JP2001021281A - Heat equalizer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To contrive applications to a work require ing a strict temperature distribution and improvement of working accuracy by allowing heat from a heat source to be supplied on the surface of a surface plate equally and maintaining the surface temperature of the surface plate uniformly. SOLUTION: In this device, a surface plate 12 comprises a first plate-like member 8 having a plurality of first annular grooves 9 concentrically formed in the underside and a plurality of second radial grooves 10 crossing the first grooves 9, for example approximately perpendicularly, and a second plate-like member joined to the underside of the first plate-like member 8 is such a manner as to cover the first grooves 9 and the second grooves 10. Moreover, the arrangement is made in such a manner that the density of the second radial grooves 10 formed in the first plate-like member 8 becomes high in the outer periphery side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat equalizing apparatus for uniformly heating or cooling a workpiece such as a resin molded product, a semiconductor wafer, a liquid crystal panel or the like on a platen to be processed.

[0002]

2. Description of the Related Art A conventional heat equalizer is disclosed, for example, in Japanese Patent Application Laid-Open No. 9-327827, and its outline is shown in FIG. In FIG. 7, reference numeral 1 denotes a first plate-like member having a flow path 2 formed of a plurality of annular grooves arranged concentrically on a lower surface, and a plurality of workpieces (shown in FIG. Is placed. Reference numeral 3 denotes a second plate-like member which is joined to the lower surface of the first plate-like member 1 by, for example, brazing so as to cover each of the flow passages 2, and a platen 4 together with the first plate-like member 1. Make up. Reference numeral 5 denotes a plurality of liquid reservoirs which are formed so as to protrude downward from the second plate-shaped member 3 and flow through the flow passage 2 in the first plate-shaped member 1. The second plate member 3 is formed by deep drawing. Reference numeral 6 denotes a hydraulic fluid stored in the liquid reservoir 5, reference numeral 7 denotes a heater immersed in the hydraulic liquid 6 in the liquid reservoir 5, and a terminal portion protrudes outside through a side wall of the liquid reservoir 5, for example, a heater or the like. Heat source.

Next, the operation will be described. When the workpiece needs to be heated, the working fluid 6 is heated by the heat source 7 immersed in the working fluid 6 of the liquid reservoir 5 of the surface plate 4. After the inside of the platen 4 is evacuated and filled with the working fluid 6, the heated working fluid 6 evaporates and evaporates immediately through the flow passage 2 and spreads over the entire inside of the platen 4, so that the annular groove 2 is formed. The condensed liquid is condensed and liquefied on the wall surface to release heat as latent heat of condensation of the working fluid 6, thereby heating a plurality of workpieces placed on the surface plate 4. The working fluid 6 condensed and liquefied on the wall of the flow passage 2 is returned to the liquid reservoir 5 again. By repeating such a series of operations,
The workpiece is uniformly heated on the surface of the platen 4.

[0004]

The conventional heat equalizer is constructed as described above, and the working fluid 6 sealed after vacuum decompression is filled.
The heat from the heat source 7 is uniformly transferred to the surface of the surface plate 4 by the latent heat of the surface plate 4, but as shown in FIG. Since the effect of heat radiation from the end face appears, the amount of heat radiation on the outer diameter side increases, so that the temperature on the outer peripheral side of the platen 4 decreases as compared with the inner diameter side as shown in FIG. However, there was a problem that the heat equalizing characteristic of the above was not sufficiently obtained.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the heat of the heat source is uniformly supplied to the surface of the surface plate, and the surface temperature of the surface plate is maintained uniformly. It is an object of the present invention to provide a heat equalizer that can be applied to a workpiece requiring a temperature distribution and that can improve processing accuracy.

[0006]

According to a first aspect of the present invention, there is provided a heat equalizer in which a plurality of concentrically arranged annular first grooves are formed and radial second intersecting first grooves are formed. A first plate-shaped member having a plurality of grooves formed thereon and a second plate-shaped member joined to the first plate-shaped member so as to cover the first groove and the second groove; The radial second grooves formed in the plate-like member are arranged such that the arrangement density is high on the outer peripheral side.

In the heat equalizing apparatus according to a second aspect of the present invention, a plurality of annular first grooves formed in the first plate-like member are arranged such that an interval between the first grooves is smaller on an outer peripheral side. .

According to a third aspect of the present invention, in the heat equalizer according to the first or second aspect, the plurality of annular first grooves formed in the first plate-like member are formed on the inner wall of the outermost circumferential groove. A groove is formed.

According to a fourth aspect of the present invention, there is provided the heat equalizer according to the first or second aspect, wherein the plurality of annular first grooves formed in the first plate-like member are formed on the inner wall of the outermost peripheral groove. A groove is formed, and an annular first plate-like member is formed.
A narrow groove is formed in a portion located at the outermost peripheral groove of the groove.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. 1 and 2
FIG. 1 is a plan view and a cross-sectional view illustrating a heat equalizer according to Embodiment 1 of the present invention. In each of these figures, reference numeral 8 denotes a plurality of annular first grooves 9 formed concentrically on the lower surface and a plurality of radial second grooves 10 intersecting with the first grooves 9, for example, intersecting at substantially right angles. A plurality of workpieces are placed on the upper surface of the first plate-shaped member. Reference numeral 11 denotes a second plate member joined to the lower surface of the first plate member 8 by, for example, brazing so as to cover the first groove 9 and the second groove 10. Together, they constitute a surface plate 12. Also, the second radial plate formed on the first plate-shaped member 8 is formed.
The grooves 10 are arranged such that the arrangement density is dense on the outer peripheral side, for example, higher toward the outer peripheral side. As described above, the first plate-like member 8 formed on the first
The grooves 9 and the second grooves 10 form flow passages that communicate with each other so as to intersect each other. The insides thereof are each evacuated and then filled with a predetermined amount of hydraulic fluid.

In the heat equalizer in the first embodiment configured as described above, the lower surface of the platen 12, ie, the second
When heated from the plate member 11 side by a heating source (not shown) such as a heater, for example, the first groove 9 and the second groove 10 formed in the first plate member 8 intersect each other. The working fluid in the communicating flow passage is also heated and diffuses as steam into the space in the closed flow passage, and this vapor condenses and liquefies on the lower temperature upper surface side or the outermost side surface side of the flow passage. Then, heat is released as latent heat of condensation to liquefy. Then, the liquefied working fluid falls by gravity and returns to the lower surface side inside the flow passage, and by repeating this operation sequentially, heat is transported from the heating source to the upper surface of the platen 12,
The workpiece placed on the upper surface of the substrate is heated.

As described above, according to the first embodiment, the arrangement density of the radial second grooves 10 formed in the first plate-shaped member 8 is increased on the outer peripheral side, for example, as the arrangement density increases toward the outer peripheral side. Is arranged to be higher, a large amount of steam flows on the outer peripheral side of the surface plate 12 and condensed and liquefied, so that the surface of the surface plate 12 can be uniformly heated up to the outer periphery and a heater or the like can be used. It is not necessary to dispose the heating source uniformly on the lower surface of the surface plate 12, so that a plate-shaped heater having poor external dimension accuracy can be sufficiently applied.

Embodiment 2 FIG. FIG. 3 is a plan view showing a heat equalizer according to Embodiment 2 of the present invention. In the drawing, reference numeral 8 denotes a first plate-like member, 10 denotes a second groove, and 12 denotes a surface plate. Reference numeral 13 denotes a plurality of annular first grooves formed on the lower surface of the first plate-shaped member 8 and arranged concentrically. The annular first grooves are arranged so that the interval between them is smaller on the outer peripheral side, that is, the annular first groove. 13 are arranged such that the outer peripheral side is dense. As a result, a larger amount of steam flows on the outer peripheral side of the surface plate 12 to condense and liquefy as compared with the above-described first embodiment, so that the surface of the surface plate 12 can be more uniformly heated to the outer periphery. .

Embodiment 3 4 and 5 are a plan view and a sectional view showing a heat equalizer according to Embodiment 3 of the present invention. In each of these drawings, reference numeral 8 denotes a first plate-like member, 9 denotes a plurality of annular first grooves formed on the lower surface of the first plate-like member 8 and is concentrically arranged, and 9a denotes a plurality of annular first grooves. In the figure, the groove width is formed to be wider than the other groove widths as an example. Reference numeral 10 denotes a second groove, 11 denotes a second plate-like member, and 12 denotes a surface plate. Reference numeral 14 denotes a narrow groove formed on the inner wall of the outermost peripheral groove 9a of the plurality of annular first grooves 9. As described above, the outermost peripheral groove 9a of the plurality of annular first grooves 9
By forming the narrow groove 14 on the inner wall, the annular first groove 9 is formed.
The condensed area of the steam in the outermost peripheral side groove 9a increases, the amount of condensed steam in the outer peripheral portion increases, and the surface plate 1 reaches the outer periphery.
The two surfaces can be more uniformly heated.

Embodiment 4 FIG. 6 is a sectional view showing a heat equalizer according to Embodiment 4 of the present invention. In FIG. 6, 8 is a first plate-like member, 9 is a plurality of annular first grooves, 9
a is the outermost peripheral groove of the plurality of annular first grooves 9, 11 is a second plate-like member, and 12 is a surface plate. 14 is a plurality of annular first
It is a narrow groove formed on the inner wall of the outermost groove 9a of the groove 9. 1
Reference numeral 5 denotes a narrow groove formed in a portion of the second plate-shaped member 11 located at the outermost peripheral groove 9a of the annular first groove 9. Thus, the narrow groove 1 is formed on the inner wall of the outermost peripheral groove 9a of the plurality of annular first grooves 9.
4 and the narrow groove 15 is formed in the portion of the second plate-shaped member 11 located at the outermost peripheral groove 9a of the annular first groove 9, so that the outermost peripheral groove 9a of the annular first groove 9 is formed. The condensed area of the steam at the surface can be further increased, the amount of steam condensed at the outer peripheral portion can be further increased, and the temperature uniformity of the surface of the surface plate 12 can be further improved up to the outer periphery.

In the above-described third and fourth embodiments, the narrow grooves 14 and 15 have been described as having a triangular cross section. However, the present invention is not limited to this groove cross section. The groove may have a shape in which the tip of the groove is sharpened so that the discharge can be performed quickly.

[0017]

As described above, the heat equalizer according to the first aspect of the present invention comprises a plurality of annular first heat equalizers.
A second radial groove is formed and intersects the first groove.
A first plate-like member having a plurality of grooves, a first groove and a second groove;
A platen is formed by a second plate member joined to the first plate member so as to cover the groove, and the arrangement density of the radial second grooves formed in the first plate member is high on the outer peripheral side. , So that the surface of the surface plate can be uniformly heated up to the outer periphery.

Further, in the heat equalizing apparatus according to claim 2 of the present invention, since the arrangement interval of the plurality of annular first grooves formed in the first plate-like member is smaller on the outer peripheral side, the outer peripheral side is smaller. , The surface of the platen can be more uniformly heated.

According to a third aspect of the present invention, there is provided the heat equalizing apparatus according to the first or second aspect, wherein the plurality of annular first grooves formed in the first plate-like member are provided on the inner wall of the outermost circumferential groove. Since the grooves are formed, the surface of the surface plate can be more uniformly heated up to the outer periphery.

According to a fourth aspect of the present invention, in the heat equalizer according to the first or second aspect, the plurality of annular first grooves formed in the first plate-like member are provided on the inner wall of the outermost circumferential groove. A groove is formed, and an annular first plate-like member is formed.
Since a narrow groove was formed in the part located on the outermost peripheral groove of the groove,
The temperature uniformity of the surface of the surface plate up to the outer periphery can be further improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing Embodiment 1 of the present invention.

FIG. 3 is a plan view showing Embodiment 2 of the present invention.

FIG. 4 is a plan view showing a third embodiment of the present invention.

FIG. 5 is a sectional view showing Embodiment 3 of the present invention.

FIG. 6 is a sectional view showing a fourth embodiment of the present invention.

FIG. 7 is a front sectional view showing a partial cross section of a conventional heat equalizer.

FIG. 8 is a characteristic diagram showing heat radiation characteristics of a conventional heat equalizer.

FIG. 9 is a characteristic diagram showing temperature characteristics of a conventional heat equalizer.

[Explanation of symbols]

8 1st plate-like member, 9 1st groove, 10 2nd groove, 11
2nd plate-like member, 12 surface plate, 13 1st groove, 14,
15 Narrow grooves.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shinji Miyazaki 2-3-2 Marunouchi, Chiyoda-ku, Tokyo F-term (reference) 5F031 HA08 HA37 in Mitsubishi Electric Corporation

Claims (4)

[Claims] 1. A heat equalizer having a platen on which a workpiece is placed and a heat source for heating or cooling the workpiece via the platen, wherein a plurality of annular concentrically arranged heat equalizers are provided. A first plate-shaped member in which a first groove is formed and a plurality of radial second grooves intersecting with the first groove are formed; and the first plate-shaped member is formed so as to cover the first groove and the second groove. The platen is constituted by a second plate-like member joined to the member,
Wherein the radial second grooves formed in the plate-like member are arranged such that the arrangement density of the radial second grooves is higher on the outer peripheral side. 2. The heat equalizer according to claim 1, wherein a plurality of annular first grooves formed in the first plate-like member are arranged such that an interval between the first annular grooves becomes smaller on an outer peripheral side. 3. The method according to claim 1, wherein
Wherein the plurality of annular first grooves formed in the plate-shaped member have narrow grooves formed on the innermost wall of the outermost groove. 4. The method according to claim 1, wherein
A thin groove is formed on the innermost wall of the outermost peripheral groove of the plurality of annular first grooves formed on the plate-shaped member, and is located on the outermost peripheral side of the annular first groove of the second plate-shaped member. A heat equalizer, wherein a narrow groove is formed in a portion.