JP2001091578A - Inspection device - Google Patents

Abstract

(57) [Problem] To be able to easily increase or decrease the pressing force applied to an object to be inspected in accordance with the number of terminals of the object to be inspected. A pressing member supporting member for supporting a pressing member.
6 is connected to the rotating plate 14 by a support shaft 50 and a nut 51.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus used for a non-destructive test of an electronic circuit on an object having an electronic circuit therein.

[0002]

2. Description of the Related Art Various tests are performed on a semiconductor integrated circuit mounted on an electronic device or the like before mounting to remove potential defects. The test is performed nondestructively by applying voltage stress, operating at high temperature, storing at high temperature, and the like corresponding to thermal and mechanical environment tests. Among the various tests, a burn-in test for performing an operation test for a certain period of time under a high temperature condition is performed as a test that is effective for removing an initial operation defective integrated circuit.

An inspection jig used for the burn-in test is generally called an electrical component socket, and is supplied with a predetermined test voltage and is subjected to a test as shown in, for example, Japanese Patent Application Laid-Open No. 10-255943. For example, a BGA type (B) in which a printed wiring board (printed board) having an input / output unit for transmitting an abnormality detection signal indicating a short circuit or the like from an inspection object and a semiconductor integrated circuit as an inspection object are accommodated.
Inspection object housing member (socket body) having a housing portion in which a semiconductor element of an all grid array is mounted.
And a cover member (pressing cover) that has a pressing portion (pressure member) that abuts on the upper surface of the semiconductor element and presses with a predetermined pressure, and covers a top portion of the inspection object housing member, and is rotatably supported by the cover member. And a hook member that engages with the inspection object housing member and fixes the cover member to the inspection object housing member.

[0004] One end of the cover member is rotatably connected to the inspection object housing member by a support shaft provided at one end of the inspection object housing member. Further, the above-mentioned pressing portion is provided at a portion facing the semiconductor element on the inner surface side portion of the cover member.

[0005] When the semiconductor element is mounted in the accommodating portion of the inspection object accommodating member, or when the tested semiconductor element is removed from the accommodating portion of the inspection object accommodating member, the hook member is disengaged. , The cover member is opened. At that time, the semiconductor element is positioned and arranged with respect to a contact group on the printed wiring board.

On the other hand, when the cover member is closed to cover the accommodation chamber of the inspection object accommodation member, the hook member is engaged with the terminals of the semiconductor element under a predetermined urging force by the pressing portion. In this state, the terminals of the semiconductor element and the contacts of the printed wiring board are electrically connected. At that time, during the test, or when mounting the semiconductor element,
In order to obtain a reliable conduction state, it is required that the pressing portion uniformly presses all the terminals of the semiconductor element against the contact group of the printed wiring board.

In this configuration, the semiconductor element is mounted in the housing of the inspection object housing member, and a predetermined test voltage is supplied to the input / output unit of the printed wiring board to perform, for example, a burn-in test. Become.

[0008]

As described above, in a structure in which the tip of each terminal in the semiconductor element is brought into contact with the contact point of the substrate and a predetermined urging force is applied to each terminal and contact point, as much as possible. It is desired to inspect semiconductor elements having different numbers of terminals using the same inspection jig.

However, for example, when the number of terminals of the semiconductor element increases and becomes relatively large and the area of the pressed surface of the semiconductor element becomes relatively large, the required urging force becomes relatively large. Therefore, in general, the inspection jig does not have a structure for increasing the pressing force, so that it may be difficult to inspect semiconductor elements having different numbers of terminals with the same inspection jig that applies a predetermined pressing force. is there.

In view of the above problems, the present invention relates to an inspection apparatus used for a non-destructive test of an electronic circuit in an object having an electronic circuit therein, wherein the inspection device is used in accordance with the number of terminals of the object. An object of the present invention is to provide an inspection apparatus that can easily increase and decrease the pressing force applied to an inspection object.

[0011]

In order to achieve the above-mentioned object, an inspection apparatus according to the present invention comprises: a contact electrically connected to a terminal of an inspection object having an electronic circuit therein;
A base provided with a substrate having an input / output terminal portion to which an input signal is input and an output signal from the inspection object is sent out, and one end portion is rotatably supported by the base and close to the substrate. A rotating member disposed at a position or a separated position; and a pressing member which is detachably provided on the rotating member and which is pressed against the inspection object so as to contact a terminal of the inspection object arranged on the substrate and a contact point of the substrate. A pressing member support for supporting a pressing member having a pressing surface for pressing a surface portion, and a pressure receiving member connected to the base via a substrate and receiving a pressing force by the pressing member are provided.

When the rotating member is rotated by the rotating member and takes a position close to the substrate, the posture of the pressing surface of the pressing member is substantially parallel to the pressed surface portion of the inspection object. In order to maintain the guide member, a guide member having a guide portion for guiding the pressing member support so as to be relatively movable may be further provided.

[0013] A conductive sheet member for selectively conducting between the contact point of the substrate and the terminal of the device under test may be provided between the contact point of the substrate and the terminal of the device under test.

Further, a contact electrically connected to a terminal of the inspection object having an electronic circuit therein, and an input / output terminal portion to which an input signal is input and an output signal from the inspection object is transmitted are provided. A second substrate for supplying an input signal, the first substrate having a first substrate disposed on the base, and a connector portion being disposed on the base and electrically connected to an input / output terminal of the first substrate; May be provided.

[0015]

FIG. 2 schematically shows an entire configuration of an example of an inspection apparatus according to the present invention. In FIG. 2, a printed circuit board 6 having an input / output unit 6A for supplying a predetermined test voltage and transmitting an abnormality detection signal indicating a short circuit or the like from an object to be inspected, and a predetermined position on the printed circuit board 6 And a test object storage member 8 having a storage chamber in which a plurality of semiconductor elements as test objects are mounted.

On both sides of the printed wiring board 6, guide rollers 4 provided at one end of the opening / closing operation member 4, respectively.
A guide rail 2A for guiding A and a guide rail 2B for guiding a guide roller 4B provided at the other end of the opening / closing operation member 4 are arranged.

The opening / closing operation member 4 for selectively opening / closing the rotating plate 14 to be described later is moved from a standby position shown by a solid line in FIG. The rotating plates 14 of the inspection object storage members 8 arranged and guided by the guide rails 2A and 2B are sequentially closed, and moved to a position shown by a two-dot chain line in FIG. After the period is stopped, the rotating plate 1 is subsequently moved in the direction opposite to the direction indicated by the arrow and
4 are sequentially opened and returned to the standby position indicated by the solid line in FIG.

As shown in FIGS. 1, 3, and 4, the inspection object storage member 8 serves as a first substrate electrically connected to the printed wiring board 6 serving as a second substrate. A base 10 arranged on the substrate 20 and forming a lower portion of the inspection object storage member 8, and a pressing member support 16, which is rotatably supported at one end by the base 10, described later, is in a state close to the base 10. A rotating plate 14 to be in a separated state, a guide member 12 having one end rotatably supported by the base 10 and arranged between the base 10 and the rotating plate 14 to guide the pressing member support 16. As a main element.

The substantially rectangular board 20 has a male connector section 20A on each side connected to the female connector section 6A of the printed wiring board 6, respectively. The connector portions 20A are provided at four locations on the back side of the substrate 20. Each connector section 20A is electrically connected to an electrode group provided at the center of the substrate 20 via a conductor layer (not shown).

In the center of the substrate 20, FIG.
As shown in FIG.
The electrode group 20 </ b> B that is in contact with a is provided corresponding to the terminal portion 22 a of the conductive sheet member 22. This allows
A signal from the connector 20A is supplied to the terminal 22a of the conductive sheet member 22 through the electrode group 20B.
A signal from the terminal portion 22a of the conductive sheet member 22 is transmitted to the connector portion 20A through the electrode group 20B. At this time, since the board 20 and the printed wiring board 6 are electrically connected via the connector section 20A and the connector section 6, a high frequency band can be obtained as compared with a case where the board 20 is connected via relatively long connection pins. This is advantageous in reducing the resistance in the test.

As shown in FIGS. 1 and 7, the conductive sheet member 22 made of a resin material is pressed in its thickness direction at a substantially central portion thereof to selectively conduct. Are formed corresponding to the electrodes of the semiconductor element 26 described later and the electrode group 20B of the substrate 20.

The terminal portion 22a of the conductive sheet member 22 is
A composite conductive material, for example, as schematically shown in FIG. 11A, a silicone rubber 22s as an insulating rubber
And an aggregate of metal particles 22m as conductive particles. As a composite conductive material,
Anisotropic conductive rubber is used. Anisotropic conductive rubber is a material that has conductivity in the thickness direction and does not have conductivity in a direction along a plane. The anisotropic conductive rubber includes a dispersion type in which conductive portions are dispersed in rubber having an insulating property and an uneven distribution type in which a plurality of conductive portions are partially distributed. May be used. Terminal part 22
Since a is made of such anisotropic conductive rubber, each electrode of the semiconductor element 26 and the terminal portion 22a are connected by surface contact, so that a contact failure is avoided and the contact with the electrode of the semiconductor element 26 is prevented. Damage will be avoided.

The conductive sheet member 22 is not limited to such an example, and as shown schematically in FIG. 11B, the terminal portion 60a of the conductive sheet member 60 is made of an insulating rubber 60s. , A conductive linear body or 60 m of fiber. The wire diameter of the linear body is, for example, about 10
It is about μm. Further, as shown in FIG. 11C, the terminal portion 62a of the conductive sheet member 62 may be made of a conductive metal foil 62m or scaly particles 62m and an insulating rubber 62s.

Although one conductive sheet member 22 is provided for each base 10 in the above example, the present invention is not limited to this example, and the substrates 20 of each base 10 are connected to each other. Originally, one may be provided so as to straddle a plurality of bases 10.

As shown in FIG. 7, the conductive sheet member 22 mounted on the substrate 20 has through holes 22b into which four positioning pins 52 penetrating the substrate 20 are fitted. are doing. Thereby, the positioning of the terminal portion 22a with respect to the electrode group 20B of the substrate 20 is performed with high accuracy.

As the object to be inspected, for example, a BGA type semiconductor element 26 is composed of a plurality of semiconductor integrated circuits formed on a wafer as shown in FIGS. 10A, 10B and 10C. Each circuit is a substantially square chip obtained through a dicing and assembling process.

On the surface of the semiconductor element 26 facing the conductive sheet member 22, a plurality of spherical electrodes 26a to be electrically connected to the terminal portions 22a of the conductive sheet member 22 are provided over the entire surface, for example, about 360. Or more at a predetermined pitch.

The semiconductor element 26 has a flat pressed surface 26p facing the surface on which the electrode 26a is formed. The pressed surface 26p is pressed by a pressing body 34 described later when the semiconductor element 26 is mounted as described below.

As shown in FIGS. 1 and 4, a semiconductor element 26 is accommodated on the conductive sheet member 22, and the electrode 26a of the semiconductor element 26 is positioned with respect to the terminal 22a of the conductive sheet member 22. Positioning member 24
Is provided. The positioning member 24 is disposed in the recess 10c of the base 10, as shown in FIGS.

The plate-shaped positioning member 24 is made of, for example, an aluminum alloy material, and accommodates the object to be inspected at a position facing the terminal portion 22a of the conductive sheet member 22, as shown in FIGS. Substantially square opening 2 as part
4a. An arc portion is formed at each corner of the periphery of the opening 24a. In addition, the above-described positioning pins 52 are provided at four places around the opening 24a.
Are provided in the through holes 24b.

Thus, the positioning of the electrode 26a of the semiconductor element 26 mounted in the opening 24a with respect to the terminal 22a of the conductive sheet member 22 can be performed with high accuracy.

The base 10 is made of, for example, an amorphous polymer containing a predetermined amount of glass fiber, polyether sulfone (PES). The base 10 may be made of polyetherimide (PEI) or an aluminum alloy material.

As shown in FIGS. 3 and 4, the base 10 has a semiconductor element 26 and a pressing body 34 at the center thereof.
Has an opening 10h through which the front end passes. Opening 1
0h communicates with the recess 10c. The opening 10
The periphery of h is chamfered.

At one side end of the base 10, FIG.
And the connecting portion 1 of the guide member 12 as shown in FIG.
Connection support portion 10F to which 2F is rotatably connected.
Is provided. The two connecting support portions 10F are connected so as to be sandwiched between the two connecting portions 12F of the guide member 12. Each connection support portion 10F has a through hole 10f into which the support shaft 48 is inserted. The central axis of the through hole 10f is parallel to the printed wiring board 6 and the board 20 in FIG. 1 and extends in a direction perpendicular to the plane of the drawing. Accordingly, each of the connection support portions 10F supports the support shaft 48 with a relatively long mutual distance.

A slope 10s is formed between the connection supporting portions 10F so as to extend obliquely downward from left to right in FIG. When the rotating plate 14 is in the maximum open state, the outer peripheral surface of the rotating plate 14 is brought into contact with the slope portion 10s as shown in FIG.

Further, at the other side end of the base 10, as shown in FIGS. 1 and 5, an engaged portion 10e with which an engaging portion 18b of a hook member 18 described later is engaged is provided. Have been. The angle α of the tip of the hook-shaped engaged portion 10e with respect to the vertical straight line is set to, for example, about 80 degrees, which is smaller than 90 degrees.

The base 10 is fastened to the pressure receiving plate 33 via the substrate 20 by bolts Bo provided at four places around the opening 10h. Each bolt Bo is mounted on the base 1
It is screwed into the female screw hole 33a of the pressure receiving plate 33 via the counterbore 10b, the through hole 10a, and the through hole 20a of the substrate 20.

The pressure receiving plate 33 is formed in a plate shape from, for example, an aluminum alloy material. The lengths of the short side and the long side of the pressure receiving plate 33 are set substantially equal to the lengths of the short side and the long side of the base 10. By providing the pressure receiving plate 33 in this manner, the substrate 20 is reinforced even when the pressing force of the pressing body 34 described later is relatively large, and the bending of the substrate 20 is avoided.

As shown in FIGS. 5 and 6, the guide member 12 made of the same material as the base 10 is located at a position facing the opening 24a of the positioning member 24 and is larger than the opening 24a. It has a substantially square guide hole 12a. When the guide member 12 takes a position close to and opposed to the semiconductor element 26 mounted in the opening 24a, the guide hole 1
2a, the central axis is the pressed surface 26 of the semiconductor element 26;
It is formed so as to intersect substantially perpendicularly to a.

At a position corresponding to the connection support portion 10F of the base 10 in the guide member 12, a pair of connection ends 12F connected via a support shaft 48 with the connection support portion 10F interposed therebetween are opposed to each other at a predetermined position. They are provided at intervals. Each connection end 12F has a through hole 12f into which the support shaft 48 is inserted on a common central axis with the through hole 10f of the connection support portion 10F. Also, a pair of connecting ends 12F of the guide member 12
A concave portion 12g with which one end of the coil spring 42 is engaged is provided on one end side opposite to.

Rotating plate 14 made of the same material as base 10
As shown in FIGS. 1 and 3, the guide member 12 has an opening 14a having a side larger than one side of the guide hole 12a at a position facing the guide hole 12a of the guide member 12. At positions corresponding to the pair of connection support portions 10F of the base 10 on the rotating plate 14, as shown in FIG.
F are opposed to each other and are provided at a predetermined interval. Each connection end 14F is rotatably connected between a pair of connection support portions 10F of the base 10, and a common center axis of the through hole 14f into which the support shaft 48 is inserted is formed. It has correspondingly.

Thus, the connecting end 14F of the rotating plate 14
Is mounted on the base 10 via the support shaft 48 together with the guide member 12.
Is rotatably supported by the connection support portion 10F.

At the center of the support shaft 48 in the axial direction, FIG.
As shown in FIG. 5 and FIG. 5, the rotating plate 14 and the guide member 12 are respectively moved clockwise in FIG.
A coil spring 40 that urges the rotating plate 14 in a direction to be opened is wound. One end of the coil spring 40 is locked to the rotating plate 14, and the other end is connected to the base 10.
It is locked to. As shown in FIGS. 5 and 7, the base 10 has a notch 10 k facing the coil spring 40 in order to facilitate the assembly of the coil spring 40.

As shown in FIG. 1 and FIG. 3, one end of the rotating plate 14 facing the connecting end 14F
A recess 14e is formed. A hook member 18 for selectively fixing the rotating plate 14 to the base 10 is provided in the concave portion 14e. A through hole 14h into which both ends of the support shaft 44 are press-fitted is formed in a peripheral portion of the concave portion 14e in the rotating plate 14.
Are provided opposite to each other.

The support shaft 44 is disposed substantially parallel to one end face of the support shaft 48 and the rotary plate 14.

As shown in FIGS. 1 and 9, the hook member 18 has one end portion of the engaged portion 10 of the base 10.
e has an engaging portion 18b to be engaged with the e. An angle β formed between the tip of the hook-shaped engaging portion 18b and a vertical straight line is set to, for example, about 80 degrees. Thereby, when the engaging portion 18b of the hook member 18 is engaged with the engaged portion 10e of the base 10, the engaged state is ensured, and the hook member 18
Is prevented from being undesired.

The hook member 18 has a through hole 18a at the other end into which the support shaft 44 is inserted. A recess 18c is formed in the other end of the hook member 18 for accommodating a coil spring 46 to be described later. In addition, the concave portion 18c communicates with each through hole 18a. A forked protrusion 18 e with which the opening / closing operation member 4 is selectively engaged is formed at the tip of the other end of the hook member 18.

As a result, the hook member 18 is rotatably supported by the support shaft 44 whose both ends are supported by the rotating plate 14.

A coil spring 46 wound around the outer periphery of the support shaft 44 is provided in the recess 18c at the other end of the hook member 18. Coil spring 46
Is engaged with the inner wall surface forming the concave portion 18c, and the other end of the coil spring 46 is engaged with the inner wall surface forming the concave portion 14e of the rotating plate 14. Therefore, the hook member 18 is engaged with the base 10 by the urging force of the coil spring 46 such that the engaging portion 18b of the hook member 18 changes from the state shown by the two-dot chain line in FIG. It is urged in a direction to be engaged with the joint 10e.

As shown in FIG. 1, a recess 14 with which the other end of the coil spring 42 is engaged is located at a position on the rotating plate 14 facing the recess 12g of the guide member 12.
b is provided. The coil spring 42 biases the rotating plate 14 and the guide member 12 in a direction away from each other. Thereby, the engaging portion 1 of the hook member 18
8b is disengaged from the engaged portion 10e of the base 10, one end of the rotating plate 14 and one end of the guide member 12 are connected by a coil spring 42, and the rotating plate 14 And one end of the guide member 12 are separated from each other.

Further, the opening 14a in the rotating plate 14
, A pressing member support 16 pivotally supported by a pair of support shafts 50 disposed on the same common axis is disposed at a predetermined interval from the entire peripheral edge of the opening 14a. As shown in FIG. 3, one end of each support shaft 50 is rotatably engaged with the long hole 14ha of the rotary plate 14, respectively. The long hole 14ha extends substantially parallel to the center axis of the support shaft 44 so as to face the peripheral edge of the opening 14a. As shown in FIG. 8, the other end of each support shaft 50 is connected to the support shaft 4 in the pressing member support 16.
4 is screwed into the nut 51 through a through hole 16 d provided substantially parallel to the center axis of the nut 4. Each nut 51
Are press-fitted into slits 16e provided near the through holes 16d of the pressing member support 16, respectively.

The pressing member support 16 formed of the same material as the material of the rotating plate 14 has a through hole 16b at a substantially central portion of the upper portion thereof.

As shown in FIGS. 1 and 6, an opening 16g into which the pressing body 34 is inserted is formed at the lower end of the pressing member support 16. On the periphery of the opening 16g,
The claw portions 16n with which the flanges of the pressing body 34 are engaged are formed to face each other. The two claw portions 16n are respectively provided at three predetermined positions on a straight line at predetermined intervals. Also,
A communication portion 16m is formed between the opening 16g and the through hole 16b to allow the opening 16g to communicate with the through hole 16b.

As shown in FIGS. 1 and 4, the communication portion 16m is provided with a cylindrical spring receiving guide member 28 and a spring receiving member 30. The flange provided at one end of the spring receiving guide member 28 has its center axis aligned with the center of the through hole 16b, and the communication portion 16d
Is engaged with the uppermost end. A shaft portion of the spring receiving member 30 is slidably supported on an inner peripheral portion of the spring receiving guide member 28.

A coil spring 36 is wound around the outer periphery of the cylindrical portion of the spring receiving guide member 28.
Both ends of the coil spring 36 are supported by a flange of the spring receiving guide member 28 and a step of the spring holding portion of the spring receiving member 30, respectively.

The spring holding portion of the spring receiving member 30 has a concave portion 32a in which the ball 32 is disposed.
Ball 3 arranged to be rotatable within substantially conical recess 32a
A part of the spherical portion of 2 protrudes from the spring receiving member 30.

A part of the spherical portion of the ball 32 is
Are engaged with a substantially hemispherical concave portion provided at a substantially central portion of a portion facing the spring receiving member 30 in FIG.

As a result, a predetermined gap is formed between the spring holding portion of the spring receiving member 30 and the portion of the pressing body 34 surrounding the spring receiving member 30, as shown in FIG. .

As shown in FIG. 1, a positioning member 2 is provided at a portion of the pressing body 34 facing the semiconductor element 26.
4 is provided with a pressing portion 34a inserted into the opening 24a. The pressing body 34 is made of, for example, an aluminum alloy material. The flange of the pressing body 34 is
6 are selectively engageable with the claw portions 16n.

Therefore, as shown in FIG. 1, it is assumed that the center axis Y of the shaft of the spring receiving member 30 is assembled at a predetermined angle and the center axis Y becomes the center axis Y '. However, as long as the spring receiving member 30 does not interfere with the pressing body 34, the spring receiving member 30 can move the ball 32 even if the posture of the spring receiving member 30 is tilted.
, And does not affect the attitude of the pressing body 34.

At this time, the urging force of the coil spring 36 is uniformly applied to the pressing portion 34a of the pressing body 34 via the ball 32. The pressing surface of the pressing portion 34a is substantially perpendicular to the center axis of the guide hole 12a.

The spring receiving member 3 in the pressing body 34
When the rotating plate 14 is opened, the flanges connected to the portion opposing the zero are respectively engaged with the claws 16n by the action of the urging force of the coil spring 36.

On the other hand, as shown in FIG.
Is closed, the flange of the pressing body 34 is
With a predetermined gap.

Accordingly, in such a configuration, the pressing member support 16 including the pressing body 34 is
Is made to be in a fastening state or a non-fastening state with respect to the nut 51, it can be easily replaced with a new pressing member support including a coil spring having a different spring constant.

When inspecting the semiconductor element 26 with this configuration, first, the rotating plate 14 is turned upside down as shown by a two-dot chain line in FIG.
6 is attached to the opening 24 a of the positioning member 24.

At this time, the end of the rotating plate 14 is
The semiconductor element 26 is automatically brought into contact with the opening 24 a of the positioning member 24 because the pressing member support 16 including the pressing body 34 is in contact with the slope 10 s of the positioning member 24. , And can be easily mounted.

Next, as shown by a two-dot chain line in FIG.
When the rotating plate 14 is pressed in the direction shown by the arrow L against the urging force of the coil spring 40 by the opening / closing operation member 4, the guide member 1 is moved from the inverted state to the rotating plate 14.
It is rotated in the direction approaching toward the positioning member 24 with 2. At this time, the pressing member support 16 is
Is rotated around the support shaft 50 while being guided by the guide holes 12a of the guide member 12 along with the rotation of.

Subsequently, when the rotating plate 14 is further rotated, the end surface of the pressing member support 16 is guided by the guide holes 12a of the guide member 12 with respect to the center of the rotating trajectory of the rotating plate 14. The pressing portion 34 of the pressing body 34
The semiconductor element 26 is evenly pressed by the pressing portion 34a of the pressing body 34 in a state where the pressing surface a and the pressed surface 26a of the semiconductor element 26 are substantially parallel to each other.

At this time, the engaging portion 18b of the hook member 18 is engaged with the engaged portion 10e by the urging force of the coil spring 46, and the rotating plate 14 is fixed to the base 10. Becomes Further, the terminal portion 22a of the conductive sheet member 22 is pressed to be in a conductive state. Thus, the electrode 26a of the semiconductor element 26 and the electrode group 2 of the substrate 20
0B is electrically connected.

Then, in a predetermined atmosphere, the test voltage is applied to the substrate 2 via the input / output unit 6A of the printed wiring board 6.
0 is supplied to perform the test. Further, a potential defect of the semiconductor element 26 is determined by a diagnostic device (not shown) based on an output signal obtained from the input / output unit 6A.

Therefore, the semiconductor element 26 can be positioned
During the series of steps from the mounting of the semiconductor device 26 to the terminal portion 22a of the conductive sheet member 22 after the mounting of the semiconductor device 26 into the opening portion 24a, the pressing portion 34a of the pressing body 34 By uniformly applying pressure to the electrodes 26, an undesired shearing force does not act between each electrode of the semiconductor element 26 and the terminal portion 22a of the conductive sheet member 22. As a result, the semiconductor element 26
This prevents the electrodes from being damaged. Moreover, the use of the conductive sheet member 22 makes it possible to easily perform a test on a semiconductor element having high-density terminals.

After the inspection of the semiconductor element 26 is completed, the opening / closing member 4 abutting on the projection 18e of the hook member 18 is moved in the direction indicated by the arrow UL, so that the projection 18e of the hook member 18 is moved by the coil spring. By rotating clockwise around the support shaft 44 against the urging force of the engagement member 46, the engagement portion 18b of the hook member 18
0e is disengaged. And the rotating plate 14
The guide member 12 is returned to the original state by the urging force of the coil spring 40, as shown by the two-dot chain line in FIG.

[0073]

As is apparent from the above description, according to the inspection apparatus of the present invention, the pressure on the object to be inspected so that the terminal of the object to be inspected arranged on the substrate is brought into contact with the contact point of the substrate. Since the pressing member support for supporting the pressing member having the pressing surface for pressing the surface with a predetermined pressure is detachably provided on the rotating member, the pressing member can be replaced, and as a result, the terminal of the inspection object can be replaced. The pressing force applied to the inspection object can be easily increased or decreased according to the number.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a main part of an example of an inspection apparatus according to the present invention.

FIG. 2 is a configuration diagram schematically showing an overall configuration of an example of an inspection device according to the present invention.

FIG. 3 is a plan view of the example shown in FIG. 1;

FIG. 4 is a cross-sectional view of the example shown in FIG. 1 as viewed from the side.

FIG. 5 is a plan view of the example shown in FIG. 1;

FIG. 6 is a plan view of a guide member in the example shown in FIG.

FIG. 7 is a bottom view of the base and the positioning member in the example shown in FIG.

FIG. 8 is a partial sectional view of a pressing member support in the example shown in FIG. 1;

FIG. 9 is a front view showing a hook member in the example shown in FIG. 1;

FIGS. 10A, 10B, and 10C are a plan view, a side view, and a bottom view, respectively, of an inspection object in an example of an inspection apparatus according to the present invention.

FIGS. 11A, 11B, and 11C are cross-sectional views each showing a conductive sheet member used in an example of the inspection apparatus according to the present invention.

[Explanation of symbols]

 Reference Signs List 6 printed wiring board 10 base 14 rotating plate 16 pressing member support 20 substrate 22, 60, 62 conductive sheet member 33 pressure receiving plate 34 pressing member

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Daisuke Yamada 2-11-24 Tsukiji, Chuo-ku, Tokyo FSR term in JSR Corporation (reference) 2G003 AA07 AC04 AG07 AG12 2G011 AA01 AB01 AB08 AC14 AC21 AC31 AD01 AE11 AF01 5E024 CA19 CB06

Claims (4)

[Claims] A contact electrically connected to a terminal of an inspection object having an electronic circuit therein, and an input / output terminal portion to which an input signal is input and an output signal from the inspection object is transmitted. A base on which a substrate is provided; a rotating member having one end rotatably supported by the base and arranged at a position close to or away from the substrate; detachable from the rotating member And a pressing member supporting a pressing member having a pressing surface for pressing a pressed surface portion of the inspection object so as to contact a terminal of the inspection object arranged on the substrate and a contact point of the substrate. An inspection apparatus comprising: a body; and a pressure receiving member connected to the base via the substrate and receiving a pressing force by the pressing member. 2. When the rotating member is rotated along with the rotating member and takes a position close to the substrate, the posture of the pressing surface of the pressing member is changed to the pressed surface portion of the inspection object. The inspection device according to claim 1, further comprising a guide member having a guide portion for guiding the pressing member support so as to be relatively movable so as to be kept substantially parallel to the inspection member. 3. A conductive sheet member for selectively conducting between a contact of the substrate and a terminal of the object to be inspected is provided between the contact of the substrate and the terminal of the object to be inspected. The inspection device according to claim 1, wherein: 4. A contact electrically connected to a terminal of an inspection object having an electronic circuit therein, and an input / output terminal portion to which an input signal is input and an output signal from the inspection object is transmitted. A first board disposed on the base, and a connector section disposed on the base and electrically connected to an input / output terminal section of the first board, and supplying the input signal. And a second substrate.
Inspection device as described.