JP2001143037A - Non-contact data carrier and manufacturing method thereof - Google Patents

Abstract

(57) [Problem] To provide a non-contact data carrier in which the deterioration and damage of an antenna coil layer are prevented and the protective sheet has a high adhesive strength, and a method of manufacturing the same. A non-contact data carrier according to the present invention includes a resin base, a metal antenna coil provided on one surface of the resin base, and an IC chip connected to the antenna coil. The carrier is characterized in that the insulating resist material used in the etching step remains as a protective film on the surface of the antenna layer except for the connection ends 131 and 132 to the IC chip. Also,
The method for manufacturing a non-contact data carrier of the present invention includes a step of applying a printing resist on a metal foil surface of a base material on which a resin base material and a metal foil are laminated, a step of etching, and a step of applying only a resist on an antenna connection terminal And a step of removing

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact data carrier having an antenna coil and an IC chip (semiconductor device). The present invention relates to a non-contact data carrier remaining as a protective film.

[0002]

2. Description of the Related Art Conventionally, a non-contact data carrier having an antenna coil and an IC chip has been used in a distribution system or the like. Such contactless data carriers are:
For example, it is used by being attached to a product packaging box or the product itself. Non-contact data carriers generally include a resin substrate,
It has a metal antenna coil provided on a resin base material and an IC chip connected to the antenna coil. When an electromagnetic wave is emitted from the reader side to the non-contact data carrier, an induced voltage is generated in the antenna coil,
The IC chip is operated.

[0003]

A non-contact data carrier has a metal antenna coil provided on a resin substrate as described above, and an IC chip connected to the antenna coil. A protective sheet for protecting the antenna coil and the IC chip is provided on the antenna coil. However, before laminating the protective sheet, a sufficient adhesive lamination strength is obtained due to scratches, deterioration such as oxidation, and contamination of the antenna. May not be possible. Further, when the IC chip is heat-pressed to the antenna coil, the resin base material may sag or shrink, resulting in poor conduction, or making it impossible to accurately manufacture the carrier. Therefore,
The present invention is intended to solve these problems by leaving the resist material in the etching step as a protective film on the antenna layer other than the connection end of the antenna.

[0004]

Means for Solving the Problems A first aspect of the present invention for solving the above problems is to provide a resin base, a metal antenna coil provided on one surface of the resin base, and an antenna coil. In a non-contact data carrier having a connected IC chip, the insulating resist material used in the etching step remains as a protective film on the surface of the antenna layer except for the connection end with the IC chip. And contactless data carriers. Since the contactless data carrier is used, the data carrier can be operated without any malfunction.

[0005] In the above, if the IC chip is mounted in a face-down manner via the adhesive layer applied on the protective film, the protrusion of the data carrier by the IC chip can be reduced. Further, if the bumps at both ends of the IC chip are attached to the antenna coil so as to straddle the antenna coil, it is not necessary to provide a through hole in the circuit.

A second aspect of the present invention for solving the above problems is a step of printing a printing resist on a metal foil surface of a data carrier substrate on which a resin substrate and a metal foil are laminated, Forming an antenna by etching the antenna, removing only the resist on the connection terminals of the antenna, and laminating a protective sheet while leaving a protective film of the resist on the antenna layer. A method of manufacturing a non-contact data carrier. With this manufacturing method, it is possible to easily manufacture a data carrier having no malfunction.

[0007] In the above, if the etching step is chemical etching using an alkaline etching solution or chemical etching using an acidic etching solution, accurate etching can be performed.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a non-contact data carrier according to the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the contactless data carrier of the present invention, and FIG.
FIG. 2 is a sectional view taken along line AA in FIG. 1. The data carrier 10 includes, for example, a resin base material 11 made of PET, an antenna coil 13 made of metal etched and formed using a resist material over substantially the entire area of the resin base material 11, and an IC chip connected to the antenna coil 13. 20.
The IC chip is simply indicated by a rectangular frame so that the state of the coil can be understood. There are various sizes, but in reality, small ones of about 1.5 mm square are often used. Both connection ends 131 and 132 of the antenna coil are I
Connected to bumps on C chip. In the non-contact data carrier of the present invention, the insulating resist material used in the etching process remains as a protective film on the surface of the antenna layer thus formed except for both connection ends of the antenna with the IC chip. It is characterized by having. The resist material at the connection end of the antenna is removed so that the metal layer is exposed and the IC chip can be mounted by a normal connection method using solder, anisotropic conductive film, anisotropic conductive paste, and non-conductive paste. In order to

In the data carrier of FIG. 1, the capacitor pattern is not formed, but the capacitor is built in the IC chip, and an LC resonance circuit is formed by the capacitance C of the capacitor and the inductance L of the coil. I have. Generally, the one corresponding to the resonance frequency of 13.56 MHz is widely used. Generally, a protective sheet 18 is laminated on the entire surface covering the antenna coil and the IC chip. A protective sheet may be laminated via a buffer layer that is hollowed out so as to fit the convex part of the IC chip. The protective sheet may be made of plastic or paper, and necessary display printing and the like are also performed on the sheet surface.

As shown in FIG. 2, an antenna coil 13 is formed on a substrate 11, and a protective film 14 made of an insulating resist material is provided on the antenna layer. The protective film is peeled off at both connection ends 131 and 132 of the antenna coil, and an IC chip is formed on the connection ends by melting an anisotropic conductive film, an anisotropic conductive paste, a non-conductive paste or a solder bump. And so on. In the case of a non-conductive paste, it is preferable to use a bump having a spike at the tip so as to pierce the antenna layer. It is preferable that the IC chip 20 has a small thickness so as to reduce irregularities on the surface of the data carrier.
The thickness is 180 μm. As described above, leaving the resist film on the antenna layer not only functions as a protective layer itself, but also prevents oxidation and dirt of the antenna and contributes to improvement of adhesiveness when the protective sheet 18 is laminated on the surface. Can be done. Further, the step of removing the resist which is usually performed can be omitted, and the occurrence of damage to the antenna due to the step can be prevented, and the step can be simplified and the cost can be reduced.

FIG. 3 is a plan view showing the connection end of the antenna coil with the IC chip. Connecting ends 131 and 132 of the coils are located on both sides of the two antenna coils. In the figure, the obliquely hatched portions indicate that the resist remains as a protective film, and the connection ends that are white indicate that the resist has been peeled off. By making the coil passing between the terminals narrow, the number of coils is not limited to two but can be many. By removing the resist only at the connection end in this manner, the IC chip 20 can be mounted by a normal connection method, and the other parts of the antenna coil are prevented from being deteriorated due to oxidation and from being damaged or stained. Can be.

FIG. 4 is a plan view showing another example of the non-contact data carrier of the present invention. A line pattern formed by aluminum etching with a line width of 0.5 mm is formed on a 45 × 45 mm substrate in eight turns. 0.5m between lines
m. In this example, the coil is configured to form a jumping circuit through the back surface of the base material by the conductive member 17, and the IC chip 20 is mounted on a portion where both connection ends of the coil face each other. Also in this example, on the antenna layer,
Except for the connection end, a protective film made of an insulating resist is formed similarly. Note that the conductive member 17 can be electrically connected to the antenna by caulking the base material with projections and depressions. The conductive member may be formed by etching an aluminum foil on the surface of the substrate 11 opposite to the surface on which the antenna is formed, or a thin-film component may be used.

Next, a method for manufacturing a non-contact data carrier will be described. FIG. 5 is a diagram illustrating a manufacturing process of the non-contact data carrier. First, as shown in FIG. 5A, a sheet in which a good conductive metal foil 13f is laminated on a resin base material 11 is prepared. As the resin base material, various materials such as PET, polypropylene, polyethylene, polystyrene, and nylon can be used, and the thickness is 5 to 300 μm.
Can be used, but 10 to 100 μm is more preferable in view of strength, workability, cost, and the like. As the metal foil, a copper foil, an aluminum foil or an iron foil can be used, but an aluminum foil is preferable from the viewpoint of cost and workability, and its thickness is preferably about 6 to 50 μm.

Next, as shown in FIG. 5B, a required antenna coil pattern is printed on the metal foil using the printing resist 14R. For printing the resist, gravure, flexo, offset printing or silk screen printing is often used. This process can be performed by a photo process using a photosensitive resist, but printing by gravure, flexo, offset printing, and screen printing is possible up to about 0.1 mm line width. This is advantageous because the process can be omitted and the efficiency can be improved.

The metal foil is etched using an etchant so that the resin base material in portions other than the printed resist coating portion is exposed. When the metal foil is an aluminum foil, the etching solution includes caustic soda (NaOH) and sodium carbonate (N
a ₂ CO ₃ ), phosphoric acid (H ₃ PO ₄ ), hydrochloric acid (HCl),
A solution having a concentration of sulfuric acid (H ₂ SO ₄ ) of several% to about 20%, ferric chloride (FeCl ₃ ), or the like can be used. In the case of ferric chloride, a precipitate of iron is formed. And it becomes difficult to perform good etching. The etching time varies depending on the metal material and thickness, but is usually about 1 to 2 minutes to 5 minutes.

After etching and drying, as shown in FIG. 5C, the antenna coil 13 with the protective film 14 made of resist is formed.
Get. Next, as shown in FIG. 5D, only the resist on the surfaces 131 and 132 of both ends of the antenna coil is removed. For this, it is possible to employ a polishing apparatus for polishing abrasive paper or a small area portion, a method of physically removing by a plasma, or a method of chemically removing with a high-concentration acid or alkali solution.

Although not shown, an appropriate amount of non-conductive paste is applied to the antenna coil connection terminal surface.
Positioning is performed so that the bumps of the C chip 20 match the positions of the two connection terminals, and the IC chip is mounted by applying heat and pressure from above the IC chip. The IC chip can be fixed on the antenna with a non-conductive paste, and can be conducted in the direction pressed by the bump. The mounting of the IC chip is not limited to the non-conductive paste, but may be an ordinary face-down mounting means for melting and mounting an anisotropic conductive paste, an anisotropic conductive film, solder or a solder bump. The non-contact data carrier is completed by laminating the protective sheet 18 over the entire surface of the antenna coil using an adhesive.

(Embodiment Regarding Other Materials) As a resist material for forming the protective film, a general resist for forming a circuit or a solder resist for a solder mask may be used. Dry film resists and liquid resists can of course be used. As the resin composition, a photosensitive photocurable resin containing a copolymer such as methacrylic acid ester, acrylic acid ester or styrene, a two-liquid curable resin such as epoxy, acrylic, urethane, vinyl chloride, vinyl chloride vinyl chloride, or the like can be used. Alternatively, a cyclized rubber, a novolak resin, or casein provided with photosensitivity may be used.
However, for example, a resist material having low adhesion to aluminum of the antenna layer after drying may cause peeling after completion of the data carrier.

When a surface protective sheet is provided as a final product, a transparent or opaque plastic film is laminated and laminated. In addition to the lamination of the heat lamination, the lamination may be performed using an adhesive. As the material, polyester, polyethylene, polypropylene, polystyrene, nylon, or the like can be used, or a material obtained by laminating high-quality paper or synthetic paper can be used. Necessary printed displays and decorations can be provided in advance. The thickness of the sheet is about 10 to 300 μm in terms of strength, surface performance, and cost. The adhesive for laminating the protective sheet can be appropriately selected in consideration of the protective sheet material and the like, but in addition to hot melt type thermoplastic adhesives such as polyester, acrylic, urethane, and vinyl, Two-component crosslinking reaction-curable adhesives, moisture-curable adhesives, UV-curable adhesives, and the like can be used. Further, it is necessary that the adhesiveness be high with respect to a resist material as a protective film on the antenna layer.

[0020]

EXAMPLES (Example) An antenna resin base material was prepared by dry-laminating a 25-μm-thick aluminum foil on a 38-μm-thick transparent biaxially stretched polyester film. A printing resist (the Inktec Co., Ltd.) 14R made of vinyl chloride vinegar resin is printed on the surface of the aluminum foil by gravure printing so that the thickness after drying becomes 2 μm, and then 5% hydrochloric acid is provided. The aluminum exposed portion was etched for 2 minutes to obtain a sheet having an antenna coil pattern. Note that the resist film was left as it was on the antenna layer without being subjected to a film removing process, and only the resist film of the connection terminals 131 and 132 was removed by a polishing apparatus.

Next, using a non-conductive paste (“YK520” manufactured by Sony Chemical Co., Ltd.), the bumps of the IC chip are placed face down, and the bumps are aligned with the connection ends 131 and 132 of the antenna coil and temporarily. Crimped. 150 ° C, 1.3 × 10 ⁶ Pa from IC chip side
The IC chip was mounted by applying heat pressure to the IC chip. next,
A 50 μm-thick biaxially stretched polyester film is laminated via a polyester-based hot melt adhesive, sandwiched between mirror-surface stainless steel plates, and then introduced into a press machine at 135 °.
Lamination was performed by hot pressing under the conditions of C, 0.5 MPa and 120 seconds. Then, a predetermined shape (50 mm x 50 m
m) to cut the outer dimensions to complete the data carrier.

(Comparative Example) An antenna coil pattern was formed on a substrate under the same conditions as in the above example. After removing the resist film, the IC chip was mounted under the same conditions. Lamination of the protective sheet was performed under the same conditions.

In the non-contact data carrier of the embodiment, the surface of the antenna was not damaged, deteriorated or stained, and the protective sheet could be laminated with sufficient adhesive strength. on the other hand,
In the case of the comparative example, the surface of the antenna was damaged during the film removal process, resulting in poor conduction, and the oxide film on the aluminum surface reduced the adhesive strength of the laminate, resulting in a practical problem.

[0024]

As described above, in the data carrier of the present invention, the resist film is left as it is on the antenna layer except for the connection terminal portion. When the protective sheet is laminated on the surface while preventing deterioration and dirt such as the above, it can contribute to improvement in adhesiveness. Further, the step of removing the resist, which is usually performed, can be omitted, and the process can be simplified and the cost can be reduced. Further, in the non-contact data carrier of the present invention, since the resist on the coil is removed from the IC chip mounting portion, a normal mounting method can be performed. Further, according to the method for manufacturing a non-contact data carrier of the present invention, it is possible to manufacture a non-contact data carrier having no malfunction by a simple method.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a non-contact data carrier of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a plan view showing a connection end of an antenna coil with an IC chip.

FIG. 4 is a plan view showing another example of the non-contact data carrier of the present invention.

FIG. 5 is a diagram showing a manufacturing process of a non-contact data carrier.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Non-contact data carrier 11 Base material 13 Antenna coil 14 Protective film 17 Conductive member 18 Protective sheet 19 Anisotropic conductive film or non-conductive paste 20 IC chip 131, 132 Both connection end portions of antenna 201, 202 Bump

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01Q 1/40 H04B 1/59 7/00 5/02 H04B 1/59 G06K 19/00 H 5/02 K (72) Inventor Noboru Araki 1-1-1 Ichigaya-Kaga-cho, Shinjuku-ku, Tokyo F-term in Dai Nippon Printing Co., Ltd. AB11 PA01 PA07 QA04 QA10 5K012 AA07 AB03 AB18 AC06 BA00

Claims (6)

[Claims] 1. A non-contact data carrier comprising a resin base, a metal antenna coil provided on one surface of the resin base, and an IC chip connected to the antenna coil, wherein an IC layer is provided on the surface of the antenna layer. A non-contact data carrier, wherein an insulating resist material used in an etching step remains as a protective film except for a connection end portion with a chip. 2. The non-contact data carrier according to claim 1, wherein the IC chip is mounted in a face-down manner. 3. The non-contact data carrier according to claim 1, wherein the bumps at both ends of the IC chip are mounted on the antenna coil so as to straddle the antenna coil. 4. A step of printing a printing resist on a metal foil surface of a data carrier base material on which a resin base material and a metal foil are laminated; a step of forming an antenna by etching the metal foil; A method for manufacturing a non-contact data carrier, comprising: a step of removing only a resist on a terminal; and a step of laminating a protective sheet in a state where a protective film of the resist is left on an antenna layer. 5. The method according to claim 4, wherein the etching step is chemical etching using an alkaline etching solution. 6. The method according to claim 4, wherein the etching step is chemical etching using an acidic etching solution.