JP2001094006A - Semiconductor element mounting substrate and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily produce a semiconductor device of high quality. SOLUTION: In a substrate 28 for packaging semiconductor element constituted by having a resin molded part made of synthetic resin, an electric circuit 13 provided with an inner led 13A and an outer lead 13B and a semiconductor element packaging part 14 formed on the surface of the resin molded part adjacent to the inner lead, the electrical circuit is formed mainly from copper foils 16 and 26 press-welded and molded integrally with the resin molded part and on the resin-molded part, a projection 17 is formed around the semiconductor element packaging part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor element mounting substrate and a semiconductor device, and more particularly to a semiconductor element mounting substrate having a stable quality and a semiconductor device using the same.

[0002]

2. Description of the Related Art As a conventional semiconductor device, for example, an LCC (Leadless Chip) in which ceramic is used as a package material and an electric circuit is formed by printing.
(Carrier) type and flip-chip mounting type in which connection to an electrode of a semiconductor element is made by a bump. However, the former type has a high manufacturing cost due to the expensive ceramic material, and the latter has a number of unsolved problems. ing.

Further, as another conventional semiconductor device, a semiconductor element is mounted on a lead frame formed by punching a metal plate.
A type sealed with a resin is known. The lead frame used in this semiconductor device has a device hole for mounting a semiconductor element in the center, an inner lead for connecting to an electrode of the semiconductor element is formed in the device hole, and a printed circuit board is formed on the outside. It is provided with outer leads for connection to the like, and is widely used because of its excellent characteristics, and is widely used in various applications.

Still another semiconductor device is one in which a wiring pattern of an electric circuit formed on a resin molded product on which a semiconductor element can be mounted is provided by non-punching means such as metal plating, vapor deposition or sputtering. Vapor deposition and sputtering require expensive equipment to provide a vacuum atmosphere, and special surface treatment is required for the resin molded product that forms the wiring pattern, so the formation of wiring patterns based on metal plating is often used Have been.

[0005] The wiring pattern of the electric circuit is formed by first roughening the surface of the resin molded product using a chemical such as chromic sulfuric acid, since the resin molded product is non-conductive. Then, the entire surface is subjected to electroless copper plating, and thereafter, the electroless copper plating layer is formed by performing mask exposure, development, etching, and the like.

[0006]

However, according to the above-described semiconductor device using the lead frame, the lead portion of the lead frame for mounting the semiconductor element bends.
Twisting, warping, and mutual contact are likely to occur. Therefore, in each process of manufacturing, packing, and mounting semiconductor elements, careful attention must be paid to prevent lead deformation. Becomes

In particular, resin sealing performed after wire bonding between a semiconductor element and inner leads is performed by press-fitting a resin into a mold. In addition, a stress effect on a wire bonding portion or the like in which a thin gold wire is connected to the lead portion is unavoidable. Therefore, in performing the resin sealing, in order to protect these portions from the action of the stress, it is severe and severe. Care must be taken.

Further, in terms of manufacturing equipment, in order to maintain high quality punching of a lead frame without burrs, a constant punching clearance must be always secured. However, there is a considerable burden in terms of management of the die for punching.

In a semiconductor device in which a wiring pattern of an electric circuit is formed using metal plating, surface roughening of a resin molded product, application of a plating catalyst, electroless copper plating, etc.
Many complicated steps are required. In addition, in each of these steps, sufficient attention must be paid to the management and disposal of chemicals.

[0010] Further, in wire bonding between an electric circuit formed based on such electroless copper plating and a semiconductor element, as shown in FIG. 18B, the surface roughness of the electroless copper plating layer 100 is reduced. Therefore, it is difficult to remove the stain on the surface of the electroless copper plating layer 100, and there is a possibility that the wire bonding property to the electric circuit may be reduced.

Further, before the electroless copper plating, the surface of the resin molded article 101 is roughened by using a chemical or the like. Copper plating layer 100, that is, electric circuit and resin molded product 1
There is a possibility that the bonding strength (peel strength) with 01 may be insufficient.

As a result of these reductions in wire bonding properties and in the peak strength of the electric circuit, the quality of the semiconductor device may be reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device mounting substrate and a semiconductor device which can manufacture a semiconductor device easily and with high quality.

[0014]

According to a first aspect of the present invention, there is provided a resin molded article made of a synthetic resin, an electric circuit formed on the resin molded article and including an inner lead and an outer lead. In a semiconductor element mounting substrate configured to include a semiconductor element mounting portion formed on the surface of the resin molded product adjacent to the lead, the electric circuit is formed by pressure bonding integrally with the resin molded product. A conductive metal layer is formed as a main part, and a raised part is formed on the resin molded product so as to surround the semiconductor element mounting part.

According to a second aspect of the present invention, in the first aspect of the invention, the resin molded product has a groove formed on a side surface thereof in a thickness direction of the resin molded product. The groove is provided with an outer lead extension connected to the outer lead of the electric circuit.

According to a third aspect of the present invention, in the second aspect of the present invention, the outer lead extension portion has a protrusion corresponding to an electric circuit of an object to be connected at an end opposite to the outer lead side. Characterized by having a terminal-like portion.

According to a fourth aspect of the present invention, there is provided a resin molded product made of a synthetic resin, an electric circuit formed on the resin molded product and including an inner lead and an outer lead. In a semiconductor element mounting substrate configured to include a semiconductor element mounting portion formed on a surface of a resin molded product, the electric circuit mainly includes a conductive metal layer integrally press-molded on the resin molded product. A raised portion is formed on the resin molded product so as to surround the semiconductor element mounting portion, and the outer lead of the electric circuit is disposed on the raised portion.

According to a fifth aspect of the present invention, in the fourth aspect of the invention, the raised portion has a second inclined surface inclined downward in a direction opposite to the first inclined surface inclined downward toward the semiconductor element mounting portion. The surface is formed.

The invention according to claim 6 is the invention according to claims 1 to 5
In the invention described in any one of the above, the semiconductor element mounting portion is formed in a concave shape for receiving the mounted semiconductor element. Claim 7
The invention according to any one of claims 1 to 6, wherein the conductive metal layer is formed by subjecting a back surface of the conductive metal layer to an uneven treatment, and the conductive metal layer is formed of the resin It is characterized in that these resin molded products and the conductive metal layer are integrally pressure-bonded and molded to the molded products.

The invention described in claim 8 is the first to seventh aspects of the present invention.
In the invention described in any one of the above, the resin molded article is made of a thermosetting resin or a thermoplastic resin, and the conductive metal layer is made of a copper foil.

According to a ninth aspect of the present invention, there is provided a resin molded product made of a synthetic resin, an electric circuit formed on the resin molded product and including an inner lead and an outer lead. A semiconductor element mounting portion formed on the surface of the resin molded product; a semiconductor element mounted on the semiconductor element mounting portion and connected to the inner lead; and a sealing formed to seal the periphery of the semiconductor element. In a semiconductor device having a stopper member, the electric circuit is formed mainly of a conductive metal layer integrally formed by compression-bonding on the resin molded product. A raised portion is formed so as to surround the element mounting portion, and the sealing member is formed of a solidified liquid sealing material injected into a space surrounded by the raised portion. It is an.

According to a tenth aspect of the present invention, in the ninth aspect of the invention, the resin molded product is provided on a side portion thereof.
It has a groove formed in the thickness direction of the resin molded product, and the groove is provided with an outer lead extension connected to an outer lead of the electric circuit.

According to an eleventh aspect of the present invention, in the invention of the tenth aspect, the outer lead extension portion has a projection corresponding to an electric circuit of an object to be connected at an end opposite to the outer lead side. Characterized by having a terminal-like portion.

According to a twelfth aspect of the present invention, there is provided a resin molded product made of a synthetic resin, an electric circuit formed on the resin molded product and including an inner lead and an outer lead. A semiconductor element mounting portion formed on the surface of the resin molded product; a semiconductor element mounted on the semiconductor element mounting portion and connected to the inner lead; and a sealing formed to seal the periphery of the semiconductor element. In a semiconductor device having a stopper member, the electric circuit is formed mainly of a conductive metal layer integrally formed by compression-bonding on the resin molded product. A raised portion is formed so as to surround the periphery of the element mounting portion, an outer lead of the electric circuit is arranged on the raised portion, and the sealing member is provided in a space surrounded by the raised portion. Provided by the solid of off to the liquid sealing material, it is characterized in that it has been configured for connection with the outer leads of the serial ridges to the electric circuit of the connection object.

According to a thirteenth aspect of the present invention, in the twelfth aspect of the present invention, the raised portion has a second inclined surface inclined downward in a direction opposite to the first inclined surface inclined downward toward the semiconductor element mounting portion. The surface is formed.

According to a fourteenth aspect of the present invention, in any one of the ninth to thirteenth aspects, the semiconductor element mounting portion is formed in a concave shape for receiving the mounted semiconductor element. It is a feature.

According to a fifteenth aspect of the present invention, in the invention according to any one of the ninth to fourteenth aspects, the conductive metal layer is formed by subjecting a back surface of the conductive metal layer to an unevenness treatment. The uneven surface is bonded to the resin molded product, and the resin molded product and the conductive metal layer are integrally formed by pressure bonding.

According to a sixteenth aspect of the present invention, in the invention according to any one of the ninth to fifteenth aspects, the resin molded article is made of a thermosetting resin or a thermoplastic resin, and the conductive metal layer is made of copper. It is characterized by being composed of foil.

The first, fourth, eighth, ninth, twelfth or sixteenth invention has the following effects.

Since the electric circuit formed on the resin molded product constituting the substrate for mounting the semiconductor element is composed mainly of the conductive metal layer formed integrally with the resin molded product by pressure bonding, the surface of the electric circuit is formed. Is excellent in smoothness and flatness, and is easy to remove dirt. Therefore, wire bonding can be favorably performed between the electric circuit and the semiconductor element mounted on the semiconductor element mounting portion. Therefore, it is possible to improve the quality of a semiconductor device configured using the semiconductor element mounting substrate.

When the electric circuit is formed by using metal plating, since the resin molded product is non-conductive,
After roughening the surface of the resin molded article, a plating catalyst must be applied, and then electroless metal plating must be performed, which requires many complicated steps. On the other hand, in the case of the present invention, the conductive metal layer is integrally pressure-bonded to the resin molded product,
Since the electric circuit is formed with the conductive metal layer as a main part, the number of steps can be reduced as compared with the case of metal plating, and the electric circuit can be formed easily.

Further, since the raised portion is formed so as to surround the semiconductor element mounting portion, when the semiconductor element mounted on the semiconductor element mounting portion is sealed with a resin, the semiconductor element is simply surrounded by the raised portion. What is necessary is just to inject a liquid sealing material into the space, whereby the semiconductor element is buried in the sealing material in a natural state and sealed. For this reason, undesired stress does not act as when using a die for lead frame punching molding, and therefore, the inner lead weak to the bending force formed by the punching molding and the bond lead bonded to the inner lead. There is no fear that the wire portion or the like receives an undesired force. Therefore, a semiconductor element mounting substrate and a semiconductor device having stable quality can be provided.

Further, when the electric circuit is composed of the conductive metal layer as a main part, the lead is not bent, twisted, warped, or the like at the time of manufacturing or packing the lead frame, and the lead frame punching and forming metal is formed. Since strict equipment management such as a mold is not required, a semiconductor element mounting substrate and a semiconductor device having more stable quality can be provided.

The second or tenth aspect of the present invention has the following effects.

Since a groove extending in the thickness direction of the resin molded product is formed on the side surface of the resin molded product, and the outer lead extension is formed in this groove, connection of an electric circuit to a connection target such as a printed circuit board is performed. Accuracy can be improved. That is, the wiring of the outer lead is fine,
When soldering this to a connection object such as a printed circuit board, it is necessary to take care not to cause a short circuit between the leads, but the presence of the groove completely separates the individual outer lead extensions independently. Therefore, the accuracy of the soldering operation can be improved.

The invention according to claim 3 or 11 has the following operation.

According to the electric circuit of the object to be connected, a protruding terminal portion is formed at the end of the outer lead extension opposite to the outer lead side. It can be connected to the terminal with high accuracy, and the connection accuracy of the electric circuit can be increased.

The invention according to claim 4 or 12 has the following operation.

Since the outer leads of the electric circuit are arranged at the raised portions of the resin molded product, the semiconductor device formed by the semiconductor element mounting substrate is connected to the outer leads of the raised portions by a face-down mounting method. By connecting to the electric circuit of the object, it can be mounted on the object to be connected. For this reason, the connection portion at the time of mounting the semiconductor device can be easily observed, and replacement of the semiconductor device becomes easy.

Further, the semiconductor device can be mounted on the object to be connected by connecting the outer lead of the raised portion to the electric circuit of the object to be connected. It is not necessary to drill a hole and to apply a thin electroless metal plating process and an electrolytic metal plating process to the through-hole, and the conductive metal can be pressed only on one side of the resin molded product. Exposure for forming the electric circuit described above may be performed only on one side of the resin molded product. From these, the cost of the semiconductor element mounting substrate and the semiconductor device can be reduced.

The invention according to claim 5 or 13 has the following operation.

A plurality of semiconductor element mounting substrates are formed on a resin circuit molded product because a second inclined surface inclined downward in a direction opposite to the first inclined surface inclined downward toward the semiconductor element mounting portion is formed in the raised portion. In the case of collectively manufacturing, by manually folding the boundary line of the second inclined surface arranged adjacent to each other, a plurality of semiconductor element mounting substrates or semiconductor devices can be separated from each other, and mechanical processing such as dicing can be performed. Cutting is not required.

The invention according to claim 6 or 14 has the following operation.

The semiconductor element mounting portion is formed in a concave shape so as to be able to receive the semiconductor element, and the semiconductor element is mounted in the concave portion. The mounting structure of the semiconductor element on the molded product is ensured, and the mounting operation can be stabilized.

The invention according to claim 7 or 15 has the following operation.

The uneven surface of the conductive metal layer was joined to the resin molded product, and the resin molded product and the conductive metal layer were integrally formed by pressure bonding. The anchor effect is exhibited by digging into. In addition, unlike a case of applying metal plating, the surface of a resin molded product is not roughened by a chemical or the like, and the mechanical strength is not reduced. As a result, the bonding strength between the electric circuit formed mainly of the conductive metal layer and the resin molded product, that is, the peel strength is improved, and the semiconductor element mounting substrate composed of the resin molded product and the electric circuit is used. The quality of the configured semiconductor device can be further improved.

[0047]

Embodiments of the present invention will be described below with reference to the drawings.

[A] First Embodiment (FIGS. 1 to 9 and FIG. 18) FIG. 1 is a plan view showing a first embodiment of a semiconductor element mounting substrate according to the present invention. FIG. 2 is a cross-sectional view of the semiconductor element mounting substrate of FIG. 1 along the line II-II.

A semiconductor element mounting substrate 28 for manufacturing the semiconductor device 10 shown in FIG. 5 (G) has a resin molded product 12 and an electric circuit 13 as shown in FIGS. Is done. Actually, the semiconductor element mounting substrate 28 is not manufactured alone, but as shown in FIG. 4D (FIGS. 7 and 8).
As shown in FIG.
Manufactured as 1.

As shown in FIGS. 1 and 2, the resin molded product 12 includes a semiconductor element mounting portion 14, a raised portion 17, and a plurality of grooves 18. Further, the electric circuit 13 includes:
Copper foils 16 and 26 as a conductive metal layer, which are integrally press-bonded to the resin molded product 12, are formed as main parts. The electric circuit 13 includes an inner lead 13A, an outer lead 13B, an outer lead extension 13C, and a protruding terminal 13D.

The semiconductor element mounting portion 14 is provided at a central position of the semiconductor element mounting substrate 28,
(FIG. 5) can be mounted. This semiconductor element mounting portion 14
Is formed on the surface of the resin molded product 12 adjacent to the inner lead 13A of the electric circuit 13. In addition, the raised portion 1
7 surrounds the periphery of the semiconductor element mounting portion 14 in the resin molded product 12, is higher than the height of the semiconductor element mounting portion 14, and is higher than the semiconductor element 19 mounted on the semiconductor element mounting portion 14. It is formed by being raised.

Here, the resin molded article 12 is formed by molding a thermoplastic resin or a thermosetting resin.
As the thermoplastic resin, for example, aromatic polyester resin, aromatic polyamide resin, crystalline polystyrene resin,
Polyphenylene sulfide (PPS), polyether sulfone (PES), polyether imide (PEI), and the like are used. Among them, as the aromatic polyester resin, a trade name “VECTRA” manufactured by Polyplastics Co., Ltd. "Zyder" (trade name, manufactured by Nippon Petrochemical Co., Ltd.), "Sumika Super LCP" (trade name, manufactured by Sumitomo Chemical Co., Ltd.), and "Zenite" (trade name, manufactured by Dupont) are used. As the aromatic polyamide resin, Mitsui Petrochemical Industries Co., Ltd. product name "Alen", Teijin Amoco Engineering Plastics Co., Ltd. product name "Amodel", BASF Engineering Plastics Co., Ltd. product name "Ultramid T" And the like, and as the crystalline polystyrene, trade name “Zarek” manufactured by Idemitsu Petrochemical Co., Ltd. is used.

As the thermosetting resin, for example, epoxy resin, thermosetting polyester resin, phenol resin, melamine resin, diallyl phthalate resin and the like are used. Particularly, an epoxy resin composition is suitable. The resin circuit board 12 is molded by various molding equipment such as an injection molding machine, a transfer molding machine, a compression molding machine, and a casting machine. In particular, a compression molding machine is suitable.

As shown in FIGS. 1 and 2, a plurality of the groove portions 18 are formed on each of the four side surfaces of the raised portion 17 in the resin molded product 12 of the semiconductor element mounting substrate 28.
It is provided to extend in the thickness direction of the semiconductor element mounting substrate 28. These grooves 18 are provided with a plurality of through holes 1 shown in FIG.
As shown in FIG. 5 (F), the semi-inner peripheral surface of the through-hole 15 formed by dicing the resin circuit molded product 11 along the arrangement direction of 5.

As shown in FIG. 8, these through holes 15 are formed in the semiconductor element mounting portion 1 in the resin circuit molded product 11.
4 are pierced in a straight line along the periphery of the pier. As described later, these through holes 15 are provided in the resin molded product 12 in the copper foil 1.
After the pressure-bonding moldings 6 and 26 are integrally formed, the resin moldings 12 and the copper foils 16 and 26 are formed to penetrate. The cross-sectional shape of the through hole 15 is a circle, an ellipse, or a square.

Further, the copper foils 16 and 26 are formed as shown in FIG.
As shown in the figure, the back surface is subjected to the unevenness treatment, and the unevenness-treated surface 2
0 is formed, and when the copper foils 16 and 26 and the resin molded product 12 are integrally pressed and formed, the resin molded product 12 is
And is closely adhered and joined. The surfaces of the copper foils 16 and 26 are formed as a smooth surface and a flat surface.

As shown in FIGS. 1 and 2, the electric circuit 13 includes an inner lead 13A and an outer lead 13A.
B, outer lead extension 13C and protruding terminal 13D
Are sequentially and continuously formed. The inner lead 13A is inside the raised portion 17 on the surface of the resin molded product 12, the outer lead 13B is on the raised portion 17 on the surface of the resin molded product 12, and the outer lead extension 13C is in the groove 18 of the resin molded product 12. , The protruding terminal portion 13D is a resin molded product 1
2 is provided on each of the back surfaces. Inner lead 13
A, outer lead 13B and outer lead extension 1
3C is formed by subjecting the copper foils 16 and 26 integrated on the front and back surfaces of the resin molded product 12 to mask exposure, development, and etching, respectively, as described later in detail. In addition, the outer lead extension 13C is provided with a copper plating layer 24 (see FIG. 4) described later formed inside the through hole 15.
(C)), and the outer lead 13B and the protruding terminal portion 13D are continuous. Therefore, the protruding terminal portion 13D
Is formed at the end of the outer lead extension 13C opposite to the outer lead 13B side. Further, the protruding terminal portion 13D is connected to the printed circuit board 2 as an object to be connected.
9 (FIG. 9) corresponding to the electric circuit of FIG.
As shown in (A), (B), and (C), respectively, it is configured in a circular shape, a rectangular shape, or a trapezoidal shape in a side view.

As shown in FIG. 5 (G), the semiconductor device 10 has a semiconductor element mounting substrate 28 configured as described above.
The semiconductor element 19 is mounted on the semiconductor element mounting portion 14 using an adhesive (die bonding), and the semiconductor element 19 and the inner leads 13A of the plurality of electric circuits 13 are connected using the gold wire 25 ( Wire bonding),
The semiconductor element 19 and the gold wire 25 are sealed by a sealing member 30. The semiconductor element 19 and the gold wire 25 are buried in the sealing member 30 and protected. Further, the raised portion 17 is exposed from the sealing member 30, and the electric circuit 13 on the raised portion 17, that is, the outer lead 13B
Has been exposed.

The adhesive is applied to the semiconductor element mounting portion 1 of the semiconductor element mounting substrate 28 when the semiconductor element 19 is mounted.
Although it may be supplied between the semiconductor element 4 and the semiconductor element 19, it is preferable to provide the adhesive layer on the surface of the semiconductor element mounting portion 14 in advance, and a film-like adhesive layer is more suitable. ing.

The sealing member 30 is formed by injecting a liquid sealant into a space surrounded by the raised portion 17 of the semiconductor element mounting substrate 28 and solidifying the liquid sealant. It is. As the liquid sealant, a liquid sealant having a property of being liquid at the time of injection and being solidified by a curing treatment such as heating is used, and specifically, a heat-curable epoxy resin or a silicone resin is used. A sealing material for flowing a liquid material obtained by dissolving a thermoplastic resin in a solvent into a space surrounded by the protruding portion 17 and heating the resin to dry the thermoplastic resin, thereby sealing the semiconductor element 19. 30 may be configured.

Next, the manufacturing process of the semiconductor device 10 including the resin circuit molded product 11 (semiconductor element mounting substrate 28) will be described with reference to FIGS.

First, as shown in FIGS. 4A and 7, a copper foil 16 is formed on the surface of the resin molded product 12 of the resin circuit molded product 11 having the plurality of semiconductor element mounting portions 14, and a copper foil 26 is formed on the back surface. Are integrally formed by pressure bonding to form a resin composite molded product 21. At this time, the copper foil 16 is integrally formed so as to cover the plurality of semiconductor element mounting portions 14.

As shown in FIG. 6, the integral press-molding of the resin molded product 12 and the copper foils 16 and 26 is performed by first molding an uncured resin molded product 12 in which a plurality of semiconductor element mounting portions 14 are molded in advance. Then, the copper foil 16 preliminarily formed into an uneven shape corresponding to the semiconductor element mounting portion 14 and the copper foil 26 having a flat surface shape are arranged between the upper mold 22 and the lower mold 23. At this time, the uneven surface 20 of the copper foils 16 and 26 faces the resin molded product 12 side. Next, using the upper mold 22 and the lower mold 23, for example, under a heating state of 180 ° C., the resin molded product 1 is heated.
2 and copper foils 16 and 26 for 2 minutes at 100 kgf / cm ²
Acting pressure. In this way, the uncured resin molded product 12 is melted, molded, and cured to obtain the resin molded product 12 shown in FIG.
As shown in (A), the uneven surface 2 of the copper foils 16 and 26
0 is cut into the resin molded product 12 in a molten state, and after the resin molded product 12 is cured, the copper foils 16 and 26 are brought into close contact with the resin molded product 12 and integrally press-molded.

Next, as shown in FIGS. 4B and 8, a plurality of through holes 15 are arranged linearly along the periphery of each semiconductor element mounting portion 14 of the resin composite molded article 21. Set up. Each through hole 15 is formed of a resin molded product 12 and a copper foil 1 integrated on the front and back surfaces of the resin molded product 12, respectively.
6, 26 are formed.

Next, as shown in FIG. 4 (C), the entire surface and the entire back surface of the resin composite molded article 21 are subjected to thin electroless copper plating mainly for the inside of the through-hole 15, and An electroless copper plating layer having a thickness of about 1 μm is formed. Thereafter, electrolytic copper plating is performed on the electroless copper plating layer to form an electrolytic copper plating layer having a thickness of about 10 μm. In this way, a copper plating layer 24 is formed mainly in the through-hole 15 so that the copper foil 16 on the front surface of the resin composite molded article 21 and the copper foil 26 on the rear surface are continuous.

Next, although not shown, the resin composite molded product 2
A positive electrodeposition resist is applied to the entire surface of 1 to form a resist layer, and the resist layer is covered with a masking film and exposed to ultraviolet light for development. By this development, the electric circuit 1
The unnecessary part of the resist layer for the formation of 3 is removed. Next, an etching process is performed to etch away the portions of the copper foils 16 and 26 and the copper plating layer 24 that are not covered with the resist layer, and then remove the remaining resist layer.

Thus, the resin circuit molded product 11 is manufactured as shown in FIG. This resin circuit molded product 11
The electric circuit 13 includes, on the front and back surfaces of the resin molded product 12 and the inside of the through-hole 15, copper foils 16 and 26 as main parts, in the vicinity of each semiconductor element mounting portion 14, on the raised portion 17,
The inside of the plurality of through holes 15 and the peripheral portion of the through hole 15 on the back surface of the resin molded product 12 are formed continuously.

Next, as shown in FIGS. 5E and 9, a semiconductor element 19 is mounted on each semiconductor element mounting portion 14 by die bonding, and thereafter, the semiconductor element 19 and inner leads of the electric circuit 13 are mounted. 13A is electrically connected by wire bonding using a gold wire 25.

Thereafter, as shown in FIG. 5 (F), a liquid sealing agent is injected into a space surrounded by the protruding portion 17 in a portion corresponding to each semiconductor element mounting substrate 28, and the whole is heated to form a liquid sealing material. The sealant is solidified to form the sealing member 30. The semiconductor element 19 and the gold wire 25 are buried and protected by the sealing member 30.

Finally, the resin circuit molded product 11 is diced along the direction in which the plurality of through holes 15 are arranged as shown by the broken lines in FIG. 5 (F), and individual semiconductors are formed as shown in FIG. 5 (G). The device 10 is formed. By the above dicing, a plurality of grooves 18 are formed on the side surfaces of the raised portions 17 in the semiconductor element mounting substrate 28 of each semiconductor device 10, and further, the copper plating layer 24 provided in the through hole 15 is formed by the outer lead extension 13 </ b> C. Becomes

The semiconductor device 1 manufactured as described above
0 is mounted on the printed circuit board 29 as shown in FIG. At this time, the protruding terminal portion 13D of the semiconductor device 10 is electrically connected to the electric circuit of the printed circuit board 29 using the solder 31. The protruding terminal portion 13D is formed corresponding to the electric circuit of the printed circuit board 29. Further, each outer lead extension portion 13C is provided in each groove portion 18 so that the solder flows into another groove portion 18. For example, the connection accuracy between the semiconductor device 10 and the printed circuit board 29 is improved.

Therefore, according to the above embodiment, the following effects (1) to (9) can be obtained.

(1) The electric circuit 13 formed on the resin molded product 12 constituting the semiconductor element mounting board 28 is composed mainly of the copper foils 16 and 26 which are integrally formed on the resin molded product 12 by pressure bonding. Therefore, as shown in FIG. 18A, the surface of the electric circuit 13 has excellent smoothness and flatness,
Since dirt is also easily removed, the electric circuit 13 and the semiconductor element 19 mounted on the semiconductor element mounting portion 14
Wire bonding can be favorably performed using the gold wire 25. Therefore, the quality of the semiconductor device 10 configured using the semiconductor element mounting substrate 28 can be improved.

(2) The uneven surface 20 of the copper foils 16 and 26
Are bonded to the resin molded product 12 and the resin molded product 12 and the copper foils 16 and 26 are integrally formed by pressure bonding to form the resin composite molded product 21. The anchoring effect is exerted by digging into the product 12. Further, unlike the case of applying metal plating, the surface of the resin molded product 12 is not roughened by a chemical or the like, and the mechanical strength is not reduced. As a result, the bond strength between the electric circuit 13 formed mainly of the copper foils 16 and 26 and the resin molded product 12, that is, the peel strength is improved, and the semiconductor element mounting device including the resin molded product 12 and the electric circuit 13 is mounted. Semiconductor device 10 configured using substrate 28
Quality can be further improved.

(3) When the electric circuit 13 is formed using metal plating, since the resin molded product 12 is non-conductive, the surface of the resin molded product 12 is roughened and then a plating catalyst is applied. Then, electroless copper plating must be performed, and many complicated steps are required. In contrast,
In the case of the present embodiment, the copper foils 16 and 26 are integrally press-molded on the resin molded product 12 and the electric circuit 13 is formed with the copper foils 16 and 26 as main parts. The number of processes can be reduced compared to
3 can be easily formed. As a result, the semiconductor device 10 can be easily manufactured.

(4) In the case where an electric circuit is formed by the above-described copper plating, various chemicals are required for surface roughening of a resin molded product, application of a plating catalyst, and electroless copper plating. In the embodiment, when the electroless copper plating and the electrolytic copper plating are mainly performed in the through holes 15, the number of chemicals used is small, and thus the management and disposal of the chemicals are facilitated.

(5) The resin circuit molded article 11 having a plurality of semiconductor element mounting portions 14 on which the semiconductor element 19 can be mounted is obtained by collective molding, and this is diced to obtain the semiconductor element mounting substrate 28 and the semiconductor device 10. Therefore, a plurality of semiconductor devices 10 as individual components can be efficiently manufactured at the same time.

(6) Since the raised portion 17 is formed on the semiconductor element mounting substrate 28 so as to surround the semiconductor element mounting portion 14, the semiconductor element mounting portion 1
When the semiconductor element 19 mounted on the semiconductor device 19 is sealed with a resin using the sealing member 30, a liquid sealing agent may be simply injected into a space surrounded by the raised portion 17. Is buried in the sealing member 30 under a natural state and is sealed. For this reason, undesired stress does not act as when using a die for lead frame punching molding, and therefore, the inner lead which is weak to the bending force formed by punching and the bonding wire bonded to the inner lead are used. There is no possibility that the parts and the like receive an undesired force, and therefore, it is possible to provide the semiconductor element mounting substrate 28 and the semiconductor device 10 with stable quality.

(7) When the electric circuit 13 is composed mainly of the copper foils 16 and 26, there is no bending, twisting, warping or the like of the lead during manufacture of the lead frame or at the time of packing operation, and the lead frame is eliminated. Since strict equipment management such as a die for punching molding is not required, the semiconductor element mounting substrate 28 and the semiconductor device 10 with more stable quality can be provided.

(8) A groove 18 extending in the thickness direction of the resin molded product 12 is formed on the side surface of the resin molded product 12 in the semiconductor element mounting substrate 28, and the electric circuit 13 is formed in the groove 18.
Since the outer lead extension 13C is provided, the connection accuracy of the electric circuit 13 to the printed circuit board 29 can be improved. That is, the wiring of the electric circuit 13 is fine. Therefore, when soldering the wiring to the printed circuit board 29, it is necessary to take care not to cause a short circuit in the electric circuit 13, but the existence of the groove 18 Since the individual outer lead extension portions 13C are completely separated independently, the solder does not flow into the other groove portions 18, and the accuracy of the soldering operation can be improved.

(9) Since the protruding terminal portion 13D is formed at the end of the electric circuit 13 opposite to the outer lead 13B corresponding to the electric circuit of the printed circuit board 29, the protruding terminal portion 13D is formed. Can be connected to the terminals of the electric circuit of the printed circuit board 29 with high accuracy.
3 can improve the connection accuracy.

[B] Second Embodiment (FIG. 10, FIG. 1)
1) FIG. 10 is a plan view showing a semiconductor element mounting substrate according to a second embodiment of the present invention. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The difference between the semiconductor element mounting substrate 41 of the second embodiment and the semiconductor element mounting substrate 28 of the first embodiment is that, as shown in FIGS.
The point is that the semiconductor element mounting portion 42 is formed in a concave shape for receiving the semiconductor element 19 to be mounted. At this time, the depth of the semiconductor element mounting portion 42 is set such that the upper surface of the semiconductor element 19 mounted in the semiconductor element mounting portion 42 is substantially flush with the inner lead 13A of the electric circuit 13.

Therefore, the semiconductor element mounting substrate 41 of the second embodiment and the semiconductor element mounting substrate 41
According to the semiconductor device 40 composed of the following, in addition to the effects (1) to (9) of the first embodiment, the following effect (10)
And (11).

(10) The semiconductor element mounting portion 42 of the semiconductor element mounting substrate 41 is formed in a concave shape so as to receive the semiconductor element 19, and the semiconductor element 19 is mounted in this concave shape. As compared with the semiconductor element mounting portion 42 having a non-recessed shape, the mounting structure of the semiconductor element 19 on the resin molded product 12 is more reliable, and the mounting work can be stabilized. Adhesive can be omitted.

(11) When the semiconductor element 19 is mounted on the semiconductor element mounting portion 42, the upper surface of the semiconductor element 19 and the inner lead 13A of the electric circuit 13 are substantially flush with each other. 25 can be shortened, and wire bonding between the semiconductor element 19 and the inner lead 13A can be facilitated.

[C] Third Embodiment (FIGS. 12 to 1)
5) FIG. 12A is a plan view showing a third embodiment of the semiconductor element mounting board according to the present invention, and FIG.
It is sectional drawing which follows the XII-XII line of (A). In the third embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

Semiconductor device mounting substrate 5 of this embodiment
Reference numeral 1 denotes the semiconductor element mounting substrate 28 of the first embodiment.
The difference is that there is no groove 18 on the side surface, and this groove 18
There is no outer lead extension 13C inside, no protruding terminal portion 13D on the back surface, and furthermore, a first inclined portion 53 downwardly inclined toward the semiconductor element mounting portion 14 at a raised portion 53 provided around the semiconductor element mounting portion 14. This is the point where the second inclined portion 55 inclined downward in the opposite direction to the portion 54 is formed. This second inclined portion 5
The outer leads 13B are provided on the raised portions 53 including 5, and therefore, the electric circuit 13 includes the inner leads 13A and the outer leads 13B.

The semiconductor element mounting substrate 5 of the above embodiment.
1 and a semiconductor device 50 composed of the semiconductor element mounting substrate 51 are manufactured as follows, as shown in FIG.

First, as shown in FIGS. 13A and 14, a copper foil 16 is integrally formed on the surface of a resin molded product 12 having a plurality of semiconductor element mounting portions 14 by pressure bonding. Is configured. At this time, the copper foil 16 is integrally formed so as to cover the plurality of semiconductor element mounting portions 14. The compression molding of the semiconductor element mounting portion 14 and the copper foil 16 is performed in the same manner as in the first embodiment described above.
It is implemented using.

Next, as in the first embodiment,
The electric circuit 13 including the inner lead 13A and the outer lead 13B is formed by forming a resist layer, exposing to ultraviolet light, developing, and etching to form a resin circuit molded article 11 as shown in FIG. 13B. .

Next, as shown in FIG. 13C, a semiconductor element 19 is mounted on each semiconductor element mounting portion 14 by die bonding, and thereafter, the semiconductor element 19 and the electric circuit 13 are mounted.
Is wire-bonded to the inner lead 13A using the gold wire 25.

Thereafter, as shown in FIG. 13 (D), a sealing member 30 is formed by enclosing the liquid sealing body in a space including the respective semiconductor element mounting portions 14 and surrounded by the raised portions 53. The semiconductor element 19 and the gold wire 25 are buried and protected by the sealing member 30.

Finally, in the resin circuit molded product 11,
The resin circuit molded product 11 is manually folded or mechanically diced using the boundary line 56 of the second inclined portion 55 in a portion corresponding to each of the adjacent semiconductor element mounting substrates 28, as shown in FIG. A single semiconductor device 50 is manufactured.

In the semiconductor device 50, the outer leads 13B of the electric circuit 13 provided on the raised portions 53 are provided without being buried by the sealing member 30 so as to be exposed. It is configured to be connectable to an electric circuit of the printed board 29.

That is, as shown in FIG. 15, the semiconductor device 50 is turned upside down, or the printed board 29 is turned upside down, so that the outer leads 13B on the raised portions 53 and the electric circuit of the printed board 29 are soldered. It is electrically connected at 57 (face-down mounting method).

Therefore, according to the above embodiment, the effects (1), (2), (3),
In addition to the effects similar to (5), (6) and (7), the following effects (12) to (14) are obtained.

(12) Since the outer leads 13B of the electric circuit 13 are arranged on the raised portions 53 of the resin molded product 12, the semiconductor device 50 formed by the semiconductor element mounting substrate 51 can be mounted face down. The outer lead 13B of the raised portion 53 is
9 can be mounted on the printed circuit board 29 by connecting to the electric circuit. For this reason, the connection part at the time of mounting the semiconductor device 50 can be easily observed, and the replacement of the semiconductor device 50 becomes easy.

(13) Outer lead 13 of raised portion 53
Since the semiconductor device 50 can be mounted on the printed circuit board 29 by connecting B to the electric circuit of the printed circuit board 29, the through-hole 15 is formed in the resin molded product 12 or the like when the semiconductor element mounting board 51 is manufactured. This through hole 15
A thin electroless copper plating process and an electrolytic copper plating process are not required, and the pressure bonding of the copper foil 16 may be performed only on one side of the resin molded product 12, so that the electric circuit 13 of the semiconductor element mounting substrate 51 is formed. Exposure may be performed only on one side of the resin molded product 12. From these, the manufacturing cost of the semiconductor element mounting substrate 51 and the semiconductor device 50 can be reduced, the number of chemicals used is small, and the management and disposal of the chemicals can be facilitated.

(14) The first projecting portion 53 of the substrate 51 for mounting a semiconductor element has the first
Since the second inclined portion 55 inclined downward in the opposite direction to the inclined portion 54 is formed, the plurality of semiconductor element mounting substrates 51 are formed.
Are collectively manufactured as the resin circuit molded product 11, the boundary lines 56 of the second inclined portions 55 arranged adjacent to each other are manually folded so that the plurality of semiconductor element mounting substrates 51 or the semiconductor devices 50 are mutually connected. It can be separated, and mechanical cutting such as dicing is not required.

[D] Fourth Embodiment (FIG. 16, FIG. 1)
7) FIG. 16A is a plan view showing a fourth embodiment of the semiconductor element mounting board according to the present invention, and FIG. 16B is a cross section taken along line XVI-XVI in FIG. FIG. In the fourth embodiment, the same parts as those in the third embodiment are denoted by the same reference numerals, and the description is omitted.

In the semiconductor element mounting board 61 of the fourth embodiment, the protrusions 62 formed around the semiconductor element mounting section 14 of each semiconductor element mounting board 61 are provided with the outer leads 13 B of the electric circuit 13. Many irregularities 63 are formed corresponding to the intervals. The form of the unevenness 63 is shown in FIG.
17 (A) shows a semi-cylindrical convex portion 64.
Are arranged at predetermined intervals. In the form of FIG. 17B, rectangular convex portions 65 are arranged at predetermined intervals. The form shown in FIG. 17C has a convex portion 6 which is rounded.
6 and concave portions 67 are formed alternately. FIG.
In the form (D), trapezoidal convex portions 68 are arranged at predetermined intervals. In any case, the projections 64, 6
Outer leads 13B are provided along the ridge lines 5, 66 and 68. As a result, the adjacent outer leads 13
Since a space is secured between B and the concave portion, when mounting the semiconductor device 60 composed of the semiconductor element mounting substrate 61 on the printed circuit board 29, the outer leads 13B
No solder is connected between them. In addition, the convex part and the concave part are:
Not limited to those shown, the cross-section is semicircular, rectangular, trapezoidal,
The shape may be an ellipse or a combination thereof.

Therefore, also in the fourth embodiment, the effects (1), (2), (3),
(5), (6) and (7), and the following effects (15) in addition to the effects similar to the effects (12) to (14) of the third embodiment.

(15) The outer leads 13 B of the electric circuit 13 on the semiconductor element mounting board 61 are
When the semiconductor device 60 is mounted on the printed circuit board 29 by the face-down mounting method similarly to the semiconductor device 50,
Since a space is formed between the outer leads 13B by the concave portions of the irregularities 63, the adjacent outer leads 13B are not erroneously connected by solder or the like, and the connection accuracy of the electric circuit 13 when the semiconductor device 60 is mounted is improved. Can be improved.

The present invention has been described based on the above embodiment, but the present invention is not limited to this.

For example, in the semiconductor element mounting board 51 of the third embodiment and the semiconductor element mounting board 61 of the fourth embodiment, the semiconductor element mounting portion 14 is connected in the same manner as in the second embodiment. It may be configured in a concave shape for receiving the semiconductor element 19 to be mounted.

Further, in each of the embodiments, the case where the conductive metal layer is the copper foil 16 has been described. However, the conductive metal layer may be a copper plate or a nickel or gold foil or plate.

[0108]

According to the first aspect of the present invention, there is provided a substrate for mounting a semiconductor element, comprising: a resin molded product made of a synthetic resin; and an electric device formed on the resin molded product and including inner leads and outer leads. In a semiconductor element mounting board comprising a circuit and a semiconductor element mounting portion formed on the surface of the resin molded article adjacent to the inner lead, the electric circuit is integrated with the resin molded article. A conductive metal layer formed by compression bonding is formed as a main part,
Since the raised portion is formed on the resin molded product so as to surround the semiconductor element mounting portion, the semiconductor device can be manufactured easily and with high quality.

According to the semiconductor element mounting substrate according to the fourth aspect of the present invention, a resin molded product made of a synthetic resin and an electric circuit formed on the resin molded product and including inner leads and outer leads are provided. A semiconductor element mounting portion formed on the surface of the resin molded product adjacent to the inner lead, wherein the electric circuit is integrally press-bonded to the resin molded product. The molded conductive metal layer was formed as a main part, and the resin molded product was formed with a raised portion so as to surround the semiconductor element mounting portion, and the outer lead of the electric circuit was arranged on the raised portion. Therefore, the semiconductor device can be manufactured easily and with high quality.

According to the semiconductor device of the ninth aspect of the present invention, a resin molded product made of a synthetic resin, an electric circuit formed on the resin molded product and including inner leads and outer leads, A semiconductor element mounting portion formed on the surface of the resin molded product adjacent to the semiconductor device; a semiconductor element mounted on the semiconductor element mounting portion and connected to the inner lead; and a periphery of the semiconductor element sealed. And a sealing member formed on the resin molded product, wherein the electric circuit is formed with a conductive metal layer integrally formed by pressure bonding on the resin molded product as a main part, and the resin molded product A raised portion is formed so as to surround the semiconductor element mounting portion, and the sealing member is formed by a solidified liquid sealing material injected into a space surrounded by the raised portion. From what has been configured, it is possible to produce a simple and high-quality semiconductor device.

According to the semiconductor device of the twelfth aspect, a resin molded article made of a synthetic resin is provided.
An electric circuit formed on the resin molded product, including an inner lead and an outer lead, a semiconductor element mounting portion formed on a surface of the resin molded product adjacent to the inner lead, and mounted on the semiconductor element mounting portion. A semiconductor device having a semiconductor element connected to the inner lead and a sealing member formed so as to seal the periphery of the semiconductor element. The resin molded article is formed with a conductive metal layer integrally formed by pressure bonding as a main part, and a protruding portion is formed on the resin molded product so as to surround the semiconductor element mounting portion. Is disposed, and the sealing member is provided by a solidified liquid sealing material injected into a space surrounded by the raised portion, and connects the outer lead of the raised portion to the connection pair. From what has been configured to be connectable to an electrical circuit of the object it can be produced easily and with high quality semiconductor device.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first embodiment of a semiconductor element mounting substrate according to the present invention.

FIG. 2 is a cross-sectional view of the semiconductor element mounting substrate of FIG. 1 taken along the line II-II.

3 (A) is a view on arrow III in FIG. 2, and FIG. 3 (B) is an enlarged view showing a modified example of the protruding terminal portion in FIG. 3 (A);
(C) is an enlarged view showing another modified example of the protruding terminal portion of FIG. 3 (A).

FIG. 4 is a sectional process view showing the first half of the manufacturing process of the semiconductor element mounting substrate of FIG. 1 and the semiconductor device according to the present invention;

FIG. 5 is a sectional process view showing a latter half of the manufacturing process of FIG. 4;

FIG. 6 is a cross-sectional view showing a manufacturing process for manufacturing the resin composite molded article of FIG. 4 (A).

FIG. 7 is a cross-sectional view (IVA-) of the cross-sectional view shown in FIG.
FIG. 4 is a plan view of the resin composite molded product to which (IVA line) is added.

FIG. 8 is a cross-sectional view (IVB-
FIG. 4 is a plan view showing a resin composite molded product to which (IVB line) is added.

9 is a cross-sectional view illustrating a state where the semiconductor device illustrated in FIG. 5G is mounted on a printed board.

FIG. 10 is a plan view showing a second embodiment of the semiconductor element mounting board according to the present invention.

FIG. 11 is a cross-sectional view of a semiconductor device including the semiconductor element mounting substrate of FIG. 10;

12A is a plan view showing a third embodiment of the substrate for mounting a semiconductor element according to the present invention, and FIG.
It is sectional drawing which follows the XII-XII line of 2 (A).

FIG. 13 is a sectional process view showing a manufacturing process of the semiconductor element mounting substrate of FIG. 12A and the semiconductor device according to the present invention;

FIG. 14 is a cross-sectional view (XI) of the cross-sectional view shown in FIG.
It is a top view which shows the resin composite molded article to which II-XIII line was added.

15 is a cross-sectional view illustrating a state where the semiconductor device in FIG. 13E is mounted on a printed circuit board.

FIG. 16A is a plan view showing a fourth embodiment of the semiconductor element mounting board according to the present invention, and FIG.
FIG. 6 (A) is a sectional view taken along the line XVI-XVI.

FIG. 17 is a schematic cross-sectional view showing a concavo-convex shape in a raised portion in FIG.

FIG. 18A is a cross-sectional view showing a bonding state between a copper foil and a resin molded product constituting the electric circuit shown in FIG. 1, and FIG.
FIG. 2 is a cross-sectional view showing a state in which a conventional electric circuit is combined with electroless copper plating and a resin molded product.

[Explanation of symbols]

 Reference Signs List 10 semiconductor device 12 resin molded article 13 electric circuit 14 semiconductor element mounting portion 16, 26 copper foil 17 raised portion 18 groove portion 19 semiconductor element 20 unevenness treated surface 28 semiconductor element mounting substrate 29 printed board (connection object) 30 sealing member 13A Inner lead 13B Outer lead 13C Outer lead extension 13D Projecting terminal 40 Semiconductor device 41 Semiconductor element mounting substrate 42 Semiconductor element mounting portion 50 Semiconductor device 51 Semiconductor element mounting substrate 53 Raised portion 54 First inclined portion 55 Second Inclined portion 56 Boundary line 60 Semiconductor device 61 Semiconductor element mounting substrate 62 Raised portion 63 Unevenness

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H01L 23/50 H01L 23/12 L F term (Reference) 5F061 AA01 BA03 CA01 CA21 CB02 CB03 5F067 AA08 AA11 AA13 AB04 BB19 BC08 BE10 CC03 CC07 DA01 DA05 DA16 DC02 EA04

Claims (16)

[Claims] 1. A resin molded product made of a synthetic resin, an electric circuit formed on the resin molded product and including an inner lead and an outer lead, and formed on a surface of the resin molded product adjacent to the inner lead. A semiconductor element mounting substrate configured to include: a conductive metal layer formed integrally with the resin molded article by pressure bonding; A semiconductor element mounting substrate, wherein a protrusion is formed on the molded product so as to surround the semiconductor element mounting portion. 2. The resin molded article has a groove formed on a side surface thereof in a thickness direction of the resin molded article, and the groove has an outer lead connected to an outer lead of the electric circuit. 2. The substrate for mounting a semiconductor element according to claim 1, wherein an extension is provided. 3. The outer lead extension portion includes a protruding terminal portion corresponding to an electric circuit of an object to be connected at an end opposite to the outer lead side. Semiconductor element mounting substrate. 4. A resin molded product made of a synthetic resin, an electric circuit formed on the resin molded product and including an inner lead and an outer lead, and formed on a surface of the resin molded product adjacent to the inner lead. A semiconductor element mounting substrate configured to include: a conductive metal layer formed integrally with the resin molded product by pressure bonding; A substrate for mounting a semiconductor element, wherein a raised part is formed on the molded product so as to surround the periphery of the semiconductor element mounting part, and outer leads of the electric circuit are arranged on the raised part. 5. The protrusion according to claim 4, wherein a second inclined surface inclined downward in a direction opposite to the first inclined surface inclined downward toward the semiconductor element mounting portion is formed in the raised portion. Substrate for mounting semiconductor elements. 6. The semiconductor element mounting substrate according to claim 1, wherein said semiconductor element mounting portion is formed in a concave shape for receiving a semiconductor element to be mounted. 7. The conductive metal layer is formed by subjecting a back surface of the conductive metal layer to an uneven treatment, and the uneven surface of the conductive metal layer is joined to the resin molded product, and the resin molded product is electrically conductive with the resin molded product. 7. The substrate for mounting a semiconductor element according to claim 1, wherein the metal layer and the metal layer are integrally formed by pressure bonding. 8. The method according to claim 1, wherein the resin molded article is made of a thermosetting resin or a thermoplastic resin, and the conductive metal layer is made of a copper foil. Substrate for mounting semiconductor elements. 9. A resin molded article made of a synthetic resin, an electric circuit formed on the resin molded article and including an inner lead and an outer lead, and formed on a surface of the resin molded article adjacent to the inner lead. A semiconductor element mounting part, a semiconductor element mounted on the semiconductor element mounting part and connected to the inner lead, and a sealing member formed to seal the periphery of the semiconductor element. In the semiconductor device having the above structure, the electric circuit is formed mainly of a conductive metal layer formed integrally with the resin molded product by pressure bonding. A semiconductor device, wherein a raised portion is formed as described above, and the sealing member is made of a solidified liquid sealing material injected into a space surrounded by the raised portion. 10. The resin molded article has a groove formed on a side surface thereof in a thickness direction of the resin molded article, and the groove has an outer lead connected to an outer lead of the electric circuit. The semiconductor device according to claim 9, further comprising an extension. 11. The outer lead extension portion has a protruding terminal portion corresponding to an electric circuit of an object to be connected at an end opposite to the outer lead side. Semiconductor device. 12. A resin molded product made of a synthetic resin, an electric circuit formed on the resin molded product and including an inner lead and an outer lead, and formed on a surface of the resin molded product adjacent to the inner lead. A semiconductor element mounting part, a semiconductor element mounted on the semiconductor element mounting part and connected to the inner lead, and a sealing member formed to seal the periphery of the semiconductor element. In the configured semiconductor device, the electric circuit is formed mainly of a conductive metal layer integrally formed on the resin molded product by pressure bonding, and the resin molded product surrounds the periphery of the semiconductor element mounting portion. The outer lead of the electric circuit is disposed on the raised portion, and the sealing member is formed by solidifying a liquid sealing material injected into a space surrounded by the raised portion. Wherein the outer lead of the raised portion is configured to be connectable to an electric circuit of a connection target. 13. The protrusion according to claim 12, wherein a second inclined surface inclined downward in a direction opposite to the first inclined surface inclined downward toward the semiconductor element mounting portion is formed in the raised portion. Semiconductor device. 14. The semiconductor device according to claim 9, wherein said semiconductor element mounting portion is formed in a concave shape for receiving a semiconductor element to be mounted. 15. The conductive metal layer is formed by subjecting a back surface of the conductive metal layer to a concavo-convex treatment. The semiconductor device according to claim 9, wherein the metal layer and the metal layer are integrally formed by pressure bonding. 16. The method according to claim 9, wherein the resin molded product is made of a thermosetting resin or a thermoplastic resin, and the conductive metal layer is made of a copper foil. Semiconductor device.