JP2000348793A - Electric connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric connector capable of preventing the dispersion of connection resistance of electrodes, of being used even for a multipolar electronic component and of restraining and preventing the increase of the connection resistance even if it is repeatedly used with a load above a predetermined value. SOLUTION: This electric connector is composed of: a frame 8 interlaid between a test board 14 and a BGA 16; an elastic insulating elastomer layer 9 shaped and fitted to the frame 8; plural wires 7 embedded in the vertical thickness direction of the elastomer layer 9 and mutually separated at a certain interval; contact area expanding plated terminals 12 each connected to the lower end part of each of the wires 7, exposed to the back face of the elastomer layer 9 and abutting on each of the plural electrodes 15 of the test board 14; and contact area expanding pad terminals 13 each connected to the upper end part of each of the wire 7 and abutting on each of plural solder balls 17 of the BGA 16. Both the front and back surfaces of each of the pad terminals 13 are plated, the lower parts of the respective pad terminals 13 are embedded in the elastomer layer 9, and the upper parts thereof are projected from the surface of the elastomer layer 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in an electrical connector used for inspection and connection of a surface mount type IC package.

[0002]

2. Description of the Related Art There are various types of IC packages. As shown in FIGS. 31 and 32, a plurality of solder packages, which are electrodes, are provided on the entire back surface of the package as a surface mount type having a large number of input / output electrodes. A ball grid array type IC package (hereinafter abbreviated as BGA) 16 and a land grid array type IC package (hereinafter abbreviated as LGA) 16 in which a plurality of balls 17 or land-shaped electrodes are arranged in a grid shape are provided. It has been developed and its practical use is progressing.

When inspecting or connecting this type of BGA 16 or LGA with an inspection board, an electrical connector shown in FIG. 33 is used. As shown in the figure, the electrical connector includes an elastic insulating elastomer layer 9 interposed between the inspection board 14 and the BGA 16, and is separated from each other at a constant pitch in the vertical thickness direction of the elastomer layer 9. A plurality of wires 7 are embedded, and the lower end of each wire 7 is slightly exposed from the back surface of the elastomer layer 9 to function as a small ball terminal 21, and the upper end of each wire 7 is placed on the surface of the elastomer layer 9. A minute pad 22 is formed substantially at the same position.

In the above configuration, the inspection board 14 and the BGA
16 is electrically connected to the inspection board 14 and the BG
A16, an electrical connector is sandwiched between the plurality of electrodes 15 of the inspection board 14 and the ball terminals 21 of the wires 7 are attached to the BGA1.
The pads 22 of the wires 7 are respectively brought into contact with the plurality of solder balls 17. Then, when a load is applied by pressing down the BGA 16 to bring the inspection board 14 and the BGA 16 closer to each other, they can be electrically connected via the electrical connector.

As related prior art documents of this kind,
JP-A-9-115577, 9-35789, 8-3
No. 35486, Japanese Patent No. 2796872, and the like.

[0006]

The conventional electrical connector is constructed as described above, and the solder ball 1 of the BGA 16 is provided.
Since the contact area of the pad 22 in contact with the electrode 7 is very small, there is a problem that the connection resistance of the electrode tends to vary due to the positional accuracy of the solder ball 17 and the pad 22. Further, as the number of electrodes increases, the compressive load required to obtain stable conduction increases. However, in consideration of the flatness of BGA 16 (maximum 0.15 mm), the electrical connector requires 0.1%.
A compression amount of 5 mm or more is required. However, since the compressive load in this case is large, the BGA 16 may be damaged, and it is extremely difficult to use a conventional electrical connector for the multi-pole BGA 16 having 200 pins or more.

Further, since the pad 22 hardly protrudes,
The LGA having a flat plate shape has a problem that the elastomer layer 9 has no escape during compression, and the compression load is further increased so that the electric connector cannot be used at all. Further, when repeatedly used for inspection at a compression of 0.15 mm or more, as shown in FIG.
The connection resistance increases due to the burial or damage of the pad 22 inside (peeling of the pad 22 from the elastomer layer 9), the burial of the ball terminal 21, or the abrasion, so that the electrical connector cannot be used repeatedly. There is.

The present invention has been made in view of the above problems, and prevents variations in connection resistance of electrodes, can be used for multi-pole electronic components, and can be used repeatedly even when a load equal to or more than a predetermined value is used. It is an object of the present invention to provide an electrical connector that can prevent increase in connection resistance.

[0009]

According to the first aspect of the present invention, in order to achieve the above object, the first and second electric joints are interposed between the first and second electric joints. As the joint approaches under the action of the load, the first,
An elastic insulating layer interposed between the first and second electric joints, and buried in a thickness direction of the elastic insulating layer, wherein A plurality of conductive wires that are separated from each other at a pitch, and are connected to one end of each conductive wire and are exposed on the back surface of the elastic insulating layer to be in contact with the plurality of electrodes of the first electrical joint, respectively; A plating terminal for increasing the contact area, and a pad terminal for increasing the contact area, which is connected to the other end of each of the conductive wires and is in contact with the plurality of electrodes of the second electrical joint, respectively. It is characterized in that both the front and back surfaces of each pad terminal are plated, and a part of each pad terminal is buried in the elastic insulating layer, and the rest protrudes from the surface of the elastic insulating layer.

[0010] The elastic insulating layer has a hardness of 10 ° H or more.
Preferably, the temperature is set to 80 ° H. At least a part of each of the conductive wires is inclined or bent in a direction intersecting the thickness direction of the elastic insulating layer so as to reduce the load. Also,
Each of the plating terminals, a first plating layer connected to one end of each of the conductive wires and located on the back side of the elastic insulating layer, and a second plating layer covering the first plating layer , And it is preferable that a part of each of the pad terminals is made about 25% or more of its thickness.

Here, the first and second electrical joints in the claims include an inspection board, a high-density flexible board, a build-up wiring board, BGA, LGA, FB
Examples include a surface-mount type semiconductor package made of GA, PBGA, or the like, or a surface-mount type electric / electronic component. As the conductive wire, gold, gold alloy, platinum, copper, aluminum, aluminum-silicon alloy, brass, phosphor bronze, beryllium copper, nickel, tungsten, stainless steel, etc., such as gold, gold alloy, nickel, etc. Examples include a plated wire.

As a method of providing the conductive wire, there are a wedge bonding method, a metal bonding method, an ultrasonic wire bonding method, a method of making a hole in a metal plate constituting a pad terminal and inserting the same. Among these, an ultrasonic wire bonding method which is excellent in accuracy and speed is desirable.
The metal plate is not particularly limited, but copper, a copper alloy, an iron-nickel alloy, or the like can be used. In particular, an iron-nickel alloy is preferable from the viewpoints of workability (bonding property, low distortion property and etching property at the time of forming the elastic insulating layer), cost, electrical characteristics, and thermal expansion. Further, the substantially hemispherical shape of the plating terminal includes a hemispherical shape, a semi-elliptical shape, or a similar shape.

According to the first aspect of the present invention, since the size of the plated terminal and the size of the pad terminal are increased, the connection resistance of each terminal does not vary due to the positional accuracy of the terminal of the electrical joint and the pad. Even when compressed repeatedly, the terminal is not buried in the elastic insulating layer. Further, since the plated terminal and the pad terminal protrude greatly from the elastic insulating layer, stable connection with low contact resistance can be realized. Further, even when the compression is performed by a predetermined value or more, a gap is created between the electric joint and the elastic insulating layer, and the volume of the elastic insulating layer corresponding to the deformation can be released to that portion. Therefore, even if it is deformed, the elastic insulating layer is relatively easily deformed, and the load can be reduced.

According to the second aspect of the present invention, since the hardness of the elastic insulating layer does not exceed 80 ° H, the load at the time of compression does not become unnecessarily large. The hardness is 1
Since it is not less than 0 ° H, an increase in compression set can be suppressed or prevented. Furthermore, the bending of the conductive wire during joining or connection can be suppressed or prevented, and the load can be reduced.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to the following embodiments. As shown in FIGS. 1 and 2 and the like, the electric connector according to the present embodiment includes a frame 8 interposed between the inspection board 14 and the BGA 16 and an elastic insulating material formed and fitted into the frame 8. An elastomer layer 9 and a plurality of wires 7 embedded in the thickness direction of the elastomer layer 9 and separated from each other at a constant pitch.
And an elastomer layer 9 connected to the lower end of each wire 7.
And a plurality of plating terminals 12 for contact area enlargement, which are exposed on the back surface of the
And a plurality of pad terminals 13 connected to the upper end of each wire 7 for increasing the contact area to be in contact with the plurality of solder balls 17 of the BGA 16, respectively.

As shown in FIG. 1, the frame 8 is formed into a frame shape using a general-purpose engineering plastic material, ceramic material, or metal material. Engineering plastic materials include polyetherimide (PEI), polyphenylene sulfide (PPS), or polyether sulfone, which have excellent dimensional stability and heat resistance.
(PES) and the like.

The elastomer layer 9 is formed into a plate shape and rectangular shape in cross section using various elastomers which have fluidity before curing and cure to form a crosslinked structure. As the elastomer, for example, silicone rubber, fluorine rubber, polybutadiene rubber, polyisoprene rubber, polyurethane rubber, chloroprene rubber, polyester rubber,
Styrene-butadiene copolymer rubber, natural rubber, or independent and open-cell foamed materials thereof can be used. Among them, silicone rubber having excellent electrical insulation properties, heat resistance and compression set characteristics after curing, especially wires 7
Since the material can be injected without disturbing the arrangement and the leveling can be performed in a short time, it is appropriate that the material before curing has a liquid state and a low viscosity. In the case of silicone rubber, the viscosity is 10
Those having a poise of not more than 00 poise, preferably not more than 200 poise, usually not less than 5 poise are good. The hardness of the elastomer layer 9 is 10 ° H to 80 ° H, more preferably 20 ° H to 5 ° C.
0 ° H is good.

Each wire 7 is made of a gold wire which is suitable for a bonding method by wire bonding and has excellent conductivity. The wire diameter of each wire 7 is not particularly limited, but it is preferable that the load at the time of connection be as small as possible and that the wire 7 be as thin as possible without adversely affecting the stability of the connection. Specifically, a wire 7 of 100 μm or less, particularly 20 to 80 μm, which is used in ordinary wire bonding, is used. Each wire 7 is formed in a substantially crank shape inclined at 45 degrees as shown in FIGS.

However, the shape of each wire 7 is not limited to a substantially crank shape, but may be a straight rod shape, a rectangular shape, a substantially N shape, a horizontal S shape, a U shape, a straight bar shape inclined with respect to the vertical thickness direction.
Alternatively, it is appropriately formed in a lateral Ω shape or the like. If there is a linear portion such as a substantially N-shape, the thickness of the electrical connector is 0.5 to 2
mm, and utilizes the elastic properties of the elastomer layer 9 with respect to the inspection and compression of the connection, so that the length of the linear portion is 0.
2 to 0.5 mm, preferably 0.2 to 0.3 mm.

As shown in FIGS. 1, 2 and 13, each plating terminal 12 is connected to the contact 7a of each wire 7 and is located on the back side of the elastomer layer 9.
0 and a hard second plating layer 11 that covers the surface of the first plating layer 10 are curvedly formed in a hemispherical shape. The first plating layer 10 functions to increase the amount of protrusion of the wire 7 from the elastomer layer 9 and is formed of gold, silver, tin, nickel, or the like. However, from the viewpoint of plating growth speed, nickel plating is preferred. The first plating layer 10 is formed to a thickness of 30 μm to 100 μm. This is because if the thickness is less than 30 μm, the amount of protrusion from the elastomer layer 9 becomes insufficient, and the elastomer layer 9 may be depressed during compression. On the contrary, 100
If it exceeds μm, it is not preferable from the viewpoint of cost.

The second plating layer 11 uses gold plating in the case of mounting connection of the BGA 16 which is not used repeatedly. On the other hand, in the case of the inspection of the BGA 16, hard gold plating having a thickness of about 0.1 to 2 μm is used from the viewpoint of preventing the contact 7a from being damaged or worn.

As shown in FIGS. 1, 2 and 15, each pad terminal 13 is composed of a flat substrate 5 and platings 4 formed on the front and rear surfaces of the substrate 5, respectively. At least 25% of the lower part is buried in the elastomer layer 9, and the remaining upper part protrudes from the surface of the elastomer layer 9. The shape and diameter of each pad terminal 13 is such that the solder ball 17 is generally φ0.3 to 0.75 mm in the case of the BGA 16, and the solder ball 1 is formed while ensuring insulation between the terminals.
Since it is necessary to take into account the positional accuracy of the pad 7 and the pad terminal 13, it is appropriately formed in a circular, oval, square, polygonal, or elliptical shape. In the case of a circular shape, a range of φ0.3 to 0.8 mm is desirable. On the other hand, in the case of a land-shaped electrode such as LGA, from the viewpoint of concentrating the contact pressure and stabilizing the contact resistance, the diameter of the surface (upper surface) contacting the land-shaped electrode has a diameter of φ0.05 to 0.25mm, bottom diameter is φ
A substantially trapezoidal cross section of 0.3 to 0.8 mm is appropriate (FIG. 18).
reference).

The pad terminal 13 is buried in the metal plate 1.
Is determined by the etching amount. The reason why the lower portion of the pad terminal 13 having a thickness of 25% or more is buried in the elastomer layer 9 is that when the thickness is 24% or less, the remaining portion of the metal plate 1 is large and the side etching becomes large in the final etching. This is because the diameter is not stable.

The substrate 5 is made of an iron-nickel alloy having a thickness of 0.05 to 0.5 mm, that is, a metal plate 1. Both the front and back surfaces are mirror-finished and function to suppress the generation of solder dust. When the thickness of the substrate 5 is 0.1 mm or less, the amount of protrusion from the elastomer layer 9 is small, and the load increases due to the contact of the elastomer layer 9 with the BGA 16 during compression use. Conversely 0.2
If it is 5 mm or more, the side etching becomes large in the final etching, and it is difficult to obtain a sharp edge. Further, the etching time becomes longer, which leads to an increase in cost. Therefore, the thickness of the substrate 5 is 0.1 to 0.
25 mm is optimal.

Each plating 4 is a bright plating using gold, silver, palladium, palladium-nickel alloy, nickel, cobalt, rhodium, ruthenium, or the like, and can suppress generation of solder dust. Among them, BGA
In the case of No. 16, when using gold plating, there is a problem that solder dust migrates and accumulates on the surface of the terminal portion to increase the connection resistance. Therefore, compared with gold plating, palladium, cobalt, Rhodium or nickel plating is used. Further, palladium plating is preferable from the viewpoint of connection resistance and strength. In contrast, LGA
In the case of, gold plating is used from the viewpoint of connection resistance.

Each plating 4 needs a thickness of 0.1 μm or more from the viewpoint of contact resistance and wear resistance. In particular, since it functions as an etching resist in the final etching for forming the pad terminals, it is preferable to use a resist of 0.1 from the viewpoint of etching resistance and the like.
5 μm or more is required. Thus, the thickness of each plating 4 is better as it is thicker, but is preferably 3 μm or less in order to prevent an increase in cost. Therefore, each plating 4 is formed to have a thickness in the range of 1 to 2 μm in consideration of contact resistance, abrasion resistance, etching resistance, and cost.

Next, a method of manufacturing the electrical connector will be described. First, a metal plate 1 made of an iron-nickel alloy having a thickness of 0.1 to 0.25 mm is prepared, and an etching resist film 2 is formed on a portion of the metal plate 1 to be finally plated by a photoresist process (FIG. 3), and the other part was coated with a ferric chloride solution to a thickness of 25 to 40 from both sides.
% Is etched (see FIG. 4), and an electrodeposited photoresist film 3 is formed in the recessed portion (see FIG. 5) by the etching. Subsequently, the etching resist film 2 is peeled off with a sodium hydroxide solution (see FIG. 6), plating is applied to the portions thereof (see FIG. 7), and the electrodeposited photoresist film 3 is coated with a corrosive liquid containing lactic acid. Peeling and bonding substrate 5
(See FIG. 8).

The reason why the etching amount is 25 to 40% is as follows.
If it is less than 25%, the remaining portion of the metal plate 1 is large, so that the side etching may be large in the final etching or the variation in the diameter of the terminal portion after the etching may be large. In addition, the rubber layer 9 is not sufficiently buried in the elastomer layer 9 and a sufficient bonding area cannot be secured. On the other hand, if it exceeds 40%, the remaining portion of the metal plate 1 is reduced, and the strength may be insufficient or a through hole may be generated.

Similarly, in the case of etching from one side, as shown in FIG. 19, an etching resist film 2 is formed on a portion of the iron-nickel alloy metal plate 1 having a thickness of 0.1 to 0.25 mm to be finally plated. Formed by a photoresist process, one surface of which is entirely laminated with a protective film 6,
Etching is performed on the other surface with a ferric chloride solution at 25 to 60% of the thickness (see FIG. 20). Subsequently, the protective film 6 is peeled off, and a photoresist film 3 is formed on the concave portion by etching and the non-etched resist film portion on the back surface as shown in FIG. Then, the etching resist film 2 is peeled off with a sodium hydroxide solution (see FIG. 22), and the plating 4 is applied to the portions (see FIG. 23). Thereafter, the electrodeposited photoresist film 3 is coated with a corrosive solution containing lactic acid. By peeling off, a substrate 5 for bonding is produced (see FIG. 24).

The reason why the etching amount is 25 to 60% is as follows.
If it is less than 25%, the remaining portion of the metal plate 1 is large, so that the side etching may be large in the final etching or the variation in the diameter of the terminal portion after the etching may be large. In addition, the rubber layer 9 is not sufficiently buried in the elastomer layer 9 and a sufficient bonding area cannot be secured. Conversely, if it exceeds 60%, the amount of protrusion of the terminal portion from the elastomer layer 9 is small, and the load increases due to the contact of the elastomer layer 9 with the BGA 16 during compression use. In addition, the remaining portion of the metal plate 1 is reduced, and the strength may be insufficient or a through hole may be generated.

Next, a plurality of wires 7 are bonded to the bonding substrate 5 by a wire bonder (see FIG. 9), and a laser is applied to the upper end of each wire 7 to form a ball-shaped contact 7a (see FIG. 10). ). After the contacts 7a are formed, a frame 8 is arranged along the outer peripheral edge of the bonding substrate 5, and a casting rubber is filled in the frame 8 to form an elastomer layer 9; The contact 7a is covered, and the bonding substrate 5, the plurality of wires 7, the frame 8, and the elastomer layer 9 are integrally bonded (see FIG. 11).

Next, a known laser such as a YAG laser is radiated to make each contact 7a from the elastomer layer 9 0.03 to 0.03.
0.1 mm is exposed (see FIG. 12), the first plating layer 10 is applied to the surface of each contact 7a by 30 to 100 μm, and the second plating layer 11 is applied to the surface of the first plating layer 10 by 0.1 to 100 μm.
The plating terminal 12 is formed by applying 2 μm (see FIG. 13). After the plated terminals 12 are formed, the bonding substrate 5 is turned upside down, and the non-plated portions are removed by etching to form a plurality of pad terminals 13 (see FIG. 14). And then, the water pressure of 10 to 30 is applied to the rest of the plating 4 generated by the side etching.
Water is sprayed under the condition of kgf / cm ² to remove the remainder of the plating 4 (see FIG. 15).

[0033] was the condition of the water pressure 10~30kgf / cm ² is not possible to remove less than 10 kgf / cm ^2. Conversely, if it exceeds 30 kgf / cm ² , the pad terminals 13 may peel off from the elastomer layer 9. With the above method, the electrical connector of the present embodiment can be manufactured (see FIG. 16).
Other parts are the same as in the conventional example.

According to the above configuration, since the pad 22 is substantially enlarged by providing the large pad terminal 13 on the wire 7, the connection resistance of each terminal varies due to the positional accuracy of the solder ball 17 of the BGA 16 and the pad 22. Problem can be surely solved. In addition, since the plated terminal 12 and the pad terminal 13 are greatly protruded from the elastomer layer 9, stress can be concentrated on the terminal, and stable connection with low contact resistance can be realized. Also, 0.
Even when the compression is performed by 15 mm or more, a sufficient gap is created between the test substrate 14 and the elastomer layer 9, and the volume of the elastomer layer 9 corresponding to the compression can be released to the portion. Therefore, even if compressed, the elastomer layer 9 is easily deformed, and the load can be suppressed to a very small value.

For the LGA, between the LGA and the elastomer layer 9 and between the test substrate 14 and the elastomer layer 9
Between the elastomer layer 9 and the compressed elastomer layer 9
Can be released to that part. Therefore, 0.
Even when compressed by 15 mm or more, the elastomer layer 9 is easily deformed, and remarkable suppression of the load can be expected. In addition, since the plating terminal 12 and the pad terminal 13 are each made larger, the terminal does not become buried in the elastomer layer 9 even when repeatedly compressed. Further, since 25% or more of the thickness of the pad terminal 13 is buried in the elastomer layer 9,
It does not peel off from the elastomer layer 9. Furthermore, in the case of the inspection of the BGA 16, since the surface of the plated terminal 12 is made of hard gold plating, the wear of the plated terminal 12 can be expected to be prevented.

When the characteristics of the electric connector of the present embodiment and the conventional electric connector, specifically, the connection resistance at the time of compression, the load at the time of compression, and the number of times of repeated use are compared, the results shown in Table 1 can be obtained. Was.

[0037]

[Table 1]

[0038]

Embodiment 1 Hereinafter, an embodiment of an electrical connector for testing a BGA 16 will be described. Φ0.7 mm, pitch 1.27 mm on both front and back surfaces at the center of a metal plate 1 made of an iron-nickel alloy (nickel 41%) having a thickness of 0.15 mm, a length of 35 mm, and a width of 35 mm
Then, a casein resist layer (etching resist film 2) having a thickness of 7 μm is formed in a matrix of 20 rows and columns (total number of 400) using a known photoresist, and a depth of 0.05 mm each from the front and back with a ferric chloride solution. Etching with
An electrodeposited photoresist film 3 of an acrylic resin having a thickness of about 7 μm was formed in the recessed portion by the etching. Subsequently, the casein resist layer was peeled off with a 5% sodium hydroxide solution, and one side of the portion (the surface to be subsequently bonded) was plated with nickel under a thickness of 1 μm and plated with gold 4 at a thickness of 0.2 μm. A 2 μm underlying nickel plating was applied to the contact surface of the back side solder ball 17, and then a 2 μm palladium plating 4 was applied. The electrodeposited photoresist film 3 was peeled off with a corrosion solution containing lactic acid to obtain a bonding substrate 5 (see FIGS. 3 to 8).

Next, using a general-purpose ball bonder, gold wires 7 having a diameter of 50 μm were bonded at a pitch of 1.27 mm in a matrix of 20 rows each in a vertical direction and a horizontal direction (a total of 400) using a general-purpose ball bonder. At this time, as shown in FIG.
m, offset by 0.6 mm at an angle of 45 °, and further extended vertically. After each wire 7 was prepared, the upper end of each wire 7 was irradiated with argon laser light to form a spherical contact 7a having a diameter of 100 μm on the upper end, and the height was uniformed to be 1.2 mm. (See FIG. 10).
Then, along the outer peripheral edge on the substrate 5, 35 m each in the vertical and horizontal directions
m, height 1.3mm, width 5mm, polyetherimide
A molding frame 8 (hereinafter, referred to as PEI) was disposed.

Next, in the frame 8, a two-part silicone rubber KE1216A / B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) having a cured rubber hardness of 25 ° H (JIS A) is obtained.
Colorant K-Color-BK-0 was added to each 50 parts by weight.
10 parts by weight of 2B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) was added and mixed in an amount of 0.1 mm higher than the upper end of the contact 7a of the wire 7 and heat-treated at 120 ° C. for 30 minutes. And cured (see FIG. 11).

Then, the elastomer layer 9 covering the contact 7a of the wire 7 is removed by scanning irradiation with a YAG laser beam until the contact 7a of the wire 7 projects 50 μm from the surface of the elastomer layer 9 (see FIG. 12). Then, the contact 7a of the wire 7 exposed by the electrolytic plating 4 using the substrate 5 as the pad terminal 13 is plated with nickel of 75 μm (first plating layer 10), and hard gold plating (second plating layer 11 ) Was applied 2 μm (see FIG. 13). After the hard gold plating, the substrate 5 was etched with a ferric chloride solution, and the plated portion having a diameter of 0.7 mm was removed leaving a cylindrical shape, thereby forming a pad terminal 13 (see FIG. 14). Then, water is sprayed at a water pressure of 20 kgf / cm ² on the remainder of the plating 4 generated by the side etching to remove the remainder of the plating 4 (see FIG. 15). After sufficient washing, after-curing is performed at 200 ° C. for 1 hour. The process was performed to obtain an electrical connector (see FIG. 16).

When this electrical connector was compressed by 0.2 mm between the BGA 16 having the solder balls 17 having a diameter of 0.75 mm and the height of 0.6 mm in a matrix of 20 rows each in the vertical and horizontal directions at a pitch of 1.27 mm and the test board 14, it was stable. And the variation of each electrode was as small as 15 to 25 mΩ, and there was no problem in testing the electrical characteristics of the BGA 16. Furthermore, compression was repeatedly performed with a compression amount of 0.2 mm, and the electrical connection was continuously confirmed.
Even if the number of times exceeded 10,000, no point where the resistance exceeded 100 mΩ was generated.

Embodiment 2 Hereinafter, an embodiment of an LGA inspection electrical connector will be described.
0.15 mm in thickness, 50 mm in height, 50 mm in width, 0.5 mm on the front surface, 0.2 mm on the back surface, pitch 1
A 7 μm-thick casein resist layer (etching resist film 2) is formed in a matrix of 40 mm in length and width (total number: 1600) by a known photoresist, and a depth of 0.05 mm each from the front and back with a ferric chloride solution. Then, an electrodeposited photoresist film 3 made of an acrylic resin having a thickness of about 7 μm was formed in the recessed portion formed by the etching.

Subsequently, the casein resist layer was peeled off with a 5% sodium hydroxide solution, and one surface of the portion (the surface to be subsequently bonded) was plated with nickel under a thickness of 1 μm, and gold plating 4 was applied to a thickness of 0.1 mm. 2 μm,
A 2 μm underlying nickel plating is applied to the surface of the backside LGA contacting the electrode 15, and then a hard gold plating 4 is applied to the 2 μm plating.
m. Then, the electrodeposited photoresist film 3 was peeled off with a corrosion solution containing lactic acid to obtain a bonding substrate 5 (see FIG. 17).

Next, using a general-purpose ball bonder, gold wires 7 having a diameter of 50 μm are arranged at a pitch of 1 mm at 40 mm rows and columns (total 16 rows) at the center of the plating portion on the plating surface.
00). At this time, as shown in FIG. 9, the wire 7 had a structure in which it was vertically offset by about 0.3 mm, at an angle of 45 ° and 0.5 mm, and further extended in the vertical direction. After each wire 7 is prepared, the upper end of each wire 7 is irradiated with argon laser light to form a spherical contact 7a having a diameter of 100 μm on the upper end, and its height is 1 m.
m. Then, a PEI molding frame 8 having a length and width of 50 mm, a height of 1.1 mm, and a width of 5 mm was arranged along the outer peripheral edge of the substrate 5.

Next, in the frame 8, a two-part silicone rubber KE1216A / B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) having a cured rubber hardness of 25 ° H (JIS A) is obtained.
Colorant K-Color-BK-0 was added to each 50 parts by weight.
10 parts by weight of 2B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) was added and mixed in an amount of 0.1 mm higher than the upper end of the contact 7a of the wire 7 and heat-treated at 120 ° C. for 30 minutes. And cured (see FIG. 11).

Next, the elastomer layer 9 covering the contact 7a of the wire 7 is removed by scanning irradiation with a YAG laser beam until the contact 7a of the wire 7 projects 50 μm from the surface of the elastomer layer 9 (see FIG. 12). The contact 7a of the wire 7 exposed by the electrolytic method using the substrate 5 as the pad terminal 13 is plated with nickel of 75 μm (the first plating layer 1).
0), and hard gold plating (second plating layer 11) was further applied thereon by 2 μm (see FIG. 13). After the hard gold plating, the substrate 5 was etched with a ferric chloride solution, and the plating portions of the top φ0.2 mm and the bottom φ0.5 mm were removed leaving a trapezoidal shape to form the pad terminals 13 (FIG. 14). reference). Then, water is sprayed at a water pressure of 20 kgf / cm ² on the remainder of the plating 4 generated by the side etching to remove the remainder of the plating 4 (see FIG. 15). After sufficient washing, after-curing is performed at 200 ° C. for 1 hour. The process was performed to obtain an electrical connector (see FIG. 18).

This electrical connector is mounted between an LGA having inspection electrodes 14 and a LGA having gold-plated land electrodes of φ0.5 mm arranged in a matrix of 40 columns each at a pitch of 1 mm each in the vertical and horizontal directions.
When it was compressed by 15 mm, stable conductivity was obtained, and the variation of each electrode was as small as 10 to 20 mΩ, and there was no problem in testing the electrical characteristics of the LGA. further,
Compression was repeatedly performed with a compression amount of 0.15 mm, and the electrical connection was continuously confirmed. As a result, no point where the resistance exceeded 100 mΩ was generated even when the electrical connection exceeded 100,000 times.

Embodiment 3 Hereinafter, an embodiment of an electrical connector for testing the BGA 16 will be described. Φ0.7 mm, pitch 1.27 mm on both front and back surfaces at the center of a metal plate 1 made of an iron-nickel alloy (nickel 41%) having a thickness of 0.15 mm, a length of 35 mm, and a width of 35 mm
A casein resist layer (etching resist film 2) having a thickness of 7 μm is formed of a known photoresist in a matrix of 20 rows and columns (total number of 400), and a polyester-based protective film 6 with an acrylic adhesive is laminated on one side. did. Subsequently, a ferric chloride solution is used to remove 0.1 from one side.
Etching was performed at a depth of 075 mm, the protective film 6 was peeled off, and an electrodeposited photoresist film 3 made of an acrylic resin having a thickness of about 7 μm was formed in the recessed portion due to the etching and the non-casein resist layer portion on the back surface.

Subsequently, the casein resist layer was peeled off with a 5% sodium hydroxide solution, and one side of the portion (the surface to be subsequently bonded) was plated with nickel under a thickness of 1 μm, and gold plating 4 was applied to a thickness of 0.1 mm. 2 μm,
A 2 μm underlying nickel plating is applied to the contact surface of the solder ball 17 on the back side, and then a palladium plating 4 is
m. Then, the electrodeposited photoresist film 3 peeled off with a corrosion solution containing lactic acid was used as a substrate 5 for bonding (see FIGS. 17 to 24).

Next, using a general-purpose ball bonder, a gold wire 7 having a diameter of 50 μm was bonded at a pitch of 1.27 mm in a matrix of 20 rows each in a vertical direction and a horizontal direction (a total of 400) using a general-purpose ball bonder. At this time, as shown in FIG.
m, offset by 0.6 mm at an angle of 45 °, and further extended vertically. After each wire 7 was prepared, the upper end of each wire 7 was irradiated with argon laser light to form a spherical contact 7a having a diameter of 100 μm on the upper end, and the height was uniformed to be 1.2 mm. (See FIG. 26).
Then, along the outer peripheral edge on the substrate 5, 35 m each in the vertical and horizontal directions
m, a height of 1.3 mm and a width of 5 mm, a PEI molding frame 8 was arranged.

Next, in the frame 8, a two-part silicone rubber KE1216A / B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) having a cured rubber hardness of 25 ° H (JIS A) is obtained.
Colorant K-Color-BK-0 was added to each 50 parts by weight.
10 parts by weight of 2B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) was added and mixed in an amount of 0.1 mm higher than the upper end of the contact 7a of the wire 7 and heat-treated at 120 ° C. for 30 minutes. And cured (see FIG. 27).

Next, the elastomer layer 9 covering the contact 7a of the wire 7 is removed by scanning irradiation with a YAG laser beam until the contact 7a of the wire 7 projects 50 μm from the surface of the elastomer layer 9 (see FIG. 12). Then, the contact 7a of the wire 7 exposed by the electrolytic plating 4 using the substrate 5 as the pad terminal 13 is plated with nickel of 75 μm (first plating layer 10), and hard gold plating (second plating layer 11 ) Was applied 2 μm (see FIG. 13). After the hard gold plating, the substrate 5 was etched with a ferric chloride solution, and the plated portion having a diameter of 0.7 mm was removed leaving a cylindrical shape to form a pad terminal 13 (see FIG. 28). Then, water is sprayed at a water pressure of 20 kgf / cm ² on the remainder of the plating 4 generated by the side etching to remove the remainder of the plating 4 (see FIG. 29), and after sufficient washing, after-curing at 200 ° C. for 1 hour. The process was performed to obtain an electrical connector (see FIG. 30).

When the electrical connector was compressed by 0.2 mm between the BGA 16 and the inspection board 14 having solder balls 17 having a diameter of 0.75 mm and a height of 0.6 mm at a pitch of 1.27 mm in a matrix of 20 rows and 20 columns, a stable result was obtained. The electrical conductivity of the BGA 16 was small, and the variation of each electrode was as small as 15 to 25 mΩ, and there was no problem in testing the electrical characteristics of the BGA 16. Furthermore, when compression was repeatedly performed with a compression amount of 0.2 mm and the electrical connection was continuously confirmed,
Even if it exceeded 50,000 times, no point where the resistance exceeded 100 mΩ was generated.

[0055]

As described above, according to the first aspect of the present invention, it is possible to prevent the variation in the connection resistance of the electrodes and to use the invention in an electronic component having a large number of electrodes. In addition, even if it is repeatedly used with a load equal to or greater than the predetermined value,
It is possible to suppress or prevent an increase in connection resistance.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional explanatory view showing an embodiment of an electric connector according to the present invention.

FIG. 2 is an explanatory sectional view of a main part showing an embodiment of the electric connector according to the present invention.

FIG. 3 is an explanatory sectional view showing a state in which an etching resist film is formed on a portion of the metal plate to be finally plated in the embodiment of the electrical connector according to the present invention.

FIG. 4 is an explanatory sectional view showing a state where a non-etching resist film forming portion in FIG. 3 is etched with a ferric chloride solution.

5 is an explanatory cross-sectional view showing a state in which an electrodeposited photoresist film is formed in a concave portion by etching in FIG.

FIG. 6 is an explanatory sectional view showing a state in which the resist film of FIG. 5 has been peeled off with a sodium hydroxide solution.

FIG. 7 is an explanatory sectional view showing a state where plating is applied to a portion where the resist film of FIG. 6 is peeled off;

8 is an explanatory cross-sectional view showing a state in which the resist film of FIG. 7 is peeled off with a corrosive liquid to produce a bonding substrate.

9 is an explanatory cross-sectional view showing a state where wires are bonded to the bonding substrate of FIG. 8;

10 is an explanatory sectional view showing a state where a ball-shaped contact is formed at the upper end of the wire of FIG. 9;

FIG. 11 is an explanatory sectional view showing a state in which the wire, frame, and elastomer layer of FIG. 10 are integrally formed.

FIG. 12 is an explanatory sectional view showing a state where a contact is exposed from the elastomer layer of FIG. 11;

FIG. 13 is an explanatory sectional view showing a state in which a plating terminal is formed on the contact point in FIG.

14 is an explanatory cross-sectional view showing a state where the bonding substrate of FIG. 13 is turned upside down.

15 is an explanatory sectional view showing a state in which a non-plated portion of the bonding substrate of FIG. 14 is removed to form pad terminals.

FIG. 16 is an explanatory sectional view showing a completed state of the electric connector in the embodiment of the electric connector according to the present invention.

FIG. 17 is an illustrative sectional view showing a step of manufacturing a pad terminal in another embodiment of the electrical connector according to the present invention.

FIG. 18 is an explanatory sectional view showing a modified example of the pad terminal in another embodiment of the electric connector according to the present invention.

FIG. 19 is a cross-sectional explanatory view showing a manufacturing process of etching from one side in another embodiment of the electric connector according to the present invention.

20 is an explanatory sectional view showing a state where the metal plate of FIG. 19 is etched from the other surface with a ferric chloride solution.

21 is an explanatory sectional view showing a state in which the protective film of FIG. 20 has been peeled off and a photoresist film has been formed on the concave portion and the non-etching resist film portion on the back surface.

FIG. 22 is an explanatory sectional view showing a state in which the resist film of FIG. 21 has been stripped with a sodium hydroxide solution.

FIG. 23 is an explanatory sectional view showing a state where plating is applied to a peeled portion in FIG. 22;

24 is an explanatory cross-sectional view showing a state in which the electrodeposited photoresist film of FIG. 22 is peeled off to produce a bonding substrate.

FIG. 25 is an explanatory sectional view showing a state where wires are bonded in a matrix to the plated portions of FIG. 24;

FIG. 26 is an explanatory sectional view showing a state where a spherical contact is formed at the upper end of the wire of FIG. 25;

FIG. 27 is an explanatory cross-sectional view showing a state in which the substrate of FIG. 26 is filled with a mixture obtained by adding a coloring agent to silicone rubber in an amount higher than the upper end of the contact point of the wire.

FIG. 28 is an explanatory sectional view showing a state in which the substrate of FIG. 27 is subjected to an etching treatment, a plated portion is removed while leaving a columnar shape, and pad terminals are formed.

FIG. 29 is an explanatory cross-sectional view showing a state in which the remainder of the plating is removed by spraying water on the remainder of the plating of FIG. 28;

FIG. 30 is an explanatory sectional view showing the manufactured electrical connector shown in FIG. 29;

FIG. 31 is an explanatory perspective view showing a BGA.

FIG. 32 is an explanatory perspective view showing a BGA solder ball;

FIG. 33 is an enlarged sectional view of a main part showing a conventional electric connector.

FIG. 34 is an explanatory sectional view showing a problem of the conventional electric connector.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 metal plate 2 etching resist film 3 electrodeposition photoresist film 4 plating 5 substrate 6 protective film 7 wire (conductive wire) 7a contact 8 frame 9 elastomer layer (elastic insulating layer) 10 first plating layer 11 second plating Layer 12 Plating terminal 13 Pad terminal 14 Inspection board (first electrical connection) 15 Electrode 16 BGA (second electrical connection) 17 Solder ball (electrode)

Claims (3)

[Claims] 1. A method according to claim 1, wherein the first and second electric joints are sandwiched between the first and second electric joints, and the first and second electric joints approach each other under the action of a load, thereby causing the first and second electric joints to approach each other. An electrical connector for conducting the electrical joint of the above, an elastic insulating layer interposed between the first and second electrical joints, embedded in the thickness direction of the elastic insulating layer, a constant pitch A plurality of conductive wires separated from each other by a contact and connected to one end of each conductive wire to be exposed on the back surface of the elastic insulating layer and to contact the plurality of electrodes of the first electrical joint, respectively. An area-enlargement plating terminal, and a contact-area-enlargement pad terminal connected to the other end of each conductive wire and in contact with the plurality of electrodes of the second electrical joint, respectively. Plating both the front and back surfaces of the pad terminals, and part of each pad terminal Electrical connector, characterized in that the remainder by buried layer is projected from the surface of the elastic insulating layer. 2. The elastic insulating layer has a hardness of 10 ° H.
2. The electrical connector according to claim 1, wherein the load is reduced by setting the temperature to a degree H and inclining or bending at least a part of each of the conductive wires in a direction intersecting the thickness direction of the elastic insulating layer. 3. A first plating layer connected to one end of each of the conductive wires and located on the back side of the elastic insulating layer, and a first plating layer covering the first plating layer. 3. The semiconductor device according to claim 1, wherein the second plating layer is formed in a substantially hemispherical shape, and a part of each of the pad terminals has a thickness of about 25% or more.
Electrical connector as described.