JP2000331582A - Thermal fuse - Google Patents
Thermal fuseInfo
- Publication number
- JP2000331582A JP2000331582A JP11142571A JP14257199A JP2000331582A JP 2000331582 A JP2000331582 A JP 2000331582A JP 11142571 A JP11142571 A JP 11142571A JP 14257199 A JP14257199 A JP 14257199A JP 2000331582 A JP2000331582 A JP 2000331582A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- movable contact
- temperature
- lead wire
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000010276 construction Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は所定の温度に達する
と回路を遮断する温度ヒューズに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal fuse that cuts off a circuit when a predetermined temperature is reached.
【0002】[0002]
【従来の技術】可動接点(可動コンタクト)は接触抵抗
低減のために高価な銀板が採用される。この可動接点を
リードコンタクトに押しつける異形スプリングは,感温
可溶体の溶解時に速やかに転動するように,中央部が膨
らんだタイコ型を採用する。小径の金属ケース内への異
形スプリング自動挿入は意外と難しい。ケース内で回転
するためである。異形スプリングに代えて末広スプリン
グを採用した特願平9-169559号を本発明者は開発する。2. Description of the Related Art An expensive silver plate is used for a movable contact (movable contact) to reduce contact resistance. The deformed spring that presses the movable contact against the lead contact adopts a Tyco type with a bulged central part so that it can roll quickly when the temperature-sensitive fusible material melts. Automatic insertion of a deformed spring into a small diameter metal case is surprisingly difficult. This is to rotate in the case. The present inventor has developed Japanese Patent Application No. 9-169559 which employs a Suehiro spring in place of a deformed spring.
【0003】[0003]
【発明が解決しようとする課題】溶断時の作動を確実に
すべく、可動コンタクトと感温可溶体とのあいだのスプ
リング力を余り大きくできない。接触抵抗を1mΩ以下
にできない。また、封止体を金属スリーブ開口部カシメ
で封止する量産方式では、歩留り向上を高める意味でも
このスプリング力を必要以上に高めることはできない。The spring force between the movable contact and the temperature-sensitive fusible element cannot be increased so much as to ensure the operation at the time of fusing. The contact resistance cannot be reduced below 1 mΩ. Further, in a mass production system in which the sealing body is sealed with a metal sleeve opening portion caulking, the spring force cannot be increased more than necessary in order to improve the yield.
【0004】[0004]
【課題を解決するための手段】底部にリード線を取り付
けた金属スリーブ内に、押圧スプリングと、感温可溶体
と,透孔を有する可動コンタクトと、折曲外周部と透孔
を有する弾性コンタクトと、開放スプリングと、リード
線を中央に有する封止体とを順次配置する。A pressing spring, a temperature-sensitive fusible material, a movable contact having a through hole, and an elastic contact having a bent outer peripheral portion and a through hole are provided in a metal sleeve having a lead wire attached to a bottom portion. , An opening spring, and a sealing body having a lead wire at the center are sequentially arranged.
【0005】[0005]
【発明の実施の形態】リード線9と一体の金属スリーブ
1内に、3〜4ターンの押圧スプリング6と、金属板
と、所定温度になると溶解する感温可溶体4と、透孔を
有する可動コンタクト3と、0.1 mm厚の純銅を第2図
のように打ち抜き成形した弾性コンタクト2と、開放ス
プリング5、リード線9を中央に有する封止体7とを順
次挿入し、金属スリーブ1開口部をカシメ固定し、エポ
キシ樹脂等で封止する。 弾性コンタクト2は、折曲外
周部と透孔を有し、銀メッキしてある。従来の弾性コン
タクト2は高価な銀板である。従来の押圧スプリング6
は可動コンタクト3と弾性コンタクト2とのあいだに配
置されていたので、感温可溶体4の溶解時に可動コンタ
クト3と一緒に移動する。押圧スプリング6のスプリン
グ力(セット時の挟圧力)を余り大きくできなかった。
しかし、本発明の押圧スプリング6は可動コンタクト3
から離れているために、スプリング力をより大きくで
き、リード線9と弾性コンタクト2との接触抵抗を低く
できる。1.5 mm径のリード線を使用する時、抵抗値は
0.5 mΩに納まる。温度ヒューズの通電時の内部発熱箇
所は、リード線8の先端と弾性コンタクト2の接触面で
ある。この内部発熱による温度上昇は、従来品(内部抵
抗1mΩ、10アンペア)では7℃であったが、本発明
(内部抵抗1mΩ、10アンペア)では4℃であった。
可動コンタクト3に当接している感温可溶体4が、内部
発熱を拡散し局所的温度上昇を阻止している。可動コン
タクト3の透孔は、リード線8の先端と面接触を可能と
するとともに、自動挿入時のリード線8の位置決めとし
ても機能する。DESCRIPTION OF THE PREFERRED EMBODIMENTS In a metal sleeve 1 integral with a lead wire 9, a pressing spring 6 of 3 to 4 turns, a metal plate, a temperature-sensitive fusible material 4 which melts at a predetermined temperature, and a through hole are provided. As shown in FIG. 2, a movable contact 3, a resilient contact 2 formed by punching and molding 0.1 mm thick pure copper, an opening spring 5, and a sealing body 7 having a lead wire 9 at the center are sequentially inserted. The part is fixed by caulking and sealed with epoxy resin or the like. The elastic contact 2 has a bent outer peripheral portion and a through hole, and is plated with silver. The conventional elastic contact 2 is an expensive silver plate. Conventional pressing spring 6
Is disposed between the movable contact 3 and the elastic contact 2, and moves together with the movable contact 3 when the temperature-sensitive fusible substance 4 is melted. The spring force (pressing force at the time of setting) of the pressing spring 6 could not be increased so much.
However, the pressing spring 6 of the present invention has the
, The spring force can be increased, and the contact resistance between the lead wire 9 and the elastic contact 2 can be reduced. When using a 1.5 mm diameter lead wire, the resistance is
Fits in 0.5 mΩ. An internal heat generating portion when the thermal fuse is energized is a contact surface between the end of the lead wire 8 and the elastic contact 2. The temperature rise due to this internal heat generation was 7 ° C. for the conventional product (internal resistance 1 mΩ, 10 amps), but was 4 ° C. for the present invention (internal resistance 1 mΩ, 10 amps).
The temperature-sensitive fusible body 4 in contact with the movable contact 3 diffuses internal heat generation and prevents a local temperature rise. The through hole of the movable contact 3 allows surface contact with the tip of the lead wire 8 and also functions as positioning of the lead wire 8 during automatic insertion.
【0006】次に作動について説明する。温度ヒューズ
が所定の温度に達すると、感温可溶体4は溶解(ガス
化)する。発生した液体やガスは、可動コンタクト3及
び弾性コンタクト2の透孔を経て、開放スプリング5側
に入り込み、開放スプリング5による弾性コンタクト2
とリード線8との分離を促進する。リード線8から離れ
た可動コンタクト3は、フリー状態で移動する。同時に
開放される押圧スプリング6はこの可動コンタクト3の
動きにいっさい影響を与えない。Next, the operation will be described. When the temperature fuse reaches a predetermined temperature, the temperature-sensitive fusible substance 4 melts (gasifies). The generated liquid or gas enters the opening spring 5 side through the through holes of the movable contact 3 and the elastic contact 2, and the elastic contact 2
And the lead wire 8 are promoted. The movable contact 3 separated from the lead wire 8 moves in a free state. The pressing spring 6, which is opened at the same time, does not affect the movement of the movable contact 3 at all.
【0007】[0007]
【発明の効果】本発明は、底部にリード線9を取り付け
た金属スリーブ1内に、押圧スプリング6と、感温可溶
体4と,透孔を有する可動コンタクト3と、折曲外周部
と透孔を有する弾性コンタクト2と、開放スプリング5
と、リード線8を中央に有する封止体7とを順次配置し
たため、押圧スプリング6を従来よりも強くでき、リー
ド線8と弾性コンタクト2との接触抵抗を低減できる。
また、感温可溶体8が可動コンタクト3と当接するた
め、内部発熱を拡散でき、局所温度上昇を阻止できる。According to the present invention, a pressing spring 6, a temperature-sensitive fusible member 4, a movable contact 3 having a through hole, a bent outer peripheral portion, and a pressing member 6 are provided in a metal sleeve 1 having a lead wire 9 attached to a bottom portion. Elastic contact 2 having a hole, and opening spring 5
And the sealing body 7 having the lead wire 8 at the center are sequentially arranged, so that the pressing spring 6 can be made stronger than before, and the contact resistance between the lead wire 8 and the elastic contact 2 can be reduced.
Further, since the temperature-sensitive fusible member 8 comes into contact with the movable contact 3, internal heat generation can be diffused, and a local temperature rise can be prevented.
【図1】断面図である。FIG. 1 is a sectional view.
【図2】主要部品の斜視図である。FIG. 2 is a perspective view of main components.
1 金属スリーブ 2 弾性コンタクト 3 可動コンタクト 4 感温可溶体 5 開放スプリング 6 押圧スプリング 7 封止体 8 リード線 9 リード線 DESCRIPTION OF SYMBOLS 1 Metal sleeve 2 Elastic contact 3 Movable contact 4 Temperature sensitive fusible material 5 Opening spring 6 Pressing spring 7 Sealing body 8 Lead wire 9 Lead wire
Claims (2)
ーブ1内に、押圧スプリング6と、感温可溶体4と,透
孔を有する可動コンタクト3と、折曲外周部と透孔を有
する弾性コンタクト2と、開放スプリング5と、リード
線8を中央に有する封止体7とを順次配置してなる、温
度ヒューズ。1. In a metal sleeve 1 having a lead wire 9 attached to a bottom portion, a pressing spring 6, a temperature-sensitive fusible member 4, a movable contact 3 having a through hole, an elastic member having a bent outer peripheral portion and a through hole. A thermal fuse in which a contact 2, an opening spring 5, and a sealing body 7 having a lead wire 8 at the center are sequentially arranged.
常時可動コンタクト3に当接する、請求項1記載の温度
ヒューズ。2. The thermal fuse according to claim 1, wherein the temperature-sensitive fusible member is always in contact with the movable contact by the pressing spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11142571A JP2000331582A (en) | 1999-05-24 | 1999-05-24 | Thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11142571A JP2000331582A (en) | 1999-05-24 | 1999-05-24 | Thermal fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000331582A true JP2000331582A (en) | 2000-11-30 |
Family
ID=15318432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11142571A Pending JP2000331582A (en) | 1999-05-24 | 1999-05-24 | Thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000331582A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110648886A (en) * | 2019-09-21 | 2020-01-03 | 天宇匹克电子(惠州)有限公司 | Small thermal fuse link with double insulators |
-
1999
- 1999-05-24 JP JP11142571A patent/JP2000331582A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110648886A (en) * | 2019-09-21 | 2020-01-03 | 天宇匹克电子(惠州)有限公司 | Small thermal fuse link with double insulators |
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