JP2000353654A - Substrate processing equipment - Google Patents

Abstract

(57) Abstract: Provided is a substrate processing apparatus capable of easily adjusting a discharge position of a processing liquid discharge nozzle in a short time. A teaching screen (21) displayed on an operation panel (20) includes a nozzle selector (22) for selecting a nozzle unit for adjusting a discharge position of a processing liquid discharge nozzle.
An axis position operation unit 23 for moving the nozzle unit in the X-axis or Y-axis direction, a rotation operation unit 25 for operating the rotation operation of the substrate, and an operation for discharging the processing liquid from the processing liquid discharge nozzle onto the substrate. Operation unit 26 for the operation. The processing liquid is discharged from the processing liquid discharge nozzle onto the substrate by selecting a nozzle unit with the nozzle selection unit 22 and pressing the start buttons 25a and 26a of the rotation operation unit 25 and the discharge operation unit 26, respectively. The operator observes the spread state of the processing liquid on the substrate while observing the spread state of the processing liquid on the substrate.
3 is operated to adjust the discharge position of the processing liquid discharge nozzle.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate processing apparatus provided with a processing liquid discharge nozzle for discharging a processing liquid.

[0002]

2. Description of the Related Art A substrate processing apparatus is used to supply a processing liquid to a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, and a glass substrate for an optical disk to perform predetermined processing. . The substrate processing apparatus includes a rotary coating apparatus that supplies a coating liquid such as a resist solution to the substrate surface and spin-coats, a rotary developing apparatus that supplies a developing solution to the substrate surface to perform development processing, or a processing method that spins the substrate surface. There is a rotary cleaning device that supplies a liquid to perform a cleaning process.

[0003] These substrate processing apparatuses are provided with processing liquid discharge nozzles for supplying each processing liquid to the substrate surface.
Also, to supply different processing liquids depending on the processing content,
In some cases, one substrate processing apparatus includes a plurality of processing liquid discharge nozzles.

The processing liquid discharge nozzle stands by at a standby position outside the substrate during standby, and moves above the substrate to supply the processing liquid to the substrate surface when supplying the processing liquid. When the supply of the processing liquid is completed, the processing liquid discharge nozzle returns to the standby position and prepares for the next supply operation.

The processing liquid is supplied from the processing liquid discharge nozzle onto the substrate at a predetermined timing and in a predetermined amount. For example, in a rotary coating apparatus that supplies a resist liquid as a processing liquid, a predetermined amount of the resist liquid is supplied from a processing liquid discharge nozzle to a substantially central portion of the substrate when the substrate rotates at a low speed. Thereafter, the substrate is rotated at a high speed, and the resist solution is spread over the entire surface of the substrate to a predetermined thickness.

[0006] By design, the processing liquid discharge nozzle moves to the center of rotation of the substrate. However, actually,
The discharge position of the processing liquid discharge nozzle may not coincide with the rotation center of the substrate due to an assembly error or the like. When the processing liquid is supplied onto the substrate from the processing liquid discharge nozzle located at a position deviated from the rotation center of the substrate, the thickness of the processing liquid on the substrate surface becomes uneven, and the substrate is subjected to uneven processing. . Therefore, it is necessary to adjust the discharge position of the processing liquid discharge nozzle in advance so that the discharge position of the processing liquid discharge nozzle coincides with the rotation center of the substrate (hereinafter, referred to as teaching).

A method of teaching a processing liquid discharge nozzle from an operation panel provided in a rotary coating apparatus will be described.

FIG. 5 is a view showing an operation panel for adjusting a discharge position of a processing liquid discharge nozzle in a conventional rotary coating apparatus. Note that the rotary coating apparatus has a plurality of processing liquid discharge nozzles.

[0009] As shown in FIG.
Shows a teaching screen 51. The teaching screen 51 includes a nozzle selection unit 52 for selecting a processing liquid discharge nozzle to be taught from among a plurality of processing liquid discharge nozzles.
An axis position operation unit 53 having a movement button 53a for horizontally moving in the axial direction, a display unit 54 for displaying the positions of the selected processing liquid discharge nozzles on the X axis and the Y axis, a start button 55a for rotating the substrate, and stopping the substrate. A rotation operation unit 55 having a stop button 55b and a discharge menu button 56 for opening a discharge menu screen are provided. By pressing the discharge menu button 56, the operation panel 50 is pressed.
Switches from the teaching screen 51 to the ejection menu screen 57 of FIG. 5B.

As shown in FIG. 5B, a discharge menu screen 57 includes a discharge condition selection unit 58 for selecting discharge conditions of the resist liquid from the processing liquid discharge nozzle, for example, a continuous discharge or an intermittent discharge, and the like. The discharge operation unit 59 includes a start button 59a for starting discharge of the liquid and a stop button 59b for stopping discharge of the resist liquid, and a return button 60 for returning to the teaching screen 51.

Next, the teaching process will be described. First, in the nozzle selection section 52 of the teaching screen 51, a processing liquid discharge nozzle for performing teaching is selected. Next, the start button 55a of the rotation operation unit 55 is pressed.
Thereby, the substrate rotates.

A discharge menu button 56 is pressed to open a discharge menu screen 57. In a discharge condition selection section 58 of the discharge menu screen 57, a condition for intermittently discharging the resist liquid from the processing liquid discharge nozzle is selected. Next, the start button 59a of the discharge operation unit 59 is pressed. As a result, the processing liquid discharge nozzle moves from the standby position outside the substrate to the discharge position above the substrate. Thereafter, the resist liquid is intermittently discharged onto the substrate from the processing liquid discharge nozzle.

Next, the spread state of the resist liquid discharged onto the substrate is observed. When the resist liquid is spread over the entire surface of the substrate with a uniform film thickness, it is determined that the discharge position of the processing liquid discharge nozzle coincides with the rotation center of the substrate. On the other hand, when the thickness of the resist liquid spread over the substrate is not uniform, it is determined that the discharge position of the processing liquid discharge nozzle does not coincide with the rotation center of the substrate.

If it is determined that the position of the processing liquid discharge nozzle does not coincide with the rotation center of the substrate, the amount of deviation between the rotation center of the substrate and the discharge position of the processing liquid discharge nozzle is visually estimated, and the estimated deviation amount is calculated. Is stored. Next, the discharge operation unit 59
Press the stop button 59b. Thereby, the discharge of the resist liquid from the processing liquid discharge nozzle is stopped, and the processing liquid discharge nozzle moves from the discharge position above the substrate to the standby position outside the substrate.

Next, the return button 60 is pressed to open the teaching screen 51. Then, in order to move the processing liquid discharge nozzle by the amount of displacement between the center of rotation of the substrate stored previously and the discharge position of the processing liquid discharge nozzle, while checking the position of the processing liquid discharge nozzle displayed on the display unit 54, The move button 53a of the position operation unit 53 is pressed.

By pressing the discharge menu button 56, the intermittent discharge condition is selected in the discharge condition selection section 58 of the discharge menu screen 57, and the start button 59a of the discharge operation section 59 is pressed. By observing the spread state of the resist liquid discharged onto the substrate, it is determined whether or not the discharge position of the processing liquid discharge nozzle matches the rotational center of the substrate.

The operation of moving the processing liquid discharge nozzle and the operation of discharging the processing liquid onto the substrate are performed until it is determined that the discharge position of the processing liquid discharge nozzle coincides with the center of rotation of the substrate.

Thereafter, the stop button 55 of the rotary operation unit 55
Press b to stop the rotation of the substrate. Thus, the teaching of the processing liquid discharge nozzle ends.

On the other hand, when the displacement between the discharge position of the processing liquid discharge nozzle and the center of rotation of the substrate is small, the cover for covering the rotary coating device is opened, and the processing liquid discharge nozzle is manually shifted. This operation is also performed while observing the spread state of the resist liquid discharged onto the substrate.

[0020]

As described above, the movement of the discharge position of the processing liquid discharge nozzle is performed based on the amount of deviation between the rotation center of the substrate and the discharge position of the processing liquid discharge nozzle estimated visually. . Therefore, unless the adjustment of the discharge position of the processing liquid discharge nozzle is repeated, the rotation center of the substrate does not match the discharge position of the processing liquid discharge nozzle. Thus, it is necessary to switch between the teaching screen 51 and the ejection menu screen 57 many times. Therefore, the time required for teaching becomes longer. Further, it is necessary to store the amount of deviation estimated visually.

On the other hand, when adjusting the discharge position by manually shifting the processing liquid discharge nozzle, it is necessary to open the cover that covers the rotary coating device during the rotation of the substrate. As a result, mist (splashes) of the processing liquid may be scattered outside the rotary coating apparatus, thereby contaminating the surroundings.

An object of the present invention is to provide a substrate processing apparatus capable of easily adjusting the discharge position of a processing liquid discharge nozzle in a short time.

[0023]

Means for Solving the Problems and Effects of the Invention A substrate processing apparatus according to a first aspect of the present invention comprises a substrate holding means for holding a substrate, a rotation driving means for rotating the substrate holding means, and a substrate holding means. A processing liquid discharge nozzle that discharges a processing liquid to the substrate that has been moved, a moving unit that moves the processing liquid discharge nozzle to a discharge position above the substrate held by the substrate holding unit, and a standby position that deviates from above the substrate, Adjusting means for adjusting the discharge position by moving the processing liquid discharge nozzle at the position, rotating operation of the substrate holding means by the rotary driving means, moving operation of the processing liquid discharge nozzle by the moving means, processing from the processing liquid discharge nozzle Control means for controlling a liquid discharging operation and a discharging position adjusting operation by the adjusting means; a rotating operation of the substrate holding means by the rotary driving means; and a processing liquid discharging nozzle by the moving means. A command is issued to the control means for a moving operation and a discharge operation of the processing liquid from the processing liquid discharge nozzle, and an instruction is issued to the control means for an adjustment operation of the discharge position by the adjusting means during the discharge operation of the processing liquid from the processing liquid discharge nozzle. And an operation panel.

In the substrate processing apparatus according to the first invention, a command is given from the operation panel to the control means by operating the operation panel. When the rotation of the substrate holding unit is commanded by the operation panel, the control unit causes the rotation driving unit to rotate the substrate holding unit. When a movement of the processing liquid discharge nozzle is commanded by the operation panel, the control means moves the processing liquid discharge nozzle from the standby position to the discharge position by the moving means. When the processing panel issues a command to discharge the processing liquid from the processing liquid discharge nozzle, the control unit causes the processing liquid discharge nozzle to discharge the processing liquid onto the rotating substrate. By operating the operation panel in this state, it is possible to adjust the discharge position of the processing liquid discharge nozzle by moving the processing liquid discharge nozzle by the adjusting means while observing the spread state of the processing liquid on the substrate. .

Thus, the discharge position of the processing liquid discharge nozzle can be easily matched with the rotation center of the substrate in a short time. When adjusting the discharge position, it is not necessary to store the amount of deviation between the discharge position of the processing liquid discharge nozzle and the rotation center of the substrate.

Further, since the discharge position of the processing liquid discharge nozzle can be adjusted only by operating the operation panel, there is no need to manually adjust the discharge position of the processing liquid discharge nozzle during operation. Thereby, the processing liquid does not scatter outside the substrate processing apparatus.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the present invention, the operation panel includes: a rotation operation section for instructing a rotation operation of the substrate holding means; A movement operation unit for instructing a movement operation of the nozzle, a discharge operation unit for instructing a discharge operation of the processing liquid from the processing liquid discharge nozzle, and a discharge position operation unit for instructing a discharge position adjustment operation It is provided with.

In this case, a rotation operation of the substrate holding means is commanded from a rotation operation section of the operation panel, a movement operation of the processing liquid discharge nozzle is commanded from a movement operation section of the operation panel, and a processing liquid is discharged from the discharge operation section of the operation panel. The operation of discharging the processing liquid from the discharge nozzle can be commanded, and the operation of adjusting the discharge position of the processing liquid discharge nozzle can be commanded from the discharge position operation unit of the operation panel.

A substrate processing apparatus according to a third aspect of the present invention is the substrate processing apparatus according to the second aspect, wherein
The moving operation unit, the ejection operation unit, and the ejection position operation unit are displayed on a screen.

In this case, since all operations related to the adjustment of the discharge position of the processing liquid discharge nozzle can be performed on the screen, work efficiency is improved.

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a rotary coating apparatus will be described as an example of a substrate processing apparatus according to the present invention.

FIG. 1 is a sectional view of a rotary coating apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of the rotary coating apparatus of FIG.

As shown in FIG. 1, the rotary coating apparatus 100
Includes a coating unit 50 and a nozzle unit 40. The coating unit 50 includes the substrate holding unit 1 that holds the substrate W by suction in a horizontal posture. The substrate holding unit 1 includes a motor 3
And is configured to be rotatable about a vertical axis. Around the substrate holding part 1,
A circular cup 2 is provided to freely move up and down so as to surround the substrate W.

A biaxial driving device 11 is fixed to the bottom surface of the rotary coating device 100, and a fan-shaped table 10 is mounted on the upper surface of the biaxial driving device 11. As shown in FIG. 2, a plurality of nozzle units 40 are radially arranged on the upper surface of the fan-shaped table 10.

The biaxial drive device 11 shown in FIG. 1 includes a support member 11a, an X-direction member 11b disposed on the upper surface of the support member 11a, and a Y-direction member disposed on the upper surface of the X-direction member 11b. 11c. Hereinafter, as shown in FIG. 2, two directions orthogonal to each other on a horizontal plane are referred to as an X-axis direction and a Y-axis direction.

The X-direction member 11b is formed so as to be movable in the X-axis direction with respect to the support member 11a. Between the support member 11a and the X-direction member 11b, a rotating shaft 11d of an X-axis motor 12a that can rotate forward and backward is provided along the X-axis direction. A male screw (not shown) is formed on the rotation shaft 11d, and the support member 11a, the X-direction member 11b, and the rotation shaft 11d constitute an X-axis feed mechanism. By driving the X-axis motor 12a, the X-direction member 11b can be moved in the X-axis direction.

The Y-direction member 11c is connected to the X-direction member 11c.
It is formed movably in the Y-axis direction with respect to b. Between the X-direction member 11b and the Y-direction member 11c, a rotation shaft 11e of a Y-axis motor 12b that can rotate forward and backward is provided along the Y-axis direction. A male screw (not shown) is formed on the rotating shaft 11e, and the X-direction member 11b,
The Y-direction member 11c and the rotating shaft 11e constitute a feed mechanism in the Y-axis direction. By driving the Y-axis motor 12b, the Y-direction member 11c can be moved in the Y-axis direction. Therefore, by driving the X-axis motor 12a and the Y-axis motor 12b, the nozzle unit 40 can be moved in the X-axis direction and the Y-axis direction.

The nozzle unit 40 includes a nozzle arm 7,
A nozzle arm guide member 13, a nozzle arm support member 9, and an air cylinder 8 are provided. Nozzle arm support member 9
Is attached to the upper end surface of the rod 8a of the air cylinder 8, and moves up and down as the rod 8a expands and contracts.

A holding member 15 for holding the processing liquid discharge nozzle 6 is attached to one end of the nozzle arm 7. A pipe for supplying a resist liquid is attached to the processing liquid discharge nozzle 6, and an on-off valve 17 is provided in the pipe.

The nozzle arm 7 is a nozzle arm support member 9
Is rotatably mounted by a shaft member 7a.

The other end of the nozzle arm 7 has a protruding member 7b.
Is attached. The protrusion member 7b is provided with a vertically extending groove 13a provided on the nozzle arm guide member 13.
Is engaged. The groove 13a is formed such that the lower side is located closer to the application unit 50 than the shaft member 7a, and the upper side is located opposite to the application unit 50 from the shaft member 7a.

With the above configuration, the nozzle arm 7 is in the upright posture when the rod 8a is retracted. on the other hand,
When the rod 8a extends, the nozzle arm 7 moves to the shaft member 7
Rotate around a. As a result, the nozzle arm 7 is in the horizontal position, and the processing liquid discharge nozzle 6 can be moved to the discharge position above the substrate W.

An operation panel 20 is provided on the outer surface of the rotary coating apparatus 100. An operation (teaching) of adjusting the discharge position of the processing liquid discharge nozzle 6 in advance such that the discharge position of the processing liquid discharge nozzle 6 coincides with the rotation center of the substrate W is performed by setting from the operation panel 20.

A setting signal based on an input from the operation panel 20 is given to the control unit 18. The control unit 18 controls the motor 3, the X-axis motor 12a, the Y-axis motor 12b, the air cylinder 8, and the on-off valve 17 based on the setting signal.

FIG. 3 is a view of a setting screen displayed on the operation panel 20 of the rotary coating apparatus 100 of FIG.

As shown in FIG. 3, a teaching screen 21 is displayed on the operation panel 20. Teaching screen 2
1 includes a nozzle selection unit 22, a shaft position operation unit 23, a rotation operation unit 25, and a discharge operation unit 26. The function of each part of the teaching screen 21 will be described with reference to FIG.

The nozzle selector 22 is for selecting a nozzle unit 40 to be taught from among the plurality of nozzle units 40. When the nozzle unit 40 to be taught is selected by the nozzle selection unit 22 and a start button 26a of the ejection operation unit 26 to be described later is pressed, the nozzle arm 7 of the nozzle unit 40 is set in a horizontal posture and is selected above the substrate W. The processing liquid discharge nozzle 6 of the nozzle unit 40 moves. Then, the resist liquid is discharged onto the substrate W from the processing liquid discharge nozzle 6.

The axis position operating section 23 is for moving the selected nozzle unit 40 in the X-axis direction or the Y-axis direction. The shaft position operation unit 23 is provided with the nozzle unit 40
Buttons 23a, 23 for moving the mouse in the X-axis direction
b and Y direction movement button 23 for moving in the Y axis direction
c, 23d. X direction move button 23
a and the Y direction movement button 23 c
0 in the positive direction along the X-axis and the Y-axis, respectively.
The direction moving button 23d is for moving the nozzle unit 40 in the negative direction along the X axis and the Y axis, respectively. While the X-direction movement buttons 23a and 23b or the Y-direction movement buttons 23c and 23d are being pressed, the control unit 18 drives the X-axis motor 23a or the Y-axis motor 23b. Thereby, the nozzle unit 40 can be moved in the X-axis direction and the Y-axis direction.

The rotation operation section 25 is for rotating or stopping the substrate W. When the start button 25a of the rotation operation unit 25 is pressed, the control unit 18 drives the motor 3.
Accordingly, the substrate holding unit 1 that holds the substrate W rotates. When the stop button 25b is pressed, the control unit 18 stops driving the motor 3. Thus, the substrate holding unit 1 that holds the substrate W stops.

The discharge operation section 26 is for starting or stopping the discharge of the resist liquid from the processing liquid discharge nozzle 6 of the selected nozzle unit 40 onto the substrate W. When the start button 26a of the discharge operation unit 26 is pressed, the control unit 18 controls the air cylinder 8 so that the rod 8a of the selected nozzle unit 40 extends. Thereby, the substrate W
The processing liquid discharge nozzle 6 moves to above. Next, the control unit 18 controls the on-off valve 17 to open. This allows
The resist liquid is discharged onto the substrate W from the processing liquid discharge nozzle 6.

While the resist solution is being discharged, the control unit 18
Controls the on-off valve 17 so that the on-off valve 17 opens and closes in a fixed cycle. Thus, the resist liquid is intermittently discharged onto the substrate W.

When the stop button 26b of the discharge operation unit 26 is pressed, the control unit 18 controls the on-off valve 17 so that the on-off valve 17 closes.
Control. Thus, the discharge of the resist liquid is stopped. Next, the control unit 18 controls the air cylinder 8 so that the rod 8a is retracted. Thereby, the nozzle unit 40 returns to the standby state.

In this embodiment, the substrate holding unit 1 corresponds to the substrate holding unit, the motor 3 corresponds to the rotary driving unit, the processing liquid discharge nozzle 6 corresponds to the processing liquid discharge nozzle, the nozzle arm 7 and the air cylinder. 8, the nozzle arm support member 9 and the nozzle arm guide member 13 constitute a moving unit, the two-axis driving device 11 corresponds to an adjusting unit, the control unit 18 corresponds to a control unit, and the operation panel 20 corresponds to an operation panel. The rotation operation unit 25 corresponds to a rotation operation unit, the nozzle selection unit 22 corresponds to a movement operation unit, the discharge operation unit 26 corresponds to a discharge operation unit, and the shaft position operation unit 23 corresponds to a discharge position operation unit. I do.

FIG. 4 is a flowchart showing the teaching processing of the nozzle unit 40 of FIG. Next, FIG.
The teaching process will be described with reference to FIG.

In the nozzle selection section 22 of the teaching screen 21 shown in FIG.
0 is selected (step S1). At this time, the nozzle unit 40 is in a standby state.

Next, the start button 25a of the rotation operation unit 25
push. Thereby, the substrate W rotates (Step S)
2).

Further, the start button 26 of the discharge operation section 26
Press a (step S3). Thereby, the processing liquid discharge nozzle 6 of the selected nozzle unit 40 moves above the substrate W. Thereafter, the resist liquid is applied to the processing liquid discharge nozzle 6.
Is discharged intermittently onto the substrate W.

Next, the spread state of the resist liquid discharged onto the substrate W is observed, and it is determined whether or not the discharge position of the processing liquid discharge nozzle 6 coincides with the rotation center of the substrate W (step S4). ). When the resist liquid is spread over the entire surface of the substrate W with a uniform film thickness, it is determined that the discharge position of the processing liquid discharge nozzle 6 coincides with the rotation center of the substrate W. On the other hand, when the thickness of the resist liquid spread over the substrate W is not uniform, it is determined that the discharge position of the processing liquid discharge nozzle 6 does not coincide with the rotation center of the substrate W.

When it is determined that the discharge position of the processing liquid discharge nozzle 6 does not coincide with the center of rotation of the substrate W, the X direction movement buttons 23a, 23b are observed while observing the spread state of the resist liquid discharged on the substrate W. By operating the 23b and the Y direction movement buttons 23c and 23d, the processing liquid discharge nozzle 6 is moved to the rotation center of the substrate W (Step S5), and the process returns to Step S4.

If it is determined in step S4 that the discharge position of the processing liquid discharge nozzle 6 coincides with the center of rotation of the substrate W, the stop button 26b of the discharge operation unit 26 is pressed (step S6). Thus, the discharge of the resist liquid stops.
Thereafter, the rod 8a of the air cylinder 8 retracts, and the nozzle unit 40 returns to the standby state.

Finally, the stop button 25 of the rotary operation unit 25
Press b (step S7). Thus, the rotation of the substrate W stops.

As described above, the discharge position of the processing liquid discharge nozzle 6 can be adjusted while observing the spread state of the resist liquid discharged onto the substrate W. This allows
The discharge position of the processing liquid discharge nozzle 6 can be easily matched with the rotation center of the substrate W in a short time.

Further, since all operations relating to teaching can be performed only on the teaching screen 21, work efficiency is improved. Further, the discharge position of the processing liquid discharge nozzle 6 and the substrate W
It is not necessary to memorize the amount of deviation from the rotation center.

Further, since the teaching can be performed by the operation from the operation panel 20, it is not necessary to shift the processing liquid discharge nozzle 6 by hand. Therefore, it is not necessary to open a cover (not shown) that covers the rotary coating device 100 during teaching. Therefore, teaching can be performed without the resist liquid being scattered outside the rotary coating apparatus 100.

In the above embodiment, the case where the present invention is applied to the processing liquid discharge nozzle (resist nozzle) for discharging the resist liquid of the rotary coating apparatus has been described. However, the present invention is applied to the edge cleaner nozzle of the rotary coating apparatus. The present invention can be applied to processing liquid discharge nozzles of various substrate processing apparatuses such as a developing nozzle or a pure water nozzle of a rotary developing apparatus, a pure water nozzle of a rotary cleaning apparatus, and the like.

[Brief description of the drawings]

FIG. 1 is a sectional view of a rotary coating apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the rotary coating apparatus of FIG.

FIG. 3 is a diagram of a setting screen displayed on an operation panel of the rotary coating device in FIG. 1;

FIG. 4 is a flowchart illustrating a teaching process of the nozzle unit of FIG. 1;

FIG. 5 is a diagram of a setting screen displayed on an operation panel of a conventional rotary coating device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate holding | maintenance part 3 Motor 6 Processing liquid discharge nozzle 7 Nozzle arm 8 Air cylinder 9 Nozzle arm support member 11 2-axis drive device 13 Nozzle arm guide member 18 Control part 20 Operation panel 22 Nozzle selection part 23 Axis position operation part 25 Rotation operation Unit 26 Discharge operation unit

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/304 643 H01L 21/304 643A 5F046 21/306 21/30 569C 21/306 R F term (Reference) 2H025 AB08 AB16 EA05 2H096 AA24 AA25 CA14 CA20 GA30 4F041 AA05 BA22 BA34 BA38 BA56 4F042 AA06 BA08 EB05 EB09 EB18 EB29 5F043 CC14 DD13 EE07 EE08 EE40 5F046 JA02 JA05 JA16 LA04

Claims (3)

[Claims] 1. A substrate holding means for holding a substrate, a rotation driving means for rotating the substrate holding means, a processing liquid discharge nozzle for discharging a processing liquid onto the substrate held by the substrate holding means, and a processing liquid Moving means for moving a discharge nozzle to a discharge position above the substrate held by the substrate holding means and a standby position deviating from above the substrate; and by moving the treatment liquid discharge nozzle at the discharge position. Adjusting means for adjusting the discharge position; rotating operation of the substrate holding means by the rotation driving means;
A moving operation of the processing liquid discharge nozzle by the moving unit,
A control unit that controls a discharge operation of the processing liquid from the processing liquid discharge nozzle and an adjustment operation of the discharge position by the adjustment unit; a rotation operation of the substrate holding unit by the rotation driving unit;
A moving operation of the processing liquid discharge nozzle by the moving unit,
And instructing the control means to discharge the processing liquid from the processing liquid discharge nozzle to the control means, and adjust the discharge position adjustment operation by the adjusting means during the processing liquid discharge operation from the processing liquid discharge nozzle. And an operation panel for instructing the substrate processing apparatus. 2. The operation panel, comprising: a rotation operation unit for instructing a rotation operation of the substrate holding unit; a movement operation unit for instructing a movement operation of the processing liquid ejection nozzle; 2. The substrate processing apparatus according to claim 1, further comprising: a discharge operation unit configured to instruct a discharge operation of the processing liquid from the apparatus; and a discharge position operation unit configured to instruct the discharge position adjustment operation. 3. 3. The substrate processing apparatus according to claim 2, wherein the rotation operation unit, the movement operation unit, the ejection operation unit, and the ejection position operation unit are displayed on a screen.