JP2001099890A - Connector for electrical connection with ic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector which can transmit a high frequency signal. SOLUTION: A signal wire 96 from a cable 44 is spot welded to a signal connector 82. Similarly, a ground wire 98 from the cable 44 is spot welded to a ground connector 84. The joints are surrounded by a mold 90 to constitute a connector 80. The signal wire 96 and the ground wire 98 are extremely short. Outer surface of the ground connector 84 comes into direct contact with the common ground, i.e., a ground plate 54. It means that limitation of test rate due to reflection, caused by the length of a signal transmission line and a ground line, is improved. When the connector 80 is used, mismatch of the cable 44 and the signal wire 96, the ground wire 98 is reduced resulting in high rate signal transmission.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a connector which is an interface of an IC package, and more particularly to a connector capable of transmitting a high frequency signal.

[0002]

2. Description of the Related Art FIG. 1 shows a pin grid array (PGA).
1 shows a semiconductor device 10 packaged in a package. This semiconductor device 10 has many pins 20. At present, many types of packages are used for ICs, and in particular, the PGA package is one of the most popular packages in terms of high pin count and high heat generation. Further, packaging and bonding of the PGA package are easier than other packages, and the IC is often packaged in the PGA package at the stage of the prototype of the IC.

[0003] FIG. 2 is a diagram showing an IGA mounted on a PGA package.
1 shows a conventional device inserter for inserting a semiconductor device 10 to test C. The device insertion device includes a PGA socket 12 and a socket board 14. The PGA socket 12 and the socket board 14 have pin holes (not shown) corresponding to the pins of the semiconductor device 10, respectively. The PGA socket 12 is arranged on the socket board 14 so that the center of the pin hole of the PGA socket 12 and the center of the pin hole of the socket board 14 match. The semiconductor device 10 inserts the pin into the pin hole of the PGA socket 12. The semiconductor device 10 is mounted on a socket board 14 via a PGA socket 12.

[0004]

FIG. 3 is a perspective sectional view showing a back surface of the device insertion device on which the semiconductor device 10 is mounted. A semiconductor device 10 is mounted on a PGA socket 12 arranged on a socket board 14. The PGA socket 12 is made of an insulating material. In FIG. 3, the signal pin 20a and the ground pin 20b of the semiconductor device 10 are
2 is shown inserted. Signal pin 20
a and the ground pin 20b are electrically connected to the signal line and the ground line of the coaxial cable 26 via the contactor 22.

When testing a semiconductor device 10, ie, an IC mounted in a PGA package, a high-speed signal is generally transmitted through a 50 ohm coaxial cable 26 to a signal generator and a signal determiner (both not shown). , IC. At this time, the signal transmission line 28 and the ground line 18 that are not matched with the 50 ohm coaxial cable 26 must be as short as possible. For example, in an IC test, when the test rate is 100 MHz or more, the allowable mismatched line length of the signal transmission line 28 is said to be several millimeters.

However, in the conventional device insertion device, the ground point 24 on the socket board 14 is separated from the contactor 22 of the IC socket 12. Therefore, in the conventional semiconductor test device, the mismatched line length of the signal transmission line 28 and the ground line 18 cannot be shortened. Due to the inconsistency between the coaxial cable 26 and the signal transmission line 28 and / or the ground line 18, an upper limit is imposed on the test rate, making it difficult to shorten the test time per semiconductor device 10.

In the conventional semiconductor test apparatus, the signal transmission line 28 from the coaxial cable 26 and the ground line 18 are soldered to predetermined positions on the back surface of the socket board 14. This soldering operation was very fine and time-consuming, and the burden on the user was very large. Further, the device insertion device once soldered is connected to the semiconductor device 10 having the same package.
, But not for testing other ICs. For this reason, it has been conventionally difficult to reuse a device insertion device that has been soldered once.

Therefore, an object of the present invention is to provide a connector that can solve the above-mentioned problems. This object is achieved by a combination of features described in the independent claims. The dependent claims define further advantageous embodiments of the present invention.

[0009]

That is, the first aspect of the present invention is as follows.
In another aspect, the present invention provides a connector for electrically connecting a semiconductor device having a ground pin and a signal pin to be inserted into a device insertion device having a ground. The connector includes a ground contactor having an opening into which the ground pin of the semiconductor device is inserted, and a signal contactor having an opening into which the signal pin of the semiconductor device is inserted. The outer surface of the ground contactor can directly contact the ground.

[0010] In one embodiment of the first aspect of the present invention, the connector further comprises a mold for fixing the ground contactor and the signal contactor.

In another aspect of the first aspect of the present invention,
The distance between the opening of the ground contactor and the opening of the signal contactor, which is fixed by the mold, may be determined based on the distance between the ground pin and the signal pin of the semiconductor device.

In still another aspect of the first aspect of the present invention, the connector further includes an insulating sheath covering at least a part of the signal contactor and insulating the signal contactor from the ground. be able to.

[0013] In still another aspect of the first aspect of the present invention, at least one of the ground contactor and the signal contactor may have a plurality of connector elements formed of a conductive material.

In still another aspect of the first aspect of the present invention, the ground contactor may have a rim portion projecting outward in the radial direction.

Further, according to a second aspect of the present invention, there is provided a device insertion device into which a semiconductor device having a ground pin and a signal pin, which can solve the above problem, is inserted. This device insertion device has a plurality of through holes through which the ground pin and the signal pin of the semiconductor device are inserted, and an inserter in which the plurality of through holes are insulated from each other, and separates the inserter. A plurality of penetrating through-holes corresponding to the ground pin and the signal pin of the semiconductor device, and the inner surfaces of the plurality of through-holes are electrically interconnected. And a ground plate connected to the ground.

In one embodiment of the second aspect of the present invention, the plurality of through holes of the ground plate may be formed in substantially the same shape.

In another aspect of the second aspect of the present invention,
The through hole of the ground plate may have a region with an increased inner diameter.

In still another aspect of the second aspect of the present invention, the through hole of the ground plate may have a region whose diameter increases toward one surface of the ground plate.

[0019] In still another aspect of the second aspect of the present invention, the through hole of the inserter may have a region having an enlarged inner diameter.

According to a third aspect of the present invention, a semiconductor device having a ground pin and a signal pin is inserted, and a column contactor for ground electrically connected to the ground pin and the signal pin are provided. A device plug-in device into which a connector having a signal columnar contactor electrically connected to a connector is provided. The device insertion device has a plurality of through holes through which the ground pin and the signal pin of the semiconductor device are inserted, the plurality of through holes are insulated from each other, and the ground pin of the semiconductor device is And an inserter into which the signal pin is inserted, and a plurality of through-holes that are arranged on the opposite side of the semiconductor device with the inserter interposed therebetween and correspond to the ground pin and the signal pin of the semiconductor device, Each of the inner surfaces of the plurality of through-holes is electrically connected to each other, and includes a ground plate into which the connector is inserted, and a slide mechanism that can slide the inserter by a predetermined distance with respect to the ground plate. .

In one embodiment of the third aspect of the present invention, the ground contactor and the signal contactor have openings into which the ground pins and the signal pins are inserted, respectively. When the ground pin and the signal pin are inserted into the opening of the signal contactor and the slide mechanism slides the inserter with respect to the ground plate, the ground pin and the signal pin are connected to the opening. And the outer surfaces of the ground contactor and the signal contactor are pressed by the through hole.

Note that the above summary of the present invention does not list all of the necessary features of the present invention, and sub-combinations of these features may also constitute the present invention.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described through embodiments of the present invention. However, the following embodiments do not limit the invention according to the claims, and are described in the embodiments. Not all combinations of features are essential to the solution of the invention.

FIG. 4 shows an example of the configuration of a semiconductor test apparatus 50 having a device insertion device 42 according to one embodiment of the present invention. The semiconductor test device 50 further includes a signal generator 30, a test head 34, and a signal determination device 40. The device insertion device 42 is connected to the test head 34 via a cable 44. The semiconductor device 10 to be tested is inserted into the device insertion device 42. In the semiconductor test apparatus 50 shown in FIG.
Although the device insertion device 42 and the test head 34 are directly connected via a cable 44, they are indirectly connected with a component (not shown) such as a performance board therebetween. Is also good.

The signal generator 30 includes the semiconductor device 10
To generate a test signal 32 necessary for testing. The test signal 32 includes, for example, signals such as an address signal, a data signal, and a control signal. The test signal 32 is sent to a test head 34, and then transmitted via a cable 44 to a device insertion device 42, where the semiconductor device 10
Is input to

The semiconductor device 10 outputs an output signal 36 indicating an output result based on the test signal. Output signal 3
6 is sent from the device insertion device 42 to the test head 34 via the cable 44, and then is sent to the signal determination device 40.
Is input to At the same time, the signal generator 30 outputs an expected value signal 38 that the semiconductor device 10 will output based on the test signal 32 to the signal determination device 40. The signal determination device 40 compares the output signal 36 with the expected value signal 38 to determine the quality of the semiconductor device 10. If the output signal 36 and the expected value signal 38 match, the semiconductor device 10 to be tested is good. If the output signal and the expected value signal 38 are different, the semiconductor device 10 to be tested is good. It is determined that it is defective.

FIG. 5 shows a semiconductor device 10 mounted thereon.
It is a perspective view of the device insertion device 42 by this embodiment. In this embodiment, the semiconductor device 10 is an IC
Is a device packaged in a PGA package. The device insertion device 42 according to the present embodiment includes an inserter 52 and a ground plate 54. The inserter 52 and the ground plate 54 have through holes corresponding to the pin arrangement of the semiconductor device 10 to be tested. The through holes of the inserter 52 are preferably insulated from each other. Further, it is preferable that the inner surfaces of the through holes of the ground plate 54 be electrically connected to each other.

The inserter 52 is preferably made of an insulating material. For example, the inserter 52 may be made of a resin material. The ground plate 54 is preferably made of a conductive material. For example, the ground plate 54 may be made of a tin-plated copper alloy. Semiconductor device 10
Is used to connect the pins of the PGA package to the device insertion device 42.
And inserted on the device insertion device 42. The ground plate 54 has inserter guides 56a and 56b, device fixing levers 58a and 58b, and lever support members 66a and 66a.
6b are provided.

The inserter guides 56a and 56b limit the movement of the inserter 52 so that the inserter 52 does not move except in the direction indicated by arrow A. In this embodiment, inserter guides 56a and 56b are provided along opposing edges of inserter 52, respectively. The operation direction of the inserter 52 on the ground plate 54 is limited to only the direction indicated by the arrow A by the inserter guides 56a and 56b. In addition, a part of the inserter guides 56a and 56b protrudes above the inserter 52 to restrict the movement of the inserter 52 in a direction perpendicular to the ground plate 54. By the inserter guides 56a and 56b, the inserter 52
It is possible to move only in the direction indicated by.

Device fixing levers 58a and 58b
Are supported by lever support members 66a and 66b, respectively. The device fixing levers 58a and 58b are provided rotatably with respect to the ground plate 54, and the rotation angles of the device fixing levers 58a and 58b are limited by lever support members 66a and 66b, respectively. In the configuration shown in FIG. 5, the rotation angle is limited to approximately 90 °.

By rotating the device fixing levers 58a and 58b in the direction indicated by the arrow B by a known technique, the inserter 52 is moved in the direction indicated by the arrow A. This mechanism is used, for example, in a computer that implements a PGA package.
(Zero Insertion Force) mechanism. This operation will be described later with reference to FIG.

One end of the cable 44 is connected to a ground plate 54 via a connector (not shown) according to the present embodiment.
Is connected to the back side. The other end of the cable 44 is connected to a test head, a performance board, or the like. The semiconductor device 10 exchanges signals with the signal generation device 30 and the signal determination device 40 via the cable 44.

FIG. 6A shows the inserter 5 shown in FIG.
FIG. 2 is a perspective view of FIG. As shown, the inserter 52
Has a plurality of penetrating through holes 60 corresponding to a plurality of pins of the semiconductor device 10. The inner diameter of the through hole 60 is
It is formed in a size larger than the diameter of the pin 20 of the semiconductor device. In this embodiment, the semiconductor device 10 is a device packaged in a PGA package, and a plurality of holes of the inserter 52 are formed corresponding to the pin arrangement of the PGA package. An opening 62 is provided at the center of the inserter 52. Inserter 52
Has a projecting portion 64 extending perpendicular to the rear surface on the rear surface, and a recess is formed in the projecting portion 64.

FIG. 6B is a cross-sectional view of the inserter 52 shown in FIG. An opening 62 is shown in the cross-sectional view of FIG. The inner diameter of the cross section of the through hole 60 is determined to be equal to or larger than the diameter of the pin 20 of the semiconductor device 10. Pin 20
Is inserted into the inserter 52 from above, but the upper part of the through hole 60 which is the insertion opening of the pin 20 is formed to have a diameter slightly larger than the diameter of the pin 20 so that the pin 20 can be easily inserted. Is preferred. Furthermore, the through hole 6
The upper part of 0 is so that the pin 20 can be inserted smoothly.
It is preferably formed in a tapered shape so that the diameter of the cross section becomes gradually smaller. The through-hole 60 is, for example, as shown in FIG.
May be provided. Further, as another configuration, the through-hole portion 60 may be provided so as to continuously decrease in diameter from the upper portion to the lower portion.

FIG. 7A is a perspective view of the ground plate 54 shown in FIG. The ground plate 54 has a plurality of penetrating through-holes 70 corresponding to a plurality of pins of the semiconductor device 10, similarly to the inserter 52 shown in FIG. The plurality of through-holes 70 are desirably formed in substantially the same shape so as to correspond to packages on which various ICs are mounted. In this embodiment, the semiconductor device 10 is a device packaged in a PGA package, and a plurality of holes of the ground plate 54 are formed corresponding to the pin arrangement of the PGA package. An opening 7 is provided at the center of the ground plate 54.
2 are provided. The ground plate 54 has an opening 74 into which the protrusion 64 of the inserter 52 is inserted. The inserter 52 is placed on the ground plate 54 by inserting the protrusion 64 into the opening 74.

FIG. 7B is a cross-sectional view of the ground plate 54 shown in FIG. The opening 72 is shown in the cross-sectional view of FIG. The inner diameter of the through hole 70 is determined by the diameter of a contactor that electrically connects the pin 20 of the semiconductor device 10 and the cable 44, which will be described later.
Although the contactor is inserted into the ground plate 54 from below, it is preferable that the through-hole portion 70, which is the insertion port of the contactor, has a lower portion whose diameter continuously increases toward the lower surface so that the contactor can be easily inserted. . Specifically, the diameter of the lower surface of the ground plate 54 is preferably formed to be slightly larger than the diameter of the contactor. Further, the lower portion of the through hole 70 is preferably formed in a tapered shape so that the diameter of the cross section gradually increases toward the lower surface so that the contactor can be smoothly inserted. The through-hole 70 may have a configuration illustrated in FIG. 7B, for example.

FIG. 8 is a perspective view showing a back surface of the ground plate 54 on which the inserter 52 is mounted.
As described with reference to FIG.
Are provided with device fixing levers 58a and 58b and lever support members 66a and 66b. The ends of the two device fixing levers 58a and 58b are connected to rod-shaped members 68 that pass through recesses formed in the protrusions 64 of the inserter 52, respectively. The two device fixing levers 58a and 58b and the rod-shaped member 68 may be separate members or may be formed integrally.
The device fixing levers 58a and 58b, the lever support members 66a and 66b, and the rod-shaped member 68 constitute a slide mechanism for sliding the inserter 52 with respect to the ground plate 54 by a predetermined distance.

FIG. 8 shows the cable 44 connected to the ground plate 54 by inserting the connector 80 into the through hole 70 from below the ground plate 54. The signal contactor 82 of the connector 80 is inserted into the through hole 70 into which the signal pin of the semiconductor device 10 is inserted, and the ground contactor 84 is inserted into the semiconductor device 1.
The zero ground pin is inserted into the through hole 70 into which the ground pin is inserted.

FIG. 9 shows a state where the signal contactor 82 and the ground contactor 84 are connected to the cable 44 inside the connector 80. In this embodiment, the cable 44 is a 50 ohm coaxial cable having a signal line 96 and a ground line 98. The signal line 96 coming out of the cable 44 is connected to the signal contactor 82 by spot welding. Similarly, the ground wire 98 coming out of the cable 44 is connected to the ground contactor 84 by spot welding. These connecting parts are connected to a mold 90
The connector 80 is constituted by surrounding it with.

As shown in FIG. 9, the signal line 96 is provided extremely shorter than the signal transmission line 28 in the conventional configuration shown in FIG. Similarly, the ground line 98 is provided extremely shorter than the ground line 18 in the conventional configuration shown in FIG. Further, the outer surface of the ground contactor 84 directly contacts the ground plate 54 which is a common ground. These facts mean that the limitation of the test rate due to the reflection due to the length of the signal transmission line 28 and the ground line 18 which has been conventionally considered as an issue is improved. Therefore, according to the connector 80 shown in the present embodiment, the inconsistency between the cable 44, the signal line 96 and the ground line 98 is reduced, and high-speed signal transmission becomes possible.

FIG. 10 is a perspective view of the connector 80.
The connector 80 includes a signal contactor 82, a ground contactor 84, and a mold 90. The signal contactor 82 and the ground contactor 84 preferably have a columnar shape in accordance with the shape of the through hole 70 of the ground plate 54. As used herein, the term “columnar” includes shapes such as cylinders, polygonal pillars, and cut-out cylinders and polygonal pillars. Also, the signal contactor 82
In addition, the ground contactor 84 may have, for example, a weight-like shape according to the shape of the through hole 70. The side surface of the signal contactor 82 is preferably protected by an insulating material so as not to be affected by the potential of the ground plate 54. The signal contactor 82 and the ground contactor 84 have openings 86 and 88 for inserting the pins 20 of the semiconductor device 10, respectively. The diameters of the openings 86 and 88 are determined based on the diameter of the pin 20. Further, the interval between the openings 86 and 88 is set to be equal to the pin interval between two adjacent pins of the semiconductor device 10. The mold 90 includes a signal contactor 82.
And the ground contactor 84 is fixed and held. The mold 90 has an index for specifying an orientation.
Further, inside the mold 90, the signal contactor 82 and the ground contactor 84 are connected to the cable 44 (not shown).

A method for electrically connecting the pins 20 of the semiconductor device 10 and the cable 44 will be briefly described. First, the signal contactor 82 and the ground contactor 84 of the connector 80 are inserted into the through hole 70 of the ground plate 54. Then, the semiconductor device 10
The semiconductor device 10 is mounted on the inserter 52 by aligning the pins 20 with the through holes 60 of the inserter 52. At this time, the signal pin of the semiconductor device 10 is inserted into the opening 86, and the semiconductor device 10 is inserted into the opening 88.
Is inserted. Thus, the pins 20 of the semiconductor device 10 and the cables 44 are connected to the connector 8
0 is electrically connected. Therefore, it is not necessary to perform a soldering operation, which has been conventionally difficult, and the wiring can be changed only by replacing the connector 80.

FIG. 11 is a cross-sectional perspective view showing a cross section of the device insertion device 42 on which the semiconductor device 10 is mounted from a rear surface, in a state where the mounting of the semiconductor device 10 on the device insertion device 42 is completed. Is shown. A method of mounting the semiconductor device 10 on the device insertion device 42 will be described with reference to FIG.

First, the through hole 7 of the ground plate 54
0, the connectors (signal contactor 82 and ground contactor 84) are inserted. Specifically, the signal contactor 82 is inserted into the through-hole 70 into which the signal pin of the semiconductor device 10 is to be inserted, and the ground contactor 10 is inserted into the through-hole 70 into which the ground pin of the semiconductor device 10 is to be inserted. Plug in.

Next, the device fixing levers 58a and 58
8b in the direction indicated by arrow B. When the device fixing levers 58a and 58b are raised in the direction shown by the arrow B, the bar-shaped member 68 fitted into the protrusion 64 of the inserter 52 moves in the direction shown by the arrow A. The movement of the rod-shaped member 68 is transmitted to the inserter 52, and the inserter 52 slides in the direction indicated by the arrow A in accordance with the movement of the rod-shaped member 68. The configuration in which the device fixing levers 58a and 58b and the inserter 52 are linked is known as a conventional technique. In this example, the device fixing lever 5
By rotating 8a and 58b about 90 ° in the direction shown by arrow B, inserter 52 slides about 0.5 mm in the direction shown by arrow A, and the center position of through hole 60 of inserter 52 and ground plate 54 Through hole part 7
0 coincides with the center position.

Then, the pin 20 of the semiconductor device 10 is
Is inserted into the through hole 60 of the inserter 52. Since the through hole 60 and the through hole 70 are connected and the connector is inserted into the through hole 70, the semiconductor device 10
Are inserted into the openings 86 and 88 of the connector 80. Specifically, the signal pin of the semiconductor device 10 is inserted into the opening 86 of the signal contactor 82, and the ground pin of the semiconductor device 10 is inserted into the opening 88 of the ground contactor 84.

Then, the device fixing levers 58a and 58b are rotated in the direction opposite to the direction shown by the arrow B to return to the original position. The inserter 52 slides about 0.5 mm in a direction opposite to the direction indicated by the arrow A. The inserter 52 slides about 0.5 mm from the state where the center positions of the through-holes 60 and 70 are exactly aligned, so that the pins 20 of the semiconductor device 10 are moved to the openings of the through-hole 60 and / or the connector 80. Pressed by 86 and 88, the semiconductor device 10 is fixed to the device insertion device 42 and / or the connector 80. Pin 2
The connector 80 is pressed against the through-hole 70 by pressing the “0” into the openings 86 and 88 of the connector 80. Therefore, the connector 80 is fixed to the through hole 70.

By taking the above procedure, the semiconductor device 10 can be mounted on the device insertion device 42.

FIG. 12 shows that the signal pin 20a and the ground pin 20b of the semiconductor device 10 are connected to the signal contactor 82.
And a state inserted into each of the ground contactor 84. Although not shown, the cable 44 is connected to the connector 80. FIG. 12 shows that there is a gap between the members so that the relationship between the members can be easily understood. However, actually, the members are almost in close contact with each other. As shown, the signal contactor 82
Is inserted into the through hole 70 of the ground plate 54,
The signal pin 20 a is inserted into the opening 86 of the signal contactor 82 through the through hole 60 of the inserter 52. Similarly, the ground contactor 84 is inserted into the through hole 70 of the ground plate 54, and the ground pin 20 b passes through the through hole 60 of the inserter 52,
It is inserted into the opening 88 of the ground contactor 84. The ground contactor 84 preferably contacts the grounded ground plate 54 electrically. Conversely, it is preferable that the signal contactor 82 be insulated without being in electrical contact with the ground plate 54 that is grounded. The electrical contact between the signal contactor 82 and the ground contactor 84 and the ground plate 54 will be described later with reference to FIG.

FIG. 13 shows that the signal pin 20a and the ground pin 20b of the semiconductor device 10 are connected to the signal contactor 82.
And a state inserted into each of the ground contactor 84. 13 and 12 show the same configuration except that the through hole 60 of the inserter 52 shown in FIG. 13 is different from the through hole 60 shown in FIG. The through-hole portion 60 in this embodiment has, at the lower portion, a region having an enlarged inner diameter. In FIG. 13, the through-hole portion 60 is not only formed in a tapered shape so that the upper portion is widened, but is also formed in a tapered shape so that the lower portion is also widened. By forming the lower part of the through hole 60 in a tapered shape, a gap is generated between the inner surface of the lower part of the through hole 60 and the pin 20.

Therefore, when the pins 20 are fixed to the device insertion device 42 by moving the device fixing levers 58a and 58b, even if a certain pin 20 is inclined obliquely for some reason, another pin 20 may be used. 20 does not need to be affected. That is, since the inclined pin 20 has a spatial degree of freedom in a gap formed below the through hole 60, the movement of the semiconductor device 10 as a whole is not restricted by the device insertion device 42. Yes.

FIG. 14 is a perspective view showing an example of the connector 80. Signal contactor 82 in this embodiment
Is partially covered by the insulating sheath 100, that is, the side surface. The insulating sheath 100 is made of an insulating material, and is particularly preferably made of a resin material. The insulating sheath 100 prevents the signal contactor 82 from being electrically connected to the ground plate 54. Therefore,
The signal is transmitted via the signal line 96 in the cable 44 between the signal pin 20 a of the semiconductor device 10 and the signal generator 30 and / or the signal determination device 40 without being affected by the ground potential of the ground plate 54. It becomes possible to deliver.

On the other hand, the outer surface of the ground contactor 84 makes physical contact with the ground plate 54 serving as a common ground, and the inner surface of the ground contactor 84 makes physical contact with the ground pin 20b of the semiconductor device 10. The ground level can be stabilized by the contact between the outer surface of the ground contactor 84 and the ground plate 54. Further, the contact between the inner surface of the ground contactor 84 and the ground pin 20b makes it possible to reduce the line impedance as compared with the related art. Therefore, the ground pin 20b and the cable 4
The fourth ground line 98 is stabilized at the ground potential.

The plurality of through holes 7 of the ground plate 54
Zeros are generally formed equally. Therefore, it is preferable that the outer diameter of the ground contactor 84 and the diameter of the insulating sheath 100 covered by the signal contactor 82 are set to be equal according to the shape of the through hole 70. Since the shape of the ground contactor 84 and the shape of the insulating sheath 100 are formed in accordance with the shape of the through hole 70, the connector 80 can be inserted into any of the through holes 70. Therefore, according to the change of the test item, the connector 80 can be easily inserted into another place, and there is an effect that the wiring can be easily changed.

Further, both the signal contactor 82 and the ground contactor 84 have notches 4
It is constituted by one connector element 102. FIG.
In the description, for convenience of explanation, the ground contactor 84
Reference numeral 102 is assigned to only one connector element. The openings 86 and 88 of the connector 80
It is formed around the center of the two connector elements 102. The pins 20 of the semiconductor device 10 are inserted into and electrically connected to openings 86 and 88 of the signal contactor 82 and the ground contactor 84 formed by the connector element 102. In the present embodiment, the connector openings 86 and 88 are divided into four connector elements 102. However, in another embodiment, the connector openings 86 and 88 may be divided into three or more connector elements 102. It does not have to be divided as in the configuration shown. Furthermore, in this embodiment, the shape of each connector element 102 is the same, but in another embodiment, the shape of each connector element 102 does not necessarily have to be the same.

In this embodiment, the semiconductor device 10
Is a PGA package device, and the pins of the PGA package have a circular cross section. Therefore, the connector having the configuration shown in FIG. 14 is very suitable for inserting the pins of the PGA package.

FIG. 15 shows an example of a dual in-line package (DIP). The dual in-line package has a configuration in which pins 104 having a rectangular cross section protrude from two sides.

FIG. 16 shows a connector 80 having a signal contactor 82 and a ground contactor 84 according to another embodiment of the present invention. The signal contactor 82 and the ground contactor 84 are notched in one direction and have a configuration suitable for electrically connecting to the DIP pins 104. Thus, the connector is desirably configured to match the pin shape of the semiconductor device 10 to be tested. However, in any case, as long as the connector and the pin can be electrically connected, it goes without saying that the configuration of the connector may be configured in any manner.

FIG. 17 shows the configuration of another embodiment of the connector 80. In particular, FIG. 17 shows the configuration of another embodiment of the connector 80 shown in FIG. This connector 80
Similarly to the connector 80 shown in FIG. 14, the signal contactor 82, the ground contactor 84, the insulating sheath 10
0 and a mold 90. Signal contactor 82
Is covered by an insulating sheath 100 and is indicated by a dotted line. Since the ground contactor 84 is formed of the plurality of connector elements 102 which are cut, the elasticity is provided in the radial direction. The difference from the configuration shown in FIG. 14 is that the ground contactor 84 has a rim 130. Specifically, the rim 130
Are provided on each of the connector elements 102 so as to protrude in a radially outward direction. The upper portion of the rim 130 is preferably chamfered so as to be easily inserted into the through hole 70. In FIG. 17, the rim portion 130 is provided above the connector element 120, but may be provided in the middle of the connector element 120 in another embodiment. The configuration for inserting the ground contactor 84 shown in FIG. 17 into the ground plate 54 will be described with reference to FIG.

FIG. 18 shows that the ground plate 54
7 shows a state where the ground contactor 84 shown in FIG. 7 is inserted. The upper portion 140 of the through hole 70 of the ground plate 54 is formed in a shape capable of accommodating the rim 130 of the ground contactor 84.
It is preferable to form it into a shape that fits. As a shape, the through-hole portion 70 matches the shape of the rim portion 130,
It has a region with an enlarged inner diameter. In this embodiment, the upper portion 140 is provided with a region having an enlarged inner diameter.

The ground contactor 84 includes a rim 13
0 to the upper part 140 so that the ground plate 5
4 is inserted into the through hole 70 from below. Rim 13
0 until the upper part 140 is reached.
Due to the radial elasticity of 02, the rim portion 130 is pushed radially inward into the inner surface of the through hole 70 of the ground plate 54. The rim portion 130 has the through hole 70
Reaches the upper portion 140 of the plurality of connector elements 102
Releases the pushing force in the radial inward direction, returns to the original position, and fits with the upper part 140. The ground contactor 84 is vertically fixed to the ground plate 54. Therefore, even if the ground pin 20b is inserted into the ground contactor 84 through the through hole 60 of the inserter 52, the ground contactor 84 does not shift downward.

FIG. 19 shows the configuration of another embodiment of the connector 80. The connector 80 has one signal contactor 82 and one ground contactor 84 which are arranged at an interval of one pin. For example, signal pin 2
0a is not adjacent to the ground pin 20b,
It is possible to use the connector 80 shown in FIG. In FIG. 19, the signal contactor 82 and the ground contactor 84 are arranged at an interval of one pin, but in another embodiment, they may be arranged at an interval of two pins or more. .

FIG. 20 shows the configuration of another embodiment of the connector 80. This connector 80 can be used when the signal pin 20a is oblique to the ground pin 20b. When the signal pin 20a and the ground pin 20b are in an oblique positional relationship, by adjusting the distance between the signal contactor 82 and the ground contactor 84,
It is also possible to use the connector 80 shown in FIG. However, in order to prevent a conflict (interference) between the connectors, it is preferable to use the connector 80 formed by the mold 90 shown in FIG.

As shown in FIGS. 19 and 20, by appropriately setting the shape of the mold 90, the connector 80 of this embodiment is also electrically connected to any combination of the signal pins 20a and the ground pins 20b. It becomes possible.

In this embodiment, the connector 80 is inserted into the pin 20 to be tested during the test. At this time, in order to prevent the other pins 20 and the ground plate 54 from being short-circuited, it is preferable to insert an insulating member into the vacant through hole 70 of the ground plate 54 and perform the test.

In this embodiment, the ZIF type device insertion device 42 is described. However, the connector 80 according to this embodiment can also be used for a press-fit type device insertion device.

As is clear from the above description, according to the present invention, a connector suitable for high-speed signal transmission can be provided. As described above, the present invention has been described using the embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments. It is apparent to those skilled in the art that various changes or improvements can be made to the above embodiment.
It is apparent from the description of the appended claims that embodiments with such modifications or improvements are also included in the technical scope of the present invention.

[0068]

According to the present invention, there is an effect that a connector suitable for high-speed signal transmission is provided.

[Brief description of the drawings]

FIG. 1 shows a semiconductor device 10 packaged in a pin grid array (PGA) package.

FIG. 2 shows a conventional device insertion device for inserting a semiconductor device 10;

FIG. 3 is a perspective sectional view perspectively showing the back surface of the device insertion device on which the semiconductor device 10 is mounted.

FIG. 4 shows an example of a configuration of a semiconductor test apparatus 50 including a device insertion device 42 according to one embodiment of the present invention.

FIG. 5 is a perspective view of the device insertion device according to the present embodiment, on which the semiconductor device 10 is mounted.

FIG. 6A is a perspective view of an inserter 52,
(B) is sectional drawing which cut | disconnected the inserter 52 shown in (a) by line CC.

7A is a perspective view of a ground plate 54, and FIG. 7B is a perspective view of the ground plate 54 shown in FIG.
Is a sectional view taken along line DD.

FIG. 8 shows a ground plate 5 on which an inserter 52 is mounted.
FIG. 4 is a perspective view showing a back surface of a fourth perspective view.

9 shows a state in which a signal contactor 82 and a ground contactor 84 are connected to a cable 44 inside a mold 90. FIG.

10 is a perspective view of the connector 80. FIG.

FIG. 11 is a cross-sectional perspective view showing a cross section of the device insertion device 42 on which the semiconductor device 10 is mounted in a perspective view from the back surface.

FIG. 12 shows a state in which a signal pin 20a and a ground pin 20b of the semiconductor device 10 are inserted into a signal contactor 82 and a ground contactor 84, respectively.

FIG. 13 shows a state where the signal pin 20a and the ground pin 20b of the semiconductor device 10 are inserted into the signal contactor 82 and the ground contactor 84, respectively.

FIG. 14 is a perspective view showing an example of a connector 80.

FIG. 15 shows an example of a dual in-line package (DIP).

FIG. 16 illustrates a connector 80 having a signal contactor 82 and a ground contactor 84 according to another embodiment of the present invention.

FIG. 17 shows a configuration of another embodiment of the connector 80.

18 shows a state in which the ground contactor 84 shown in FIG. 17 is inserted into the ground plate 54. FIG.

FIG. 19 shows a configuration of another embodiment of the connector 80.

FIG. 20 shows a configuration of another embodiment of the connector 80.

[Explanation of symbols]

10 semiconductor device, 12 PGA socket, 14 socket board, 18 ground line, 20 pin, 20a signal pin, 20b
..Ground pins, 22 ... Contactors, 24 ...
Ground point, 26: coaxial cable, 28: signal transmission line, 30: signal generator, 32: test signal, 3
4 ... test head, 36 ... output signal, 38 ...
・ Expected value signal, 40 ・ ・ ・ Signal judgment device, 42 ・ ・ ・ Device insertion device, 44 ・ ・ ・ Cable, 50 ・ ・ ・ Semiconductor test device, 52 ・ ・ ・ Inserter, 54 ・ ・ ・ Ground plate, 56a , 56b ... inserter guide,
58a, 58b ... device fixing lever, 60 ...
· Through-hole part, 62 ... opening, 64 ... projection part, 66
a, 66b: Lever support member, 68: Rod member, 70: Through hole, 72: Opening, 74:
Opening, 80 connector, 82 contactor for signal, 84 contactor for ground, 86, 88,.
Opening, 90 mold, 92 index, 96 signal line, 98 ground line, 100 insulating sheath, 102 connector element, 104 pin 130 ... rim part, 140
..Upper part

Claims (13)

[Claims] 1. A connector for electrically connecting a semiconductor device having a ground pin and a signal pin to be inserted into a device insertion device having a ground, wherein the opening of the semiconductor device into which the ground pin is inserted is provided. And a signal contactor having an opening into which the signal pin of the semiconductor device is inserted, wherein an outer surface of the ground contactor can directly contact the ground. connector. 2. The connector according to claim 1, further comprising a mold for fixing the ground contactor and the signal contactor. 3. The distance between the opening of the ground contactor and the opening of the signal contactor, which is fixed by the mold, is determined based on the distance between the ground pin and the signal pin of the semiconductor device. The connector according to claim 2, wherein: 4. The apparatus according to claim 1, further comprising an insulating sheath covering at least a part of the signal contactor and insulating the signal contactor from the ground.
4. The connector according to any one of claims 1 to 3. 5. The connector according to claim 1, wherein at least one of the ground contactor and the signal contactor has a plurality of connector elements formed of a conductive material. 6. The connector according to claim 1, wherein the ground contactor has a rim protruding radially outward. 7. A device insertion device into which a semiconductor device having a ground pin and a signal pin is inserted, comprising a plurality of through holes into which the ground pin and the signal pin of the semiconductor device are inserted, An inserter in which through holes are mutually insulated, and a plurality of through holes that are arranged on the opposite side of the semiconductor device with the inserter interposed therebetween and correspond to the ground pins and the signal pins of the semiconductor device. And a ground plate in which the inner surfaces of the plurality of through holes are electrically connected to each other. 8. The device insertion device according to claim 7, wherein the plurality of through holes of the ground plate are formed in substantially the same shape. 9. The device insertion device according to claim 7, wherein the through hole of the ground plate has a region having an enlarged inner diameter. 10. The device insertion device according to claim 9, wherein the through hole of the ground plate has a region whose diameter increases toward one surface of the ground plate. 11. The device insertion device according to claim 7, wherein the through hole of the inserter has a region whose inner diameter is enlarged. 12. A device into which a semiconductor device having a ground pin and a signal pin is inserted, and a connector having a column contactor for ground electrically connected to the ground pin and a column contactor for signal electrically connected to the signal pin is inserted. The plug-in device, further comprising a plurality of through-holes through which the ground pin and the signal pin of the semiconductor device are inserted, the plurality of through-holes are insulated from each other, and the ground pin of the semiconductor device and the An inserter into which a signal pin is inserted; and an inserter disposed on the opposite side of the semiconductor device with the inserter interposed therebetween, the inserter having a plurality of through holes corresponding to the ground pin and the signal pin of the semiconductor device, The inner surfaces of the through holes are electrically connected to each other, and A ground plate to be written, the device plug device, characterized in that the inserter and a sliding mechanism capable of sliding by a predetermined distance relative to the ground plate. 13. The ground contactor and the signal contactor each have an opening into which the ground pin and the signal pin are inserted, and the ground contactor and the signal contactor have the opening in the opening. When the pin and the signal pin are inserted and the slide mechanism slides the inserter with respect to the ground plate, the ground pin and the signal pin are pressed by the opening, and the ground contactor and the signal 13. The device insertion device according to claim 12, wherein an outer side surface of the contactor is pressed against the through hole.