JP2000328042A - Sealing compound composition - Google Patents
Sealing compound compositionInfo
- Publication number
- JP2000328042A JP2000328042A JP11138409A JP13840999A JP2000328042A JP 2000328042 A JP2000328042 A JP 2000328042A JP 11138409 A JP11138409 A JP 11138409A JP 13840999 A JP13840999 A JP 13840999A JP 2000328042 A JP2000328042 A JP 2000328042A
- Authority
- JP
- Japan
- Prior art keywords
- group
- compound
- polymer
- platinum
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 52
- 150000001875 compounds Chemical class 0.000 title claims abstract description 36
- 238000007789 sealing Methods 0.000 title abstract description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 106
- 229920000642 polymer Polymers 0.000 claims abstract description 81
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 49
- -1 thiophene compound Chemical class 0.000 claims abstract description 48
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Divinylene sulfide Natural products C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229920002367 Polyisobutene Polymers 0.000 claims abstract description 20
- 125000000524 functional group Chemical group 0.000 claims abstract description 20
- 239000003054 catalyst Substances 0.000 claims abstract description 19
- 229930192474 thiophene Natural products 0.000 claims abstract description 17
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 15
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 7
- 150000004294 cyclic thioethers Chemical class 0.000 claims abstract description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 3
- 125000004437 phosphorous atom Chemical group 0.000 claims abstract description 3
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 3
- 239000011593 sulfur Substances 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 28
- 125000000101 thioether group Chemical group 0.000 claims description 22
- 150000002430 hydrocarbons Chemical group 0.000 claims description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims description 17
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 239000000565 sealant Substances 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 11
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 7
- 239000003566 sealing material Substances 0.000 claims description 7
- 125000001841 imino group Chemical group [H]N=* 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 3
- 125000001302 tertiary amino group Chemical group 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 230000000704 physical effect Effects 0.000 abstract description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 42
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 39
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 32
- 239000000243 solution Substances 0.000 description 28
- 238000006243 chemical reaction Methods 0.000 description 26
- 239000002253 acid Substances 0.000 description 24
- 239000003446 ligand Substances 0.000 description 22
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 238000010438 heat treatment Methods 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 16
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 16
- 238000006116 polymerization reaction Methods 0.000 description 15
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 14
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 13
- 239000002585 base Substances 0.000 description 11
- 239000000178 monomer Substances 0.000 description 11
- 238000011084 recovery Methods 0.000 description 9
- 125000000753 cycloalkyl group Chemical group 0.000 description 8
- 125000005843 halogen group Chemical group 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 150000004687 hexahydrates Chemical class 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- NZFVHTDPGHVCOL-UHFFFAOYSA-N 1-(bromomethyl)-2-[2-(bromomethyl)phenyl]sulfanylbenzene Chemical compound BrCC1=CC=CC=C1SC1=CC=CC=C1CBr NZFVHTDPGHVCOL-UHFFFAOYSA-N 0.000 description 6
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 125000002947 alkylene group Chemical group 0.000 description 6
- 230000035699 permeability Effects 0.000 description 6
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- FCEHBMOGCRZNNI-UHFFFAOYSA-N 1-benzothiophene Chemical compound C1=CC=C2SC=CC2=C1 FCEHBMOGCRZNNI-UHFFFAOYSA-N 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- 150000001721 carbon Chemical group 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- UVEWQKMPXAHFST-UHFFFAOYSA-N n,1-diphenylmethanimine Chemical compound C=1C=CC=CC=1C=NC1=CC=CC=C1 UVEWQKMPXAHFST-UHFFFAOYSA-N 0.000 description 4
- 239000002683 reaction inhibitor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 3
- QMMFVYPAHWMCMS-UHFFFAOYSA-N Dimethyl sulfide Chemical compound CSC QMMFVYPAHWMCMS-UHFFFAOYSA-N 0.000 description 3
- 239000002841 Lewis acid Substances 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 125000000732 arylene group Chemical group 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 150000002527 isonitriles Chemical class 0.000 description 3
- 150000007517 lewis acids Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 150000003057 platinum Chemical class 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- KXSFECAJUBPPFE-UHFFFAOYSA-N 2,2':5',2''-terthiophene Chemical compound C1=CSC(C=2SC(=CC=2)C=2SC=CC=2)=C1 KXSFECAJUBPPFE-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- BLZKSRBAQDZAIX-UHFFFAOYSA-N 2-methyl-1-benzothiophene Chemical compound C1=CC=C2SC(C)=CC2=C1 BLZKSRBAQDZAIX-UHFFFAOYSA-N 0.000 description 2
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical compound CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 2
- 238000005727 Friedel-Crafts reaction Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- CHRUFKIFDUZHEH-UHFFFAOYSA-N [4-(bromomethyl)phenyl]-dimethylphosphane Chemical compound CP(C)C1=CC=C(CBr)C=C1 CHRUFKIFDUZHEH-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical compound CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
- 239000003518 caustics Substances 0.000 description 2
- 239000012986 chain transfer agent Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- XYZMOVWWVXBHDP-UHFFFAOYSA-N cyclohexyl isocyanide Chemical group [C-]#[N+]C1CCCCC1 XYZMOVWWVXBHDP-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- IYYZUPMFVPLQIF-UHFFFAOYSA-N dibenzothiophene Chemical compound C1=CC=C2C3=CC=CC=C3SC2=C1 IYYZUPMFVPLQIF-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- HASCQPSFPAKVEK-UHFFFAOYSA-N dimethyl(phenyl)phosphine Chemical group CP(C)C1=CC=CC=C1 HASCQPSFPAKVEK-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- IWVKTOUOPHGZRX-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.COC(=O)C(C)=C IWVKTOUOPHGZRX-UHFFFAOYSA-N 0.000 description 2
- FSBLVBBRXSCOKU-UHFFFAOYSA-N n-butyl isocyanide Chemical group CCCC[N+]#[C-] FSBLVBBRXSCOKU-UHFFFAOYSA-N 0.000 description 2
- 125000005702 oxyalkylene group Chemical group 0.000 description 2
- RCIBIGQXGCBBCT-UHFFFAOYSA-N phenyl isocyanide Chemical compound [C-]#[N+]C1=CC=CC=C1 RCIBIGQXGCBBCT-UHFFFAOYSA-N 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 description 2
- HYWCXWRMUZYRPH-UHFFFAOYSA-N trimethyl(prop-2-enyl)silane Chemical group C[Si](C)(C)CC=C HYWCXWRMUZYRPH-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 1
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 1
- OWXJKYNZGFSVRC-NSCUHMNNSA-N (e)-1-chloroprop-1-ene Chemical compound C\C=C\Cl OWXJKYNZGFSVRC-NSCUHMNNSA-N 0.000 description 1
- HELCSRZMDRYPIJ-UHFFFAOYSA-N 1,4,7,10,13,16-hexathiacyclooctadecane Chemical compound C1CSCCSCCSCCSCCSCCS1 HELCSRZMDRYPIJ-UHFFFAOYSA-N 0.000 description 1
- JZVKYARMSUTTSV-UHFFFAOYSA-N 1,4,7,10,13-pentathiacyclopentadecane Chemical compound C1CSCCSCCSCCSCCS1 JZVKYARMSUTTSV-UHFFFAOYSA-N 0.000 description 1
- KDCBVVQAMMXRFB-UHFFFAOYSA-N 1,4,7,10,13-pentazacyclopentadecane Chemical compound C1CNCCNCCNCCNCCN1 KDCBVVQAMMXRFB-UHFFFAOYSA-N 0.000 description 1
- QBPPRVHXOZRESW-UHFFFAOYSA-N 1,4,7,10-tetraazacyclododecane Chemical compound C1CNCCNCCNCCN1 QBPPRVHXOZRESW-UHFFFAOYSA-N 0.000 description 1
- OXZZXSNMSMZDCT-UHFFFAOYSA-N 1,4,7,10-tetrathiacyclohexadecane Chemical compound C1CCCSCCSCCSCCSCC1 OXZZXSNMSMZDCT-UHFFFAOYSA-N 0.000 description 1
- GWRGEEAABGHXBR-UHFFFAOYSA-N 1,4-bis(2-chloropropan-2-yl)benzene Chemical compound CC(C)(Cl)C1=CC=C(C(C)(C)Cl)C=C1 GWRGEEAABGHXBR-UHFFFAOYSA-N 0.000 description 1
- FKQDVXKCPSKZSH-UHFFFAOYSA-N 1-(bromomethyl)-4-isocyanobenzene Chemical compound BrCC1=CC=C([N+]#[C-])C=C1 FKQDVXKCPSKZSH-UHFFFAOYSA-N 0.000 description 1
- KPQFGTSOAVOKTR-UHFFFAOYSA-N 1-(chloromethoxy)-2-hex-1-enylbenzene Chemical compound CCCCC=CC1=CC=CC=C1OCCl KPQFGTSOAVOKTR-UHFFFAOYSA-N 0.000 description 1
- KKLSEIIDJBCSRK-UHFFFAOYSA-N 1-(chloromethyl)-2-ethenylbenzene Chemical compound ClCC1=CC=CC=C1C=C KKLSEIIDJBCSRK-UHFFFAOYSA-N 0.000 description 1
- HGHYFKUMLWEAMR-UHFFFAOYSA-N 1-(isocyanomethyl)-4-methylbenzene Chemical compound CC1=CC=C(C[N+]#[C-])C=C1 HGHYFKUMLWEAMR-UHFFFAOYSA-N 0.000 description 1
- JAWVCUNWTMNOOS-UHFFFAOYSA-N 1-butyl-4-isocyanobenzene Chemical compound CCCCC1=CC=C([N+]#[C-])C=C1 JAWVCUNWTMNOOS-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- QPPCIPBFKQOIMT-UHFFFAOYSA-N 1-chloro-4-isocyanobenzene Chemical compound ClC1=CC=C([N+]#[C-])C=C1 QPPCIPBFKQOIMT-UHFFFAOYSA-N 0.000 description 1
- DUDKKPVINWLFBI-UHFFFAOYSA-N 1-chlorobut-1-ene Chemical compound CCC=CCl DUDKKPVINWLFBI-UHFFFAOYSA-N 0.000 description 1
- CEDCUGJMWLHFCR-UHFFFAOYSA-N 1-ethenyl-4-hex-1-enoxybenzene Chemical compound CCCCC=COC1=CC=C(C=C)C=C1 CEDCUGJMWLHFCR-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- PHXXEJBIUOARGY-UHFFFAOYSA-N 1-isocyano-3-methoxybenzene Chemical compound COC1=CC=CC([N+]#[C-])=C1 PHXXEJBIUOARGY-UHFFFAOYSA-N 0.000 description 1
- MIEQKTRWKZYUPY-UHFFFAOYSA-N 1-isocyano-4-methoxybenzene Chemical compound COC1=CC=C([N+]#[C-])C=C1 MIEQKTRWKZYUPY-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- OHZAHWOAMVVGEL-UHFFFAOYSA-N 2,2'-bithiophene Chemical compound C1=CSC(C=2SC=CC=2)=C1 OHZAHWOAMVVGEL-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QZOBOLDDGXPTBP-UHFFFAOYSA-N 2-(bromomethyl)thiophene Chemical compound BrCC1=CC=CS1 QZOBOLDDGXPTBP-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- WIFMYMXKTAVDSQ-UHFFFAOYSA-N 2-bromo-1-benzothiophene Chemical compound C1=CC=C2SC(Br)=CC2=C1 WIFMYMXKTAVDSQ-UHFFFAOYSA-N 0.000 description 1
- KPJKMUJJFXZGAX-UHFFFAOYSA-N 2-chloropropan-2-ylbenzene Chemical compound CC(C)(Cl)C1=CC=CC=C1 KPJKMUJJFXZGAX-UHFFFAOYSA-N 0.000 description 1
- YVPXQMYCTGCWBE-UHFFFAOYSA-N 2-isocyano-2,4,4-trimethylpentane Chemical group CC(C)(C)CC(C)(C)[N+]#[C-] YVPXQMYCTGCWBE-UHFFFAOYSA-N 0.000 description 1
- MJZUMMKYWBNKIP-UHFFFAOYSA-N 2-isocyanopropane Chemical compound CC(C)[N+]#[C-] MJZUMMKYWBNKIP-UHFFFAOYSA-N 0.000 description 1
- OKEHURCMYKPVFW-UHFFFAOYSA-N 2-methoxythiophene Chemical compound COC1=CC=CS1 OKEHURCMYKPVFW-UHFFFAOYSA-N 0.000 description 1
- MHNNAWXXUZQSNM-UHFFFAOYSA-N 2-methylbut-1-ene Chemical compound CCC(C)=C MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 description 1
- RNBCQLCYZIHPON-UHFFFAOYSA-N 3-(4-bromophenyl)-2-methylprop-2-enal Chemical compound O=CC(C)=CC1=CC=C(Br)C=C1 RNBCQLCYZIHPON-UHFFFAOYSA-N 0.000 description 1
- PNXDDJPALLQFMY-UHFFFAOYSA-N 5-phenylpent-4-en-1-amine Chemical compound NCCCC=CC1=CC=CC=C1 PNXDDJPALLQFMY-UHFFFAOYSA-N 0.000 description 1
- LLQHSBBZNDXTIV-UHFFFAOYSA-N 6-[5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-4,5-dihydro-1,2-oxazol-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC1CC(=NO1)C1=CC2=C(NC(O2)=O)C=C1 LLQHSBBZNDXTIV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- NOIHRFSSUIMSKH-UHFFFAOYSA-N N1NCNCCNCCNCCNCCNCC1 Chemical compound N1NCNCCNCCNCCNCCNCC1 NOIHRFSSUIMSKH-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- GVOKAHCTMMCWJT-UHFFFAOYSA-N OS(C1=C(CBr)C=CC=C1)(O)=O Chemical compound OS(C1=C(CBr)C=CC=C1)(O)=O GVOKAHCTMMCWJT-UHFFFAOYSA-N 0.000 description 1
- 239000005662 Paraffin oil Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- WTARULDDTDQWMU-UHFFFAOYSA-N Pseudopinene Natural products C1C2C(C)(C)C1CCC2=C WTARULDDTDQWMU-UHFFFAOYSA-N 0.000 description 1
- 239000002262 Schiff base Substances 0.000 description 1
- 150000004753 Schiff bases Chemical class 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- GMTXBUZKCHNBCH-UHFFFAOYSA-L [K].[Pt](Cl)Cl Chemical compound [K].[Pt](Cl)Cl GMTXBUZKCHNBCH-UHFFFAOYSA-L 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- BHELZAPQIKSEDF-UHFFFAOYSA-N allyl bromide Chemical compound BrCC=C BHELZAPQIKSEDF-UHFFFAOYSA-N 0.000 description 1
- XCPQUQHBVVXMRQ-UHFFFAOYSA-N alpha-Fenchene Natural products C1CC2C(=C)CC1C2(C)C XCPQUQHBVVXMRQ-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229930006722 beta-pinene Natural products 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- 125000005997 bromomethyl group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- NLDGJRWPPOSWLC-UHFFFAOYSA-N deca-1,9-diene Chemical compound C=CCCCCCCC=C NLDGJRWPPOSWLC-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- XNMQEEKYCVKGBD-UHFFFAOYSA-N dimethylacetylene Natural products CC#CC XNMQEEKYCVKGBD-UHFFFAOYSA-N 0.000 description 1
- MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- RJUVPCYAOBNZAX-VOTSOKGWSA-N ethyl (e)-3-(dimethylamino)-2-methylprop-2-enoate Chemical compound CCOC(=O)C(\C)=C\N(C)C RJUVPCYAOBNZAX-VOTSOKGWSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 230000000855 fungicidal effect Effects 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- LCWMKIHBLJLORW-UHFFFAOYSA-N gamma-carene Natural products C1CC(=C)CC2C(C)(C)C21 LCWMKIHBLJLORW-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000000879 imine group Chemical group 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910003002 lithium salt Inorganic materials 0.000 description 1
- 159000000002 lithium salts Chemical class 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 150000004681 metal hydrides Chemical class 0.000 description 1
- CBXWICRJSHEQJT-UHFFFAOYSA-N n,1-diphenylethanimine Chemical compound C=1C=CC=CC=1C(C)=NC1=CC=CC=C1 CBXWICRJSHEQJT-UHFFFAOYSA-N 0.000 description 1
- ZFKWRXUWOWXNMZ-UHFFFAOYSA-N n-(1,2-diphenylethenyl)aniline Chemical compound C=1C=CC=CC=1NC(C=1C=CC=CC=1)=CC1=CC=CC=C1 ZFKWRXUWOWXNMZ-UHFFFAOYSA-N 0.000 description 1
- HXTGGPKOEKKUQO-UHFFFAOYSA-N n-methyl-1-phenylmethanimine Chemical compound CN=CC1=CC=CC=C1 HXTGGPKOEKKUQO-UHFFFAOYSA-N 0.000 description 1
- BHGHXAOHFWSPNE-UHFFFAOYSA-N n-phenylethanimine Chemical compound CC=NC1=CC=CC=C1 BHGHXAOHFWSPNE-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical compound [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical group 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- DNAJDTIOMGISDS-UHFFFAOYSA-N prop-2-enylsilane Chemical compound [SiH3]CC=C DNAJDTIOMGISDS-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920013730 reactive polymer Polymers 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003577 thiophenes Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、加熱硬化しうる一
液性シール剤組成物に関するものであり、特に本発明の
組成物の硬化物は低透湿性であり湿気を嫌う電子部品な
どのシールに適するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a one-part sealant composition which can be cured by heating, and in particular, a cured product of the composition of the present invention has low moisture permeability and is suitable for sealing electronic parts and the like which do not like moisture. It is suitable for.
【0002】[0002]
【従来の技術】従来よりシール剤組成物として空気中の
湿気で硬化するシリコーン樹脂はよく知られている。シ
リコーン樹脂は耐熱性、耐寒性に優れており汎用的なシ
ール剤としては十分な性能を有しており、建築用、自動
車機械用など広く使用されている。しかし、シリコーン
樹脂は大気中の湿気で厚膜硬化することからわかるよう
に、硬化物の透湿性は比較的高い。そのため、湿分によ
り性能が低下したり破損してしまう電子部品を内部に収
納する部品のケースなどをシールする場合には、シリコ
ーン樹脂では不十分であった。2. Description of the Related Art Silicone resins which cure with moisture in the air have been well known as sealant compositions. Silicone resin is excellent in heat resistance and cold resistance and has sufficient performance as a general-purpose sealant, and is widely used for construction, automobile machinery and the like. However, as can be seen from the fact that a silicone resin cures a thick film by atmospheric moisture, the cured product has a relatively high moisture permeability. For this reason, silicone resin has been insufficient for sealing a case or the like of a component that stores therein an electronic component whose performance is deteriorated or damaged by moisture.
【0003】上述した、シリコーン樹脂とよばれるもの
は珪素原子に結合した加水分解性基を有し、シロキサン
結合を形成することにより架橋し得る珪素原子含有基
(以下「加水分解性珪素基」という)を有するジアルキ
ルシロキサン重合体であり、また分子主鎖をオキシアル
キレン系重合体やイソブチレン系重合体を使用したもの
も既に知られている。これらは湿気によって常温で硬化
し、ゴム状硬化物が得られるため、従来からよく使用さ
れている。しかし、いずれも湿気による硬化は反応性が
低く、硬化に時間を要するという問題がある。また、加
水分解性珪素基を有するイソブチレン系重合体は加水分
解性珪素基を有するオキシアルキレン系重合体やジメチ
ルシロキサン系重合体よりも低透湿性であるため湿気硬
化性が非常に悪く、厚膜硬化性が悪いという問題があ
る。そのため、深部まで早く硬化させようとするには2
液混合タイプにしなければならないがこれは使い勝手が
悪いものであった。[0003] The above-mentioned silicone resin has a hydrolyzable group bonded to a silicon atom and has a silicon atom-containing group which can be crosslinked by forming a siloxane bond (hereinafter referred to as "hydrolyzable silicon group"). ), And those using an oxyalkylene-based polymer or an isobutylene-based polymer as the molecular main chain are already known. Since these are cured at normal temperature by moisture to obtain a rubber-like cured product, they have been conventionally used. However, in any case, there is a problem that curing by moisture has low reactivity and requires a long time for curing. Further, the isobutylene-based polymer having a hydrolyzable silicon group has a lower moisture permeability than the oxyalkylene-based polymer or dimethylsiloxane-based polymer having a hydrolyzable silicon group, so that the moisture curability is very poor, and the There is a problem that the curability is poor. Therefore, 2
It had to be a liquid mixing type, but this was inconvenient.
【0004】また、従来のシール材は湿分により性能が
低下したり破損してしまう電子部品を内部に収納する部
材などから防湿するシール剤としては不十分であった。
例えば太陽電池の電極部や衛星アンテナなどは空気中の
湿分により著しく性能が低下する。また、CdS/Cd
Teを光起電力部分として含む太陽電池などは湿分と接
すると有害物質を発生するなどの環境や人体を脅かす場
合もあるため、空気中の湿気を完全に遮断するシール剤
が要求されてきた。Further, the conventional sealing material is insufficient as a sealing agent for preventing moisture from deteriorating from a member for accommodating an electronic component whose performance is deteriorated or damaged by moisture.
For example, the performance of an electrode portion of a solar cell, a satellite antenna, or the like is significantly reduced due to moisture in the air. Also, CdS / Cd
A solar cell or the like containing Te as a photovoltaic portion may generate harmful substances when exposed to moisture, and may pose a threat to the environment or the human body. Therefore, a sealant that completely blocks moisture in the air has been required. .
【0005】[0005]
【発明が解決しようとする課題】低透湿性のゴム材料と
しては従来よりイソブチレン系重合体が提案されてお
り、所望の方法により硬化する硬化性樹脂にする方法
が、検討されてきた。As a rubber material having low moisture permeability, an isobutylene-based polymer has been conventionally proposed, and a method of forming a curable resin which can be cured by a desired method has been studied.
【0006】例えばポリイソブチレン分子中にアルコキ
シシランやオキシムシラン等の加水分解性シランを付与
させて、湿気硬化性樹脂にしたり、アクリル基やグリシ
ジル基を付与させて、加熱硬化性樹脂や光硬化性樹脂に
したりと様々な方法でイソブチレン樹脂を硬化性樹脂に
する方法が発表されてきた。For example, by adding a hydrolyzable silane such as an alkoxysilane or an oxime silane to a polyisobutylene molecule to obtain a moisture-curable resin, or by imparting an acrylic group or a glycidyl group, a heat-curable resin or a photocurable Various methods have been disclosed for converting isobutylene resin into a curable resin by using various methods such as resin.
【0007】ポリイソブチレンの分子中にアルケニル基
含有ケイ素を付加させ、水素含有ケイ素化合物とハイド
ロシリル化反応させる硬化性樹脂を得る方法も発表され
ている。通常、ハイドロシリル化反応による1液性タイ
プは組成物中に反応抑制剤を添加して保存状態時の白金
触媒の活性を抑え、硬化させたいときは加熱することに
より触媒活性を高めることにより反応を開始するという
原理で達成される。しかし、ポリイソブチレンは高分子
であり架橋点が少ないため白金触媒の活性が高くないと
優れた硬化物が得られない。[0007] A method has also been disclosed in which silicon containing an alkenyl group is added to the molecule of polyisobutylene to obtain a curable resin that undergoes a hydrosilylation reaction with a hydrogen-containing silicon compound. Generally, the one-part type by the hydrosilylation reaction suppresses the activity of the platinum catalyst during storage by adding a reaction inhibitor to the composition, and when curing is desired, increases the catalytic activity by heating. Is achieved on the principle of starting. However, since polyisobutylene is a polymer and has few crosslinking points, an excellent cured product cannot be obtained unless the activity of the platinum catalyst is high.
【0008】そのため、主鎖がポリイソブチレンの1液
性タイプの場合、従来から公知である反応抑制剤と白金
触媒の組み合わせを検討して保存性と加熱時の硬化時間
のバランスを最適な状態にしても、最終硬化物の樹脂強
度がポリイソブチレン本来の強度に達しないという欠点
があった。要するに、保存性と硬化時間と最終強度を満
足するものはなく、実用には至っていないというのが現
状である。Therefore, when the main chain is a one-component type of polyisobutylene, a combination of a conventionally known reaction inhibitor and a platinum catalyst is examined to optimize the balance between storage stability and curing time during heating. However, there is a disadvantage that the resin strength of the final cured product does not reach the original strength of polyisobutylene. In short, there is nothing satisfying the preservability, the curing time, and the final strength, and at present, it has not been put to practical use.
【0009】硬化物の樹脂強度が弱いと、シール材とし
て使用したときに静的な状態での使用には耐えうるが、
高圧部のシールや高温部のシール、振動や衝撃が加わる
部分のシールには使用することができない。If the cured product has a low resin strength, it can withstand use in a static state when used as a sealing material.
It cannot be used for sealing high-pressure parts, high-temperature parts, or parts where vibration or impact is applied.
【0010】[0010]
【課題を解決するための手段】本発明の目的は、上記の
ような従来の硬化性樹脂組成物の有する問題を解消する
ものであり、すなわち、(a)アルケニル基を有するポ
リイソブチレン化合物と(b)分子中に少なくとも2個
のヒドロシリル基を有する化合物および(c)白金触媒
および、(d)常温では白金触媒のヒドロシリル化を促
進する能力を抑制し、高温時には抑制しない化合物から
なることを特徴とする加熱硬化しうる一液性シール剤組
成物を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the conventional curable resin composition, that is, (a) a polyisobutylene compound having an alkenyl group and ( b) a compound having at least two hydrosilyl groups in the molecule and (c) a platinum catalyst, and (d) a compound that suppresses the ability of the platinum catalyst to promote hydrosilylation at room temperature and does not suppress the ability at high temperatures. The purpose of the present invention is to provide a one-part sealant composition which can be cured by heating.
【0011】本発明の(a)成分であるアルケニル基を
有するポリイソブチレン化合物は主鎖成分が単量体組成
として50モル%以上のイソブチレン単位を含む化合物
であり、数平均分子量をコントロールするためにはケネ
ディー氏によって提案された1,4−ビス(α−クロロ
イソプロピル)ベンゼンのような二官能性分または1,
3,5−トリス(α−クロロイソプロピル)ベンゼンの
ような三官能成分を開始剤兼連鎖移動剤、BCL3を触
媒としてイソブチレンをカチオン重合させるイニファー
法(米国特許4276394号)により製造される。イ
ソブチレン単位は50モル以上をポリイソブチレンとし
たが本発明の低透湿性、高反応性、保存安定性等を向上
させるためにはイソブチレン単位は多い方が好ましく、
(a)成分の主鎖部分すべてがイソブチレン単位から形
成されても良く、好ましくは90%以上がイソブチレン
の場合である。The alkenyl group-containing polyisobutylene compound (a) of the present invention is a compound whose main chain component contains 50 mol% or more of isobutylene units as a monomer composition. Is a bifunctional moiety such as 1,4-bis (α-chloroisopropyl) benzene proposed by Kennedy or 1,
It is produced by an inifer method (US Pat. No. 4,276,394) in which a trifunctional component such as 3,5-tris (α-chloroisopropyl) benzene is used as an initiator / chain transfer agent, and BCL 3 is used as a catalyst to cationically polymerize isobutylene. The isobutylene unit is preferably 50 mol or more of polyisobutylene, but in order to improve the low moisture permeability, high reactivity, storage stability and the like of the present invention, it is preferable that the isobutylene unit has a large amount,
The entire main chain of the component (a) may be formed from isobutylene units, and preferably 90% or more is isobutylene.
【0012】イソブチレン以外の反復単位としてイソブ
チレンと共重合が可能な単量体としては炭素数4〜12
のオレフィン、ビニルエーテル、芳香族ビニル化合物、
ビニルシラン類、アリルシラン類等があげられる。この
ような単量体の共重合体成分の具体例としては1−ブテ
ン、2−ブテン、2−メチル−1−ブテン、3−メチル
−2−ブテン、ペンテン、ヘキセン、シクロヘキセン、
ビニルヘキサン、5−エチリデンノルボルネン、インデ
ン、β−ピネン等の脂肪族オレフィン類;シクロペンタ
ジエン、ジシクロペンタジエン等のジエン類;スチレ
ン、α−メチルスチレン、p−クロロスチレン等のスチ
レン類等をあげることができる。The monomer which can be copolymerized with isobutylene as a repeating unit other than isobutylene is one having 4 to 12 carbon atoms.
Olefins, vinyl ethers, aromatic vinyl compounds,
Examples include vinyl silanes and allyl silanes. Specific examples of the copolymer component of such a monomer include 1-butene, 2-butene, 2-methyl-1-butene, 3-methyl-2-butene, pentene, hexene, cyclohexene,
Aliphatic olefins such as vinylhexane, 5-ethylidene norbornene, indene and β-pinene; dienes such as cyclopentadiene and dicyclopentadiene; and styrenes such as styrene, α-methylstyrene and p-chlorostyrene. Can be.
【0013】(a)成分のポリイソブチレンにアルケニ
ル基を導入する方法としては主鎖の重合後にアルケニル
基を導入する方法と、重合中にアルケニル基を導入する
方法に大別することができる。重合後にアルケニル基を
導入する方法としては例えば、末端、主鎖、あるいは側
鎖の水酸基を−ONaや−OKなどの基にした後、ハロ
ゲン原子とアルキレンをもつ化合物で反応させることに
より、末端アルケニル基を有するポリイソブチレンが製
造される。ハロゲン原子とアルキレンをもつ化合物は例
えば、アリルクロライド、アリルブロマイド、ビニル
(クロロメチル)ベンゼン、クロロプロペン、クロロブ
テン、クロロメチル(メタ)アクリレート、アリル(ク
ロロメチル)ベンゼン、アリル(ブロモメチル)ベンゼ
ン、アリル(クロロメチル)エーテル、アリル(クロロ
メトキシ)ベンゼン、1−へキセニル(クロロメトキ
シ)ベンゼン、アリルオキシ(クロロメチル)ベンゼン
等があげられる。The method of introducing an alkenyl group into the polyisobutylene of the component (a) can be roughly classified into a method of introducing an alkenyl group after polymerization of a main chain and a method of introducing an alkenyl group during polymerization. Examples of a method of introducing an alkenyl group after polymerization include, for example, converting a hydroxyl group at a terminal, main chain, or side chain into a group such as -ONa or -OK, followed by a reaction with a compound having an alkylene and a halogen atom, to thereby obtain a terminal alkenyl group. A polyisobutylene having groups is produced. Compounds having a halogen atom and an alkylene include, for example, allyl chloride, allyl bromide, vinyl (chloromethyl) benzene, chloropropene, chlorobutene, chloromethyl (meth) acrylate, allyl (chloromethyl) benzene, allyl (bromomethyl) benzene, allyl ( Chloromethyl) ether, allyl (chloromethoxy) benzene, 1-hexenyl (chloromethoxy) benzene, allyloxy (chloromethyl) benzene and the like.
【0014】末端ヒドロキシポリイソブチレンの末端水
酸基をオキシメタル基にする方法としてはNa、Kのよ
うなアルカリ金属;NaHのような金属水素化物;Na
OCH3のような金属アルコキシド;苛性ソーダ、苛性
カリウムのような苛性アルカリなどと反応させる方法が
あげられる。Methods for converting the terminal hydroxyl group of terminal hydroxy polyisobutylene into an oxymetal group include alkali metals such as Na and K; metal hydrides such as NaH;
Metal alkoxides such as OCH 3; caustic soda, a method of reacting with such caustic alkali such as caustic potassium.
【0015】また、共有結合Cl基を有するポリイソブ
チレンにアルケニル基を導入する方法としては特に制限
はないが、例えば種々のアルケニルフェニルエーテル類
とCl基のフリーデルクラフツ反応を行う方法、アリル
トリメチルシラン等とCl基とをルイス酸存在下、置換
反応を行う方法、および、種々のフェノール類とCl基
のフリーデルクラフツ反応を行い水酸基を導入した上で
さらに、前記のアルケニル基導入方法を併用する方法が
あげられる。The method of introducing an alkenyl group into polyisobutylene having a covalently bonded Cl group is not particularly limited. For example, a method of performing a Friedel-Crafts reaction of various alkenyl phenyl ethers with a Cl group, allyltrimethylsilane And a Cl group in the presence of a Lewis acid in the presence of a Lewis acid, and a Friedel-Crafts reaction between various phenols and a Cl group to introduce a hydroxyl group, and further use the above-mentioned alkenyl group introduction method in combination. There is a method.
【0016】重合中にアルケニル基を導入する方法とし
ては、例えば、開始剤兼連鎖移動剤としてハロゲン原子
を有し、該ハロゲン原子が結合している化合物および/
またはハロゲン原子を有し、該ハロゲン原子が結合して
いる炭素原子が第3級炭素原子である化合物を使用しか
つ、触媒としてルイス酸を使用してイソブチレンを含有
するカチオン重合性モノマーをカチオン重合させるに当
たり、アリルトリメチルシランを重合系に添加すること
によるアリル末端を有するポリイソブチレン製造法や、
同じく、1,9−デカジエンのような非共役ジエン類、
またはp−ヘキセニルオキシスチレンのようなアルケニ
ルオキシスチレン類を重合系に添加することによるアル
ケニル基を主鎖あるいは側鎖の末端に有するポリイソブ
チレンの製造方法があげられる。As a method for introducing an alkenyl group during polymerization, for example, a compound having a halogen atom as an initiator and a chain transfer agent, and a compound having the halogen atom bonded thereto, and / or
Alternatively, a compound having a halogen atom, wherein the carbon atom to which the halogen atom is bonded is a tertiary carbon atom, and a cationic polymerizable monomer containing isobutylene is cationically polymerized using a Lewis acid as a catalyst. In making it, an allyl-terminated polyisobutylene production method by adding allyltrimethylsilane to the polymerization system,
Similarly, non-conjugated dienes such as 1,9-decadiene,
Alternatively, a method for producing polyisobutylene having an alkenyl group at an end of a main chain or a side chain by adding an alkenyloxystyrene such as p-hexenyloxystyrene to a polymerization system may be mentioned.
【0017】(a)成分の製造方法は上記以外にも、重
合直後のポリイソブチレンにアリルシランを反応させ
る、あるいは単利生成を行った両末端にクロル基を有す
るポリイソブチレンにTiCl4を加えアルケニルトリ
メチルシランを反応させることにより両末端にアルケニ
ル基を有する重合体を得る方法(特開昭63−1050
05号公報)、非共役ジエン類を共重合ないしは末端停
止剤として用いる方法(特開平4−288309号公
報)、ビニル型炭素−炭素不飽和基をヒドロシリル化反
応によって湿分硬化性に変える方法(特公平4−696
59号公報、特開平4−233916号公報)等が公知
となっており、これらの方法を用いても良い。[0017] (a) In addition to the production method of the component above, the polymerization immediately after the polyisobutylene are reacted allylsilane, or alkenyl trimethylsilane TiCl 4 was added to the polyisobutylene having a chloro group at both ends was simple interest generated To obtain a polymer having alkenyl groups at both ends (Japanese Patent Application Laid-Open No. 63-1050).
No. 05), a method of using a non-conjugated diene as a copolymer or a terminal stopper (Japanese Patent Application Laid-Open No. 4-288309), a method of converting a vinyl-type carbon-carbon unsaturated group into moisture-curable by a hydrosilylation reaction ( Tokiko 4-696
No. 59, JP-A-4-233916) and the like, and these methods may be used.
【0018】本発明の(b)成分は分子内に少なくとも
2個のヒドロシリル基を含有する化合物であれば制限さ
れない。ここで、ヒドロシリル基1個とはSiH基1個
をさす。従って、同一Siに水素原子が2個結合してい
いる場合はヒドロシリル基2個と計算する。(b)成分
としては従来から公知のポリオルガノハイドロジェンが
好ましいものの1つに挙げられる。ポリオルガノハイド
ロジェンシロキサンはSiHが分子鎖の末端についても
良く、分子鎖の途中に付いても良い。また、ポリシロキ
サンが環状体であっても良い。The component (b) of the present invention is not limited as long as it is a compound containing at least two hydrosilyl groups in the molecule. Here, one hydrosilyl group refers to one SiH group. Therefore, when two hydrogen atoms are bonded to the same Si, it is calculated as two hydrosilyl groups. As the component (b), conventionally known polyorganohydrogen is one of the preferable ones. In the polyorganohydrogensiloxane, SiH may be present at the terminal of the molecular chain or may be attached in the middle of the molecular chain. Further, the polysiloxane may be a cyclic body.
【0019】ただし、ポリオルガノハイドロジェンシロ
キサン単体では(a)成分との相溶性が高くないため、
(a)成分との相溶性が高い炭素数2〜2000の飽和
炭化水素に上記のハイドロジェンシロキサンを結合させ
たものを使用することが好ましい。これらの詳細は特開
平8−127683号公報に記述されている技術を使用
することができる。However, since the polyorganohydrogensiloxane alone is not highly compatible with the component (a),
It is preferable to use a compound obtained by bonding the above-mentioned hydrogen siloxane to a saturated hydrocarbon having 2 to 2,000 carbon atoms having high compatibility with the component (a). For details thereof, the technology described in Japanese Patent Application Laid-Open No. 8-127683 can be used.
【0020】(b)成分に含まれるヒドロシリル基の個
数については少なくとも1分子中に2個あればよいが、
2〜15が好ましく、3〜12個が特に好ましい。本発
明の組成物をヒドロシリル化反応により硬化させる場合
には該ヒドロシリル基の個数が2より少ないと、硬化が
遅く硬化不良を起こすことが多い。また、該ヒドロシリ
ル基の個数が15より多くなると(b)成分である硬化
剤の安定性が悪くなり、その上硬化後も、多量のヒドロ
シリル基が硬化物中に残存し、ボイドやクラックの原因
となる。The number of hydrosilyl groups contained in the component (b) may be at least two in one molecule.
2 to 15 are preferred, and 3 to 12 are particularly preferred. When the composition of the present invention is cured by a hydrosilylation reaction, if the number of the hydrosilyl groups is less than 2, curing is slow and poor curing often occurs. If the number of the hydrosilyl groups is more than 15, the stability of the curing agent (b) becomes poor, and after curing, a large amount of hydrosilyl groups remains in the cured product, causing voids and cracks. Becomes
【0021】本発明の(c)成分であるヒドロシリル化
反応触媒は(a)成分と(b)成分をヒドロシリル化反
応によって架橋するための触媒であり、通常白金原子の
有機金属錯体からなる。The hydrosilylation reaction catalyst which is the component (c) of the present invention is a catalyst for crosslinking the components (a) and (b) by a hydrosilylation reaction, and usually comprises an organometallic complex of a platinum atom.
【0022】本発明における(c)成分は(a)成分と
(b)成分とをヒドロシリル化反応によって架橋するた
めの触媒であり、通常白金原子の有機金属錯体からなる
ものである。ヒドロシリル化触媒としては従来公知の適
宜の白金触媒を使用できる。それらの例としては、塩化
白金酸、アルコール変成塩化白金酸、白金とケトンの錯
体、白金とビニルシロキサンなどの錯体があげられる
が、とりわけ好適なのは、アシビーの米国特許第315
9601号に記載されている白金炭化水素錯体、ラモロ
ーの同第3220970号に記載されている白金アルコ
ラート錯体、カーステットの同第3516946号に記
載されている白金−オレフィン錯体、スパイアーの示す
触媒(アドバンスドオーガニックケミストリ−、17
巻、407ページ、1979年に記載)である。The component (c) in the present invention is a catalyst for crosslinking the component (a) and the component (b) by a hydrosilylation reaction, and usually comprises a platinum atom organometallic complex. As the hydrosilylation catalyst, a conventionally known appropriate platinum catalyst can be used. Examples thereof include chloroplatinic acid, alcohol-modified chloroplatinic acid, complexes of platinum and ketones, complexes of platinum and vinylsiloxane, etc., and particularly preferred are Ashby's U.S. Pat.
No. 9601, a platinum-alcoholate complex described in Lamoreau No. 3220970, a platinum-olefin complex described in Kerstedt No. 3516946, a catalyst represented by Spire (Advanced Organic Chemistry, 17
Vol., P. 407, 1979).
【0023】本発明における白金触媒の添加量は、
(a)成分(b)成分の組成物の重量を基準として、通
常10ppmから100ppm、好ましくは30ppm
から70ppmである。In the present invention, the added amount of the platinum catalyst is as follows:
(A) Component (b) Usually 10 ppm to 100 ppm, preferably 30 ppm, based on the weight of the composition of the component.
To 70 ppm.
【0024】本発明における(d)成分は(c)成分の
ヒドロシリル化反応を促進する能力を常温では抑制し、
組成物を加熱した高温時には抑制しない化合物である。
(d)成分と(c)成分を組み合わせることにより室温
では保存することができる一液型加熱硬化型の樹脂とす
ることができる。The component (d) in the present invention suppresses the ability of the component (c) to promote the hydrosilylation reaction at room temperature,
It is a compound that is not inhibited at high temperatures when the composition is heated.
By combining the components (d) and (c), a one-pack type heat-curable resin that can be stored at room temperature can be obtained.
【0025】(d)成分を例示すると、チオフェン化合
物、イソシアニド化合物、環状チオエーテル化合物、環
状アゾエーテル化合物、イミノ化合物及び白金原子と錯
体を形成しうる硫黄原子、窒素原子またはリン原子含有
官能基を1分子中に複数もつ平均分子量1,000〜2
00,000のポリマーからなる群から選ばれる少なく
とも1のメンバーを挙げることができる。As an example of the component (d), a thiophene compound, an isocyanide compound, a cyclic thioether compound, a cyclic azoether compound, an imino compound, and a sulfur-, nitrogen-, or phosphorus-containing functional group capable of forming a complex with a platinum atom are one molecule. Average molecular weight of 1,000 to 2
At least one member selected from the group consisting of 00,000 polymers can be mentioned.
【0026】以下、(d)成分を詳述する。チオフェン
化合物は、少量の添加で、組成物の高温における硬化性
を損なうことなく、室温付近での保存安定性に優れた働
きを示す。本発明に用いる(d)成分の第1はチオフェ
ン化合物である。チオフェン化合物としては次の一般式
(1)及び(2)で表わされるチオフェン化合物が好ま
しく用いられる。Hereinafter, the component (d) will be described in detail. The thiophene compound exhibits excellent storage stability near room temperature without impairing the curability of the composition at high temperatures when added in a small amount. The first component (d) used in the present invention is a thiophene compound. As the thiophene compound, a thiophene compound represented by the following general formulas (1) and (2) is preferably used.
【0027】[T]n (1)[T] n (1)
【0028】式中Tはチオフェン分子骨格を示し、nは
1〜4の整数を示す。具体的には狭義のチオフェンおよ
び置換基をもたないチオフェン骨格が2〜4個直鎖状に
結合したジチオフェン、トリチオフェンおよびテトラチ
オフェンがある。In the formula, T represents a thiophene molecular skeleton, and n represents an integer of 1 to 4. Specifically, there are thiophene in a narrow sense and dithiophene, trithiophene, and tetrathiophene in which 2 to 4 unsubstituted thiophene skeletons are linearly bonded.
【0029】Ar−T−Ar’ (2)Ar-T-Ar '(2)
【0030】但しTはチオフェン分子骨格を示し、Ar
はアリール基またはアリールアルキル基を示し、Ar−
はアリール基、アリールアルキル基または水素原子を示
す。ここでアリール基またはアリールアルキル基を構成
するアリール基としてはフェニル基、ナフチル基または
1〜3個のアルキル基、アルコキシ基、ハロゲンもしく
はへテロ原子含有置換基をもつフェニル基もしくはナフ
チル基が例示される。またアリールアルキル基の例とし
てはベンジル基またはベンジル基を構成するフェニル基
が上記の置換フェニル基であるものが例示される。Here, T represents a thiophene molecular skeleton, and Ar represents
Represents an aryl group or an arylalkyl group, and Ar-
Represents an aryl group, an arylalkyl group or a hydrogen atom. Here, examples of the aryl group constituting the aryl group or the arylalkyl group include a phenyl group, a naphthyl group or a phenyl group or a naphthyl group having 1 to 3 alkyl groups, an alkoxy group, a halogen or a hetero atom-containing substituent. You. Examples of the arylalkyl group include those in which a benzyl group or a phenyl group constituting the benzyl group is the above-mentioned substituted phenyl group.
【0031】チオフェン化合物の具体例としては、チオ
フェン、ビチオフェン、ターチオフェン、ベンゾチオフ
ェン、2−メチル−ペンゾチオフェン、2−メトキシ−
ペンゾチオフェン、2−ブロモ−ペンゾチオフェン、ジ
ベンゾチオフェン、2,2’−メチル−ジベンゾチオフ
ェン、2,2’−ジブロモ−ジベンゾチオフェンのよう
なチオフェン誘導体が挙げられる。Specific examples of the thiophene compound include thiophene, bithiophene, terthiophene, benzothiophene, 2-methyl-benzothiophene and 2-methoxy-thiophene.
Thiophene derivatives such as benzothiophene, 2-bromo-benzothiophene, dibenzothiophene, 2,2′-methyl-dibenzothiophene, and 2,2′-dibromo-dibenzothiophene.
【0032】本発明に用いる(d)成分の第2はイソシ
アニド化合物である。イソンアニド化合物としては次の
一般式(3)で表わされる化合物が好ましく用いられ
る。The second component (d) used in the present invention is an isocyanide compound. As the isone anide compound, a compound represented by the following general formula (3) is preferably used.
【0033】R1−NC (3)R 1 -NC (3)
【0034】但しR1は置換基を有していてもよい炭素
数1〜18の炭化水素基であり、炭化水素基としてはア
ルキル基、シクロアルキル基、アリール基またはアリー
ルアルキル基がある。アルキル基としては炭素数1〜1
0の直鎖もしくは分枝アルキル基が好ましく、特に分枝
した3級アルキル基が好ましい。シクロアルキル基とし
ては5〜8員環のシクロアルキル基が好ましい。アリー
ル基としてはフェニル基、ナフチル基が例示され、また
アリールアルキル基としてはベンジル基が例示される。
これらを構成するアリール基がアルキル基、アルコキシ
基、ハロゲン基またはへテロ環含有置換基を置換基とし
て持つものも好ましく用いられる。However, R 1 is a hydrocarbon group having 1 to 18 carbon atoms which may have a substituent, and examples of the hydrocarbon group include an alkyl group, a cycloalkyl group, an aryl group and an arylalkyl group. The alkyl group has 1 to 1 carbon atoms.
A straight-chain or branched alkyl group of 0 is preferred, and a branched tertiary alkyl group is particularly preferred. The cycloalkyl group is preferably a 5- to 8-membered cycloalkyl group. Examples of the aryl group include a phenyl group and a naphthyl group, and examples of the arylalkyl group include a benzyl group.
Those in which the aryl group constituting these has an alkyl group, an alkoxy group, a halogen group or a heterocyclic-containing substituent as a substituent are also preferably used.
【0035】これらのイソシアニド化合物は市販品を用
いることができるが、「オーガニックファンクショナル
グループプレパレーション(1986年アカデミックプ
レス社発行、206ページ)」に記載されている方法に
従って合成したものを使用することが好ましい。(d)
成分として用いられる化合物の具体例としては、エチル
イソシアニド、イソプロピルイソシアニド、ターシャリ
ーブチルイソシアニド、1,1,3,3−テトラメチル
ブチルイソシアニド、シクロヘキシルイソシアニド、ベ
ンジルイソンアニド、4−メチル−ベンジルイソシアニ
ド、4−クロロ−ベンジルイソンアニド、フェニルイソ
シアニド、4−ブチル−フェニルイソシアニド、4−ク
ロロ−フェニルイソシアニド、3−メトキシ−フェニル
イソシアニド、4−メトキシ−フェニルイソシアニド、
2,6−メチル−フェニルイソシアニドのようなイソシ
アニド化合物が挙げられる。As these isocyanide compounds, commercially available products can be used, but those synthesized according to the method described in “Organic Functional Group Preparation (published by Academic Press, 1986, page 206)” can be used. Is preferred. (D)
Specific examples of the compound used as a component include ethyl isocyanide, isopropyl isocyanide, tertiary butyl isocyanide, 1,1,3,3-tetramethylbutyl isocyanide, cyclohexyl isocyanide, benzyl isone anide, 4-methyl-benzyl isocyanide, 4-chloro-benzylisone anide, phenyl isocyanide, 4-butyl-phenyl isocyanide, 4-chloro-phenyl isocyanide, 3-methoxy-phenyl isocyanide, 4-methoxy-phenyl isocyanide,
Isocyanide compounds such as 2,6-methyl-phenyl isocyanide are exemplified.
【0036】本発明で用いる(d)成分の第3は環状チ
オエーテル化合物又は環状アゾエーテル化合物である。
これらの化合物としては次の一般式(4)および(5)
で表わされる化合物が好ましく用いられる。The third component (d) used in the present invention is a cyclic thioether compound or a cyclic azoether compound.
These compounds include the following general formulas (4) and (5)
The compound represented by is preferably used.
【0037】[0037]
【化1】 Embedded image
【化2】 Embedded image
【0038】但しR5は炭素数3〜18の2価の炭化水
素基であり、nは3以上の整数である。炭化水素基とし
てはアルキレン基が好ましく、nとしては3〜8、特に
4〜6が好ましい。Wherein R 5 is a divalent hydrocarbon group having 3 to 18 carbon atoms, and n is an integer of 3 or more. The hydrocarbon group is preferably an alkylene group, and n is preferably from 3 to 8, particularly preferably from 4 to 6.
【0039】環状チオエーテル化合物の具体例としては
1,4,7,10−テトラチアシクロヘキサデカン(1
2−チアクラウン−4)、1,4,7,10,13−ペ
ンタチアシクロペンタデカン(15−チアクラウン−
5)、1,4,7,10,13,16−へキサチアシク
ロオクタデカン(18−チアクラウン−6)等や、ジベ
ンゾ−18−チアクラウン−6、ジナフト−12−チア
クラウン−4、ジンクロヘキシル−15−チアクラウン
−5等の前記チオクラウンエーテル化合物の置換体など
が挙げられる。Specific examples of the cyclic thioether compound include 1,4,7,10-tetrathiacyclohexadecane (1
2-thiacrown-4), 1,4,7,10,13-pentathiacyclopentadecane (15-thiacrown-
5), 1,4,7,10,13,16-hexathiacyclooctadecane (18-thiacrown-6), dibenzo-18-thiacrown-6, dinaphth-12-thiacrown-4, zinc chloride Substitutes of the above thiocrown ether compounds such as hexyl-15-thiacrown-5 and the like.
【0040】環状アゾエーテル化合物の具体例としては
1,4,7,10−テトラアザシクロドデカン(12−
アザクラウン−4)、1,4,7,10,13−ペンタ
アザシクロペンタデカン(15−アザクラウン−5)、
1,4,7,10,13,16−へキサアザシクロオク
タデカン(18−アザクラウン−6)等が挙げられ、前
記の環状チオエーテル同様に置換体も挙げることができ
る。Specific examples of the cyclic azoether compound include 1,4,7,10-tetraazacyclododecane (12-
Azacrown-4), 1,4,7,10,13-pentaazacyclopentadecane (15-azacrown-5),
1,4,7,10,13,16-Hexazaazacyclooctadecane (18-azacrown-6) and the like, as well as the above-mentioned cyclic thioethers, and substituted products can also be mentioned.
【0041】本発明で用いる(d)成分の第4はイミノ
化合物がある。イミノ化合物としては次の一般式(6)
で表わされる化合物が好ましく用いられる。The fourth component (d) used in the present invention is an imino compound. As the imino compound, the following general formula (6)
The compound represented by is preferably used.
【0042】R2−N=C(R3,R4) (6)R 2 -N = C (R 3 , R 4 ) (6)
【0043】但しR2は置換基を有していてもよい炭素
数1〜12の炭化水素基であり、炭化水素基としてはア
ルキル基、シクロアルキル基、アリール基またはアリー
ルアルキル基がある。R3およびR4はそれぞれ独立に
水素原子または置換基を有していてもよい炭素数1〜1
2の炭化水素基であり、炭化水素基としてはアルキル
基、シクロアルキル基、アリール基またはアリールアル
キル基かある。Here, R 2 is a hydrocarbon group having 1 to 12 carbon atoms which may have a substituent, and examples of the hydrocarbon group include an alkyl group, a cycloalkyl group, an aryl group and an arylalkyl group. R 3 and R 4 each independently represent a hydrogen atom or an optionally substituted carbon atom of 1 to 1;
And a hydrocarbon group such as an alkyl group, a cycloalkyl group, an aryl group or an arylalkyl group.
【0044】イミノ化合物の具体例としてはエチリデン
アニリン、ベンジリデンアニリン、ベンジリデンベンジ
ルアニリン、ベンジリデンメチルアミン、ベンジリデン
ブチルアミン、α−メチル−ベンジリデンアニリン、α
−フェニル−ベンジリデンアニリンなどのシッフ塩基が
挙げられる。Specific examples of the imino compound include ethylideneaniline, benzylideneaniline, benzylidenebenzylaniline, benzylidenemethylamine, benzylidenebutylamine, α-methyl-benzylideneaniline, α
Schiff bases such as -phenyl-benzylideneaniline.
【0045】本発明で用いる(d)成分の第5は白金原
子と錯体を形成しうる官能基を1分子中に複数もつ平均
分子量1,000〜200,000のポリマーである。
官能基としては硫黄原子、窒素原子またはリン原子をも
つ錯体形成性有機官能基があり、スルフィド基、2級も
しくは3級アミノ基、ホスフィン基、さらにはチオフェ
ン基およびイミノ基が例示される。The fifth component (d) used in the present invention is a polymer having an average molecular weight of 1,000 to 200,000 having a plurality of functional groups capable of forming a complex with a platinum atom in one molecule.
Examples of the functional group include a complex-forming organic functional group having a sulfur atom, a nitrogen atom or a phosphorus atom, and examples thereof include a sulfide group, a secondary or tertiary amino group, a phosphine group, a thiophene group and an imino group.
【0046】スルフィド基としては一般式(7)で表わ
される基が好ましく用いられる。As the sulfide group, a group represented by the general formula (7) is preferably used.
【0047】−R6−S−R7 (7)-R 6 -SR 7 (7)
【0048】但しR6は炭素数1〜8の2価の炭化水素
基、好ましくはアルキレン基またはアリーレン基であ
り、R7は炭素数1〜8の1価の炭化水素基、好ましく
はアルキル基、アリール基またはシクロアルキル基であ
る。Wherein R 6 is a divalent hydrocarbon group having 1 to 8 carbon atoms, preferably an alkylene group or an arylene group, and R 7 is a monovalent hydrocarbon group having 1 to 8 carbon atoms, preferably an alkyl group. , An aryl group or a cycloalkyl group.
【0049】2級もしくは3級アミノ基としては一般式
(8)で表わされる基が好ましく用いられる。As the secondary or tertiary amino group, a group represented by the general formula (8) is preferably used.
【0050】−R8−N(R9,R10) (8)-R 8 -N (R 9 , R 10 ) (8)
【0051】但しR8は炭素数1〜8の2価の炭化水素
基、好ましくはアルキレン基、アリーレン基であり、R
9およびR10は水素原子または炭素数1〜8の炭化水
素基、好ましくはアルキル基、アリール基またはシクロ
アルキル基であるが、R9とR10が共に水素であるこ
とはない。Wherein R 8 is a divalent hydrocarbon group having 1 to 8 carbon atoms, preferably an alkylene group or an arylene group;
9 and R 10 are a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms, preferably an alkyl group, an aryl group or a cycloalkyl group, but both R 9 and R 10 are not hydrogen.
【0052】ホスフィン基としては一般式(9)で表わ
される基が好ましく用いられる。As the phosphine group, a group represented by the general formula (9) is preferably used.
【0053】−R11−P(R12,R13) (9) 但しR11は炭素数1〜8の2価の炭化水素基、好まし
くはアルキレン基またはアリーレン基であり、R12お
よびR13は水素原子または炭素数1〜8の炭化水素
基、好ましくはアルキル基、アリール基またはシクロア
ルキル基である。これらの官能基は通常ポリマーに側鎖
として導入される。-R 11 -P (R 12 , R 13 ) (9) wherein R 11 is a divalent hydrocarbon group having 1 to 8 carbon atoms, preferably an alkylene group or an arylene group, and R 12 and R 13 Is a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms, preferably an alkyl group, an aryl group or a cycloalkyl group. These functional groups are usually introduced as side chains into the polymer.
【0054】主鎖を構成するポリマーとしては官能基を
チオフェン基およびイミノ基は前記したチオフェン化合
物およびイミノ化合物における炭素原子に結合した1の
水素原子がポリマー分子への結合手になっている基であ
る。これらの錯体形成性官能基は通常ポリマー分子中に
側鎖として導入される。The polymer constituting the main chain has a thiophene group and an imino group as functional groups, and a group in which one hydrogen atom bonded to a carbon atom in the thiophene compound and the imino compound is a bond to a polymer molecule. is there. These complexing functional groups are usually introduced as side chains into the polymer molecule.
【0055】主鎖を構成するポリマーとしては、カルボ
キンル基(もしくはその機能誘導体)、ヒドロキシ基、
ハロゲン原子等の反応性官能基を反復単位中にもつポリ
マーが好ましく、その官能基に上記の官能基を含有する
化合物を反応させることによって容易に上記の第5の
(d)成分をつくることができる。The polymer constituting the main chain includes a carboquinol group (or a functional derivative thereof), a hydroxy group,
A polymer having a reactive functional group such as a halogen atom in a repeating unit is preferable, and the above-mentioned fifth component (d) can be easily produced by reacting a compound containing the above functional group with the functional group. it can.
【0056】このようなポリマーの例としてはアクリル
酸またはメタクリル酸(もしくはそれらの機能誘導体)
を構成モノマーとするアクリル系ポリマー、ビニルアル
コールを構成モノマーとするビニルアルコール系ポリマ
ー、パラ位にハロゲン等の反応性官能基をもつスチレン
を構成モノマーとするスチレン系ポリマーやフェノール
樹脂等がある。これらは単独重合体でも、適宜のコモノ
マーを共重合させた共重合体でもよい。シリコーン組成
物中における溶解性や硬化温度とのバランス調整のため
最適のモノマーの組合せを用いることが好ましい。Examples of such polymers include acrylic acid or methacrylic acid (or their functional derivatives)
And vinyl alcohol-based polymers having vinyl alcohol as a constituent monomer, styrene-based polymers having styrene having a reactive functional group such as halogen at the para-position, and phenolic resins. These may be homopolymers or copolymers obtained by copolymerizing appropriate comonomers. It is preferable to use an optimal combination of monomers for adjusting the balance between the solubility in the silicone composition and the curing temperature.
【0057】また予めスルフィド基等を側鎖にもつ重合
性モノマー、たとえばアクリロイルモノマーやビニルモ
ノマー、を単独または他のコモノマーと共に重合して白
金原子と配位しうる官能基をもつポリマーをつくっても
よく、また上記したように、スルフィド基等の官能基含
有反応性モノマーをその反応性基と反応しうる基をもつ
ポリマーと反応させてもよい。後者の例としてはポリア
クリル酸やアクリル酸とアクリル酸メチルとの基車合体
などのカルボキシル基をもつポリマーとカルボキシル基
と反応性をもつ官能基、たとえばブロモメチル基、をも
つスルフィド化合物、2級もしくは3級アミノ化合物ま
たはホスフィン化合物と反応させる方法がある。この反
応は、たとえば溶媒としてジメチルスルフィド等の極性
有機溶媒を用し触媒として1,8−ジアザ(5,4,
0)ビシクロウンデセン−7等を用いることにより容易
に進行する。A polymer having a functional group capable of coordinating with a platinum atom by previously polymerizing a polymerizable monomer having a sulfide group or the like in a side chain, for example, an acryloyl monomer or a vinyl monomer, alone or together with another comonomer, may be prepared. As described above, a reactive monomer containing a functional group such as a sulfide group may be reacted with a polymer having a group capable of reacting with the reactive group. Examples of the latter are a sulfide compound having a carboxyl group-reactive polymer such as polyacrylic acid or a carboxyl group of acrylic acid and methyl acrylate, and a functional group reactive with the carboxyl group, for example, a bromomethyl group. There is a method of reacting with a tertiary amino compound or a phosphine compound. In this reaction, for example, a polar organic solvent such as dimethyl sulfide is used as a solvent, and 1,8-diaza (5,4,4) is used as a catalyst.
0) It proceeds easily by using bicycloundecene-7 or the like.
【0058】これらの(d)成分の配合量は、白金原子
に対し理論上2当量であり、少なすぎると十分な反応抑
制効果が得られず、また多すぎると適度の温度での硬化
が難しくなる。通常白金化合物当り1〜5当量、より好
ましくは1〜3当量用いられる。ポリマーの場合は錯体
形成性官能基の当量数が計算される。通常はポリマーの
重合度の5%以上(つまり反復単位数の合計の5%以
上)が錯体形成性官能基をもつことが好ましい。The amount of the component (d) is theoretically 2 equivalents to the platinum atom. If the amount is too small, a sufficient effect of suppressing the reaction cannot be obtained. If the amount is too large, curing at an appropriate temperature is difficult. Become. Usually, 1 to 5 equivalents, more preferably 1 to 3 equivalents are used per platinum compound. In the case of a polymer, the number of equivalents of the complex-forming functional group is calculated. Usually, it is preferable that 5% or more of the polymerization degree of the polymer (that is, 5% or more of the total number of repeating units) has a complex-forming functional group.
【0059】本発明では上記した(a)〜(d)成分を
必須成分として配合するが、その配合順率は特に制限さ
れない。たとえば(c)と(d)成分とを予め配合して
錯体を形成し、それに(a)と(b)成分を配合する方
法や(a)〜(d)成分を同時に配合する方法等が適宜
採用される。In the present invention, the above components (a) to (d) are blended as essential components, but the blending order is not particularly limited. For example, a method of preliminarily blending the components (c) and (d) to form a complex and then blending the components (a) and (b), a method of simultaneously blending the components (a) to (d), or the like is appropriate. Adopted.
【0060】本発明のシール剤組成物は基本的には上記
成分からなるが、さらに必要に応じて、硬化前の流れ特
性を改善し、硬化後のゴム状弾性体に必要な機械的性質
を付与するために、微粉末状の無機質充填剤を添加する
こともできる.無機質充填剤としてはヒュームドシリ
カ、石英微粉末、炭酸カルシウム、煙霧質二酸化チタ
ン、けいそう土、水酸化アルミニウム、微粒子状アルミ
ナ、マグネシア、酸化亜鉛、炭酸亜鉛、およびこれらを
シラン類、シラザン類、低重合度シロキサン類、有機化
合物などを表面処理したものなどが例示される。The sealant composition of the present invention basically comprises the above-mentioned components. If necessary, the sealant composition further improves the flow characteristics before curing, and improves the mechanical properties required for the rubber-like elastic body after curing. In order to provide, an inorganic filler in the form of fine powder can be added. As inorganic fillers, fumed silica, quartz fine powder, calcium carbonate, fumed titanium dioxide, diatomaceous earth, aluminum hydroxide, particulate alumina, magnesia, zinc oxide, zinc carbonate, and silanes, silazanes, Examples thereof include low-polymerization degree siloxanes, organic compounds, and the like, which are surface-treated.
【0061】さらに、本発明のシール剤組成物には有機
溶剤、防黴剤、難燃剤、可塑剤、チクソ性付与剤、接着
付与剤、硬化促進剤、顔料などを添加することができ
る。可塑剤としては、ポリブテン、水添ポリブテン、液
状ポリブタジエン、水添ポリブタジエン、パラフィン
油、ナフテン油等の炭化水素系化合物類、塩素化パラフ
ィン類、ジブチルフタレート、ジ(2−エチルヘキシ
ル)フタレート等のフタル酸エステル類、ジオクチルア
ジペート、ジオクチルセバケート等の非芳香族二塩基酸
エステル類、ポリアルキレングリコールのエステル類、
トリクレジルホスフェート等のリン酸エステル類等が挙
げられる。Further, an organic solvent, a fungicide, a flame retardant, a plasticizer, a thixotropy-imparting agent, an adhesion-imparting agent, a curing accelerator, a pigment and the like can be added to the sealant composition of the present invention. Examples of the plasticizer include hydrocarbon compounds such as polybutene, hydrogenated polybutene, liquid polybutadiene, hydrogenated polybutadiene, paraffin oil and naphthenic oil, chlorinated paraffins, phthalic acid such as dibutyl phthalate and di (2-ethylhexyl) phthalate. Non-aromatic dibasic acid esters such as esters, dioctyl adipate, dioctyl sebacate, esters of polyalkylene glycol,
Phosphoric esters such as tricresyl phosphate and the like can be mentioned.
【0062】また、本発明のシール材組成物は、室温付
近の温度での保存性に優れ、かつ適度な加熱によって速
かに硬化する。そのため、本発明のシール材組成物を使
用すれば、それを用いた製品の作業工程の短縮や、製品
コストの低減、これを使用する作業時間の延長などが可
能となり、さらには比較的低温での硬化性に優れている
ため、省エネルギー化も可能である。また、本発明の組
成物は1液型としての使用が可能であり、2液型のよう
な混合などの手間かない。仮に、2液型にした場合にお
いても混合塗布機の混合室やノズルで硬化することがな
いので洗浄などの手間が省ける。Further, the sealing material composition of the present invention is excellent in storability at a temperature around room temperature and is rapidly cured by moderate heating. Therefore, if the sealing material composition of the present invention is used, it is possible to shorten a working process of a product using the same, reduce a product cost, extend a working time using the same, and furthermore, at a relatively low temperature. Because of its excellent curability, energy saving is possible. Further, the composition of the present invention can be used as a one-pack type, and there is no need for mixing and the like as in a two-pack type. Even in the case of using a two-pack type, since there is no hardening in the mixing chamber or the nozzle of the mixing / coating machine, the labor such as cleaning can be omitted.
【0063】本発明の組成物は(c)成分と(d)成分
の組み合わせにより一液化熱硬化性ポリイソブチレン系
硬化性樹脂硬化物の最終強度を高くすることができる。
もちろん保存安定性と硬化時間を低下させることもな
く、工業用シール材として有用である。そのため、電子
部品などの湿気を嫌う箇所のシール剤に適するものであ
る。具体的には車載用屋外用電子機器、電気機器、制御
板の筐体や基板などである。The composition of the present invention can increase the final strength of the one-part thermosetting polyisobutylene-based curable resin by combining the components (c) and (d).
Of course, it is useful as an industrial sealing material without reducing storage stability and curing time. Therefore, it is suitable for a sealant in a place where moisture is disliked, such as electronic parts. Specifically, it is an in-vehicle outdoor electronic device, an electric device, a housing or a substrate of a control board, or the like.
【0064】本願のシール剤組成物はハウジング容器な
どの本体と蓋部のシール剤、電子基板の全面コーティン
グ、容器内に部品を埋め込むポッティングなど湿分を遮
断するシール剤として使用することができ、またこのよ
うな用途に使用すると真価を発揮するものである。The sealant composition of the present invention can be used as a sealant for shutting off moisture such as a sealant for a main body and a lid of a housing container and the like, a coating of an entire surface of an electronic substrate, potting for embedding components in a container, and the like. In addition, when used for such purposes, it shows its true value.
【0065】[0065]
【発明の実施の形態】以下、実施例により本発明を説明
する。本発明の範囲は、これらの実施例によって限定さ
れるものではない。尚、実施例および比較例中、部およ
び%は特に断らないかぎり重量部および重量%を示す。
表中の試験項目は以下の手順で測定した。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to examples. The scope of the present invention is not limited by these examples. In Examples and Comparative Examples, parts and% indicate parts by weight and% by weight, respectively, unless otherwise specified.
The test items in the table were measured according to the following procedure.
【0066】[ベース樹脂の調製]主鎖が平均分子量1
0000であり分子量末端にメチルジアルコキシシラン
が付加されたポリイソブチレンである、エピオン403
(鐘淵化学工業製)を100部、ハイドロジェンシラン
を含有するオルガノポリシロキサンであるHMS−30
1(Gelest社製)を3部、混合し十分撹拌した。[Preparation of Base Resin] The main chain has an average molecular weight of 1
EPION 403, which is a polyisobutylene having a molecular weight terminal added with a methyldialkoxysilane.
(Kanebuchi Chemical Industry Co., Ltd.) 100 parts, HMS-30 which is an organopolysiloxane containing hydrogen silane
1 (manufactured by Gelest) in an amount of 3 parts were mixed and sufficiently stirred.
【0067】[実施例1−3](c)成分である2.0
%の白金を含有する塩化白金酸・6水和物のイソプロパ
ノール溶液に(d)成分である表に示すチオフェン化合
物を2当量添加し、白金のチオフェン錯休を調製した。
先に調製したべース樹脂にこの白金錯体を30ppm添
加し、目的の樹脂組成物を得た。[Example 1-3] Component (c) 2.0
% Of platinum was added to an isopropanol solution of chloroplatinic acid hexahydrate, and 2 equivalents of the thiophene compound shown in the table as the component (d) were added to prepare a thiophene complex of platinum.
30 ppm of this platinum complex was added to the previously prepared base resin to obtain a target resin composition.
【0068】[実施例4−6](c)成分と(d)成分
による白金錯体は、次の手順に従って合成をした。実施
例4としてターシャリーブチルイソシアニド約0.16
グラム(約0.02モル)が入った滴下ロートを付けた
二口フラスコに塩化白金カリウム塩約0.42グラム
(約0.01モル)とテトラブチルアンモニウムクロラ
イド1モル%を入れ、系内を十分に窒素置換した後、純
水5ミリリットルに溶解させた。系内の反応基質が溶解
したことを確認し、滴下ロート内のイソシアニド化合物
を室温でゆっくり滴下した。その後、室温のまま1時間
激しく撹拌し、反応させた。反応終了後、50mlの純
水で2回洗浄を行い、得られた錯体をろ別した。ろ別し
た錯体を真空下室温で一晩乾燥させ、その後工タノール
を用いて2回再結晶を行った。収率:57.4%、融
点:220℃で分解、IR(KBr、cm−1):22
29、1635、1460(すべてNCの特性吸収)Example 4-6 A platinum complex comprising the components (c) and (d) was synthesized according to the following procedure. In Example 4, about 0.16 tertiary butyl isocyanide was used.
In a two-necked flask equipped with a dropping funnel containing gram (about 0.02 mol), about 0.42 g (about 0.01 mol) of platinum chloride potassium salt and 1 mol% of tetrabutylammonium chloride are added. After the atmosphere was sufficiently purged with nitrogen, it was dissolved in 5 ml of pure water. After confirming that the reaction substrate in the system was dissolved, the isocyanide compound in the dropping funnel was slowly dropped at room temperature. Thereafter, the mixture was vigorously stirred for 1 hour at room temperature to react. After the completion of the reaction, washing was performed twice with 50 ml of pure water, and the obtained complex was separated by filtration. The filtered complex was dried at room temperature under vacuum overnight, and then recrystallized twice using ethanol. Yield: 57.4%, melting point: decomposed at 220 ° C., IR (KBr, cm −1 ): 22
29, 1635, 1460 (all NC characteristic absorption)
【0069】上記と同様に、実施例5としてイソシアニ
ド化合物としてシクロヘキシルイソシアニドを用いた白
金錯体を合成した。 収率:60.0%、融点:220℃で分解、IR(KB
r、cm−1):2268、1637、1452(すべ
てNCの特性吸収)In the same manner as described above, as Example 5, a platinum complex using cyclohexyl isocyanide as the isocyanide compound was synthesized. Yield: 60.0%, melting point: decomposed at 220 ° C, IR (KB
r, cm -1 ): 2268, 1637, 1452 (all characteristic absorption of NC)
【0070】上記と同様に、実施例6としてイソンアニ
ド化合物としてフェニルイソシアニドを用いて白金錨体
を合成した。 収率:40.9%、融点:250℃で分解、IR(KB
r、cm−1):2276、1637、1450(すべ
てNCの特性吸収)In the same manner as described above, as Example 6, a platinum anchor was synthesized using phenyl isocyanide as the isonanid compound. Yield: 40.9%, melting point: decomposed at 250 ° C., IR (KB
r, cm -1 ): 2276, 1637, 1450 (all characteristic absorption of NC)
【0071】このように合成した表に示すイソシアニド
化合物を用いた白金錯体を上記のべース樹脂に添加し
た。A platinum complex using the isocyanide compound shown in the table thus synthesized was added to the above base resin.
【0072】[実施例7−10]べース樹脂の中に2.
0%の白金を含有する塩化白金酸・6水和物のイソブロ
パノール溶液を15ppm添加しすぐに表に示すイミノ
化合物を2当量添加し十分に撹伴し目的の樹脂組成物を
得た。[Examples 7-10] In a base resin,
15 ppm of a solution of chloroplatinic acid hexahydrate containing 0% of platinum in isopropanol was added, and immediately thereafter, 2 equivalents of the imino compound shown in the table were added, followed by sufficient stirring to obtain a target resin composition.
【0073】[実施例11−13]2.0%の白金を含
有する塩化白金酸・6水和物のイソプロパノール溶液に
イミノ化合物としてベンジリデンアニリンを添加し白金
の錯体を調製した。ベンジリデンアニリンの添加量は白
金原子に対し実施例11は1当量、実施例12は2当
量、実施例13は3当量を添加した。その後、先に調製
したべース樹脂にこの白金錯体を30ppm添加し、目
的の樹脂組成物を得た。[Examples 11-13] To a solution of chloroplatinic acid hexahydrate containing 2.0% platinum in isopropanol was added benzylideneaniline as an imino compound to prepare a platinum complex. The amount of benzylideneaniline added was 1 equivalent in Example 11, 2 equivalents in Example 12, and 3 equivalents in Example 13 based on platinum atoms. Thereafter, 30 ppm of this platinum complex was added to the previously prepared base resin to obtain a target resin composition.
【0074】[実施例14−24] (実施例14)数平均分子量約10000のポリメタク
リル酸(0.86g、10mmol)をジメチルフオル
ムアミド5mlに溶解し、2−ブロモメチルフェニルス
ルフィト(2.22g、11mmol)とジアザビシク
ロ−(5,4,0)−ウンデセン−7(1.67g、1
1mmol)を加えたものを50℃で24時間加熱し
た。加熱終了後、反応溶液を多量のメタノールに注いで
スルフィド基を有するポリマーを回収した。(回収率は
90%)スルフィド基の導入率はポリマーのカルボン酸
量に対し98%)(1HNMRによりポリマー側鎖のメ
チンブロトンの積分比とポリマー主鎖のメチル基プロト
ンの積分比から算出した。)。得られたポリマー配位子
をテトラヒドロフランに溶解させ、ポリマーがもつスル
フィド基に対して2当量の塩化白金酸を加え、40℃で
3時間加熱することで目的の白金錯体を調製した。[Examples 14-24] (Example 14) Polymethacrylic acid (0.86 g, 10 mmol) having a number average molecular weight of about 10,000 was dissolved in 5 ml of dimethylformamide, and 2-bromomethylphenylsulfite (2. 22 g, 11 mmol) and diazabicyclo- (5,4,0) -undecene-7 (1.67 g, 1
(1 mmol) was heated at 50 ° C. for 24 hours. After completion of the heating, the reaction solution was poured into a large amount of methanol to recover a polymer having a sulfide group. (The recovery rate is 90%.) The introduction rate of the sulfide group is 98% based on the amount of the carboxylic acid in the polymer. (Calculated from 1HNMR based on the integral ratio of methine broton in the polymer side chain and the integral ratio of methyl group proton in the polymer main chain.) . The obtained polymer ligand was dissolved in tetrahydrofuran, 2 equivalents of chloroplatinic acid were added to the sulfide group of the polymer, and the mixture was heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0075】(実施例15)数平均分子量約50000
のポリ(パラクロロメチルスチレン)(1.52g、l
0mmol)をジメチルフオルムアミド5mlに溶解
し、2−ブロモメチルフェニルスルフィド(2.22
g、11mmol)とジアザビシクロ−(5,4,0)
−ウンデセン−7(1.67g、11mmol)を加え
たものを50℃で24時間加熱した。加熱終了後、反応
溶液を多量のメタノールに注いでスルフィド基を有する
ポリマー配位子を回収した。(回収率78%、スルフィ
ド基導入率98%:測定法は実施例1と同様、以下同
じ)。得られたポリマーをテトラヒドロフランに溶解さ
せ、スルフィド基に対し3当量の塩化白金酸を加え、4
0℃で3時間加熱することで目的の白金錯体を調製し
た。Example 15 Number average molecular weight: about 50,000
Of poly (parachloromethylstyrene) (1.52 g, l
0 mmol) was dissolved in 5 ml of dimethylformamide, and 2-bromomethylphenyl sulfide (2.22) was dissolved.
g, 11 mmol) and diazabicyclo- (5,4,0)
-Undecene-7 (1.67 g, 11 mmol) was added and heated at 50 ° C for 24 hours. After the completion of the heating, the reaction solution was poured into a large amount of methanol to recover a polymer ligand having a sulfide group. (Recovery rate 78%, sulfide group introduction rate 98%: The measurement method is the same as in Example 1 and the same hereinafter). The obtained polymer is dissolved in tetrahydrofuran, and 3 equivalents of chloroplatinic acid are added to the sulfide group, and
The target platinum complex was prepared by heating at 0 ° C. for 3 hours.
【0076】(実施例16)数平均分子量約10000
0のフェノール樹脂(1.00g、10mmol)をジ
メチルフォルムアミド5mlに溶解し、2−ブロモメチ
ルフェニルスルフィド(2.22g、11mmol)と
ジアザビシクロ−(5,4,0)−ウンデセン−7
(1.67g、11mmol)を加えたものを50℃で
24時間加熱した。加熱終了後、反応溶液を多量のメタ
ノールに注いでスルフィド基を有するポリマー配位子を
回収した。(回収率90%、スルフィド基導入率81
%)。得られたポリマーをテトラヒドロフランに溶解さ
せ、スルフィド基と4当量の塩化白金酸を加え、40℃
で3時間加熱することで目的の白金錯体を調製した。Example 16 Number average molecular weight: about 10,000
Phenol resin (1.00 g, 10 mmol) was dissolved in 5 ml of dimethylformamide, and 2-bromomethylphenyl sulfide (2.22 g, 11 mmol) and diazabicyclo- (5,4,0) -undecene-7 were dissolved.
(1.67 g, 11 mmol) was added and heated at 50 ° C. for 24 hours. After the completion of the heating, the reaction solution was poured into a large amount of methanol to recover a polymer ligand having a sulfide group. (Recovery rate 90%, sulfide group introduction rate 81
%). The obtained polymer was dissolved in tetrahydrofuran, and a sulfide group and 4 equivalents of chloroplatinic acid were added.
For 3 hours to prepare the target platinum complex.
【0077】(実施例17)数平均分子量約2000の
ポリメタクリル酸をジメチルフォルムアミドに溶解し、
2−プロモメチルチオフェンとジアザビシクロ−(5,
4,0)−ウンデセン−7を加えたものを50℃で24
時間加熱した。加熱終了後、反応溶液を多量のメタノー
ルに注いで対応するポリマー配位子を回収した。(収率
99%、反応率98%:1HNMRにより確認)。得ら
れたポリマー配位子をテトラヒドロフランに溶解させ、
ポリマー側鎖のチオフェン基と2当量の塩化白金酸を加
え、40℃で3時間加熱することで目的の白金錯体を調
製した。Example 17 Polymethacrylic acid having a number average molecular weight of about 2,000 was dissolved in dimethylformamide.
2-bromomethylthiophene and diazabicyclo- (5,
(4,0) -undecene-7 was added at 50 ° C for 24 hours.
Heated for hours. After the completion of the heating, the reaction solution was poured into a large amount of methanol to recover the corresponding polymer ligand. (Yield 99%, conversion 98%: confirmed by 1H NMR). Dissolve the obtained polymer ligand in tetrahydrofuran,
The target platinum complex was prepared by adding a thiophene group in a polymer side chain and 2 equivalents of chloroplatinic acid and heating at 40 ° C. for 3 hours.
【0078】(実施例18)モノマーとしてN,N’−
ジメチルアミノエチルメタクリレートを反応溶媒にエタ
ノール、重合開始剤としてアゾビスイソブチロニトリル
を用いて、60℃で3時間重合を行った。重合終了後、
反応溶液を多量のジエチルエーテル中に注ぎ、対応する
側鎖にジメチルアミノ基を有するポリマ−配位子を得た
(数平均分子量約15000)。その後、得られたポリ
マー配位子をテトラヒドロフランに溶解させ、ポリマー
側鎖のジメチルアミノ基と当量の塩化白金酸を加え、4
0℃で3時間加熱することで目的の白金錯体を調製し
た。(Example 18) N, N'-
Using dimethylaminoethyl methacrylate as a reaction solvent and ethanol and azobisisobutyronitrile as a polymerization initiator, polymerization was carried out at 60 ° C. for 3 hours. After polymerization,
The reaction solution was poured into a large amount of diethyl ether to obtain a polymer ligand having a dimethylamino group in the corresponding side chain (number average molecular weight: about 15,000). Thereafter, the obtained polymer ligand is dissolved in tetrahydrofuran, and a dimethylamino group in a polymer side chain and an equivalent amount of chloroplatinic acid are added.
The target platinum complex was prepared by heating at 0 ° C. for 3 hours.
【0079】(実施例19)モノマーとしてパラホルミ
ルスチレンを反応溶媒にクロロベンゼン、重合開始剤と
してアゾビスイソブチロニトリルを用いて、60℃で8
時間重合を行った。重合終了後、反応溶液を多量のメタ
ノール中に注ぎ、側鎖にホルミル基を有するポリマーを
得た(数平均分子量約9000)。次に得られたポリマ
ーをジメチルフオルムアミドに溶解し、ポリマー側鎖の
ホルミル基に対して2当量のアニリンを加え、50℃で
24時間加熱した。加熱終了後、反応溶液を多量のメタ
ノールに注いで対応する側鎖にイミン基を有する高分子
配位子を回収した。(収率90%、反応率88%:1H
NMRにより確認)。その後、得られた高分子配位子を
テトラヒドロフランに溶解させ、ポリマー側鎖のイミノ
基と当量の塩化白金酸を加え、40℃で3時間加熱する
ことで目的の白金錯体を調製した。Example 19 Using paraformylstyrene as a monomer, chlorobenzene as a reaction solvent, and azobisisobutyronitrile as a polymerization initiator, the reaction was carried out at 60 ° C. for 8 hours.
Polymerization was carried out for hours. After completion of the polymerization, the reaction solution was poured into a large amount of methanol to obtain a polymer having a formyl group in a side chain (number-average molecular weight: about 9000). Next, the obtained polymer was dissolved in dimethylformamide, 2 equivalents of aniline was added to the formyl group in the side chain of the polymer, and the mixture was heated at 50 ° C. for 24 hours. After the completion of the heating, the reaction solution was poured into a large amount of methanol to recover a polymer ligand having an imine group in the corresponding side chain. (Yield 90%, conversion 88%: 1H
Confirmed by NMR). Thereafter, the obtained polymer ligand was dissolved in tetrahydrofuran, an equivalent amount of chloroplatinic acid was added to the imino group of the polymer side chain, and the mixture was heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0080】(実施例20)数平均分子量約10000
のポリメタクリル酸をジメチルフオルムアミドに溶解
し、4−ブロモメチルフェニルイソシアニドとジアザビ
シクロ−(5,4,0)−ウンデセン−7を加えたもの
を50℃で24時間加熱した。加熱終了後、反応溶液を
多量のメタノールに注いで対応するポリマー配位子を回
収した。(収率67%、反応率91%:1HNMRによ
り確認)。得られたポリマー配位子をテトラヒドロフラ
ンに溶解させ、ポリマー側鎖のイソシアニド基と当量の
塩化白金酸を加え、40℃で3時間加熱することで目的
の白金錯体を調製した。Example 20 Number average molecular weight: about 10,000
Was dissolved in dimethylformamide, and the solution obtained by adding 4-bromomethylphenyl isocyanide and diazabicyclo- (5,4,0) -undecene-7 was heated at 50 ° C. for 24 hours. After the completion of the heating, the reaction solution was poured into a large amount of methanol to recover the corresponding polymer ligand. (Yield 67%, conversion 91% confirmed by 1H NMR). The obtained polymer ligand was dissolved in tetrahydrofuran, an equivalent amount of chloroplatinic acid was added to the isocyanide group of the polymer side chain, and the mixture was heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0081】(実施例21)数平均分子量約10000
のポリメタクリル酸をジメチルフォルムアミドに溶解
し、4−ブロモメチルフェニル−ジメチルホスフィンと
ジアザビシクロ−(5,4,0)−ウンデセン−7を加
えたものを50℃で24時間加熱した。加熱終了後、反
応溶液を多量のメタノールに注いで対応するポリマー配
位子を回収した。(収率67%、反応率91%:1HN
MRにより確認)。得られたポリマー配位子をテトラヒ
ドロフランに溶解させ、ポリマー側鎖のフェニル−ジメ
チルホスフィン基と当量の塩化白金酸を加え、40℃で
3時間加熱することで目的の白金錯体を調製した。Example 21 Number average molecular weight: about 10,000
Was dissolved in dimethylformamide, and a solution obtained by adding 4-bromomethylphenyl-dimethylphosphine and diazabicyclo- (5,4,0) -undecene-7 was heated at 50 ° C. for 24 hours. After the completion of the heating, the reaction solution was poured into a large amount of methanol to recover the corresponding polymer ligand. (Yield 67%, conversion 91%: 1HN
Confirmed by MR). The obtained polymer ligand was dissolved in tetrahydrofuran, an equivalent amount of chloroplatinic acid was added to the phenyl-dimethylphosphine group in the polymer side chain, and the mixture was heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0082】(実施例22)数平均分子量約14000
のメタクリル酸とメタクリル酸メチルの共車合体(組成
比は4:6、0.95g、10mmol)をジメチルフ
ォルムアミド5mlに溶解し、2−ブロモメチルフェニ
ルスルフィド(2.22g、1lmmol)とジアザビ
シクロ−(5,4,0)−ウンデセン−7(1.67
g、1lmmol)を加えたものを50℃で24時間加
熱した。加熱終了後、反応溶液を多量のメタノールに注
いで対応するポリマー配位子を回収した。(ポリマー回
収率99%、配位子導入率94%(40%のカルボン酸
官能基に対して38%の導入率であり、したがって、ポ
リマー全体から28%の配位子導入率である):1NM
Rにより高分子側鎖のメチンプロトンの積分比とポリマ
ー主鎖のメチル基プロトンの積分比から算出した)。得
られたポリマー配位子をテトラヒドロフランに溶解さ
せ、ポリマー側鎖のチオフェン基と当量の塩化白金酸を
加え、40℃で3時間加熱することで目的の白金錯体を
調製した。Example 22 Number average molecular weight: about 14,000
Of methacrylic acid and methyl methacrylate (composition ratio: 4: 6, 0.95 g, 10 mmol) was dissolved in 5 ml of dimethylformamide, and 2-bromomethylphenylsulfide (2.22 g, 1 lmmol) and diazabicyclo- (5,4,0) -undecene-7 (1.67
g, 11 mmol) was heated at 50 ° C. for 24 hours. After the completion of the heating, the reaction solution was poured into a large amount of methanol to recover the corresponding polymer ligand. (Polymer recovery 99%, ligand introduction 94% (38% introduction for 40% carboxylic acid function, thus 28% ligand introduction from the whole polymer): 1NM
R was calculated from the integral ratio of the methine proton in the polymer side chain and the integral ratio of the methyl group proton in the polymer main chain). The obtained polymer ligand was dissolved in tetrahydrofuran, a chloroplatinic acid equivalent to the thiophene group in the polymer side chain was added, and the mixture was heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0083】(実施例23)モノマーとしてN,N’−
ジメチルアミノエチルメタクリレート(0.47g、3
mmol)とメタクリル酸メチル(0.70g、0.7
mmol)反応溶媒に工タノール5ml、重合開始剤と
してアゾビスイソブチロニトリル(3mol%)を用い
て、60℃で3時間重合を行った。重合終了後、反応溶
液を多量のジエチルエーテル中に注ぎ、側鎖にジメチル
アミノ基を有するメタクリル酸メチル共重合型ポリマー
配位子を得た(数平均分子量約11000、ユニット組
成比は3:7(1HNMRにより側鎖のジメチルアミノ
基のプロトン積分比と主鎖のメチル基ブロトンの積分比
から算出した)。その後、得られたポリマー配位子をテ
トラヒドロフランに溶解させ、ポリマーのジメチルアミ
ノ基と当量の塩化白金酸を加え、40℃で3時間加熱す
ることで目的の白金錯体を調製した。(Example 23) N, N'-
Dimethylaminoethyl methacrylate (0.47 g, 3
mmol) and methyl methacrylate (0.70 g, 0.7
(mmol) Polymerization was carried out at 60 ° C. for 3 hours using 5 ml of ethanol as a reaction solvent and azobisisobutyronitrile (3 mol%) as a polymerization initiator. After the polymerization, the reaction solution was poured into a large amount of diethyl ether to obtain a methyl methacrylate copolymer-type polymer ligand having a dimethylamino group in a side chain (number-average molecular weight: about 11,000, unit composition ratio: 3: 7). (Calculated from the integral ratio of the proton of the dimethylamino group in the side chain and the integral ratio of the methyl group broton in the main chain by 1H NMR.) The obtained polymer ligand was dissolved in tetrahydrofuran, and the equivalent of the dimethylamino group of the polymer was obtained. Was heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0084】(実施例24)数平均分子量約14000
のポリ(メタクリル酸−メタクリル酸メチル)共重合体
(組成比は2:8、0.95g、10mmol)をジメ
チルフォルムアミド5mlに溶解し、4−ブロモメチル
フェニル−ジメチルホスフィン(2.34g、11mm
ol)とジアザビシクロ−(5,4,0)−ウンデセン
−7(1.67g、11mmol)を加えたものを50
℃で24時間加熱した。加熱終了後、反応溶液を多量の
メタノールに注いでホスフィン基を有するポリマー配位
子を回収した。(回収率67%、ポリマーのカルボン酸
に対するホスフィン配位子導入率94%(ポリマー全体
に対して19%の導入率)。得られたポリマーをテトラ
ヒドロフランに溶解させ、フェニル−ジメチルホスフィ
ン基に対し2当量の塩化白金酸を加え、40℃で3時間
加熱することで目的の白金錯体を調製した。(Example 24) Number average molecular weight: about 14,000
Of poly (methacrylic acid-methyl methacrylate) copolymer (composition ratio 2: 8, 0.95 g, 10 mmol) was dissolved in 5 ml of dimethylformamide, and 4-bromomethylphenyl-dimethylphosphine (2.34 g, 11 mm
ol) and diazabicyclo- (5,4,0) -undecene-7 (1.67 g, 11 mmol).
Heated at ° C for 24 hours. After the completion of the heating, the reaction solution was poured into a large amount of methanol to recover a polymer ligand having a phosphine group. (Recovery rate 67%, introduction rate of phosphine ligand to polymer carboxylic acid 94% (introduction rate of 19% based on the whole polymer). The obtained polymer was dissolved in tetrahydrofuran, and 2% based on phenyl-dimethylphosphine group. An equivalent amount of chloroplatinic acid was added and heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0085】[比較例1−4]2.0%の白金を含有す
る塩化白金酸・6水和物のイソプロパノール溶液30p
pmと表に記載の反応抑制剤を100当量(比較例1お
よび2)または10当量(比較例3および4)を添加し
て白金錯体を調製し、べース樹脂に同様に添加した。[Comparative Example 1-4] 30p of a solution of chloroplatinic acid hexahydrate containing 2.0% of platinum in isopropanol
pm and 100 equivalents (Comparative Examples 1 and 2) or 10 equivalents (Comparative Examples 3 and 4) of the reaction inhibitor described in the table were added to prepare a platinum complex, which was similarly added to the base resin.
【0086】[比較例5−6]2.0%の白金を含有す
る塩化白金酸・6水和物のイソプロパノール溶液30p
pmと表に示した化合物を白金原子に対して2当量を添
加して白金錯体を調製しべース樹脂に添加した。[Comparative Example 5-6] 30p of a solution of chloroplatinic acid hexahydrate containing 2.0% of platinum in isopropanol
The platinum complex was prepared by adding 2 equivalents of the compounds shown in the table with pm to the platinum atom and added to the base resin.
【0087】[比較例7−8]実施例1で調製したべー
ス樹脂に、2.0%の白金を含有する塩化白金酸・6水
和物のイソプロパノール溶液30ppmと反応抑制剤と
して白金原子に対して、ベンジリデンアニリンを5当量
(比較例7)、10当量(比較例8)を添加して白金錯
体を得た。これら白金錯体30ppmを上記のべース樹
脂に添加した。[Comparative Examples 7-8] The base resin prepared in Example 1 was mixed with 30 ppm of a chloroplatinic acid hexahydrate containing 2.0% platinum in isopropanol solution and platinum atom as a reaction inhibitor. Then, 5 equivalents (Comparative Example 7) and 10 equivalents (Comparative Example 8) of benzylideneaniline were added to obtain a platinum complex. 30 ppm of these platinum complexes were added to the above base resin.
【0088】[比較例9−12]以下の用に調製した白
金錯体を前記ベース樹脂に30ppm添加した。 (比較例9)数平均分子量約300000のポリメタク
リル酸(0.86、10mmol)をジメチルフォルム
アミド5mlに溶解し、2−ブロモメチルフェニルスル
フィド(2.22g、11mmol)とジアザビシクロ
−(5,4,0)−ウンデセン−7(1.67g、11
mmol)を加えたものを50℃で24時間加熱した。
加熱終了後、反応溶液を多量のメタノールに注いでスル
フィド基を有するポリマーを回収した。(回収率95
%、スルフィド基導入率90%)。得られたポリマーを
テトラヒドロフランに溶解させ、ポリマーのスルフィド
基と当量の塩化白金酸を加え、40℃で3時間加熱する
ことで目的の白金錯体を調製した。[Comparative Examples 9-12] 30 ppm of a platinum complex prepared for the following was added to the base resin. (Comparative Example 9) Polymethacrylic acid (0.86, 10 mmol) having a number-average molecular weight of about 300,000 was dissolved in 5 ml of dimethylformamide, and 2-bromomethylphenylsulfide (2.22 g, 11 mmol) and diazabicyclo- (5,4 , 0) -undecene-7 (1.67 g, 11
(mmol) was heated at 50 ° C. for 24 hours.
After completion of the heating, the reaction solution was poured into a large amount of methanol to recover a polymer having a sulfide group. (Recovery rate 95
%, Sulfide group introduction rate 90%). The obtained polymer was dissolved in tetrahydrofuran, a chloroplatinic acid equivalent to the sulfide group of the polymer was added, and the mixture was heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0089】(比較例10)数平均分子量約800のポ
リメタクリル酸オリゴマー(0.86g、10mmo
l)をジメチルフォルムアミド5mlに溶解し、2−ブ
ロモメチルフェニルスルフィド(2.22g、11mm
ol)とジアザビンクロ−(5,4,0)−ウンデセン
−7(1.67g、1lmmol)を加えたものを50
℃で24時間加熱した。加熱終了後、反応溶液を多量の
メタノールに注いでスルフィド基を有するポリマーを回
収した。(回収率90%、スルフィド基の導入率98
%)。得られたポリマーをテトラヒドロフランに溶解さ
せ、スルフィド基と当量の塩化白金酸を加え、40℃で
3時間加熱することで目的の白金錯体を調製した。Comparative Example 10 Polymethacrylic acid oligomer having a number average molecular weight of about 800 (0.86 g, 10 mmol)
l) was dissolved in 5 ml of dimethylformamide, and 2-bromomethylphenylsulfide (2.22 g, 11 mm
ol) and diazavinclo- (5,4,0) -undecene-7 (1.67 g, 11 mmol).
Heated at ° C for 24 hours. After completion of the heating, the reaction solution was poured into a large amount of methanol to recover a polymer having a sulfide group. (Recovery rate 90%, introduction rate of sulfide group 98
%). The obtained polymer was dissolved in tetrahydrofuran, an equivalent amount of chloroplatinic acid was added to a sulfide group, and the mixture was heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0090】(比較例11)数平均分子量約10000
のポリメタクリル酸(0.86g、10mmol)をジ
メチルフォルムアミド5mlに溶解した。プロパルギル
アルコールをテトラヒドロフランで希釈したものを0℃
に冷却し、その溶液にノルマルブチルキチウムの6規定
へキサン溶液をゆっくり滴下し、プロパルギルアルコー
ルのリチウム塩を合成した。この溶液を室温に戻し、先
のポリクロロメチルスチレンに加え、80℃で12時間
加熱した。加熱終了後、反応溶液を多量のメタノールに
注いでプロパルギル基を有するポリマーを回収した。
(回収率90%、プロパルギル基の導入率98%)。得
られたポリマーをテトラヒドロフランに溶解させ、プロ
パルギル基と当量の塩化白金酸を加え、40℃で3時間
加熱することで目的の白金錯体を調製した。(Comparative Example 11) Number average molecular weight: about 10,000
Of polymethacrylic acid (0.86 g, 10 mmol) was dissolved in 5 ml of dimethylformamide. Propargyl alcohol diluted with tetrahydrofuran at 0 ° C
Then, a 6N hexane solution of normal butylchitium was slowly added dropwise to the solution to synthesize a lithium salt of propargyl alcohol. This solution was returned to room temperature, added to the above polychloromethylstyrene, and heated at 80 ° C. for 12 hours. After completion of the heating, the reaction solution was poured into a large amount of methanol to recover a polymer having a propargyl group.
(Recovery rate 90%, introduction rate of propargyl group 98%). The obtained polymer was dissolved in tetrahydrofuran, a propargyl group and an equivalent amount of chloroplatinic acid were added, and the mixture was heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0091】(比較例12)数平均分子量約11000
のポリ(メタクリル酸−メタクリル酸メチル)共重合体
(組成比は0.2:9.8、0.98g、10mmo
l)をジメチルフォルムアミド5mlに溶解し、2−ブ
ロモメチルフェニルスルフィド(2.22g、11mm
ol)とジアザビシクロ−(5,4,0)−ウンデセン
−7(1.67g、11mmol)を加えたものを50
℃で24時間加熱した。加熱終了後、反応溶液を多量の
メタノールに注いでスルフィド基を有するポリマーを回
収した。(回収率97%、配位子導入率99%(2%の
カルボン酸官能基に対して1.9%の導入率):1NM
Rによりポリマー鎖のメチンプロトンの積分比と高分子
主鎖のメチル基プロトンの積分比から算出した)。得ら
れたポリマーをテトラヒドロフランに溶解させ、スルフ
ィド基と当量の塩化白金酸を加え、40℃で3時間加熱
することで目的の白金錯体を調製した。(Comparative Example 12) Number average molecular weight: about 11,000
Poly (methacrylic acid-methyl methacrylate) copolymer (composition ratio: 0.2: 9.8, 0.98 g, 10 mmol)
l) was dissolved in 5 ml of dimethylformamide, and 2-bromomethylphenylsulfide (2.22 g, 11 mm
ol) and diazabicyclo- (5,4,0) -undecene-7 (1.67 g, 11 mmol).
Heated at ° C for 24 hours. After completion of the heating, the reaction solution was poured into a large amount of methanol to recover a polymer having a sulfide group. (Recovery rate 97%, ligand introduction rate 99% (1.9% introduction rate for 2% carboxylic acid functional group): 1 NM
R was calculated from the integral ratio of the methine proton in the polymer chain and the integral ratio of the methyl group proton in the polymer main chain). The obtained polymer was dissolved in tetrahydrofuran, an equivalent amount of chloroplatinic acid was added to a sulfide group, and the mixture was heated at 40 ° C. for 3 hours to prepare a target platinum complex.
【0092】(比較例13)(d)成分を添加せずベー
ス樹脂に2.0%の白金を含有する塩化白金酸・6水和
物のイソプロパノール溶液を15ppm添加した。本組
成物は直ちに反応が起こるため添加後すぐに撹拌し下記
の硬化実験を行った。(Comparative Example 13) 15 ppm of a solution of chloroplatinic acid hexahydrate containing 2.0% platinum in isopropanol was added to the base resin without adding the component (d). Since this composition immediately reacted, it was stirred immediately after the addition, and the following curing experiment was performed.
【0093】(硬化実験)上述した実施例と比較例で得
られた樹脂組成物を2mm×100mm×150mmの
容量に満たし、100℃の恒温槽中で加熱し、硬化させ
た。15分で硬化したものは○、30分で硬化したもの
は△、30分でも硬化しないものは×とした。(Curing Experiment) The resin compositions obtained in the above Examples and Comparative Examples were filled in a capacity of 2 mm × 100 mm × 150 mm, and were heated and cured in a thermostat at 100 ° C. The sample was cured in 15 minutes was rated as 、, the one cured in 30 minutes was rated as Δ, and the one that was not cured in 30 minutes was rated X.
【0094】(保存安定性)組成物をガラス製試験管に
50グラム秤量しゴム栓をした。40℃の恒温層で3日
静置してゲル化しないかを確認した。ゲル化したものは
×、増粘したものは△、初期と変化ないものは○とし
た。(Storage stability) 50 g of the composition was weighed and placed in a glass test tube and sealed with a rubber stopper. The mixture was allowed to stand still for 3 days in a constant temperature layer at 40 ° C. to check whether or not gelation occurred. The gelation was evaluated as ×, the viscosity increased as Δ, and the one that did not change from the initial state was evaluated as ○.
【0095】(硬化物物性測定)上述した実施例と比較
例で得られた組成物の硬化物の引張強度、伸び率を測定
した。引張強度、伸び率は硬化物をJIS−K−630
1の準拠した3号ゴムダンベル型に打ち抜き切断してお
こなった。その結果を表に示す。表中引張強度の単位は
MPaであり、伸び率は%である。(Measurement of Physical Properties of Cured Product) Tensile strength and elongation of cured products of the compositions obtained in the above Examples and Comparative Examples were measured. Tensile strength and elongation were measured according to JIS-K-630.
This was performed by punching and cutting into a No. 3 rubber dumbbell mold conforming to 1. The results are shown in the table. In the table, the unit of the tensile strength is MPa, and the elongation is%.
【0096】[0096]
【表1】 [Table 1]
【0097】[0097]
【発明の効果】本発明は、一液性の室温保存性組成物に
関するものであり低透湿性のシール剤となることができ
る。よって、湿分により性能が低下したり破損してしま
う電子部品などを内部に収納する場合などのシール剤と
して有用である。Industrial Applicability The present invention relates to a one-part room-temperature storage composition which can be used as a sealant having low moisture permeability. Therefore, it is useful as a sealant in cases where electronic components or the like whose performance is deteriorated or damaged by moisture are housed inside.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C08K 5/29 C08K 5/29 5/3467 5/3467 5/45 5/45 5/56 5/56 C08L 23/22 C08L 23/22 25/18 25/18 29/04 29/04 C 33/02 33/02 61/06 61/06 83/05 83/05 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C08K 5/29 C08K 5/29 5/3467 5/3467 5/45 5/45 5/56 5/56 C08L 23/22 C08L 23/22 25/18 25/18 29/04 29/04 C 33/02 33/02 61/06 61/06 83/05 83/05
Claims (10)
レン化合物と(b)分子中に少なくとも2個のヒドロシ
リル基を有する化合物と(c)白金触媒および、(d)
常温では白金触媒のヒドロシリル化を促進する能力を抑
制し、高温時には抑制しない化合物からなることを特徴
とするシール剤組成物。1. A polyisobutylene compound having an alkenyl group, (b) a compound having at least two hydrosilyl groups in a molecule, (c) a platinum catalyst, and (d) a platinum catalyst.
A sealant composition comprising a compound that suppresses the ability of a platinum catalyst to promote hydrosilylation at room temperature and does not suppress the ability at high temperatures.
シアニド化合物、環状チオエーテル化合物、環状アゾエ
ーテル化合物、イミノ化合物及び白金原子と錯体を形成
しうる硫黄原子、窒素原子またはリン原子含有官能基を
1分子中に複数もつ平均分子量1,000〜200,0
00のポリマーからなる群から選ばれる少なくとも1の
メンバーであることを特徴とする請求項1に記載のシー
ル材組成物。2. The component (d) contains one molecule of a thiophene compound, an isocyanide compound, a cyclic thioether compound, a cyclic azoether compound, an imino compound and a sulfur, nitrogen or phosphorus atom-containing functional group capable of forming a complex with a platinum atom. Average molecular weight of 1,000 to 200,0
The sealing material composition according to claim 1, wherein the sealing material composition is at least one member selected from the group consisting of 00 polymers.
基またはアリールアルキル基であり、Ar’はアリール
基、アリールアルキル基または水素原子である)で示さ
れる請求項2記載の組成物。3. The thiophene compound represented by the general formula [T] n or Ar—T—Ar ′ (where T is a thiophene molecular skeleton, Ar is an aryl group or an arylalkyl group, and Ar ′ is an aryl group or an aryl group). The composition according to claim 2, which is an alkyl group or a hydrogen atom.
される請求項2記載の組成物。4. The composition according to claim 2, wherein said isocyanide compound is represented by the general formula R 1 -NC, wherein R 1 is a hydrocarbon group having 1 to 18 carbon atoms.
り、nは3〜8の整数である)で示される請求項2記載
の組成物。5. The cyclic thioether compound represented by the general formula (R 5 —S) n (where R 5 is a divalent hydrocarbon group having 3 to 18 carbon atoms, and n is an integer of 3 to 8). 3. The composition of claim 2 as indicated.
り、nは3〜8の整数である)で示される請求項2記載
の組成物。6. The cyclic azoether compound has a general formula (R 5 —N) n (where R 5 is a divalent hydrocarbon group having 3 to 18 carbon atoms, and n is an integer of 3 to 8). 3. The composition of claim 2 as indicated.
素基であり、R3およびR4はそれぞれ独立に水素原
子、または炭素数1〜12の非置換または置換炭化水素
である)で示される請求項2記載の組成物。7. The imino compound represented by the general formula R 2 —N = C (R 3 , R 4 ) (where R 2 is an unsubstituted or substituted hydrocarbon group having 1 to 12 carbon atoms, and R 3 and R 4 Is each independently a hydrogen atom or an unsubstituted or substituted hydrocarbon having 1 to 12 carbon atoms).
フィド基、2級もしくは3級アミノ基、ホスフィン基、
チオフェン基またはイミノ基である請求項2記載の組成
物。8. The method according to claim 1, wherein the functional group bonded to the polymer is a sulfide group, a secondary or tertiary amino group, a phosphine group,
The composition according to claim 2, which is a thiophene group or an imino group.
ルアルコール系ポリマー、スチレン系ポリマーまたはフ
ェノール樹脂である請求項8記載の組成物。9. The composition according to claim 8, wherein the polymer is an acrylic polymer, a vinyl alcohol polymer, a styrene polymer or a phenol resin.
量である請求項1記載の組成物。10. The composition according to claim 1, wherein the amount of the component (d) is 1 to 5 equivalents per platinum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11138409A JP2000328042A (en) | 1999-05-19 | 1999-05-19 | Sealing compound composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11138409A JP2000328042A (en) | 1999-05-19 | 1999-05-19 | Sealing compound composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000328042A true JP2000328042A (en) | 2000-11-28 |
Family
ID=15221295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11138409A Pending JP2000328042A (en) | 1999-05-19 | 1999-05-19 | Sealing compound composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000328042A (en) |
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|---|---|---|---|---|
| JP2002332410A (en) * | 2001-05-09 | 2002-11-22 | Kanegafuchi Chem Ind Co Ltd | Curable composition |
| US6825965B2 (en) | 2001-10-10 | 2004-11-30 | Murakami Corporation | Solid type electrochromic glare-proof mirror |
| WO2005095520A1 (en) * | 2004-04-01 | 2005-10-13 | Three Bond Co., Ltd. | Curing composition and sealing method |
| WO2006001522A1 (en) * | 2004-06-25 | 2006-01-05 | Three Bond Co., Ltd. | Photocurable composition |
| JP2006008819A (en) * | 2004-06-25 | 2006-01-12 | Three Bond Co Ltd | Photocurable composition |
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