JP2001050983A - Probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe card capable of reliably achieving required electrical connection even to a circuit device having an oxide film on the surface of an electrode to be inspected. Provided is a probe card capable of preventing a surface of a circuit device from being damaged or contaminated, and maintaining a good electrical connection state for a long period of time. A probe card interposed between a circuit device to be tested and an electrical testing device for performing electrical testing of electrodes of the circuit device, wherein an elastic polymer material is filled with conductive particles. A plurality of conductive portions extending in the thickness direction are electrically insulated from each other by an anisotropic conductive sheet disposed in a state where the conductive portions are insulated from each other by an insulating portion made of an elastic polymer material. A plurality of protruding electrodes that are electrically connected, and the anisotropic conductive sheet and the protruding electrodes are integrated. Each of the protruding electrodes is preferably supported by a support plate disposed on the anisotropic conductive sheet.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a probe card, and more particularly, to a probe card suitable for inspecting electrical characteristics of a circuit device comprising a semiconductor chip in a wafer state.

[0002]

2. Description of the Related Art Generally, in a semiconductor integrated circuit device, after a required circuit pattern is formed on a wafer, a semiconductor chip is formed by cutting the wafer, and the semiconductor chip is housed in an appropriate package. It is manufactured by sealing. Therefore, in order to assure the quality of such a semiconductor integrated circuit device, it is necessary to not only inspect the electrical characteristics of the semiconductor integrated circuit device but also inspect the electrical characteristics of the semiconductor chip itself. Is extremely important. In recent years, a mounting method has been developed in which a semiconductor chip itself is used as an integrated circuit device, and a circuit device formed of the semiconductor chip is directly mounted on, for example, a printed circuit board. Has been requested.

However, since semiconductor chips are fine and inconvenient to handle, it takes a long time to inspect a circuit device composed of semiconductor chips, and the inspection cost is considerably high. Become. For these reasons, WLBI (Waf), which inspects the electrical characteristics of a circuit device composed of a semiconductor chip in a wafer state, recently.
er Level Burn-in) test is receiving attention.

Conventionally, in an electrical inspection of a circuit device,
A probe card is used to electrically connect each of the electrodes to be inspected of a circuit device to be inspected to a tester. In this probe card, inspection probes formed of pins or blades are arranged corresponding to each of the electrodes to be inspected, and the probe card is interposed between a circuit device to be inspected and a tester. As a result, the electrode to be inspected of the circuit device is electrically connected to the tester, and the required electrical inspection is performed. And
In the WLBI test, if a probe having an inspection probe corresponding to the electrode to be inspected of all the circuit devices on the wafer can be used, the electrical inspection of all the circuit devices on the wafer can be performed by one inspection process. Therefore, the inspection time can be shortened.

However, in order to manufacture such a probe card, it is necessary to arrange a very large number (for example, thousands or more) of test probes, so that the probe card becomes extremely expensive. Further, when the pitch of the electrodes to be inspected is small, it is difficult to fabricate the probe card itself. Also, in general, a wafer is warped, and the state of the warp is different for each product (wafer). Therefore, the inspection probes of the probe card are simultaneously applied to the electrodes to be inspected of all the circuit devices on the wafer. It is practically difficult to make a stable connection.

In the electrical inspection of circuit devices,
A method using an anisotropic conductive sheet as a probe card instead of a probe card having an inspection probe composed of a pin or a blade, specifically, a circuit device to be inspected and an electrode to be inspected of the circuit device 2. Description of the Related Art There is known a method of performing an electrical inspection of a circuit device by interposing an anisotropic conductive sheet between the circuit device and an inspection circuit board having a pattern connection electrode. This anisotropic conductive sheet is
It has conductivity only in the thickness direction, or has a large number of pressurized conductive path forming portions that have conductivity only in the thickness direction when pressed, and various structures are available. No. 48951, JP-A-51-93393
JP, JP-A-53-147772, JP-A-Showa 54
This is known from, for example, Japanese Patent Publication No. 146873. Then, in the WLBI test, by using such an anisotropic conductive sheet as a probe card, when the anisotropic conductive sheet is brought into contact with a wafer to be inspected, the anisotropic conductive sheet is used in accordance with the magnitude of the warpage of the wafer. Since the anisotropic conductive sheet is deformed in the thickness direction, required electrical connection can be performed for each of the electrodes to be inspected of all the circuit devices on the wafer.

However, when the anisotropic conductive sheet is used as a probe card, there are the following problems. An electrode to be inspected of a circuit device formed on a wafer is generally made of copper, aluminum, gold, or the like, and an insulating oxide film is formed on a surface of the electrode. In this method, it is necessary to break through an oxide film formed on the surface of the electrode to be inspected with a probe card. However, since the anisotropic conductive sheet is flexible, when electrically connected to the electrode to be inspected of the circuit device, it is considerably difficult to break through the oxide film formed on the surface of the electrode to be inspected. Large pressure is required,
As a result, the surface of the circuit device to be inspected is damaged by the applied pressure, or is contaminated by the low molecular weight component contained in the elastic polymer material constituting the anisotropic conductive sheet. In addition, when the electrical connection between the circuit device and the anisotropic conductive sheet is repeatedly performed, the conductive portion of the anisotropic conductive sheet is damaged at an early stage, and a good electrical connection state cannot be maintained.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide a circuit device to be inspected in which an electrode to be inspected is provided on a surface thereof. It is an object of the present invention to provide a probe card which can reliably attain required electrical connection even if it has an oxide film. A second object of the present invention is to provide a probe card capable of preventing a surface of a circuit device to be inspected from being damaged or contaminated, and capable of maintaining a good electrical connection state for a long period of time. To provide.

[0009]

SUMMARY OF THE INVENTION A probe card according to the present invention is a probe card interposed between a circuit device to be inspected and an electrical inspection device for electrically inspecting electrodes of the circuit device. A plurality of conductive portions, each of which is filled with conductive particles in an elastic polymer material and extends in the thickness direction, are arranged in a state insulated from each other by an insulating portion made of the elastic polymer material. A conductive sheet;
A plurality of protruding electrodes electrically connected to each of the conductive portions of the anisotropic conductive sheet, wherein the anisotropic conductive sheet and the protruding electrodes are integrated. And

[0010] In the probe card of the present invention, it is preferable that each of the protruding electrodes is supported by a support plate disposed on the anisotropic conductive sheet. Further, between the anisotropic conductive sheet and the support, a wiring portion for electrically connecting the protruding electrodes may be provided on a conductive portion of the anisotropic conductive sheet. Further, the probe card of the present invention can be suitably used for electrical inspection of a circuit device formed on a wafer.

[0011]

(1) Since the protruding electrode is provided integrally with the anisotropic conductive sheet, even if the electrode to be inspected has an oxide film on its surface, the protruding electrode forms the oxide film. Can be pierced with a small pressing force, so that the required electrical connection is achieved. (2) Since the required electrical connection is reliably achieved with a small pressing force, it is possible to prevent the surface of the circuit device to be inspected from being damaged, and to maintain a good electrical connection state for a long period of time. Can be maintained. (3) Since the anisotropic conductive sheet does not directly come into contact with the electrode to be inspected, the electrode to be inspected is formed by the low molecular weight component contained in the elastic polymer material constituting the anisotropic conductive sheet. Contamination can be prevented.

(4) By providing a support for supporting the protruding electrodes on the anisotropic conductive sheet, when the protruding electrodes press the electrode to be inspected, the protruding electrodes are prevented from tilting, As a result, the required electrical connection can be achieved more reliably. In addition, since the support prevents the anisotropic conductive sheet from directly contacting the circuit device, the low molecular weight component contained in the elastic polymer material constituting the anisotropic conductive sheet causes the circuit device to have a low molecular weight. Can be prevented from being contaminated. (5) By providing a wiring portion for electrically connecting the protruding electrodes to the conductive portion of the anisotropic conductive sheet between the anisotropic conductive sheet and the support, the conductive portion of the anisotropic conductive sheet is provided. It is not necessary to match the pitch of the electrodes with the pitch of the electrodes to be inspected of the circuit device to be inspected, and the size can be appropriately set. Therefore, even if the pitch of the electrodes to be inspected of the circuit device to be inspected is small, the anisotropic conductive sheet having the conductive portion having a pitch larger than the pitch of the electrodes to be inspected can be used. The electrical inspection of the electrode to be inspected can be performed in a state where required insulation between the electrodes is secured.

[0013]

Embodiments of the present invention will be described below in detail. <First Embodiment> FIG. 1 is an explanatory sectional view showing the structure of a main part of a first embodiment of a probe card according to the present invention. The probe card includes a plurality of conductive portions 11 each extending in a thickness direction, and a plurality of these conductive portions 11.
Has an anisotropic conductive sheet 10 composed of an insulating portion 12 that insulates each other. Each of the conductive portions 11 in the anisotropic conductive sheet 10 is arranged along a surface direction of the anisotropic conductive sheet 10 according to a pattern corresponding to a pattern of an electrode to be inspected of a circuit device to be inspected. . Then, on each conductive portion 11 of the anisotropic conductive sheet 10, a protruding electrode 2 made of metal is provided via an adhesive layer 15.
0 is provided integrally. This protruding electrode 20
The hemispherical tip portion 21 and the disc-shaped base portion 22 are connected to the connecting portion 2.
3 are connected. In the first embodiment, each of the conductive portions 11 has the same thickness as the thickness of the insulating portion 12 and is arranged such that its upper surface is located on the same plane as the upper surface of the insulating portion 12. Thereby, the adhesive layer 15 and the protruding electrodes 20 are in a state of protruding from the surface of the insulating portion 12 in the anisotropic conductive sheet.

The conductive portion 11 of the anisotropic conductive sheet 10
Is formed by filling conductive particles in an insulating elastic polymer material, and preferably, the conductive particles are oriented in the elastic polymer material in a state of being arranged in the thickness direction. A conductive path is formed in the thickness direction of the conductive part. The conductive portion 11 may be a pressurized conductive portion in which a conductive path is formed by reducing the resistance value when compressed and compressed in the thickness direction.

As the insulating elastic high molecular substance used for the conductive portion 11, a high molecular substance having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance forming material that can be used to obtain the crosslinked polymer substance, and specific examples thereof include polybutadiene,
Conjugated diene rubbers such as natural rubber, polyisoprene, styrene-butadiene copolymer rubber (SBR), acrylonitrile-butadiene copolymer rubber (NBR) and hydrogenated products thereof, styrene-butadiene-diene block copolymer, Block copolymers such as styrene-isoprene block copolymers and their hydrogenated products, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer, ethylene-propylene-diene copolymer And the like. In the above, when the obtained anisotropic conductive sheet 10 is required to have weather resistance, it is preferable to use a material other than the conjugated diene rubber. In particular, from the viewpoint of moldability and electrical characteristics, silicone rubber is used. Preferably, it is used.

Here, the silicone rubber will be described in more detail. As the silicone rubber, one obtained by crosslinking or condensing a liquid silicone rubber is preferable. Liquid silicone rubber has a viscosity of 10 ⁵ at a strain rate of 10 ⁻¹ sec.
Poises or less are preferable, and any of condensation type, addition type, and those containing a vinyl group or a hydroxyl group may be used. Specifically, dimethylsilicone raw rubber, methylvinylsilicone raw rubber, methylphenylvinylsilicone raw rubber and the like can be mentioned.

Among these, liquid group-containing silicone rubber (vinyl group-containing polydimethylsiloxane)
Is usually obtained by subjecting dimethyldichlorosilane or dimethyldialkoxysilane to hydrolysis and condensation reaction in the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane, for example, followed by fractionation by repeated dissolution-precipitation. Also,
The liquid silicone rubber containing vinyl groups at both ends is anionically polymerized with a cyclic siloxane such as octamethylcyclotetrasiloxane in the presence of a catalyst, and uses, for example, dimethyldivinylsiloxane as a polymerization terminator and other reaction conditions (for example, , The amount of the cyclic siloxane and the amount of the polymerization terminator). Here, as a catalyst for anionic polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C.

On the other hand, a liquid silicone rubber containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) is usually prepared by hydrolyzing dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane. And condensation reaction, for example,
It is obtained by performing fractionation by repeating precipitation.
Further, cyclic siloxane is anionically polymerized in the presence of a catalyst, and dimethylhydrochlorosilane, methyldihydrochlorosilane or dimethylhydroalkoxysilane is used as a polymerization terminator, and other reaction conditions (for example, the amount of the cyclic siloxane and the polymerization termination) are used. Amount of agent)
Can also be obtained by appropriately selecting Here, as a catalyst for anionic polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C. In the present invention, either one of the above-mentioned vinyl group-containing polydimethylsiloxane and hydroxyl group-containing polydimethylsiloxane can be used, or both can be used in combination.

Such an elastic polymer substance preferably has a molecular weight Mw (weight average molecular weight in terms of standard polystyrene; the same applies hereinafter) of 10,000 to 40,000. In addition, from the viewpoint of heat resistance of the obtained conductive part, the molecular weight distribution index (the value of the ratio Mw / Mn between the standard polystyrene equivalent weight average molecular weight Mw and the standard polystyrene equivalent number average molecular weight Mn; the same applies hereinafter) is 2. Those having 0 or less are preferable.

The conductive particles used in the conductive portion 11 include known simple conductive metal particles such as iron, copper, zinc, chromium, nickel, silver, cobalt, and aluminum.
And alloy conductive metal particles composed of two or more of these metal elements. Among these, simple conductive metal particles such as nickel, iron, and copper are preferable in terms of economy and conductive characteristics. In addition, from the viewpoint that the particles can be easily oriented in the thickness direction of the anisotropic conductive sheet 10 by a method described later, it is preferable to use conductive particles exhibiting magnetism. For example, it is preferable to use nickel particles on the surface of which a coating film made of gold is formed by, for example, electroless plating. The thickness of the coating film is preferably 1000 ° or more. The coating amount is preferably 1% by weight or more of the whole conductive particles, more preferably 2 to 10% by weight, and particularly preferably 3 to 8% by weight.

As the conductive particles, those whose surfaces have been treated with a coupling agent such as a silane coupling agent can be appropriately used. When the surface of the conductive particles is treated with the coupling agent, the adhesiveness between the conductive particles and the elastic polymer material is increased, and as a result, the obtained conductive portion 11 has durability in repeated use. It will be expensive. The amount of the coupling agent used is appropriately selected within a range that does not affect the conductivity of the conductive particles. However, the coverage of the coupling agent on the surface of the conductive particles (the ratio of the coupling agent to the surface area of the conductive core particles). (The ratio of the coating area) is preferably 5% or more, more preferably 7 to 100%, more preferably 10 to 100%, particularly preferably 20 to 100%. .

The particle size of the conductive particles is 1 to 100.
0 μm, more preferably 2 to 50 μm.
0 μm, more preferably 5 to 300 μm, particularly preferably 10 to 200 μm. Further, the particle size distribution (Dw / Dn) of the conductive particles is preferably 1 to 10, more preferably 1.01 to 7, further preferably 1.05 to 5, and particularly preferably 1.1 to 1. 4. By using conductive particles that satisfy such conditions,
The resulting conductive portion 11 is easily deformed under pressure,
Further, in the conductive portion 11, conductive particles are used.

The water content of the conductive particles is preferably 5% or less, more preferably 3% or less, further preferably 2% or less, and particularly preferably 1% or less.
By using the conductive particles satisfying such conditions, it is possible to prevent bubbles from being generated in the polymer material layer when the polymer material layer is cured in the manufacturing method described below or Is suppressed.

It is preferable that such conductive particles are used in an amount of 10 to 1000 parts by weight, preferably 30 to 750 parts by weight, based on 100 parts by weight of the elastic polymer material.
If this ratio is less than 10 parts by weight, the conductive portion 11 having a sufficiently small electric resistance may not be obtained. On the other hand, when this ratio exceeds 1000 parts by weight, the obtained conductive portion 11 tends to be fragile, and the elasticity required for the conductive portion may not be obtained in some cases.

The insulating portion 12 in the anisotropic conductive sheet 10
Is made of an elastic polymer material having an insulating property. Curable polymer material forming materials that can be used to obtain such an elastic polymer material include polybutadiene rubber, natural rubber, polyisoprene rubber, and styrene-
Conjugated diene rubbers such as butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, and block copolymers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer Rubber and their hydrogenated products,
Chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like.The anisotropic conductive sheet obtained is required to have weather resistance. In this case, it is preferable to use a material other than the conjugated diene rubber. As the elastic high molecular substance forming the insulating section 12, the same type or different type of elastic high molecular substance forming the conductive section 11 can be used. Further, the insulating section 12 may be integrated with the conductive path forming section 11 or may be separate.

The thickness of the anisotropic conductive sheet 10 is, for example, 0.1 to 2 mm, preferably 0.2 to 1 mm. The diameter of the conductive part 11 is, for example, 0.01 to 1 mm.
And preferably 0.02 to 0.5 mm.

As a material for forming the adhesive layer 15, a curable resin such as a thermosetting resin or a radiation curable resin, or an elastic polymer substance can be used. Specific examples of the curable resin include an epoxy resin, a polyimide resin, and a phenol resin. In addition, specific examples of the elastic polymer substance include those exemplified as the elastic polymer substance constituting the conductive portion 11 of the anisotropic conductive sheet 10 described above. The thickness of the conductive adhesive layer 15 is, for example, 0.05
０．５0.5 mm, preferably 0.15 to 0.25 m
m.

Further, it is preferable that the adhesive layer 15 contains a conductive powder, so that the adhesive layer 15 having sufficiently high conductivity can be formed. As the conductive powder, various metal powders can be used, and specific examples thereof include silver powder, palladium powder,
Examples thereof include silver-palladium alloy powder, gold powder, copper powder, and a mixture of these metal powders. Further, when the conductive powder is contained in the adhesive layer 15, the content ratio of the conductive powder is 30 to 70% by volume, particularly 40 to 70%.
Preferably it is 60%. If this content ratio is too small, it may be difficult to obtain the adhesive layer 15 having the required conductivity. On the other hand, when this content ratio is excessive, the obtained adhesive layer 15 tends to have low strength, and when used repeatedly, may be damaged early, and a long service life may not be obtained. .

The metal constituting the protruding electrode 20 includes
Iron, copper, zinc, chromium, nickel, gold, silver, cobalt,
A known simple conductive metal such as aluminum and an alloy conductive metal composed of two or more of these metal elements can be exemplified. Among these, simple conductive metals such as nickel, iron, and copper are preferable in terms of economy and conductive characteristics, and nickel is particularly preferable. The surface of the protruding electrode 20 is preferably coated with gold, silver, rhodium, solder, or the like, and particularly preferably coated with gold because contact resistance is extremely small. When coating with gold, the film thickness is preferably 500 ° or more. The thickness (height) of the protruding electrode 20 is preferably 1 μm or more, more preferably 5 to 100 μm, more preferably 10 to 50 μm, and particularly preferably 15 to 35 μm.

The above probe card can be manufactured, for example, by the following method. In this method, first, the anisotropic conductive sheet 10 is manufactured. FIG.
FIG. 2 is an explanatory cross-sectional view illustrating a configuration of an example of a mold used for manufacturing an anisotropic conductive sheet. This mold
It is composed of an upper die 50 and a lower die 55 that is paired with the upper die 50. The upper mold 50 has a template 51 made of a non-magnetic material, and the surface of the template 50 has a recess according to a pattern opposite to the arrangement pattern of the conductive portions 11 in the anisotropic conductive sheet 10 to be manufactured. 51H are formed, and the recess 51H is formed.
Inside, a magnetic member 52 made of a ferromagnetic material is arranged. On the other hand, the lower die 55 has a template 56 made of a non-magnetic material, and the surface of the template 56 is recessed according to the same pattern as the arrangement pattern of the conductive portions 11 in the anisotropic conductive sheet 10 to be manufactured. 56H is formed, and this recess 56H is formed.
Inside, a magnetic member 57 made of a ferromagnetic material is arranged. As the nonmagnetic material constituting the template 51 of the upper mold 50 and the template of the lower mold 55, a nonmagnetic metal such as copper, a heat-resistant resin such as polyimide, or the like can be used. The ferromagnetic materials constituting the magnetic member 52 of the upper mold 50 and the magnetic member 57 of the lower mold 55 include iron, nickel,
Cobalt or an alloy thereof can be used.

Then, as shown in FIG. 3, between the upper mold 50 and the lower mold 55, conductive particles exhibiting magnetism are dispersed in a polymer material which is cured to become an elastic polymer material. In addition to forming a layer (hereinafter, referred to as a “sheet forming material layer”) 10A made of a sheet forming material, a pair of electromagnets 53 and 58 are arranged on the upper surface of the upper die 50 and the lower surface of the lower die 55.

The sheet molding material may contain a curing catalyst for curing the polymer material. As such a curing catalyst, an organic peroxide, a fatty acid azo compound, a hydrosilylation catalyst, or the like can be used. Specific examples of the organic peroxide used as the curing catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide, and ditertiary butyl peroxide. Specific examples of the fatty acid azo compound used as a curing catalyst include azobisisobutyronitrile. Specific examples of the catalyst which can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and salts thereof, a siloxane complex containing a platinum-unsaturated group, a complex of vinylsiloxane and platinum, and platinum and 1,3-divinyltetramethyldisiloxane. And a complex of triorganophosphine or phosphite with platinum, acetylacetate platinum chelate, and a complex of cyclic diene and platinum. The amount of the curing catalyst used is appropriately selected in consideration of the type of the polymer-forming material, the type of the curing catalyst, and other curing treatment conditions. 15 parts by weight.

The sheet molding material may contain, if necessary, ordinary inorganic fillers such as silica powder, colloidal silica, airgel silica, and alumina. By including such an inorganic filler,
The thixotropy of the sheet molding material is ensured, the viscosity is increased, and the dispersion stability of the conductive particles is improved, and the strength of the obtained anisotropic conductive sheet is increased. The use amount of such an inorganic filler is not particularly limited, but if used in a large amount, the orientation of the conductive magnetic particles due to the magnetic field cannot be sufficiently achieved in the manufacturing method described below. Is not preferred.
The viscosity of the sheet molding material is 1 at a temperature of 25 ° C.
It is preferable to be in the range of 0000 to 1,000,000 cp.

By operating the electromagnets 53 and 58, a parallel magnetic field acts in a direction from the magnetic member 52 of the upper die 50 to the corresponding magnetic member 57 of the lower die 55. As a result, in the sheet molding material layer 10A,
The conductive particles exhibiting magnetism dispersed in the sheet forming material layer 10A gather in a portion located between the magnetic member 52 of the upper mold 50 and the corresponding magnetic member 57 of the lower mold 55, More preferably, it is oriented in the thickness direction of the sheet forming material layer 10A. Then, in this state, the sheet forming material layer 10A is subjected to a hardening treatment, so as to be disposed between the magnetic member 52 of the upper die 50 and the corresponding magnetic member 57 of the lower die 55 as shown in FIG. In addition, an anisotropic conductive sheet 10 is formed which includes a conductive portion 11 densely filled with conductive particles and an insulating portion 12 having no or almost no conductive particles.

In the above description, the curing treatment of the sheet molding material layer 10A can be performed while the parallel magnetic field is applied, but can also be performed after the operation of the parallel magnetic field is stopped. The strength of the parallel magnetic field applied to the sheet forming material layer 10A is preferably 200 to 10000 gauss on average. When applying a parallel magnetic field to the sheet molding material layer 10A, it is preferable to vibrate the upper mold 50 and the lower mold 55 with ultrasonic waves. By adopting such a method, the conductive particles dispersed in the sheet forming material layer 10A are moved between the magnetic member 52 of the upper mold 50 and the corresponding magnetic member 57 of the lower mold 55. Can be gathered with high efficiency in the part where it is. As a means for applying a parallel magnetic field, a permanent magnet can be used instead of an electromagnet. As such a permanent magnet, those made of alnico (Fe-Al-Ni-Co-based alloy), ferrite, or the like are preferable in that a parallel magnetic field strength in the above range can be obtained. In the conductive portion 11 thus obtained, since the conductive particles are oriented so as to be arranged in the thickness direction of the anisotropic conductive sheet 10, good conductivity can be obtained even if the ratio of the conductive particles is small.

The curing treatment of the sheet molding material layer 10A is appropriately selected depending on the material to be used, but is usually performed by a heating treatment. The sheet molding material layer 10 is heated
When the curing treatment of A is performed, a heater may be provided for the electromagnets 53 and 58. The specific heating temperature and heating time are appropriately selected in consideration of the type of the material for the polymer substance constituting the sheet molding material layer 10A, the time required for the movement of the conductive particles, and the like.

Next, the protruding electrodes 20 are provided on the respective conductive portions 11 of the anisotropic conductive sheet 10 via the adhesive layer 15.
Are integrally formed. More specifically, as shown in FIG. 5, a metal plate 60 made of, for example, copper is prepared, and an array pattern of the protruding electrodes 20 to be formed is formed on the surface of the metal plate 60 by photolithography. A resist film 65 having a plurality of openings 66 is formed according to the corresponding pattern. Next, as shown in FIG. 6, the surface of the metal plate 60 is subjected to an etching process through the opening 66 of the resist film 65, so that the metal plate 60
A plurality of hemispherical depressions 61 are formed on the surface of the substrate. Thereafter, as shown in FIG. 7, an insulating film 62 is formed on the entire back surface of the metal plate 60, and in this state,
For example, by performing electrolytic nickel plating, nickel is deposited in the recess 61 of the metal plate 60 and the resist film 65.
As a result of being deposited in the opening 66 of the resist film 65 and being hemispherically deposited on the opening 66 of the resist film 65, as shown in FIG. Is formed while being held in the opening 66 of the resist film 65, whereby an intermediate composite 25A including the metal plate 60, the resist film 65, and the plurality of electrode metal bodies 20A is obtained.

After the insulating film 62 is removed from the back surface of the metal plate 60 in the intermediate composite 25A, the metal plate 60 of the intermediate composite 25A is removed by, for example, etching, and further, the electrode metal 20A is removed. By performing a gold plating process on the surface, as shown in FIG. 9, an electrode connector 25 in which the electrode metal body 60 is held in each of the openings 65 of the resist film 65 is obtained. Thereafter, the one end surface of the electrode metal body 20A in the electrode connection body 25 is polished, so that the hemispherical tip portion 21 is formed as shown in FIG.
The protruding electrode 20 is formed by connecting the disk-shaped base end portion 22 with the connecting portion 23.

Next, an adhesive layer forming material made of a curable resin material or a material for an elastic polymer material or a conductive powder in these materials is applied to the end face of the base end portion 22 of the protruding electrode 20 in the electrode connecting body 25. Is coated on the anisotropic conductive sheet 10 such that the base end 22 of the protruding electrode 20 is positioned on the conductive portion 11. By arranging and curing the adhesive layer forming material in this state, the adhesive layer 1 is formed on the conductive portion 11 of the anisotropic conductive sheet 10 as shown in FIG.
5, the protruding electrode 20 in the electrode connecting body 25
Are integrally bonded. Thereafter, by removing the resist film 65 in the electrode connecting body 25, the probe card having the configuration shown in FIG. 1 is manufactured.

In the probe card as described above,
It is used for electrical inspection of a circuit device formed on a wafer, for example, as described below. In the inspection of the circuit device, as shown in FIG. 12, a connection electrode 2 arranged on the surface according to a pattern opposite to the electrode 6 to be inspected of the circuit device formed on the wafer 5 is provided on the surface. Electrically connected to the electrode 2, for example, with a pitch of 2.54 mm, 1.8
An inspection circuit board 1 having a terminal electrode 3 disposed on a 0 mm or 1.27 mm grid point position on the back surface is prepared, and the inspection circuit board 1 is connected to an anisotropic conductive material in a probe card. Conductive portion 11 of conductive sheet 10
It is arranged so that it is located above. On the other hand, below the probe card, the wafer 5 which is the inspection palm is arranged such that the electrode 6 to be inspected faces the corresponding protruding electrode 20. Then, for example, when the inspection circuit board 1 is moved in a direction approaching the wafer 5, the electrodes 6 to be inspected of the wafer 5 are pressed by the protruding electrodes 20 of the probe card, and the oxide film formed on the surface thereof is pierced. Can be
On the other hand, the probe card is sandwiched between the inspection circuit board 1 and the wafer 5, whereby the anisotropic conductive sheet 10 is deformed so as to be compressed in the thickness direction in accordance with the warp state of the wafer 5. A conductive path extending in the thickness direction of the conductive portion 11 is formed. As a result, electrical connection between the connection electrodes 2 of the inspection circuit board 1 and the electrodes 6 to be inspected of the wafer 5 is achieved. Then, in this state, the inspection circuit board 1, the probe card, and the wafer 5 are fixed, and a required inspection is performed.

According to the probe card as described above, the protruding electrodes 20 are integrally provided on the conductive portions 11 of the anisotropic conductive sheet 10 with the adhesive layer 15 interposed therebetween.
Even if the electrode to be inspected of the circuit device to be inspected has an oxide film on its surface, the oxide film can be pierced by the protruding electrode 20 with a small pressing force. Connection can be reliably achieved. Further, since a required electric connection is reliably achieved with a small pressing force to the electrode 6 to be inspected of the circuit device formed on the wafer 5, it is possible to prevent the surface of the wafer 5 from being damaged. And a good electrical connection state can be maintained for a long period of time. Furthermore, since the conductive portion 11 of the anisotropic conductive sheet 10 does not directly contact the electrode 6 to be inspected of the circuit device on the wafer 5, the elasticity of the conductive portion 11 of the anisotropic conductive sheet 10 is high. It is possible to prevent the electrode 6 to be inspected from being contaminated by the low molecular weight component contained in the molecular substance.

<Second Embodiment> FIG. 13 is an explanatory sectional view showing the structure of a main part of a probe card according to a second embodiment of the present invention. Each of the conductive portions 11 of the anisotropic conductive sheet 10 in this probe card has a thickness smaller than the thickness of the insulating portion 12, and is arranged such that its upper surface is located below the upper surface of the insulating portion 12, A recess is formed on the conductive portion 11. The protruding electrode 20 is provided integrally on the conductive portion 11 in a state where the base end portion 22 of the protruding electrode 20 is received in a recess formed on the conductive portion 11. I have.
Other specific configurations are the same as those of the probe card according to the above-described first embodiment. In such a probe card, the protruding height of the protruding electrode 20 from the surface of the anisotropic conductive sheet 10 (the tip portion 21 and the connecting portion 22).
Is preferably 1 μm or more, more preferably 5 to 200 μm, further preferably 10 to 150 μm, and particularly preferably 30 to 80 μm.

The above probe card can be manufactured, for example, by the following method. First, the opening 6 of the resist film 65 is formed in the same manner as in the first embodiment.
An electrode connecting body 25 in which the protruding electrode 20 is held in each of the electrodes 6 is manufactured (see FIGS. 5 to 10). Then, FIG.
14 is prepared, and as shown in FIG. 14, a sheet molding material layer 10A is formed on the surface of the lower mold 55 as shown in FIG.
Is formed, and on the sheet forming material layer 10A, the above-described electrode connecting body 25 is arranged such that the protruding electrode 20 is located above the magnetic member 57 of the lower die 55.

Thereafter, as shown in FIG. 15, a pair of electromagnets 5 are placed on the upper surface of the electrode connector 25 and the lower surface of the lower mold 55.
By disposing the electromagnets 53 and 58 and operating the electromagnets 53 and 58, the protruding electrodes 20 of the electrode connecting body 25 become magnetic poles, and from the protruding electrodes 20 to the magnetic members 5 of the lower mold 55.
A parallel magnetic field acts in the direction toward. As a result, in the sheet molding material layer 10A, the conductive particles exhibiting magnetism dispersed in the sheet molding material layer 10A become the protruding electrodes 20 of the electrode connecting body 25 and the magnetic members 57 of the lower mold 55. And more preferably oriented in the thickness direction of the sheet forming material layer 10A. Then, in this state, the sheet forming material layer 10A is disposed between the protruding electrode 20 of the electrode connecting body 25 and the magnetic member 57 of the lower mold 55 by hardening the sheet forming material layer 10A, as shown in FIG. Conductive part 1 densely filled with conductive particles
An anisotropic conductive sheet 10 comprising 1 and an insulating portion 12 having no or almost no conductive particles is integrally formed on the electrode connecting body 25. Thereafter, the electrode connecting body 25
13 by removing the resist film 65 in FIG.
Is manufactured.

In the above, when applying a parallel magnetic field to the sheet molding material layer 10A, it is preferable to vibrate the electrode connecting body 25 and the lower mold 55 by ultrasonic waves.
By employing such a method, the conductive particles dispersed in the sheet forming material layer 10A are positioned between the protruding electrodes 20 of the electrode connecting body 25 and the magnetic members 57 of the lower mold 55. The parts can be assembled with high efficiency. Other conditions are the same as the manufacturing conditions of the anisotropic conductive sheet 10 in the first embodiment.

According to such a probe card, the same effects as those of the probe card according to the first embodiment can be obtained, and the protruding electrodes 20 are directly connected to the conductive portions 11 of the anisotropic conductive sheet 10. Because it is provided integrally,
The production of the anisotropic conductive sheet 10 and the bonding between the anisotropic conductive sheet 10 and the protruding electrodes 20 can be performed in the same step, thereby simplifying the manufacturing steps.

<Third Embodiment> FIG. 17 is an explanatory sectional view showing the structure of a main part of a probe card according to a third embodiment of the present invention. In this probe card, a support plate 30 in which a plurality of holes 31 are formed in accordance with a pattern corresponding to a pattern of an electrode to be inspected of a circuit device to be inspected is arranged on an anisotropic conductive sheet 10. By fixing the connecting portion 23 of the protruding electrode 20 in the hole 31 of the thirty, the protruding electrode 20 is supported by the support plate 30. The specific configurations of the anisotropic conductive sheet 10 and the protruding electrodes 20 are the same as those of the probe card according to the above-described first embodiment.

In such a probe card, the protruding height of the protruding electrode 20 from the surface of the support 30 (the thickness of the tip portion 21) is preferably 1 μm or more, more preferably 5 to 100 μm. And more preferably 10 to 50 μm, particularly preferably 15 to 35 μm.

The material constituting the support plate 30 is not particularly limited as long as it has an insulating property, but polyimide, aramid, fluorine-based resin, glass fiber, polyester and the like can be used. Among them, polyimide is preferable in terms of processability and the surface of a circuit device such as a wafer is not contaminated. The thickness of the support plate 30 is preferably 1 to 100 μm,
More preferably 5 to 50 μm, particularly preferably 10 to
30 μm. The cross-sectional area of the hole 31 of the support plate 30 is preferably 10 to the area of the surface of the electrode to be inspected.
To 200%, more preferably 30 to 120%, particularly preferably 50 to 100%. If the cross-sectional area of the hole 31 of the support plate 30 is too small, when the protruding electrode 20 is pressed against the electrode to be inspected of the circuit device, the anisotropic conductive sheet 1
Since the pressure is locally concentrated on 0, conduction failure may occur in the conductive portion of the anisotropic conductive sheet. When the cross-sectional area of the hole 31 of the support plate 30 is excessive, when the protruding electrode 20 is pressed against the electrode to be inspected of the circuit device,
The projecting electrode 20 is inclined so that the adjacent projecting electrode 2
There is a case where a short circuit occurs due to contact with 0 or a conduction failure occurs.

The above probe card can be manufactured, for example, by the following method. First, as shown in FIG. 18, a metal plate 60 is prepared, and a support plate having a plurality of holes 31 formed on the metal plate 60 in accordance with a pattern corresponding to a pattern of an electrode to be inspected of a circuit device to be inspected. Form 30. As a method for forming the support plate 30 on the metal plate 60, when a curable resin material such as polyimide is used as a material for forming the support plate 30, a curable resin material before curing is applied on the metal plate 60. Then, a method of forming the holes 31 by laser processing or dry etching can be adopted.

Next, as shown in FIG.
Is etched through the holes 31 of the support plate 30 to form a plurality of hemispherical depressions 61 on the surface of the metal plate 60. Thereafter, as shown in FIG. 20, an insulating film 62 is formed on the entire back surface of the metal plate 60, and in this state, the metal plate 60 is subjected to electrolytic nickel plating to remove nickel from the recesses of the metal plate 60. As shown in FIG. 21, hemispheres are deposited in the holes 61 of the support plate 30 and the holes 31 of the support plate 30, and are hemispherically deposited on the holes 31 of the support plate 30. The electrode metal body 20A to be formed is formed in a state held in the hole 31 of the support plate 30, so that the metal plate 60
Then, an intermediate composite 35A including the support 30 and the plurality of electrode metal bodies 20A is obtained.

After removing the insulating film 62 from the back surface of the metal plate 60 in the intermediate composite 35A, the metal plate 60 of the intermediate composite 35A is removed by, for example, etching, and further, the surface of the electrode metal body 20A is removed. By performing a gold plating process, the electrode connecting body 35 in which the electrode metal body 20A is held in the holes 31 of the support plate 30 is obtained as shown in FIG. Thereafter, by polishing one end surface of the electrode metal body 20A in the electrode connection body 35,
As shown in FIG. 23, the hemispherical tip portion 21 and the disc-shaped base end portion 22 are connected by a connecting portion 23, and the connecting portion 23 is fixed in the hole 31 of the support plate 30. An electrode 20 is formed.

On the other hand, the anisotropic conductive sheet 10 is manufactured in the same manner as in the first embodiment (see FIGS. 2 to 4). Next, the protruding electrode 2 in the electrode connecting body 35
An adhesive layer forming material made of a curable resin material or a material for an elastic polymer substance or an adhesive layer forming material containing a conductive powder in these materials is applied to the end face of the base end portion 22 of the No. 0. The electrode connecting body 35 is connected to the anisotropic conductive sheet 10.
Above, the base end 22 of the protruding electrode 20 is connected to the conductive portion 1.
The probe card having the configuration shown in FIG. 17 is manufactured by arranging it so as to be located on the upper surface 1 and performing a curing treatment of the adhesive layer forming material in this state.

According to such a probe card, the same effects as those of the probe card according to the first embodiment can be obtained, and the following effects can be obtained. On the anisotropic conductive sheet 10, a support 3 for supporting the protruding electrodes 20 is provided.
0 is provided, it is possible to prevent the protruding electrode 20 from tilting when the protruding electrode 20 presses the electrode to be inspected of the circuit device to be inspected. A more reliable connection can be achieved. Also, the support 30 allows the anisotropic conductive sheet 10
Is prevented from directly contacting the circuit device, thereby preventing the surface of the circuit device from being contaminated by the low molecular weight component contained in the elastic polymer material constituting the anisotropic conductive sheet 10. Can be.

<Fourth Embodiment> FIG. 24 is an explanatory sectional view showing the structure of a main part of a fourth embodiment of the probe card according to the present invention. Each of the conductive portions 11 of the anisotropic conductive sheet 10 in this probe card has a thickness smaller than the thickness of the insulating portion 12, and is arranged such that its upper surface is located below the upper surface of the insulating portion 12, A recess is formed on the conductive portion 11. The protruding electrode 20 is provided integrally on the conductive portion 11 in a state where the base end portion 22 of the protruding electrode 20 is received in a recess formed on the conductive portion 11. I have.
The specific configurations of the anisotropic conductive sheet 10 and the protruding electrodes 20 are the same as those of the probe card according to the above-described first embodiment. A support plate 30 having a plurality of holes 31 formed on the anisotropic conductive sheet 10 according to a pattern corresponding to a pattern of an electrode to be inspected of a circuit device to be inspected.
Are integrally provided, and the connecting portions 23 of the protruding electrodes 20 are fixed in the holes 31 of the supporting plate 30 so that the protruding electrodes 20 are supported by the supporting plate 30. The specific configuration of the support plate 30 is the same as that of the third embodiment.

The probe card described above can be manufactured, for example, by the following method. First, in the same manner as in the third embodiment, an electrode connector 35 in which the projecting electrodes 20 are supported in the holes 31 of the support plate 30 is manufactured (see FIGS. 18 to 23). Next, a lower mold 55 in the mold shown in FIG. 2 is prepared, and as shown in FIG. 25, a sheet molding material layer 10A in which conductive particles exhibiting magnetism are dispersed is formed on the surface of the lower mold 55, On the sheet forming material layer 10A, the above-described electrode connecting body 35 is arranged such that the protruding electrode 20 is located above the magnetic member 57 of the lower die 55. On the other hand, the anisotropic conductive sheet 10 is manufactured in the same manner as in the first embodiment (see FIGS. 2 to 4).

Then, as shown in FIG. 26, a pair of electromagnets 5 are placed on the upper surface of the electrode connector 35 and the lower surface of the lower mold 55.
By disposing the electromagnets 53 and 58 and operating the electromagnets 53 and 58, the protruding electrodes 20 of the electrode connecting body 35 become magnetic poles, and the protruding electrodes 20 and the magnetic members 5
A parallel magnetic field acts in the direction toward. As a result, in the sheet forming material layer 10A, the conductive particles exhibiting magnetism dispersed in the sheet forming material layer 10A are combined with the protruding electrodes 20 of the electrode connecting body 35 and the magnetic members 57 of the lower mold 55. And more preferably oriented in the thickness direction of the sheet forming material layer 10A. Then, in this state, the sheet forming material layer 10A is subjected to a curing treatment, so that the sheet forming material layer 10A is disposed between the protruding electrode 20 of the electrode connecting body 35 and the magnetic member 57 of the lower mold 55 as shown in FIG. Conductive part 1 densely filled with conductive particles
An anisotropic conductive sheet 10 composed of an insulating member 12 having no or almost no conductive particles and an insulating portion 12 is formed integrally with the electrode connecting body 35, so that the probe card having the configuration shown in FIG. Manufactured.

In the above description, when applying a parallel magnetic field to the sheet forming material layer 10A, it is preferable to vibrate the electrode connecting body 35 and the lower mold 55 by ultrasonic waves.
By adopting such a method, the conductive particles dispersed in the sheet forming material layer 10A are positioned between the protruding electrodes 20 of the electrode connecting body 35 and the magnetic members 57 of the lower mold 55. The parts can be assembled with high efficiency. Other conditions are the same as the manufacturing conditions of the anisotropic conductive sheet 10 in the first embodiment described above.

According to such a probe card, the same effects as those of the probe card according to the third embodiment can be obtained, and the protruding electrodes 20 can be directly connected to the conductive portions 11 of the anisotropic conductive sheet 10. The manufacturing of the anisotropic conductive sheet 10 which is provided integrally and the anisotropic conductive sheet 10
Since the bonding between the electrode and the protruding electrode 20 can be performed in the same step, the manufacturing process can be simplified.

<Fifth Embodiment> FIG. 28 is an explanatory sectional view showing the structure of a main part of a probe card according to a fifth embodiment of the present invention. In this probe card, the conductive portion 1 is placed on the anisotropic conductive sheet 10.
A wiring portion 16 electrically connected to the first through an adhesive layer 15
The protruding electrode 20 is integrally provided on the wiring portion 16. The protruding electrode 20 is formed on the conductive portion of the anisotropic conductive sheet 10 by the wiring portion 16 and the adhesive layer 15. 11 is electrically connected. The protruding electrode 20 has a hemispherical tip 21 and a hemispherical base 2.
2 are connected by a connecting portion 23, and
They are arranged according to a pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected. Further, a plurality of holes 3 are formed on the anisotropic conductive sheet 10 in accordance with a pattern corresponding to a pattern of an electrode to be inspected of a circuit device to be inspected.
The support plate 30 on which the protruding electrodes 20 are formed is disposed via the wiring portion 16 and the connecting portions 23 of the protruding electrodes 20 are fixed in the holes 31 of the support plate 30.
Are supported by the support plate 30. Other specific configurations are the same as those of the probe card according to the above-described first embodiment.

The above-described probe card can be manufactured, for example, by the following method. First, as in the third embodiment, the metal plate 60 and the support 3
0 and a plurality of metal bodies 20A for electrodes are produced (see FIGS. 18 to 21). Next, the metal plate 60 in the intermediate composite 35A is subjected to photolithography and etching to remove a part of the metal plate 60, and is further subjected to gold plating on the surface of the electrode metal body 20A, as shown in FIG. As shown, the metal plate 60
The wiring pattern 16 of a required pattern connected to the protruding electrode 20 is formed by the remaining part, so that the holes 3 of the support plate 30 are formed.
1. An electrode connecting body 35 having a protruding electrode 20 supported on the electrode 1 and having a wiring portion 16 connected to the protruding electrode 20
Is obtained.

On the other hand, the anisotropic conductive sheet 10 is manufactured in the same manner as in the first embodiment (see FIGS. 2 to 4). A bonding layer forming material made of a curable resin material or a material for an elastic polymer substance or a conductive powder is contained in these materials at required locations on the surface of the wiring portion 16 of the electrode connecting body 35. Apply adhesive layer forming material,
This electrode connecting body 35 is placed on the anisotropic conductive sheet 10,
By arranging the wiring section 16 so that the portion where the adhesive layer forming material is applied is located on the conductive section 11 and performing a curing treatment of the adhesive layer forming material in this state, FIG.
Is manufactured.

According to such a probe card, the same effects as those of the probe card according to the third embodiment can be obtained, and the following effects can be obtained. An anisotropic conductive sheet 1 is provided between the anisotropic conductive sheet 10 and the support 30.
Since the wiring portions 16 for electrically connecting the protruding electrodes 20 are provided on the conductive portions 11 of the anisotropic conductive sheet 10, the pitch of the conductive portions 11 of the anisotropic conductive sheet 10 is inspected by the circuit device to be tested. It is not necessary to match the pitch of the electrodes, and the size can be set appropriately. Therefore, even if the pitch of the electrodes to be inspected of the circuit device to be inspected is small, the anisotropic conductive sheet having the conductive portion having a pitch larger than the pitch of the electrodes to be inspected can be used. The electrical inspection of the electrode to be inspected can be performed in a state where required insulation between the electrodes is secured.

The present invention is not limited to the above embodiment,
Various changes can be made. (1) The tip portion 21 of the protruding electrode 20 is not limited to a hemispherical shape, and may have various shapes, for example, a concave shape, a convex shape, a flat plate shape, a conical shape, a cylindrical shape, a saw shape, or the like, or These may have a composite shape. However, the electrical connection to the electrode to be inspected of the circuit device to be inspected can be stably achieved, and the surface and the periphery of the electrode to be inspected are not damaged. The tip portion 21 is preferably a hemispherical one.

(2) In the first to fourth embodiments, the base end 22 of the protruding electrode 20 is not limited to a disk-shaped one, but may be of various shapes, for example, a circle. A shape other than a plate, such as a flat plate shape, a concave shape, a convex shape, a conical shape, a cylindrical shape, a hemispherical shape, a saw-like shape, or a composite shape thereof may be used. However, stable electrical connection to the conductive part 11 of the anisotropic conductive sheet 10 can be achieved,
A flat plate is preferable in that the anisotropic conductive sheet is not damaged.

(3) In the first and second embodiments, a plurality of projecting electrodes 2
The electrode connected body 25 holding 0 may be manufactured, for example, as follows. As shown in FIG. 5, a resist film in which a plurality of openings 66 are formed on the surface of a metal plate 60 made of, for example, copper according to a pattern corresponding to an arrangement pattern of the protruding electrodes 20 to be formed by a photolithography technique. Then, as shown in FIG. 30, in a state where the insulating film 62 is formed on the entire back surface of the metal plate 60, the metal plate 60 is subjected to, for example, electrolytic nickel plating to form a resist film. The electrode metal body 20A protruding from one surface of the electrode film 65 is formed in a state held in the opening 66 of the resist film 65. Thus, the metal plate 60, the resist film 65, and the plurality of electrode metal bodies 2 are formed.
Thus, an intermediate composite 25A consisting of 0A is obtained. And
After removing the insulating film 62 from the back surface of the metal plate 60 in the intermediate composite 25A, the metal plate 60 of the intermediate composite 25A is subjected to photolithography and etching to remove a part thereof. By performing the gold plating process, as shown in FIG. 31, the protruding electrode 20 in which the distal end portion 21 made of nickel is connected to the base end portion 22 made of copper by the connecting portion 23 made of nickel is held on the resist film 65. Thus, an electrode connector 25 is obtained.

(4) In the third to fifth embodiments, the electrode connecting body 35 in which the plurality of protruding electrodes 20 are held on the support 30 is replaced with a support instead of the resist film 65. By using No. 30, it can be manufactured in the same manner as in the above method (3).

(5) The protruding electrodes 20 may be provided not only on one surface of the anisotropic conductive sheet 10 but also on both surfaces.

(6) In the probe card in which the protruding electrodes 20 are provided on both surfaces of the anisotropic conductive sheet 10, the second
(The protruding electrodes 20 are integrally provided in the recesses formed on both end surfaces of the conductive portion 11 in the anisotropic conductive sheet 10 with the base end portions 22 being received. The following method can be adopted in the case of manufacturing the same. As shown in FIG. 32, a pair of electrode connecting bodies 25 in which the protruding electrodes 20 are held on the resist film 65 in a pattern opposite to each other are prepared, and one of the electrode connecting bodies 25 (the lower side in FIG. A sheet forming material layer 10A is formed on the surface on the base end side of the protruding electrode 20 in the electrode connecting body 25).
0, the other electrode connecting body 25 is connected to the protruding electrode 2
0 is located above the protruding electrode 20 of the one electrode connecting body. Then, a pair of electromagnets 53 and 58 are disposed on the lower surface of one electrode connecting body 25 and the upper surface of the other electrode connecting body 25, and by operating these electromagnets 53 and 58, each of the electrode connecting bodies 25 is formed. The projecting electrodes 20 of the other form a magnetic pole, and a parallel magnetic field acts in a direction from the projecting electrodes 20 of the other electrode connecting body 25 to the projecting electrodes 20 of the one electrode connecting body 25. As a result, in the sheet forming material layer 10A, the conductive particles are connected to the protruding electrodes 20 of the other electrode connecting body 25 and the one electrode connecting body 2.
5 and is more preferably oriented in the thickness direction of the sheet forming material layer 10A. In this state, after the sheet forming material layer 10A is cured, the resist film 6 on each of the electrode connecting bodies 25 is formed.
By removing 5, a probe is provided in which protruding electrodes 20 are integrally provided with base ends 22 received in recesses formed on both end surfaces of conductive portion 11 in anisotropic conductive sheet 10. You get a card. According to such a method, since the anisotropic conductive sheet can be formed without using a special mold, the manufacturing cost can be reduced. Further, by forming the anisotropically conductive sheet 10 having the protruding electrodes 20 provided on both surfaces by the method as described above, the protruding electrodes 20 on one of the surfaces are removed, whereby the anisotropic conductive sheet 10 is removed. A probe card in which the protruding electrodes 20 are provided only on one surface of the sheet can be manufactured.

(7) The probe card formed integrally with the base end portion 22 received in the recesses formed on both end surfaces of the conductive portion 11 of the anisotropic conductive sheet 10 as described above ( In the case of manufacturing by the method 6), FIG.
As shown in FIG. 3, it is preferable to use a protruding electrode 20 having a hemispherical base end 22 as the electrode connecting body 25. According to the method using the electrode connecting body 25, since the base end portion 22 of the protruding electrode 20 is hemispherical,
In a portion serving as a conductive portion in the sheet molding material layer 10A,
A magnetic field having a uniform intensity can be applied in the plane direction, so that the conductive particles in the sheet forming material layer 10A are uniformly gathered in the plane direction on a portion to be a conductive portion of the sheet forming material layer 10A. As a result, the conductive portion having the desired conductivity can be reliably formed. Further, by forming the anisotropically conductive sheet 10 having the protruding electrodes 20 provided on both surfaces by the method as described above, the protruding electrodes 20 on one of the surfaces are removed, whereby the anisotropic conductive sheet 10 is removed. A probe card in which the protruding electrodes 20 are provided only on one surface of the sheet can be manufactured.

(8) A probe card provided on both sides of the anisotropic conductive sheet 10 having the same configuration as that of the fourth embodiment (the protruding electrode 20 is
0, the base portions 22 are integrally provided in recesses formed on both end surfaces of the conductive portion 11, and each of the protruding electrodes 20 is provided on both surfaces of the anisotropic conductive sheet 10. The electrode connector 2 supported by the support plate 30) includes a resist film 65 holding the protruding electrodes 20.
By using the electrode connecting body 35 in which the protruding electrodes 20 are held on the support plate 30 instead of 5, it can be manufactured in the same manner as in the method (6). Further, in such a method, it is preferable that the base portion 22 of the protruding electrode 20 be hemispherical as the electrode connecting body 35, whereby the conductive portion having the desired conductivity can be surely formed. Can be formed.

[0072]

EXAMPLES Hereinafter, specific examples of the probe card of the present invention will be described, but the present invention is not limited to these examples.

Example 1 A laminate of a support plate (30) made of polyimide having a thickness of 25 μm and a metal plate (60) made of copper having a thickness of 18 μm was prepared, and the support plate (30) in this laminate was prepared. Then, by KrF excimer laser,
Holes with a pitch of 0.2 mm and an inner diameter of 0.03 mm (3
1) was formed (see FIG. 18). Then, a metal plate (6
0) is etched through the holes (31) of the support plate (30) to thereby form the metal plate (6).
A plurality of hemispherical depressions (61) were formed on the surface of 0) (see FIG. 19). Thereafter, an insulating film 62 made of polyimide is formed on the entire back surface of the metal plate (60), and the metal plate (60) is subjected to electrolytic nickel plating,
A metal body (2) for an electrode supported in a hole (31) of the support plate (30) and projecting hemispherically from both surfaces of the support plate (30).
0A), thereby producing an intermediate composite (35A) (see FIGS. 20 and 21).

Then, after removing the insulating film (62) from the metal plate (60) in the intermediate composite (35A), the metal plate (60) of the intermediate composite (35A) is removed by etching, and the electrode is further removed. By performing gold plating on the surface of the metal body (20A) for use, the holes (3) of the support plate (30) are formed.
A connected body for an electrode (35) in which the metal body for an electrode (20A) was supported in 1) was manufactured. Thereafter, by polishing one end face of the electrode metal body (20A) in the electrode connection body (35), the hemispherical tip end (21) and the disk-shaped base end (22) are connected. (23), and the connecting portion (23) is connected to the hole (3) of the support plate (30).
1) A protruding electrode (20) fixed inside was formed. The protruding electrode (20) has a hemispherical tip (21) and a disc-shaped base (22) connected by a connecting portion (23), and has a total thickness of 73 μm and a support plate. (30)
(The thickness of the tip portion (21)) is 30 μm.

On the other hand, addition type silicone rubber “1206R”
TV "(manufactured by Shin-Etsu Chemical Co., Ltd.), 100 parts by weight, and a nickel film having an average particle diameter of 28 μm formed with a gold coating film (average film thickness: 0.1 μm, coating amount: 4% by weight). A sheet molding material was prepared by mixing 30 parts by weight of the conductive particles. This sheet molding material is applied to the surface of the lower mold (55) in the mold shown in FIG. 2 by screen printing to form a sheet molding material layer (10A) having a thickness of 0.5 mm. On the material layer (10A), the electrode connecting body (35) was arranged such that the protruding electrode (20) was located above the magnetic member (57) of the lower mold (55) (see FIG. 25).

Then, a pair of electromagnets (53, 58) are disposed on the upper surface of the electrode connecting body (35) and the lower surface of the lower mold (55), and the electromagnets (53, 58) are actuated. A protruding electrode (20) of the connecting body (35);
Between the magnetic member (57) of the lower mold (55) and the magnetic field (57A) of the sheet forming material layer (10A), a parallel magnetic field of 5000 Gauss on average acts on the sheet forming material layer (10A). Is cured at 100 ° C. for 60 minutes to obtain an anisotropic conductive sheet (1).
0) was formed, and thus, a probe card having a configuration shown in FIG. 24 was manufactured.

A wafer having a plurality of circuit devices formed on the surface thereof (one that has been confirmed to be good for all the circuit devices) is prepared, and the obtained probe card is placed on the wafer with the protruding electrode. Are placed on each of the electrodes to be inspected of the circuit device on the wafer, and the pressure applied to each of the electrodes to be inspected is 5 gf, 10 gf, and 15 gf by the following methods (1) to (3). Pressure is applied under the conditions described below, and in this state, the electrical connection between the probe card and the circuit device formed on the wafer is determined by performing an electrical inspection on the electrode to be inspected of the circuit device formed on the wafer. The case where the electrical connection state was good for all the electrodes to be inspected was evaluated as Δ, and the case where there was a portion where the electrical connection state was defective was evaluated as ×. Method (1): The probe card is pressed over the entire surface of the wafer. Method (2): The probe card is pressurized for each circuit device formed on the wafer. Method (3): A probe card is pressurized for each electrode to be inspected in a circuit device formed on a wafer. The results are shown in Table 1.

Comparative Example 1 A sheet molding material was prepared in the same manner as in Example 1, and an anisotropic conductive sheet was produced from this sheet molding material under the same conditions as in Example 1.
A wafer having a plurality of circuit devices formed on its surface (one that has been confirmed to be good for all circuit devices) is prepared, and the obtained anisotropic conductive sheet is placed on this wafer, Each of them is arranged so as to be positioned on each of the electrodes to be inspected of the circuit device on the wafer. According to the above method (1), the pressure applied to each electrode to be inspected is 5 gf,
Pressurized under conditions of 10 gf and 15 gf, and in this state,
The electrical connection between the anisotropic conductive sheet and the circuit device formed on the wafer is checked by performing an electrical test on the electrode to be tested of the circuit device formed on the wafer. evaluated. Table 1 shows the results.

[0079]

[Table 1]

As is clear from the results in Table 1, Example 1
According to the probe card according to the above, it was confirmed that a good electrical connection state was achieved with respect to the electrodes to be inspected of the circuit device formed on the wafer by any of the methods and the pressure. On the other hand, in the case of an anisotropic conductive sheet having no protruding electrodes, a good electrical connection state could not be achieved with respect to an electrode to be inspected of a circuit device formed on a wafer.

[0081]

According to the probe card of the present invention, since the protruding electrode electrically connected to the conductive portion of the anisotropic conductive sheet is provided, the electrode to be inspected has an oxide film on its surface. Even if it is, the oxide film can be pierced by the projecting electrode with a small pressing force, and as a result, required electrical connection can be reliably achieved.
In addition, since the required electrical connection is reliably achieved with a small pressing force, it is possible to prevent the surface of the circuit device to be inspected from being damaged, and to maintain a good electrical connection state for a long period of time. Can be maintained. Further, since the anisotropic conductive sheet does not directly contact the electrode to be inspected, the electrode to be inspected is contaminated by the low molecular weight component contained in the elastic polymer material constituting the anisotropic conductive sheet. Can be prevented.

Further, by providing a support for supporting the protruding electrodes on the anisotropic conductive sheet, when the protruding electrodes press the electrode to be inspected, the protruding electrodes are prevented from tilting. As a result, the required electrical connection can be achieved more reliably. In addition, since the support prevents the anisotropic conductive sheet from directly contacting the circuit device, the low molecular weight component contained in the elastic polymer material constituting the anisotropic conductive sheet causes the circuit device to have a low molecular weight. Can be prevented from being contaminated.

Further, by providing a wiring portion for electrically connecting the protruding electrodes to the conductive portion of the anisotropic conductive sheet between the anisotropic conductive sheet and the support, the conductive portion of the anisotropic conductive sheet is provided. It is not necessary to match the pitch of the conductive portions with the pitch of the electrodes to be inspected of the circuit device to be inspected, and the size can be made as appropriate. Therefore, even if the pitch of the electrodes to be inspected of the circuit device to be inspected is small, the anisotropic conductive sheet having the conductive portion having a pitch larger than the pitch of the electrodes to be inspected can be used. The electrical inspection of the electrode to be inspected can be performed in a state where required insulation between the electrodes is secured.

Since such a probe card has an anisotropic conductive sheet which is easily deformed in the thickness direction and has a protruding electrode which can break through an oxide film with a small pressing force, a circuit device comprising a semiconductor chip is provided. Can be suitably used for inspecting the electrical characteristics of the wafer in a state of a wafer.

[Brief description of the drawings]

FIG. 1 is an explanatory cross-sectional view illustrating a configuration of a main part of a probe card according to a first embodiment of the present invention.

FIG. 2 is an explanatory cross-sectional view illustrating a configuration of an example of a mold for manufacturing an anisotropic conductive sheet.

FIG. 3 is an explanatory sectional view showing a state in which a parallel magnetic field is applied to a sheet molding material layer formed in a mold shown in FIG. 2;

FIG. 4 is an explanatory cross-sectional view showing a state in which a sheet forming material layer has been cured to produce an anisotropic conductive sheet.

FIG. 5 is an explanatory cross-sectional view showing a state in which a resist film is formed on one surface of a metal plate.

FIG. 6 is an explanatory cross-sectional view showing a state where a recess is formed by etching a metal plate.

FIG. 7 is an explanatory cross-sectional view showing a state where an insulating film is formed on the other surface of the metal plate.

FIG. 8 is an explanatory cross-sectional view showing a state in which a metal body for an electrode is formed to produce an intermediate composite.

FIG. 9 is an explanatory cross-sectional view showing a state in which the connection body for an electrode is manufactured.

FIG. 10 is an explanatory cross-sectional view showing a state where a protruding electrode is formed by polishing an electrode metal body of an electrode connecting body.

FIG. 11 is an explanatory cross-sectional view showing a state in which a protruding electrode in a connection body for an electrode is bonded to a conductive portion of an anisotropic conductive sheet via an adhesive layer.

FIG. 12 is an explanatory cross-sectional view showing a state where an electrical inspection of a circuit device is performed using the probe card of the present invention.

FIG. 13 is an explanatory cross-sectional view illustrating a configuration of a main part of a probe card according to a second embodiment of the present invention.

FIG. 14 is an explanatory cross-sectional view showing a state in which an electrode connector is arranged on a lower mold shown in FIG. 2 via a sheet molding material layer.

FIG. 15 is an explanatory cross-sectional view showing a state where a parallel magnetic field is applied to a sheet forming material layer.

FIG. 16 is an explanatory cross-sectional view showing a state in which an anisotropic conductive sheet is formed integrally with a connection body for electrodes.

FIG. 17 is an explanatory cross-sectional view illustrating a configuration of a main part of a probe card according to a third embodiment of the present invention.

FIG. 18 is an explanatory cross-sectional view showing a state in which a support is laminated on one surface of a metal plate.

FIG. 19 is an explanatory cross-sectional view showing a state in which a metal plate is etched to form a recess.

FIG. 20 is an explanatory cross-sectional view showing a state where an insulating film is formed on the other surface of the metal plate.

FIG. 21 is an explanatory cross-sectional view showing a state in which a metal body for an electrode is formed to produce an intermediate composite.

FIG. 22 is an explanatory cross-sectional view showing a state where the electrode connecting body is manufactured.

FIG. 23 is an explanatory cross-sectional view showing a state where a protruding electrode is formed by polishing an electrode metal body of an electrode connecting body.

FIG. 24 is an explanatory cross-sectional view showing a configuration of a main part of a probe card according to a fourth embodiment of the present invention.

FIG. 25 is an explanatory cross-sectional view showing a state where the electrode connecting body is arranged on the lower mold shown in FIG. 2 via a sheet molding material layer.

FIG. 26 is an explanatory cross-sectional view showing a state where a parallel magnetic field is applied to the sheet molding material layer.

FIG. 27 is an explanatory cross-sectional view showing a state in which an anisotropic conductive sheet is integrally formed on a connection body for electrodes.

FIG. 28 is an explanatory sectional view showing a configuration of a main part of a probe card according to a fourth embodiment of the present invention.

FIG. 29 is an explanatory cross-sectional view showing a state where the electrode connector is manufactured.

FIG. 30 is an explanatory sectional view showing an intermediate composite including a metal plate having no recess, a resist film, and a metal body for an electrode.

FIG. 31 is an explanatory cross-sectional view showing a state where the electrode connection body is manufactured.

FIG. 32 is an explanatory cross-sectional view showing a state in which a sheet molding material layer is formed between a pair of electrode connecting bodies and a parallel magnetic field is applied to the sheet molding material layer.

FIG. 33 shows a state in which a sheet molding material layer is formed between a pair of electrode connecting bodies provided with projecting electrodes each having a hemispherical base end portion, and a parallel magnetic field is applied to the sheet molding material layer; FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Inspection circuit board 2 Connection electrode 3 Terminal electrode 5 Wafer 6 Inspection electrode 10 Anisotropic conductive sheet 10A Sheet molding material layer 11 Conductive part 12 Insulating part 15 Adhesive layer 16 Wiring part 20 Protruding electrode 20A Metal body for electrode DESCRIPTION OF SYMBOLS 21 Top end part 22 Base end part 23 Connecting part 25 Electrode connection body 25A Intermediate composite 30 Support body 31 Hole 35 Electrode connection body 35A Intermediate composite 50 Upper mold 51 Template 51H recess 52 Magnetic member 53 Electromagnet 55 Lower mold 56 type plate 56H recess 57 magnetic member 58 electromagnet 60 metal plate 61 recess insulating film 65 resist film 66 opening

Claims (4)

[Claims] 1. A probe card interposed between a circuit device to be inspected and an electrical inspection device for performing an electrical inspection of electrodes of the circuit device, the probe card comprising: An anisotropic conductive sheet in which a plurality of conductive portions each filled with particles and extending in the thickness direction are arranged in a state in which they are insulated from each other by an insulating portion made of an elastic polymer material; A probe card, comprising: a plurality of protruding electrodes electrically connected to each of the conductive portions, wherein the anisotropic conductive sheet and the protruding electrodes are integrated. 2. The probe card according to claim 1, wherein each of the protruding electrodes is supported by a support plate disposed on an anisotropic conductive sheet. 3. A wiring portion for electrically connecting a projecting electrode to a conductive portion of the anisotropic conductive sheet between the anisotropic conductive sheet and the support. The probe card according to claim 2. 4. The probe card according to claim 1, wherein the circuit device to be inspected is a circuit device formed on a wafer.