JP2001068796A - Resin circuit molded product for mounting electronic components and method of manufacturing electronic components - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To enable easy and high-quality production of electronic components. SOLUTION: The concave portion has a plurality of concave portions 14A and 14B and a plurality of through holes 15, and the concave portion has stepped portions 17, 18 so that a photosensor element 19 can be mounted. Molded articles 12 arranged in plural
And an electric circuit 13 formed in a region extending from the concave portion of the resin molded product to the inside of the through-hole, the electric circuit is integrally press-molded with the resin molded product. The copper foils 16 and 26 thus formed are formed as main parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention particularly relates to a resin circuit molded product for mounting electronic components and elements for manufacturing electronic components such as a photosensor which can be surface-mounted on a printed circuit board, and a resin circuit molded product for mounting such electronic components. The present invention relates to a method of manufacturing an electronic component using the method.

[0002]

2. Description of the Related Art Electronic components such as photosensors that can be surface-mounted on a printed circuit board or the like are disclosed in Japanese Patent Application Laid-Open No. 10-261808.
First, a plurality of recesses and a plurality of through-holes are formed in a resin molded product, and then a region from the recess to the inside of the through-hole of the resin molded product is subjected to metal plating by applying metal plating. A circuit is formed to form a resin circuit molded product, and then, for example, an electronic component element such as a photosensor element is mounted in a concave portion of the resin circuit molded product, and the electronic component element and the electric circuit are wire-bonded. Then, the resin circuit molded product is manufactured by dicing along a direction in which a plurality of through holes arranged linearly are arranged.

[0003] Here, since the resin molded article is non-conductive, the surface of the resin molded article is first roughened using a chemical such as chromic sulfuric acid, and then the plating catalyst is removed. Coating, then apply electroless copper plating on the entire surface, and then mask exposure on this electroless copper plating layer,
It is formed by performing development and etching.

[0004]

However, in the step of forming the electric circuit, a number of complicated steps such as surface roughening of a resin molded product, application of a plating catalyst, and electroless copper plating are required. In addition, in each of these steps, sufficient attention must be paid to the management and disposal of chemicals.

In wire bonding between an electric circuit formed based on such electroless copper plating and an electronic component element, as shown in FIG. 10B, the surface of the electroless copper plating layer 100 has a rough surface. Therefore, it is difficult to remove dirt on the surface of the electroless copper plating layer 100, and therefore, wire bonding to an electric circuit may be deteriorated.

Further, before the electroless copper plating, the surface of the resin molded article 101 is roughened by using a chemical or the like. Copper plating layer 100, that is, electric circuit and resin molded product 1
There is a possibility that the bonding strength (peel strength) with 01 may be insufficient.

[0007] As a result of the reduction in the wire bonding property and the reduction in the peak strength of the electric circuit, there is a possibility that the quality of the photosensor as an electronic component is reduced.

SUMMARY OF THE INVENTION An object of the present invention has been made in view of the above-mentioned circumstances, and a resin circuit molded product for mounting electronic components and a method of manufacturing an electronic component capable of manufacturing electronic components easily and with high quality. Is to provide.

[0009]

The invention according to claim 1 has a plurality of recesses and a plurality of through holes.
A resin molded product provided with at least two steps so that the electronic component element can be mounted thereon, wherein the through holes are linearly arrayed in the vicinity of the concave portion; In an electronic component element mounting resin circuit molded product having an electric circuit formed in a region extending to the inside, the electric circuit includes a conductive metal layer integrally press-molded on the resin molded product. It is characterized by being formed as a main part.

According to a second aspect of the present invention, in the first aspect of the present invention, the conductive metal layer is formed by subjecting a back surface of the conductive metal layer to an unevenness treatment. It is characterized by being joined to a resin molded product, and the resin molded product and the conductive metal layer are integrally formed by pressure bonding.

According to a third aspect of the present invention, in the first or second aspect, the resin molded article is made of a thermosetting resin or a thermoplastic resin, and the conductive metal layer is made of a copper foil. It is characterized by having been done.

According to a fourth aspect of the present invention, a conductive metal layer is integrally press-molded on a resin molded product having two or more steps and provided with a plurality of recesses on which electronic component elements can be mounted. A resin composite molded article is formed. Next, in the vicinity of the concave portion, the resin molded article and the conductive metal layer are penetrated, and a plurality of through holes are linearly arranged and formed. With the layer as a main part, an electric circuit is formed in a region from the concave portion to the inside of the through hole to produce a resin circuit molded product, and then, after mounting the electronic component element in the concave portion, The invention according to claim 5, wherein the electronic circuit is manufactured by dicing the resin circuit molded product along the arrangement direction of the through holes after connecting the electric circuit. Provided with multiple recesses with electronic steps for mounting electronic components Then, a conductive metal layer is integrally formed on the molded resin article by pressure bonding to form a resin composite molded article. Next, in the vicinity of the concave portion, the resin molded article and the conductive metal layer are penetrated to form a plurality of through-holes. The holes are formed in a linear array, then
With the conductive metal layer as a main part, an electric circuit is formed in a region extending from the concave portion to the inside of the through hole to produce a resin circuit molded product, and then the resin circuit is formed along the arrangement direction of the through holes. The method is characterized in that a molded article is diced, an electronic component element is mounted in the concave portion, and the electronic component element is connected to the electric circuit to manufacture an electronic component.

According to a sixth aspect of the present invention, in the fourth or fifth aspect of the present invention, the conductive metal layer is formed by subjecting a back surface of the conductive metal layer to an uneven surface treatment. Are joined to the resin molded product, and the resin molded product and the conductive metal layer are integrally formed by pressure bonding.

[0014] The invention according to claim 7 is the invention according to claims 4 to 6.
In the invention described in any one of the above, the resin molded article is made of a thermosetting resin or a thermoplastic resin, and the conductive metal layer is made of a copper foil.

The invention according to the first, third, fourth, fifth or seventh aspect has the following effects.

An electric circuit formed in a region extending from the concave portion to the inside of the through hole of the resin molded product constituting the resin circuit molded product,
Since the main part is formed of a conductive metal layer integrally formed by compression bonding on a resin molded product, the surface of the electric circuit is excellent in smoothness and flatness, and it is easy to remove dirt. Wire bonding can be favorably performed between the electronic component element mounted in the concave portion of the circuit molded product. Therefore, it is possible to improve the quality of an electronic component formed using the resin circuit molded product.

When the electric circuit is formed by using metal plating, since the resin molded product is non-conductive,
After roughening the surface of the resin molded product, a plating catalyst must be applied, and then electroless plating must be performed, which requires many complicated steps. On the other hand, in the case of the present invention, the conductive metal layer is integrally press-bonded to the resin molded product, and an electric circuit is formed with the conductive metal layer as a main part. The number can be reduced, and the electric circuit can be easily formed.

The invention according to claim 2 or 6 has the following operation.

The uneven surface of the conductive metal layer is joined to the resin molded product, and the resin molded product and the conductive metal layer are integrally formed by pressure bonding. The anchor effect is exhibited by digging into. In addition, unlike a case of applying metal plating, the surface of a resin molded product is not roughened by a chemical or the like, and the mechanical strength is not reduced. As a result, the bonding strength, that is, the peel strength between the electric circuit formed mainly of the conductive metal layer and the resin molded product, that is, the peel strength is improved, and the resin circuit molded product including the resin molded product and the electric circuit is used. The quality of the obtained electrical component can be further improved.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

[A] Embodiment (FIGS. 1 to 8 and FIG. 1)
0) FIG. 1 is a cross-sectional view showing a resin circuit molded product as an embodiment of the electronic component element mounting resin circuit molded product according to the present invention. FIG. 2 is a plan view of the resin circuit molded product of FIG.

A resin circuit molded product 11 for mounting a photosensor element as a resin circuit molded product for mounting an electronic component element for manufacturing the photosensor 10 shown in FIG. 5 as an electronic component is shown in FIGS. 1 and 2. As shown, it is configured to include a resin molded product 12 and an electric circuit 13. The above resin molded product 1
2 comprises a plurality of recesses 14A and 14B and a plurality of through holes 15. Further, the electric circuit 13 is formed mainly of copper foils 16 and 26 as conductive metal layers, which are integrally press-molded on the resin molded product 12.

Each of the recesses 14A and 14B is formed by providing two stepped portions 17 and 18 on the resin molded product 12. The concave portion 14A is formed at a position deeper than the concave portion 14B, so that the photosensor element 19 (FIG. 5) can be mounted. When the photosensor element 19 is mounted on the concave section 14A, the concave section 14B
9 is formed at a position that is substantially flush with the upper surface of the substrate 9.

The plurality of through-holes 15 are formed in the vicinity of each recess 14B in a straight line along the longitudinal direction of the recess 14B. As will be described later, these through-holes 15 are formed after the copper foils 16 and 26 are integrally formed on the resin molded product 12 by pressure bonding.
6 to be formed. The cross-sectional shape of the through-hole 15 is shown in FIG. 2 as being circular, but may be elliptical or square.

The electric circuit 13 is formed in a region extending from the concave portion 14B through the inside of the through hole 15 to the back surface of the resin molded product 12. For this reason, the photo sensor 10 is provided such that its back surface is joined to the surface of a printed board (not shown) so that the photo sensor 10 can be mounted on the printed board. As will be described in detail later, the electric circuit 13 includes copper foils 16 and 26 integrated on the front surface and the back surface of the resin molded product 12, and a copper plating layer 24 described later formed inside the through hole 15, respectively. Are formed, and the copper foils 16 and 26 and the copper plating layer 24 are formed by mask exposure, development and etching.

The copper foils 16 and 26 are formed as shown in FIG.
As shown in the figure, the back surface is subjected to the unevenness treatment, and the unevenness-treated surface 2
0 is formed, and when the copper foils 16 and 26 and the resin molded product 12 are integrally pressed and formed, the resin molded product 12 is
And is closely adhered and joined. The surfaces of the copper foils 16 and 26 are formed as a smooth surface and a flat surface.

Here, the resin molded article 12 needs to have solder heat resistance in order to surface-mount the photosensor 10 on a printed board (not shown), and for example, a thermosetting resin is used. As the thermosetting resin, epoxy resin, unsaturated polyester, phenol resin, and the like are preferable.

Next, a manufacturing process of the photosensor 10 including the above-described resin circuit molded article 11 will be described with reference to FIGS.

(1) First, as shown in FIGS. 3A and 7, a copper foil 16 is integrally formed on the surface of a resin molded product 12 having a plurality of recesses 14A and 14B, and a copper foil 26 is integrally formed on the back surface. The resin composite molded article 21 is formed by compression molding. At this time, the copper foil 16 is integrally formed so as to cover the plurality of recesses 14A and 14B.

As shown in FIG. 6, the resin molded product 12 and the copper foils 16 and 26 are integrally press-molded together with an uncured resin molded product 12 in which a plurality of recesses 14A and 14B are molded in advance. Then, a copper foil 16 preformed in an uneven shape corresponding to the concave portions 14A and 14B and a copper foil 26 having a flat surface shape are arranged between the upper mold 22 and the lower mold 23. At this time, the uneven surface 20 of the copper foils 16 and 26 faces the resin molded product 12 side. Next, using the upper mold 22 and the lower mold 23, for example, under a heating state of 180 ° C., the resin molded product 1 is heated.
2 and copper foils 16 and 26 for 2 minutes at 100 kgf / cm ²
Acting pressure. In this way, the uncured resin molded product 12 is melted, molded, and cured to obtain the resin molded product 12 shown in FIG.
As shown in (A), the uneven surface 2 of the copper foils 16 and 26
0 is cut into the resin molded product 12 in a molten state, and after the resin molded product 12 is cured, the copper foils 16 and 26 are brought into close contact with the resin molded product 12 and integrally press-molded.

(2) Next, as shown in FIGS. 3B and 8, a plurality of through holes 15 are formed in the vicinity of each of the recesses 14B of the resin composite molded article 21 along the longitudinal direction of these recesses 14B. Drilled in a straight line. Each through-hole 15 is formed through the resin molded product 12 and the copper foils 16 and 26 integrated on the front and back surfaces of the resin molded product 12, respectively.

(3) Next, as shown in FIG. 3 (C), thin electroless copper plating is performed on the entire surface and the entire back surface of the resin composite molded article 21 mainly for the inside of the through hole 15. hand,
An electroless copper plating layer having a thickness of about 1 μm is formed. afterwards,
Perform electrolytic copper plating on this electroless copper plating layer,
An electrolytic copper plating layer having a thickness of about 10 μm is formed. In this way, the copper plating layer 2 is formed mainly in the through-hole 15 by connecting the copper foil 16 on the surface of the resin composite molded product 21 and the copper foil 26 on the back surface.
4 are formed.

(4) Next, although not shown, a positive electrodeposition resist is applied to the entire surface of the resin composite molded article 21 to form a resist layer, and the resist layer is covered with a masking film and exposed to ultraviolet light for development. I do. By this development, a portion of the resist layer unnecessary for forming the electric circuit 13 is removed. Next, an etching process is performed to etch away the portions of the copper foils 16 and 26 and the copper plating layer 24 that are not covered with the resist layer, and then remove the remaining resist layer.

Thus, the resin circuit molded article 11 is manufactured as shown in FIGS. 3 (D), 1 and 2. The electric circuit 13 of the resin circuit molded product 11 has copper foils 16 and 26 on the front and back surfaces of the resin molded product 12 and inside the through hole 15.
Each of the concave portions 14B, the inside of the plurality of through holes 15 corresponding to the concave portions 14B, and the peripheral portion of the through hole 15 on the back surface of the resin molded product 12 are continuously formed.

(5) Next, as shown in FIGS. 4 (E) and 5, a photosensor element 19 is mounted by die bonding in each recess 14A of FIG. The electric circuit 13 on 14B and the gold wire 25
And electrically connected by wire bonding.

(6) Thereafter, as shown in FIGS. 4 (F) and 2, the resin circuit molded product 11 is moved along the arrangement direction of the plurality of through holes 15 as shown by the broken line in FIG. 4 (F). Dicing is performed, and further, dicing is performed for each part to be the photosensor 10.

(7) Finally, as shown in FIG.
The transparent plate 27 is fixed so as to cover the concave portions 14A and 14B of the dicing as in the above (6), and the photosensor 10 is manufactured.

Therefore, according to the above embodiment, the following effects are obtained.

The electric circuit 13 is formed in a region extending from the concave portion 14B of the resin molded product 12 to the peripheral portion of the through hole 15 on the back surface of the resin molded product 12 through the inside of the through hole 15, thereby forming the resin circuit molded product 11. , This electric circuit 13
Copper foils 16 and 2 formed integrally with resin molded product 12 by pressure bonding
6 as a main part, as shown in FIG. 10A, the surface of the electric circuit 13 is excellent in smoothness and flatness, and dirt is easily removed.
Wire bonding can be favorably performed using the gold wire 25 with the photosensor element 19 mounted in the recess 14A. For this reason, the quality of the photo sensor 10 configured using the resin circuit molded product 11 can be improved.

The uneven surface 20 of the copper foils 16 and 26 is joined to the resin molded product 12, and the resin molded product 12 and the copper foils 16 and 26 are integrally press-molded to form a resin composite molded product 21. As a result, the irregularities of the irregularity treated surface 20 bite into the resin molded product 12 and an anchoring effect is exhibited. Further, unlike the case of applying metal plating, the surface of the resin molded product 12 is not roughened by a chemical or the like, and the mechanical strength is not reduced. As a result, the copper foil 16
And 26, the bonding strength between the electric circuit 13 and the resin molded product 12 formed as a main part, that is, the peel strength is improved, and the photo formed by using the resin circuit molded product 11 formed from the resin composite molded product 21 is improved. The quality of the sensor 10 can be further improved.

When the electric circuit 13 is formed using metal plating, since the resin molded product 12 is non-conductive, the surface of the resin molded product 12 is roughened, and then a plating catalyst is applied. Must be performed, and many complicated steps are required. On the other hand, in the case of the present embodiment, the copper foils 16 and 2
6 are integrally formed by pressure bonding, and the electric circuit 13 is formed by using the copper foils 16 and 26 as main parts. Therefore, the number of steps can be reduced as compared with the case of metal plating, and the electric circuit 13 can be formed easily. As a result, the photo sensor 10 can be easily manufactured.

When an electric circuit is formed by the above-described copper plating treatment, various chemicals are required in the surface roughening of the resin molded product, the application of the plating catalyst, and the electroless copper plating treatment. In the case where electroless copper plating and electrolytic copper plating are mainly performed in the through holes 15, the number of chemicals used is small, and therefore, the management and disposal of the chemicals are facilitated.

A resin circuit molded article 11 having a plurality of recesses 14A on which the photosensor element 19 can be mounted is obtained by collective molding, and the resultant is diced, whereby the photosensor 10 can be manufactured. Can be efficiently manufactured at the same time.

By mounting the photosensor element 19 in the concave portion 14A, the upper surface of the photosensor element 19 and the upper surface of the concave portion 14B are substantially flush with each other. Can be easily carried out.

The electric circuit 13 formed in a region extending from the concave portion 14B to the peripheral portion of the through hole 15 on the back surface of the resin molded product 12 through the through hole 15 serves as a metallized electrode as a whole. It can be easily surface-mounted on a substrate.

[B] Another Embodiment (FIG. 9) FIG. 9 is a process sectional view showing a photosensor manufacturing process to which another embodiment of the method for manufacturing an electronic component according to the present invention is applied. In the other embodiments, the same parts as those in the above embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

The other embodiment of manufacturing the photosensor 10 is different from that of the first embodiment in that the photosensor element 19 is mounted in the recess 14A after the resin circuit molded article 11 is diced. .

(1) That is, as shown in FIG. 3, the copper foils 16 and 26 are integrated with the resin molded product 12 to produce a resin composite molded product 21 (FIG. 3A). A through hole 15 is formed in the resin composite molded article 21 (FIG. 3 (B)), and then a copper plating process is performed on the resin composite molded article 21 (FIG. 3 (C)). The steps up to the step of forming the electric circuit 13 on the molded article 21 to produce the resin circuit molded article 11 (FIG. 3D) are the same as those of the above-described embodiment.

(2) Next, as shown in FIG. 9A, the resin circuit molded product 11 is diced along the direction in which the plurality of through holes 15 are arranged as shown by the broken lines in FIG. Dicing is performed for each part to be the sensor 10.

(3) Thereafter, as shown in FIG.
The photosensor element 19 is mounted on the recessed portion 14A of the diced product by die bonding, and the photosensor element 19 and the electric circuit 13 on the recessed portion 14B are electrically connected by wire bonding using a gold wire 25. .

(4) Finally, as shown in FIG.
The recessed portion 14A of the product diced in the above (2)
Then, the transparent plate 27 is fixed so as to cover 14B and 14B, and the photosensor 10 is manufactured.

Therefore, in the other embodiments,
The same effects as the effects of the first embodiment are obtained.

As described above, the present invention has been described based on the above embodiment, but the present invention is not limited to this.

For example, the resin molded article 12 is not limited to a thermosetting resin, but may be made of a thermoplastic resin. As the thermoplastic resin, liquid crystal polymer (LCP), polyethersulfone (PES), polyphenylene sulfide (PPS) or the like, which is an aromatic polyester, is preferable.

Although the case where the conductive metal layer is the copper foil 16 has been described, a copper plate or a nickel or gold foil or plate may be used.

Further, in both embodiments, the case where the electronic component is a photo sensor has been described, but the present invention can be applied to a temperature sensor, a humidity sensor, a gas sensor, or the like.

[0057]

As described above, according to the resin circuit molded article for mounting electronic parts and elements according to the first aspect of the present invention, the resin molded article is formed in the region from the plurality of recesses to the plurality of through holes. The electronic circuit can be manufactured easily and with high quality because the main part of the electric circuit is a conductive metal layer integrally formed by compression bonding on a resin molded product.

According to the method of manufacturing an electronic component according to the fourth aspect of the present invention, a resin molded product having two or more steps and provided with a plurality of recesses on which electronic component elements can be mounted is provided. The metal layer is integrally pressed and formed into a resin composite molded product, and then, in the vicinity of the concave portion, a plurality of through holes are linearly arranged through the resin molded product and the conductive metal layer. Then, using the conductive metal layer as a main portion, an electric circuit is formed in a region from the concave portion to the inside of the through hole to produce a resin circuit molded product, and then an electronic component element is formed in the concave portion. After mounting, the electronic component element is connected to the electric circuit, and then the resin circuit molded product is diced along the arrangement direction of the through holes to manufacture the electronic component. And it can be manufactured with high quality.

According to the method of manufacturing an electronic component according to the fifth aspect of the present invention, a resin molded product having two or more steps and provided with a plurality of recesses on which electronic component elements can be mounted is provided. The metal layer is integrally pressed and formed into a resin composite molded product, and then, in the vicinity of the concave portion, a plurality of through holes are linearly arranged through the resin molded product and the conductive metal layer. Then, with the conductive metal layer as a main part, an electric circuit is formed in a region from the concave portion to the inside of the through hole to produce a resin circuit molded product, and then in the arrangement direction of the through holes. After dicing the resin circuit molded product along with the electronic component element in the concave portion and connecting the electronic component element and the electric circuit to manufacture the electronic component, the electronic component can be easily manufactured. And it can be manufactured with high quality.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a resin circuit molded product as an embodiment of a resin circuit molded product for mounting electronic components according to the present invention.

FIG. 2 is a plan view of the resin circuit molded product of FIG.

FIG. 3 is a cross-sectional process diagram showing a first half of a photosensor manufacturing process to which an embodiment of the electronic component manufacturing method according to the present invention is applied.

FIG. 4 is a sectional process view showing the latter half of the manufacturing process of the photosensor of FIG. 3;

FIG. 5 is a plan view showing a photosensor manufactured by the manufacturing steps of FIGS. 3 and 4;

FIG. 6 is a cross-sectional view showing a manufacturing process for manufacturing the resin composite molded article of FIG. 3 (A).

FIG. 7 is a cross-sectional view (IIIA) of the cross-sectional view shown in FIG.
FIG. 3B is a plan view of the resin composite molded product to which (−IIIA line) is added.

FIG. 8 is a cross-sectional view (IIIB) of the cross-sectional view shown in FIG.
FIG. 3 is a plan view of the resin composite molded product to which (−IIIB line) is added.

FIG. 9 is a sectional process view showing a photosensor manufacturing process to which another embodiment of the semiconductor manufacturing method according to the present invention is applied.

FIG. 10A is a cross-sectional view showing a connection state between a copper foil and a resin molded product constituting the electric circuit shown in FIG. 1,
(B) is a cross-sectional view showing a state of connection between a resin molded product and electroless copper plating constituting a conventional electric circuit.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 photosensor (electronic component) 11 resin circuit molded product 12 resin molded product 13 electric circuit 14 A, 14 B recess 15 through hole 16, 26 copper foil 17, 18 step 19 photosensor element (electronic component element) 20 uneven surface 21 Resin composite molded product 24 Copper plating layer

Continued on the front page F term (reference) 5E317 AA24 BB01 BB02 BB12 CC03 CC13 CC31 CD34 GG17 5E338 AA16 BB03 BB19 BB25 BB63 BB75 CD01 EE31 5F088 BA18 CB20 FA09 JA03

Claims (7)

[Claims] 1. A semiconductor device comprising: a plurality of recesses and a plurality of through holes; wherein the recess has two or more steps, and is provided so that an electronic component element can be mounted; A plurality of resin molded products, and an electric circuit formed in an area extending from the concave portion of the resin molded product to the inside of the through hole. A resin circuit molded product for mounting electronic component elements, characterized in that the electric circuit is formed mainly of a conductive metal layer formed integrally with the resin molded product by pressure bonding. 2. The conductive metal layer is formed by subjecting a back surface of the conductive metal layer to a concavo-convex treatment. The resin circuit molded product for electronic component element mounting according to claim 1, wherein the metal layer and the metal layer are integrally formed by pressure bonding. 3. The electronic component element according to claim 1, wherein the resin molded product is made of a thermosetting resin or a thermoplastic resin, and the conductive metal layer is made of a copper foil. Resin circuit molded product for mounting. 4. A resin composite molded article obtained by integrally pressing a conductive metal layer on a resin molded article provided with a plurality of recesses provided with two or more steps and capable of mounting an electronic component element. In the vicinity of the concave portion, a plurality of through-holes are formed in a straight line by penetrating the resin molded product and the conductive metal layer, and then forming the conductive metal layer as a main part, An electric circuit is formed in a region extending from the concave portion to the inside of the through hole to produce a resin circuit molded product. Next, after mounting an electronic component element in the concave portion, the electronic component element is connected to the electric circuit. Thereafter, a method of manufacturing an electronic component, comprising: dicing the resin circuit molded product along the arrangement direction of the through holes to manufacture an electronic component. 5. A resin composite molded article obtained by integrally pressing a conductive metal layer on a resin molded article having two or more steps and provided with a plurality of recesses on which electronic component elements can be mounted. In the vicinity of the concave portion, a plurality of through-holes are formed in a straight line by penetrating the resin molded product and the conductive metal layer, and then forming the conductive metal layer as a main part, An electric circuit is formed in a region extending from the concave portion to the inside of the through hole to produce a resin circuit molded product. Next, the resin circuit molded product is diced along the arrangement direction of the through holes. A method for manufacturing an electronic component, comprising: mounting an electronic component, connecting the electronic component to the electric circuit, and manufacturing an electronic component. 6. The conductive metal layer is formed by subjecting a back surface of the conductive metal layer to a concavo-convex treatment. The method for manufacturing an electronic component according to claim 4, wherein the metal layer and the metal layer are integrally formed by pressure bonding. 7. The method according to claim 4, wherein the resin molded product is made of a thermosetting resin or a thermoplastic resin, and the conductive metal layer is made of a copper foil. Manufacturing method of electronic components.