JP2001013191A - Substrate inspection sensor and substrate inspection device - Google Patents

Abstract

(57) [Problem] To provide a substrate inspection sensor capable of executing an electrical inspection on a package substrate without causing an increase in manufacturing cost and without damaging bonding terminals. SOLUTION: A plurality of bonding terminal formation surfaces 43a to 43b are provided.
43c is a substrate inspection sensor 6 for performing a predetermined electrical inspection on the package substrate 40 having the cavity 41 formed in a stepped shape, wherein the insulating layer 17 having a predetermined thickness is formed on the bottom surface, and Electrode portions 14a to 14c configured to be able to contact at least two bonding terminal forming surfaces 43a to 43c via the insulating layer 17 are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board inspection sensor for performing a predetermined electrical inspection on a package board, and a board inspection apparatus provided with the board inspection sensor.

[0002]

2. Description of the Related Art In recent years, with the increase in the density of semiconductor components, microcomputers and the like having a bare chip integrated circuit (hereinafter referred to as "IC") mounted on a package substrate have been used. This type of package substrate 70 is shown in FIGS.
As shown in FIG. 2, the whole is formed in a flat plate shape, and a cavity 71 is formed in the center of the upper surface 70a. In the cavity 71, an IC mounting surface 72 for mounting an IC and a bonding terminal forming surface 73 formed at a position higher than the IC mounting surface 72 so as to surround the IC mounting surface 72 are formed in a stepped manner. Is formed.
In this case, on the bonding terminal forming surface 73, bonding terminals 44, 44,... For wire bonding IC connection terminals are formed in a row at a very fine pitch. Further, around the cavity 71, FIG.
Are connected to the bonding terminals 44, 44,... Via the conductor patterns 46, 46,.

On the other hand, as a board inspection apparatus for inspecting this type of package board 70, a board inspection apparatus 51 shown in FIG. 13 is conventionally known. This board inspection device 5
1 denotes bonding terminals 44 and 4 of the package substrate 70.
4. An inspection device for inspecting the continuity state between 4 and the external connection terminals 45, 45,..., A substrate mounting table 2 on which a package substrate 70 to be inspected is mounted, and a probe for outputting an inspection signal , And a sensor unit 56 for measuring capacitance.

The probes 5, 5,...
0 external connection terminals 45, 45,.
It is fixed to a probe fixing part 54 attached to a probe moving mechanism (not shown). As shown in FIG. 10, the sensor unit 56 includes a flat electrode 61, an insulating film 62 attached to the bottom surface of the electrode 61, and a cable 63 for electrically connecting the electrode 61 and a control device (not shown). It is attached to an air cylinder (not shown) via a columnar attachment portion 61 a erected on the upper surface of the electrode 61. In this case, the electrode 61 is formed to have substantially the same size as the outer shape of the bonding terminal formation surface 73 of the package substrate 70.

When inspecting the package substrate 70 using the substrate inspection apparatus 51, first, the package substrate 70 is mounted on the substrate mounting table 2 with the upper surface 70a facing upward.
Next, the probe moving mechanism is controlled to
Is moved downward, and as shown in FIG.
Each probe 5, 5,.. Is brought into contact with 5, 45,..., And the air cylinder is driven to fit the sensor section 56 into the cavity 71. At this time, the electrode 61 contacts the bonding terminal forming surface 73 via the insulating film 62, and the bottom surface of the electrode 61 is connected to the bonding terminals 44, 44.
.. Are spaced apart from each other by the thickness of the insulating film 62.

Next, an AC voltage is output as an inspection signal to the external connection terminal 45 via an arbitrary probe 5 and the capacitance between the bonding terminal 44 and the electrode 61 is measured. After that, by comparing the measured capacitance with the reference data for inspection absorbed from the good substrate,
The conduction state between the bonding terminal 44 and the external connection terminal 45 is inspected. At this time, when the measured capacitance is out of the predetermined range with respect to the inspection reference data and has a low capacitance value, it is determined that the bonding terminal 44 and the external connection terminal 45 are disconnected. This inspection process is performed for all bonding terminals 44, 44,.
By performing the process between 5, 45,..., The quality of the package substrate 70 is determined.

[0007]

However, the conventional board inspection apparatus 51 has the following problems. That is, in the conventional substrate inspection apparatus 51, as shown in FIGS. 8 and 9, for example, when inspecting the package substrate 40 having the cavity 41 in which the bonding terminal formation surfaces 43a to 43c are formed in steps different from each other in height. , Electrode 6
1 cannot be brought into contact with all of the bonding terminal formation surfaces 43a to 43c.
It is not possible to measure the capacitance between 44... And the electrode 61. For this reason, the conventional substrate inspection apparatus 51 has a problem that it is not possible to inspect a package substrate having a cavity in which a plurality of bonding terminal formation surfaces are formed in a stepwise manner.

In this case, the bonding terminal forming surface 43a
It is also possible to prepare in advance three types of sensor units 56, 56, 56 each having an electrode 61 having the same size as that of the outer shape of .about. In this case, each bonding terminal formation surface 43
By sequentially measuring the capacitance between the bonding terminals 44, 44,.
The conduction state is inspected based on the measured capacitance. But,
In such a case, there arises a problem that the inspection time is lengthened by an amount required to replace the sensor unit 56.

On the other hand, for example, each of the bonding terminals 44, 44,.
By using a test jig in which a number of contact-type probes are implanted in a step-like manner so as to make contact with each other and probes 5, 5,..., A test signal is conducted between the bonding terminal 44 and the external connection terminal 45, The conduction state can be inspected. However, in such a case, since a contact mark of the contact probe remains on the bonding terminal 44,
There is a problem that a wire bonding failure due to a contact mark occurs at the time of mounting. Furthermore, since it is very difficult to implant a large number of contact probes in accordance with the pitch at which the bonding terminals 44, 44,... Are formed, there is a problem that the manufacturing cost of the inspection jig increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of the above-described problems. A main object is to provide a sensor and a board inspection device.

[0011]

According to a first aspect of the present invention, there is provided a sensor for board inspection, wherein a predetermined electric power is applied to a package substrate having a cavity in which a plurality of bonding terminal forming surfaces are formed in a stepwise manner. A substrate inspection sensor for performing a physical inspection, wherein an insulating layer having a predetermined thickness is formed on the bottom surface, and an electrode portion configured to be able to abut on at least two bonding terminal forming surfaces via the insulating layer. It is characterized by having.

According to a second aspect of the present invention, there is provided the substrate inspection sensor according to the first aspect, wherein the electrode portion is provided with a plurality of electrodes capable of contacting the respective bonding terminal forming surfaces. The electrodes are configured to be finely movable independently of each other in the vertical direction.

According to a third aspect of the present invention, there is provided the substrate inspection sensor according to the second aspect, wherein an elastic material which is elastically deformed in accordance with upward movement of the electrode is provided at an upper end of the electrode. It is characterized by being.

According to a fourth aspect of the present invention, there is provided a substrate inspection sensor according to the second or third aspect, wherein the plurality of electrodes are insulated from each other.

According to a fifth aspect of the present invention, there is provided the sensor for inspecting a substrate according to the third or fourth aspect of the present invention, further comprising: an inspection section for performing a predetermined electrical inspection; Wherein the connection cable is electrically connected to the electrode by being sandwiched between the elastic material and the electrode.

According to a sixth aspect of the present invention, there is provided a board inspection apparatus.
5. The sensor for board inspection according to any one of claims 1 to 5, further comprising: a probe arranged to be able to contact an external connection terminal of the package board to output or input an inspection signal. A test signal is applied between the bonding terminal and the contacting terminal, and the capacitance between the bonding terminal and the electrode portion formed on the bonding terminal forming surface is measured. It is characterized in that a predetermined electrical test is performed on the electrical test.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a substrate inspection sensor and a substrate inspection apparatus according to the present invention will be described below with reference to the accompanying drawings.

First, the configuration of the board inspection apparatus 1 will be described.
The description will be made with reference to the drawings.

As shown in FIG. 1, the substrate inspection apparatus 1 includes a substrate mounting table 2, a moving mechanism 3a, an air cylinder 3b, a probe fixing section 4, a sensor section 6, and a control apparatus 7 constituting an inspection section in the present invention. It has. In this case, a base plate (not shown) is fixed to the moving mechanism 3a, and the probe fixing unit 4 and the air cylinder 3b are connected and fixed to the base plate. Therefore, the moving mechanism 3a is controlled by the control unit 7 to control the probe fixing unit 4 and the air cylinder 3b.
Are simultaneously moved up and down, and the air cylinder 3b independently moves the sensor unit 6 up and down under the control of the control device 7. As shown in FIG. 7, a plurality of probes 5, 5,... Surround the sensor section 6 on the bottom surface of the probe fixing section 4 so that the external connection terminals 45, 45,. It is fixed at a position corresponding to the forming position.

The sensor section 6 corresponds to the board inspection sensor of the present invention, and as shown in FIGS.
Rubber plate 12, base portion 13, electrodes 14a, 14a,.
14b, 14b, 14c, 14c, spacer 1
., And cables 16, 16,... Corresponding to connection cables in the present invention. Case 1
2, 1 is formed in a box shape with a bottom opening. As shown in FIG. 3, a columnar mounting portion 11a for mounting on the air cylinder 3b is provided upright on the upper surface of the case 11, and cables 16, 16,.
Holes 21a, 21a.
, 21b, 21b,..., 21c, 21c,.

The rubber plate 12 corresponds to the elastic material in the present invention, and the base portion insertion hole 1 through which the base portion 13 can be inserted.
2a is formed in the center and the cables 16, 16
..Cable insertion holes 22a, 22a
, 22b, 22b,..., 22c, 22c,. The base portion 13 is formed of a resin in a box shape, and the four side surfaces thereof are provided with electrodes 14 a to 14 c and a spacer 1.
Shafts 13a, 13 for attaching 5, 15,.
a are provided respectively. In this case, each shaft 1
The springs 18 are respectively mounted on the 3a.
Further, a bolt insertion hole 23 through which a fixing bolt for fixing the base portion 13 to the case 11 can be inserted is formed in a central portion of the base portion 13.

The electrodes 14a to 14c are formed of a metal in the shape of a flat plate, and the bottom surface thereof has an insulating layer 17 having a predetermined thickness.
Are formed respectively. Also, the electrodes 14a to 14c
Are formed so that the shafts 13a, 13a of the base portion 13 can be inserted through the shaft insertion holes 24, 24,. In this case, as shown in FIG.
The electrodes 14a to 14c in which a is inserted (the electrode 14b is shown in the figure) are formed in an oval shape that is long in the vertical direction so as to be finely movable in the vertical direction. Also, the electrodes 14a to 14c have their shaft insertion holes 24
Each length from the lower edge portion to the insulating layer 17 is formed to a length capable of contacting each of the opposing bonding terminal forming surfaces 43a to 43c, and each lateral width thereof is set to be in contact with each of the bonding terminal forming surfaces 43a to 43c. Each is formed so as to be substantially equal to the length of 43c.

The spacer 15 is formed by resin molding into a flat plate shape.
As shown in FIG. 3, shaft insertion holes 25, 25... Through which the shafts 13 a can be inserted are formed so as to communicate with each other. In addition, cables 16, 16
.. Are the cable insertion holes 21a (or 21b, 21c) of the case 11 and the cable insertion holes 22 of the rubber plate 12.
a (or 22b, 22c), the central portion of which is electrically connected to the electrode 14a (or 14b, 14c), and whose both ends (or only one end) are insulated from each other. Each is connected to a device 7. For example, the cable insertion holes 21a, 22a, 2
The cable 16 inserted through 1a and 22a is sandwiched between the rubber plate 12 and the electrode 14a and is electrically connected to the electrode 14a. Further, the control device 7 controls driving of the moving mechanism 3a and the air cylinder 3b, output control of a test signal via the probe 5, and each of the electrodes 14a to 14c based on the test signal input via each cable 16. A capacitance measurement between the package substrate 40 and each of the bonding terminals 44 and a pass / fail determination process of the package substrate 40 based on the measured capacitance are executed.

On the other hand, the package substrate 40 to be inspected is
As shown in FIGS. 8 and 9, the whole is formed in a flat plate shape,
A cavity 41 is formed at the center of the upper surface 40a. In this case, the cavity 41 includes an IC mounting surface 42 on which the IC is mounted, a bonding terminal forming surface 43 a formed at a position slightly higher than the IC mounting surface 42 so as to surround the IC mounting surface 42, and a bonding terminal forming surface. A bonding terminal formation surface 43b formed at a higher position so as to surround the surface 43a; and a bonding terminal formation surface 43b at a position higher than the bonding terminal formation surface 43b and surrounding the bonding terminal formation surface 43b so as to surround the bonding terminal formation surface 43b.
The bonding terminal forming surface 43c formed at a position slightly lower than 0a is formed in a stepped manner. In this case, IC surfaces are formed on the bonding terminal forming surfaces 43a to 43c.
Are formed in rows at a very fine pitch. In addition, around the cavity 41, FIG.
, External connection terminals 45, 45... Individually connected to the bonding terminals 44, 44... Via the conductor patterns 46, 46. Have been.

Next, a method of manufacturing the sensor section 6 will be described with reference to the drawings.

First, the rubber plate 12 is fitted inside the case 11, and the cable insertion holes 21a, 21a.
, 21c, 21c, and the cable insertion holes 22a, 22a,..., 22c, 22c,. In this case,
As shown in FIG. 5, for example, the cable 16 inserted through the cable insertion hole 21b from the upper surface side of the case 11 is pulled out to the back side of the rubber plate 12 through the cable insertion hole 22b. It is inserted from the back side into the adjacent cable insertion hole 22b and pulled out to the upper surface side of the case 11 through the cable insertion hole 21b. Next, the base unit 1
After mounting the spring 18 on each shaft 13a of No. 3, the electrodes 14a to 14c and the spacer 15 are mounted. At this time, as shown in FIG.
Spacer 15, electrode 14b, spacer 15, electrode 14
c, and the spacer 15 is mounted in this order.

Next, the base portion 13 in this state is fitted inside the case 11, and is fixed to the case 11 by tightening the fixing bolt inserted through the bolt insertion hole 23. At this time, as shown in FIG. 5, for example, the cable insertion holes 21b, 21b and the cable insertion holes 22b, 22b
Is inserted between the rubber plate 12 and the electrode 14b, and is electrically connected to the electrode 14b. Similarly, the cable insertion holes 21a and 21a and the cable 16 inserted through the cable insertion holes 22a and 22a
Are connected to the electrode 14a, and the cable insertion holes 21c,
The cable 16 inserted through the hole 21c and the cable insertion holes 22c is connected to the electrode 14c. Thereby, as shown in FIG. 6, the sensor section 6 is completed. In this case, since the sensor section 6 is small, it is almost impossible to solder the cable 16 to each of the electrodes 14a to 14c. However, according to this connection method by sandwiching, the two can be electrically connected very easily. be able to.

Next, a method of inspecting the package substrate 40 using the substrate inspection apparatus 1 will be described with reference to the drawings.

First, after mounting the package substrate 40 to be inspected at a predetermined position on the substrate mounting table 2, the control device 7
The driving mechanism 3a is driven and controlled to move the probe fixing part 4 downward, and the external connection terminals 45, 45,.
Contact. Next, the control device 7 controls the air cylinder 3b.
To lower the sensor unit 6 by controlling the driving of
As shown in FIG. At this time, the formation positions of the bonding terminal formation surfaces 43a to 43c in the height direction are determined by the respective package substrates 40 to be inspected.
Even if it varies every 40.
As a result, fine movement of each of the members 4c independently in the vertical direction results in absorption of the variation and the impact at the time of contact. Also, electrode 1
When 4a to 14c slightly move upward relative to case 11, rubber plate 12 elastically deforms to urge electrodes 14a to 14c to contact bonding terminal forming surfaces 43a to 43c, respectively. Press. As a result,
Each of the electrodes 14a to 14c is
The bonding terminals 44, 44 on a to 43 c are spaced apart by the thickness of the insulating layer 17.

Next, an AC voltage is output as an inspection signal to an external connection terminal 45 via an arbitrary probe 5, and a bonding terminal 44 to be inspected and electrodes 14a to 14c arranged on the bonding terminal 44 are output. The capacitance between the two is measured. At this time, in the board inspection apparatus 1, since the electrodes 14a to 14c of the sensor unit 6 are insulated from each other by the spacers 15, 15,..., A maximum of four bonding terminals are provided for each of the bonding terminal forming surfaces 43a to 43c. The capacitances of 44, 44,... (16 as a whole of the substrate inspection apparatus 1) can be measured simultaneously and separately. For this reason, the inspection time can be reduced. Thereafter, the continuity between the bonding terminal 44 and the external connection terminal 45 is inspected by comparing the capacitance between each bonding terminal 44 and the electrodes 14a to 14c with the reference data absorbed from the non-defective substrate. . At this time, when the measured capacitance is out of the predetermined range with respect to the reference data and has a low capacitance value, the control device 7 determines that the bonding terminal 44 and the external connection terminal 45 are disconnected. By performing this inspection process for all the bonding terminals 44, 44,... And the external connection terminals 45, 45,.

As described above, in the board inspection apparatus 1, the electrical inspection of the package board 40 is performed by using the sensor section 6 having the electrodes 14a to 14c capable of simultaneously contacting the plurality of bonding terminal formation surfaces 43a to 43c. By doing so, the inspection time can be extremely reduced. Also, compared to an inspection jig in which a large number of contact probes are implanted corresponding to all the bonding terminals 44, 44,... Can be performed. further,
When replacing the electrodes 14a to 14c which are most easily damaged and worn, only the worn electrodes 14a to 14c can be easily replaced without replacing the cable 16, and it is not necessary to replace the entire sensor section 6. , Replacement costs and running costs can also be reduced.

The present invention is not limited to the configuration shown in the above-described embodiment of the present invention. For example, in the embodiment of the present invention, three bonding terminal forming surfaces 43a to 43a are formed.
Although an example of the sensor unit 6 capable of inspecting the package substrate 40 having the cavity 41 in which the cavity 43c is formed has been described, the number of bonding terminal formation surfaces on the inspection target package substrate 4 is not limited to this, and two or four bonding terminals are formed. The present invention can be configured to be capable of inspecting a package substrate having a bonding terminal formation surface of a surface or more. In this case, the number of electrodes 1 corresponding to the number of bonding terminal formation surfaces is
4 may be provided.

Further, in the embodiment of the present invention, four electrodes 14 are provided for one bonding terminal formation surface, and the capacitance is applied to all the bonding terminals 44 on the bonding terminal formation surface. Has been described above, for example, one electrode 14 is provided for one bonding terminal forming surface, and the sensor unit having the electrode 14 is rotated by 90 ° to form the bonding. It is also possible to configure so that the capacitance can be sequentially measured for all the bonding terminals 44 on the terminal forming surface. Further, for example, it is also possible to use a rectangular tube-shaped electrode that comes into contact with each of the bonding terminal forming surfaces 43a to 43c, or the bottom surface is integrated stepwise according to the forming position of the bonding terminal forming surfaces 43a to 43c. It can also be configured using the formed electrodes.

[0034]

As described above, according to the sensor for inspecting a substrate according to the first aspect, the provision of the electrode portion configured to be able to contact at least two bonding terminal forming surfaces via the insulating layer is provided. In addition, the inspection time can be shortened as compared with the case where the inspection is sequentially performed for each bonding terminal forming surface, and the inspection is compared with the case where the inspection is performed using an inspection jig having a large number of contact probes to be brought into contact with each bonding terminal. As a result, the manufacturing cost can be reduced, and the electrical inspection can be performed while preventing the bonding terminals from being damaged.

According to the second aspect of the present invention, each electrode of the electrode portion abuts on each bonding terminal forming surface and is configured to be independently finely movable in the vertical direction. By doing so, even if there is a variation in the formation position in the height direction of the bonding terminal formation surface, each electrode independently moves slightly in the vertical direction to absorb the variation, so that there is no gap between each bonding terminal. As a result of accurately measuring the capacitance, it is possible to accurately inspect the package substrate.

According to the third aspect of the present invention, since the elastic material is provided on the upper end of each electrode, each electrode is urged toward the bonding terminal forming surface by the elastic material and pressed. Therefore, the bottom surface of the electrode and the bonding terminal are accurately separated from each other by the thickness of the insulating layer, so that the capacitance between the bonding terminal and the bonding terminal can be accurately measured.

Further, according to the sensor for board inspection according to the fourth aspect, since the electrodes are insulated from each other, the capacitance between the plurality of bonding terminals can be measured simultaneously for the number of electrodes. In addition, the inspection time can be further reduced.

According to the sensor for board inspection according to the fifth aspect, since the connection cable is sandwiched between the elastic material and the electrode and electrically connected to the electrode, the connection cable is extremely compared with the connection method by soldering or the like. Both can be electrically connected reliably and easily.

Further, according to the substrate inspection apparatus of the sixth aspect, the provision of the substrate inspection sensor having the electrode portion configured to be able to contact two or more bonding terminal forming surfaces is provided, thereby reducing the manufacturing cost. The predetermined electrical test can be performed in a very short time while preventing the bonding terminal from being damaged.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1 according to an embodiment of the present invention.

FIG. 2 is a side sectional view of the sensor unit 6;

FIG. 3 is an exploded perspective view of the sensor unit 6;

FIG. 4 is a perspective view showing a state where electrodes 14a to 14c and a spacer 15 are mounted on a base portion 13.

FIG. 5 is a side sectional view showing a connection state between an electrode 14b and a cable 16;

FIG. 6 is an external perspective view of the sensor unit 6 in a completed state.

FIG. 7 is a side cross-sectional view of the board inspection apparatus 1 in a state where probes 5, 5,...

FIG. 8 is an external perspective view of a package substrate 40 which is an example of an inspection target.

FIG. 9 is a side sectional view of the package substrate 40.

FIG. 10 shows a sensor unit 5 in a conventional board inspection apparatus 51.
6 is an external perspective view of FIG.

FIG. 11 is an external perspective view of a package substrate 70 which is an example of an inspection target.

FIG. 12 is a side sectional view of the package substrate 70.

FIG. 13 shows a board inspection device 51 in a state where probes 5, 5.
FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Board inspection apparatus 5 Probe 6 Sensor part 12 Rubber plate 14a-14c Electrode 15 Spacer 17 Insulating layer 40 Package board 41 Cavities 43a-43c Bonding terminal formation surface 44 Bonding terminal 45 External connection terminal

Claims (6)

[Claims] 1. A substrate inspection sensor for performing a predetermined electrical inspection on a package substrate having a cavity in which a plurality of bonding terminal formation surfaces are formed in a stepwise manner, wherein the insulating layer has a predetermined thickness. Formed on the bottom surface and at least 2
A substrate inspection sensor, comprising: an electrode portion configured to be able to abut on the two bonding terminal formation surfaces via the insulating layer. 2. The electrode section is configured to include a plurality of electrodes that can be respectively in contact with the respective bonding terminal formation surfaces, and the respective electrodes are configured to be independently finely movable in the vertical direction. The substrate inspection sensor according to claim 1, wherein: 3. The substrate inspection sensor according to claim 2, wherein an elastic material that elastically deforms in accordance with upward movement of the electrode is provided at an upper end of the electrode. 4. The substrate inspection sensor according to claim 2, wherein the plurality of electrodes are insulated from each other. 5. An inspection unit for performing the predetermined electrical inspection, and a connection cable for connecting each of the electrodes to the inspection unit, wherein the connection cable is sandwiched between the elastic material and the electrode. The substrate inspection sensor according to claim 3, wherein the sensor is electrically connected to the electrode. 6. The sensor for board inspection according to claim 1, further comprising: a probe disposed so as to be able to contact an external connection terminal of the package board to output or input an inspection signal. The inspection signal is applied between the electrode portion in the substrate inspection sensor and the bonding terminal with which the probe is in contact, and an electrostatic force between the bonding terminal formed on the bonding terminal forming surface and the electrode portion is formed. A board inspection apparatus that measures a capacitance and performs the predetermined electrical inspection on the package substrate based on the measured value.