JP2001081319A - Polyamide resin composition - Google Patents

Abstract

(57) [Problem] To provide a polyamide resin composition having excellent slidability and excellent in various properties such as heat resistance, low water absorption and chemical resistance. SOLUTION: Terephthalic acid unit is 60 to 100 mol%.
40 to 99.9 parts by weight of a polyamide resin (I) comprising a dicarboxylic acid unit (a) to be contained and a diamine unit (b) containing 60 to 100 mol% of an aliphatic alkylenediamine unit having 6 to 18 carbon atoms, and aramid Particle (II)
The above problem is solved by a polyamide resin composition comprising 60 to 0.1 parts by weight.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a polyamide resin composition and a molded article comprising the same. The polyamide resin composition of the present invention has extremely excellent sliding properties, and further has excellent properties such as heat resistance, low water absorption and chemical resistance. material,
It is useful as a material for industrial materials. Among them, it can be used particularly effectively for applications requiring slidability.

[0002]

2. Description of the Related Art In recent years, the replacement of metal parts with resin parts has been actively studied for the purpose of weight reduction and cost reduction, and gears, bearings, cams, bearings, pistons and rotors requiring slidability are being studied. It has been applied and put to practical use for parts such as.
Conventionally, aliphatic polyamides, polyacetals, fluororesins, and the like are known as resins used in such applications, and additives such as solid lubricants, lubricating oils, carbon fibers, aramid fibers, and glass fibers are added to these resins. And resin compositions in which reinforcing agents such as whiskers are blended.

[0003] However, the above resins and resin compositions can be used without problems under relatively low load and low speed friction and wear conditions. It has the drawback that it tends to be worn and cannot be used after being melted due to frictional heat.
Furthermore, the heat resistance of these resins and resin compositions cannot be said to be sufficiently high, and in a high-temperature atmosphere, not only the slidability of the molded article made of the above resin or resin composition, but also the mechanical performance is reduced. There is a problem.

Under such circumstances, in recent years, nylon 46 obtained by polycondensation of adipic acid and 1,4-butanediamine has been proposed and some of them have been put to practical use. However, although the molded product made of nylon 46 has improved slidability and heat resistance as compared with the conventional molded product made of the above resin, it has been pointed out that the slidability and dimensional stability are reduced by water absorption. In fact, further improvement in slidability has been demanded.

[0005] Further, an attempt has been made to achieve both heat resistance and slidability by blending a fibrous filler such as aramid fiber, glass fiber, carbon fiber, and boron fiber with semi-aromatic polyamide (Japanese Patent Publication No. No. 64-11073), but the slidability is still not sufficient.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a polyamide resin composition having excellent sliding properties and excellent properties such as heat resistance, low water absorption and chemical resistance. Is to do.

[0007]

Means for Solving the Problems The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, a polyamide resin composition comprising a specific semi-aromatic polyamide and aramid particles mixed in a specific ratio, The inventors have found that they have extremely excellent sliding properties and are excellent in various properties such as heat resistance, low water absorption and chemical resistance, and have completed the present invention.

That is, the present invention relates to a dicarboxylic acid unit (a) containing 60 to 100 mol% of a terephthalic acid unit and an aliphatic alkylenediamine unit having 6 to 18 carbon atoms.
Polyamide resin composition comprising 40 to 99.9 parts by weight of polyamide resin (I) comprising diamine unit (b) containing from 100 to 100 mol% and 60 to 0.1 parts by weight of aramid particles (II), and molded article comprising the same About.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. The polyamide resin (I) used in the present invention comprises a dicarboxylic acid unit (a) containing 60 to 100 mol% of terephthalic acid units and a diamine containing 60 to 100 mol% of aliphatic alkylenediamine units having 6 to 18 carbon atoms. Unit (b). When the content of the terephthalic acid unit is less than 60 mol%, the heat resistance of the obtained polyamide resin composition is reduced, and when the content of the aliphatic alkylenediamine unit having 6 to 18 carbon atoms is less than 60 mol%. In addition, the slidability, heat resistance, low water absorption, chemical resistance and the like of the obtained polyamide resin composition are reduced.

The content of the terephthalic acid unit in the above dicarboxylic acid unit (a) includes heat resistance, low water absorption,
From the viewpoint of chemical resistance, the range is preferably from 75 to 100 mol%, more preferably from 90 to 100 mol%.
The content of the aliphatic alkylenediamine unit having 6 to 18 carbon atoms in the diamine unit (b) is preferably from 75 to 1 from the viewpoints of slidability, heat resistance, low water absorption, and chemical resistance.
It is preferably within the range of 00 mol%, more preferably within the range of 90 to 100 mol%.

The above-mentioned dicarboxylic acid unit (a) may contain other dicarboxylic acid units other than terephthalic acid unit as long as it is 40 mol% or less. The other dicarboxylic acid units include malonic acid, dimethylmalonic acid, succinic acid, glutaric acid, adipic acid, 2-methyladipic acid, trimethyladipic acid, pimelic acid, 2,2-dimethylglutaric acid, 3,3- Aliphatic dicarboxylic acids such as diethylsuccinic acid, azelaic acid, sebacic acid and suberic acid; 1,3-
Alicyclic dicarboxylic acids such as cyclopentanedicarboxylic acid and 1,4-cyclohexanedicarboxylic acid; isophthalic acid;
2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,
4-phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, diphenic acid, dibenzoic acid, 4,4′-oxydibenzoic acid, diphenylmethane-4,4′-dicarboxylic acid, diphenylsulfone-4,4 Units derived from aromatic dicarboxylic acids such as' -dicarboxylic acid and 4,4'-biphenyldicarboxylic acid;
One or more of these can be included. Of these, units derived from aromatic dicarboxylic acids are preferred. The content of these other dicarboxylic acid units is preferably 25 mol% or less, preferably 1 mol% or less.
More preferably, it is 0 mol% or less. Further, a unit derived from a polycarboxylic acid such as trimellitic acid, trimesic acid, and pyromellitic acid can be included in a range where melt molding is possible.

The aliphatic alkylenediamine unit having 6 to 18 carbon atoms includes, for example, 1,6-hexanediamine, 1,7-heptanediamine, 1,8-octanediamine, 1,9-nonanediamine, Linear aliphatic alkylenediamines such as 10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine;
1-butyl-1,2-ethanediamine, 1,1-dimethyl-1,4-butanediamine, 1-ethyl-1,4-butanediamine, 1,2-dimethyl-1,4-butanediamine, 1, 3-dimethyl-1,4-butanediamine,
1,4-dimethyl-1,4-butanediamine, 2,3-
Dimethyl-1,4-butanediamine, 2-methyl-1,
5-pentanediamine, 3-methyl-1,5-pentanediamine, 2,5-dimethyl-1,6-hexanediamine, 2,4-dimethyl-1,6-hexanediamine,
3,3-dimethyl-1,6-hexanediamine, 2,2
-Dimethyl-1,6-hexanediamine, 2,2,4-
Trimethyl-1,6-hexanediamine, 2,4,4-
Trimethyl-1,6-hexanediamine, 2,4-diethyl-1,6-hexanediamine, 2,2-dimethyl-
1,7-heptanediamine, 2,3-dimethyl-1,7
-Heptanediamine, 2,4-dimethyl-1,7-heptanediamine, 2,5-dimethyl-1,7-heptanediamine, 2-methyl-1,8-octanediamine, 3-
Methyl-1,8-octanediamine, 4-methyl-1,
8-octanediamine, 1,3-dimethyl-1,8-octanediamine, 1,4-dimethyl-1,8-octanediamine, 2,4-dimethyl-1,8-octanediamine, 3,4-dimethyl- 1,8-octanediamine,
4,5-dimethyl-1,8-octanediamine, 2,2
-Dimethyl-1,8-octanediamine, 3,3-dimethyl-1,8-octanediamine, 4,4-dimethyl-
Examples include units derived from branched aliphatic alkylenediamines such as 1,8-octanediamine and 5-methyl-1,9-nonanediamine, and one or more of these units may be used. it can.

Among the above aliphatic alkylenediamine units, from the viewpoint of low water absorption and light weight, 1,6-hexanediamine, 1,8-octanediamine and 2-methyl-diamine are preferred.
1,8-octanediamine, 1,9-nonanediamine,
Units derived from 1,10-decanediamine, 1,11-undecanediamine, and 1,12-dodecanediamine are preferred, and 1,9-nonanediamine units and / or 2-methyl-1,8-octanediamine units are more preferred. preferable. When 1,9-nonanediamine unit and 2-methyl-1,8-octanediamine unit are used in combination,
The molar ratio of 1,9-nonanediamine unit: 2-methyl-1,8-octanediamine unit is 99: 1 to 20:80.
The ratio is preferably 99: 1 to 60:40, and more preferably 99: 1 to 80:20. When a polyamide resin containing 1,9-nonanediamine unit and 2-methyl-1,8-octanediamine unit in the above ratio is used, sliding property, heat resistance, moldability, low water absorption and light weight are excellent. A polyamide resin composition is obtained.

The above diamine unit (b) is 40 mol%
If it is below, it may contain other diamine units other than the aliphatic alkylenediamine unit having 6 to 18 carbon atoms. Examples of the other diamine unit include aliphatic diamines such as ethylenediamine, propylenediamine, and 1,4-butanediamine; alicyclic rings such as cyclohexanediamine, methylcyclohexanediamine, isophoronediamine, norbornanedimethylamine, and tricyclodecanedimethylamine. Formula diamine: p-phenylenediamine, m-phenylenediamine, p-xylylenediamine, m-xylylenediamine, 4,4′-diaminodiphenylmethane,
Examples include units derived from aromatic diamines such as 4,4'-diaminodiphenyl sulfone and 4,4'-diaminodiphenyl ether, and one or more of these units can be used. The content of these other diamine units is preferably 25 mol% or less, more preferably 10 mol% or less.

The polyamide resin (I) used in the present invention
It is preferable that 10% or more of the terminal groups of the molecular chain are blocked with a terminal blocking agent. The ratio of the terminal groups being blocked (terminal blocking ratio) is more preferably 40% or more, and even more preferably 70% or more. When a polyamide resin having an end capping rate of 10% or more is used, a polyamide resin composition excellent in melt stability, hot water resistance and the like can be obtained.

The terminal capping rate of the polyamide resin (I) is determined by measuring the number of carboxyl group terminals, amino group terminals, and the number of terminals capped by the terminal capping agent, respectively, in the polyamide resin. ). The number of each terminal group is determined by ¹ H-NMR from the integrated value of the characteristic signal corresponding to each terminal group.
It is preferable in terms of simplicity. Terminal blocking ratio (%) = [(AB) / A] × 100 (1) [wherein A represents the total number of molecular chain terminal groups (this is usually equal to twice the number of polyamide molecules). , B represents the total number of carboxyl group terminals and amino group terminals. ]

The terminal capping agent is not particularly limited as long as it is a monofunctional compound having reactivity with the amino group or carboxyl group at the terminal of the polyamide resin. , A monocarboxylic acid or a monoamine is preferred, and a monocarboxylic acid is more preferred from the viewpoint of easy handling. In addition, acid anhydrides such as phthalic anhydride, monoisocyanates, monoacid halides, monoesters, and monoalcohols can also be used.

The monocarboxylic acid used as the terminal blocking agent is not particularly limited as long as it has reactivity with an amino group. For example, acetic acid, propionic acid, butyric acid,
Valeric acid, caproic acid, caprylic acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearic acid,
Aliphatic monocarboxylic acids such as pivalic acid and isobutyric acid; alicyclic monocarboxylic acids such as cyclohexanecarboxylic acid; benzoic acid, toluic acid, α-naphthalenecarboxylic acid, β-
Naphthalene carboxylic acid, methyl naphthalene carboxylic acid,
Examples thereof include aromatic monocarboxylic acids such as phenylacetic acid, and arbitrary mixtures thereof. Among them, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearin Acids and benzoic acid are preferred.

The monoamine used as the terminal blocking agent is not particularly limited as long as it has reactivity with a carboxyl group, and examples thereof include methylamine, ethylamine, propylamine, butylamine, hexylamine,
Aliphatic monoamines such as octylamine, decylamine, stearylamine, dimethylamine, diethylamine, dipropylamine and dibutylamine; alicyclic monoamines such as cyclohexylamine and dicyclohexylamine;
Examples thereof include aromatic monoamines such as aniline, toluidine, diphenylamine, and naphthylamine, and arbitrary mixtures thereof. Among these, butylamine, hexylamine, octylamine, decylamine, stearylamine, cyclohexylamine, and aniline are preferred from the viewpoints of reactivity, high boiling point, stability of a sealed terminal, and price.

The polyamide resin (I) used in the present invention
Can be produced using any method known as a method for producing a crystalline polyamide. For example,
A polymerization method such as a solution polymerization method or an interfacial polymerization method using an acid chloride and a diamine as raw materials, a melt polymerization method using a dicarboxylic acid and a diamine as raw materials, a solid phase polymerization method, and a melt extruder polymerization method can be used.

The polyamide resin (I) is prepared, for example, by adding a diamine, a dicarboxylic acid, a catalyst and, if necessary, a terminal blocking agent at a time to produce a nylon salt.
A prepolymer having an intrinsic viscosity [η] of 0.1 to 0.6 dl / g by heat polymerization at a temperature of 250 ° C., and further produced by solid phase polymerization or polymerization using a melt extruder. Can be. When the intrinsic viscosity [η] of the prepolymer is in the range of 0.1 to 0.6 dl / g, deviation of the molar balance between carboxyl groups and amino groups and lowering of the polymerization rate in the subsequent polymerization stage are small, and A polyamide resin having a small molecular weight distribution and excellent in various physical properties and moldability can be obtained. When the final stage of the polymerization is carried out by solid phase polymerization, it is preferable to carry out the reaction under reduced pressure or under an inert gas flow. The polymerization temperature at this time is preferably in the range of 200 to 280 ° C. When the polymerization is performed under such conditions, the polymerization rate is high, the productivity is excellent, and coloring and gelation can be effectively suppressed. The polymerization temperature in the case where the final stage of the polymerization is carried out by a melt extruder is preferably 370 ° C. or lower. When the polymerization is carried out under such conditions, a polyamide resin with almost no decomposition or deterioration of the polyamide resin is obtained.

In producing the polyamide resin (I), for example, phosphoric acid, phosphorous acid, hypophosphorous acid, a salt or ester thereof, etc. may be added as a catalyst in addition to the terminal blocking agent. Can be. As the above salts or esters, phosphoric acid, phosphorous acid or hypophosphorous acid and potassium, sodium, magnesium, vanadium, calcium, zinc, cobalt, manganese, tin, tungsten,
Salts with metals such as germanium, titanium and antimony; ammonium salts of phosphoric acid, phosphorous acid or hypophosphorous acid; ethyl ester, isopropyl ester, butyl ester, hexyl ester of phosphoric acid, phosphorous acid or hypophosphorous acid , Isodecyl ester, octadecyl ester, decyl ester, stearyl ester, phenyl ester and the like.

The polyamide resin (I) used in the present invention
Is preferably in the range of 0.6 to 3.0 dl / g, more preferably in the range of 0.7 to 2.5 dl / g, and 0.8 to 3.0 dl / g. 2.0 dl /
More preferably, it is within the range of g. The intrinsic viscosity is 0.
If it is less than 6 dl / g, the mechanical properties of the resulting polyamide resin composition tend to be impaired, and
If it is larger than / g, the fluidity of the obtained polyamide resin composition tends to decrease, and moldability tends to deteriorate. The above intrinsic viscosity is a value measured in concentrated sulfuric acid at 30 ° C.

Aramid particles (II) used in the present invention
Are particles of an aramid resin comprising an aromatic dicarboxylic acid unit and an aromatic diamine unit. The above-mentioned aramid resin can be produced by a condensation reaction between an acid halide of an aromatic dicarboxylic acid and an aromatic diamine.

The acid halides of aromatic dicarboxylic acids include terephthaloyl chloride, 4,4'-dibenzoyl chloride, 2-chloroterephthaloyl chloride, 2,5-dichloroterephthaloyl chloride,
Methyl-terephthaloyl chloride, 2,6-naphthalenedicarboxylic acid chloride, 1,5-naphthalenedicarboxylic acid chloride, isophthaloyl chloride, 3,
Examples thereof include 3′-dibenzoyl chloride and 3,4′-dibenzoyl chloride, and one or more of these can be used.

As the aromatic diamine, p-phenylenediamine, 4,4'-diaminobiphenyl, 2-methyl-p-phenylenediamine, 2-chloro-p-phenylenediamine, 2,6-naphthalenediamine, 1,5 -Naphthalenediamine, m-phenylenediamine, 3,3 '
-Diaminobiphenyl, 3,4'-diaminobiphenyl, 3,3'-oxydiphenylenediamine and the like, and one or more of these can be used.

From the viewpoint of improving the slidability of the polyamide resin composition, the aramid resin is mainly composed of an aromatic dicarboxylic acid unit derived from an acid halide mainly composed of terephthaloyl chloride and p-phenylenediamine. P-phenylene terephthalamide comprising an aromatic diamine unit derived from a diamine represented by the formula:

The content of terephthaloyl chloride in the above-mentioned acid halide mainly composed of terephthaloyl chloride is preferably at least 60 mol%, more preferably at least 80 mol%. When the content of terephthaloyl chloride is less than 60 mol%, the slidability of the polyamide resin composition tends to decrease.

The content of p-phenylenediamine in the above-mentioned diamine containing p-phenylenediamine as a main component is preferably 60 mol% or more.
More preferably, it is 0 mol% or more. When the content of p-phenylenediamine is less than 60 mol%, the slidability of the polyamide resin composition tends to decrease.

The average particle size of the aramid particles (II) is preferably in the range of 10 to 200 μm from the viewpoint of improving the slidability of the polyamide resin composition.
More preferably, it is within the range of 0 to 180 μm. When the average particle diameter of the aramid particles (II) is less than 10 μm, the sliding property of the molded article obtained from the polyamide resin composition may not be improved so much, while when it exceeds 200 μm, the mechanical performance of the polyamide resin composition May decrease.

The polyamide resin composition of the present invention comprises 40 to 99.9 parts by weight of polyamide resin (I) and 60 to 0.1 parts by weight of aramid particles (II). When the content of the aramid particles (II) is less than 0.1 parts by weight, the slidability of the obtained polyamide resin composition is not improved, and when it exceeds 60 parts by weight, the obtained polyamide resin composition is obtained. The mechanical performance of The polyamide resin composition of the present invention preferably comprises 50 to 99 parts by weight of the polyamide resin (I) and 50 to 1 part by weight of the aramid particles (II) from the viewpoint of further improving the slidability and mechanical performance. 60 to 98 parts by weight of resin (I) and aramid particles (I
I) It is more preferably composed of 40 to 2 parts by weight.

The polyamide resin composition of the present invention may contain, if necessary, a fibrous filler such as glass fiber, carbon fiber, boron fiber, aramid fiber, liquid crystal polyester fiber, potassium titanate whisker, silica, silica alumina, Additives such as powdered fillers such as alumina, talc, graphite, titanium dioxide, molybdenum disulfide, and polytetrafluoroethylene, and various lubricating oils may be blended. When these additives are blended at a ratio of 1 to 100 parts by weight with respect to 100 parts by weight of the polyamide resin composition of the present invention, a polyamide resin composition having a more excellent balance of slidability, mechanical properties and moldability can be obtained. can get.

Further, in addition to the above-mentioned additives, the polyamide resin composition of the present invention may further comprise, if necessary, a conventionally known copper-based stabilizer, hindered phenol-based antioxidant, or hindered amine-based antioxidant. , Phosphorus antioxidants, thio antioxidants, colorants, ultraviolet absorbers, light stabilizers, antistatic agents, plasticizers, lubricants, crystal nucleating agents, polyolefins,
Other polymers such as polystyrene may be blended.
Further, the polyamide resin composition of the present invention may contain a conventionally known flame retardant or flame retardant auxiliary, if necessary.

The method for producing the polyamide resin composition of the present invention is not particularly limited, and may be any method capable of uniformly mixing the polyamide resin (I) and the aramid particles (II). It can be manufactured by melt-kneading with other components to be blended accordingly. Melt kneading is performed by a single screw extruder, twin screw extruder, kneader,
Kneading can be performed using a kneading machine such as a Banbury mixer, and the kind of equipment and melt kneading conditions used at that time are not particularly limited, but are kneaded at a temperature within a range of about 300 to 350 ° C. for 1 to 30 minutes. By doing so, the polyamide resin composition of the present invention can be produced.

The polyamide resin composition of the present invention is generally subjected to heat molding such as injection molding, extrusion molding, press molding, blow molding, calender molding, cast molding, etc., depending on the type, application, shape, etc. of the intended molded article. A molded article can be manufactured by molding by the molding method used for the plastic resin composition. Further, a molding method obtained by combining the above-described molding methods can be employed. Further, the polyamide resin composition of the present invention and another polymer can be formed into a composite.

Since the polyamide resin composition of the present invention has excellent slidability, bearings for electric appliances, office machines and power equipment, various gears, cams, bearings, end faces of mechanical seals, valve seats for valves, V ring, rod packing, piston ring, rotary shaft and rotary sleeve of compressor,
It can be used as a material for sliding members such as pistons, impellers, vanes, and rotors.

[0037]

The present invention will be described below in more detail with reference to examples, but the present invention is not limited thereto. In the following Examples and Comparative Examples, preparation or slidability, heat resistance, equilibrium water absorption and chemical resistance of test pieces were evaluated or measured by the following methods.

Preparation of test piece: Using an 80-ton injection molding machine manufactured by Nissei Plastic Industry Co., Ltd., cylinder temperature 330
° C (Examples 1-8, Comparative Example 1), cylinder temperature 290
° C (Comparative Example 2) or cylinder temperature 300 ° C (Comparative Example 3), mold temperature 150 ° C (Examples 1 to 8, Comparative Example 1), mold temperature 80 ° C (Comparative Example 2) or mold temperature 12
Under the condition of 0 ° C. (Comparative Example 3), a test piece for evaluating slidability (80 mm × 80 mm × 3 mm), a test piece for evaluating heat resistance (128 mm × 12.7 mm × 6.2 mm), and chemical resistance JIS No. 1 dumbbell-type test pieces for evaluation were prepared. Further, using a compression molding machine of Shinto Metal Industry Co., Ltd., the temperature was 330 ° C. (Examples 1 to 8, Comparative Example 1), the temperature was 290 ° C. (Comparative Example 2), or the temperature was 300 ° C.
(Comparative Example 3) A press sheet (50 mm × 50) for evaluating equilibrium water absorption under a condition of a press pressure of 100 kg / cm ^2.
mm × 0.2 mm).

Sliding property (limit PV value): Using a test piece prepared by the above method, using a friction and abrasion tester (manufactured by A & D Co., Ltd.) in accordance with JIS K7218. Pressure 10 kg / cm ² , sliding speed 50-200
Under a condition of cm / sec, a limit PV value was measured with respect to a steel material S45C (sandpaper finish) as a mating material.

Heat resistance (weight deflection temperature): Using a test piece prepared by the above method, according to JIS K7207.
Using a weighted strain temperature measuring device (manufactured by Toyo Seiki Seisaku-sho, Ltd.), a weight deflection temperature (D
TUL) was measured and used as an index of heat resistance.

Equilibrium water absorption: The test piece produced by the above method was dried under reduced pressure for 5 days, weighed, immersed in water at 23 ° C. for 10 days, weighed, and immersed in the increased amount before immersion. The equilibrium water absorption was determined by the ratio to the weight.

Chemical resistance: The test piece prepared by the above method was immersed in methyl alcohol at 23 ° C. for 7 days, and then the tensile yield strength was measured using an autograph (manufactured by Shimadzu Corporation). The retention of the test piece before immersion with respect to the tensile yield strength was determined.

In the following Examples and Comparative Examples, the following polyamide resin (I), aramid particles (II), polyamide resin (III) and aramid fiber (IV) were used.

Polyamide resin (I) PA9T: Composed of terephthalic acid unit and 1,9-nonanediamine unit, having a melting point of 317 ° C. and an intrinsic viscosity [η] (measured in concentrated sulfuric acid at 30 ° C.) of 1.0 dl / g. And a polyamide resin having a terminal blocking rate of 90% (terminal blocking agent: benzoic acid).

PA9MT: Terephthalic acid unit and 1,9
-Nonanediamine unit and 2-methyl-1,8-octanediamine unit (1,9-nonanediamine unit: 2-
When the molar ratio of methyl-1,8-octanediamine unit is 9
0:10), having a melting point of 308 ° C., an intrinsic viscosity [η] (measured in concentrated sulfuric acid at 30 ° C.) of 1.0 dl / g,
A polyamide resin having a terminal blocking ratio of 90% (terminal blocking agent: benzoic acid).

PA10T: Terephthalic acid unit and 1,10
Having a melting point of 316 ° C. and an intrinsic viscosity [η] (measured in concentrated sulfuric acid at 30 ° C.) of 1.0 dl
/ G, a polyamide resin having a terminal blocking rate of 90% (terminal blocking agent: benzoic acid).

Aramid particles (II) “Twaron T5011” manufactured by Nippon Aramid Co., Ltd. (average particle diameter: 50 μm)

Polyamide resin (III) PA66: "Leona 1300S" manufactured by Asahi Kasei Corporation

PA46: "STANIL TS30" manufactured by DSMJSR Engineering Plastics Co., Ltd.
0 "

Aramid fiber (IV) "Twaron T1488" (fiber length 2 mm) manufactured by Nippon Aramid Co., Ltd.

Examples 1 to 8 The polyamide resin (I) and the aramid particles (II) shown in Table 1 below were premixed in the proportions shown in Table 1 below, followed by a twin-screw extruder (Nippon Steel Works, Ltd.). "TEX44
C)), melt-kneaded under the condition of a cylinder temperature of 330 ° C., extruded, cooled and cut to produce a pellet-shaped polyamide resin composition. Using the obtained polyamide resin composition, a test piece was prepared by the method described above, and the results of evaluating the slidability, heat resistance, equilibrium water absorption and chemical resistance by the method described above are shown in Table 1 below. .

[0052]

[Table 1]

Comparative Example 1 The polyamide resin (I) and the aramid fiber (IV) shown in Table 2 below were premixed in the proportions shown in Table 2 below, and then a twin-screw extruder (manufactured by Nippon Steel Works, Ltd.) TEX44
C)), melt-kneaded under the condition of a cylinder temperature of 330 ° C., extruded, cooled and cut to produce a pellet-shaped polyamide resin composition. Using the obtained polyamide resin composition, a test piece was prepared by the method described above, and the results of evaluating the slidability, heat resistance, equilibrium water absorption and chemical resistance by the method described above are shown in Table 2 below. .

Comparative Examples 2 and 3 Using the polyamide resin (III) shown in Table 2 below alone, a test piece was prepared by the method described above, and the sliding property, heat resistance,
The results of evaluating the equilibrium water absorption and the chemical resistance by the above-mentioned methods are shown in Table 2 below.

[0055]

[Table 2]

[0056]

According to the present invention, there is provided a polyamide resin composition having extremely excellent sliding properties and excellent properties such as heat resistance, low water absorption and chemical resistance.

Claims (6)

[Claims] 1. A terephthalic acid unit having a content of 60 to 100 mol%
40 to 99.9 parts by weight of a polyamide resin (I) comprising a dicarboxylic acid unit (a) to be contained and a diamine unit (b) containing 60 to 100 mol% of an aliphatic alkylenediamine unit having 6 to 18 carbon atoms, and aramid Particle (II)
A polyamide resin composition comprising 60 to 0.1 parts by weight. 2. The polyamide resin composition according to claim 1, wherein the aramid particles (II) are particles of p-phenylene terephthalamide. 3. The aramid particles (II) having an average particle diameter of 10
The polyamide resin composition according to claim 1, wherein the thickness is from 200 μm to 200 μm. 4. The aliphatic alkylenediamine unit having 6 to 18 carbon atoms is a 1,9-nonanediamine unit and / or a 2-methyl-1,8-octanediamine unit. The polyamide resin composition according to the above. 5. An intrinsic viscosity [η] of the polyamide resin (I).
Is 0.6 to 3.0 dl / g, the polyamide resin composition according to any one of claims 1 to 4. 6. A molded article comprising the polyamide resin composition according to any one of claims 1 to 5.