には、ビス（オキシメチル）トリシクロ
［５，２，１，０2,6］デカンジメタクリレート９４重
量部、ペンタエリスリトールテトラキス（β−チオプロ
ピオネート）６重量部、光重合開始剤として２，４，６
−トリメチルベンゾイルジフェニルホスフィンオキシド
（ＢＡＳＦ社製「ルシリンＴＰＯ」）０．０６重量部、
ベンゾフェノン０．０４重量部を均一に撹拌混合した
後、脱泡して得た組成物を用いた。Example 1 A flat glass plate (750 mm long × 750 mm wide × 6 m thick)
m), as a release layer, ZEONEX (Zeon Corporation)
A solution obtained by dissolving ZEONEX 480 (trade name, manufactured by KK) in mesitylene is applied on a glass flat plate using a spin coater, and then xylene is evaporated to form a 1 μm thick ZEONEX thin film on the glass flat plate. Was. The ZEONEX thin film surface was opposed to the inner surface, and a silicon plate having a width of 5 mm and a thickness of 0.4 mm was used as a spacer to form a cavity and also used as a sealing material. A peripheral part was fixed with a clip to form a molding die. In addition, measurement width 25mm, 180 degree peeling, measurement speed 10mm / m
When the adhesion strength between this mold and the release layer was measured using an autograph under the condition of in, it was 0.1 N / 25 mm.
The photocurable resin includes 94 parts by weight of bis (oxymethyl) tricyclo [5,2,1,0 2,6 ] decane dimethacrylate, 6 parts by weight of pentaerythritol tetrakis (β-thiopropionate), 2,4,6 as agent
0.06 parts by weight of trimethylbenzoyldiphenylphosphine oxide (“Lucillin TPO” manufactured by BASF)
A composition obtained by uniformly stirring and mixing 0.04 parts by weight of benzophenone and then defoaming was used.
【００２１】この組成物を、成形型に注入し、ガラス面
より上下両面から出力１６０Ｗ／ｃｍのメタルハライド
ランプで積算照射量が３３０００ｍｊ／ｃｍ2の紫外線
を照射し硬化させた。その後、成形型を分解した。成形
型に密着した成形体を剥離するため平ノズル（（株）テ
ンコーポレーション フラットノズルＦＬ−６００Ｅ、
幅約４８mm）を剥離境界全面以上にエアーが当たるよう
に個々の間隔を１ｍｍ間隔で１６個並べて配置し、吹き
付け角度３０°、平ノズル一個のエアー元圧力１９６ｋ
Ｐaの条件で成形型より成形体を離型した。剥離後の成
形体をメシチレン溶剤で洗浄し、成形体に密着した剥離
層を取り除いた。評価及び測定結果を表−１に示した。The composition was poured into a mold, and cured by irradiating ultraviolet rays having an integrated irradiation amount of 33000 mj / cm 2 with a metal halide lamp having an output of 160 W / cm from both the upper and lower surfaces of the glass. Thereafter, the mold was disassembled. A flat nozzle (Ten Corporation Flat Nozzle FL-600E,
16 widths of about 48 mm) were arranged at intervals of 1 mm so that air could be applied to the entire surface of the peeling boundary or more. The spray angle was 30 ° and the air source pressure of one flat nozzle was 196 k.
The molded body was released from the molding die under the conditions of Pa. The peeled molded article was washed with a mesitylene solvent to remove a peeling layer which was in close contact with the molded article. The evaluation and measurement results are shown in Table 1.
【００２２】実施例２ 実施例１において、ガラス製平板を縦４００ｍｍ×横４
００ｍｍ×厚さ４ｍｍのもの、またスペーサーとして幅
５ｍｍ、厚さ１．０ｍｍのシリコン板を用い、剥離層の
厚さを２μｍ、積算照射量が２７０００ｍｊ／ｃｍ2、
平ノズルを１ｍｍ間隔で９個並べて配置し、平ノズル吹
き付け角度５５°、平ノズル一個のエアー元圧力９８ｋ
Ｐａの条件とした以外は同例と同様にした。評価及び測
定結果を表−１に示した。 実施例３ 実施例２において、剥離層の厚さを８μｍ、エアー吹き
付け角度１５°とした以外は同例と同様にした。評価及
び測定結果を表−１に示した。 実施例４ 実施例１において、剥離層の厚さを４μｍ、エアー吹き
付け角度８°とにした以外は同例と同様に離型した。評
価及び測定結果を表−１に示した。Example 2 In Example 1, the glass flat plate was 400 mm long × 4 mm wide.
A silicon plate having a width of 5 mm and a thickness of 1.0 mm was used as a spacer, the thickness of the release layer was 2 μm, the integrated irradiation amount was 27000 mj / cm 2,
Nine flat nozzles are arranged at 1 mm intervals, the flat nozzle spray angle is 55 °, and the air source pressure of one flat nozzle is 98k.
The same procedure was performed as in the same example except that the condition of Pa was used. The evaluation and measurement results are shown in Table 1. Example 3 In Example 2, it carried out similarly to Example 2 except having set the thickness of the peeling layer to 8 micrometers, and the air blowing angle to 15 degrees. The evaluation and measurement results are shown in Table 1. Example 4 A mold was released in the same manner as in Example 1 except that the thickness of the release layer was 4 μm and the air spray angle was 8 °. The evaluation and measurement results are shown in Table 1.
【００２３】実施例５ 実施例２において、剥離層の厚さを１２μｍ、エアー吹
き付け角度１５°とした以外は同例と同様にした。評価
及び測定結果を表−１に示した。 実施例６ 実施例２において、剥離層の厚さを１５μｍ、エアー吹
き付け角度２５°とした以外は同例と同様にした。評価
及び測定結果を表−１に示した。 実施例７ 実施例２において、スペーサーとして幅５ｍｍ、厚さ
０．４ｍｍのシリコン板を用い、剥離層の厚さを８μ
ｍ、平ノズル吹き付け角度３°、平ノズル一個のエアー
元圧力９８ｋＰａの条件とした以外は同例と同様にし
た。評価及び測定結果を表−１に示した。Example 5 The procedure of Example 2 was repeated except that the thickness of the release layer was changed to 12 μm and the air spray angle was set to 15 °. The evaluation and measurement results are shown in Table 1. Example 6 In Example 2, it carried out similarly to Example 2 except having set the thickness of the peeling layer to 15 micrometers, and the air blowing angle to 25 degrees. The evaluation and measurement results are shown in Table 1. Example 7 In Example 2, a silicon plate having a width of 5 mm and a thickness of 0.4 mm was used as a spacer, and the thickness of the release layer was set to 8 μm.
m, the flat nozzle spray angle was 3 °, and the air source pressure of one flat nozzle was 98 kPa. The evaluation and measurement results are shown in Table 1.
【００２４】比較例１ 実施例１において、剥離層を形成しないガラス製平板を
用い、平ノズル吹き付け角度４５°、平ノズル一個のエ
アー元圧力１９６ｋＰaの条件とした以外は同例と同様
にした。評価及び測定結果を表−１に示した。 比較例２ 実施例２において、剥離層を形成しないガラス製平板を
用い、平ノズルを用いずにヘラ等の鋭利な治具を使い離
型した以外は同例と同様にした。評価及び測定結果を表
−１に示した。 比較例３ 実施例２において、剥離層の厚みを５μｍとし、ヘラ等
の鋭利な治具を使い成形型を剥離した以外は同例と同様
にした。評価及び測定結果を表−１に示した。Comparative Example 1 The same procedure as in Example 1 was carried out except that a flat plate made of glass without a release layer was used, and the conditions were such that the spray angle of the flat nozzle was 45 ° and the air source pressure of one flat nozzle was 196 kPa. The evaluation and measurement results are shown in Table 1. Comparative Example 2 The procedure of Example 2 was repeated, except that a flat plate made of glass without a release layer was used, and the mold was released using a sharp jig such as a spatula without using a flat nozzle. The evaluation and measurement results are shown in Table 1. Comparative Example 3 The procedure of Example 2 was repeated, except that the thickness of the release layer was 5 μm, and the mold was released using a sharp jig such as a spatula. The evaluation and measurement results are shown in Table 1.
【００２５】[0025]
【表１】 [Table 1]
【００２６】[0026]
【発明の効果】本発明の成形体の剥離方法によれば、薄
厚で、広面積のシート状成形体を損傷なく、表面状態が
良好なまま、成形型から離型させることができる。ま
た、本発明は機械化による連続製造化も容易であり、生
産性の顕著な向上が期待できる。According to the method for peeling a molded article of the present invention, a thin, large-area sheet-shaped molded article can be released from a molding die without damage and with good surface condition. In addition, the present invention facilitates continuous production by mechanization, and a remarkable improvement in productivity can be expected.
【図１】 本発明で用いることができる成形型の斜視図
である。FIG. 1 is a perspective view of a mold that can be used in the present invention.
【図２】 本発明で用いることができる成形型の片方の
型をとった際の斜視図である。FIG. 2 is a perspective view when one of molds that can be used in the present invention is taken.
【図３】 本発明で用いることができる成形型より成形
体を剥離させる際の斜視図である。FIG. 3 is a perspective view when a molded body is peeled from a molding die that can be used in the present invention.
【図４】 本発明で成形体を成形型より剥離させるため
にガスの吹き付ける方向と成形型の関係を示すための説
明図である。FIG. 4 is an explanatory diagram showing a relationship between a direction of gas blowing and a molding die in order to peel a molded body from the molding die in the present invention.
【図５】 本発明で成形体を成形型より剥離させるため
にガスの吹き付ける方向と成形型の関係を示すための説
明図である。FIG. 5 is an explanatory view showing a relationship between a direction of blowing gas and a forming die in order to peel a formed body from the forming die in the present invention.
【図６】 本発明で成形体を成形型より剥離させるため
にガスの吹き付ける方向と成形型の関係を示すための説
明図である。FIG. 6 is an explanatory view showing a relationship between a direction of blowing gas and a molding die in order to peel the molded body from the molding die in the present invention.
【図７】 本発明で成形体を成形型より剥離させるため
にガスの吹き付ける方向と成形型の関係を示すための説
明図である。FIG. 7 is an explanatory view showing the relationship between the direction of gas blowing and the mold in order to peel the molded body from the mold in the present invention.
１ 成形型 ２ａ、２ｂ 板状成形型 ３ シール材 ４ａ、４ｂ 剥離層 ５ キャビティー ６ 活性エネルギー線又は熱線 ７ 成形体 ８、１０ 境界 ９ 基準面 １１ 平ノズル １２ 気体 DESCRIPTION OF SYMBOLS 1 Mold 2a, 2b Plate mold 3 Sealing material 4a, 4b Release layer 5 Cavity 6 Active energy ray or heat ray 7 Molded body 8, 10 Boundary 9 Reference plane 11 Flat nozzle 12 Gas
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F071 AA33 AA42 AA43 AA53 AG15 BB01 BC01 4F202 AA44 AG02 AG03 CA01 CB01 CM16 CM72 CM82 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F071 AA33 AA42 AA43 AA53 AG15 BB01 BC01 4F202 AA44 AG02 AG03 CA01 CB01 CM16 CM72 CM82
Claims (4)
離層を内面とし所定間隔をおいて対向させると共に周辺
部をシールしてキャビティーが形成される成形型を用
い、該キャビティーに液状樹脂を注入し、液状樹脂を硬
化させ成形体を製造し、次いで、成形型を型開きし、型
開きした板状成形型に剥離層を介して密着している成形
体を剥離する方法であって、成形体、剥離層、板状成形
体の周辺端部厚み方向面の少なくとも一方向より、板状
成形型との密着側の成形体と剥離層の境界に、あるい
は、剥離層と板状成形体の少なくとも一つ以上の境界
に、気体を吹きつけて成形体を板状成形型から剥離する
ことを特徴とする成形体の剥離方法。1. A mold in which a cavity is formed by opposing a plate-shaped mold provided with a pair of release layers at a predetermined interval with the release layer as an inner surface and sealing a peripheral portion. Inject the liquid resin into the tee, cure the liquid resin to produce a molded body, then open the mold, and peel off the molded body that is in close contact with the opened plate-shaped mold via a release layer. The method, a molded body, a release layer, from at least one direction of the peripheral end portion thickness direction surface of the plate-shaped molded body, at the boundary between the molded body and the release layer on the side close to the plate-shaped mold, or, A method for separating a molded body, comprising blowing a gas to at least one or more boundaries between the molded body and the plate-shaped molded body to separate the molded body from the plate-shaped mold.
離層と板状成形体の少なくとも一つ以上の境界に、気体
を吹きつける際の吹きつけ角度が５°以上、６０°以下
である請求項１の成形体の剥離方法。2. A blowing angle of 5 ° or more and 60 ° or less when blowing a gas at a boundary between a molded body and a release layer or at least one boundary between a release layer and a plate-like molded body. 2. The method for stripping a molded article according to claim 1.
項１又は２の成形体の剥離方法。3. The method according to claim 1, wherein the thickness of the release layer is 1 to 10 μm.
がポリスチレン系樹脂又は環状ポリオレフィン系樹脂で
ある請求項１〜３のいずれかの成形体の剥離方法。4. The method according to claim 1, wherein the liquid resin is a photocurable resin, and the release layer is a polystyrene resin or a cyclic polyolefin resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33975599A JP2001150462A (en) | 1999-11-30 | 1999-11-30 | Molded body peeling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33975599A JP2001150462A (en) | 1999-11-30 | 1999-11-30 | Molded body peeling method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001150462A true JP2001150462A (en) | 2001-06-05 |
Family
ID=18330508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33975599A Pending JP2001150462A (en) | 1999-11-30 | 1999-11-30 | Molded body peeling method |
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| Country | Link |
|---|---|
| JP (1) | JP2001150462A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013014118A (en) * | 2011-07-06 | 2013-01-24 | Japan Steel Works Ltd:The | Method of peeling fine structure and peeling apparatus |
| JP6075675B1 (en) * | 2016-06-24 | 2017-02-08 | 株式会社Ｔｈｅ ＭＯＴ Ｃｏｍｐａｎｙ | Demolding method of fiber reinforced composite material molding |
| WO2018190161A1 (en) * | 2017-04-14 | 2018-10-18 | 株式会社Ｔｈｅ ＭＯＴ Ｃｏｍｐａｎｙ | Method for manufacturing fiber-reinforced resin molded article and demolding method |
| JP2020032687A (en) * | 2018-08-31 | 2020-03-05 | Ｔｏｗａ株式会社 | Resin molding device, release film peeling method, resin molded product manufacturing method |
-
1999
- 1999-11-30 JP JP33975599A patent/JP2001150462A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013014118A (en) * | 2011-07-06 | 2013-01-24 | Japan Steel Works Ltd:The | Method of peeling fine structure and peeling apparatus |
| JP6075675B1 (en) * | 2016-06-24 | 2017-02-08 | 株式会社Ｔｈｅ ＭＯＴ Ｃｏｍｐａｎｙ | Demolding method of fiber reinforced composite material molding |
| WO2018190161A1 (en) * | 2017-04-14 | 2018-10-18 | 株式会社Ｔｈｅ ＭＯＴ Ｃｏｍｐａｎｙ | Method for manufacturing fiber-reinforced resin molded article and demolding method |
| JP2018176570A (en) * | 2017-04-14 | 2018-11-15 | 株式会社Ｔｈｅ ＭＯＴ Ｃｏｍｐａｎｙ | Method of manufacturing fiber-reinforced resin molded article and method of demolding |
| JP2020032687A (en) * | 2018-08-31 | 2020-03-05 | Ｔｏｗａ株式会社 | Resin molding device, release film peeling method, resin molded product manufacturing method |
| JP6994445B2 (en) | 2018-08-31 | 2022-01-14 | Ｔｏｗａ株式会社 | Resin molding equipment, release film peeling method, resin molded product manufacturing method |
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