JP2001001373A - Insert molding method of member into mold resin - Google Patents
Insert molding method of member into mold resinInfo
- Publication number
- JP2001001373A JP2001001373A JP17678099A JP17678099A JP2001001373A JP 2001001373 A JP2001001373 A JP 2001001373A JP 17678099 A JP17678099 A JP 17678099A JP 17678099 A JP17678099 A JP 17678099A JP 2001001373 A JP2001001373 A JP 2001001373A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic sensor
- mold
- sensor element
- mold resin
- elastic pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 24
- 229920005989 resin Polymers 0.000 title claims abstract description 24
- 238000000465 moulding Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Brushless Motors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は磁気センサ素子など
の部材のモールド樹脂内へのインサート成形方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for insert molding a member such as a magnetic sensor element into a mold resin.
【０００２】[0002]
【従来の技術】従来、磁気抵抗を利用して磁界の状態を
検出する磁気センサが開発され、種々の電子機器に利用
されている。図５はこの種の磁気センサ８０を示す図で
あり、同図（ａ）は斜視図、同図（ｂ）は同図（ａ）の
Ａ‐Ａ断面図である。また図６は磁気センサ素子８１を
示す斜視図である。ここでまず磁気センサ素子８１は、
基板８３の表面に所望の磁気抵抗パターン８５と、磁気
抵抗パターン８５から引き出された４本の電極パターン
８７とを設けて構成されている。なお各電極パターン８
７上には導電層が印刷形成されている。そして磁気セン
サ８０は、平板状の磁気センサ素子８１に設けた各電極
パターン８７に４本の金属板９０の一端を接続した状態
でその周囲に直接成形品（ケース）１００をモールド成
形して構成されている。2. Description of the Related Art Conventionally, magnetic sensors for detecting the state of a magnetic field using a magnetic resistance have been developed and used for various electronic devices. FIGS. 5A and 5B are diagrams showing this type of magnetic sensor 80. FIG. 5A is a perspective view, and FIG. 5B is a sectional view taken along line AA of FIG. FIG. 6 is a perspective view showing the magnetic sensor element 81. Here, first, the magnetic sensor element 81
A desired magnetoresistive pattern 85 and four electrode patterns 87 drawn from the magnetoresistive pattern 85 are provided on the surface of the substrate 83. Each electrode pattern 8
A conductive layer is formed by printing on 7. The magnetic sensor 80 is configured by directly molding a molded product (case) 100 around one end of each of the four metal plates 90 in a state where one end of each of the four metal plates 90 is connected to each electrode pattern 87 provided on the flat magnetic sensor element 81. Have been.
【０００３】そして上記磁気センサ８０を製造するに
は、図７に示すように金型ｅ１，ｅ２内に金属板９０と
磁気センサ素子８１を収納してその際磁気センサ素子８
１の各電極パターン８７に金属板９０の一端を当接し、
金型ｅ１に設けたピンゲートｐ１から高温・高圧のモー
ルド樹脂をキャビティーｃ内に圧入してキャビティーｃ
内をモールド樹脂で満たし、モールド樹脂が固化した後
に金型を取り外す方法が用いられる。In order to manufacture the magnetic sensor 80, as shown in FIG. 7, a metal plate 90 and a magnetic sensor element 81 are housed in dies e1 and e2,
One end of the metal plate 90 is brought into contact with each of the electrode patterns 87 of FIG.
A high-temperature and high-pressure molding resin is pressed into the cavity c from the pin gate p1 provided in the mold e1 to form the cavity c.
A method of filling the inside with a mold resin and removing the mold after the mold resin is solidified is used.
【０００４】ところでこの磁気センサ８０は、図５に示
すように磁気センサ素子８１の磁気抵抗パターン８５を
形成した面を成形品１００から露出しておく必要がある
ので、この面は図７に示すようにモールド樹脂充填時に
金型ｅ２の表面に密着させておく。In this magnetic sensor 80, it is necessary to expose the surface of the magnetic sensor element 81, on which the magnetic resistance pattern 85 is formed, from the molded article 100 as shown in FIG. 5, so this surface is shown in FIG. As described above, the mold resin is brought into close contact with the surface of the mold e2 when filling the mold resin.
【０００５】このためピンゲートｐ１からキャビティー
ｃ内に射出されるモールド樹脂は磁気センサ素子８１の
磁気抵抗パターン８５を形成した面の裏面にまず当接し
て、モールド樹脂の射出圧力をかけることによって磁気
抵抗パターン８５を形成した面を金型ｅ２の面に強く当
接させておくようにしている。For this reason, the mold resin injected into the cavity c from the pin gate p1 first comes into contact with the back surface of the surface on which the magnetoresistive pattern 85 of the magnetic sensor element 81 is formed, and the injection pressure of the mold resin is applied to apply magnetic force. The surface on which the resistance pattern 85 is formed is brought into strong contact with the surface of the mold e2.
【０００６】しかしながら上記方法では、ピンゲートｐ
１を設ける位置が限定されてしまい、その位置を必要に
応じて変更する自由度が制限される場合があった。また
射出する溶融モールド樹脂の粘度や圧力によっては、磁
気センサ素子８１を強く金型ｅ２側に向けて押圧できな
い恐れがあった。However, in the above method, the pin gate p
In some cases, the position where 1 is provided is limited, and the degree of freedom to change the position as necessary is sometimes limited. Also, depending on the viscosity and pressure of the molten mold resin to be injected, there is a possibility that the magnetic sensor element 81 cannot be pressed strongly toward the mold e2.
【０００７】このような問題を解決するためには、図７
に点線で示すように、金型ｅ１側に磁気センサ素子８１
を押える押圧部ｅ１１を設ければ良い。しかしながら磁
気センサ素子８１はその基板８３がガラスやシリコンや
セラミック等の硬くてもろい材料で構成されているの
で、磁気センサ素子８１を破壊しないで適正な力で押圧
するためには、磁気センサ素子８１を挟持する金型ｅ２
の面と押圧部ｅ１１間の間隔を極めて精度良くしなけれ
ばならない。しかしながら金型ｅ１，ｅ２自体の若干の
寸法誤差や、磁気センサ素子８１の厚みの若干の寸法誤
差などによって、金型ｅ２の面と押圧部ｅ１１が磁気セ
ンサ素子８１を強く挟持して磁気センサ素子８１を破壊
したり、逆に金型ｅ２の面と押圧部ｅ１１との間隔が磁
気センサ素子８１の厚みよりも若干大きくなって磁気セ
ンサ素子８１を挟持できなくなってしまうという問題が
あった。To solve such a problem, FIG.
As shown by a dotted line in FIG.
It is sufficient to provide a pressing portion e11 that presses. However, since the substrate 83 of the magnetic sensor element 81 is made of a hard and brittle material such as glass, silicon, or ceramic, in order to press the magnetic sensor element 81 with an appropriate force without breaking it, Mold e2 for holding
The distance between the surface and the pressing portion e11 must be extremely accurate. However, due to a slight dimensional error in the molds e1 and e2 itself and a slight dimensional error in the thickness of the magnetic sensor element 81, the surface of the mold e2 and the pressing portion e11 strongly sandwich the magnetic sensor element 81, and There has been a problem that the magnetic sensor element 81 may be destroyed or, conversely, the distance between the surface of the mold e2 and the pressing portion e11 may be slightly larger than the thickness of the magnetic sensor element 81, so that the magnetic sensor element 81 cannot be sandwiched.
【０００８】[0008]
【発明が解決しようとする課題】本発明は上述の点に鑑
みてなされたものでありその目的は、磁気センサ素子な
どの部材を金型内に収納した際に、前記部材を容易且つ
確実に適正な力で挟持することができて、容易且つ確実
にインサート成形できる部材のモールド樹脂内へのイン
サート成形方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to easily and surely hold a member such as a magnetic sensor element when the member is housed in a mold. It is an object of the present invention to provide a method of insert-molding a member that can be easily and reliably insert-molded into a mold resin, which can be sandwiched with an appropriate force.
【０００９】[0009]
【課題を解決するための手段】上記問題点を解決するた
め本発明は、部材を金型内に収納して金型内に設けたキ
ャビティー内に溶融したモールド樹脂を充填して固化せ
しめる部材のモールド樹脂内へのインサート成形方法に
おいて、前記金型内に、前記部材を金型内の所定部分に
押し付けるように押圧する弾性押圧体を設けることとし
た。また前記部材はもろいガラス基板又はシリコン基板
又はセラミック基板に適用して好適である。ここで前記
部材は磁気センサ素子であり、磁気センサ素子の磁気抵
抗パターン形成面が金型内の所定の面に当接するように
その反対側の面を前記弾性押圧体によって押圧するよう
に構成することが好ましい。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a member in which a member is housed in a mold and a cavity provided in the mold is filled with molten mold resin and solidified. In the method of insert molding into a mold resin, an elastic pressing member for pressing the member against a predetermined portion in the mold is provided in the mold. Further, the above-mentioned member is suitably applied to a fragile glass substrate, a silicon substrate, or a ceramic substrate. Here, the member is a magnetic sensor element, and the surface on the opposite side is pressed by the elastic pressing member so that the surface on which the magnetic resistance pattern is formed of the magnetic sensor element contacts a predetermined surface in the mold. Is preferred.
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて詳細に説明する。図１は本発明にかかる方法を
用いて製造された磁気センサ１０を示す図であり、図１
（ａ）は正面側から見た斜視図、図１（ｂ）は背面側か
ら見た斜視図である。また図２は磁気センサ１０の縦断
面図である。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram showing a magnetic sensor 10 manufactured using the method according to the present invention.
1A is a perspective view seen from the front side, and FIG. 1B is a perspective view seen from the back side. FIG. 2 is a longitudinal sectional view of the magnetic sensor 10.
【００１１】これらの図に示すように磁気センサ１０
は、平板状の磁気センサ素子１５の下部に設けた４つの
電極パターン１５５のそれぞれに、４本の金属板２０の
一端を接続した状態で、その周囲に直接成形品（ケー
ス）３０をモールド成形して構成されている。以下各構
成部品について説明する。As shown in these figures, the magnetic sensor 10
Is a state in which one end of each of the four metal plates 20 is connected to each of the four electrode patterns 155 provided below the flat magnetic sensor element 15, and a molded product (case) 30 is directly molded around the metal plate 20. It is configured. Hereinafter, each component will be described.
【００１２】磁気センサ素子１５は前記図６に示す磁気
センサ素子８１と同じものであり、平板状のガラス，シ
リコン若しくはセラミックからなる基板１５１の表面
に、所望の磁気抵抗パターン１５３と、磁気抵抗パター
ン１５３から引き出される４本の電極パターン１５５
（図２参照）とを形成することによって構成されてい
る。各電極パターン１５５はその表面に導電体ペースト
からなる導電層が印刷形成されている。The magnetic sensor element 15 is the same as the magnetic sensor element 81 shown in FIG. 6, and a desired magnetoresistive pattern 153 and a desired magnetoresistive pattern are formed on the surface of a substrate 151 made of flat glass, silicon or ceramic. Four electrode patterns 155 drawn from 153
(See FIG. 2). Each electrode pattern 155 has a conductive layer made of a conductive paste printed on the surface thereof.
【００１３】次に成形品３０は略矩形状に成形されてお
り、一方の表面に磁気センサ素子１５の磁気抵抗パター
ン１５３形成面を露出している。成形品３０の上部に
は、この磁気センサ１０を他の部材に固定するための固
定穴３１が設けられている。なお磁気センサ素子１５の
周囲３ヶ所には凹部３３が設けられている。また３４は
この磁気センサ１０を他の部材に固定する際の位置決め
に用いるガイド部である。また成形品３０の各金属板２
０の電極パターン１５５に接続した部分には、それぞれ
小穴３５（全部で４個）が形成されている。Next, the molded product 30 is formed in a substantially rectangular shape, and the surface on which the magnetic resistance pattern 153 of the magnetic sensor element 15 is formed is exposed on one surface. A fixing hole 31 for fixing the magnetic sensor 10 to another member is provided in an upper part of the molded product 30. In addition, concave portions 33 are provided at three places around the magnetic sensor element 15. Reference numeral 34 denotes a guide portion used for positioning when the magnetic sensor 10 is fixed to another member. Each metal plate 2 of the molded product 30
Small holes 35 (a total of four holes) are formed in portions connected to the zero electrode pattern 155, respectively.
【００１４】さらに成形品３０の背面には、磁気センサ
素子１５の背面に至る凹部３７が設けられているが、こ
の凹部３７は成形品３０を成形する際に下記する金型Ｅ
１の押圧体支持部Ｅ１３と弾性押圧体Ｅ１５によって生
じるものである。Further, on the back surface of the molded product 30, there is provided a concave portion 37 extending to the back surface of the magnetic sensor element 15, and this concave portion 37 is used for molding a molded product 30 as follows.
This is caused by one pressing body supporting portion E13 and the elastic pressing body E15.
【００１５】次にこの磁気センサ１０の製造方法を説明
する。即ち磁気センサ１０を製造するには、図３に示す
ようにまず第２金型Ｅ２のキャビティーＣ２内に４本の
金属板２０（図３では１本のみ示す）を挿入・載置す
る。このとき各金属板２０の先端近傍には第２金型Ｅ２
に設けた位置決め部Ｅ２３の先端が当接する（前記図１
（ａ）に示す成形品３０の４つの小穴３５はこの位置決
め部Ｅ２３によって形成される）。Next, a method of manufacturing the magnetic sensor 10 will be described. That is, to manufacture the magnetic sensor 10, first, as shown in FIG. 3, four metal plates 20 (only one is shown in FIG. 3) are inserted and placed in the cavity C2 of the second mold E2. At this time, the second mold E2 is located near the tip of each metal plate 20.
The tip of the positioning portion E23 provided at the end comes into contact (see FIG. 1).
(The four small holes 35 of the molded product 30 shown in (a) are formed by the positioning portions E23.)
【００１６】次に磁気センサ素子１５をその磁気抵抗パ
ターン１５３（図１参照）形成面を下にして第２金型Ｅ
２のキャビティーＣ２内に収納・載置する。その際磁気
センサ素子１５は第２金型Ｅ２に設けた３つのガイド突
起Ｅ２１（図では２つのみ示すが、もう１本のガイド突
起Ｅ２１は図３に示す右側のガイド突起Ｅ２１の紙面手
前側であって磁気センサ素子１５の紙面手前側の外周側
面をガイドする位置に設けられている）の間にガイドさ
れて位置決めされる（前記図１（ａ）に示す３つの凹部
３３は、これら３つのガイド突起Ｅ２１によって形成さ
れる）。そしてこのとき前記４本の金属板２０の一端面
に磁気センサ素子１５の各電極パターン１５５が接着剤
なしで直接接触する。Next, the magnetic sensor element 15 is placed in the second mold E with its magnetoresistive pattern 153 (see FIG. 1) facing down.
And placed in the second cavity C2. At this time, the magnetic sensor element 15 is provided with three guide projections E21 provided on the second mold E2 (only two guide projections E21 are shown in the figure, but the other guide projection E21 is located on the near side of the right guide projection E21 shown in FIG. 3). The three concave portions 33 shown in FIG. 1A are positioned and guided between the magnetic sensor elements 15 which are provided at positions for guiding the outer peripheral side of the magnetic sensor element 15 on the near side of the drawing. Formed by two guide projections E21). At this time, each electrode pattern 155 of the magnetic sensor element 15 directly contacts one end surface of the four metal plates 20 without an adhesive.
【００１７】ところで第１金型Ｅ１のキャビティーＣ１
内には略円柱状（他の形状でも良い）に突出する押圧体
支持部Ｅ１３が設けられており、押圧体支持部Ｅ１３の
先端面に設けた凹部には弾性押圧体Ｅ１５がその先端が
突出するように挿入されている。弾性押圧体Ｅ１５は円
柱形状（他の形状でも良い）であって、耐熱性の高い弾
性材料（例えばシリコンゴムやフッ素ゴムなど）によっ
て構成されている。The cavity C1 of the first mold E1
A pressing body supporting portion E13 projecting in a substantially columnar shape (may be another shape) is provided therein, and a resilient pressing body E15 protrudes from a concave portion provided on the distal end surface of the pressing body supporting portion E13. Has been inserted to be. The elastic pressing body E15 has a columnar shape (may have another shape) and is made of an elastic material having high heat resistance (for example, silicon rubber or fluorine rubber).
【００１８】そして第２金型Ｅ２の上にこの第１金型Ｅ
１を当接すれば、金属板２０が第１，第２金型Ｅ１，Ｅ
２によって挟持されると同時に、磁気センサ素子１５の
裏面が前記弾性押圧体Ｅ１５によって押圧されて磁気セ
ンサ素子１５の磁気抵抗パターン１５３形成面（図１
（ａ）参照）が第２金型Ｅ２の面に押し付けられる。The first mold E is placed on the second mold E2.
1 makes contact with the metal plate 20, the first and second molds E1, E
2 and at the same time, the back surface of the magnetic sensor element 15 is pressed by the elastic pressing member E15 to form the magnetic resistance pattern 153 forming surface of the magnetic sensor element 15 (FIG. 1).
(See (a)) is pressed against the surface of the second mold E2.
【００１９】このとき弾性押圧体Ｅ１５には弾性がある
ので、たとえ弾性押圧体Ｅ１５の先端面と第２金型Ｅ２
の磁気センサ素子１５を当接する面との間の間隔に若干
の寸法誤差が生じて該間隔が少し狭くなっても、弾性押
圧体Ｅ１５が少し変形するだけでこの誤差を吸収し、磁
気センサ素子１５を強い力で押圧することはなく、磁気
センサ素子１５は常に適正な力で押圧・挟持される。従
って前述のように硬くてもろい材料で構成されている磁
気センサ素子１５であっても破壊されることはない。At this time, since the elastic pressing member E15 has elasticity, for example, the front end surface of the elastic pressing member E15 and the second mold E2
Even if a slight dimensional error occurs in the gap between the magnetic sensor element 15 and the surface in contact with the magnetic sensor element 15 and the gap is slightly narrowed, the error is absorbed only by a slight deformation of the elastic pressing body E15, and the magnetic sensor element The magnetic sensor element 15 is always pressed and held with an appropriate force without pressing the magnetic sensor element 15 with a strong force. Therefore, even the magnetic sensor element 15 made of a hard and brittle material as described above is not broken.
【００２０】従って本実施形態においては、弾性押圧体
Ｅ１５を少し磁気センサ素子１５を押圧する位置となる
ように、弾性押圧体Ｅ１５の先端面と第２金型Ｅ２の磁
気センサ素子１５を当接する面との間の間隔を若干狭く
セットしておくことで、多少の寸法誤差が生じても、弾
性押圧体Ｅ１５が磁気センサ素子１５を押圧できなくな
ることを防止することができる。Therefore, in the present embodiment, the distal end surface of the elastic pressing member E15 is brought into contact with the magnetic sensor element 15 of the second mold E2 so that the elastic pressing member E15 is at a position where the magnetic sensor element 15 is slightly pressed. By setting the distance between the surface and the surface slightly smaller, it is possible to prevent the elastic pressing body E15 from being unable to press the magnetic sensor element 15 even if a slight dimensional error occurs.
【００２１】以上のように弾性押圧体Ｅ１５が磁気セン
サ素子１５を押圧することで、磁気センサ素子１５は確
実に第１，第２金型Ｅ１，Ｅ２内で固定され、同時に各
金属板２０の先端は磁気センサ素子１５の電極パターン
１５５の部分と位置決め部Ｅ２３によって挟持されて各
金属板２０は各電極パターン１５５に確実に密着され
る。As described above, when the elastic pressing member E15 presses the magnetic sensor element 15, the magnetic sensor element 15 is securely fixed in the first and second molds E1 and E2. The tip is sandwiched between the electrode pattern 155 of the magnetic sensor element 15 and the positioning portion E23, so that each metal plate 20 is securely adhered to each electrode pattern 155.
【００２２】そして第１金型Ｅ１側に設けたピンゲート
Ｐ１から例えば２６０℃程度で射出圧力が例えば１００
〜６００ｋｇｆ／ｃｍ2程度の高温高圧の溶融モールド
樹脂、例えばポリブチレンテレフタレート（ＰＢＴ）や
ポリエチレンテレフタレート（ＰＥＴ）やポリフェニレ
ンスルフイド（ＰＰＳ）等をキャビティーＣ１，Ｃ２内
に圧入して満たし、溶融モールド樹脂が冷却・固化した
後に第１，第２金型Ｅ１，Ｅ２を取り外せば、図１，図
２に示す磁気センサ１０が完成する。The injection pressure is, for example, 100 ° C. at about 260 ° C. from the pin gate P1 provided on the first mold E1 side.
A high-temperature and high-pressure molten mold resin of about 600 kgf / cm 2 , such as polybutylene terephthalate (PBT), polyethylene terephthalate (PET), or polyphenylene sulfide (PPS), is pressed into the cavities C1 and C2 to fill and melt. If the first and second molds E1 and E2 are removed after the mold resin has cooled and solidified, the magnetic sensor 10 shown in FIGS. 1 and 2 is completed.
【００２３】なお電極パターン１５５と金属板２０との
接続は上記実施形態では接着部材を用いずに直接接触さ
せたものの周囲にモールド樹脂を成形することによって
単に機械的に圧接させているだけであるが、上述の様に
金属板２０は電極パターン１５５に強く圧接した状態で
その周囲にモールド樹脂が成形されるので、その電気的
機械的接続は十分である。さらに金属板２０と電極パタ
ーン１５５間の接続を強固にするためには以下の実施形
態のようにすれば良い。In the above embodiment, the connection between the electrode pattern 155 and the metal plate 20 is merely mechanically brought into pressure contact by forming a mold resin around a member directly contacted without using an adhesive member. However, as described above, since the mold plate is molded around the metal plate 20 while being strongly pressed against the electrode pattern 155, the electrical and mechanical connection is sufficient. In order to further strengthen the connection between the metal plate 20 and the electrode pattern 155, the following embodiment may be used.
【００２４】即ち図４は本発明の他の実施形態にかかる
磁気センサの製造方法を示す図である。この実施形態に
おいて前記図３に示す実施形態と相違する点は、押圧体
支持部Ｅ１３とこれに取り付けられる弾性押圧体Ｅ１５
の位置とピンゲートｐ１の位置を変更した点のみであ
る。FIG. 4 is a view showing a method of manufacturing a magnetic sensor according to another embodiment of the present invention. This embodiment is different from the embodiment shown in FIG. 3 in that a pressing body support portion E13 and an elastic pressing body E15 attached thereto are provided.
And the position of the pin gate p1 are changed.
【００２５】即ちこの実施形態の場合、押圧体支持部Ｅ
１３及び弾性押圧体Ｅ１５による磁気センサ素子１５の
押圧位置を、磁気センサ素子１５の電極パターン１５５
を設けた部分の略裏面の部分とし、それに伴ってピンゲ
ートｐ１の位置を移動した。このように構成すれば、弾
性押圧体Ｅ１５は主として電極パターン１５５の部分を
金属板２０方向に向けて押圧するので、金属板２０を電
極パターン１５５に更な確実に当接させておくことがで
き、金属板２０と電極パターン１５５間のモールド樹脂
による固定はさらに確実になる。もちろん同時に磁気抵
抗パターン１５３形成面も第２金型Ｅ２の面に押圧され
て確実に当接する。That is, in the case of this embodiment, the pressing body supporting portion E
13 and the pressing position of the magnetic sensor element 15 by the elastic pressing body E15 is determined by the electrode pattern 155 of the magnetic sensor element 15.
And the position of the pin gate p1 was moved accordingly. With this configuration, the elastic pressing body E15 mainly presses the electrode pattern 155 toward the metal plate 20. Therefore, the metal plate 20 can be more reliably brought into contact with the electrode pattern 155. In addition, the fixing between the metal plate 20 and the electrode pattern 155 by the mold resin is further ensured. Of course, at the same time, the surface on which the magnetoresistive pattern 153 is formed is also pressed against the surface of the second mold E2 and reliably comes into contact.
【００２６】つまり弾性押圧体Ｅ１５の磁気センサ素子
１５を押圧する位置は、必要に応じて種々の変更ができ
る。また弾性押圧体Ｅ１５を２ヵ所以上に設け、その押
圧位置を２ヵ所以上としても良い。また第１金型Ｅ１と
第２金型Ｅ２の両者にそれぞれ弾性押圧体Ｅ１５を設
け、両弾性押圧体Ｅ１５によって磁気センサ素子１５等
の各種部材を挟持するようにしても良い。That is, the position of the elastic pressing member E15 at which the magnetic sensor element 15 is pressed can be variously changed as necessary. Further, the elastic pressing member E15 may be provided at two or more places, and the pressing position may be set to two or more places. Further, an elastic pressing body E15 may be provided on each of the first mold E1 and the second mold E2, and various members such as the magnetic sensor element 15 may be held between the elastic pressing bodies E15.
【００２７】以上本発明の実施形態を説明したが本発明
は特許請求の範囲に記載した技術的思想の範囲内におい
て種々の変更が可能であり、上記各実施形態に限定され
るものではない。例えば金型の形状・構造の種々の変更
や、弾性押圧体や磁気センサ素子１５や金属板２０や成
形品３０の形状・構造・材質の種々の変形が可能である
ことは言うまでもない。また予め金属板を電極パターン
に半田等の接着部材で接着した上で本発明を適用しても
良い。また本発明は磁気センサ素子１５のモールド樹脂
内へのインサート成形に限定されるものではなく、他の
各種電子部品やその他の部材をモールド樹脂内へインサ
ート成形する場合にも適用できる。Although the embodiments of the present invention have been described above, the present invention can be variously modified within the scope of the technical idea described in the claims, and is not limited to the above embodiments. For example, it goes without saying that various changes in the shape and structure of the mold and various deformations in the shape, structure and material of the elastic pressing body, the magnetic sensor element 15, the metal plate 20, and the molded product 30 are possible. In addition, the present invention may be applied after a metal plate is previously bonded to the electrode pattern with an adhesive member such as solder. In addition, the present invention is not limited to the insert molding of the magnetic sensor element 15 into the mold resin, but is also applicable to the case where other various electronic components and other members are insert molded into the mold resin.
【００２８】[0028]
【発明の効果】以上詳細に説明したように本発明によれ
ば、部材を金型内の所定部分に押し付けるように押圧す
る弾性押圧体を設けたので、磁気センサ素子などの部材
を金型内に収納した際に、例え部材が硬くてもろい材質
で構成されていても、部材を容易且つ確実に適正な力で
押圧・挟持することができ、部材を確実に所定の位置に
保持した状態でモールド樹脂を成形できる。As described above in detail, according to the present invention, since the elastic pressing member for pressing the member to a predetermined portion in the mold is provided, the member such as the magnetic sensor element is provided in the mold. When the member is stored in, even if the member is made of a hard or brittle material, the member can be pressed and pinched easily and reliably with an appropriate force, and the member is securely held at a predetermined position. Mold resin can be molded.
【図１】本発明にかかる方法を用いて製造された磁気セ
ンサ１０を示す図であり、図１（ａ）は正面側から見た
斜視図、図１（ｂ）は背面側から見た斜視図である。FIG. 1 is a diagram showing a magnetic sensor 10 manufactured by using a method according to the present invention, wherein FIG. 1A is a perspective view seen from the front side, and FIG. 1B is a perspective view seen from the back side. FIG.
【図２】磁気センサ１０の縦断面図である。FIG. 2 is a longitudinal sectional view of the magnetic sensor 10.
【図３】磁気センサ１０の製造方法を示す図である。FIG. 3 is a diagram illustrating a method of manufacturing the magnetic sensor 10.
【図４】本発明の他の実施形態にかかる磁気センサの製
造方法を示す図である。FIG. 4 is a diagram illustrating a method of manufacturing a magnetic sensor according to another embodiment of the present invention.
【図５】従来の磁気センサ８０を示す図であり、同図
（ａ）は斜視図、同図（ｂ）は同図（ａ）のＡ‐Ａ断面
図である。5A and 5B are views showing a conventional magnetic sensor 80, wherein FIG. 5A is a perspective view, and FIG. 5B is a sectional view taken along line AA of FIG.
【図６】磁気センサ素子８１を示す斜視図である。FIG. 6 is a perspective view showing a magnetic sensor element 81.
【図７】磁気センサ８０の製造方法を示す図である。FIG. 7 is a diagram illustrating a method of manufacturing the magnetic sensor 80.
１０ 磁気センサ １５ 磁気センサ素子（部材） １５１ 基板 １５３ 磁気抵抗パターン １５５ 電極パターン（導体パターン） ２０ 金属板 ３０ 成形品（ケース） ３７ 凹部 Ｅ１ 第１金型 Ｅ１３ 押圧体支持部 Ｅ１５ 弾性押圧体 Ｃ１ キャビティー Ｅ２ 第２金型 Ｅ２３ 位置決め部 Ｃ２ キャビティー DESCRIPTION OF SYMBOLS 10 Magnetic sensor 15 Magnetic sensor element (member) 151 Substrate 153 Magnetic resistance pattern 155 Electrode pattern (conductor pattern) 20 Metal plate 30 Molded product (case) 37 Depression E1 First mold E13 Press body support E15 Elastic press body C1 Cab Tee E2 Second mold E23 Positioning part C2 Cavity
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） // Ｂ２９Ｌ 31:34 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) // B29L 31:34
Claims (3)
キャビティー内に溶融したモールド樹脂を充填して固化
せしめる部材のモールド樹脂内へのインサート成形方法
において、 前記金型内には、前記部材を金型内の所定部分に押し付
けるように押圧する弾性押圧体を設けたことを特徴とす
る部材のモールド樹脂内へのインサート成形方法。1. A method for insert-molding a member into a mold resin, wherein the member is housed in a mold and a cavity provided in the mold is filled with a molten mold resin and solidified. Wherein an elastic pressing member is provided for pressing the member against a predetermined portion in the mold.
又はセラミック基板であることを特徴とする請求項１記
載の部材のモールド樹脂内へのインサート成形方法。2. The method according to claim 1, wherein the member is a glass substrate, a silicon substrate, or a ceramic substrate.
センサ素子の磁気抵抗パターン形成面が金型内の所定の
面に当接するようにその反対側の面を前記弾性押圧体に
よって押圧することを特徴とする請求項１又は２記載の
部材のモールド樹脂内へのインサート成形方法。3. The member is a magnetic sensor element, and a surface on the opposite side of the magnetic sensor element is pressed by the elastic pressing member such that a surface on which a magnetoresistive pattern is formed contacts a predetermined surface in a mold. The method of insert-molding a member according to claim 1 or 2 into a mold resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17678099A JP3563640B2 (en) | 1999-06-23 | 1999-06-23 | Method of insert molding magnetic sensor element into mold resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17678099A JP3563640B2 (en) | 1999-06-23 | 1999-06-23 | Method of insert molding magnetic sensor element into mold resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001001373A true JP2001001373A (en) | 2001-01-09 |
| JP3563640B2 JP3563640B2 (en) | 2004-09-08 |
Family
ID=16019720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17678099A Expired - Fee Related JP3563640B2 (en) | 1999-06-23 | 1999-06-23 | Method of insert molding magnetic sensor element into mold resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3563640B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002361668A (en) * | 2001-06-13 | 2002-12-18 | Yamaha Livingtec Corp | Method for decorating molded product |
| EP1563979A1 (en) * | 2004-02-16 | 2005-08-17 | Prettl, Rolf | Method and device for manufacturing a composite part |
| US7404321B2 (en) | 2005-07-29 | 2008-07-29 | Denso Corporation | Sensor device having a buffer element between the molding and the sensing element |
| JP2009066841A (en) * | 2007-09-12 | 2009-04-02 | Konica Minolta Opto Inc | Manufacturing method of engaging member |
| JP2009158781A (en) * | 2007-12-27 | 2009-07-16 | Teikoku Tsushin Kogyo Co Ltd | How to attach electronic components to circuit boards |
| WO2010092760A1 (en) * | 2009-02-12 | 2010-08-19 | クリナップ株式会社 | Method of producing resin molding, and resin molding |
| JP6086166B1 (en) * | 2016-02-05 | 2017-03-01 | 第一精工株式会社 | Resin sealing mold, resin sealing device and resin sealing method |
-
1999
- 1999-06-23 JP JP17678099A patent/JP3563640B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002361668A (en) * | 2001-06-13 | 2002-12-18 | Yamaha Livingtec Corp | Method for decorating molded product |
| EP1563979A1 (en) * | 2004-02-16 | 2005-08-17 | Prettl, Rolf | Method and device for manufacturing a composite part |
| US7404321B2 (en) | 2005-07-29 | 2008-07-29 | Denso Corporation | Sensor device having a buffer element between the molding and the sensing element |
| JP2009066841A (en) * | 2007-09-12 | 2009-04-02 | Konica Minolta Opto Inc | Manufacturing method of engaging member |
| JP2009158781A (en) * | 2007-12-27 | 2009-07-16 | Teikoku Tsushin Kogyo Co Ltd | How to attach electronic components to circuit boards |
| WO2010092760A1 (en) * | 2009-02-12 | 2010-08-19 | クリナップ株式会社 | Method of producing resin molding, and resin molding |
| KR20110128798A (en) * | 2009-02-12 | 2011-11-30 | 크린업 코포레이션 | Manufacturing method of resin molding, resin molding |
| JP5441936B2 (en) * | 2009-02-12 | 2014-03-12 | クリナップ株式会社 | Manufacturing method of resin molded body, resin molded body |
| KR101671198B1 (en) | 2009-02-12 | 2016-11-01 | 크린업 코포레이션 | Method of producing resin molding, and resin molding |
| JP6086166B1 (en) * | 2016-02-05 | 2017-03-01 | 第一精工株式会社 | Resin sealing mold, resin sealing device and resin sealing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3563640B2 (en) | 2004-09-08 |
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