JP2000348974A - Chip composite function device - Google Patents

Abstract

(57) Abstract: An object of the present invention is to provide a chip composite function element in which the thickness of a protective layer is small and the moisture resistance of a film dielectric can be improved. SOLUTION: Four terminal electrodes 12a to 12d provided on an insulating substrate 11 and two adjacent terminal electrode pairs 12 are provided.
a film dielectric 13 formed between the layers a and 12b, and another terminal electrode pair 12c and 12d formed on the surface opposite to the surface of the insulating substrate 11 on which the film dielectric 13 is formed. A film resistor 15 and a protective layer covering the film dielectric 13 and the film resistor 15. The protective layer of the film dielectric 13 is formed of a lower layer of crystallized glass and an upper layer of amorphous glass. It is a heavy structure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip multifunction device having a built-in capacitor and a resistor.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become lighter, thinner and smaller, there has been a demand for smaller, thinner, and more surface-mounted circuit elements, and demand for chip components such as chip resistors and chip capacitors has been increasing. In addition, the demand for a chip composite function element in which a capacitor and a resistor are built in one chip is increasing.

Heretofore, a chip composite device having a built-in capacitor and a resistor has not been put to practical use, and a film resistor such as a thick film resistor and a film dielectric such as a thick film dielectric are formed on an insulating substrate such as alumina. What has formed is considered. Hereinafter, a conventional chip composite function element in which a film resistor and a film dielectric are formed on an alumina substrate will be described.

FIG. 5A shows a top view of a conventional chip composite function element in which a film resistor and a film dielectric are formed on an alumina substrate, and FIG. 5B is an equivalent circuit diagram thereof. is there. In FIG. 5A, reference numeral 1 denotes a rectangular insulating substrate made of alumina or the like, and terminal electrodes 2 and 3 are formed at both ends. Reference numeral 4 denotes an intermediate electrode that forms a capacitance with the terminal electrode 3 and a resistance with the terminal electrode 2. Reference numeral 5 denotes a film resistor formed between the intermediate electrode 4 and the terminal electrode 2. 6
Is a film dielectric formed so as to partially overlap the intermediate electrode 4. 7 is an upper electrode formed on the film dielectric 6,
Connected to terminal electrode 3. Although not shown in the figure, the surface of the chip composite function element is covered with a protective coat made of polyimide, amorphous glass, or the like, except for a part of the terminal electrodes 2 and 3 and the intermediate electrode 4.

[0005]

However, as shown in FIG. 5B, the above-mentioned conventional chip composite function element has a problem that it can only cope with a series circuit of a resistor and a capacitor.

Furthermore, since the protective coat covering the film dielectric 6 is made of polyimide, amorphous glass, or the like, there is another problem that the moisture resistance of the film dielectric 6 cannot be improved.

Further, in order to improve the moisture resistance of the film dielectric 6, it is necessary to increase the thickness of the protective coat.

The present invention solves the above-mentioned conventional problems and can easily cope with not only a series circuit of a capacitor and a resistor but also any circuit, and has a thin protective coat and an improved moisture resistance of a film dielectric. It is an object of the present invention to provide a chip multifunction device capable of causing the chip multifunction device to operate.

[0009]

In order to achieve the above object, a chip composite function device according to the present invention comprises a rectangular insulating substrate having two or less at one end and four concaves or convexes at all edges. Four terminal electrodes provided on the concave or convex portion of the insulating substrate from the front surface to the rear surface of the substrate, and a film dielectric formed between two adjacent terminal electrode pairs among the terminal electrodes; A film resistor formed between another adjacent terminal electrode pair different from the terminal electrode pair on the back surface of the insulating substrate opposite to the insulating substrate surface on which the film dielectric is formed; A protective layer for covering the body, wherein the protective layer of the film dielectric has a double structure of a lower layer of crystallized glass and an upper layer of amorphous glass.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a rectangular insulating substrate having two or less at one end and four concaves or convexes at all edges, Alternatively, four terminal electrodes provided on the convex portion from the front surface to the back surface of the substrate, a film dielectric formed between two adjacent terminal electrode pairs among the terminal electrodes, and the film dielectric are formed. A film resistor formed on the back surface of the insulating substrate opposite to the surface of the insulating substrate opposite to the pair of terminal electrodes, and a protective layer for covering the film dielectric and the film resistor. Wherein the protective layer of the film dielectric has a double structure of a lower layer of crystallized glass and an upper layer of amorphous glass, and according to this configuration, it has a resistor and a capacitor. Both ends of the resistance element part and the capacitor element part of the chip composite function element, One assignment to one of the terminal electrodes, since that can be taken out as a terminal electrode both ends of which are independent of the resistance element, it is possible to perform a resistance measurement easily and 4
By changing the wiring patterns of the two terminal electrodes and the printed circuit board, it is possible to cope with various circuits such as a series circuit of a resistor and a capacitor. In addition, since the amorphous glass is buried in the voids of the crystallized glass having voids inside, the protective layer has a small thickness, and has the effect of improving the moisture resistance of the film dielectric. is there.

(Embodiment 1) Hereinafter, a chip multifunctional element according to Embodiment 1 of the present invention will be described with reference to the drawings. FIGS. 1A, 1B, and 2 show a front top view, a back top view, and an equivalent circuit diagram of a chip composite function device according to Embodiment 1 of the present invention, respectively. 1 and 2, reference numeral 11 denotes a rectangular insulating substrate such as alumina, which has four concave portions at the edge. This 4
Terminal electrodes 12a, 12b, 12c, and 12d are provided from the three concave portions to the front and back surfaces of the insulating substrate 11. 1
Reference numeral 3 denotes a film dielectric formed on the terminal electrode 12a on the front surface of the substrate, 14 denotes an upper electrode overlapping the film dielectric 13 and the terminal electrode 12b, and 15 denotes terminal electrodes 12c and 12d on the back surface of the substrate.
It is a film resistor formed between them. Although not shown in the figure, the surface of the insulating substrate is covered with a protective layer for protecting the film dielectric 13 and the film resistor 15 except for the edge of the terminal electrode.

The protective layer of the film dielectric 13 has a double structure of a lower layer of crystallized glass and an upper layer of amorphous glass, and the protective layer of the film resistor 15 has an amorphous glass.

In the chip composite function device according to the first embodiment of the present invention configured as described above, the amorphous glass is generally buried in the voids of the crystallized glass having voids therein. Since the thickness of the protective layer is small and external moisture cannot penetrate into the film dielectric 13, the moisture resistance of the film dielectric 13 can be improved. The effect of preventing the element portion (film dielectric 13) from functioning as a capacitor can be prevented.

The terminal electrodes 12a, 12b on the substrate surface
A capacitor element is interposed between the terminal electrodes 12c and 1 on the back of the substrate.
Since the resistance elements are independently formed between 2d, the resistance value of the resistance element can be easily measured by a normal DC current measurement method. Also, as shown in FIGS. 3 (a), (b), and (c),
By changing the wiring pattern of the printed circuit board for one terminal electrode, it is possible to cope with various circuits such as a resistor / capacitor series circuit. 3A shows an example of an RC series circuit, FIG. 3B shows an example of a low-pass filter, and FIG.
(C) is an example of a high-pass filter.

In the present embodiment, the four terminal electrodes are concave electrodes. However, even if the four terminal electrodes are two or less at one edge of the insulating substrate, how they are provided at the four edges is provided. The same effect can be obtained.

(Embodiment 2) Hereinafter, a chip multifunctional element according to Embodiment 2 of the present invention will be described with reference to the drawings. FIGS. 4A and 4B are a top view and a back view, respectively, of the chip multifunction device according to the second embodiment of the present invention. In FIG. 4, 2
Reference numeral 1 denotes a rectangular insulating substrate such as alumina, which has four concave portions at the edge. From the four concave portions to the front and back surfaces of the insulating substrate 21, terminal electrodes 22a, 22b, 22c, 2
2d is provided. 23 is a terminal electrode 22 on the substrate surface
a, a top electrode overlapping the film dielectric 23 and the terminal electrode 22b; and 25, a terminal electrode 2
This is a film resistor formed between 2c and 22d. In addition,
Although not shown, the film dielectric 23 and the film resistor 25
The surface of the insulating substrate 21 is covered with a protective layer for protecting the terminal electrodes except for the edge portions of the terminal electrodes.

The protective layer of the film dielectric 23 has a double structure of the lower layer of crystallized glass and the upper layer of amorphous glass, and the protective layer of the film resistor 25 has an amorphous glass.

In the chip composite function device according to the second embodiment of the present invention configured as described above, generally, the amorphous glass is buried in the voids of the crystallized glass having voids therein. Since the thickness of the protective layer is small and external moisture cannot enter the film dielectric 23, the moisture resistance of the film dielectric 23 can be improved.
The effect is obtained that it is possible to prevent the deterioration of the insulating property of the film dielectric 23 and prevent the capacitor element portion (the film dielectric 23) from functioning as a capacitor.

Further, since a capacitor element is formed between the terminal electrodes 22a and 22b and a resistance element is formed completely independently between the terminal electrodes 22c and 22d on the substrate surface, the resistance of the resistance element can be easily determined by a normal DC current measuring method. The value can be measured. Further, by changing the wiring pattern of the printed circuit board for the four terminal electrodes as shown in FIG. 3, it is possible to cope with various circuits such as a series circuit of resistors and capacitors.

Also, in this embodiment, the four terminal electrodes are concave electrodes. However, even if the four terminal electrodes are convex electrodes, if they are two or less at one edge of the insulating substrate, how are they provided at the four edges? The same effect can be obtained.

[0021]

As described above, the present invention provides a rectangular insulating substrate having two or less at one end and four concaves or convexes at all edges, and a substrate surface at the concave or convex part of the insulating substrate. The four terminal electrodes provided from the terminal electrode to the back surface, the film dielectric formed between two adjacent terminal electrode pairs among the terminal electrodes, and the insulating substrate surface on which the film dielectric is formed A film resistor formed between another terminal electrode pair different from the terminal electrode pair on the back surface of the opposite insulating substrate, and a protective layer covering the film dielectric and the film resistor; Dielectric protective layer, characterized in that it has a double structure of the lower layer of crystallized glass and the upper layer of amorphous glass,
According to this configuration, both ends of the resistance element portion and the capacitor element portion of the chip composite function element having the resistance / capacitor,
Assigned to any of the four terminal electrodes, and both ends of the resistance element portion can be taken out as independent terminal electrodes, so that resistance value measurement can be easily performed and the wiring pattern of the four terminal electrodes and the printed circuit board can be changed. Accordingly, various circuits such as a series circuit of a resistor and a capacitor can be supported.

Furthermore, since the amorphous glass is filled in the voids of the crystallized glass having voids therein, the protective layer has a small thickness and the moisture resistance of the film dielectric can be improved. It is.

[Brief description of the drawings]

FIG. 1A is a front top view of a chip multifunction device according to a first embodiment of the present invention; FIG.

FIG. 2 is an equivalent circuit diagram of the same.

FIG. 3 is a circuit diagram showing an example of using a circuit of the chip multifunction device.

FIG. 4A is a top side view of the chip multifunction device according to Embodiment 2 of the present invention, and FIG.

FIG. 5A is a top view of a conventional chip multifunction device. FIG. 5B is an equivalent circuit diagram thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Insulating substrate 12a, 12b, 12c, 12d Terminal electrode 13 Film dielectric 14 Upper electrode 15 Film resistor

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification FI theme coat ゛ (Reference) H01G 4/12 445 H01G 1/02 J (72) Inventor Takashi Ikeda 1006 Odakadoma, Kadoma City, Osaka Matsushita Electric Within Sangyo Co., Ltd. (72) Inventor Koji Nishida 1006 Kazuma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. A rectangular insulating substrate having two or less concave portions or convex portions at one end and four or less at all edges, and four concave portions or convex portions provided on the insulating substrate from the front surface to the rear surface of the substrate. Terminal electrode, a film dielectric formed between two adjacent terminal electrode pairs among the terminal electrodes, and the terminal on the back surface of the insulating substrate opposite to the surface of the insulating substrate on which the film dielectric is formed. A film resistor formed between another adjacent terminal electrode pair different from the electrode pair, and a protective layer covering the film dielectric and the film resistor, wherein the protective layer of the film dielectric is
A chip composite function element having a double structure of a lower layer of crystallized glass and an upper layer of amorphous glass.