JP2000321594A - Cog type liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a COG(Chip On Glass) type liquid crystal display device hardly causing defective plating when the wiring parts of the liquid crystal display device having metallic wiring on a glass substrate is metal-plated. SOLUTION: In this COG type liquid crystal display device composed of a glass substrate 2, segment-side electrodes 6a, control-side electrodes 6b, input- side electrodes 6c, segment display parts 3e, alignment marks 4, cutting parts 5, a transparent insulating film coating area 7 and terminal aggregate parts 8 (8a, 8b, 8c), respective electrodes (6a, 6b, 6c) extended and connected to the terminal pattern aggregate parts 8 are plated, then and are cut off at the cutting lines 5 between the extended electrodes (6a, 6b, 6c) and the terminal pattern aggregate parts 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display device having a metal wiring terminal on a glass substrate. The present invention relates to a liquid crystal display device to be stably applied.

[0002]

2. Description of the Related Art Recently, cost,
LSI for driving liquid crystal on a glass substrate due to the number of processes and reliability
COG type (Chip On Glass) for mounting a chip
The liquid crystal display device of s) is often used.

FIG. 5 shows a basic configuration diagram of a COG type liquid crystal display device. In FIG. 5, a COG type liquid crystal display device 21 is shown.
Are the glass substrate 2, the transparent conductive patterns 3a and 3b,
It is composed of a liquid crystal 14, a seal 15 made of resin or the like, an external electrode 6, a polarizing filter 17, a liquid crystal driving LSI 18, and a metal plating 9. The upper and lower two glass substrates 2 are aligned, and a gap is formed between the two glass substrates. The liquid crystal 14 is sealed in the gap, and the periphery is sealed with a seal 15 such as a resin. On the surface of the glass substrate 2, a pattern 3a of a transparent conductive film such as a Nesa film or an ITO film (indium oxide film) is formed. 3b.

Further, a polarizing filter 17 is attached to the surface of the COG type liquid crystal display device 21. Further, a liquid crystal driving LSI 18 is provided at a wiring terminal outside the liquid crystal 14, receives a power supply and a display command signal from the external electrode 6, and supplies a signal for a liquid crystal display device to a display unit.

Further, an external electrode 6 and a liquid crystal driving LS
The entire pattern of I18 is covered with metal plating 9. The portions outside the liquid crystal 14 formed at the same time as the formation of the patterns 3a and 3b of the transparent conductive film are used as the external electrodes 6 and the wiring terminals.

The COG type liquid crystal display device 21 is a small module in which a liquid crystal driving LSI 18 is provided in an electrode portion. In a fine pattern used when a display capacity is large, a wiring terminal becomes thin, and especially, a wiring terminal becomes thin. Around the liquid crystal driving LSI 18 to be installed, the line width of the wiring is 100 μm.
m or less, the wiring resistance also increases. A metal wiring is effective for reducing the resistance value, and a conventional liquid crystal display device uses a patterning method of forming a fine pattern by vapor deposition or sputtering of a metal film.

Further, the conventional COG type liquid crystal display device is a method in which Ni-P and Au are electrolessly plated on an ITO film of a transparent conductive film, and Ni-P is selectively deposited only on the ITO film. Au can be subjected to displacement plating or autocatalytic plating thereon, and patterning is not required.
There was a feature that plating was not adhered on glass having no TO film.

Further, Japanese Patent Application Laid-Open No. 5-53128 discloses that a metal wiring is formed on a glass substrate by an electroless plating method.
Provide a dummy pattern or a wide power supply line so as to surround the outermost part of the wiring in the area with the metal wiring,
There is disclosed an invention that prevents plating from being removed from the inner side.

[0009]

In a conventional COG type liquid crystal display device in which a fine pattern is formed by vapor deposition or sputtering of a metal film, the equipment cost of the vapor deposition or sputtering device is high because the processes such as vapor deposition and sputtering are performed. Therefore, there is a problem that the manufacturing cost increases.

[0010] Further, Ni- on the ITO film of the transparent conductive film.
A conventional COG type liquid crystal display device in which P and Au are electrolessly plated can be manufactured at a low cost, but only one of continuous patterns may be unplated, and in particular, isolated fine patterns may be produced. Plating often occurs in the pattern. There is a problem that not a plated portion and a non-plated portion are generated in one pattern, but a pattern that is not plated is not plated at all portions.

Further, a conventional liquid crystal disclosed in Japanese Patent Application Laid-Open No. 5-53128 is provided with a dummy pattern or a power supply line surrounding a wiring in a certain area so as to surround the outermost part, thereby preventing plating from being removed inside. The display device seems to be caused by the potential of the plating, and there is a problem that not only the outer dummy pattern or the power supply line but also the inner pattern may be plated simultaneously.

[0012]

According to the present invention, there is provided a segment substrate of a COG type liquid crystal display device according to the present invention, comprising a terminal pattern group for extending and connecting thin conductive patterns from terminals of a wiring terminal portion. And a cutting portion for cutting between the wiring terminal portion and the terminal pattern gathering portion, plating the wiring terminal portion with the same potential, and after plating, the wiring terminal portion and the terminal pattern gathering portion. It is characterized by having been cut at the cutting part

In the segment substrate of the COG type liquid crystal display device according to the present invention, since the wiring terminal portions are set to the same potential, plating is stably performed, and after plating, the terminal pattern portion is separated.

[0014] The segment display section and the terminal pattern collecting section connected to the segment display section according to the present invention may include:
The region is covered with a transparent insulating film and is not plated.

The segment display portion and the terminal pattern collecting portion connected to the segment display portion according to the present invention prevent the plating from being adhered because the region is not plated.
In addition, it is possible to prevent contamination between terminals outside the seal and short circuit due to dew condensation water.

Further, the alignment mark portion according to the present invention is characterized in that the alignment mark portion is connected to the terminal pattern collecting portion by a thin conductive pattern, and all the connected patterns are metal-plated.

The alignment mark portion according to the present invention can be used as a detection mark for automatic image recognition because the alignment mark portion is clearly displayed by plating when the liquid crystal driving LSI is automatically installed by a machine.

[0018]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows the C according to the present invention.
1 shows a segment substrate diagram of an OG type liquid crystal display device. In FIG. 1, a segment substrate 1 of a COG type liquid crystal display device includes a glass substrate 2, a wiring terminal (segment-side electrode) 6a, a wiring terminal (control-side electrode) 6b, a wiring terminal (input-side electrode) 6c, and a segment display. A portion 3e, an alignment mark portion 4, a cutting portion 5, a transparent insulating film application region 7, and a terminal pattern collecting portion 8 (8a, 8b, 8c).

The glass substrate 2 contains soda lime glass as a main component as a glass component. In addition, the glass substrate 2
It is made of high-quality glass with little unevenness, warpage, undulation, surface roughness, etc., in terms of flatness, scratches, pits, dirt, and the like. In some cases, the surface is polished. Note that the glass substrate 2 may be made of non-alkali glass.

The wiring terminal portion (segment side electrode) 6a
It is composed of a plurality of wiring terminals and gives a potential to the segment electrodes to display liquid crystal. The wiring terminal (segment side electrode) 6a is made of tin oxide (SnO ₂ ) or indium oxide (I
n ₂ O ₃ ) is used as a main component, and a compound made of a mixture of indium oxide and tin oxide, cadmium tin oxide (Cd ₂ SnO ₄ ), or the like is used to form a transparent conductive film by vacuum, chemical vapor deposition, or the like.

Further, a wiring terminal (control electrode) 6b
Is composed of a plurality of wiring terminals and applies a potential to the common electrode to display a liquid crystal. Also, a wiring terminal (control-side electrode) 6
b forms a transparent conductive film by using, as a main component, tin oxide or indium oxide, a mixture of indium oxide and tin oxide, cadmium tin oxide, or the like, by vacuum, chemical vapor deposition, or the like.

Further, a wiring terminal portion (input side electrode) 6c
Is composed of a plurality of wiring terminals and supplies current for power supply and grounding of the liquid crystal driving LSI. The wiring terminal portion (input side electrode) 6c is mainly composed of tin oxide or indium oxide, and is a mixture of indium oxide and tin oxide;
A transparent conductive film is formed from a compound made of cadmium tin oxide or the like by vacuum, chemical vapor deposition, or the like.

The segment display section 3e is connected to a wiring terminal section (segment-side electrode) 6a, and its pattern is larger in area than the segment-side electrode 6a, and contains tin oxide or indium oxide as a main component. A mixture of tin and a compound composed of cadmium tin oxide or the like is formed in a display electrode by vacuum, chemical vapor deposition, or the like, an upper portion of the display electrode is covered with a transparent insulating film, an alignment film is disposed thereon, and an alignment film is further disposed thereon. Equipped with liquid crystal.

The alignment mark section 4 is a liquid crystal driving LSI
This is a mark for notifying the position and the direction when arranging, and the pattern of the alignment mark portion 4 is extended with a thin pattern and connected to the terminal pattern collecting portion 8c and the wiring terminal portion (input side electrode) 6c. Metal plating is also performed on the alignment mark portion 4 at the same time.

After the metal plating, the cutting section 5 cuts the glass substrate 2 at the position of the cutting section 5 to form the wiring terminal sections 6a, 6a.
b, 6c and terminal pattern gathering section 8 (8a, 8b, 8c)
And is electrically disconnected.

Since the transparent insulating film is applied on the transparent conductive film of the segment display portion 3e and the terminal pattern collecting portion 8a, the transparent insulating film is not plated in the application region 7 of the transparent insulating film. Further, the coating of the transparent insulating film prevents the plating from adhering to the segment display portion 3e, and the thin pattern obtained by extending the pattern of the segment display portion 3e has the same pattern as that of the transparent insulating film. To prevent short circuit due to dirt or dew condensation. Further, a liquid crystal cell is formed above the segment display portion 3e in the application region 7 of the transparent insulating film via an alignment film.

The terminal pattern collecting portion 8a is formed of one thin conductive pattern, and is connected to a thin pattern extending from the segment display portion 3e connected to the wiring terminal portion (segment side electrode) 6a. Are all the same. The terminal pattern collecting portion 8b is formed of one thin conductive pattern, and the wiring terminal portion (control electrode) 6
The connection is made to a thin pattern extending from all the wiring terminals of the common electrode pattern b, and the potentials of the wiring terminal portions are all equalized. Further, the terminal pattern collecting portion 8c is formed of one thin conductive pattern, and the wiring terminal portion (input side electrode)
6c is connected to a thin pattern extending from all the wiring terminals, and all the potentials of the wiring terminal portions are made equal.

It should be noted that all the wiring terminals are connected to one pattern of the terminal pattern gathering portion without dividing the terminal pattern gathering portion 8 for each electrode pattern so that all the potentials of the wiring terminals become the same. You may.

FIG. 2 is a view showing a plating process of a segment substrate according to the present invention. FIG. 2A shows a state of a patterned substrate with an ITO film. A display electrode (corresponding to the segment substrate 3e in FIG. 1) is formed on a glass substrate 2 made of soda lime silica glass or the like by etching or the like with tin oxide or indium oxide, and a wiring terminal portion to the display portion (segment side electrode in FIG. 6a) and the terminal of the external electrode 6 (corresponding to the input-side electrode 6c in FIG. 1). To form a transparent conductive film. Further, a transparent insulating film 7 is provided in a region where plating is not attached.

FIG. 2B shows metal plating (nickel).
9 shows a state where 9-a is performed. In FIG. 2B, in order to apply metal plating to portions other than the wiring portion and the bump portion to the liquid crystal portion, first, for the purpose of removing dirt on the surface or degreasing,
Cleaning is performed with an alkaline solution, and then alkalinity is neutralized with an acid such as hydrochloric acid.

Further, a catalytic treatment is performed. First, as a catalyst, it is immersed for about 2 to 3 minutes in a catalyzed treatment solution containing simultaneously a metal chloride composed of stannous chloride and palladium chloride and hydrochloric acid.

Further, the substrate is immersed in a chemical nickel plating solution such as a nickel chloride solution or a nickel sulfate solution containing nickel ions to generate electroless nickel plating, thereby forming an underlying nickel plating layer 9-a.

FIG. 2C shows metal plating (gold plating).
9B shows a state where 9-b is selectively applied on the nickel plating 9-a. As in the treatment process of FIG. 2B, first, cleaning is performed with an alkaline solution for removing stains and degreasing of the surface, and then neutralizing the alkalinity with an acid such as sulfuric acid and the like. Activate.

Further, gold plating using flash gold having a plating layer thickness of about 50 nm is performed. Immerse in a chemical gold plating solution composed of a metal salt such as a chloride solution or a sulfate solution containing gold ions at about room temperature, and further reduce with formaldehyde or Rochelle salt as a metal ion reducing agent to generate electroless gold plating, Underlying nickel plating layer 9-
a) A gold plating layer 9-b is formed on the upper part a. The metal plating 9 is formed on the whole of the nickel plating layer 9-a and the gold plating layer 9-b.

As described above, when performing electroless metal plating,
A thin conductive pattern is extended from each of the terminals of the segment display section and the wiring terminal section and connected to a terminal pattern collecting section composed of one pattern, and the wiring terminal section and the segment display section are all set to the same potential and plated. For example, metal plating without pattern omission can be performed.

FIG. 3 shows a pattern of the segment substrate after cutting and an application area diagram of the transparent insulating film. In FIG. 3, a portion surrounded by a thick solid line on the cut segment substrate 51 is a region 13 where a seal is printed, and a region indicated by a broken line is a transparent insulating film application region 7.

The application area 7 of the transparent insulating film is an area where plating is not performed. The segment display portion and a part of the extended thin pattern are covered with a transparent insulating film. Further, the pattern extended from each terminal is separated and becomes an independent pattern. There is a region 13 where a seal is printed above the application region 7 of the transparent insulating film, and liquid crystal is sealed in the region 13 where the seal is printed.

FIG. 4 is a pattern diagram in which a plurality of segment substrate patterns are provided on a mother glass. In FIG. 4, a mother glass 41 is a glass substrate that is a base when manufacturing a pattern of a segment substrate. A large number of segment substrate patterns are imposed on the mother glass 41, a panel is formed after plating, and a liquid crystal is injected. If the injection port is sealed and then cut at the position of the cutting section 5, a large number of segment substrate patterns can be manufactured at once, thereby improving the production efficiency. Note that a large number of segment substrate patterns and common substrate patterns may be provided on the same mother glass for plating.

[0039]

As described above, the segment substrate of the COG type liquid crystal display device according to the present invention comprises a terminal pattern collecting portion for extending and connecting a thin conductive pattern from the terminal of the wiring terminal portion, and a wiring terminal. When the plating is done with the same potential, after the plating is completed, the wiring terminal part and the terminal pattern assembly part are cut and separated from the segment substrate, so when plating, the pattern potential can be the same. , Plating can be prevented. Also, LSI for driving liquid crystal
Since the power supply wiring, the ground wiring, and the boost wiring are metal-plated, the terminals have low resistance, and current can flow without voltage drop.

The segment display section and the terminal pattern assembly section connected to the segment display section according to the present invention are covered with the transparent insulating film, so that plating is prevented from adhering to the segment display section, and the outside of the seal is prevented. The occurrence of a short circuit due to the contamination of the wiring portion or dew condensation water is prevented.

The alignment mark portion according to the present invention is connected to the terminal pattern collecting portion by a thin conductive pattern, and all of the connected patterns are metal-plated, so that the liquid crystal driving LSI is automatically installed by a machine. In addition, the alignment mark portion is clearly displayed by metal plating and can be used as a detection mark for automatic image recognition.

[Brief description of the drawings]

FIG. 1 is a segment substrate view of a COG type liquid crystal display device according to the present invention.

FIG. 2 is a diagram showing a plating process of a segment substrate according to the present invention.

FIG. 3 is a view showing a pattern of a segment substrate after being cut and a coating area of a transparent insulating film.

FIG. 4 is a pattern diagram in which a plurality of glass substrates are attached to mother glass.

FIG. 5 is a basic configuration diagram of a COG type liquid crystal display device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Segment substrate of COG liquid crystal display device, 2 ... Glass substrate, 3a, 3b ... Transparent conductive film pattern, 3e ... Segment display part, 4 ... Alignment mark part, 5 ... Cutting part, 6
... external electrodes, 6a ... segment side electrodes, 6b ... control side electrodes, 6c ... input side electrodes, 7 ... application area of transparent insulating film,
8, 8a, 8b, 8c: terminal pattern assembly, 9: metal plating, 9a: nickel plating (electroless nickel plating), 9b: gold plating (electroless gold plating), 10: bump, 13: area on which seal is printed , 14 ... liquid crystal, 15
... Seal, 17 ... Deflection filter, 18 ... LS for driving liquid crystal
I, 21: COG liquid crystal display device, 41: mother glass.

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 2H092 GA41 GA43 GA44 GA57 GA60 HA19 MA11 MA12 NA15 NA28 PA01 5C094 AA32 AA38 AA42 AA43 BA43 CA14 DA09 DA14 EA04 EA05 EA07 EB02 FB12 GB01 5G435 AA16 AA17 BB12 CC37 EE12 KK05

Claims (3)

[Claims] 1. A segment display unit serving as one electrode for applying a voltage to liquid crystal sealed in a liquid crystal cell, a wiring terminal unit having a terminal for connecting a liquid crystal driving LSI outside the liquid crystal cell, and a liquid crystal driving unit. In a COG (chip-on-glass) liquid crystal display device provided with a substrate having a segment display electrode having an alignment mark portion for adjusting the direction and position of the LSI, the segment substrate is thinner than the terminal of the wiring terminal portion. A terminal pattern collecting part for extending and connecting the conductive pattern, and a cutting part for cutting between the wiring terminal part and the terminal pattern collecting part, and plating the wiring terminal part at the same potential. COG (chip-on-glass), wherein after the completion of plating, the gap between the wiring terminal portion and the terminal pattern assembly portion is cut by the cutting portion. ) Type liquid crystal display device. 2. The COG (chip-on-chip) according to claim 1, wherein the segment display section and the terminal pattern collecting section connected to the segment display section are areas that are covered with a transparent insulating film and are not plated. Glass-type liquid crystal display. 3. The alignment mark portion according to claim 1, wherein the alignment mark portion is connected to the terminal pattern gathering portion by a thin conductive pattern, and all the connected patterns are metal-plated. COG (chip-on-glass) liquid crystal display device.