JP2001068879A - Control equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently radiate heat generated by electronic parts while reducing the components. SOLUTION: Heat generated by a power transistor 21 as electronic parts with a heat generation property is absorbed by a heat absorbing pattern 11 formed on the surface side of a printed-circuit board 10, and heat absorbed by the pattern 11 is transferred to a connector pin 26 via a heat transfer pattern being formed of a through hole filled with solder to the peripheral surface side of the connector pin 26 of an external connection connector 25 at the reverse surface side of the printed-circuit board 10. Therefore, when another connector 28 is connected to the external connection connector 25, heat generated by the power transistor 21 is transferred to a wire harness 29, thus maintaining reliability and at the same time reducing the number of components and costs in a configuration for releasing heat from electronic parts to the outside.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a control device having a built-in electronic control circuit including a plurality of electronic components including heat-generating electronic components, and more particularly, to radiating heat generated from the electronic components to the outside. The present invention relates to a control device for a vehicle having a structure.

[0002]

2. Description of the Related Art Conventionally, as prior art documents relating to control equipment, Japanese Patent Application Laid-Open No. Sho 61-46098 and
The one disclosed in -500836 is known. In these devices, an electronic component such as a power transistor having heat generation which constitutes an electronic control circuit built in a control device (electronic device / electrical switching device) is fixed to a metal heat radiating member (heat sink). The heat dissipating member is brought into contact with the connector pins of the external connector via the insulating member to transmit the heat generated by the heat-generating electronic components, and dissipates heat to the wire harness of the mating connector connected to the external connector of the control device. The technique for causing this is shown.

[0003]

In recent years, there has been a demand for further reduction in cost for control devices for automobiles. For this reason, reducing the number of components provided in the control device is an important issue. However, the above-described structure has a structure in which heat from the heat-generating electronic components is radiated to the outside of the control device through the radiating member and the connector pins of the external connection connector. Since an insulative member or the like for insulating between the connector pins of the connector is used as an essential component, cost reduction in the control device has been hindered.

Accordingly, the present invention has been made to solve such a problem, and it is possible to efficiently radiate heat from an electronic component having heat generation to the outside while reducing the number of components, thereby achieving cost reduction. The task is to provide control equipment.

[0005]

According to the control device of the first aspect, heat generated by the heat-generating electronic component is absorbed by the heat-absorbing pattern formed on the printed circuit board surface,
The heat absorbed by the heat-absorbing pattern is transmitted to the connector pin via a heat-transfer pattern formed up to a peripheral surface separated by a predetermined dimension from the connector pin of the external connection connector connected to the printed circuit board. For this reason, if the mating connector is connected to the external connection connector, the heat generated by the heat-generating electronic components is transmitted to the wire harness. Thereby, in the configuration for radiating heat from the electronic component having heat generation to the outside,
The number of components can be reduced while maintaining reliability, and cost can be reduced.

In the control device according to the second aspect, the heat transfer pattern of the printed circuit board is formed together with the ground pattern, and if the ground pattern is fixed to a metal container by screws, for example, A noise component superimposed on a signal line of the electronic control circuit can be removed via a capacitor or the like.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on examples.

FIG. 1 is a plan view showing a configuration on a printed circuit board surface side in an electronic control device for a vehicle to which a control device according to an embodiment of the present invention is applied. FIG. 2 is a plan view showing the configuration of the back side of the printed circuit board in FIG. FIG. 3 is an enlarged view showing details of a portion A in FIG.

In FIG. 1, FIG. 2 and FIG. 3, an electronic control device 100 is made of metal and has a lunch box-shaped case 1 and a cover 2.
And a printed circuit board 10 using a double-sided copper-clad board is housed inside. On the front surface side of the printed circuit board 10, a power transistor 21 as an electronic component having heat generation is included, and a microcomputer 22 and the like and other external connection connectors 25 for connection to the outside are mounted. A chip type capacitor 23 and the like are mounted on the back side of the printed circuit board 10, and the electronic control circuit 20 is configured using both sides of the printed circuit board 10. Then, the electronic control device 100
When the case 1 and the cover 2 are assembled, the inside is in a substantially sealed state, so it is necessary to radiate heat from the power transistor 21 and the like to the outside. In this embodiment, case 1
Although the cover 2 is made of metal, it may be made of plastic. 1 and 2, electronic components and wiring patterns other than those described above are omitted.

Here, as shown in FIG. 1, the power transistor 21 is a surface mount type,
When mounted on the heat absorbing pattern 11 formed on the surface, the heat radiating surface is brought into surface contact with the heat absorbing pattern 11 and the lead portion is connected to a wiring pattern (not shown).
Is electrically connected to Then, as shown in FIG. 2, a through hole 12 filled with solder is provided at a position corresponding to the back surface side of the power transistor 21 within the range of the heat absorbing pattern 11 on the front surface side of the printed circuit board 10 shown in FIG. The heat-absorbing pattern 11 formed on the front surface side of the printed circuit board 10 and the heat transfer pattern 13 formed on the back surface side of the printed circuit board 10 through the through hole 12
And are connected.

As shown in FIG. 3, the heat transfer pattern 13 has a land portion 1 in which the connector pins 26 of the external connection connector 25 are soldered through the back surface of the printed circuit board 10.
It is formed in a solid pattern so as to have an area as large as possible as close as possible to a peripheral surface separated by a predetermined dimension from 4. Here, the predetermined dimension is such that when a predetermined current flows through the connector pin 26 of the external connection connector 25, the land 1
The distance between the heat transfer pattern 4 and the heat transfer pattern 13 is set such that a dielectric breakdown does not occur. Also,
As shown in FIG. 3, the chip type capacitor 23 is electrically connected between the signal line 15 electrically connected to one connector pin 26 of the external connection connector 25 and the heat transfer pattern 13. .

Next, the electronic control device 1 having the above configuration
The operation at 00 will be described.

The heat radiated from the power transistor 21 as an electronic component having heat generation is supplied to the outside through the heat absorption pattern 11 on the front surface side of the printed circuit board 10, the through hole 12, and the heat transfer pattern 13 on the back surface side of the printed circuit board 10. It is transmitted to the connector pin 26 of the connection connector 25. For this reason, in the present embodiment, heat from the power transistor 21 is transmitted through the connector pins 26 of the external connection connector 25 of the electronic control device 100 without using a separate member such as a heat radiation member or an insulating member which is conventionally required. Heat can be radiated to the wire harness 29 of the mating connector 28 to be connected.

In this embodiment, the heat transfer pattern 13 on the back side of the printed circuit board 10 extends to the screw hole 10a for fixing the printed circuit board 10 to the case 1 with screws. For this reason, after the printed circuit board 10 is placed on the screwing step 1 a of the case 1, the cover 2 is covered, and the screws are fixed together by screws (not shown), the heat from the heat transfer pattern 13 is removed. The heat can be transmitted to the case 1 and the cover 2 via screws to promote heat radiation.

In this embodiment, the heat transfer pattern 13 on the back side of the printed circuit board 10 is connected to the ground pattern 13a formed by removing the insulating film around the screw hole 10b. That is, since the heat transfer pattern 13 is at the ground potential and the signal line 15 connected to the connector pin 26 is connected to the heat transfer pattern 13 via the chip type capacitor 23, the input signal propagating through the signal line 15 Alternatively, a noise component superimposed on the output signal can be removed.

As described above, the electronic control device 10 of the present embodiment
Reference numeral 0 denotes a printed circuit board 10 on which a plurality of electronic components 21 and 22 including a power transistor 21 as heat-generating electronic components are mounted, electrically connected by a wiring pattern (not shown), and an electronic control circuit 20 is formed. And the electronic control circuit 20 formed on the printed circuit board 10
External connector 25 electrically connected to the outside through the
A heat-absorbing pattern 11 formed separately from the wiring pattern on the surface of the printed circuit board 10 as a contact surface corresponding to a heat-generating portion of the power transistor 21;
And the connector pins 26 of the external connector 25
Heat transfer pattern 1 formed separately from the wiring pattern on the printed circuit board 10 up to the peripheral surface separated by a predetermined dimension
3 is provided.

Therefore, the heat generated by the power transistor 21 as the heat-generating electronic component is absorbed by the heat absorbing pattern 11 formed on the surface of the printed circuit board 10, and the heat absorbed by the heat absorbing pattern 11. Is transmitted to the connector pins 26 of the external connection connector 25 connected to the printed circuit board 10 via the through holes 12 filled with the solder and the heat transfer pattern 13.

Therefore, if the mating connector 28 is connected to the external connection connector 25, the wire harness 29
The heat generated by the power transistor 21 as an electronic component having heat generation is transmitted. That is,
The heat generated by the power transistor 21 is efficiently radiated to the outside of the electronic control device 100 without passing through a separate heat radiating member, insulating member, or the like. This allows
In the configuration for dissipating heat from the heat-generating electronic components to the outside, the number of components can be reduced while maintaining reliability, and cost can be reduced.

Further, the electronic control device 100 of the present embodiment
The heat transfer pattern 13 is formed with the ground pattern 13a. For this reason, the case 1 and the cover 2 that accommodate the printed circuit board 10 are made of metal,
The signal line 15 of the electronic control circuit 20 and the heat transfer pattern 13 are connected via the chip type capacitor 23, and the ground pattern 13 formed on the heat transfer pattern 13 is formed.
If “a” is electrically connected to the case 1 or the cover 2, a noise component superimposed on the signal line 15 can be removed.

In the above embodiment, the plurality of electronic components 21 and 22 including the power transistor 21 as the heat-generating electronic component are mounted on the surface side of the printed circuit board 10 and the heat absorbing pattern 11 is formed. And
On the other hand, the chip type capacitor 2
3 is mounted, and the heat transfer pattern 13 and the signal line 15 are formed. However, the present invention is not limited to this, and the power On which side of the substrate surface the transistor 21, the heat absorption pattern 11, the heat transfer pattern 13, and the like are formed is appropriately selected in an actual design, and only one side of the printed circuit board 10 is used. The heat of the power transistor 21 may be transmitted to the connector pin 26 of the external connection connector 25.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a front surface side of a printed circuit board in an electronic control device to which a control device according to an embodiment of the present invention is applied.

FIG. 2 is a plan view showing a configuration on the back side of the printed circuit board in FIG. 1;

FIG. 3 is an enlarged view showing details of a portion A in FIG. 2;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Printed circuit board 11 Heat absorption pattern 13 Heat transfer pattern 13a Grounding pattern 20 Electronic control circuit 21 Power transistor (electronic component having heat generation) 25 External connector 26 Connector pin 100 Electronic control equipment

Claims (2)

[Claims] 1. A printed circuit board on which a plurality of electronic components including a heat-generating electronic component are mounted and electrically connected by a wiring pattern to form an electronic control circuit, and the electronic control formed on the printed circuit board An external connection connector for electrically connecting a circuit to the outside via a connector pin; and a wiring surface formed separately from the wiring pattern on the printed circuit board surface as a contact surface corresponding to a heat generating portion of the electronic component having heat generation properties. A heat-absorbing pattern, a heat-transfer pattern connected to the heat-absorbing pattern and formed separately from the wiring pattern on the printed circuit board surface up to a peripheral surface separated by a predetermined dimension from the connector pin of the external connector. A control device characterized by comprising: 2. The heat transfer pattern according to claim 1, wherein the heat transfer pattern is formed together with a ground pattern.
The control device according to item 1.