JP2001018398A - Manufacture of nozzle plate of ink jet head - Google Patents
Manufacture of nozzle plate of ink jet headInfo
- Publication number
- JP2001018398A JP2001018398A JP11196660A JP19666099A JP2001018398A JP 2001018398 A JP2001018398 A JP 2001018398A JP 11196660 A JP11196660 A JP 11196660A JP 19666099 A JP19666099 A JP 19666099A JP 2001018398 A JP2001018398 A JP 2001018398A
- Authority
- JP
- Japan
- Prior art keywords
- ink
- resin
- nozzle hole
- nozzle plate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000011347 resin Substances 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 239000005871 repellent Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 230000002940 repellent Effects 0.000 claims abstract description 13
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- 238000004070 electrodeposition Methods 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000011282 treatment Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 9
- 230000000873 masking effect Effects 0.000 abstract description 9
- 238000011049 filling Methods 0.000 abstract description 3
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000007599 discharging Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 14
- 230000005499 meniscus Effects 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 238000005498 polishing Methods 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- 239000010935 stainless steel Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- -1 for example Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 235000014593 oils and fats Nutrition 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 102000016751 Fringe-like Human genes 0.000 description 1
- 108050006300 Fringe-like Proteins 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229920001477 hydrophilic polymer Polymers 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はインクジェット記録
におけるインクメニスカスを安定に保ち、インクで汚れ
にくく、優れた吐出性能及び耐久性が得られるインクジ
ェットヘッド用ノズルプレートの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a nozzle plate for an ink jet head, which can stably maintain an ink meniscus in ink jet recording, is less likely to be stained with ink, and has excellent ejection performance and durability.
【０００２】[0002]
【従来の技術】インクジェットプリンターは、ノズル内
にインクを満たして正の圧力を掛け、インクをインク室
から押し出し、続いてインクに負の圧力を掛けてノズル
内に引き戻すことにより、押し出したインク柱を引きち
ぎって、ノズルからインク滴を吐出するものである。こ
のときインクメニスカスはノズル内に深く引き込まれ
る。又この負圧によりインクタンクからノズル内にイン
クが満たされ、次の吐出に備える。負圧が反転して正圧
になると、メニスカスが再び押し出され、ノズルの出口
方向に移動する。2. Description of the Related Art An ink jet printer fills a nozzle with ink, applies a positive pressure to the ink, pushes the ink out of an ink chamber, and then applies a negative pressure to the ink to pull the ink back into the nozzle, thereby extruding the ink column. To eject ink droplets from the nozzles. At this time, the ink meniscus is drawn deep into the nozzle. Further, the ink is filled from the ink tank into the nozzles by the negative pressure, and is prepared for the next ejection. When the negative pressure is reversed to a positive pressure, the meniscus is pushed out again and moves toward the outlet of the nozzle.
【０００３】この際、インクを吐出するために掛けた圧
力が、インクを吐出した後も残留して振動するため、ノ
ズル内のインク圧力が変動し、インクメニスカスが振動
する。この振動は数回繰り返されると、次第に減衰して
次の吐出が可能となる。又、インクジェットヘッドの吐
出方式によっては、一つのインク室からインクを吐出す
ると、隣接するインク室にも吐出圧力が伝わって非吐出
ノズルでもインクメニスカスが振動する。At this time, since the pressure applied to discharge the ink remains and vibrates even after the ink is discharged, the ink pressure in the nozzle fluctuates, and the ink meniscus vibrates. When this vibration is repeated several times, it gradually attenuates and the next ejection becomes possible. Further, depending on the ejection method of the ink jet head, when ink is ejected from one ink chamber, the ejection pressure is also transmitted to the adjacent ink chamber, and the ink meniscus vibrates even in a non-ejection nozzle.
【０００４】この圧力変動によりノズル内のインクに正
圧が掛かるとき、インクが吐出口から外に溢れ出ること
がある。ノズルプレートの表面に溢れ出たインクは、次
の負圧でノズル内に引き込まれるが、ノズルプレートの
表面は、溢れ出たインクで汚れ易く、これが安定吐出を
妨げ、画像を劣化させる原因となる。When a positive pressure is applied to the ink in the nozzle due to the pressure fluctuation, the ink may overflow from the discharge port. The ink overflowing on the surface of the nozzle plate is drawn into the nozzles at the next negative pressure, but the surface of the nozzle plate is easily stained with the overflowing ink, which hinders stable ejection and causes deterioration of an image. .
【０００５】即ち、溢れ出たインクや付着したインクミ
ストは、ノズルプレート上に次第に蓄積してインク溜ま
りを形成し、このインク溜まりが吐出口に触れると、吐
出するインク滴を引っ張り、吐出方向を曲げてしまった
り、更に、インク溜まりが大きくなって吐出口を覆う
と、この溜まりを突き破ってインク滴が吐出するときイ
ンクが飛び散り、画像を汚してしまったりする。更にイ
ンク溜まりが吐出口を厚く覆うとインクが吐出しなくな
る。又、ノズルプレート上のインク溜まりには、被印刷
物である紙や布等から発生する繊維や塵が付着し易く、
それがノズル穴を塞ぐこともある。That is, the overflowed ink and the adhering ink mist gradually accumulate on the nozzle plate to form an ink pool. When the ink pool touches the discharge port, the ink drop to be discharged is pulled, and the discharge direction is changed. If the ink outlet is bent or the ink reservoir becomes large and covers the ejection port, the ink splatters when the ink droplet is ejected through the reservoir and the image becomes dirty. Further, if the ink pool covers the discharge port thickly, the ink is not discharged. In addition, the ink pool on the nozzle plate is liable to adhere to fibers or dust generated from paper or cloth, which is a material to be printed,
It can block the nozzle hole.
【０００６】インクによる汚れを防ぐために、ノズルプ
レートに撥インク処理を施すことが行われている。ノズ
ルプレート表面を撥インク処理すると、インクのメニス
カスが吐出口から外に出ても、インクがノズルプレート
上に溢れ出たり、濡れ拡がったりするのを防ぐことがで
きる。[0006] In order to prevent contamination by ink, an ink repellent treatment is performed on the nozzle plate. When the surface of the nozzle plate is treated with the ink repellent ink, even if the meniscus of the ink comes out of the ejection port, it is possible to prevent the ink from overflowing onto the nozzle plate or spreading.
【０００７】ノズルプレート表面を撥インク処理するだ
けでなく、ノズル穴の出口部分も一定長さ撥インク処理
すると、ノズルプレートが更に汚れにくくなり吐出が安
定する。インクメニスカスが、撥インク処理部と未処理
部との境界にあるので、この境界がノズル内に入り込ん
でいると、メニスカスが振動してもインクがノズルプレ
ート表面に溢れ出にくくなるからである。しかしなが
ら、撥インク処理部の入り込みの長さが深すぎるとイン
クの吐出抵抗が大きくなる。また空気泡を吸い込み易く
なるのでかえって吐出が不安定になる。従って、撥イン
ク処理部の深さの制御が極めて重要である。If not only the surface of the nozzle plate is treated with ink repellency, but also the exit portion of the nozzle hole is treated with ink of a fixed length, the nozzle plate becomes more difficult to be stained and the ejection is stabilized. This is because the ink meniscus is at the boundary between the ink-repellent part and the untreated part, and if this boundary enters the nozzle, even if the meniscus vibrates, the ink will not easily overflow onto the nozzle plate surface. However, if the penetration length of the ink-repellent portion is too deep, the ejection resistance of the ink increases. In addition, since the air bubbles are easily sucked, the discharge becomes unstable. Therefore, it is very important to control the depth of the ink-repellent portion.
【０００８】特開昭４８−３７０３０号、同５７−１０
７８４８号等には、ノズルプレートにノズル穴を開けた
後、撥インク素材をスパッタリングによりノズルプレー
ト表面とノズル穴内部のある程度の深さまでコーティン
グすることが記載されている。しかしながら、スパッタ
リングでノズル穴内部の出口部分を一定の長さで撥イン
ク処理することは大変困難である。JP-A-48-37030 and JP-A-57-10
No. 7848 describes that after a nozzle hole is formed in a nozzle plate, an ink-repellent material is coated by sputtering to a certain depth on the nozzle plate surface and inside the nozzle hole. However, it is very difficult to perform the ink-repellent treatment on the exit portion inside the nozzle hole with a fixed length by sputtering.
【０００９】特開昭６４−８７３５９号には、９０℃に
加熱して溶解させた天然ワックスをノズル穴中に充填
し、端面に付着したワックスをふき取って、ノズルプレ
ート表面とノズル内の吐出口付近にテトラフルオロエチ
レンをプラズマ重合法にてコーティングし、その後ワッ
クスを溶解除去することが記載されている。しかしなが
ら、表面にはみ出したワックスをふき取るだけなので、
ノズル穴内部の十分な深さまで撥インク処理することが
できない。Japanese Unexamined Patent Publication (Kokai) No. 64-87359 discloses a method in which natural wax heated and melted at 90 ° C. is filled in a nozzle hole, and wax attached to an end face is wiped off. It describes that tetrafluoroethylene is coated in the vicinity by a plasma polymerization method, and then the wax is dissolved and removed. However, since it only wipes off the wax that has protruded on the surface,
Ink repellent treatment cannot be performed to a sufficient depth inside the nozzle hole.
【００１０】特開平１０−１５７１０６号には、ノズル
プレートのインク吐出側を保護シートで保護してインク
供給側に親インク膜を電着塗装によって設け、次いで保
護シートを取り除いて条件を変えた電着塗装によって撥
インク膜を設けることが記載されているが、この方法で
は、撥インク膜をノズル穴内部まで入り込ませることが
できない。Japanese Patent Application Laid-Open No. 10-157106 discloses a method in which the ink discharge side of a nozzle plate is protected by a protective sheet, an ink-introducing film is provided on the ink supply side by electrodeposition coating, and then the protective sheet is removed to change the conditions. It is described that the ink-repellent film is provided by coating, but this method does not allow the ink-repellent film to enter the inside of the nozzle hole.
【００１１】[0011]
【発明が解決しようとする課題】本発明は上記の事情に
鑑みてなされたものであり、ノズル板表面及びノズル穴
内部が所定の深さで撥インク処理され、安定な吐出性能
が得られるインクジェットヘッド用ノズルプレートの簡
便な製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and an ink-jet method in which the surface of a nozzle plate and the inside of a nozzle hole are subjected to an ink-repellent treatment at a predetermined depth to obtain stable ejection performance. An object of the present invention is to provide a simple method for manufacturing a head nozzle plate.
【００１２】[0012]
【課題を解決するための手段】本発明の上記目的は、 先端部に円柱状の細径部を有する漏斗形状のノズル
穴を基板に穿孔し、感光性樹脂溶液に浸漬して引き上げ
た又は該溶液をスピンコートした該基板に、紫外線を照
射して現像した後インク吐出側の樹脂を除去することに
より前記細径部を除くノズル穴内部に樹脂を充填し、電
着塗装及びメッキから選ばれる少なくとも一方により撥
インク膜を形成し、前記充填した樹脂を除去して撥イン
ク処理するインクジェットヘッドのノズルプレートの製
造方法、及び、 先端部に円柱状の細径部を有する漏斗形状のノズル
穴を基板に穿孔し、該基板のインク供給側面に感光性樹
脂シートを重ねて張り付け、該樹脂を加圧・加熱してノ
ズル穴内部に押し込み、紫外線照射により樹脂を硬化さ
せることにより前記細径部を除くノズル穴内部に樹脂を
充填し、電着塗装により撥インク膜を形成し、前記充填
した樹脂を除去して撥インク処理するインクジェットヘ
ッドのノズルプレートの製造方法、によって達成され
る。SUMMARY OF THE INVENTION The object of the present invention is to form a funnel-shaped nozzle hole having a cylindrical small diameter portion at the tip end on a substrate, and immerse it in a photosensitive resin solution and pull it up. The substrate spin-coated with the solution is irradiated with ultraviolet rays and developed, and then the resin on the ink discharge side is removed to fill the inside of the nozzle hole excluding the small-diameter portion with resin, and is selected from electrodeposition coating and plating. A method of manufacturing a nozzle plate of an ink jet head for forming an ink repellent film by at least one of the above, removing the filled resin and performing ink repellent treatment, and forming a funnel-shaped nozzle hole having a cylindrical small diameter portion at a tip end. Perforating the substrate, laminating a photosensitive resin sheet on the ink supply side surface of the substrate, applying pressure, heating and pushing the resin into the nozzle hole, and curing the resin by irradiating ultraviolet rays Filling the inside of the nozzle hole excluding the small diameter portion, forming an ink-repellent film by electrodeposition coating, and removing the filled resin to perform ink-repellent treatment. Is done.
【００１３】即ち本発明者は、先端部に円柱状の細径部
を有する漏斗形状のノズル穴とすれば、ノズルプレート
基板を感光性樹脂溶液に浸漬して引き上げたり、該溶液
をスピンコートしたり、また感光性樹脂シートの押し込
みをしたりすると前記細径部には樹脂が入り込まないこ
と、電着塗装によって形成した撥インク膜は耐久性能に
優れることを見出し、本発明に至った。In other words, the present inventor has proposed that a nozzle plate substrate having a funnel-shaped nozzle hole having a cylindrical small diameter portion at the tip end can be dipped into a photosensitive resin solution and pulled up, or spin-coated with the solution. When the photosensitive resin sheet is pressed, or when the photosensitive resin sheet is pushed in, the resin does not enter the small-diameter portion, and the ink-repellent film formed by electrodeposition coating has excellent durability performance.
【００１４】以下、本発明について説明する。Hereinafter, the present invention will be described.
【００１５】ノズルプレートの基板としては、ステンレ
ス（ＳＵＳ３０４、３１６、３１６Ｌ、４３０等）、ポ
リイミド、ポリサルフォン、ポリエーテルサルフォン、
ポリカーボネート等が採用できるが、寸法安定性に優
れ、ノズル穴の穿孔を高精度で行えることからステンレ
スが好ましい。またステンレスは導電性皮膜を形成する
処理を施さなくても電着塗装やメッキが可能である。ノ
ズルプレートの厚さは５０〜１００μｍが好ましい。As the substrate of the nozzle plate, stainless steel (SUS304, 316, 316L, 430, etc.), polyimide, polysulfone, polyethersulfone,
Polycarbonate or the like can be used, but stainless steel is preferable because it has excellent dimensional stability and can perform the drilling of the nozzle hole with high precision. Electrodeposition coating and plating can be performed on stainless steel without performing a process of forming a conductive film. The thickness of the nozzle plate is preferably 50 to 100 μm.
【００１６】先端部に円柱状の細径部を有する漏斗形状
のノズル穴を基板に穿孔する方法を図１に基づいて説明
する。A method of punching a funnel-shaped nozzle hole having a columnar small-diameter portion at the tip portion in a substrate will be described with reference to FIG.
【００１７】図１（ａ）において、１は例えばステンレ
ス材のノズルプレート基板、２は細径部２１の先端に錐
状の突出部２２（例えば約１２０°の傾斜を有する円錐
形状）、を有する漏斗形状のポンチ、３はポンチで突い
た時インク吐出側に突き出るノズルプレートの突出部１
１を受け容れる孔３１を有するダイ、４はポンチの上下
動を規制するガイド孔４１を有するポンチが形成されて
いるピンのホルダーで、この図はポンチで突いた状態を
モデル的に示す。ピンの上端にはフリンジ状の段が形成
され（図示せず）、ポンチで突くときのストッパーとな
って、ノズルプレートを貫通しない位置でポンチが止ま
るようになっている。In FIG. 1A, reference numeral 1 denotes a nozzle plate substrate made of, for example, stainless steel, and reference numeral 2 denotes a conical protruding portion 22 (for example, a conical shape having an inclination of about 120 °) at the tip of a small-diameter portion 21. A funnel-shaped punch 3 is a projection 1 of a nozzle plate that protrudes toward the ink ejection side when struck by the punch.
A die 4 having a hole 31 for receiving 1 is a holder for a pin on which a punch having a guide hole 41 for regulating the vertical movement of the punch is shown. A fringe-like step is formed at the upper end of the pin (not shown), and serves as a stopper when punching with a punch, so that the punch stops at a position not penetrating the nozzle plate.
【００１８】図１（ｂ）は、前記ポンチで突いた後、イ
ンク吐出側のノズルプレート突出部１１を研削し穴をあ
けて形成したノズルの孔形状を示すもので、ポンチのテ
ーパー部２３に対応するテーパーを有する穴内部５２
と、細径部２１に対応する細径部５１からなる。具体的
には、ポンチで穿孔するとバリが発生するので、これを
完全に取り除かなければならず、例えば平面ラップ盤の
様な装置を用い、平均粒径２μｍ以上の研磨剤で磨くラ
ップ工程で穴をあけて、穴の周辺に残るバリを平均粒径
１μｍ以下の研磨剤を用いるポリッシュ工程で取り去っ
て仕上げる。FIG. 1B shows the shape of the nozzle formed by grinding and drilling a nozzle plate projecting portion 11 on the ink discharge side after piercing with the punch. Hole 52 with corresponding taper
And a small-diameter portion 51 corresponding to the small-diameter portion 21. Specifically, since burrs are generated when punching with a punch, the burrs must be completely removed. For example, using a device such as a flat lapping machine, a hole is formed in a lapping step of polishing with an abrasive having an average particle diameter of 2 μm or more. Then, burrs remaining around the hole are removed by a polishing process using an abrasive having an average particle size of 1 μm or less to finish.
【００１９】ステンレス基板ではノズル穴内部に有るバ
リは電解研磨で取り除くことができる。電解研磨には、
燐酸と硫酸を混合した研磨液を使用する。ステンレス表
面には不動態膜と油脂が付着しているので、先ずアルカ
リ電解洗浄をしてから電解研磨を行う。これでバリのみ
ならず、ステンレス表面の酸化皮膜も取り除かれ、ステ
ンレス基板全体が親水（インク）化される。これを水
洗、乾燥後以下のマスキングを行う。In a stainless steel substrate, burrs inside the nozzle hole can be removed by electrolytic polishing. For electropolishing,
A polishing liquid in which phosphoric acid and sulfuric acid are mixed is used. Since a passivation film and oils and fats adhere to the stainless steel surface, first, alkaline electrolytic cleaning is performed, and then electrolytic polishing is performed. Thus, not only the burrs but also the oxide film on the stainless steel surface is removed, and the entire stainless steel substrate is made hydrophilic (ink). After washing with water and drying, the following masking is performed.
【００２０】その他の親インク処理としては、親水性材
料、例えば無機酸化物の超微粒子や親水性ポリマー等を
コーティングして行ってもよい。Other ink-philic treatments may be performed by coating a hydrophilic material, for example, ultrafine particles of an inorganic oxide or a hydrophilic polymer.
【００２１】細径部を除くノズル穴内部に樹脂を充填し
て、電着塗装又はメッキを行い撥インク膜を形成する
際、撥インク膜を入り込ませる位置を規制するため感光
性樹脂溶液又は感光性樹脂シートを用いる。撥インク膜
を入り込ませる長さ、即ち細径部の長さは、吐出抵抗及
びメニスカスの安定性から５〜１５μｍが好ましい。細
径部の長さはポンチ形状で所望の長さに調整できる。な
お細径部の径は２０〜６０μｍが好ましい。When the ink is repelled by filling the inside of the nozzle hole excluding the small-diameter portion with an electrodeposition coating or plating to form an ink-repellent film, a photosensitive resin solution or a photosensitive resin is used to regulate the position where the ink-repellent film enters. Use a conductive resin sheet. The length for penetrating the ink-repellent film, that is, the length of the small diameter portion is preferably 5 to 15 μm from the viewpoint of ejection resistance and meniscus stability. The length of the small diameter portion can be adjusted to a desired length in a punch shape. The diameter of the small diameter portion is preferably 20 to 60 μm.
【００２２】具体的には、ノズル穴を形成したプレート
基板１（図２（ａ））を感光性樹脂６の溶液に漬ける。
ポジ型の感光性樹脂（例えば東京応化社製、ＯＦＰＲ８
００）を使用する場合は、インク吐出側から紫外線を照
射して現像すると露光部が溶解して撥インク膜を形成す
る面の下地が露出する。これによりインク供給側面と細
径部５１を除くノズル穴内部５２が硬化した樹脂６でマ
スキングされる。ネガ型の感光性樹脂（例えば東京応化
社製、ＯＭＲ８３）を使用する場合は、インク供給側か
ら紫外線を照射して（図２（ｂ））現像すると露光部が
硬化し、インク吐出側の樹脂が溶解して同様のマスキン
グがされる（図２（ｃ））。More specifically, the plate substrate 1 (FIG. 2A) having the nozzle holes is immersed in a solution of the photosensitive resin 6.
Positive photosensitive resin (for example, OFPR8 manufactured by Tokyo Ohkasha)
In the case of using (00), when an ultraviolet ray is irradiated from the ink discharge side and developed, the exposed portion is dissolved and the base on the surface on which the ink repellent film is formed is exposed. Thereby, the inside 52 of the nozzle hole excluding the ink supply side surface and the small diameter portion 51 is masked with the cured resin 6. When a negative photosensitive resin (for example, OMR83 manufactured by Tokyo Ohka Co., Ltd.) is used, the exposed portion is cured by irradiating ultraviolet rays from the ink supply side (FIG. 2B), and the resin on the ink discharge side is cured. Are dissolved and the same masking is performed (FIG. 2C).
【００２３】またインク供給側にネガ型の感光性樹脂溶
液をスピンコートしてもよい。細径部５１を除くノズル
穴内部５２には毛管力で該溶液が侵入するが、細径部は
径２０〜６０μｍ程度のため、通常２０〜３０ｃｐの粘
度を有する該溶液は侵入できない。露光現像については
浸漬する場合と同様である。Further, a negative photosensitive resin solution may be spin-coated on the ink supply side. The solution penetrates into the inside of the nozzle hole 52 except for the small diameter portion 51 by capillary force, but since the small diameter portion has a diameter of about 20 to 60 μm, the solution having a viscosity of usually 20 to 30 cp cannot enter. Exposure development is the same as in immersion.
【００２４】ノズル穴を穿孔した基板のインク供給側面
に感光性樹脂シート（いわゆるドライフィルム）を重ね
て張り付け、該樹脂を加圧・加熱してノズル穴内部に押
し込むと、樹脂はコーン部には侵入できるが細径部には
侵入できず、紫外線を照射して樹脂を硬化させることに
より前記細径部５１を除くノズル穴内部５２に樹脂６を
充填することもできる。When a photosensitive resin sheet (a so-called dry film) is overlaid and adhered to the ink supply side surface of the substrate having the nozzle holes, the resin is pressed and heated and pushed into the nozzle holes. The resin 6 can enter, but cannot enter the small-diameter portion, and can be filled with the resin 6 in the nozzle hole interior 52 except for the small-diameter portion 51 by irradiating ultraviolet rays to cure the resin.
【００２５】一般に電着塗装やメッキでは、皮膜の付着
を強固にするため母材の前処理が行われる。母材がステ
ンレスの場合、表面には酸化鉄の不動態膜と油脂が付着
しているので、これらを除去する必要があるが、上記の
バリ取り処理時にこれらが除去される。メッキでは、更
に塩酸に漬けて表面を活性化し、下地となるストライク
メッキを施す必要が有り、電着塗装よりも工数が多くな
る。In general, in electrodeposition coating and plating, a pretreatment of a base material is performed in order to strengthen the adhesion of a film. When the base material is stainless steel, a passivation film of iron oxide and oils and fats adhere to the surface, and these must be removed. However, these are removed during the deburring process described above. In plating, it is necessary to activate the surface by further immersion in hydrochloric acid and to apply strike plating as a base, which requires more man-hours than electrodeposition coating.
【００２６】上記マスク済みの基板を電着液に浸して通
電するとノズルプレートのインク吐出側とノズル穴の細
径部に撥インク膜７が形成される（図２（ｄ））。電着
液やメッキ液は数ｃｐと低粘度で、且つ電気的にノズル
プレートに吸引されるのでノズル穴の細径部にも入り込
むことができる。When the masked substrate is immersed in the electrodeposition liquid and energized, an ink-repellent film 7 is formed on the ink discharge side of the nozzle plate and on the small diameter portion of the nozzle hole (FIG. 2D). The electrodeposition solution and the plating solution have a low viscosity of several cp and are electrically sucked into the nozzle plate, so that they can enter the small diameter portion of the nozzle hole.
【００２７】撥インク膜としては、フッ素樹脂の微粒子
とアクリル樹脂からなる液を電着したものが好ましい。
これはＰＴＦＥ（ポリテトラフルオロエチレン）分散液
と、カルボキシル基等のアニオン基を持つアクリル樹脂
を含む液に、ノズルプレート基板を浸して、これを陽極
として電着して得られる。またＮｉメッキ液にＰＴＦＥ
微粒子を分散してメッキした共析メッキ膜でもよい。但
し共析メッキ皮膜は金属が表面に露出した金属膜のた
め、水やインク成分で腐食されることがある。また超音
波洗浄を行うとＦ粒子が脱落して撥水性の劣化を招くこ
ともある。電着膜は有機膜のためそれらの不都合を避け
ることができるので、共析メッキ皮膜上に更に電着膜を
積層して撥インク膜としてもよい。As the ink-repellent film, a film obtained by electrodepositing a liquid containing fine particles of a fluorine resin and an acrylic resin is preferable.
This is obtained by immersing the nozzle plate substrate in a PTFE (polytetrafluoroethylene) dispersion liquid and a liquid containing an acrylic resin having an anionic group such as a carboxyl group, and performing electrodeposition using the nozzle plate substrate as an anode. Also, PTFE is added to the Ni plating solution.
A eutectoid plating film in which fine particles are dispersed and plated may be used. However, since the eutectoid plating film is a metal film having a metal exposed on the surface, it may be corroded by water or ink components. Also, when ultrasonic cleaning is performed, F particles may fall off, resulting in deterioration of water repellency. Since the electrodeposition film is an organic film, such disadvantages can be avoided. Therefore, an electrodeposition film may be further laminated on the eutectoid plating film to form an ink-repellent film.
【００２８】最後にマスキングに使用した樹脂を剥離し
て親インク処理と撥インク処理がなされたノズルプレー
トが形成される（図２（ｅ））。Finally, the resin used for the masking is removed to form a nozzle plate that has been subjected to the ink-philic treatment and the ink-repellent treatment (FIG. 2E).
【００２９】[0029]
【実施例】以下、実施例を用いて本発明を詳細に説明す
るが、本発明はこれによって限定されるものではない。EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited thereto.
【００３０】実施例１ （穿孔、研磨）厚さ１００μｍのＳＵＳ３１６Ｌのノズ
ルプレート基板に、精密ポンチを用いて穿孔し、細径部
の径４２μｍ、細径部の長さ１０μｍ、インク供給側の
開口径８０μｍのノズル穴になる様にプレート基板の厚
さを８０μｍに仕上げた。Example 1 (Punching and polishing) A SUS316L nozzle plate substrate having a thickness of 100 μm was pierced using a precision punch to form a small-diameter portion having a diameter of 42 μm, a small-diameter portion having a length of 10 μm, and opening the ink supply side. The thickness of the plate substrate was finished to 80 μm so as to form a nozzle hole having a diameter of 80 μm.
【００３１】（アルカリ電解洗浄）１５％ＮａＯＨと燐
酸塩とキレート剤を含む、アルカリ電解洗浄液を用い、
陽極にニッケル板、陰極にポンチしたノズルプレート基
板を取り付けて、５０℃で、電流密度５Ａ／ｄｍ2、電
圧３Ｖ、５分間のアルカリ陰極電解洗浄を行った。(Alkaline Electrolytic Cleaning) Using an alkaline electrolytic cleaning solution containing 15% NaOH, phosphate and a chelating agent,
A nickel plate was mounted on the anode, and a nozzle plate substrate punched on the cathode was attached, and alkali cathode electrolytic cleaning was performed at 50 ° C. at a current density of 5 A / dm 2 and a voltage of 3 V for 5 minutes.
【００３２】（電解研磨）燐酸２００ｃｃと硫酸４０ｃ
ｃよりなる電解研磨液を使用して、陰極にカーボン、陽
極にポンチしたノズルプレート基板を取り付けて、７０
℃で、電流密度３０Ａ／ｄｍ2、電圧３Ｖ、５分間の電
解研磨を行った。(Electropolishing) 200 cc of phosphoric acid and 40 c of sulfuric acid
Using an electropolishing liquid consisting of c, a carbon was attached to the cathode, and a nozzle plate substrate punched to the anode was attached.
Electropolishing was performed at a temperature of 30 ° C., a current density of 30 A / dm 2 and a voltage of 3 V for 5 minutes.
【００３３】（マスキング）電解研磨後、洗浄して乾燥
させたノズルプレート基板に、東京応化（株）製ネガ型
感光性樹脂ＯＭＲ８３をスピンコートし、インク供給側
から紫外線を１２ｍＷ／ｃｍ2照射し、ＯＭＲ用現像液
で１分間現像して、インク供給側を樹脂で被覆し、且つ
細径部を除くノズル穴内部に該樹脂を充填した。(Masking) A negative photosensitive resin OMR83 manufactured by Tokyo Ohka Co., Ltd. is spin-coated on the nozzle plate substrate which has been washed and dried after the electrolytic polishing, and is irradiated with ultraviolet rays of 12 mW / cm 2 from the ink supply side. After developing for 1 minute with a developing solution for OMR, the ink supply side was covered with a resin, and the resin was filled in the inside of the nozzle hole excluding the small diameter portion.
【００３４】（電着塗料の作製）ＰＴＦＥ微粉末２５ｇ
に、分散剤１０ｇを加え、少量の純水と共にトリエチル
アミン０．５ｍｌを加えて混合し、純水を徐々に加えＰ
ＴＦＥを分散させて２５０ｍｌとする。水溶性耐熱ワニ
ス５０ｇとイオン交換水２００ｇを混合して撹拌し、イ
オン交換処理によって精製して雑イオンを取り除き、両
者を合わせて電着塗料とした。(Preparation of electrodeposition paint) PTFE fine powder 25 g
, 10 g of a dispersant, 0.5 ml of triethylamine and a small amount of pure water were added and mixed.
Disperse TFE to 250 ml. 50 g of a water-soluble heat-resistant varnish and 200 g of ion-exchanged water were mixed and stirred, purified by ion exchange treatment to remove miscellaneous ions, and the two were combined to form an electrodeposition paint.
【００３５】（撥インク膜の形成）上記の電着塗料中
で、マスキングしたノズルプレート基板を陽極とし、Ｓ
ＵＳ３０４板を陰極として、２５℃、３５Ｖ、２分間の
電着条件により、２μｍの電着膜を被着させた。その
後、１００℃で５分間乾燥した後、１３０℃で３０分間
硬化させた。(Formation of Ink Repellent Film) In the above-mentioned electrodeposition paint, the masked nozzle plate substrate was used as an anode.
Using a US304 plate as a cathode, a 2 μm electrodeposited film was deposited under electrodeposition conditions of 25 ° C., 35 V, and 2 minutes. Then, after drying at 100 ° C. for 5 minutes, it was cured at 130 ° C. for 30 minutes.
【００３６】（樹脂の剥離）マスクに用いた感光性樹脂
の除去は、１００℃に加熱したＯＭＲ８３（前述）用剥
離液５０２Ａに電着済みノズルプレート基板を浸漬して
樹脂を溶解させて行った。なお感光性樹脂シートを用い
る場合は、４０℃に加熱したＮａＯＨを用いればよい。(Removal of Resin) The photosensitive resin used for the mask was removed by immersing the electrodeplated nozzle plate substrate in a release liquid 502A for OMR83 (described above) heated to 100 ° C. to dissolve the resin. . When a photosensitive resin sheet is used, NaOH heated to 40 ° C. may be used.
【００３７】得られたノズルプレートのインク吐出側面
の水の接触角は１００°あり、十分な撥インク性を有し
ていた。またインクジェットヘッドのワイピングに用い
られる鐘紡（株）製不織布、ベルイーターを用い、これ
にインクを含ませて３０ｇの荷重を掛けながら２０，０
００回の擦りテストを行ったが、傷の発生はなく、接触
角が僅かに低下し９５°になった。また走査型電子顕微
鏡を用いた４５°斜め方向からの観察により、ノズル穴
のストレート部が均一に撥インク処理されていることを
確認した。このノズルプレートをピエゾタイプのアクチ
ュエーターに接着してインクジェットヘッドを作製し、
インクを吐出させたところ、各ノズル間で吐出速度、吐
出方向、吐出量に差は見られなかった。The contact angle of water on the ink ejection side surface of the obtained nozzle plate was 100 °, indicating that the nozzle plate had sufficient ink repellency. Further, a nonwoven fabric manufactured by Kanebo Co., Ltd., which is used for wiping the ink jet head, and a bell eater are used.
The rubbing test was carried out 00 times. As a result, no scratch was generated, and the contact angle was slightly reduced to 95 °. Observation from a 45 ° oblique direction using a scanning electron microscope confirmed that the straight portion of the nozzle hole was uniformly treated for ink repellency. This nozzle plate is bonded to a piezo type actuator to produce an inkjet head,
When the ink was ejected, no difference was observed in the ejection speed, ejection direction, and ejection amount between the nozzles.
【００３８】実施例２ 電解研磨までは実施例１と同様に行った。Example 2 The procedure was the same as in Example 1 up to electrolytic polishing.
【００３９】（マスキング）電解研磨後、洗浄して乾燥
させたノズルプレート基板に、東京応化（株）製ポジ型
感光性樹脂ＯＦＰＲ−８００をディップコートし、イン
ク吐出側から紫外線を１２ｍＷ／ｃｍ2照射し、ＯＦＰ
Ｒ用現像液ＮＭＤ−３で１分間現像して、樹脂でインク
供給側を被覆し、且つ細径部を除くノズル穴内部に該樹
脂を充填した。(Masking) A positive-type photosensitive resin OFPR-800 manufactured by Tokyo Ohka Co., Ltd. was dip-coated on the nozzle plate substrate that had been washed and dried after electrolytic polishing, and ultraviolet rays were irradiated from the ink discharge side at 12 mW / cm 2. Irradiate, OFP
After developing for 1 minute with a developing solution NMD-3 for R, the ink supply side was covered with a resin, and the resin was filled inside the nozzle hole excluding the small diameter portion.
【００４０】（メッキ下地の形成）マスキングされたノ
ズルプレート基板を２０％塩酸中に室温で５分間浸漬し
て活性化し、ＮｉＣｌ2２４０ｇ／Ｌ、塩酸１２５ｍｌ
／Ｌのメッキ液を用いて陽極にニッケル板、陰極に該基
板を取り付け、室温で、電流密度８Ａ／ｄｍ2、電圧６
Ｖ、３分間のメッキ処理を行い、下地メッキとした。(Formation of plating underlayer) The masked nozzle plate substrate was activated by immersing it in 20% hydrochloric acid at room temperature for 5 minutes, and 240 g / L of NiCl 2 and 125 ml of hydrochloric acid were activated.
A / L plating solution was used to attach the nickel plate to the anode and the substrate to the cathode, and at room temperature, a current density of 8 A / dm 2 and a voltage of 6
V, plating was performed for 3 minutes to obtain a base plating.
【００４１】（撥インク膜の形成）次亜燐酸塩と錯化剤
とニッケルとＰＴＦＥ分散粒子を含む、９０℃の無電解
共析メッキ液にノズルプレート基板を入れて２μｍの撥
インク膜を形成した。(Formation of Ink Repellent Film) A nozzle plate substrate is placed in a 90 ° C. electroless eutectoid plating solution containing hypophosphite, a complexing agent, nickel and PTFE dispersed particles to form a 2 μm ink repellent film. did.
【００４２】（電着膜の形成）前記電着塗料を用いて、
メッキ皮膜上に３５Ｖで２分の電着を行い、２μｍの撥
インク膜を形成した。(Formation of Electrodeposited Film)
Electrodeposition was performed on the plating film at 35 V for 2 minutes to form a 2 μm ink-repellent film.
【００４３】（樹脂の剥離）ＯＦＰＲ用剥離液５０２Ａ
を１００℃に加温して、この中にノズルプレート基板を
漬けてマスキング用樹脂を溶解し、ノズルプレートを得
た。(Release of Resin) Release Liquid 502A for OFPR
Was heated to 100 ° C., and the nozzle plate substrate was immersed therein to dissolve the masking resin to obtain a nozzle plate.
【００４４】得られたノズルプレートで実施例１と同様
に評価したところ、同様の結果が得られた。When the obtained nozzle plate was evaluated in the same manner as in Example 1, similar results were obtained.
【００４５】実施例３ 電解研磨までは実施例１と同様に行った。Example 3 The procedure was the same as in Example 1 up to electrolytic polishing.
【００４６】マスキングとして、ノズルプレート基板の
インク供給側にＤｕｐｏｎｔ社製ドライフィルムＦＸ１
３０を１０８℃、３ｋｇ／ｃｍ2の条件でラミネート
し、該ドライフィルムに３２０〜４００ｎｍの長波長紫
外線を照射し、以降実施例１と同様にして２μｍの撥イ
ンク膜を形成した。As masking, a dry film FX1 manufactured by Dupont was placed on the ink supply side of the nozzle plate substrate.
No. 30 was laminated at 108 ° C. under a condition of 3 kg / cm 2 , and the dry film was irradiated with a long-wavelength ultraviolet ray of 320 to 400 nm to form a 2 μm ink-repellent film in the same manner as in Example 1.
【００４７】これを５０℃に加熱した５％のＮａＯＨ液
に漬けてドライフィルムを剥離し、ノズルプレートを得
た。This was immersed in a 5% NaOH solution heated to 50 ° C., and the dry film was peeled off to obtain a nozzle plate.
【００４８】得られたノズルプレートで実施例１と同様
に評価したところ、同様の結果が得られた。When the obtained nozzle plate was evaluated in the same manner as in Example 1, similar results were obtained.
【００４９】比較例 円錐形のポンチを使用して、インク供給側開口径８０μ
ｍ、インク吐出側開口径４２μｍの円錐形ノズル穴を穿
孔した以外は実施例１と全て同様にしてノズルプレート
を作製した。このノズルプレートをピエゾタイプのアク
チュエーターに接着してインクジェットヘッドを作製
し、インクを吐出させたところ、各ノズル間で吐出速
度、吐出方向、吐出量が大きくバラツキ、画質が著しく
劣化した。Comparative Example Using a conical punch, the opening diameter on the ink supply side was 80 μm.
m, a nozzle plate was prepared in the same manner as in Example 1 except that a conical nozzle hole having an opening diameter of 42 μm on the ink ejection side was formed. When this nozzle plate was bonded to a piezo-type actuator to produce an ink jet head, and ink was ejected, the ejection speed, ejection direction, and ejection amount among the nozzles varied greatly, and the image quality was significantly deteriorated.
【００５０】[0050]
【発明の効果】本発明によれば、先端部に円柱状の細径
部を有する漏斗形状のノズル穴としたので、マスキング
の際先端部の円柱状の細径部に樹脂が入り込まないた
め、ノズル穴内部が所定の深さで撥インク処理されるの
で、メニスカスを安定に維持でき、またノズル毎にメニ
スカス位置が変動せず、安定な吐出性能を有するインク
ジェットヘッドを得ることができると共に、撥インク処
理膜の耐久性に優れ、長期に亘って安定な吐出ができ
る。According to the present invention, since a funnel-shaped nozzle hole having a cylindrical thin portion at the tip is formed, no resin enters the cylindrical thin portion at the tip during masking. Since the inside of the nozzle hole is subjected to the ink-repellent treatment at a predetermined depth, the meniscus can be stably maintained, the meniscus position does not fluctuate for each nozzle, and an inkjet head having stable ejection performance can be obtained. The durability of the ink processing film is excellent, and stable ejection can be performed for a long time.
【図１】ノズル穴の形成方法を説明する図。FIG. 1 is a diagram illustrating a method for forming a nozzle hole.
【図２】本発明の撥インク膜形成プロセスをモデル的に
示す図。FIG. 2 is a diagram schematically showing an ink-repellent film forming process of the present invention.
１ ノズルプレート（基板） ２ ポンチ ３ ダイ ４ ピンホルダー ５１ 細径部 ６ 感光性樹脂 ７ 撥インク膜 DESCRIPTION OF SYMBOLS 1 Nozzle plate (substrate) 2 Punch 3 Die 4 Pin holder 51 Small diameter part 6 Photosensitive resin 7 Ink-repellent film
Claims (2)
状のノズル穴を基板に穿孔し、感光性樹脂溶液に浸漬し
て引き上げた又は該溶液をスピンコートした該基板に、
紫外線を照射して現像した後インク吐出側の樹脂を除去
することにより前記細径部を除くノズル穴内部に樹脂を
充填し、電着塗装及びメッキから選ばれる少なくとも一
方により撥インク膜を形成し、前記充填した樹脂を除去
して撥インク処理することを特徴とするインクジェット
ヘッドのノズルプレートの製造方法。1. A funnel-shaped nozzle hole having a cylindrical small diameter portion at a tip portion is pierced in a substrate, and the substrate is immersed in a photosensitive resin solution and pulled up or spin-coated with the solution.
After developing by irradiating ultraviolet rays, the resin on the ink discharge side is removed to fill the inside of the nozzle hole except for the small-diameter portion, and an ink-repellent film is formed by at least one selected from electrodeposition coating and plating. A method of manufacturing a nozzle plate of an ink jet head, wherein the filled resin is removed and an ink repellent treatment is performed.
状のノズル穴を基板に穿孔し、該基板のインク供給側面
に感光性樹脂シートを重ねて張り付け、該樹脂を加圧・
加熱してノズル穴内部に押し込み、紫外線照射により樹
脂を硬化させることにより前記細径部を除くノズル穴内
部に樹脂を充填し、電着塗装により撥インク膜を形成
し、前記充填した樹脂を除去して撥インク処理すること
を特徴とするインクジェットヘッドのノズルプレートの
製造方法。2. A substrate is provided with a funnel-shaped nozzle hole having a cylindrical small diameter portion at a tip end thereof, and a photosensitive resin sheet is superposed and attached on an ink supply side surface of the substrate, and the resin is pressed and compressed.
The resin is filled inside the nozzle hole except for the small-diameter portion by heating and pushing the inside of the nozzle hole to cure the resin by irradiating ultraviolet rays, an ink-repellent film is formed by electrodeposition coating, and the filled resin is removed. And producing a nozzle plate of an ink jet head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11196660A JP2001018398A (en) | 1999-07-09 | 1999-07-09 | Manufacture of nozzle plate of ink jet head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11196660A JP2001018398A (en) | 1999-07-09 | 1999-07-09 | Manufacture of nozzle plate of ink jet head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001018398A true JP2001018398A (en) | 2001-01-23 |
Family
ID=16361486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11196660A Pending JP2001018398A (en) | 1999-07-09 | 1999-07-09 | Manufacture of nozzle plate of ink jet head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001018398A (en) |
Cited By (7)
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|---|---|---|---|---|
| WO2003053699A1 (en) * | 2001-12-20 | 2003-07-03 | Seiko Epson Corporation | Nozzle plate for liquid drop spray head, method for manufacturing the same and a punch |
| KR100413693B1 (en) * | 2002-04-02 | 2004-01-03 | 삼성전자주식회사 | Ink jet print head and manufacturing method thereof |
| EP1375154A3 (en) * | 2002-06-26 | 2004-04-14 | Brother Kogyo Kabushiki Kaisha | Process of manufacturing nozzle plate for ink-jet print head |
| KR100453047B1 (en) * | 2002-04-17 | 2004-10-15 | 삼성전자주식회사 | Ink jet print head and manufacturing method thereof |
| JP2013028101A (en) * | 2011-07-29 | 2013-02-07 | Seiko Epson Corp | Liquid ejecting head and liquid ejecting device |
| KR101257837B1 (en) * | 2005-12-16 | 2013-04-29 | 삼성디스플레이 주식회사 | Method for forming hydrophobic coating layer on surface of nozzle plate of inkjet printhead |
| EP3482870A1 (en) * | 2017-11-14 | 2019-05-15 | SII Printek Inc | Method for manufacturing jet hole plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1292904C (en) * | 2001-12-20 | 2007-01-03 | 精工爱普生株式会社 | Nozzle plate for droplet ejection head, method of manufacturing nozzle plate, and punch |
| US7480993B2 (en) | 2001-12-20 | 2009-01-27 | Seiko Epson Corporation | Method of manufacturing a nozzle plate |
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| EP1780021A1 (en) * | 2002-06-26 | 2007-05-02 | Brother Kogyo Kabushiki Kaisha | Process of manufacturing nozzle plate for ink-jet print head |
| EP1375154A3 (en) * | 2002-06-26 | 2004-04-14 | Brother Kogyo Kabushiki Kaisha | Process of manufacturing nozzle plate for ink-jet print head |
| KR101257837B1 (en) * | 2005-12-16 | 2013-04-29 | 삼성디스플레이 주식회사 | Method for forming hydrophobic coating layer on surface of nozzle plate of inkjet printhead |
| JP2013028101A (en) * | 2011-07-29 | 2013-02-07 | Seiko Epson Corp | Liquid ejecting head and liquid ejecting device |
| EP3482870A1 (en) * | 2017-11-14 | 2019-05-15 | SII Printek Inc | Method for manufacturing jet hole plate |
| JP2019089233A (en) * | 2017-11-14 | 2019-06-13 | エスアイアイ・プリンテック株式会社 | Manufacturing method of injection hole plate |
| CN110001200A (en) * | 2017-11-14 | 2019-07-12 | 精工电子打印科技有限公司 | Spray the manufacturing method of orifice plate |
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