JP2000301065A - Piezoelectric vibration device - Google Patents

Abstract

(57) [Problem] To provide a piezoelectric vibrating device which can reduce the number of used lead wires and eliminate the need for a double-sided tape, and is excellent in manufacturing cost and space. SOLUTION: A height defining member 2 is provided on the surface of a substrate 1 and a vibrating plate 4 having a piezoelectric element 3 fixed to the surface is placed on the height defining member 2 and arranged on the substrate 1. The vibrating plate 4 is connected to the lands 6 of the circuit 5 provided on the surface of the substrate 1 by conducting portions 7.
And the vibrating plate 4 is fixed to the substrate 1 by the holding member 8. The clearance between the vibrating plate 4 and the substrate 1 can be secured by the height defining member 2 and the vibrating plate 4 can be fixed to the substrate 1 by the holding member 8. There is no need to use double-sided tape. Further, the vibrated plate 4 is connected to the land 6 by a conduction portion 7,
There is no need to connect the vibrated plate 4 to the land 6 with a lead wire.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric vibration device used as a piezoelectric buzzer or the like.

[0002]

2. Description of the Related Art As this kind of piezoelectric vibration device, a device shown in FIG. 7 has been conventionally provided. In this device, a piezoelectric element 3 is fixed to the surface of a vibrating plate 4 formed of a metal plate or the like, and the vibrating plate 4 is arranged on the substrate 1 and fixed to the substrate 1 with a donut-shaped double-sided tape 16. The leads 17 are connected between the lands 6 and 10 of the circuits 5 and 9 formed on the surface of the substrate 1 and the vibrating plate 4 and the piezoelectric element. Here, the reason why the vibrating plate 4 is fixed to the substrate 1 with the doughnut-shaped double-sided tape 16 is that a gap is formed between the vibrating plate 4 and the substrate 1 so that the vibrating plate 4 is not in contact with the vibrating plate 4. This is to prevent the pronunciation by the user from being disturbed.

[0003]

However, in the above-mentioned conventional example, it is necessary to perform connection work at a total of four places on both ends of the two lead wires 17 and 17, and it is necessary to attach a double-sided tape. In this case, assembling steps are required, and a space for arranging the two lead wires 17 is required. Therefore, there is a problem in terms of manufacturing cost and space.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and provides a piezoelectric vibrating apparatus which can reduce the number of lead wires used and can eliminate the need for a double-sided tape, and is excellent in manufacturing cost and space. It is intended to provide.

[0005]

According to a first aspect of the present invention, there is provided a piezoelectric vibrating apparatus in which a height defining member is provided on a surface of a substrate and a vibrating plate having a piezoelectric element fixed on the surface is provided at a height. The vibrating plate 4 is placed on the defining member 2 and placed on the substrate 1, and the vibrating plate 4 is connected to the lands 6 of the circuit 5 provided on the surface of the substrate 1 by conducting portions 7
And the vibration plate 4 is fixed to the substrate 1 with a holding member 8.

The invention according to claim 2 is characterized in that the conducting portion 7 also serves as a holding member 8.

According to a third aspect of the present invention, the conductive portion 7 is made of a conductive adhesive 13.

The invention according to claim 4 is characterized in that the conductive portion 7 also serves as the height defining member 2.

According to a fifth aspect of the present invention, the piezoelectric element 3 is fixed to the surface of the vibrating plate 4 on the substrate 1 side, and the piezoelectric element 3 is connected to the land 10 of the circuit 9 provided on the surface of the substrate 1 by the conductive portion 11. It is characterized by being connected.

A piezoelectric vibration device according to a sixth aspect of the present invention comprises:
The vibrating plate 4 having the piezoelectric element 3 fixed to the surface is disposed on the substrate 1 with the piezoelectric element 3 facing the substrate 1, and vibrated on the lands 6 and 10 of the circuits 5 and 9 provided on the surface of the substrate 1. The plate 4 and the piezoelectric element 3 are connected by conductive portions 7 and 11, respectively, and the vibrating plate 4 is fixed to the substrate 1 by a holding member 8, and the conductive connection of the piezoelectric element 3 is made to a portion of the substrate 1 facing the piezoelectric element 3. The opening 12 is formed except for the portion.

[0011]

Embodiments of the present invention will be described below.

FIG. 1 shows an example of an embodiment of the present invention. A substrate 1 is formed of an electrically insulating plate such as a resin laminate plate or a ceramic plate.
In addition, lands 6 and 10 connected to ends of the circuits 5 and 9 are provided by copper foil or the like. In the figure, reference numeral 18 denotes a resist such as a solder resist applied to the surface of the substrate 1 or the surfaces of the circuits 5 and 9. The vibrating plate 4 is formed of a metal plate, and the piezoelectric element 3 is fixed to the surface thereof.

When assembling the piezoelectric vibrating apparatus by mounting the vibrating plate 4 to which the piezoelectric element 3 is fixed on the substrate 1, first, cream solder 14 is printed on the surface of the land 6 of the circuit 5 and solidified by reflow. Thus, the height defining member 2 is formed. Then, a conductive adhesive 13 made of a conductive paste such as Ag paste is applied to the land 6 from above the height regulating member 2 of the solder 14, and the vibrating plate 4 having the piezoelectric element 3 facing the opposite side to the substrate 1 is formed. The vibrating plate 4 is electrically connected to the land 6 with the conductive adhesive 13 (and the solder 14) by placing the end on the height defining member 2 and bonding with the conductive adhesive 13. In addition, the vibrating plate 4 can be fixed to the substrate 1 with the conductive adhesive 13.

Therefore, the conductive adhesive 13 (and the solder 1)
In 4), a conductive portion 7 for connecting the vibrating plate 4 to the land 6 is formed, and a holding member 8 for fixing the vibrating plate 4 to the substrate 1 with the conductive adhesive 13 is formed. In this way, the conducting portion 7 also serves as the holding portion 8 as described above. The solder 14 forming the height defining member 2 forms a part of the conductive portion 7, and the conductive portion 7 also serves as the height defining member 2.

Further, the piezoelectric element 3 fixed to the upper side of the vibrating plate 4 and the land 10 of the circuit 9 are soldered with one end of a lead wire 17 to the end of the piezoelectric element 3 and the other end to the land 10 respectively. By doing so, the connection is made with the lead wire 17.

In the piezoelectric vibrating device assembled as described above, since the vibrating plate 4 is mounted on the height defining member 2, a gap is provided between the vibrating plate 4 and the substrate 1. The vibrating plate 4 can be prevented from coming into contact with the substrate 1 without vibrating the vibrating plate 4 and generating sound. Is fixed to the substrate 1 by the holding member 8, which eliminates the need to fix the vibrating plate 4 to the substrate 1 with a double-sided tape. Further, since the vibrating plate 4 is connected to the land 6 of the circuit 5 by the conductive portion 7 made of the conductive adhesive 13, it is not necessary to connect the vibrating plate 4 to the land 6 by a lead wire.

FIG. 2 shows another example of the embodiment of the present invention. In this example, the solder 14 is reflow-solidified and provided on a part of the land 6 of the circuit 5 to regulate the height. The member 2 is formed, a conductive adhesive 13 is applied to another part of the land 6, and the end of the vibrating plate 4 having the piezoelectric element 3 facing away from the substrate 1 is placed on the height defining member 2 Is placed on the substrate and adhered by the conductive adhesive 13,
The conductive plate 13 (and the solder 14) is used to form the vibrating plate 4
Is electrically connected to the land 6 and the conductive adhesive 1
At 3, the vibrating plate 4 is fixed to the substrate 1. Other configurations are the same as those in FIG.

Accordingly, also in this case, the conductive portion 7 for connecting the vibrating plate 4 to the land 6 is formed by the conductive adhesive 13 (and the solder 14), and the conductive adhesive 13 and the substrate 1 A holding member 8 for fixing the vibrating plate 4 is formed on the vibrating plate 4. Thus, the conductive portion 7 also serves as the holding portion 8. Further, the solder 14 forming the height defining member 2 forms a part of the conductive portion 7,
The conducting portion 7 also serves as the height defining member 2.

FIG. 3 shows another example of the embodiment of the present invention. In this example, a piezoelectric element 3 is fixed to the back surface of a vibrating plate 4 so that the piezoelectric element 3 The vibrated plate 4 is attached to the substrate 1 so as to face. That is, the height defining member 2 is formed by reflow-solidifying the solder 14 on the land 6 of the circuit 5 and the land 10 of the circuit 9 respectively. At this time, Land 1
The height defining member 2 above zero is formed so as to be lower by the thickness of the piezoelectric element 3 than the height defining member 2 above the land 6. Then, a conductive adhesive 13 is applied to the lands 6 and 10 from above the respective height defining members 2, and the end of the vibrating plate 4 with the piezoelectric element 3 facing the substrate 1 and the piezoelectric element 3
Is placed on each height defining member 2 and the vibrating plate 4
By bonding the end of the piezoelectric element 3 and the end of the piezoelectric element 3 with the conductive adhesive 13, the conductive adhesive 13 (and the solder 1) are bonded.
4), the vibrating plate 4 and the piezoelectric element 3 can be electrically connected to the land 6 and the piezoelectric element 3 can be connected to the land 10 by the conductive adhesive 13. Can be fixed to the substrate 1.

Therefore, the conductive adhesive 13 (and the solder 1)
In 4), a conductive portion 7 connecting the vibrating plate 4 to the land 6 is formed, and a conductive portion 11 connecting the piezoelectric element 3 to the land 10 is formed by the conductive adhesive 13 (and solder 14). In addition, a holding member 8 for fixing the vibrating plate 4 and the piezoelectric element 3 to the substrate 1 with the conductive adhesive 13 is formed. Thus, the conducting portion 7 also serves as the holding portion 8. Is what it is. The solder 14 forming the height defining member 2 forms a part of the conductive portions 7 and 11, and the conductive portions 7 and 11 also serve as the height defining member 2.

In the piezoelectric vibrating device assembled as described above, since the vibrating plate 4 is mounted on the height defining member 2, there is a gap between the vibrating plate 4 and the substrate 1. The vibrating plate 4 can be prevented from coming into contact with the substrate 1 without vibrating the vibrating plate 4 and generating sound. Is fixed to the substrate 1 by the holding member 8, which eliminates the need to fix the vibrating plate 4 to the substrate 1 with a double-sided tape. Since the vibrating plate 4 and the piezoelectric element 3 are connected to the lands 6 and 11 of the circuits 5 and 9 by the conductive portions 7 and 11 by the conductive adhesive 13, respectively,
Need not be connected to the land 6 by a lead wire, and the piezoelectric element 3 need not be connected to the land 10 by a lead wire.

FIG. 4 shows another example of the embodiment of the present invention. In this embodiment, a conductive chip component 20 such as a checker conductive chip or a jumper chip is used as the height defining member 2, and the conductive chip component is used. 20 is mounted on the land 6 of the circuit 5 by soldering 19. Then, the conductive adhesive 13 is applied to the lands 6 from above the height defining member 2 formed by the conductive chip components 20 and the conductive adhesive 13 is applied to the lands 10 of the circuit 9, and the piezoelectric element 3 is mounted. The end of the vibrating plate 4 facing the substrate 1 is placed on the height defining member 2, and the end of the vibrating plate 4 and the end of the piezoelectric element 3 are bonded with a conductive adhesive 13. Thus, the vibrating plate 4 can be electrically connected to the land 6 with the conductive adhesive 13 (and the conductive chip component 20), and the piezoelectric element 3 can be connected to the land 10 with the conductive adhesive 13. The vibrating plate 4 is made of a conductive adhesive 13.
And the piezoelectric element 3 can be fixed to the substrate 1. Other configurations are the same as those in FIG.

Therefore, the conductive portion 13 for connecting the vibrating plate 4 to the land 6 is formed by the conductive adhesive 13 (and the conductive chip component 20), and the land 10 is formed by the conductive adhesive 13.
A conductive member 11 for connecting the piezoelectric element 3 is formed on the substrate 1, and a vibrating plate 4 and a holding member 8 for fixing the piezoelectric element 3 to the substrate 1 with a conductive adhesive 13 are formed. Thus, the conductive portion 7 also serves as the holding portion 8. The conductive chip component 20 forming the height defining member 2 forms a part of the conductive portion 7, and the conductive portion 7 also serves as the height defining member 2.

FIG. 5 shows another example of the embodiment of the present invention. In this example, the solder 14 is reflow-solidified and provided on a part of the land 6 of the circuit 5 to regulate the height. The member 2 is formed, and the conductive adhesive 13 is applied to another part of the land 6 and the conductive adhesive 13 is applied to the land 10 of the circuit 9.
The end of the vibrating plate 4 with its side facing the substrate 1 is
And the end of the piezoelectric element 3 is adhered with the conductive adhesive 13, and the vibrating plate 4 is attached with the conductive adhesive 13 (and the solder 14). Is electrically connected to the land 6, the piezoelectric element 3 is electrically connected to the land 10 by the conductive adhesive 13, and the vibrating plate 4 and the piezoelectric element 3 are fixed to the substrate 1 by the conductive adhesive 13. It is. Other configurations are the same as those in FIG.

Accordingly, the conductive adhesive 13 (and the solder 1)
In 4), a conductive portion 7 connecting the vibrating plate 4 to the land 6 is formed, and a conductive portion 11 connecting the piezoelectric element 3 to the land 10 is formed by the conductive adhesive 13. The vibrating plate 4 and the piezoelectric element 3
Is formed, and the conductive portion 7 also serves as the holding portion 8 in this manner. Further, the solder 14 forming the height defining member 2 is
And the conducting portion 7 also serves as the height defining member 2. In addition, the height defining member 2 may be formed of resin or other components in addition to the above-described solder 14, and in this case, the height defining member 2 may be formed.
Does not also serve as the conducting portion 7 and has only the function of regulating the height.

FIG. 6 shows another example of the embodiment of the present invention. The substrate 1 is provided with openings 12 which are open on both sides. The opening 12 has substantially the same shape and dimensions as the piezoelectric element 3.
As shown in FIG. 2B, a protruding portion 21 is provided so as to protrude from the substrate 1 like a peninsula, and the land 10 of the circuit 9 is
1 is formed. Then, the conductive adhesive 13 is applied on the land 6 of the circuit 5 and the conductive adhesive 13 is applied on the land 10 of the circuit 9, and the end of the vibrating plate 4 with the piezoelectric element 3 facing the substrate 1. The vibrating plate 4 is electrically connected to the land 6 with the conductive adhesive 13 by bonding the portions with the conductive adhesive 13 and bonding the ends of the piezoelectric elements 3 with the conductive adhesive 13. The piezoelectric element 3 is electrically connected to the land 10 with the conductive adhesive 13, and the vibrating plate 4 and the piezoelectric element 3 are fixed to the substrate 1 with the conductive adhesive 13. Here, the piezoelectric element 3 is disposed so as to face the opening 12, and the piezoelectric element 3 faces the opening 12 except for a place where the piezoelectric element 3 is conductively connected to the land 10 by the conductive part 11. are doing. Other configurations are the same as those in FIG.

In this embodiment, a conductive portion 7 for connecting the vibrating plate 4 to the land 6 is formed by the conductive adhesive 13 and a conductive portion 11 for connecting the piezoelectric element 3 to the land 10 by the conductive adhesive 13. The holding member 8 for fixing the vibrating plate 4 and the piezoelectric element 3 to the substrate 1 with the conductive adhesive 13 is formed. Is also used. Therefore, it is not necessary to connect the vibrating plate 4 to the land 6 by a lead wire, and it is not necessary to connect the piezoelectric element 3 to the land 10 by a lead wire. In addition, the vibrating plate 4 is fixed to the substrate 1 by a double-sided tape. This eliminates the need to do so. Since the piezoelectric element 3 fixed to the vibrating plate 4 faces the opening 12, the vibrating plate 4 does not come into contact with the substrate 1 via the piezoelectric element 3. This eliminates the need to provide the height defining member 2 for forming a gap between the substrate 4 and the substrate 1.

[0028]

As described above, in the piezoelectric vibrating apparatus according to the first aspect of the present invention, a height defining member is provided on the surface of the substrate, and the vibrating plate having the piezoelectric element fixed to the surface is mounted on the height defining member. Since the vibrating plate is mounted on the substrate by placing it on the substrate, and the vibrating plate is connected to the land of the circuit provided on the surface of the substrate by a conducting portion, and the vibrating plate is fixed to the substrate by a holding member, the height defining member The gap between the vibrating plate and the substrate can be secured to prevent the vibrating plate from contacting the substrate, and the vibrating plate can be fixed to the substrate with the holding member. It is not necessary to use a double-sided tape for mounting, and the vibrating plate is connected to the land at the conductive portion, so that it is not necessary to connect the vibrating plate to the land by a lead wire. In this way, the number of lead wires used can be reduced and the need for double-sided tape can be eliminated.
It is excellent in terms of manufacturing cost and space such as automation.

According to a second aspect of the present invention, since the conducting portion also serves as a holding member, the conducting portion and the holding member are made common to reduce the space for arranging these members, thereby saving space. Can be done.

According to the third aspect of the present invention, since the conductive portion is made of a conductive adhesive, the conductive portion can be made conductive by applying the conductive adhesive, which is excellent in terms of manufacturing costs such as automation.

According to the fourth aspect of the present invention, since the conductive portion also serves as a height defining member, the conductive portion and the height defining member are made common and the space for disposing these members is reduced, thereby saving space. Is what you can do.

According to the fifth aspect of the present invention, the piezoelectric element is fixed to the surface of the vibrating plate on the substrate side, and the piezoelectric element is connected to the land of the circuit provided on the surface of the substrate by a conductive portion. The element is connected to the land at the conductive portion, and it is not necessary to connect the piezoelectric element to the land by a lead wire.

According to a sixth aspect of the present invention, there is provided a piezoelectric vibration device comprising:
The vibrating plate with the piezoelectric element fixed on the surface is placed on the substrate with the piezoelectric element facing the substrate, and the vibrating plate and the piezoelectric element are connected to the circuit lands provided on the surface of the substrate by conducting parts, respectively. The vibration plate is fixed to the substrate with a holding member, and an opening is formed in the portion of the substrate facing the piezoelectric element except for the conductive connection portion of the piezoelectric element. The vibrating plate is fixed to the substrate with a holding member, and the vibrating plate and the piezoelectric element do not need to be connected to the land with lead wires. There is no need to use tape. As described above, the number of lead wires to be used can be reduced and a double-sided tape can be omitted, which is excellent in terms of manufacturing costs such as automation and space. In addition, the piezoelectric element fixed to the vibrating plate faces the opening, and the vibrating plate does not contact the substrate via the piezoelectric element, so that a gap is formed between the vibrating plate and the substrate. It is not necessary to provide a height defining member.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of the present invention.

FIG. 2 is a sectional view showing another example of the embodiment of the invention according to claims 1 to 4;

FIG. 3 is a sectional view showing an example of the embodiment of the invention according to claim 5;

FIG. 4 is a sectional view showing another example of the embodiment of the invention of claim 5;

FIG. 5 is a sectional view showing another example of the embodiment of the invention of claim 5;

FIG. 6 is a sectional view showing an example of the embodiment of the invention according to claim 6;

FIG. 7 is a sectional view of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Height defining member 3 Piezoelectric element 4 Vibration plate 5 Circuit 6 Land 7 Conducting part 8 Holding member 9 Circuit 10 Land 11 Conducting part 12 Opening 13 Conductive adhesive

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5D004 DD05 FF06 5D107 AA12 BB20 CC02 CC10 CC11 DD11 5J079 AA03 BA43 HA04 HA05

Claims (6)

[Claims] 1. A height defining member is provided on a surface of a substrate, and a vibrating plate having a piezoelectric element fixed to the surface is placed on the height defining member and arranged on the substrate, and provided on the surface of the substrate. A piezoelectric vibrating apparatus comprising: a vibrating plate connected to a land of a circuit by a conductive portion; and the vibrating plate fixed to a substrate by a holding member. 2. The piezoelectric vibration device according to claim 1, wherein the conductive portion also serves as a holding member. 3. The piezoelectric vibration device according to claim 1, wherein the conductive portion is made of a conductive adhesive. 4. The piezoelectric vibration device according to claim 1, wherein said conductive portion also serves as a height regulating member. 5. The piezoelectric device according to claim 1, wherein the piezoelectric element is fixed to the surface of the vibrating plate on the substrate side, and the piezoelectric element is connected to a land of a circuit provided on the surface of the substrate by a conductive portion. The piezoelectric vibration device according to any one of the above. 6. A vibrating plate having a piezoelectric element fixed to a surface thereof is disposed on a substrate with the piezoelectric element facing the substrate, and the vibrating plate and the piezoelectric element are respectively connected to a circuit land provided on the surface of the substrate. Wherein the vibration plate is fixed to the substrate by a holding member, and an opening is formed in a portion of the substrate facing the piezoelectric element except for a conductive connection portion of the piezoelectric element. apparatus.