JP2001093920A - Die bonding method for pressure sensor chip - Google Patents

Abstract

(57) [Summary] [Problem] To easily and uniformly apply an adhesive to improve the adhesion between a pressure sensor chip and a body block, and to prevent the pressure sensor performance from deteriorating or varying due to the bonding condition. Providing a way. A pressure sensor chip and a body block are provided.
In the method of die-bonding the pressure sensor chip with the adhesive 3, the transfer amount control members (9, 10) are transferred to either the collet 7 holding the pressure sensor chip 1 or the paste tank 8 holding the adhesive 3. The collet 7 is dropped on the paste tank 8 and the adhesive 3
And then pressure sensor chip 1
Is mounted and bonded.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure sensor chip die bonding method for mounting a pressure sensor chip (differential pressure type semiconductor pressure sensor chip) on a package or the like (body block).

[0002]

2. Description of the Related Art FIG. 4 is a sectional view of a pressure sensor. The pressure sensor chip 1 is mounted on a body block 2 and both are adhered by an adhesive 3. The adhesive 3 is applied over a region corresponding to the outer periphery of the bonding surface of the pressure sensor chip 1. The measured pressure is applied to the silicon diaphragm 1a of the pressure sensor chip 1 via the pressure introducing hole 2a provided in the body block 2, and an electric signal corresponding to the applied pressure is transmitted from the pressure sensor chip 1 to the bonding wire. 4 to the lead frame 5.

FIG. 5 schematically shows a procedure for mounting the pressure sensor chip 1 on the body block 2. First, the adhesive 3 is applied to the bonding surface 2b (die attaching position) of the body block 2 by the dispenser nozzle 6 (a). The adhesive 3 is applied around the pressure introducing hole 2a, and then the collet 7 holding the pressure sensor chip 1 is hung down on the bonding surface 2b (b), and the pressure sensor chip 1 is mounted inside the body block 2 and bonded. The two are adhered by the agent 3 (c).

[0006] As a method of applying the adhesive by the dispenser nozzle 6, there is a method as shown in FIG. 6. FIG. 6A shows a method of applying the adhesive by moving the dispenser nozzle 6 in a substantially circular shape around the pressure introducing hole 2a. Also, FIG.
This is a method of applying a multi-point coating around the pressure introducing hole 2a.

In addition to the method of applying the adhesive 3 on the body block 2 side, there is a method of applying the adhesive 3 on the pressure sensor chip 1 side. This is shown in FIG. A collet 7 holding the pressure sensor chip 1 is hung down on the surface of the adhesive 3 in the paste tank 8, and the adhesive surface 1 of the pressure sensor chip 1
Adhesive 3 is attached to a (a). Next, the pressure sensor chip 1 to which the adhesive 3 is attached is mounted on the pressure sensor chip 1 mounting portion of the body block 2 (b), and the two are bonded (c).

[0006]

However, FIG.
In the application method as in (a), it is very difficult to apply the adhesive 3 continuously and in a uniform thickness, and the amount becomes small and faint at the start of application, and the adhesive 3 is applied at the end. It tends to be over applied due to dripping. If the adhesive 3 cannot be applied uniformly, the adhesiveness of the pressure sensor chip 1 will be deteriorated, and the applied pressure will leak from the bonding surface, deteriorating the measurement accuracy and the breakdown withstand voltage, and causing the offset voltage variation. Become. In addition, the mounting of the pressure sensor chip 1 at an angle causes a poor connection of the bonding wire 4. In the multi-point application method as shown in FIG. 6B, the adhesive 3 spreads when the pressure sensor chip 1 is mounted, and the points are connected to each other, so that an application state equivalent to continuous application is obtained.
However, this action depends on the viscosity of the adhesive 3 and the amount of application at each point, and it has been difficult to make the thickness of the adhesive 3 uniform even in this method. In addition, there is a problem that it takes time to apply at many points. Further, also in the method of applying the adhesive 3 to the pressure sensor chip 1 as shown in FIG. 7, it is difficult to keep the transfer thickness of the adhesive constant.

The present invention has been made in view of the above circumstances, and has as its object to easily and uniformly apply an adhesive, to improve the adhesiveness between a pressure sensor chip and a body block, and to improve the adhesiveness. An object of the present invention is to provide a pressure sensor chip die-bonding method for preventing performance degradation and variation of a pressure sensor.

[0008]

According to one aspect of the present invention, a pressure sensor chip and a body block on which the pressure sensor chip is mounted are bonded by an adhesive. In the method, a collet holding the pressure sensor chip, and a transfer amount control member for controlling a transfer amount of the adhesive in one of the paste tanks holding the adhesive are provided, and the collet is suspended in the paste tank. The adhesive is transferred to the pressure sensor chip, and then the pressure sensor chip is mounted on the body block and bonded.

According to a second aspect of the present invention, in the first aspect of the present invention, the transfer amount control member is provided at the bottom of the paste tank.

According to a third aspect of the present invention, in the first aspect of the invention, the transfer amount control member is provided on the collet.

According to a fourth aspect of the present invention, there is provided a pressure sensor chip die-bonding method for bonding a pressure sensor chip and a body block on which the pressure sensor chip is mounted with an adhesive, wherein the bonding surface is provided on the body block side. Is provided with a disk-shaped roller, and the transfer jig is immersed in a paste tank holding the adhesive so that the adhesive is adhered to the roller. The adhesive is transferred to the adhesive surface in the body block by the rotation operation of the roller, and then the pressure sensor chip is mounted on the adhesive surface and adhered. It is assumed that.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for die-bonding a pressure sensor chip according to an embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows a first embodiment of the present invention.
Step of transferring adhesive 3 to pressure sensor chip 1 (FIG. 7)
In (a)), the collet 7 holding the pressure sensor chip 1
A protrusion-shaped spacer 9 is provided at the bottom of the paste tank 8 as a transfer amount control member for controlling the transfer amount of the adhesive 3 at the position of the pressure sensor chip 1 at the time of hanging. By appropriately setting the height of the spacer 9, the adhesive 3 is attached to the adhesive surface 1 a of the pressure sensor chip 1.
Can be transferred in an appropriate amount and transferred uniformly without excessive transfer. Subsequent steps are the same as those in FIGS. 7B and 7C.

FIG. 2 shows a second embodiment of the present invention.
When the collet 7 holding the pressure sensor chip 1 is hung down, the support portion 1 serves as a transfer amount control member for controlling the transfer amount of the adhesive 3 in the paste tank 8 of the pressure sensor chip 1.
0 is provided on the collet 7. The hanging amount of the collet 7 is limited by the supporting portion 10, and by appropriately setting the height of the supporting portion 10, an appropriate amount can be set without excessively transferring the adhesive 3 to the bonding surface 1 a of the pressure sensor chip 1. It is possible to secure and transfer uniformly. Further, if the height of the support portion 10 is made variable, an appropriate amount according to the change in the viscosity of the adhesive 3 can be transferred. The subsequent steps are shown in FIG.
Same as (c).

FIG. 3 shows a third embodiment of the present invention.
A transfer jig 11 for transferring the adhesive 3 to the bonding surface 2b on the body block 2 side is provided with a disk-shaped roller 12, and the adhesive 3
The transfer jig 11 is immersed in a paste tank 8 holding the adhesive, the adhesive 3 is applied to the roller 12, the transfer jig 11 is inserted into the bonding surface 2 b in the body block 2, and the rotation of the roller 12 causes the body block 2 to rotate. Adhesive 3 on the adhesive surface 2b inside
Then, the pressure sensor chip 1 is mounted on the bonding surface 2b and bonded.

The outline of the process will be described with reference to FIG. First, the transfer jig 11 is hung down on the adhesive 3, and the adhesive 3 is attached around the roller 12 by the rotation of the transfer jig 11 and the roller 12 (a). Next, the transfer jig 11 is inserted into the pressure sensor chip mounting portion in the body block 2, and the adhesive 3 is transferred to the bonding surface 2 b in the body block 2 by rotating the transfer jig 11 and the roller 12 (b). . The adhesive 3 is uniformly transferred in a loop around the pressure introducing hole 2a (c). If the outer circumference of the roller 12 and the length of the ring-shaped application shape are the same, a ring-shaped application shape can be formed just by one rotation of the roller 12, which is more effective.

Since the application of the adhesive 3 is performed by the rotation of the roller 12 in this manner, a uniform and uniform ring-shaped application state is realized, and the effect of further improving the reliability of bonding can be obtained. Play. Further, even if the transfer of the adhesive 3 is blurred, it is possible to easily and uniformly apply the adhesive 3 by rotating the roller again.

[0018]

As described above, according to the first aspect of the present invention, in a die bonding method of a pressure sensor chip for bonding a pressure sensor chip and a body block on which the pressure sensor chip is mounted with an adhesive, A collet for holding the pressure sensor chip, and a transfer amount control member for controlling the transfer amount of the adhesive provided in one of the paste tanks holding the adhesive, and the collet is hung down in the paste tank. The adhesive is transferred to the chip, and then the pressure sensor chip is mounted on the body block and bonded, so that an appropriate amount is secured without excessively transferring the adhesive and uniformly. Transfer can be performed to improve the adhesiveness between the pressure sensor chip and the body block, and prevent the performance deterioration and dispersion of the pressure sensor due to the adhesion status. It could provide a die-bonding method of the pressure sensor chip.

According to the second aspect of the present invention, the first aspect is provided.
In addition to the effects of those described, the position of the pressure sensor chip when the collet holding the pressure sensor chip is
Since the transfer amount control member for controlling the transfer amount of the adhesive is provided at the bottom of the paste tank,
There is an effect that an appropriate amount of the adhesive can be secured and uniformly transferred to the bonding surface of the pressure sensor chip without excessively transferring the adhesive.

In the invention according to claim 3, claim 1 is
In addition to the effects of those described above, when the collet holding the pressure sensor chip is hung down, a transfer amount control member for controlling the transfer amount of the adhesive in the paste tank of the pressure sensor chip is provided on the collet. Therefore, it is possible to secure an appropriate amount of the adhesive on the adhesive surface of the pressure sensor chip without excessively transferring the adhesive, to uniformly transfer the adhesive, and to more precisely cope with a change in the appropriate amount due to the viscosity of the adhesive. This has the effect.

According to a fourth aspect of the present invention, in the die bonding method of a pressure sensor chip for bonding a pressure sensor chip and a body block on which the pressure sensor chip is mounted with an adhesive, the bonding is performed on the bonding surface on the body block side. A transfer jig for transferring the agent is provided with a disk-shaped roller, the transfer jig is immersed in a paste tank holding the adhesive, and the adhesive is attached to the roller, and the transfer jig is attached to the body block. Since the adhesive is transferred to the adhesive surface in the body block by the rotation operation of the roller, and then the pressure sensor chip is mounted on the adhesive surface and adhered, An effect of realizing a well-formed and highly uniform ring-shaped coating state and further improving the reliability of bonding is achieved.

[Brief description of the drawings]

FIG. 1 is a view showing an adhesive application step of a die bonding method for a pressure sensor chip according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating an adhesive application step of a pressure sensor chip die bonding method according to a second embodiment of the present invention.

FIG. 3 is a view showing an adhesive application step of a die bonding method for a pressure sensor chip according to a third embodiment of the present invention.

FIG. 4 is a sectional view of a pressure sensor.

FIG. 5 is a view showing steps of a conventional die bonding method for a pressure sensor chip.

FIG. 6 is a diagram showing a conventional adhesive application state.

FIG. 7 is a diagram showing steps of another conventional die bonding method for a pressure sensor chip.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pressure sensor chip 1a Adhesive surface (pressure sensor chip side) 2 Body block 2a Pressure introduction hole 2b Adhesive surface (body block side) 3 Adhesive 6 Dispenser nozzle 8 Paste tank 9 Spacer 10 Support portion 11 Transfer jig 12 Roller

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Mitsuhiro Kani, Inventor Matsushita Electric Works Co., Ltd., 1048, Kazuma, Kadoma, Osaka Prefecture (72) Inventor Hiroshi Saito 1048, Kazuma, Kazuma, Kadoma, Osaka, Japan Matsushita Electric Works, Ltd. 72) Inventor Takamasa Sakai 1048 Kazuma Kadoma, Kadoma-shi, Osaka F-term in Matsushita Electric Works Co., Ltd. (reference) FA22

Claims (4)

[Claims] 1. A method of die-bonding a pressure sensor chip for bonding a pressure sensor chip and a body block on which the pressure sensor chip is mounted with an adhesive, wherein a collet holding the pressure sensor chip and a paste holding the adhesive. A transfer amount control member for controlling the transfer amount of the adhesive is provided in one of the tanks, the collet is hung down on the paste tank, the adhesive is transferred to the pressure sensor chip, and then the pressure is applied to the body block. A die bonding method for a pressure sensor chip, wherein a sensor chip is mounted and bonded. 2. The method according to claim 1, wherein the transfer amount control member is provided at a bottom of the paste tank. 3. The method according to claim 1, wherein the transfer amount control member is provided on the collet. 4. A transfer jig for transferring the adhesive to an adhesive surface on the body block side in a die bonding method of a pressure sensor chip for bonding a pressure sensor chip and a body block on which the pressure sensor chip is mounted with an adhesive. A disc-shaped roller is provided, the transfer jig is immersed in a paste tank holding the adhesive, the adhesive is attached to the roller, and the transfer jig is inserted into an adhesive surface in the body block. Transferring the adhesive to the bonding surface in the body block by the rotation operation of the roller, and then mounting and bonding the pressure sensor chip to the bonding surface. Die bonding method.