JP2001044680A - Method and case for shielding electromagnetic wave - Google Patents
Method and case for shielding electromagnetic waveInfo
- Publication number
- JP2001044680A JP2001044680A JP11218935A JP21893599A JP2001044680A JP 2001044680 A JP2001044680 A JP 2001044680A JP 11218935 A JP11218935 A JP 11218935A JP 21893599 A JP21893599 A JP 21893599A JP 2001044680 A JP2001044680 A JP 2001044680A
- Authority
- JP
- Japan
- Prior art keywords
- case
- thermoplastic resin
- panel
- electromagnetic wave
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 11
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 25
- 238000004891 communication Methods 0.000 claims abstract description 11
- 238000010030 laminating Methods 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、携帯型通信機器等
における電磁波シールド方法および電磁波シールドケー
スに関する。The present invention relates to an electromagnetic wave shielding method and an electromagnetic wave shielding case in a portable communication device and the like.
【０００２】[0002]
【従来の技術】従来、携帯電話機等の携帯型通信機にお
いては、電磁波ノイズによる電子機器の誤動作を防止す
ることを目的として、内部の電子回路をシールドするた
めの種々の方法が採用されている。2. Description of the Related Art Conventionally, in a portable communication device such as a portable telephone, various methods for shielding an internal electronic circuit have been adopted for the purpose of preventing malfunction of an electronic device due to electromagnetic wave noise. .
【０００３】図３は、従来の電磁波シールド方法の一例
を示す実装構造の部分断面図であり、電子部品３３を実
装した電気回路を構成するパネル３４は、上ケースを構
成する熱可塑性樹脂３１と下ケースを構成する熱可塑性
樹脂３５の内部に固定され、また、電子回路３３は、板
金等により形成されるカバー３２で覆うことにより電磁
波シールドされている。FIG. 3 is a partial sectional view of a mounting structure showing an example of a conventional electromagnetic wave shielding method. A panel 34 forming an electric circuit on which an electronic component 33 is mounted is made up of a thermoplastic resin 31 forming an upper case. The electronic circuit 33 is fixed inside the thermoplastic resin 35 constituting the lower case, and the electronic circuit 33 is shielded by an electromagnetic wave by being covered with a cover 32 formed of sheet metal or the like.
【０００４】この従来技術においては、シールドを目的
としたカバー３２を別途板金等により製作し、パネル３
４上に取り付けなければならないので、製作費用がかか
りコスト削減の妨げとなっている。また、電磁波をシー
ルドすることを目的としたカバー３２が、電子部品３３
及び実装パネル３４の上に配置する積み上げ構造となっ
ているので、実装高さを多く必要とし、装置の薄型化が
困難である。さらに、熱可塑性樹脂成形品３１及び３５
の剛性を確保するためにはその肉厚を厚くしなければな
らない。In this conventional technique, a cover 32 for the purpose of shielding is manufactured separately from a sheet metal or the like, and a panel 3 is formed.
Since it has to be mounted on the upper surface 4, the production cost is high, which hinders cost reduction. Also, the cover 32 for the purpose of shielding electromagnetic waves is provided with an electronic component 33.
In addition, since the stacked structure is arranged on the mounting panel 34, a large mounting height is required, and it is difficult to reduce the thickness of the device. Further, the thermoplastic resin molded products 31 and 35
In order to secure the rigidity, the thickness must be increased.
【０００５】図４は、従来の電磁波シールド方法の他の
実装構造の例を示す部分断面図である。この従来例で
は、電子部品４３を実装した電気回路を構成するパネル
４４は、上ケースを構成する熱可塑性樹脂４１と下ケー
スを構成する熱可塑性樹脂４５の内部に固定され、上ケ
ースを構成する熱可塑性樹脂４１内面には、２次加工処
理により鍍金等の皮膜４２が形成されており、この皮膜
４２により電子部品４の電磁波シールドを行っている。FIG. 4 is a partial sectional view showing another example of the mounting structure of the conventional electromagnetic wave shielding method. In this conventional example, a panel 44 constituting an electric circuit on which an electronic component 43 is mounted is fixed inside a thermoplastic resin 41 constituting an upper case and a thermoplastic resin 45 constituting a lower case to constitute an upper case. A coating 42 such as plating is formed on the inner surface of the thermoplastic resin 41 by a secondary processing, and the coating 42 performs electromagnetic wave shielding of the electronic component 4.
【０００６】この方法によれば、図３のようなシールド
用のカバー３２を別途設ける必要がないので、装置の薄
型化が図れるが、上ケースとなる熱可塑性樹脂４１に対
して鍍金等の二次加工処理を別途行わなければならない
ので、コスト削減の妨げとなっていた。According to this method, there is no need to separately provide a shield cover 32 as shown in FIG. 3, so that the apparatus can be made thinner. The subsequent processing must be performed separately, which hinders cost reduction.
【０００７】[0007]
【発明が解決しようとする課題】本発明の目的は、上記
問題点に鑑み、この種の携帯型通信機において、装置の
薄型化及び剛性の確保と低コスト化を満たすことが可能
な電磁波シールド方法を提供することにある。SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide an electromagnetic wave shield capable of satisfying the requirements of a portable communication device of this type in which the thickness and the rigidity of the device can be ensured and the cost can be reduced. It is to provide a method.
【０００８】[0008]
【課題を解決するための手段】本発明の電磁波シールド
方法は、熱可塑性樹脂を成形して構成される携帯型通信
機等のケースを、ＡＢＳ等の熱可塑性樹脂層と金属を充
眞した熱可塑性樹脂層とからなる２色成形品により形成
し、この２色成形品により形成されたケースによって電
気回路を構成するパネルに実装される内部電子部品の電
磁波シールドを行うことを特徴としている。According to the present invention, there is provided an electromagnetic wave shielding method comprising: forming a case of a portable communication device or the like formed by molding a thermoplastic resin; It is characterized in that it is formed of a two-color molded product composed of a plastic resin layer, and a case formed of the two-color molded product shields electromagnetic waves of internal electronic components mounted on a panel constituting an electric circuit.
【０００９】本発明によれば、ケースとなる熱可塑性樹
脂が、ＡＢＳ等の熱可塑性樹脂層と金属を充眞した熱可
塑性樹脂層とからなる２色成形品により形成されている
ので、ケース自体で電磁波シールドを行うことができ、
ケースに対して鍍金等の二次加工処理を行う必要がなく
なる。また、金属を充眞した熱可塑性樹脂層も剛性の確
保に寄与するので外面のＡＢＳ等の熱可塑性樹脂層の厚
みをその分薄くすることができ、低コスト化及び薄型化
を図ることができる。According to the present invention, since the thermoplastic resin serving as the case is formed of a two-color molded article composed of a thermoplastic resin layer such as ABS and a thermoplastic resin layer filled with metal, the case itself is formed. Can perform electromagnetic shielding,
It is not necessary to perform secondary processing such as plating on the case. In addition, since the thermoplastic resin layer filled with metal also contributes to securing rigidity, the thickness of the thermoplastic resin layer such as ABS on the outer surface can be reduced correspondingly, and cost reduction and thinning can be achieved. .
【００１０】[0010]
【発明の実施の形態】図１は、本発明の電磁波シールド
方法が適用される携帯型通信機を示しており、ケース１
０内に電磁波シールドされる電子回路が実装されてい
る。図２は、本発明の実施の形態を示す部分断面図であ
り、図１のＡ−Ａ線に沿った断面図を示している。FIG. 1 shows a portable communication device to which an electromagnetic wave shielding method of the present invention is applied.
An electronic circuit to be shielded from electromagnetic waves is mounted in the area 0. FIG. 2 is a partial cross-sectional view showing the embodiment of the present invention, and is a cross-sectional view taken along line AA of FIG.
【００１１】図２を参照すると、本発明による携帯型通
信機のケース１０は、熱可塑性樹脂層１１と金属を充眞
した熱可塑性樹脂層１２とが積層された２色成形品から
なる上ケースと、熱可塑性樹脂のみにより構成された下
ケース１５と、これらのケースの内部に支持固定された
電気回路を構成するパネル１４と、該パネル１４上に実
装される電子部品１３にて構成される。Referring to FIG. 2, a case 10 of a portable communication device according to the present invention is an upper case formed of a two-color molded product in which a thermoplastic resin layer 11 and a metal-filled thermoplastic resin layer 12 are laminated. And a lower case 15 made of only a thermoplastic resin, a panel 14 constituting an electric circuit supported and fixed inside these cases, and an electronic component 13 mounted on the panel 14. .
【００１２】電気回路を構成するパネル１４は、プリン
ト配線基板により構成され、その裏面は、接地配線等の
金属配線が設けられているので、パネル１４上に実装さ
れた電子部品１３は、その上部を、熱可塑性樹脂層１１
と金属を充眞した熱可塑性樹脂層１２とが積層された２
色成形品からなる上ケースによって、またその下部をパ
ネル１４裏面の金属配線等によって覆われることによ
り、電磁波シールドされる。The panel 14 constituting the electric circuit is composed of a printed wiring board, and the rear surface thereof is provided with a metal wiring such as a ground wiring, so that the electronic component 13 mounted on the panel 14 has an upper part. To the thermoplastic resin layer 11
And a thermoplastic resin layer 12 filled with metal.
The electromagnetic wave is shielded by an upper case made of a color molded product and a lower portion thereof is covered by a metal wiring or the like on the back surface of the panel 14.
【００１３】この上ケースは、熱可塑性樹脂層１１と金
属を充眞した熱可塑性樹脂層１２は２色成形により形成
された成形品であり、ケース形成時点で一体的に処理さ
れるので、ケース成形後に金属膜を鍍金する等の二次加
工処理を行う場合と比較してその製造工程が簡略化され
る。また、金属を充眞した熱可塑性樹脂層１２もケース
の剛性に寄与するので、その分熱可塑性樹脂層１１の厚
みを減らすことが可能となるので、結果として装置の薄
型化にも寄与する。The upper case is a molded article formed by two-color molding of the thermoplastic resin layer 11 and the metal-filled thermoplastic resin layer 12, and is integrally processed at the time of forming the case. The manufacturing process is simplified as compared with the case of performing a secondary processing such as plating a metal film after molding. Further, since the thermoplastic resin layer 12 filled with metal also contributes to the rigidity of the case, it is possible to reduce the thickness of the thermoplastic resin layer 11 by that amount, thereby contributing to the thinning of the device.
【００１４】なお、上記の実施の形態では、携帯型通信
機のケース１０の内、上ケースにのみ熱可塑性樹脂と金
属を充眞した熱可塑性樹脂とを２色成形した成形品を用
いたが、下ケース１５にも熱可塑性樹脂と金属を充眞し
た熱可塑性樹脂とを２色成形した成形品を用いてもよ
い。このように、ケース１０全体を熱可塑性樹脂と金属
を充眞した熱可塑性樹脂とを２色成形した成形品により
構成すれば、電磁波シールド効果はより有効となる。In the above embodiment, a molded product obtained by molding a thermoplastic resin and a metal-filled thermoplastic resin in two colors only in the upper case of the case 10 of the portable communication device is used. Alternatively, the lower case 15 may be made of a molded article formed by two-color molding of a thermoplastic resin and a thermoplastic resin filled with metal. In this way, if the entire case 10 is formed of a molded product formed by two-color molding of a thermoplastic resin and a thermoplastic resin filled with a metal, the electromagnetic wave shielding effect becomes more effective.
【００１５】また、上記実施例では、ケースの外面側を
ＡＢＳ等の熱可塑性樹脂層とし、内面側を金属を充眞し
た熱可塑性樹脂層としているが、逆に、ケースの外面側
を金属を充眞した熱可塑性樹脂層とし、内面側をＡＢＳ
等の熱可塑性樹脂層としてもよい。In the above embodiment, the outer surface of the case is made of a thermoplastic resin layer such as ABS, and the inner surface is made of a thermoplastic resin layer filled with metal. Conversely, the outer surface of the case is made of metal. Filled thermoplastic resin layer, ABS inside
And the like.
【００１６】[0016]
【発明の効果】本発明によれば、電気回路を構成するパ
ネルに実装される電子部品から発される電磁波をシール
ドをすることを目的とした鍍金等の二次加工処理、ある
いは板金等により形成されたカバーの取り付けが不要と
なるので、部品コストを削減できる。According to the present invention, secondary processing such as plating for the purpose of shielding electromagnetic waves emitted from electronic components mounted on a panel constituting an electric circuit, or formation by sheet metal or the like is provided. Since it is not necessary to attach the cover thus set, the cost of parts can be reduced.
【００１７】さらに、電気回路を構成するパネルに実装
される電子部品から発される電磁波をシールドをするこ
とを目的とした板金等により形成された部品の取り付け
が必要ないため、実装高さを低くすることができ、ま
た、金属を充填した熱可塑性樹脂により剛性がアップし
肉厚を低減が可能となるので、装置の薄型化を図ること
ができる。Furthermore, since it is not necessary to mount a component formed of a sheet metal or the like for the purpose of shielding an electromagnetic wave emitted from an electronic component mounted on a panel constituting an electric circuit, the mounting height is reduced. Further, the rigidity is increased by the metal-filled thermoplastic resin and the wall thickness can be reduced, so that the device can be made thinner.
【図１】本発明が適用される携帯型通信機ケースの一例
を示す図である。FIG. 1 is a diagram showing an example of a portable communication device case to which the present invention is applied.
【図２】本発明の実施の形態を示す実装構造の部分断面
図である。FIG. 2 is a partial cross-sectional view of the mounting structure showing the embodiment of the present invention.
【図３】従来例を示す実装構造の部分断面図である。FIG. 3 is a partial sectional view of a mounting structure showing a conventional example.
【図４】他の従来例を示す実装構造の部分断面図であ
る。FIG. 4 is a partial sectional view of a mounting structure showing another conventional example.
１０ ケース １１ 熱可塑性樹脂 １２ 金属を充填した熱可塑性樹脂 １３，３３，４３ 電子部品 １４，３４，４４ 電気回路を構成するパネル １５，３５，４５ 熱可塑性樹脂成型品 ３１，４１ 熱可塑性樹脂成型品 ３２ 板金等により形成されるカバー ４２ 二次加工処理により形成される鍍金等の皮膜 DESCRIPTION OF SYMBOLS 10 Case 11 Thermoplastic resin 12 Thermoplastic resin filled with metal 13, 33, 43 Electronic component 14, 34, 44 Panel which comprises an electric circuit 15, 35, 45 Thermoplastic resin molded product 31, 41 Thermoplastic resin molded product 32 Cover formed by sheet metal etc. 42 Coating such as plating formed by secondary processing
Claims (4)
可塑性樹脂層と金属を充眞した熱可塑性樹脂層とからな
る２色成形品を用いることにより、電気回路を構成する
パネルに実装される電子部品を電磁波シールドすること
を特徴とする電磁波シールド方法。1. A two-color molded product comprising a thermoplastic resin layer such as ABS and a metal-filled thermoplastic resin layer is used as a case of an electronic device, so that it is mounted on a panel constituting an electric circuit. An electromagnetic wave shielding method comprising shielding an electronic component from electromagnetic waves.
び下ケースにより形成される内部空間に支持固定された
電気回路を構成するパネルと、該パネル上面に実装され
た電子部品とを有する携帯型通信器機において、前記上
ケース及び下ケースのうち少なくとも前記上ケースを、
ＡＢＳ等の熱可塑性樹脂層と金属を充眞した熱可塑性樹
脂層からなる２色成形品によって構成したことを特徴と
する電磁波シールドケース。2. A portable device having an upper case and a lower case, a panel constituting an electric circuit supported and fixed in an internal space formed by the upper case and the lower case, and an electronic component mounted on an upper surface of the panel. In the type communication device, at least the upper case of the upper case and the lower case,
An electromagnetic wave shielding case comprising a two-color molded product comprising a thermoplastic resin layer such as ABS and a thermoplastic resin layer filled with metal.
スは、その外面側がＡＢＳ等の熱可塑性樹脂層であり、
内面側が金属を充眞した熱可塑性樹脂層であることを特
徴とする請求項２記載の電磁波シールドケース。3. The case made of the two-color molded product has a thermoplastic resin layer such as ABS on the outer surface side.
The electromagnetic wave shielding case according to claim 2, wherein the inner surface side is a thermoplastic resin layer filled with a metal.
ることを特徴とする請求項２記載の電磁波シールドケー
ス。4. The electromagnetic wave shielding case according to claim 2, wherein the portable communication device is a mobile phone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11218935A JP2001044680A (en) | 1999-08-02 | 1999-08-02 | Method and case for shielding electromagnetic wave |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11218935A JP2001044680A (en) | 1999-08-02 | 1999-08-02 | Method and case for shielding electromagnetic wave |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001044680A true JP2001044680A (en) | 2001-02-16 |
Family
ID=16727642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11218935A Pending JP2001044680A (en) | 1999-08-02 | 1999-08-02 | Method and case for shielding electromagnetic wave |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001044680A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003085521A (en) * | 2001-09-12 | 2003-03-20 | Alps Electric Co Ltd | Card type electronic circuit unit with display |
| JP2006210526A (en) * | 2005-01-26 | 2006-08-10 | Matsushita Electric Works Ltd | Electromagnetic shield housing |
| JP2007320179A (en) * | 2006-06-01 | 2007-12-13 | Shinsei:Kk | Manufacturing process of composite resin molded parts for electronic device |
| WO2010083455A3 (en) * | 2009-01-18 | 2010-09-23 | Bretford Manufacturing Inc. | Carrying case |
| GB2514708A (en) * | 2010-09-07 | 2014-12-03 | Caged Idea S Llc | Data transmission blocking holder |
| US9655419B2 (en) | 2010-09-07 | 2017-05-23 | Michael J. Nash | Data signal blocking personal communication device holder |
| KR20170096945A (en) | 2016-02-17 | 2017-08-25 | 가부시기가이샤 디스코 | Semiconductor package and method of manufacturing semiconductor package |
| DE102018200209A1 (en) | 2017-01-10 | 2018-07-12 | Disco Corporation | SEMICONDUCTOR CONSTRUCTION ELEMENT CHIP AND MANUFACTURING METHOD FOR A SEMICONDUCTOR CONSTRUCTION ELEMENT CHIP |
| CN110642507A (en) * | 2019-10-31 | 2020-01-03 | 维沃移动通信有限公司 | Housing of electronic device and preparation method thereof, and electronic device |
| DE102019217089A1 (en) | 2018-11-06 | 2020-05-07 | Disco Corporation | PRODUCTION METHOD OF A SEMICONDUCTOR COMPONENT WITH A METAL LAYER |
| JP2020191336A (en) * | 2019-05-20 | 2020-11-26 | 三菱電機株式会社 | Barrier structure for circuit boards |
| JP2023089950A (en) * | 2021-12-16 | 2023-06-28 | アイシン テクニカル センター オブ アメリカ インコーポレイテッド | polymer graphene electronic component housing |
-
1999
- 1999-08-02 JP JP11218935A patent/JP2001044680A/en active Pending
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003085521A (en) * | 2001-09-12 | 2003-03-20 | Alps Electric Co Ltd | Card type electronic circuit unit with display |
| JP2006210526A (en) * | 2005-01-26 | 2006-08-10 | Matsushita Electric Works Ltd | Electromagnetic shield housing |
| JP2007320179A (en) * | 2006-06-01 | 2007-12-13 | Shinsei:Kk | Manufacturing process of composite resin molded parts for electronic device |
| WO2010083455A3 (en) * | 2009-01-18 | 2010-09-23 | Bretford Manufacturing Inc. | Carrying case |
| US8188714B2 (en) | 2009-01-18 | 2012-05-29 | Bretford Manufacturing, Inc. | Carrying case |
| US10104818B2 (en) | 2010-09-07 | 2018-10-16 | Caged Idea's Llc | Data transmission blocking holder |
| GB2514708A (en) * | 2010-09-07 | 2014-12-03 | Caged Idea S Llc | Data transmission blocking holder |
| GB2514708B (en) * | 2010-09-07 | 2015-04-01 | Caged Idea S Llc | Data transmission blocking holder |
| US9655419B2 (en) | 2010-09-07 | 2017-05-23 | Michael J. Nash | Data signal blocking personal communication device holder |
| US10405622B2 (en) | 2010-09-07 | 2019-09-10 | Caged Idea's Llc | Data signal blocking personal communication device holder |
| US10269724B2 (en) | 2016-02-17 | 2019-04-23 | Disco Corporation | Semiconductor package device including electromagnetic wave shield and method of manufacturing the same |
| KR20170096945A (en) | 2016-02-17 | 2017-08-25 | 가부시기가이샤 디스코 | Semiconductor package and method of manufacturing semiconductor package |
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