JP2001015667A - Lead frame, resin-sealed semiconductor device using the same, and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] In a structure in which a member supporting a semiconductor element is exposed from the back surface of a sealing resin, there is a problem of deterioration in moisture resistance. A heat radiating member 2 exposed from a sealing resin,
The lead frame includes a suspension lead portion 3 supporting the heat radiating member 2, a lead portion 4, and a wing portion 6 having a supporting portion 5 provided on each side of the heat radiating member 2 for supporting a semiconductor element. By using a lead frame,
The heat radiating member 2 is exposed from the sealing resin, and the supporting portion 5 for supporting the semiconductor element can be sealed in the sealing resin. Since the sealing resin can be interposed therebetween, the moisture resistance of the resin-sealed semiconductor device can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame having a function of effectively supporting a semiconductor element, a resin-encapsulated semiconductor device using the same, and a method of manufacturing the same. The present invention relates to an improvement of a resin-encapsulated semiconductor device in which a lower surface of a die pad portion is exposed in order to dissipate heat from an element.

[0002]

2. Description of the Related Art In recent years, in order to cope with miniaturization of electronic equipment, it has been required to mount semiconductor components mounted on electronic equipment at a high density, and accordingly, semiconductor parts have been reduced in size and thickness. In.

Hereinafter, a lead frame used in a conventional resin-sealed semiconductor device of a die pad portion exposed type will be described with reference to the drawings.

FIG. 35 is a view showing the structure of a conventional lead frame. FIG. 35 (a) is a plan view, and FIG.
FIG. 36B is a cross-sectional view taken along a line A-A1 in FIG.

As shown in FIG. 35, a conventional lead frame includes a frame 101 made of a copper (Cu) material, a rectangular die pad 102 on which a semiconductor element is mounted, and When the corners of the die pad portion 102 are supported at the tip end, and the suspension lead portion 103 whose end portion is connected to the frame 101 and the semiconductor element are mounted,
It is composed of a plurality of beam-shaped lead portions 104 electrically connected to the mounted semiconductor element by a connecting means such as a thin metal wire. When the lead portion 104 is sealed with the sealing resin, the portion embedded in the sealing resin portion constitutes the lead portion 104a, and the portion exposed from the sealing resin portion constitutes the outer lead portion 104b. And the inner lead portion 104a and the outer lead portion 104b
They are provided integrally and continuously.

FIG. 35 shows a conventional lead frame.
As shown in (b), the die pad portion 102 is supported by the suspension lead portion 103, and the die pad portion 102 is higher than the upper surface of the lead portion 104 by a depress portion (not shown) provided on the suspension lead portion 103. It is down-set so as to be located below. This structure is for exposing the lower surface of the die pad portion 102 to the bottom surface of the sealing resin portion when a semiconductor device is mounted to form a resin-sealed semiconductor device. The die pad portion 102 has a wing portion 105 at a peripheral portion thereof, and forms a resin-encapsulated semiconductor device.
02 has a function of preventing intrusion of moisture when the lower surface of the sealing resin portion is exposed from the bottom surface of the sealing resin portion.

[0007] Although not shown, the surface of a conventional lead frame is plated.

Next, a conventional resin-encapsulated semiconductor device and a method of manufacturing the same will be described.

FIGS. 36 to 40 are views showing a method of manufacturing a resin-sealed semiconductor device using the lead frame shown in FIG.

[0010] First, as shown in FIG.
In the frame, a die pad 102 having a rectangular shape on which a semiconductor element is mounted and being set up, and a wing 105 provided around the die pad 102 are provided.
And the corners of the die pad portion 102 are supported at the tip thereof,
It has a suspension lead portion whose end is connected to the frame, and a beam-shaped lead portion 104 that is electrically connected to the mounted semiconductor element by a connecting means such as a thin metal wire when the semiconductor element is mounted. Prepare a lead frame.

Then, as shown in FIG. 37, the semiconductor element 106 is placed on the die pad 102 with an adhesive 1 such as a silver paste.
07 and mounted.

Next, as shown in FIG.
02 and the inner lead portion 1 of the lead portion 104 on the electrode pad (not shown) on the surface of the semiconductor element 106 mounted on
04a is electrically connected by a thin metal wire 108.

Next, as shown in FIG. 39, the lead frame is placed in a sealing mold, a sealing resin 109 made of an epoxy resin is injected by transfer molding, and a die pad portion 102 is formed around the lead frame. , Semiconductor element 106, inner lead portion 104 of lead portion 104
The connection region between a and the thin metal wire 108 is sealed. Here, sealing is performed so that the lower surface of the die pad portion 102 is exposed to the bottom surface of the sealing resin 109.

Then, the cut portion of the lead portion 104 is subjected to lead cutting with a cutting blade using a die, and lead forming (bending process) is performed, thereby forming a lead on the die pad portion 102 of the lead frame as shown in FIG. The semiconductor element 106 is mounted by an adhesive 107, and the semiconductor element 106 and the inner lead 10 of the lead 104 are mounted.
4a are electrically connected to each other by a thin metal wire 108, the outer periphery is sealed by a sealing resin 109, and the sealing resin 10
9 is a resin-encapsulated semiconductor device in which the outer lead portion 104b is exposed from the side surface, and the lower surface of the die pad portion 102 is exposed from the bottom surface of the sealing resin 109;
Thus, a resin-encapsulated semiconductor device having a structure in which the wing 105 of No. 02 is sealed in the sealing resin 109 is obtained.

[0015]

However, in the conventional resin-encapsulated semiconductor device, although the lower surface of the die pad portion is exposed from the encapsulation resin to achieve a reduction in thickness and heat dissipation, the following problems are posed. was there.

First, as shown in the cross-sectional view of FIG. 41, the die pad portion 102 is provided with a wing portion 105 for preventing intrusion of moisture.
5, the semiconductor device 1 mounted on the die pad portion 102
However, there is a problem in that a large element (the configuration shown by a broken line in the drawing) cannot be mounted, and a small package having a large element cannot be realized.

Second, the semiconductor element 106 is adversely affected by the stress of the sealing resin 109 and the stress after mounting.
There is also a problem that cracks occur in the sealing resin 109. In particular, as shown in FIG. 41, when moisture enters between the die pad portion 102 and the sealing resin 109 (arrows in the drawing), the adhesion between the two and the occurrence of cracks become remarkable. As a result, there is a problem that the reliability is further deteriorated.

Third, although the sealing resin 109 exists on the upper surface and the side surface of the die pad portion 102, the sealing resin 109 does not exist on the back surface side of the die pad portion 102. For this reason, moisture is absorbed by the adhesive 107 that bonds the lower surface of the semiconductor element 106, and the holding power of the sealing resin to the die pad portion 102 and the semiconductor element 106 is reduced due to vaporization and expansion at a high temperature at the time of mounting. Was worse (popcorn cracking).

Fourth, the semiconductor element 106 is bonded to the adhesive 107.
When connected to the upper surface of the die pad portion 102, a difference in thermal expansion coefficient causes the die pad portion 102 to warp, and a part of the sealing resin protrudes on the back surface of the die pad portion 102 during resin sealing, so-called resin burrs are generated. There was a problem of doing.

Fifth, in the bonding between the mounting board and the die pad portion, if a part of the sealing resin protrudes from the back surface of the die pad portion 102 and so-called resin burrs are interposed, the contact with the connecting portion of the mounting substrate is not achieved. There is a possibility that desired characteristics such as heat radiation characteristics cannot be sufficiently exhibited. On the other hand, this resin burr can be removed by using a water jet or the like, but such a process requires complicated labor, and the plating layer on the lead surface is peeled off by the water jet process and impurities are attached, so that the resin sealing is performed. After the stopping step, it is necessary to apply plating to a portion exposed from the resin sealing, which may cause a reduction in work efficiency and a decrease in reliability.

The present invention has been made in view of the above points, and its typical purpose is as follows.

A first object of the present invention is to separate a die pad portion having a function of mounting a semiconductor element and a member having a heat dissipation function, so that the heat dissipation member when the lower surface of the heat dissipation member is exposed from the sealing resin. An object of the present invention is to provide a reliable resin-sealed semiconductor device and a lead frame suitable for manufacturing the same by suppressing peeling of a heat radiating member by increasing a holding force of a sealing resin for the semiconductor device.

A second object of the present invention is to separate the die pad portion and the heat radiating member, thereby suppressing cracks in the sealing resin due to intrusion of moisture or moisture from between the heat radiating member and the sealing resin. An object of the present invention is to provide a resin-encapsulated semiconductor device to be obtained and a lead frame suitable for manufacturing the same.

A third object of the present invention is to provide a highly reliable resin-encapsulated semiconductor device by separating a die pad portion and a heat radiating member so that a large semiconductor element can be mounted, and a method of manufacturing the same. Is to do.

A fourth object of the present invention is to separate the die pad portion from the heat radiating member to prevent the occurrence of resin burrs when the lower surface of the heat radiating member is exposed from the sealing resin, thereby achieving a heat radiation characteristic. It is an object of the present invention to provide a resin-encapsulated semiconductor device, a method of manufacturing the same, and a lead frame suitable for the manufacture thereof.

A fifth object of the present invention is to provide a highly reliable resin-encapsulated semiconductor when the lower surface of the heat radiating member is exposed from the sealing resin by disposing the die pad portion above the heat radiating member. An object of the present invention is to provide an apparatus and a method of manufacturing the same.

Further, a sixth object of the present invention is to provide a highly reliable resin sealing without a resin burr when the lower surface of the heat radiating member is exposed from the sealing resin by disposing the die pad portion on the suspension lead portion. It is an object of the present invention to provide a stop-type semiconductor device, a method of manufacturing the same, and a lead frame suitable for the manufacture thereof.

Further, a seventh object of the present invention is to dispose the die pad portion on the suspension lead portion and position the die pad portion above the heat radiating member so that the lower surface of the heat radiating member is exposed from the sealing resin. And a method of manufacturing the same.

[0029]

In order to solve the above-mentioned conventional problems, a lead frame of the present invention, a resin-encapsulated semiconductor device using the same, and a method of manufacturing the same are as follows.

That is, the lead frame of the present invention comprises a frame, a heat dissipating member provided in an opening area of the frame, and a plurality of leads each having a distal end facing the heat dissipating member and a terminal connected to the frame. And a lead frame having a support portion for supporting the semiconductor element near the heat radiating member.

A frame frame, a heat radiating member provided in an opening area of the frame frame, a suspension lead portion supporting the heat radiating member at a distal end thereof and connected to the frame frame at a distal end portion, A plurality of leads each having a distal end opposed to the member and a distal end connected to the frame, and a depress portion provided on the suspension lead portion for disposing the heat radiating member below an upper surface of the lead portion; And a lead frame having a supporting portion for supporting a semiconductor element near the heat radiating member.

Specifically, the support portion provided near the heat radiating member is a lead frame integrally provided in a wing shape on each side of the heat radiating member.

Further, the supporting portion provided near the heat radiating member includes:
It is a lead frame provided in a suspension lead portion that supports a heat radiation member.

Further, a frame, a heat dissipating member provided in an opening area of the frame, a projection for supporting a semiconductor element provided on the heat dissipating member, and the heat dissipating member supported at its tip. A suspension lead portion connected to the frame at an end portion, and a distal end of the suspension lead portion facing the heat dissipation member,
A plurality of lead portions whose ends are connected to the frame, and a depress portion provided on the suspension lead portion to arrange the heat dissipation member below the upper surface of the lead portion,
A lead frame having a support portion for supporting a semiconductor element on the suspension lead portion, wherein a support portion provided on the upper surface of the protrusion on the heat dissipation member and the suspension lead portion by a depressed portion of the suspension lead portion. The upper surface of the portion is a lead frame arranged on the same surface.

A resin-encapsulated semiconductor device according to the present invention includes a semiconductor element having an electrode pad, a heat radiating member provided below the semiconductor element, and a suspension lead supporting the heat radiating member and having a depressed portion. And a wing portion provided on each side of the heat dissipating member and having a support portion supporting the semiconductor element via an adhesive, and a plurality of wing portions each having a distal end opposed to the heat dissipating member and having a distal end serving as an external terminal. A lead portion for signal connection, a thin metal wire electrically connecting the electrode pad of the semiconductor element and the lead portion, a portion excluding a lower surface of the heat dissipation member, the wing portion, the semiconductor element, the lead portion and A sealing resin that seals the thin metal wire, a lower surface of the heat radiating member is exposed from a bottom surface of the sealing resin, and a sealing resin is provided between an upper portion of the heat radiating member and a lower surface of the semiconductor element. Buried It is being written resin-sealed semiconductor device.

Specifically, a resin-sealed semiconductor device in which the lower surface and one side surface of the lead portion are exposed from the bottom surface of the sealing resin.

A semiconductor device having an electrode pad;
A heat dissipating member provided below the semiconductor element, a suspending lead that supports the heat dissipating member, and has a depressed portion, and is provided on the suspending lead, and supports the semiconductor element via an adhesive. A support portion, a plurality of signal connection leads each having a distal end facing the heat dissipating member, and a distal end serving as an external terminal; and a thin metal wire electrically connecting the electrode pad of the semiconductor element and the lead. A portion excluding the lower surface of the heat dissipating member, the suspension lead portion, the semiconductor element, a sealing resin for sealing the lead portion and the fine metal wire, and a lower surface of the heat dissipating member, a bottom surface and one side surface of the lead portion. Is a resin-sealed semiconductor device that is exposed from the sealing resin and has a sealing resin embedded between an upper portion of the heat dissipation member and a lower surface of the semiconductor element.

A semiconductor device having an electrode pad;
A heat dissipating member provided below the semiconductor element, a protrusion provided on the upper surface of the heat dissipating member, supporting the semiconductor element via an adhesive, and supporting the heat dissipating member, and having a depressed part. A suspension lead portion, a support portion provided on the suspension lead portion and supporting the semiconductor element via an adhesive, and a plurality of signal connection terminals each having a distal end facing the heat dissipating member and a distal end serving as an external terminal. A lead portion, a thin metal wire electrically connecting the electrode pad of the semiconductor element and the lead portion, a portion excluding a lower surface of the heat dissipation member, the suspension lead portion, the semiconductor element, the lead portion and the thin metal wire. A bottom surface of the heat radiation member, a bottom surface and one side surface of the lead portion are exposed from the sealing resin, and a space between an upper portion of the heat radiation member and a lower surface of the semiconductor element is provided. Seal A resin-sealed semiconductor device resin is embedded.

According to a method of manufacturing a resin-encapsulated semiconductor device of the present invention, a frame, a heat dissipating member provided in an opening region of the frame, and the heat dissipating member are supported at a tip thereof.
A suspension lead portion connected to the frame at an end portion, a tip of the suspension member facing the heat dissipation member, and a plurality of signal connection leads connected to the frame end at the end, and the vicinity of the heat dissipation member, A step of preparing a lead frame comprising a wing portion having a supporting portion for supporting a semiconductor element provided on each side of the heat radiating member; and a step of preparing a lead frame extending above the heat radiating member of the lead frame. A step of bonding and mounting the semiconductor element on the support part, a step of connecting the electrode pads of the semiconductor element mounted on the support part of the heat dissipating member and the lead part with thin metal wires, and a step of enclosing the lead frame. A step of resin-sealing a portion excluding the lower surface of the heat dissipating member, a semiconductor element, and a connection region between the lead portion and the thin metal wire, and cutting the lead, thereby forming the heat dissipating member The semiconductor element is mounted on the support portion of the wing portion, the semiconductor element and the lead portion are connected by a thin metal wire, the outer periphery is sealed with a sealing resin, and the lower surface of the heat radiating member is exposed from the bottom surface of the sealing resin. And a step of obtaining a resin-sealed semiconductor device having a structure in which a wing portion is sealed in a sealing resin.

More specifically, a sealing sheet is used in the step of resin-sealing the portion of the lead frame except the lower surface of the heat radiating member, the semiconductor element, and the connection region between the inner lead portion of the lead portion and the thin metal wire. This is a method for manufacturing a resin-encapsulated semiconductor device that performs resin encapsulation while masking the bottom surface of the heat dissipation member.

A frame frame, a heat radiating member provided in an opening region of the frame frame, a suspension lead portion supporting the heat radiating member at a distal end thereof and connected to the frame frame at a distal end portion; A plurality of signal connection leads, the ends of which are opposed to the member and the ends of which are connected to the frame, and a semiconductor element provided between the depressed portions of the suspension leads as the vicinity of the heat dissipation member. Preparing a lead frame having a support portion to be mounted; bonding and mounting a semiconductor element on the support portion of the suspension lead portion; and an electrode of the semiconductor element mounted on the support portion of the suspension lead portion. A step of connecting the pad and the lead with a thin metal wire, and bonding the sealing sheet to a part of the lead, the heat radiation member, and the suspension lead on the bottom surface of the lead frame on which the semiconductor element is mounted. And placing the lead frame provided with the sealing sheet in a sealing mold, a portion excluding the lower surface of the heat radiating member as an outer periphery of the lead frame, a semiconductor element, a connection area between the lead portion and the thin metal wire, A step of resin-encapsulating the suspension leads, and a step of removing the sealing sheet;
A lead cut is performed on a cut portion of a lead portion of the lead frame after the resin sealing, a semiconductor element is mounted on a support portion of the suspension lead portion, and the semiconductor element and the lead portion are connected by a thin metal wire, An outer periphery is sealed with a sealing resin, a resin-sealed semiconductor device in which an outer lead portion is exposed from a side surface of the sealing resin, wherein a lower surface of a heat radiation member is exposed from a bottom surface of the sealing resin, A method for manufacturing a resin-sealed semiconductor device, comprising the step of obtaining a resin-sealed semiconductor device having a structure in which a support portion is sealed in the sealing resin.

Further, a frame member, a heat dissipating member provided in an opening area of the frame member and having a supporting portion protruding from the upper surface, a heat dissipating member supported at its tip end, A connected suspension lead, a plurality of signal connection leads each having a distal end opposed to the heat radiating member and a distal end connected to the frame, and a depressed portion of the suspension lead as the vicinity of the heat radiating member. A step of preparing a lead frame having a support portion for supporting the semiconductor element provided therebetween; and a step of bonding and mounting the semiconductor element on the support portion of the suspension lead portion and the support portion of the heat radiation member. Connecting the electrode pad and the lead of the mounted semiconductor element with a thin metal wire; and forming the lead, heat radiation member, and suspension lead on the bottom surface of the lead frame on which the semiconductor element is mounted. A step of bringing a sealing sheet into close contact with a portion, placing a lead frame provided with the sealing sheet in a sealing mold, and surrounding the lead frame except for a lower surface of a heat radiation member, a semiconductor element, and a lead. Section, the step of removing the sealing sheet after resin sealing, and the step of removing the sealing sheet after resin sealing, and the cutting portion of the lead section of the lead frame after resin sealing. The semiconductor element is mounted on the support portion of the suspension lead portion and the support portion on the heat radiating member by performing lead cutting, the semiconductor element and the lead portion are connected by a thin metal wire, and the outer periphery is sealed with a sealing resin. The resin-encapsulated semiconductor device has an outer lead portion exposed from a side surface of the sealing resin, wherein a lower surface of the heat radiation member is exposed from a bottom surface of the sealing resin, and each support portion is sealed in the sealing resin. Resin-sealed semi-conductor with stopped structure Device is a method for producing a more becomes a resin-sealed semiconductor device and to obtain a.

As described above, when a resin-encapsulated semiconductor device is formed using the lead frame of the present invention, various problems can be solved. For example, a sealing resin can be present between the upper surface of the heat radiating member and the semiconductor element, and a resin-sealed semiconductor device having a high holding force of the sealing resin with respect to the heat radiating member can be obtained. Further, since the lower surface of the supporting member that supports the semiconductor element can be configured not to be exposed from the sealing resin, the adhesiveness with the sealing resin increases, and the intrusion of moisture or moisture from the boundary is suppressed. You. Therefore, the moisture resistance can be improved.

Further, by separating the heat radiating member and the portion supporting the semiconductor element, a large semiconductor element can be mounted, and a high-density package mounting the large element can be realized.

Further, by using the sealing sheet, it is possible to prevent the occurrence of resin burrs on the surface of the heat radiation member or the like during resin sealing.

[0046]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A lead frame, a resin-sealed semiconductor device using the same and a method for manufacturing the same according to the present invention will be described below with reference to the drawings.

First, a lead frame according to the first embodiment of the present invention, a resin-sealed semiconductor device using the same, and a method of manufacturing the same will be described.

FIG. 1 is a view showing a lead frame of the present embodiment, FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along a line BB in FIG. 1A. .

As shown in FIG. 1, the lead frame of the present embodiment has a frame 1, a heat radiating member 2 provided in an opening area of the frame 1, and a heat radiating member 2 supported at its tip. A suspension lead 3 connected to the frame 1 at the end, a plurality of signal connection leads 4 whose ends are opposed to the heat radiating member 2 and the ends connected to the frame 1, and a vicinity of the heat radiating member 2. A wing portion 6 having a supporting portion 5 provided on each side of the heat radiating member 2 for supporting a semiconductor element.
The suspension lead portion 3 has a depressed portion so as to be disposed at a lower position. The lead portion 4 includes an inner lead portion 4a and an outer lead portion 4b.

In the lead frame according to the present embodiment, the supporting portion 5 which supports the semiconductor element is formed on the wing portion 6, and the supporting portion 5 of the wing portion 6 supports the semiconductor element, thereby forming a resin. When sealed, a sealing resin can be interposed between the bottom surface of the semiconductor element and the top surface of the heat radiating member 2, thereby realizing a resin-sealed semiconductor device having a high holding force of the sealing resin with respect to the heat radiating member 2. It is. In addition, since the supporting portion 5 that supports the semiconductor element can be configured so as not to be exposed from the sealing resin, the adhesion with the sealing resin is increased, and the penetration of moisture or moisture from the boundary can be suppressed. It is.

In the lead frame of this embodiment, the wing portions 6 and the support portions 5 provided on each side of the heat radiation member 2 are provided.
Is provided on the entire side of the heat radiation member 2 as a continuous form in the drawing, but is provided not on the entire side but partially, for example, near each corner of the heat radiation member or at the center of each side. You may. In this case, when the resin is injected, the penetration of the resin becomes good, and the sealing resin can be efficiently interposed between the lower surface of the semiconductor element and the upper surface of the heat radiation member 2.

The lead frame of the present embodiment is shown in FIG.
The lead frame pattern having the structure shown in FIG. 3 is not one but a plurality of lead frame patterns arranged continuously in the left, right, up and down directions.

Next, a resin-sealed semiconductor device of this embodiment and a method of manufacturing the same will be described.

FIGS. 2 to 6 are cross-sectional views showing the steps of a method for manufacturing a resin-encapsulated semiconductor device using the lead frame shown in FIG.

First, as shown in FIG. 2, a frame frame, a heat radiating member 2 provided in an opening area of the frame frame, and a hanging member which supports the heat radiating member 2 at its distal end and is connected to the frame at its distal end. A plurality of signal connection leads 4 whose leading ends face the heat radiating member 2 and whose ends are connected to the frame, and a semiconductor provided on each side of the heat radiating member 2 near the heat radiating member 2. A lead frame including a wing portion 6 having a support portion 5 for supporting the element is prepared.

Then, as shown in FIG. 3, the semiconductor element 7 is mounted on the support portion 5 of the wing portion 6 provided extending above the heat radiation member 2 by bonding with an adhesive 8 such as a silver paste. .

Next, as shown in FIG. 4, an electrode pad (not shown) on the surface of the semiconductor element 7 mounted on the support portion 5 of the heat radiating member 2 and an inner lead portion 4a of the lead portion 4 are connected to a thin metal wire. 9 for electrical connection.

Next, as shown in FIG. 5, the lead frame is placed in a sealing mold, a sealing resin 10 made of an epoxy resin is injected by transfer molding, and a heat radiating member 2 is formed around the lead frame. Of the semiconductor element 7 and the inner lead portion 4a of the lead portion 4 and the connection region of the thin metal wire 9 are sealed. Here, the lower surface of the heat radiating member 2 is exposed to the bottom surface of the sealing resin 10 and sealed so as to have a heat radiating function. In this case, it is preferable to perform resin sealing with the bottom surface of the heat radiation member being masked using a sealing sheet.

Then, the cut portion of the lead portion 4 is subjected to lead cutting by a cutting blade using a die, and lead forming (bending process) is performed, whereby the wing of the heat radiating member 2 of the lead frame as shown in FIG. Supporting part 5 of part 6
The semiconductor element 7 is mounted thereon with an adhesive 8, the semiconductor element 7 and the inner lead 4 a of the lead 4 are electrically connected by a thin metal wire 9, and the outer periphery is sealed by a sealing resin 10. A resin-encapsulated semiconductor device in which the outer lead portions 4b are exposed from the side surfaces of the sealing resin 10, the lower surface of the heat radiation member 2 is exposed from the bottom surface of the sealing resin 10, and the wing portions 6 are A resin-sealed semiconductor device having a structure sealed therein is obtained.

In the resin-encapsulated semiconductor device of this embodiment, as shown in FIG. 6, the sealing resin 10 can be provided between the upper surface of the heat radiating member 2 and the semiconductor element 7. 2 is a resin-encapsulated semiconductor device having a high holding force of the encapsulating resin 10 with respect to the semiconductor device 2. Further, since the structure is such that the supporting portion 5 and the wing portion 6 supporting the semiconductor element 7 are not exposed from the sealing resin, the adhesion to the sealing resin 10 is increased, and moisture or moisture enters from the boundary. Is suppressed. Therefore, the occurrence of package cracks is prevented, and the moisture resistance is improved.

Next, a lead frame according to a second embodiment of the present invention, a resin-sealed semiconductor device using the same, and a method of manufacturing the same will be described.

FIG. 7 is a plan view showing a lead frame according to the present embodiment, and FIG. 8 is a cross-sectional view taken along a line C--C1 in the plan view of FIG. FIG. 9 is a cross-sectional view taken along a line D-D1 in the plan view of FIG.

As shown in FIGS. 7, 8, and 9, the lead frame of the present embodiment includes a frame 1, a heat radiating member 2 provided in an opening area of the frame 1, a heat radiating member 2,
Is supported at its distal end, and its distal end is opposed to the suspension lead 3 connected to the frame 1 at the distal end, and to the heat dissipating member 2.
A plurality of signal connection leads 4 whose ends are connected to the frame 1;
And a supporting portion 11 for supporting the semiconductor element provided on the lead frame.
The suspension lead 3 has a plurality of depressed portions in order to dispose it below the support 11 and only arrange the support 11 above and to incline the other suspension lead 3 downward. Is what you are doing. The lead portion 4 includes an inner lead portion 4a and an outer lead portion 4b. In FIG. 7, a region shown by a broken line indicates a sealing line for resin sealing, and a portion shown by a dashed line indicates a portion to be lead-cut. A groove 12 is provided in a ring shape on the surface of the heat radiating member 2 to enhance the adhesion to the sealing resin and to prevent the resin from peeling off.

In the lead frame of the present embodiment, the supporting portion 11, which supports the semiconductor element, is
When the semiconductor element is supported by the support portion 11, the sealing resin can be interposed between the bottom surface of the semiconductor element and the upper surface of the heat radiating member 2 when resin sealing is performed. 2 can realize a resin-encapsulated semiconductor device having a high holding force of the encapsulating resin with respect to 2. Since the supporting portion 11 for supporting the semiconductor element can be formed so as not to be exposed from the sealing resin, the adhesion to the sealing resin is increased, and the penetration of moisture or moisture from the boundary can be suppressed. It is.

The shape of the support portion 11 is circular in the present embodiment, but the shape and area are set according to the bottom area of the semiconductor element to be mounted. The depressed portion may be provided such that the support portion 11 is disposed above and the heat radiating member 2 can be disposed on the same surface as the lead portion 4, and the number of depressed portions is appropriately set. Further, the lead frame of the present embodiment is not a single lead frame pattern having the configuration shown in FIG.

Next, the resin-sealed semiconductor device of this embodiment and a method of manufacturing the same will be described.

FIGS. 10 to 16 are sectional views showing the steps of a method for manufacturing a resin-encapsulated semiconductor device using the lead frame shown in FIG. In FIGS. 10 to 16,
For the sake of convenience, a cross section taken along a line D-C1 in FIG.

First, as shown in FIG.
A heat radiating member 2 provided in an opening region of the frame;
A suspension lead portion 3 supporting the heat dissipating member 2 at its distal end and being connected to the frame at the distal end; and a plurality of signal connection leads each having a distal end facing the heat dissipating member 2 and having a distal end connected to the frame. 4 and a lead frame having a support portion 11 provided between the depressed portions of the suspension lead portions 3 for supporting the semiconductor element near the heat radiating member 2 is prepared.

Then, as shown in FIG. 11, the semiconductor element 7 is mounted on the support portion 11 provided on the suspension lead portion 3 by bonding with an adhesive 8 such as a silver paste.

Next, as shown in FIG.
Electrode pads (not shown) on the surface of the semiconductor element 7 mounted on the support portion 11 and the inner lead portions 4 of the lead portions 4.
a are electrically connected by a thin metal wire 9.

Next, as shown in FIG. 13, the sealing sheet 13 is adhered to a part of the lead portion 4, the heat radiation member 2, and the suspension lead portion 3 on the bottom surface of the lead frame on which the semiconductor element 7 is mounted.

Then, as shown in FIG.
3 is placed in a sealing mold, a sealing resin 10 made of an epoxy resin is injected by transfer molding, and a portion excluding the lower surface of the heat dissipating member 2 as an outer periphery of the lead frame, a semiconductor element 7. Lead part 4
The connection region between the inner lead portion 4a and the thin metal wire 9 and the suspension lead portion 3 are sealed. Here, the lower surface of the heat dissipating member 2 is exposed to the bottom surface of the sealing resin 10, and is sealed so as to have a heat dissipating function.
Is also sealed so as to be exposed from the sealing resin.

Next, as shown in FIG. 15, after resin sealing,
The sealing sheet 13 is removed from the bottom surface of the lead portion 4 or the like by peel-off.

Then, a lead cut (lead molding) is performed on the cut portion of the lead portion 4 so that the support portion 1 of the suspension lead portion 3 of the lead frame as shown in FIG.
A semiconductor element 7 is mounted on the substrate 1 by an adhesive 8, the semiconductor element 7 is electrically connected to an inner lead portion 4 a of the lead portion 4 by a thin metal wire 9, and an outer periphery is formed of a sealing resin 10.
And the outer lead portion 4b is exposed from the side surface of the sealing resin 10, and the lower surface of the heat radiating member 2 is exposed from the bottom surface of the sealing resin 10, Is obtained in the sealing resin 10 to obtain a resin-sealed type semiconductor device.

In the resin-encapsulated semiconductor device of this embodiment, as shown in FIG. 16, the encapsulation resin 10 can be provided between the upper surface of the heat radiating member 2 and the semiconductor element 7.
This is a resin-sealed semiconductor device having a high holding force of the sealing resin 10 with respect to the heat radiation member 2. In addition, since the supporting portion 11 supporting the semiconductor element 7 is not exposed from the sealing resin, the adhesion with the sealing resin 10 is increased,
Intrusion of moisture and moisture from the boundary is suppressed. Therefore, the occurrence of package cracks is prevented, and the moisture resistance is improved.

Next, a lead frame according to a third embodiment of the present invention, a resin-sealed semiconductor device using the same, and a method of manufacturing the same will be described.

FIG. 17 is a plan view showing a lead frame of the present embodiment, and FIG.
It is sectional drawing of E1 location. 19 is a cross-sectional view taken along a line FF1 in the plan view of FIG.

As shown in FIGS. 17, 18, and 19, the lead frame of the present embodiment includes a frame 1, a heat radiating member 2 provided in an opening area of the frame 1, and a top surface of the heat radiating member 2. The supporting part 14 protruding from the supporting member, the heat dissipating member 2 is supported at its distal end, and the suspension lead part 3 connected to the frame 1 at the distal end, and the distal end thereof is opposed to the heat dissipating member 2, and the distal end is a frame. The heat dissipation member comprises a plurality of signal connection lead portions 4 connected to the frame 1 and a support portion 11 provided in the vicinity of the heat dissipation member 2 for supporting the semiconductor element provided on each suspension lead portion 3. 2 is disposed below the support portion 11 of the suspension lead portion 3, the support portion 14 of the heat radiation member 2 and the support portion 11 of the suspension lead portion 3 are disposed on the same surface, and only the support portion 11 is positioned upward. Placed in
In order to incline the other suspension lead portion 3 downward,
The suspension lead portion 3 has a plurality of depressed portions. The lead portion 4 includes an inner lead portion 4a and an outer lead portion 4b. FIG.
In FIG. 7, a region shown by a broken line shows a sealing line for resin sealing, and a portion shown by a dashed line shows a part to be lead-cut. Further, a groove may be provided on the surface of the heat radiating member 2 for adhesion and prevention of peeling.

In the lead frame according to the present embodiment, the supporting portion 11 for supporting the semiconductor element is
The supporting portion 14 is formed on the heat radiating member 2, and the semiconductor element can be stably supported by supporting the semiconductor device with the supporting portion 11 and the supporting portion 14. . In addition, when resin sealing is performed, a sealing resin can be interposed between the bottom surface of the semiconductor element and the upper surface of the heat radiating member 2. It can be realized. In addition, since the supporting portions 11 and 14 supporting the semiconductor element can be structured so as not to be exposed from the sealing resin, the adhesion to the sealing resin is increased, and moisture or moisture enters from the boundary. Can be suppressed.

Although the shapes of the support portions 11 and 14 are circular in this embodiment, the shape and area are set according to the bottom area of the semiconductor element to be mounted. Also, the depressed portion may be provided such that the support portion 11 is disposed above and the support portion 11 and the surface of the protruding support portion 14 of the heat radiation member 2 can be disposed on the same surface. Set as appropriate. Further, the lead frame of the present embodiment is not a single lead frame pattern having the configuration shown in FIG.

Next, a resin-sealed semiconductor device of this embodiment and a method of manufacturing the same will be described.

FIGS. 20 to 26 are sectional views showing the steps of a method for manufacturing a resin-sealed semiconductor device using the lead frame shown in FIG. 20 to 26 show, for convenience, a cross section taken along the line FE1 in FIG.

First, as shown in FIG. 20, a frame
A heat dissipating member 2 provided in an opening region of the frame and having a protruding support portion 14; and a suspending lead 3 supporting the heat dissipating member 2 at its distal end and connected to the frame at its distal end.
A plurality of signal connection leads 4 whose distal ends are opposed to the heat radiating member 2 and whose ends are connected to the frame are provided between the depressed portions of the suspension lead portions 3 near the heat radiating member 2. A lead frame having a support portion 11 for supporting a semiconductor element is prepared.

Then, as shown in FIG. 21, the support portion 11 provided on the suspension lead portion 3 and the support portion 1 of the heat radiation member 2 are provided.
The semiconductor element 7 is mounted on the substrate 4 by bonding with an adhesive 8 such as a silver paste.

Next, as shown in FIG.
An electrode pad (not shown) on the surface of the semiconductor element 7 mounted on the support portion 11 of the semiconductor device 7 and the support portion 14 of the heat dissipating member 2 is electrically connected to the inner lead portion 4a of the lead portion 4 by the thin metal wire 9. I do.

Next, as shown in FIG. 23, the sealing sheet 13 is adhered to a part of the lead portion 4, the heat radiation member 2, and the suspension lead portion 3 on the bottom surface of the lead frame on which the semiconductor element 7 is mounted.

Then, as shown in FIG.
3 is placed in a sealing mold, a sealing resin 10 made of an epoxy resin is injected by transfer molding, and a portion excluding the lower surface of the heat dissipating member 2 as an outer periphery of the lead frame, a semiconductor element 7. Lead part 4
The connection region between the inner lead portion 4a and the thin metal wire 9 and the suspension lead portion 3 are sealed. Here, the lower surface of the heat dissipating member 2 is exposed to the bottom surface of the sealing resin 10, and is sealed so as to have a heat dissipating function.
Is also sealed so as to be exposed from the sealing resin.

Next, as shown in FIG. 25, after resin sealing,
The sealing sheet 13 is removed from the bottom surface of the lead portion 4 or the like by peel-off.

Then, a lead cut (lead molding) is performed on the cut portion of the lead portion 4 so that the support portion 1 of the suspension lead portion 3 of the lead frame as shown in FIG.
The semiconductor element 7 is mounted on the support portion 14 on the heat radiating member 2 with the adhesive 8, and the semiconductor element 7 and the lead portion 4
Is electrically connected to the inner lead portion 4a by the thin metal wire 9, the outer periphery is sealed by the sealing resin 10, and the outer lead portion 4b is exposed from the side surface of the sealing resin 10. A resin-sealed semiconductor device having a structure in which the lower surface of the heat radiation member 2 is exposed from the bottom surface of the sealing resin 10 and the support portion 11 is sealed in the sealing resin 10 is obtained.

In the resin-encapsulated semiconductor device of this embodiment, as shown in FIG. 26, the encapsulation resin 10 can be provided between the upper surface of the heat radiation member 2 and the semiconductor element 7.
This is a resin-sealed semiconductor device having a high holding force of the sealing resin 10 with respect to the heat radiation member 2. In addition, since the structure is such that the portions of the support portions 11 and 14 that support the semiconductor element 7 are not exposed from the sealing resin, the adhesion to the sealing resin 10 is increased, and moisture and moisture from the boundary are prevented. Intrusion is suppressed. Therefore, the occurrence of package cracks is prevented, and the moisture resistance is improved.

Next, a lead frame according to a fourth embodiment of the present invention, a resin-sealed semiconductor device using the same, and a method of manufacturing the same will be described.

FIG. 27 is a view showing a lead frame of this embodiment, and FIG. 27 (a) is a plan view, and FIG.
FIG. 28B is a sectional view taken along a line GG1 in the plan view of FIG. 27.

As shown in FIG. 27, the lead frame of this embodiment has a frame 1, a heat radiating member 2 provided in an opening area of the frame 1, and a heat radiating member 2 supported at its tip. A suspension lead portion 3 connected to the frame 1 at an end, a plurality of signal connection leads 4 having a tip facing the heat radiation member 2 and an end connected to the frame 1,
A wing portion 6 having a supporting portion 5 for supporting a semiconductor element provided on each side of the heat radiating member 2 near the heat radiating member 2
Is a lead frame. The lead portion 4 includes an inner lead portion 4a and an outer lead portion 4b. In FIG. 27, a region shown by a broken line indicates a sealing line for resin sealing, and a portion shown by a dashed line indicates a portion to be lead-cut. A groove 12 is provided on the surface of the heat radiating member 2 in a ring shape.
A function to increase the adhesion to the sealing resin and to prevent resin peeling is added. In particular, in a single-sided sealed package, the groove 1
2 has a large effect.

In the lead frame according to the present embodiment, the supporting portion 5 which supports the semiconductor element is formed on the wing portion 6, and the supporting portion 5 of the wing portion 6 supports the semiconductor element to form a resin. When sealed, a sealing resin can be interposed between the bottom surface of the semiconductor element and the top surface of the heat radiating member 2, thereby realizing a resin-sealed semiconductor device having a high holding force of the sealing resin with respect to the heat radiating member 2. It is. In addition, since the supporting portion 5 that supports the semiconductor element can be configured so as not to be exposed from the sealing resin, the adhesion with the sealing resin is increased, and the penetration of moisture or moisture from the boundary can be suppressed. It is.

In the lead frame of the present embodiment, the wing portions 6 and the support portions 5 provided on each side of the heat radiating member 2 are provided.
Is provided on the entire side of the heat radiation member 2 as a continuous form in the drawing, but is provided not on the entire side but partially, for example, near each corner of the heat radiation member or at the center of each side. You may. In this case, when the resin is injected, the penetration of the resin becomes good, and the sealing resin can be efficiently interposed between the lower surface of the semiconductor element and the upper surface of the heat radiation member 2.

The lead frame of the present embodiment is shown in FIG.
The lead frame pattern having the configuration shown in FIG. 7 is not one, but a plurality of lead frame patterns arranged continuously in the left, right, up and down directions.

Next, the resin-sealed semiconductor device of this embodiment and a method of manufacturing the same will be described.

FIGS. 28 to 34 are cross-sectional views showing steps of a method for manufacturing a resin-sealed semiconductor device using the lead frame shown in FIG. 27.

First, as shown in FIG.
A heat radiating member 2 provided in an opening region of the frame;
A suspension lead portion supporting the heat dissipating member 2 at its distal end and being connected to the frame at its distal end; and a plurality of signal connection leads 4 having its distal end facing the heat dissipating member 2 and having its distal end connected to the frame. Then, a lead frame including a wing portion 6 having a support portion 5 for supporting a semiconductor element provided on each side of the heat radiation member 2 is prepared near the heat radiation member 2.

As shown in FIG. 29, the semiconductor element 7 is mounted on the support portion 5 of the wing portion 6 extending above the heat radiating member 2 by bonding with an adhesive 8 such as silver paste. .

Next, as shown in FIG. 30, an electrode pad (not shown) on the surface of the semiconductor element 7 mounted on the support portion 5 of the heat radiating member 2 and an inner lead portion 4a of the lead portion 4 are connected to a thin metal wire. 9 for electrical connection.

Next, as shown in FIG. 31, the sealing sheet 13 is brought into close contact with the lead portion 4 and the heat radiation member 2 on the bottom surface of the lead frame on which the semiconductor element 7 is mounted.

Then, as shown in FIG. 32, the sealing sheet 1
3 is placed in a sealing mold, a sealing resin 10 made of an epoxy resin is injected by transfer molding, and a portion excluding the lower surface of the heat dissipating member 2 as an outer periphery of the lead frame, a semiconductor element 7. Lead part 4
The connection region between the inner lead portion 4a and the thin metal wire 9 is sealed. Here, the lower surface of the heat radiating member 2 is exposed to the bottom surface of the sealing resin 10 and sealed so as to have a heat radiating function, and the sealing sheet 13 is sealed so that the bottom surface of the lead portion 4 is also exposed from the sealing resin. I do.

Next, as shown in FIG. 33, after resin sealing,
The sealing sheet 13 is removed from the bottom surface of the lead portion 4 or the like by peel-off.

Then, a lead cut (lead molding) is performed on the cut portion of the lead portion 4, and the support portion 5 of the wing portion 6 of the heat radiation member 2 of the lead frame as shown in FIG.
The semiconductor element 7 is mounted thereon with an adhesive 8, the semiconductor element 7 and the inner lead 4 a of the lead 4 are electrically connected by a thin metal wire 9, and the outer periphery is sealed by a sealing resin 10. A resin-encapsulated semiconductor device in which the outer lead portions 4b are exposed from the side surfaces of the sealing resin 10, wherein the lower surface of the heat radiation member 2 and the bottom surface of the lead portions 4
Thus, a resin-encapsulated semiconductor device having a structure in which the wing portion 6 is exposed in the encapsulation resin 10 and is exposed from the bottom surface of the semiconductor device 10 is obtained.

In the resin-encapsulated semiconductor device of this embodiment, as shown in FIG. 34, the encapsulation resin 10 can be present between the upper surface of the heat radiation member 2 and the semiconductor element 7.
This is a resin-sealed semiconductor device having a high holding force of the sealing resin 10 with respect to the heat radiation member 2. Further, since the structure is such that the supporting portion 5 and the wing portion 6 supporting the semiconductor element 7 are not exposed from the sealing resin, the adhesion to the sealing resin 10 is increased, and moisture or moisture enters from the boundary. Is suppressed. Therefore, the occurrence of package cracks is prevented, and the moisture resistance is improved.

As described above, the feature of the resin-encapsulated semiconductor device using the lead frame of the present embodiment is that the portion for mounting the semiconductor element and the heat-dissipating member exposed from the sealing resin are separated from each other, This is to increase the holding power of the sealing resin, suppress cracks in the sealing resin due to intrusion of moisture or moisture from between the heat radiating member and the sealing resin, and suppress peeling of the heat radiating member, thereby improving reliability.

Further, the bottom surface of the semiconductor element is in close contact with the sealing resin, and a highly water-absorbing adhesive is not interposed between the semiconductor element and the heat radiating member (die pad portion) as in the prior art. , The resin-encapsulated semiconductor device with high reliability can be realized.

[0109]

When a resin-encapsulated semiconductor device is formed using the lead frame of the present invention, it is possible to allow the encapsulating resin to be present between the upper surface of the heat radiating member and the semiconductor element. A resin-sealed semiconductor device having high sealing resin holding power can be obtained. In addition, since the lower surface of the supporting member that supports the semiconductor element can be configured not to be exposed from the sealing resin, the adhesiveness with the sealing resin increases, and the intrusion of moisture or moisture from the boundary is suppressed. You. Therefore, the moisture resistance can be improved.

Further, the configuration in which the heat radiating member and the portion for supporting the semiconductor element are separated allows a large semiconductor element to be mounted, thereby realizing a high-density package mounting the large element.

[Brief description of the drawings]

FIG. 1 is a view showing a lead frame according to a first embodiment of the present invention;

FIG. 2 is a sectional view showing a method for manufacturing the resin-sealed semiconductor device according to the first embodiment of the present invention;

FIG. 3 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the first embodiment of the present invention;

FIG. 4 is a sectional view showing the method for manufacturing the resin-encapsulated semiconductor device according to the first embodiment of the present invention;

FIG. 5 is a sectional view showing the method for manufacturing the resin-encapsulated semiconductor device according to the first embodiment of the present invention;

FIG. 6 is a sectional view showing the method of manufacturing the resin-encapsulated semiconductor device according to the first embodiment of the present invention;

FIG. 7 is a plan view showing a lead frame according to a second embodiment of the present invention.

FIG. 8 is a sectional view showing a lead frame according to a second embodiment of the present invention;

FIG. 9 is a sectional view showing a lead frame according to a second embodiment of the present invention.

FIG. 10 is a sectional view showing the method of manufacturing the resin-encapsulated semiconductor device according to the second embodiment of the present invention;

FIG. 11 is a sectional view showing a method for manufacturing a resin-sealed semiconductor device according to a second embodiment of the present invention.

FIG. 12 is a sectional view illustrating a method for manufacturing a resin-sealed semiconductor device according to a second embodiment of the present invention.

FIG. 13 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the second embodiment of the present invention;

FIG. 14 is a cross-sectional view illustrating a method for manufacturing a resin-sealed semiconductor device according to a second embodiment of the present invention.

FIG. 15 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the second embodiment of the present invention;

FIG. 16 is a sectional view showing the method of manufacturing the resin-encapsulated semiconductor device according to the second embodiment of the present invention;

FIG. 17 is a plan view showing a lead frame according to a third embodiment of the present invention.

FIG. 18 is a sectional view showing a lead frame according to a third embodiment of the present invention.

FIG. 19 is a sectional view showing a lead frame according to a third embodiment of the present invention;

FIG. 20 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the third embodiment of the present invention.

FIG. 21 is a sectional view showing the method of manufacturing the resin-encapsulated semiconductor device according to the third embodiment of the present invention;

FIG. 22 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the third embodiment of the present invention.

FIG. 23 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the third embodiment of the present invention;

FIG. 24 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the third embodiment of the present invention;

FIG. 25 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the third embodiment of the present invention.

FIG. 26 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the third embodiment of the present invention;

FIG. 27 is a view showing a lead frame according to a fourth embodiment of the present invention;

FIG. 28 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the fourth embodiment of the present invention.

FIG. 29 is a cross-sectional view illustrating the method of manufacturing the resin-encapsulated semiconductor device according to the fourth embodiment of the present invention.

FIG. 30 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the fourth embodiment of the present invention.

FIG. 31 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the fourth embodiment of the present invention.

FIG. 32 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the fourth embodiment of the present invention;

FIG. 33 is a sectional view showing the method of manufacturing the resin-sealed semiconductor device according to the fourth embodiment of the present invention.

FIG. 34 is a sectional view showing the method of manufacturing the resin-encapsulated semiconductor device according to the fourth embodiment of the present invention;

FIG. 35 shows a conventional lead frame.

FIG. 36 is a cross-sectional view showing a method for manufacturing a conventional resin-encapsulated semiconductor device.

FIG. 37 is a cross-sectional view showing a method for manufacturing a conventional resin-encapsulated semiconductor device.

FIG. 38 is a cross-sectional view showing a method for manufacturing a conventional resin-encapsulated semiconductor device.

FIG. 39 is a sectional view showing a method of manufacturing a conventional resin-encapsulated semiconductor device.

FIG. 40 is a cross-sectional view showing a method for manufacturing a conventional resin-encapsulated semiconductor device.

FIG. 41 is a sectional view showing a problem of a conventional resin-encapsulated semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Frame frame 2 Heat radiating member 3 Hanging lead part 4 Lead part 5 Support part 6 Wing part 7 Semiconductor element 8 Adhesive 9 Metal thin wire 10 Sealing resin 11 Support part 12 Groove part 13 Seal sheet 14 Support part 101 Frame frame 102 Die pad part 103 Suspended lead part 104 Lead part 105 Wing part 106 Semiconductor element 107 Adhesive 108 Fine metal wire 109 Sealing resin

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takahiro Matsuo 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd. (72) Inventor Osamu 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics F term (reference) 5F067 AA03 AA04 AB04 BE00 BE01 BE05 BE07 CA01 DE01 DF16 DF17

Claims (13)

[Claims] 1. A frame, a heat dissipating member provided in an opening area of the frame, a plurality of leads each having a distal end facing the heat dissipating member, and an end connected to the frame, and the heat dissipating member. A support portion for supporting a semiconductor element in the vicinity of the lead frame. 2. A frame, a heat dissipating member provided in an opening area of the frame, a suspension lead portion supporting the heat dissipating member at a distal end thereof, and connected to the frame at an end thereof, and A plurality of leads each having a distal end opposed to the member and a distal end connected to the frame, and a depress portion provided on the suspension lead portion for disposing the heat radiating member below an upper surface of the lead portion; And a support portion for supporting a semiconductor element near the heat radiating member. 3. The lead frame according to claim 1, wherein the support portion provided near the heat radiating member is integrally provided in a wing shape on each side of the heat radiating member. 4. The lead frame according to claim 2, wherein the support portion provided near the heat radiating member is provided on a suspension lead portion supporting the heat radiating member. 5. A frame, a heat radiating member provided in an opening region of the frame, a projecting portion for supporting a semiconductor element provided on the heat radiating member, and a tip of the heat radiating member for supporting the heat radiating member. A suspension lead connected to the frame at an end, a plurality of leads connected to the frame, the ends of which are opposed to the heat dissipating member, and the ends of the heat dissipating member are connected to the upper side of the lead. A depressed portion provided on the suspension lead portion to be disposed below, and a lead frame having a support portion for supporting a semiconductor element on the suspension lead portion, by a depressed portion of the suspension lead portion, A lead frame, wherein an upper surface of a projecting portion on the heat radiating member and an upper surface of a supporting portion provided on the suspension lead portion are arranged on the same plane. 6. A semiconductor element having an electrode pad, a heat dissipating member provided below the semiconductor element, a suspension lead portion supporting the heat dissipating member and having a depressed portion, and each side of the heat dissipating member. A wing portion having a support portion that supports the semiconductor element via an adhesive, a plurality of signal connection leads having a distal end facing the heat dissipating member, and a distal end serving as an external terminal; A thin metal wire electrically connecting the electrode pad of the semiconductor element and the lead portion, a portion excluding the lower surface of the heat radiating member, a sealing resin sealing the wing portion, the semiconductor element, the lead portion and the thin metal wire. Wherein the lower surface of the heat dissipating member is exposed from the bottom surface of the sealing resin, and the sealing resin is embedded between the upper portion of the heat dissipating member and the lower surface of the semiconductor element. Tree Oil-sealed semiconductor device. 7. The resin-sealed semiconductor device according to claim 6, wherein the lower surface and one side surface of the lead portion are exposed from the bottom surface of the sealing resin. 8. A semiconductor element having an electrode pad, a heat dissipating member provided below the semiconductor element, a suspending lead supporting the heat dissipating member and having a depressed portion, and provided on the suspending lead. And a support portion supporting the semiconductor element via an adhesive, a plurality of signal connection leads each having a distal end facing the heat dissipating member, and a distal end serving as an external terminal; and an electrode pad of the semiconductor element. A thin metal wire electrically connected to the lead portion, a portion excluding the lower surface of the heat dissipation member, the suspension lead portion, the semiconductor element, a sealing resin sealing the lead portion and the thin metal wire, A lower surface of the heat radiating member, a bottom surface and one side surface of the lead portion are exposed from the sealing resin, and a sealing resin is embedded between an upper portion of the heat radiating member and a lower surface of the semiconductor element. Resin-encapsulated semiconductor device. 9. A semiconductor element having an electrode pad, a heat radiating member provided below the semiconductor element, a projecting part provided on an upper surface of the heat radiating member and supporting the semiconductor element via an adhesive, A suspending lead that supports the heat dissipating member and has a depressed portion, and a supporting portion provided on the suspending lead and supporting the semiconductor element via an adhesive, the tip of which opposes the heat dissipating member A plurality of signal connection leads each having an external terminal, a thin metal wire electrically connecting an electrode pad of the semiconductor element and the lead, a portion excluding a lower surface of the heat dissipation member, and the suspension lead A sealing resin that seals the semiconductor element, the lead portion, and the fine metal wire, and a lower surface of the heat radiation member, a bottom surface and one side surface of the lead portion are exposed from the sealing resin, A resin-sealed semiconductor device, wherein a sealing resin is embedded between an upper part of the member and a lower surface of the semiconductor element. 10. A frame, a heat dissipating member provided in an opening region of the frame, a suspension lead portion supporting the heat dissipating member at a distal end thereof, and connected to the frame at an end thereof, and A plurality of signal connection leads each having a distal end opposed to the member and a distal end connected to the frame, and a supporting portion for supporting a semiconductor element provided on each side of the heat radiating member as a vicinity of the heat radiating member; Preparing a lead frame comprising a wing portion having a step of: bonding and mounting a semiconductor element on a support portion of a wing portion provided to extend above a heat dissipation member of the lead frame; Connecting the electrode pads of the semiconductor element mounted on the support portion of the heat dissipating member and the lead portion with a thin metal wire, and excluding the lower surface of the heat dissipating member as an outer periphery of the lead frame; A semiconductor element is mounted on a supporting portion of the wing portion of the heat radiating member of the lead frame by a step of resin-sealing a connection region of the lead, the lead portion and the thin metal wire, and a lead cut; Are connected by a thin metal wire, the outer periphery is sealed with a sealing resin, the lower surface of the heat radiation member is exposed from the bottom surface of the sealing resin, and the wing portion is sealed in the sealing resin. A method of manufacturing a resin-sealed semiconductor device, comprising: a step of obtaining a semiconductor device. 11. The step of resin-sealing a portion except for a lower surface of a heat radiating member as an outer periphery of a lead frame, a semiconductor element, and a connection region between an inner lead portion of a lead portion and a thin metal wire,
The method of manufacturing a resin-sealed semiconductor device according to claim 10, wherein resin sealing is performed with the bottom surface of the heat radiation member masked using a sealing sheet. 12. A frame, a heat dissipating member provided in an opening area of the frame, a suspension lead portion supporting the heat dissipating member at a distal end thereof, and connected to the frame at an end thereof, and A plurality of signal connection leads, the ends of which are opposed to the member and the ends of which are connected to the frame, and a semiconductor element provided between the depressed portions of the suspension leads as the vicinity of the heat dissipation member. Preparing a lead frame having a support portion to be mounted; bonding and mounting a semiconductor element on the support portion of the suspension lead portion; and an electrode of the semiconductor element mounted on the support portion of the suspension lead portion. A step of connecting the pad and the lead with a thin metal wire, and bonding the sealing sheet to a part of the lead, the heat radiation member, and the suspension lead on the bottom surface of the lead frame on which the semiconductor element is mounted. And placing the lead frame provided with the sealing sheet in a sealing mold, as an outer periphery of the lead frame, excluding the lower surface of the heat dissipating member, a semiconductor element, a connection area between the lead portion and the fine metal wire, A step of resin-encapsulating the suspension leads, and a step of removing the sealing sheet;
A lead cut is performed on a cut portion of a lead portion of the lead frame after the resin sealing, a semiconductor element is mounted on a support portion of a suspension lead portion, and the semiconductor element and the lead portion are connected by a thin metal wire, An outer periphery is sealed with a sealing resin, a resin-sealed semiconductor device in which an outer lead portion is exposed from a side surface of the sealing resin, wherein a lower surface of a heat radiation member is exposed from a bottom surface of the sealing resin, Obtaining a resin-sealed semiconductor device having a structure in which a support portion is sealed in the sealing resin. 13. A frame member, a heat radiating member provided in an opening region of the frame frame, and having a support portion protruding from an upper surface; A connected suspension lead, a plurality of signal connection leads each having a distal end opposed to the heat radiating member and a distal end connected to the frame, and a depressed portion of the suspension lead as the vicinity of the heat radiating member. A step of preparing a lead frame having a support portion for supporting the semiconductor element provided therebetween; and a step of bonding and mounting the semiconductor element on the support portion of the suspension lead portion and the support portion of the heat radiation member. Connecting the electrode pad and the lead of the mounted semiconductor element with a thin metal wire; and a lead on the bottom surface of the lead frame on which the semiconductor element is mounted, a heat radiating member,
A step of bringing the sealing sheet into close contact with a part of the suspension lead portion, and placing the lead frame attached with the sealing sheet in the sealing mold and surrounding the lead frame except for the lower surface of the heat dissipation member. Resin sealing the semiconductor element, the lead portion, the connection area of the thin metal wire, and the suspension lead portion, removing the sealing sheet after the resin sealing, and cutting the lead portion of the lead frame after the resin sealing. A lead is cut to the portion, the semiconductor element is mounted on the support of the suspension lead portion and the support on the heat radiating member, the semiconductor element and the lead are connected by a thin metal wire, and the outer enclosure is sealed. A resin-encapsulated semiconductor device in which an outer lead portion is exposed from a side surface of the sealing resin, wherein a lower surface of the heat radiation member is exposed from a bottom surface of the sealing resin, and each support portion is sealed. Of a structure sealed in resin Method for manufacturing a resin-sealed semiconductor device comprising more becomes that the step of obtaining a Aburafutome type semiconductor device.