JP2001096741A - Electrostatic actuator and inkjet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ink jet head capable of easily joining a common electrode and an individual electrode drawn to a position with a height difference to a wiring board and capable of high-density electrode wiring. SOLUTION: The electrostatic inkjet head 1 has a cavity substrate 3 having a common electrode terminal portion 37 formed on a surface thereof.
And the electrode glass substrate 4 having the individual electrode terminal portions 42A formed on the surface 44 at regular intervals.
Are connected to the common electrode connecting electrode 40 formed on the same surface as the individual electrode terminal portion 42A via the conductive paste 40 filled in the through hole 38 formed in the substrate 3. The individual electrode terminal portion 42A and the electrode 40 are connected to a wiring joint portion 67 in which a groove 68 for storing an adhesive is formed.
a and 66a are overlapped and joined via the conductive adhesive 5. The wiring connection to the common electrode and the individual electrodes can be easily formed using the wiring board 6 capable of high-density wiring.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrostatic actuator having an electrode wiring connection structure advantageous for high density.
Further, the present invention relates to a device to which an electrostatic actuator such as an ink jet head is applied.

[0002]

2. Description of the Related Art An electrostatic actuator, for example, an ink jet head to which an electrostatic actuator is applied, has a plurality of ink nozzles, an ink pressure chamber communicating with each ink nozzle, and a diaphragm formed at the bottom of each ink pressure chamber. It has. Also, individual electrodes formed on the surface of the electrode substrate face each other at regular intervals. The substrate (cavity substrate) on which the diaphragm is formed is a conductive substrate such as silicon and functions as a common electrode. Therefore, by applying a voltage between the common electrode and each individual electrode,
When an electrostatic force is generated between these, the vibration plate vibrates in the out-of-plane direction, so that ink droplets can be ejected from the ink nozzles.

Here, it is necessary to connect a power supply wiring to the common electrode and the individual electrodes. As a wiring method for this purpose, for example, as disclosed in Japanese Patent Application Laid-Open No. Hei 6-47915, an electrode terminal of an ink jet head is connected to a flexible wiring board (FP) by wire bonding.
A connection to C) is known. In addition, Japanese Unexamined Patent Publication No.
Japanese Patent Application Publication No. 218918 discloses a method of connecting an electrode terminal of an ink jet head to an external electrode substrate using a conductive paste. Japanese Patent Application Laid-Open No. 9-164671 discloses a method of connecting an electrode terminal of an ink jet head to a rigid body. There is disclosed a method for connecting to an external electrode substrate having a configuration in which a wiring pattern is formed on a substrate surface using a conductive adhesive.

[0004]

However, such a conventional electrode wiring connection method has the following problems. First, when increasing the density of an inkjet head to which an electrostatic actuator is applied, it is necessary to increase the wiring density of each individual electrode. However, in the conventional wiring connection method,
For example, in wire bonding, it is difficult to increase the wiring density, for example, the bonding pad width cannot be reduced below a certain value. In general, since there is a height difference between the positions where the individual electrodes are drawn and the positions where the common electrodes are drawn, wiring connection with these electrodes is performed using an electrode substrate having a wiring pattern formed on the surface of a rigid substrate. It is difficult.

An object of the present invention is to propose an electrostatic actuator and an ink jet head which can solve such a conventional problem.

[0006]

In order to solve the above-mentioned problems, the present invention provides a first substrate on which a first electrode is formed, and a second substrate, which is disposed opposite to the first electrode. A second substrate having electrodes formed thereon, and an electrostatic actuator configured to relatively displace the substrate by an electrostatic force generated by applying a voltage between these electrodes, The first electrode formed on the first electrode
Electrode terminal, a second electrode terminal formed on the second electrode, and at least the first electrode terminal for positioning the first and second electrode terminals on the same plane. And a wiring board provided with a bonding portion electrically connected to the connection electrode lead portion and the second electrode terminal portion so as to be superimposed on the connection electrode lead portion and the second electrode terminal portion. It is characterized by:

[0007] In the electrostatic actuator of the present invention thus configured, the first and second electrode terminal portions are drawn out on the same plane, and these portions are superimposed on the bonding portion formed on the wiring board. I try to connect. Therefore, since the electrode terminals arranged on the same plane may be simply connected to the joints arranged on the same plane by overlapping, the wiring connection can be easily performed.

In addition to the above configuration, the wiring board may be made of a material having the same or smaller thermal expansion coefficient as the board on which the connection electrode lead-out portion and the second electrode terminal portion are formed. It is also effective to provide a lead wiring pattern formed on the surface of the substrate body via an insulating layer, and the joint formed on the wiring pattern.

With the above configuration, the coefficient of linear expansion on the wiring board side is the same as or smaller than the coefficient of linear expansion of the substrate material on which the electrode terminals on the electrostatic actuator side are formed. Therefore, when both are overlapped and heated and pressed, a change in the relative position of both terminal portions can be suppressed.

Further, the connection electrode lead-out portion and the second electrode terminal portion formed on the first electrode terminal portion and the connection portion of the wiring board are overlapped with conductive particles interposed therebetween, so that electric Effective connection is also effective.

[0011] With the above configuration, it is possible to ensure conduction at a portion where the conductive particles are opposed.

Here, in the present invention, the first electrode terminal portion is formed on a surface of the first substrate opposite to a side facing the second substrate, and the second electrode terminal portion is formed on the second substrate. The electrode terminal portion may be formed on a surface of the second substrate facing the first substrate. In this case, the connection electrode lead-out portion is filled in a connection electrode formed on the opposite surface of the second substrate and a through hole formed in the first substrate, and the first electrode is connected to the first electrode. A configuration including an electrode terminal portion and a conductive paste connecting the connection electrode can be adopted.

Further, the first electrode terminal portion is connected to the first electrode terminal portion.
Forming on the surface of the substrate facing the second substrate, and forming the second electrode terminal portion on the surface of the second substrate facing the first substrate. Can be. In this case, the connection electrode lead-out portion is formed between at least a part of the first electrode terminal portion and the anodic bonding portion of the first and second substrate plates, A connection electrode formed on the opposing surface of the substrate and connected to the anodic bonding portion may be provided.

Further, the first electrode terminal portion is formed on the surface of the first substrate opposite to the side facing the second substrate, and the second electrode terminal portion is formed on the first substrate. When formed on the surface of the second substrate facing the first substrate, the connection electrode lead-out portion may include:
A conductive paste disposed between the connection electrode formed on the facing surface of the second substrate and the first electrode terminal portion and the connection electrode via a side surface of the first substrate; Can be provided.

Further, it is effective that the wiring substrate has a groove formed at a position adjacent to the bonding portion on the surface of the substrate main body.

According to the above configuration, since the groove for storing the adhesive for connecting the two electrodes is formed, the excess adhesive can be accommodated in the groove, and the conductive particles can be reliably inserted between the two electrode terminals. It becomes possible to secure continuity by sandwiching. Therefore, it is possible to perform electrode wiring connection at high density. Next, it is desirable that the substrate on which the connection electrode lead-out portion and the second electrode terminal portion are formed and the substrate body of the wiring substrate be made of the same material.

On the other hand, the present invention relates to an ink-jet head. The ink-jet head has an ink pressure chamber which communicates with the ink nozzle and has a bottom surface which is a vibrating plate which can be displaced in an out-of-plane direction. A cavity substrate, and an electrode substrate disposed at a predetermined distance from the vibration plate, and the vibration plate is vibrated by electrostatic force generated between the cavity substrate and the electrode substrate. Is configured to be able to eject ink droplets from the ink jet head.

In this case, the cavity substrate is the first substrate.
The cavity substrate is a common electrode that functions as the first electrode, and the electrode substrate is the second electrode.
And an individual electrode functioning as the second electrode is formed on a surface of the second substrate facing the bottom surface of the ink pressure chamber.

According to the electrostatic ink jet head having this configuration, it is easy to connect the common electrode and the individual electrodes to a common wiring board having a wiring pattern formed on a rigid substrate. Further, wiring connection can be performed at high density, which is extremely advantageous for increasing the number of nozzles of the inkjet head at high density.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an ink jet head to which the present invention is applied will be described below with reference to the drawings.

(Overall Configuration) FIG. 1 is a perspective view showing the overall configuration of the ink jet head of this embodiment, and FIG. 2 is a schematic sectional view of a portion cut along the line II-II. As shown in these figures, the ink jet head 1 of this example is constituted by bonding a nozzle substrate 2 made of a silicon single crystal substrate, a cavity substrate 3 also made of a silicon single crystal substrate, and an electrode glass substrate 4. Have been. A plurality of ink pressure chambers 31 and a common ink chamber 32 for supplying ink to each ink pressure chamber 31 are formed in the cavity substrate 3. A vibrating plate 33 which is elastically displaceable in an out-of-plane direction is formed on the bottom surface of each ink pressure chamber 31.

On the side of the nozzle substrate 2, a back surface 21 joined to the cavity substrate 3 is provided with each ink pressure chamber 3.
A plurality of ink nozzles 22 communicating with each other and an ink supply port 23 communicating each ink pressure chamber 31 with a common ink chamber 32 are formed. Further, a concave portion 25 is formed in a portion corresponding to the common ink chamber 32 on the surface 24 of the nozzle substrate 2. These recesses 25 have a truncated quadrangular pyramid shape with a predetermined depth spread to the surface 24 side, and the bottom surface portion of the diaphragm 2 is elastically displaceable in an out-of-plane direction.
6.

In the electrode glass substrate 4 bonded to the back surface 3a of the cavity substrate 3 by anodic bonding or adhesive bonding, a concave portion 41 is formed at a portion facing each vibration plate 33, and a bottom surface of each concave portion 41 is formed. Is formed with an individual electrode 42 made of ITO facing the vibration plate 33.

The concave portions 25A and 25B located at both ends of the cavity substrate 3 have an ink intake structure in which a large number of filter holes (not shown) having a smaller diameter than the ink nozzles 22 are formed at a constant density on the bottom surface. It is a mouth.

These ink inlets (recesses) 25
The connection portions 30 of the ink supply pipes 29 are connected to A and 25B, respectively (see FIG. 2). Ink supplied from an ink supply source (not shown) disposed outside is supplied to the common ink chamber 32 via the ink intake ports 25A and 25B.

The vibration plate 33 that defines the bottom surface of the ink pressure chamber 31 formed in the cavity substrate 3 functions as a common electrode. When a driving voltage is applied between the cavity substrate 3 and each individual electrode 42 by the driving voltage applying means 50, the vibration plate 33 facing the individual electrode 42 to which the voltage is applied is moved by the electrostatic force to the individual electrode 42. The ink is vibrated by being sucked, and the volume of the ink pressure chamber 31 changes accordingly, and ink is transferred from the common ink chamber 32 to the ink supply port 2.
3 and flows into the ink pressure chamber 31. Ink pressure chamber 3
When the voltage is released when the pressure in 1 becomes maximum, the diaphragm 33 is restored by the restoring force, and the ink droplets are ejected from the ink nozzle 21.

At the same time as ink droplets are ejected from the ink nozzle 21, the ink also flows out to the common ink chamber 32 through the ink supply port 23. At this time, the pressure generated in the common ink chamber 32 is absorbed by the elastic displacement of the diaphragm 26.

Here, power is supplied to the common electrode and the individual electrode by using the wiring board 6 and the wiring board 6 joined thereto via an anisotropic conductive adhesive 5 as described later.
Via the flexible wiring board 7 joined to the substrate.

(Electrode Wiring Connection Part) Next, the wiring connection part for the common electrode and the individual electrode of the ink jet head 1 of this embodiment will be described in detail. FIG. 3 is a partial cross-sectional view taken along line III-III in FIG. 1 to show a wiring connection state between the common electrode and the individual electrode and the wiring board 6.

Referring to FIGS. 1 to 3, the electrode glass substrate 4 has a protruding portion 43 protruding laterally from the end face 35 of the cavity substrate 3.
The exposed surface 44 of the concave portion 4 in which the individual electrode 42 is formed
On the exposed surface 44, individual electrode terminal portions 42A having a constant width and made of ITO drawn from each individual electrode 42 are formed at regular intervals on the exposed surface 44.

The cavity substrate 3 whose surface is covered with the insulating layer 30 has a protruding portion 34 protruding laterally from the end face 27 of the nozzle substrate 2, and a common electrode terminal portion 37 is provided on an exposed surface 36 of the protruding portion 34. Are formed. The common electrode terminal portion 37 is formed by attaching a metal such as platinum by sputtering. At the center position of the common electrode terminal portion 37, a through hole 38 formed in the cavity substrate projecting portion 34 is located. A common electrode connecting electrode 40 made of ITO is provided on the electrode glass substrate surface 44 facing the back surface 39 of the protruding portion 34 so as to face the through hole 38.
Are formed. Further, the common electrode terminal portion 37 formed on the cavity substrate surface 36 and the electrode glass substrate surface 44
Between the common electrode connecting electrodes 40 formed in
Are electrically connected by the conductive paste 40A filled into the conductive paste.

As the conductive paste 40A, for example,
Use silver paste or copper paste. These metal pastes have relatively low electrical conductivity and are stable against corrosion such as oxidation and migration. If these metal pastes are used, conductivity can be easily secured, and conduction reliability due to corrosion or the like can be secured.

As described above, in the common electrode terminal portion 37, the individual electrode terminal portion 42A extending from the individual electrode 42 is formed by the connection electrode lead portion composed of the conductive paste 40A and the connection electrode 40. It is drawn out onto the substrate surface 44. In other words, the common electrode connection electrode 40 and the individual electrode terminal portion 42A are located on the same plane. Therefore, the bonding state between the electrode 40 and the terminal portion 42A can be easily formed using the wiring substrate 6 in which the bonding portion to the electrode 40 and the terminal portion 42A is patterned on the same plane.

FIG. 4 is a perspective view when the wiring substrate 6 is viewed from the side where the wiring pattern is formed, and FIG. 5 is a partial cross-sectional view showing a cross-sectional shape of a connection end of the wiring substrate 6 to the ink jet head. As shown in these figures, the wiring substrate 6 includes a substrate body 61 made of rectangular silicon or the like, an IC chip 63 for driving an inkjet head mounted on a surface 62 of the substrate body 61 covered with an insulating film 61a. have. A fine metal wiring pattern 65 is formed on the surface 62 so as to connect between one end 64 of the substrate main body 61 and the IC chip 63, and one metal wiring 66 constituting the metal wiring pattern 65 is common. It is for electrode connection, and its end is a common electrode joint 66a. The remaining wiring groups 67 are for connecting individual electrodes, and their ends are used as individual electrode joints 67a.

The common electrode joint 66a is connected to the electrode glass substrate 2
The individual electrode joints 67a are also arranged at intervals corresponding to the distal end joints of the individual electrode terminal portions 42A. Have been.

Here, between the common electrode joint 66a and the individual electrode joint 67a and on both sides, a groove 68 for storing an adhesive having a constant width and a predetermined depth is formed. When the conductive adhesive 5 containing conductive particles is applied to the end portion 64 of this configuration, and the common electrode connecting electrode 40 and the individual electrode terminal portion 42A on the ink jet head are overlaid and heated and pressed. In addition, since these grooves 68 serve as pools for the excess adhesive 5, the excess adhesive protrudes out of portions other than the joining portions, and the thickness of the adhesive is reduced between the overlapping portions at the same time. , The conductive particles ensure the electrical connection between the terminals. Further, the wiring substrate 6 and the electrode glass substrate 4 are firmly fixed by the anchor effect by the adhesive 5 which flows into these grooves and is hardened. Therefore, in the connection between the wiring substrate 6 and the electrode glass substrate 4, it is possible to secure sufficient strength due to vibration and external force.

Next, an external connection wiring pattern 70 is formed between the opposite end 69 of the substrate body 61 and the IC chip 63 so as to connect them, and this wiring pattern 70 is anisotropic. The conductive adhesive 5 is joined to the wiring pattern of the flexible wiring board 7. Here, the connection between the wiring board main body 61 and the flexible wiring board 7 and the connection between the wiring board main body 61 and the electrode glass substrate 4 are connected by the same anisotropic conductive adhesive 5. When it is necessary to make the heating temperatures different for these connections, an anisotropic conductive adhesive having a different curing temperature or softening temperature may be used. In this case, an adhesive having a higher softening temperature is used for connection with the flexible wiring board 7 which is completed first.

In order to form a groove 68 having a rectangular cross section as shown in FIG. 5A, the substrate main body 61 is formed from single crystal silicon, and its surface 62 is tilted so as to have a (110) crystal plane. I just need. In this way, the surface becomes
Since it has a large crystal orientation dependence in the vertical direction (substrate thickness direction) with respect to an etching solution such as an aqueous solution of KOH or an aqueous solution of ethylenediamine, a groove portion with very few undercuts is formed without being affected by the distance between adjacent wiring joints. it can.

Here, the depth of the groove 68 is determined by the volume of the groove 68 and the surface 44 of the electrode glass substrate 4 of the adhesive contained in the conductive adhesive 5 applied or temporarily attached. It is preferable that the volume is set to be equal to or larger than the volume because the excess adhesive can be reliably captured.

The sectional shape of the groove 38 may be V-shaped as shown in FIG. In this case, a substrate main body 61A is formed from single crystal silicon, and its surface 62A is formed.
A is a (100) crystal plane. When this surface is anisotropically etched using an etching solution such as a KOH aqueous solution or an ethylenediamine aqueous solution, a V-shaped groove 68A having a (100) plane of 54.74 degrees can be formed.

The wiring board main body 61 was formed of single crystal silicon. In addition, the same material as the borosilicate glass as the material of the electrode glass substrate 4 may be used as the material of the substrate main body 61. In this case, since the material of the wiring board main body 61 and the material of the electrode glass substrate 4 are the same, it is possible to equalize the elongation and the shrinkage due to heat when heating and bonding with the anisotropic conductive adhesive 5. The displacement due to the expansion and contraction between the fine wiring connection terminals and the connection failure due to the displacement are eliminated. Also, since there is almost no thermal stress caused by a temperature change after connection, it is possible to ensure the reliability of the connection against heat shock. By using the same material for the wiring board main body 61 and the electrode glass substrate 4, there is an effect that the reliability of the electrical and mechanical connection of the connection portion can be further improved. (Another Example of Common Electrode Connecting Electrode Lead Portion) In FIG. 6, the common electrode terminal portion 37 is replaced with the individual electrode terminal portion 42.
Another example of a wiring pattern for drawing out so as to be on the same plane as A is shown. In this figure, parts corresponding to the respective parts shown in FIG. 3 are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, the projecting portion 3 of the cavity substrate 3
The common electrode terminal 37 is formed on the exposed surface 36 from which the insulating layer has been removed on a part of the surface of the surface 4, and the conductive paste 40 B is passed through the side surface 34 a of the protruding portion 34 via the insulating layer 30. In addition, the cavity substrate 3 as a common electrode is electrically connected to the common electrode connection electrode 40 formed on the surface 44 of the electrode glass substrate 4.

Next, FIG. 7 shows still another example of a wiring pattern for leading a common electrode. Also in this figure, parts corresponding to the respective parts shown in FIG. 3 are denoted by the same reference numerals, and description thereof will be omitted.

In the case of this example, the common electrode terminal 37
It is provided on the anodic bonding surface between the cavity substrate 3 and the electrode glass substrate 4 and serves as an anodic bonding portion 37A. The anodic bonding portion 37A forms the insulating layer 3 on the surface of the cavity substrate 3 before the anodic bonding between the cavity substrate 3 and the electrode glass substrate 4.
0 is removed, and this anodic bonding portion 37A is
The electrode glass substrate 4 and the cavity substrate 3 are connected to the common electrode connecting electrode 40 formed on the surface 44 of the electrode glass substrate 4 at the same time as the anodic bonding. Here, the common electrode connection electrode 40 or the insulating layer 30 is formed by anodic bonding.
The thickness of the common electrode connection electrode 40 is set equal to or greater than the thickness of the insulating layer 30 so that the anodic bonding portion 37A is reliably connected by anodic bonding between the electrode glass substrate 4 and the cavity substrate 3. Each thickness is set.

(Other Embodiments) The above description is an example in which the present invention is applied to an ink jet head. However, the present invention relates to a reflection plate driving element of a reflection type projector other than the ink jet head. The present invention can be similarly applied to an electrostatic actuator such as a certain digital mirror device (DMD). Further, the present invention can be similarly applied to an electrostatic sensor such as an electrostatic pressure sensor or a temperature sensor.

[0046]

As described above, in the electrostatic actuator and the electrostatic ink jet head of the present invention, the electrode terminal portions of the first and second electrodes which are the opposite electrodes are drawn out so as to be located on the same plane. These are overlapped and electrically connected to a bonding portion formed on the wiring board, and the wiring board is bonded to a flexible wiring board for external connection or the like. In addition, the wiring board is formed from a material having a thermal expansion coefficient equal to or smaller than that of the board on which the electrode terminal portions are formed, and is bonded to a position adjacent to a wiring joint formed at a minute interval on the wiring board. A groove for storing the agent is formed.

According to the present invention, since the electrode terminal portions of the first and second electrodes, which are generally drawn out at positions having a height difference, are drawn out so as to be located on the same plane, the wirings are arranged on the same plane. An electrode substrate with a wiring pattern formed on the surface of a rigid substrate can be easily formed by simply superposing the wiring substrate on which the joints are formed on the electrode terminals via a conductive adhesive and applying heat and pressure. In addition, the wiring connection can be made more reliably.

Further, the electrode terminal portion does not deviate from the wiring joint portion on the wiring substrate side due to thermal deformation due to heating at the time of wiring connection. In addition, since the groove is formed, the excess adhesive contained in the excess conductive adhesive is stored in the groove, and it is assumed that the electrical connection by the conductive particles between the connection wirings is assured. , The reliability of the connection can be ensured. Therefore, since the electrode terminals can be finely arranged, it is suitable to be used as a wiring connection part of an ink jet head or the like in which multiple nozzles are arranged at high density.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an inkjet head to which the present invention is applied.

FIG. 2 is a cross-sectional view of a portion taken along line II-II in FIG.

FIG. 3 is a partial cross-sectional view of a portion cut along a line III-III in FIG. 1;

FIG. 4 is a perspective view of the wiring board of FIG. 1 as viewed from a wiring pattern forming side.

5A and 5B are partial cross-sectional views each showing a cross-sectional shape of a groove formed in the wiring board of FIG. 4;

6 is a partial cross-sectional view showing another wiring example for drawing the common electrode terminal shown in FIG. 3 on the same plane as the individual electrode terminals.

7 is a partial cross-sectional view showing another wiring example for drawing the common electrode terminal shown in FIG. 3 on the same plane as the individual electrode terminals.

[Explanation of symbols]

 Reference Signs List 1 inkjet head 2 nozzle substrate 3 cavity substrate 4 electrode glass substrate 5 conductive adhesive (anisotropic conductive adhesive) 6 wiring substrate 7 flexible wiring substrate 22 nozzle 34 projecting portion of cavity substrate 36 exposed surface 37, 37A common electrode terminal Part 38 Through-hole 40 Common electrode connection electrode 40A, 40B Conductive paste 42 Individual electrode 42A Electrode terminal part of individual electrode 61 Substrate main body 62 Surface of main substrate body 63 IC chip 64 End part on bonding side to electrode terminal part 65 Wiring pattern 66 Metal wiring for common electrode bonding 66a Wiring joint 67 Metal wiring for individual electrode bonding 67a Wiring joint 68, 68A Groove

Claims (9)

[Claims] A first substrate on which a first electrode is formed; and a second substrate on which a second electrode is formed to face the first electrode. The electrostatic force generated by applying a voltage between the electrodes of
An electrostatic actuator adapted to relatively displace the substrate, wherein: a first electrode terminal formed on the first electrode; a second electrode terminal formed on the second electrode; A connection electrode lead portion formed on at least the first electrode terminal portion so as to position the first and second electrode terminal portions on the same plane; and the connection electrode lead portion and the second electrode terminal. And a wiring board having a bonding portion electrically connected to the portion by overlapping the portion. 2. The circuit board according to claim 1, wherein the wiring board is made of a material having a thermal expansion coefficient equal to or smaller than that of the board on which the connection electrode lead-out section and the second electrode terminal section are formed. An electrostatic actuator, comprising: a lead-out wiring pattern formed on a surface of the substrate body via an insulating layer; and the joint formed on the wiring pattern. 3. The wiring substrate according to claim 1, wherein a connection electrode lead-out portion and the second electrode terminal portion formed on the first electrode terminal portion and a connection portion of the wiring board are formed. An electrostatic actuator characterized by being superposed and electrically connected with conductive particles interposed therebetween. 4. The surface according to claim 1, wherein the first electrode terminal is a surface of the first substrate opposite to a surface of the first substrate facing the second substrate. And the second electrode terminal portion is formed on a facing surface of the second substrate facing the first substrate, and the connection electrode lead portion is provided on the second substrate. A connection electrode formed on the opposed surface; and a conductive paste filled in a through hole formed in the first substrate and connecting the first electrode terminal portion and the connection electrode. An electrostatic actuator characterized in that: 5. The device according to claim 1, wherein the first electrode terminal portion is formed on a surface of the first substrate facing the second substrate, and wherein the first electrode terminal portion is formed on a surface of the first substrate facing the second substrate. 2
Is formed on an opposing surface of the second substrate facing the first substrate, and the connection electrode lead-out portion is provided via at least a part of the first electrode terminal portion. An anodic bonding portion of the first and second substrates formed on the substrate, and a connection electrode formed on the opposing surface of the second substrate and connected to the anodic bonding portion. An electrostatic actuator characterized by the above. 6. The device according to claim 1, wherein the first electrode terminal portion is formed on a surface of the first substrate opposite to a side facing the second substrate. The second electrode terminal portion is formed on a facing surface of the second substrate facing the first substrate, and the connection electrode lead portion is provided on the facing surface of the second substrate. A connection electrode formed on a surface thereof; and a conductive paste disposed between the first electrode terminal portion and the connection electrode via a side surface of the first substrate. Electrostatic actuator. 7. The static circuit according to claim 1, wherein the wiring substrate has a groove formed at a position adjacent to the joining portion on a surface of the substrate main body. Electric actuator. 8. The substrate according to claim 1, wherein the substrate on which the connection electrode lead-out portion and the second electrode terminal portion are formed is made of the same material as the substrate body of the wiring substrate. An electrostatic actuator characterized by being formed from: 9. The cavity according to claim 1, wherein an ink pressure chamber communicating with the ink nozzle and having a bottom surface formed as a vibrating plate displaceable in an out-of-plane direction is formed. A substrate, and an electrode substrate disposed at a predetermined distance from the vibration plate. The vibration plate is vibrated by an electrostatic force generated between the cavity substrate and the electrode substrate, and ink is supplied from the ink nozzle. Droplets can be discharged, the cavity substrate is the first substrate, the cavity substrate is a common electrode functioning as the first electrode, and the electrode substrate is the second substrate This second
An ink jet head, wherein an individual electrode functioning as the second electrode is formed on a surface of the substrate facing the bottom surface of the ink pressure chamber.