JP2001073199A - Plating device and plating method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating device which is capable of plating materials to be plated without the generation of pits on their surfaces and a plating method therefor. SOLUTION: A plating tank 2 into which the plating liquid is put is set and the plating liquid is put into the plating tank 2. A supporting rod 6 is placed on a frame supporting part 3 and a frame 4 is hung in the plating tank. A wiring board 5 is set thereto. A lifting device 9 is mounted at the plating tank 2 and a hammer 10 is mounted at the front end thereof. The hammer 10 applies shock oscillation to the wiring board 5 via a frame 4 to desorb the air bubbles sticking to the wiring board 5. Plating may then the executed without the generation of the pits on the surface of the wiring board 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a plating apparatus and a plating method. More specifically, the present invention relates to a plating apparatus and a plating method capable of performing plating so that pits are not generated on the surface of a plating object.

[0002]

2. Description of the Related Art Conventionally, formation of a conductor layer on a wiring board has been proposed as one utilizing plating. This is performed as follows. That is, first, the surface of a substrate formed of an insulating material such as a resin is roughened to have irregularities.
Then, after applying a catalyst to the surface of the substrate, electroless plating is performed. Then, an electroless plating layer is formed on the surface of the substrate. Further, electroplating is performed thereon. Thus, a conductor layer is formed. In the wiring board manufactured in this manner, the surface of the substrate formed in an uneven shape serves as an anchor, and thus the formed conductor layer is not easily peeled off.

[0003]

However, the conventional plating has the following problems. That is, when plating is performed, pits are generated on the surface of the wiring board.
This is because, when the wiring board is immersed in the plating solution, bubbles are attached to the surface of the wiring board, so that the plating solution does not necessarily come into contact with the surface of the wiring board. That is, as shown in FIG. 6, since the surface of the object to be plated 21 is roughened, when the object to be plated 21 is immersed in a plating solution, air becomes air bubbles 24 and deep irregularities on the surface of the object to be plated 21 are generated. It is in a state of being confined in a portion (called a depression 25). Since a plating layer is not generated in this portion, it becomes a pit. Further, in the case of electroplating, hydrogen is generated on the surface of the unevenly-plated object 21, and the hydrogen forms bubbles 24, which similarly causes pits.

The present invention has been made to solve the above problems. That is, an object of the present invention is to provide a plating apparatus and a plating method capable of plating an object to be plated without generating pits on the surface.

[0005]

According to the present invention, there is provided a plating apparatus comprising: a plating tank for supplying a plating solution; a frame for setting an object to be plated in the plating tank; Swinging means for applying a shock swing to the object to be plated through.

In this plating apparatus, the rocking means
Shock swing is applied to the object to be plated via the frame. Then, the air bubbles adhering to the object to be plated are separated by the shock swing. As a result, the plating solution comes into contact with the entire surface of the substrate. Therefore, plating can be performed without generating pits on the surface of the object to be plated.

Further, in the plating method of the present invention, in the plating method in which the object to be plated is immersed in a plating solution, a shock swing is applied to the object to be plated when the object to be plated is immersed in the plating solution. This is a method of removing bubbles attached to the plating.

In this method, when the object to be plated is immersed in the plating solution, a shock swing is applied to the object to be plated. Then, due to the impact, the air bubbles adhering to the surface of the object to be plated are separated from the object to be plated. Accordingly, the plating solution comes into contact with the entirety of the object to be plated, and the surface of the object to be plated is plated to every corner. Therefore, plating can be performed without generating pits on the surface of the object to be plated.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, the configuration of the plating apparatus of the present embodiment will be described.
That is, as shown in FIG. 1, a plating apparatus 1 includes a bathtub-shaped plating tank 2, a frame support 3 attached to both sides of an upper edge thereof, and a frame 4 set on the frame support 3. have. The frame 4 has a substantially rectangular shape, and a Y-shaped support 7 is attached to the lower side of the frame 4 so as to face upward. And
A support bar 6 is provided on the upper side of the frame 4 to be set on the frame support 3. In the plating tank 2,
Two electrodes 8 are mounted parallel to and sandwich the frame 4.

An elevating device 9 using an electromagnet is attached to the plating tank 2, and a hammer 10 for applying a shock swing to the frame 4 is attached to a tip of the elevating device 9. That is, the hammer 10 is moved by the lifting device 9.
On the frame 4 to apply a shock swing to the frame 4. Therefore, in this embodiment, the lifting device 9 and the hammer 10 function as a swinging unit.

The wiring board 5 is formed by the plating apparatus 1 having the above structure.
, A plating solution is put into the plating tank 2. Then, the wiring board 5 is put in the frame 4 and set on the support portion 7. Then, the frame 4 is set on the frame support portion 3 with the support rod 6, and the wiring board 5 is put into the plating tank 2. At this time, the wiring board 5 and the electrode 8 face each other. In addition, power is supplied to the wiring board 5 via the frame support 3.

Next, a method of plating by the plating apparatus 1 having the above configuration will be described. First, the configuration of the wiring board 5 before plating is briefly described with reference to FIG.
In the wiring board 5, the surface of the insulating layer 11 is roughened to have an uneven shape. The surface of the uneven insulating layer 11 is subjected to electroless plating, and the electroless plated layer 12 has an uneven shape along the insulating layer 11.

Next, a process of plating the wiring board 5 having the above-described configuration with the plating apparatus 1 of the present embodiment will be described. First,
First, a plating solution is put into the plating tank 2. Then, the wiring board 5 having the above configuration is suspended above the frame 4, and the wiring board 5 is set on the support portion 7. Then, the wiring board 5 is put into the plating tank 2 by setting the support bar 6 on the frame support portion 3. At this time, the hammer 10 is kept up. Then, a voltage is applied between the wiring board 5 and the electrode 8. However, at this time, the uneven electroless plating layer 1
The air bubbles 14 are confined in the deep part (recess 15) of the surface of the surface 2 (FIG. 3). Therefore, at this time, the hammer 10 is hit on the frame 4 by the lifting device 9. Then, the shock swing is transmitted to the wiring board 5 via the frame 4. Therefore,
The air bubbles 14 confined in the recess 15 are separated from the recess 15 by the shock swing. Then, the plating solution comes into contact with the recess 14 (FIG. 4). Plating is performed in this state. Then, the hammer 10 is raised by the lifting device 9.

However, if the plating is continued as it is, bubbles 14 are generated in the dents 15 and trapped again, as shown in FIG. This is because hydrogen is generated on the surface by the electroplating, and this hydrogen is trapped in the depression 15 as bubbles 14. As a result, if plating is continued in this state, pits will be formed in that portion. Therefore, at this time, the hammer 10 is again struck on the frame 4 by the elevating device 9, and the shock swing is applied to the wiring board 5. Then, the bubbles 14 trapped in the depression 15 are separated from the depression 15 by the shock swing (FIG. 4). Therefore, since the plating solution comes into contact with the depression 15, the surface of the electroless plating layer 12 again comes into contact with the plating solution all over again. Then, the hammer 10 is raised by the lifting device 9. This operation is repeated several times during plating. Then, when the wiring board 5 is sufficiently plated, the frame 4 is removed from the frame support 3 and the wiring board 5 is taken out of the plating tank 2.

According to the above-described plating method, the bubbles 14 are separated from the surface of the electroless plating layer 12 by applying a shock swing to the wiring board 5, so that the surface of the electroless plating layer 12 is plated all over. Contact liquid. Thereby, as shown in FIG. 5, pits are not formed,
The surface of the electroless plating layer 12 is electroplated throughout,
The conductor layer 13 is formed.

As described above in detail, in the present embodiment, by applying a shock swing to the wiring board 4,
Since the bubbles 14 trapped in the depressions 15 on the surface of the electroless plating layer 12 are released, plating can be performed without forming pits. Thus, a plating apparatus and a plating method capable of forming a plating layer without pits are realized.

This embodiment is merely an example.
It does not limit the invention in any way. Accordingly, the present invention can be variously modified and improved without departing from the scope of the invention. For example, the present invention is not limited to electroplating, but can be applied to electroless plating, displacement plating, and the like. Further, the present invention is not limited to a wiring board as an object to be plated, and can be applied.

[0018]

As is apparent from the above description, a plating apparatus and a plating method capable of plating an object to be plated without generating pits on the surface are provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of a plating apparatus according to an embodiment.

FIG. 2 is a view showing a wiring board before plating according to the embodiment.

FIG. 3 is a diagram illustrating a state before applying a shock swing to the wiring board in the wiring board during plating.

FIG. 4 is a diagram showing a state immediately after shock swing is applied to the wiring board in the wiring board during plating.

FIG. 5 is a view showing a wiring board plated by the plating apparatus of the present embodiment.

FIG. 6 is a diagram showing a state when an object to be plated is immersed in a plating solution by a conventional plating method.

[Explanation of symbols]

 2 Plating tank 4 Frame 5 Wiring board 6 Support rod 7 Support section 9 Lifting device 10 Hammer 11 Insulating layer 12 Electroless plating layer 13 Conductive layer 14 Bubbles

Claims (2)

[Claims] 1. A plating tank for supplying a plating solution, a frame for setting an object to be plated in the plating tank, and a swinging means for applying a shock to the object to be plated via the frame. Features plating equipment. 2. A plating method wherein an object to be plated is immersed in a plating solution, wherein a shock is applied to the object to be plated while the object to be plated is immersed in the plating solution to remove air bubbles adhering to the object to be plated. A plating method characterized by being detached.