JP2001002759A - Epoxy resin composition and electric laminate - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To dramatically improve heat resistance as well as a flame retardant effect as a halogen-free flame retardant formulation. SOLUTION: Phenol novolak type epoxy resin
(A), a reaction product (B) of an amino group-containing triazine compound with a phenol and an aldehyde, and the following general formula 1 Or a hydrolyzate (C) thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-halogenated formulation
(Halogen-free) with excellent flame retardancy and excellent heat resistance and moisture resistance, so laminated component materials, semiconductor sealing materials, electrical insulating materials, fiber reinforced composite materials, coating materials, molding materials, adhesives The present invention relates to an epoxy resin composition that can be used as an agent material and the like, and is particularly useful as a laminate (printed wiring board) and a semiconductor encapsulating material for electrical applications.

[0002]

2. Description of the Related Art Conventionally, epoxy resin compositions used in combination with an epoxy resin and a curing agent have been widely used in printed wiring boards and electric and electronic material parts such as semiconductor materials because of their excellent electrical characteristics and cured product strength. Used. These electric and electronic material components require high flame retardancy (UL-94 V-0) as typified by glass epoxy laminates and IC encapsulants, and therefore, halogenated epoxy resins are usually used. Was.

However, in recent years, there has been a concern about environmental impacts such as a problem of dioxin generation accompanying incineration of waste containing a halogen-based flame retardant, and flame retardant formulations which reduce halogens or do not use halogens have been strongly used. It has been demanded.

[0004] As an alternative to such a flame retardant prescription using a halogen, for example, Japanese Patent Application Laid-Open No. 11-43536 discloses a non-halogen type by mixing a triazine-modified novolak and a phosphate ester with a phenol novolak epoxy resin. A flame retarding technology is disclosed.

[0005]

However, Japanese Patent Application Laid-Open No.
In the technique described in Japanese Patent Application Publication No. 1-435536, a synergistic effect between a flame retardant effect due to a nitrogen atom caused by a triazine-modified novolak and a flame retardant effect caused by forming a polyphosphoric acid film on an epoxy resin surface to block oxygen. However, there is a problem that the glass transition point is lowered due to the plasticizing effect of the phosphate ester, resulting in poor heat resistance.

An object of the present invention is to dramatically improve heat resistance as well as flame retardancy as a halogen-free flame retardant formulation.

[0007]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, by blending a nitrogen compound having a specific structure and a phosphorus atom-containing compound with a novolak type epoxy resin, flame retardancy has been achieved. The inventors have found that both the effect and the heat resistance can be obtained, and have completed the present invention.

That is, the present invention provides a novolak epoxy resin (A), a compound (B) having a phenol skeleton and a triazine skeleton, and a compound represented by the following general formula 1

Embedded image An epoxy resin composition comprising a compound represented by the formula (I) or a hydrolyzate (C) thereof as an essential component, and a cloth-like substrate impregnated with the composition, and then laminated and heated and pressed. The present invention relates to an electric laminate characterized by the following.

Novolak type epoxy resin used in the present invention
(A) is an epoxy resin obtained by reacting epihalohydrin with a novolak resin obtained by reacting aldehydes with phenols.

The phenols used here include:
Although not particularly limited, specific examples include monohydric phenols such as phenol and cresol; polyphenols such as bisphenol A, bisphenol S, bisphenol AD, resorcinol, and catechol; and aminophenol. These phenols can be used alone or in combination of two or more. However, phenol is preferable because the final cured product has an excellent balance of heat resistance and adhesion. Examples of the aldehyde include formaldehyde and benzoaldehyde, but are not particularly limited.

The reaction between the phenols and the aldehydes is carried out by a conventional method, and after a novolak resin is formed, the desired novolak epoxy resin (A) can be obtained by reacting with epihalohydrin. Further, in the present invention, the phenol novolak type epoxy resin thus obtained may be an epoxy resin having a structure further extended with a polyfunctional phenol such as bisphenol A or bisphenol F.

Such a novolak type epoxy resin (A)
Is preferably from 1.0 to 30.0 poise at 150 ° C. from the viewpoint of further increasing heat resistance.

Further, in the present invention, the compound (B) having an epoxy group of the novolak type epoxy resin (A), a phenol skeleton and a triazine skeleton is within a range that does not impair the effects of the present invention. Another epoxy resin (A2) may be used in combination within a range that satisfies the equivalent ratio with the hydroxyl group, epoxy group / hydroxyl group = 1 / 0.35 to 2/1. As the epoxy resin that can be used in combination, a non-halogen epoxy resin is preferable. For example, n-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, cresyl glycidyl ether, P.I.
Monofunctional epoxy resins such as Sec-butylphenyl glycidyl ether, glycidyl methacrylate, and vinylcyclohexene monoepoxide;

Bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, tetramethyl bisphenol A type epoxy resin, bisphenol S type epoxy resin, resorcinol diglycidyl ether, 1-6 dihydroxy Other bifunctional epoxy resins such as diglycidyl ether of naphthalene and dimethyl bisphenol C diglycidyl ether;

1,6-diglycidyloxynaphthalene type epoxy resin, 1- (2,7-diglycidyloxynaphthyl) -1- (2-glycidyloxynaphthyl) methane, 1,1-bis (2,7-di Naphthalene epoxy resins such as glycidyloxynaphthyl) methane and 1,1-bis (2,7-diglycidyloxynaphthyl) -1-phenyl-methane;

Cycloaliphatic epoxy resins such as epoxy resins having a cyclohexene oxide group, epoxy resins having a tricyclodecene oxide group, epoxy resins having a cyclopentene oxide group, and epoxidized dicyclopentadiene;

A glycidyl ester type epoxy resin such as diglycidyl phthalate, diglycidyl tetrahydrophthalate, diglycidyl hexahydrophthalate, diglycidyl p-oxybenzoic acid, glycidyl dimer acid and triglycidyl ester;

Diglycidyl aniline, tetraglycidylaminodiphenylmethane, triglycidyl p-aminophenol, tetraglycidyl meta-xylylenediamine,
Glycidylamine type epoxy resin such as diglycidyl toluidine, tetraglycidyl bisaminomethylcyclohexane,

Hydantoin type epoxy resins such as diglycidylhydantoin and glycidylglycidoxyalkylhydantoin; heterocyclic epoxy resins such as triallyl isocyanurate and triglycidyl isocyanurate;

Fluoroglycinol triglycidyl ether, trihydroxybiphenyl triglycidyl ether, trihydroxyphenylmethane triglycidyl ether, glycerin triglycidyl ether, 2- [4-
(2,3-epoxypropoxy) phenyl] -2- [4
-[1,1-bis [4- (2,3-epoxypropoxy) phenyl] ethyl] phenyl] propane, 1,3-
Bis [4- [1- [4- (2,3-epoxypropoxy) phenyl] -1- [4- [1- [4- (2,3-epoxypropoxy) phenyl] -1-methylethyl] phenyl] Trifunctional epoxy resins such as ethyl] phenoxy] -2-propanol,

Tetrahydroxyphenylethanetetraglycidyl ether, tetraglycidylbenzophenone,
Examples thereof include tetrafunctional epoxy resins such as bisresorcinol tetraglycidyl ether and tetraglycidoxybiphenyl.

The use of these other epoxy resins (A2) is not limited to only one type.
Two or more kinds can be used in combination or various modified ones can be used. Among these, bisphenol-type epoxy resins, particularly bisphenol A-type epoxy resins and bisphenol F-type epoxy resins, are preferable from the viewpoint of balance in mechanical properties, adhesion and the like.

When these other epoxy resins (A2) are used in combination, the epoxy equivalent of all epoxy components is 100.
The range of -500 g / eq is preferable. That is, when the epoxy equivalent is 100 g / eq or more, the adhesion to the cloth substrate is remarkably improved, and when the epoxy equivalent is 500 g / eq or less, the cured product has excellent heat resistance. 150 to 350 g / eq is more preferable from the viewpoint of excellent performance balance.

Next, the compound (B) having a phenol skeleton and a triazine skeleton is not particularly limited, but various compounds obtained by a condensation reaction of a triazine compound, a phenol and an aldehyde can be used. It is preferably used as a mixture of compounds (hereinafter, abbreviated as “mixture (B)”).

Here, the phenol skeleton represents a phenol structural site derived from phenols, and the triazine skeleton represents a triazine structural site derived from a triazine compound.

The phenols used here include:
There is no particular limitation, for example, phenol, o
Polyhydric compounds such as alkyl phenols such as cresol, m-cresol, p-cresol, xylenol, ethylphenol, butylphenol, nonylphenol, and octylphenol; bisphenol A, bisphenol F, bisphenol S, bisphenol AD, tetramethylbisphenol A, resorcinol, and catechol; Examples include phenols, naphthols such as monohydroxynaphthalene and dihydroxynaphthalene, and other phenylphenols and aminophenols. These phenols can be used alone or in combination of two or more. However, phenol is preferable because the final cured product is excellent in flame retardancy and excellent in reactivity with an amino group-containing triazine compound.

Next, the compound containing a triazine ring is not particularly limited, but is preferably the following general formula 3 or isocyanuric acid.

[0028]

Embedded image (In the general formula 1, R ₁ , R ₂ , and R ₃ represent any one of an amino group, an alkyl group, a phenyl group, a hydroxyl group, a hydroxylalkyl group, an ether group, an ester group, an acid group, an unsaturated group, and a cyano group. Represents.)

Among the compounds represented by the above general formula 1, melamine, acetamate, and the like, in which two or three of R ₁ , R ₂ , and R ₃ are amino groups, because of their excellent reactivity. Amino group-containing triazine compounds represented by guanamine derivatives such as guanamine and benzoguanamine are preferred.

The use of these compounds is not limited to one kind alone, and two or more kinds can be used in combination.

The aldehyde is not particularly limited, but formaldehyde is preferred from the viewpoint of easy handling. Formaldehyde includes, but is not limited to, formalin, paraformaldehyde, and the like as typical sources.

Among the mixtures (B) obtained by subjecting these triazine compounds, phenols and aldehydes to a condensation reaction, particularly the triazine compounds represented by the above-mentioned guanamine derivatives such as melamine, acetoguanamine and benzoguanamine. A mixture obtained using an amino group-containing triazine compound (hereinafter, abbreviated as “mixture (B ′)”) is preferable because the effect of improving flame retardancy is remarkable.

Examples of the mixture (B ′) include: B1: a condensation reaction product of an amino group-containing triazine compound, a phenol and an aldehyde, and B2: a condensation reaction product of an amino group-containing triazine compound and an aldehyde. , B3: the condensation reaction of phenols and aldehydes, B4: phenols, B5: a mixture of an amino group-containing triazine compound, and, -NH- -X-NH-CH ₂ in the mixture (b1 _{) -X-NH-CH 2 -Y-} (b2) ( wherein, X is a triazine skeleton, Y is showing a phenol skeleton.) comprising a structural moiety and (b2) / (b1) = 1.5~20 Those contained in proportion are preferred from the viewpoint of excellent compatibility with the epoxy resin (A).

In the mixture (B '), phenols (B4), which are unreacted components, and an amino group-containing triazine compound (B
5) may slightly remain, but is preferably in a range of 3% by weight or less.

In the present invention, the mixture obtained by subjecting a triazine compound, a phenol and an aldehyde to a condensation reaction or a mixture (B ′) using an amino-containing triazine compound as the triazine compound is a mixture (B ′). The nitrogen atom content in B) or the mixture (B ′) is preferably 5% by weight or more, especially 8% by weight or more, and the softening point measured in glycerin by a ball and ring method is 50 ° C. or more, preferably 80 ° C. or higher is preferred. In addition, 150 ° C measured with a cone plate type viscometer
The melt viscosity at 0.1 Pas or more, preferably 0.3 Pas
The above is preferred.

Novolak type epoxy resin in the present invention
The compounding ratio of (A) and the compound (B) having a phenol skeleton and a triazine skeleton is such that the epoxy group in (A)
It is preferable that the equivalent ratio with the hydroxyl group in the compound (B) and the epoxy group / hydroxyl group = 1 / 0.35 to 2/1 be satisfied from the viewpoint of the moisture resistance of the cured product and the laminate, and the mechanical strength.

The compound (C) used in the present invention is a compound represented by the following general formula 1 or a hydrolyzate thereof, which imparts an excellent refractory effect to the epoxy resin composition of the present invention.

[0038]

Embedded image Here, in the general formula 1, each R is independently a hydrogen atom or an aliphatic group or an aromatic group having 1 to 10 carbon atoms, m is an integer of 1 to 4, and n is 1 to 4 Represents an integer. The aliphatic or aromatic group having 1 to 10 carbon atoms specifically includes a methyl group, an ethyl group, an isopropyl group, a t-butyl group, a sec-butyl group, a phenyl group and the like.

The hydrolyzate of the compound represented by the general formula 1 is specifically represented by the following general formula 2.

[0040]

Embedded image Here, R, m and n in the general formula 2 have the same meanings as in the case of the general formula 1.

Among them, it is preferable that R in the general formula 1 or 2 is a hydrogen atom from the viewpoint of remarkably excellent remarkable effect. Further, from the viewpoint of water resistance, the general formula 1 is more preferable than the general formula 2, and therefore, in particular, in the general formula 1, 9,10-hydro-9-where R is a hydrogen atom.
Oxa-10-phosphaphenanthrene-10-oxide is most preferred.

The amount of the compound (C) is not particularly limited, but is preferably in the range of 5 to 50% by weight based on the solid content in the composition. That is, when the content is 5% by weight or more, the inevitable effect is remarkably improved, and when the content is 50% by weight or less, mechanical properties are excellent. The range of 10 to 40% by weight is particularly preferable from the viewpoint of excellent balance between them. The compound (C) may be used as an additive-based flame retardant, or may be used in advance as a novolak epoxy resin.
It may be used by reacting with (A), or may react with novolak type epoxy resin (A) during the curing reaction.

Here, in order to react the compound (C) with the novolak type epoxy resin (A) in advance, for example, 20 to 20
The reaction may be performed at a temperature of 0 ° C. The reaction may be carried out without a catalyst, but is preferably carried out in the presence of a catalyst. Examples of usable catalysts include alkali metal hydroxides such as sodium hydroxide and potassium hydroxide, and tertiary amines such as triethylamine and benzyldimethylamine. And quaternary ammonium salts such as quaternary amines and tetramethylammonium chloride, imidazole compounds, triphenylphosphine, and quaternary phosphonium salts. The reaction can be carried out in the presence of a solvent. However, it is preferable to carry out the reaction without a solvent since compound (C) may react with a solvent. Further, it is preferable to use a catalyst not containing a halogen atom as the above-mentioned catalyst.

The epoxy resin composition of the present invention can use various curing accelerators (D), which may be conventionally known ones, for example, tertiary amines such as benzyldimethylamine, various imidazoles, Known compounds such as primary phosphines or various metal compounds can be applied.

In the epoxy resin composition of the present invention, an organic solvent (E) can be used, if necessary, in addition to the above components. In particular, when preparing a varnish for an electric laminate, it is preferable that the components (A), (B), (C), and (E) be essential components. In addition, of course, in other uses such as paint use, (A), (B),
You may use each component of (C), (D), and (E) together.

The organic solvent (E) is not particularly restricted but includes, for example, acetone, methyl ethyl ketone, toluene, xylene, methyl isobutyl ketone, ethyl acetate, ethylene glycol monomethyl ether,
N, N-dimethylformamide, methanol, ethanol, isopropyl alcohol, n-butanol, methoxypropanol, ethyl carbitol, toluene, cyclohexanone and the like. These solvents can be used as a mixture of two or more solvents as appropriate.

The amount of the organic solvent (E) to be used is not particularly limited, but the solid content concentration is 30% by weight since the impregnation into the base material and the adhesion of the resin to the prepreg are improved. %, Especially 40 to 70% by weight.

Various curing agents, additives, flame retardants, fillers, and the like can be appropriately added to the epoxy resin composition of the present invention, if necessary, but the effects of the present invention are remarkable. In order to do so, it is desirable to avoid the use of inorganic flame retardants and other inorganic fillers as much as possible. Even when they are used, it is preferable that the content be within 5% by weight of the composition.

The epoxy resin composition of the present invention described in detail above is extremely useful for electric laminates as described above. The method for producing an electric laminate from the epoxy resin composition of the present invention is not particularly limited, and among the above components, a solid composition composed of each component except for the organic solvent (E) is heated and melted. To impregnate the cloth-like base material at a ratio of the resin amount of 30 to 70% by weight, or (A) to
A varnish is prepared by blending the components of (E), and the varnish is impregnated into a cloth-like substrate at a ratio of 30 to 70% by weight of a resin to form a prepreg, and then a plurality of prepregs, preferably 1 to There is a method in which ten sheets are hot-pressed together with a copper foil.

Here, the cloth-like substrate is not particularly limited, and examples thereof include glass cloth and aramid cloth.

The conditions for the heat and pressure molding are not particularly limited.
The range of -220 ° C and the range of 2-10 MPa as a pressure condition can be preferably applied.

The epoxy resin composition of the present invention may further contain various curing agents, additives, flame retardants, fillers, and the like, if necessary.

[0053]

The present invention will be described in more detail with reference to the following examples.

Synthesis Example 1 41.5 was added to 94 parts of phenol and 12 parts of benzoguanamine.
% Formalin and 0.4 parts of triethylamine were added to adjust the pH of the system to 8.2, and the temperature was gradually raised to 100 ° C. while paying attention to heat generation. After reacting at 100 ° C. for 5 hours, the temperature was raised to 120 ° C. over 2 hours while removing water under normal pressure. Next, after reacting for 3 hours under reflux, the temperature was raised to 160 ° C. over 2 hours while removing water under normal pressure. After further reacting for 3 hours under reflux,
The temperature was raised to 180 ° C. over 2 hours while removing water under normal pressure. Next, unreacted phenol was removed under reduced pressure to obtain a mixture having a softening point of 111 ° C. and a hydroxyl equivalent of 120 g / eq.

Hereinafter, this mixture is abbreviated as "B-1".
The resulting weight ratio of the phenols and triazines in the composition, unreacted formaldehyde amount, presence or absence of methylol groups, the structural units _{b1 (-X-NH-CH 2} -NH
-), the structural unit _{b2 (-X-NH-CH 2} -Y-) molar ratio of unreacted phenol monomer amount, and triazines reaction rate was determined as follows.

<Weight ratio of phenol to triazines (benzoguanamine)> The phenol content in the effluent removed from the reaction system at 180 ° C. under reduced pressure was calculated by gas chromatography, subtracted from the number of phenol parts charged, and calculated in the mixture. Of phenol. Benzoguanamine was included in the composition as it was charged. The ratio between the two was defined as the abundance ratio. [Column: 30% Celite 545 carnauba wax 2m
× 3 mmΦ, column temperature: 170 ° C, inlet temperature: 230
° C detector: FID carrier gas: N2 gas 1.0kg
/ Cm2 measurement method: internal standard method]

<Structural unit b1 (—X—NH—CH ₂ —N
H-) were measured under the following conditions using a molar ratio> @ 13 C-NMR chart of the structural unit _{b2 (-X-NH-CH 2} -Y-). [Apparatus: GSX270 Proton: 2 manufactured by JEOL Ltd.]
70 MHZ measurement solvent: DMSO or heavy acetone Reference substance: tetramethylsilane Measurement condition Pulse condition: 45 ° × 10000 times Pulse interval: 2 seconds] Chart 4
The integrated value of the peak appearing at 2.5 to 45 ppm is Bp, 4
The integral value of the peak appearing at 7 to 48.5 ppm was defined as Ap, and the molar ratio was determined by the following equation. Structural unit b1 / structural unit b2 = Bp / Ap

<Amount of unreacted phenol monomer> The phenol monomer content in the effluent was measured under the same measurement conditions as in the gas chromatography described above.

<Reaction rate of triazines> Calculated using a 13 C-NMR chart measured under the same conditions as in the measurement of the above b1 / b2 ratio. 167.2 to 167 of the chart.
The integrated value of a sharp peak appearing at 4 ppm is defined as Tm, 1
The peak integration value of the broad peak appearing at 63 to 167.2 ppm was defined as Tr, and the reaction rate was determined by the following equation.

Reaction rate (%) = (Tr / (Tr + Tm)) × 100 The results of the amounts of the respective components thus obtained are summarized in Table 1.

Synthesis Example 2 To 94 parts of phenol and 18 parts of melamine, 45 parts of 41.5% formalin and 0.4 parts of triethylamine were added.
The pH of the system was adjusted to 8.2, and the temperature was gradually raised to 100 ° C. while paying attention to heat generation. After reacting at 100 ° C. for 5 hours, the temperature was raised to 120 ° C. over 2 hours while removing water under normal pressure. Next, after reacting for 3 hours under reflux, the temperature was raised to 140 ° C. over 2 hours while removing water under normal pressure. After reacting for 3 hours under reflux, the temperature was raised to 160 ° C. over 2 hours while removing water under normal pressure. After further reacting under reflux for 3 hours, the temperature was raised to 180 ° C. over 2 hours while removing water under normal pressure. Next, unreacted phenol was removed under reduced pressure to obtain a mixture having a softening point of 128 ° C. and a hydroxyl equivalent of 120 g / eq. Hereinafter, this mixture is abbreviated as “B-2”. The weight ratio of phenol to melamine, the molar ratio of structural unit b1, the structural unit b2, the amount of unreacted phenol monomer, and the conversion of triazines were determined in the same manner as in Example 1, and the results are summarized in Table 1.

[0062]

[Table 1]

Next, a varnish was prepared according to the composition shown in Table 2. The varnish is prepared by mixing an epoxy resin and a curing agent and a phosphorus compound previously dissolved in a mixed solution of methyl cellosolve and N, N-dimethylformamide, and then adding the curing agent 2-
Ethyl-4-methylimidazole was added, and the mixture was adjusted with methyl ethyl ketone so that the nonvolatile content (NV) of the compounded epoxy resin composition was finally 56%.

At this time, the amount of the curing agent was blended in such a manner that it would be 1.0 equivalent to the epoxy equivalent in the base epoxy resin. The curing accelerator is added in an amount of 0.1 part per 100 parts of the resin (total of epoxy resin, curing agent and phosphorus compound).
The ratio was 1 part. Thereafter, each mixed solution was cured under the following conditions to produce a double-sided copper-clad laminate. Table 2 shows the evaluation results.

[Lamination board production conditions] Base material: 180 μm; Glass cloth “WEA 7628 30 H258 N” manufactured by Nitto Boseki Co., Ltd. Number of plies: 8 Pre-preg formation condition: 160 ° C./3 minutes Copper foil: 35 μm; Curing conditions: 170 ° C, 1 hour at 40 kg / cm2 at 1 hour Molding thickness: 1.6 mm Resin content: 40%

[Physical property test conditions] Combustion test: Based on UL-94 vertical test. Glass transition temperature: Measured by TMA after removing copper foil by etching. Heating rate 10 ° C / min Peel strength: Conforms to JIS K6481. Moisture resistance and solder resistance: After exposing the test piece (25mm x 50mm) to the environment of [temperature; 121 ° C, humidity; 100%, 2 hours], immersed in a solder bath at 260 ° C for 30 seconds, and before and after the condition Changes were observed. (Judgment criteria) ○: No change in appearance △: 5 or less blisters with a diameter of 5 mm or less. ×: swelling larger than 5 mm in diameter or 6 or more swelling less than 5 mm in diameter

[0067]

[Table 2]

The raw materials and abbreviations in Table 2 are as follows. "N-775": phenol novolak type epoxy resin (trade name [EPI, manufactured by Dainippon Ink and Chemicals, Inc.)
CLON N-775], epoxy equivalent 190 g / e
q) "N-690": Cresol novolak type epoxy resin (trade name [EPI, manufactured by Dainippon Ink and Chemicals, Inc.)
CLON N-690] epoxy equivalent 216 g / eq) “HCA”: 9,10-hydro-9-oxa-10
-Phosphaphenanthrene-10-oxide (Sanko Co., Ltd.)
Manufactured and trade name: [HCA]) "2E4MZ": 2-ethyl-4-methyl-imidazole)

[0069]

According to the present invention, it is an object of the present invention to dramatically improve heat resistance as well as flame retardancy as a halogen-free flame retardant formulation.

Therefore, the epoxy resin composition of the present invention
It can be used for laminated component materials, semiconductor sealing materials, electrical insulating materials, fiber reinforced composite materials, coating materials, molding materials, adhesive materials, etc., and is especially effective for electric laminated boards (printed wiring boards) for electrical applications. Available.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01B 3/40 H01B 3/40 CG // B29K 63:00 105: 08 B29L 31:34 F term (reference ) 4F204 AA37E AA38E AA39 AB03 AB22 AD04 AD16 AH36 FA01 FB01 FB11 FE21 FF21 FG09 FH06 FH21 FN08 FN15 FN17 FW50 4J002 CC272 CD061 EA058 EC008 ED008 EE028 EH008 EN007 EP008 AA 136 OA01 FD01 EA01 EA01 012 AF01 AF06 AG01 AG07 AJ08 AJ18 DA04 DC02 DC41 DD07 FA12 FB08 FB09 JA08 KA01 5G305 AA06 AA07 AB24 AB25 BA12 CA17 CA36

Claims (7)

[Claims] 1. A novolak-type epoxy resin (A), a compound (B) having a phenol skeleton and a triazine skeleton, and a compound represented by the following general formula 1. An epoxy resin composition comprising the compound represented by the formula (I) or a hydrolyzate (C) thereof as an essential component. 2. A compound (B) comprising: a triazine compound;
The composition according to claim 1, which has a structure obtained by a condensation reaction between a phenol and an aldehyde. 3. A compound (B) comprising: B1: a condensation reaction product of an amino group-containing triazine compound with phenols and aldehydes; B2: a condensation reaction product of an amino group-containing triazine compound with aldehydes; B3: phenols condensation reaction product of the aldehyde compound, B4: phenols, B5: a mixture of an amino group-containing triazine compound, and, -NH- -X-NH-CH ₂ in the mixture (b1) -X-NH —CH ₂ —Y— (b2) (wherein, X represents a triazine skeleton and Y represents a phenol skeleton). A mixture containing a structural site of (b2) / (b1) = 1.5 to 20 The composition according to claim 1, which is used as: 4. An epoxy resin (A) having an epoxy equivalent of 1
4. The composition according to claim 1, wherein the amount is from 00 to 500 g / eq.
A composition as described. 5. The method according to claim 1, which further comprises a curing accelerator (D) in addition to the epoxy resin (A), the curing agent (B), and the phosphorus-containing compound (C). Composition. 6. The composition according to claim 1, wherein the composition contains an organic solvent (E) in addition to the epoxy resin (A), the curing agent (B), and the phosphorus-containing compound (C). object. 7. A cloth-like substrate impregnated with the epoxy resin composition according to any one of claims 1 to 6 and then laminated and heated and pressed. An electric laminate characterized by being formed.