JP2000340326A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a manufacturing cost by assuring storage of a probe, storage of an IC bump and contact with the probe by superimposing one kind of base plates. SOLUTION: In this IC socket, the bump 41 of an IC is connected to the pattern of a printed circuit board 5 through a probe 1 in a socket by storing the IC 4 in the socket. The IC socket is composed of the probe having a ring- shaped step part 11a formed on the outer periphery of a cylinder part 11 to store a spring 14 applying spring energization in the direction on which a first terminal 12 to be brought into contact with the bump of the IC and a second terminal 13 to be brought into contact with the pattern of the printed circuit board are repelled each other, and a pair of base plates 2 of an insulating material on which many probe storing holes consisting of large diameter holes 21 to store the ring-shaped step part of the probe and small diameter holes 22 to store the cylinder part in communication with the large diameter holes, and the probe is stored in the IC socket by superimposing the small diameter hole side of one base plate on the large diameter hole side of the other base plate with the ring-shaped step part or the probe stored in the large diameter hole of the base plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an LGAIC or a BGA
By mounting a leadless type IC (hereinafter simply referred to as a package) such as an IC in a socket mounted on a printed circuit board, bumps, which are connection terminals formed on the package, are printed via probes in the socket. The present invention relates to an IC socket connected to a pattern on a substrate.

[0002]

2. Description of the Related Art A conventional leadless IC socket is disclosed in, for example, Japanese Patent Laid-Open No. 7-44885 (Patent No. 2).
648120) There is a surface contact type connector disclosed in the gazette. In this connector, holes for inserting contact pins (probes) communicating with each other are formed in upper and lower two insulating substrates (hereinafter, referred to as a base plate in the present invention, the same applies hereinafter) and opposed to the IC side. On the upper surface of the lower insulating substrate, I
The hole into which the C bump enters is formed.

[0003] The contact pin has a pipe in which a spring is housed inside and an upper pin terminal is integrally formed on an upper end side, and one end is housed in the pipe so that a spring force is applied by the spring. And lower pin terminals.

The upper surface of a socket integrated with the contact pins sandwiched between two upper and lower insulating substrates is provided on the upper surface of the socket.
When C is placed, the bumps of the IC enter the holes formed in the upper insulating substrate and come into contact with the upper pin terminals, and
When the IC is pushed down, the contact pins are lowered, so that the lower pin terminal comes into contact with the pattern on the printed circuit board via the spring force of the spring. Thereby, IC
Each of the bumps is electrically connected to a pattern on a printed circuit board via a contact pin.

[0005]

The two upper and lower insulating substrates in the prior art have different thicknesses and cross-sectional shapes. Therefore, two types of molds are required to manufacture the insulating substrate. Thus, there is a problem that the manufacturing cost of the insulating substrate increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method of accommodating a probe, accommodating a pump of an IC, and making contact with the probe by stacking one kind of base plate. By being able to do it reliably,
An object of the present invention is to provide an IC socket capable of reducing the manufacturing cost.

[0007]

SUMMARY OF THE INVENTION The IC socket of the present invention achieves the above-mentioned object.
In an IC socket in which an IC is accommodated in a socket so that bumps of the IC and a pattern of a printed circuit board are connected via a probe in the socket,
A ring-shaped step is formed on the outer periphery of a cylindrical portion in which a spring for biasing a first terminal in contact with the bump of C and a second terminal in contact with the pattern of the printed circuit board in a repulsive direction is accommodated. An insulating material in which a large number of probe receiving holes are formed, each of which comprises a probe, a large-diameter hole accommodating a ring-shaped step portion of the probe, and a small-diameter hole communicating with the large-diameter hole and accommodating the cylindrical portion. And the ring-shaped step of the probe is accommodated in the large-diameter hole of one base plate, and the small-diameter hole side of the other base plate is set to the large diameter of the one base plate. The probe is housed so as to overlap the hole side.

Further, a screw insertion hole is formed in the one base plate, a screw hole is formed in the other base plate, a screw is inserted through the screw hole insertion hole, and the screw is screwed into the screw hole. Thus, it is desirable to integrate the pair of base plates.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of an IC socket according to the present invention will be described below with reference to FIGS. Reference numeral 1 denotes a probe made of a conductive material, a cylindrical portion 11 having a ring-shaped step portion 11a formed at a substantially central portion of the outer periphery, and a first portion slidably housed at upper and lower ends of the cylindrical portion 11. Second
, And a spring 14 housed in the cylindrical portion 11 and biasing the first and second terminals 12, 13 in a protruding direction with respect to each other.

Reference numeral 2 denotes a base plate made of an insulating material such as a synthetic resin by die molding, and a large-diameter hole 2 large enough to accommodate the ring-shaped step portion 11a of the probe 1.
1 and a small-diameter hole 22 for accommodating the cylindrical portion 11 are formed so as to communicate with the large-diameter hole 21.

A pair of base plates 2 formed by die molding constitute one socket. One base plate 2 has a screw hole 23 and the other base plate 2 has a screw insertion hole 24. It is formed by post processing.

As shown in FIGS. 1 and 2, one base plate 2 is inserted into the large-diameter hole 21 with respect to the base plate 2 having the above-described structure.
Insert the probe 1 side up. Thus, the ring-shaped step 11 a of the probe 1 is accommodated in the large-diameter hole 21, and the cylindrical portion 11 below the ring-shaped step 11 a is accommodated in the small-diameter hole 22.

Next, another base plate 2 is placed on the upper surface of the one base plate 2 with the small-diameter hole 22 side facing downward. At this time, the cylindrical portion 11 above the upper ring portion 11 a of the probe 1 is accommodated in the small-diameter hole 22 of the other base plate 2. In this state, the first terminal 12 protrudes into the large-diameter hole 21 of the other base plate 2, and the second terminal 13 protrudes from the small-diameter hole 22 of one base plate 2.

The screw insertion hole 24 of the other base plate 2
Into the base plate 2
By screwing into the screw holes 23 and tightening, the pair of base plates 2 are integrated into a socket as shown in FIG.

Next, a structure for connecting the bumps 41 of the package 4 to a pattern (not shown) of the printed circuit board 5 using the socket configured as described above will be described with reference to FIGS. As a method of fixing the socket to the printed circuit board 5 by screwing in this embodiment, a method of fixing the socket to the printed circuit board 5 without forming a mounting hole is disclosed. That is, a nut 6 for screwing is soldered to a pad formed on the printed circuit board 5, and is fixed with a screw 7 using the nut 6. In addition,
The screw 3 for fixing the base plate 2 and the screw 7 for fixing the socket to the printed circuit board 5 are out of position.

The nut 6 used here has a groove 6a (see FIG. 4) formed at the lower portion of the nut to be soldered to the pad of the printed circuit board 5, so that the solder wraps around at the time of soldering. The solder to the pad is firmly performed. Note that an adhesive may be used instead of the solder.

When the nut 6 is fixed to the pad by soldering, when cream solder is applied to the entire surface of the pad, the cream solder enters the screw hole of the nut 6 and the screw 7 is screwed into the screw hole on the way. This makes it impossible to secure the screws by contacting the solder.

Therefore, in the present embodiment, cream solder is applied to each pad using a mask, and a circular mask portion is formed at a portion corresponding to the screw hole of the nut 6, or By not forming the copper foil on the portion of the printed circuit board 5 corresponding to the screw hole of the nut 6, the cream solder does not enter the screw hole of the nut 6, so that the screw can be firmly fixed. Becomes

Reference numeral 8 denotes a frame mounted on the upper surface of the base plate 2, and a frame formed of aluminum or the like for accommodating the package 4. 9 denotes a frame mounted on the upper surface of the frame 8, and a screw 10. A cover plate for pressing the bumps 4a of the package 4 housed in the frame body 8 against the probe 1 by being fixed to the frame body 8 to make electrical contact therewith.

In order to attach the base plate 2 and the frame 8 to the printed board 5, screws 7 are inserted into nuts 6 fixed to the printed board 5 through holes formed in the base plate 2 and the frame plate 8. Then, the base plate 2 and the frame plate 8 can be fixed to the printed circuit board 5. In this state, the second terminal 13 of the probe 1 is brought into pressure contact with the pattern of the printed circuit board 5.

Next, the package 4 is accommodated in the frame 8, and thereafter, the lid plate 9 is placed on the upper surface of the frame 8,
By screwing into a screw hole (not shown) formed in the frame body 8 and fixing the
a enters the large-diameter hole 21 of the base plate 2 and
The first terminal 12 of the probe 1 protrudes into the first terminal 12. Therefore, the bump 4a is electrically connected to the pattern on the printed board 5 (see FIG. 6).

The probe 1 in the above-described embodiment has first and second terminals 12 and 13 at both ends of a cylindrical body 11.
Is slidably inserted into the first terminal 12.
7 is extended from the cylindrical body 11 as shown in FIG.
Only three may be slidably fitted into the cylindrical body 11.

The probe 1 according to this embodiment
In this case, it is necessary to insert the first terminal 11b into the base plate 2 so that the first terminal 11b faces the package 4 side. That is, when attaching the holder to the printed circuit board 5,
When the first terminal 11b faces the printed circuit board 5,
The ring-shaped step portion 11a comes into contact with the upper boundary between the large-diameter hole 21 and the small-diameter hole 22.
Because it cannot be fixed to

[0024]

As described above, according to the present invention, since a socket can be formed by stacking one type of base plate, a pair of base plates can be formed with one mold, and the probe can be accommodated. Since the connection can be reliably performed and the bumps of the IC can be accommodated and the probes can be reliably contacted, the manufacturing cost can be reduced and the electrical connection as a socket can be reliably performed.

Further, a screw insertion hole is formed in one base plate of the pair of base plates, a screw hole is formed in the other base plate, a screw is inserted through the screw hole insertion hole, and the screw hole is inserted into the screw hole. By screwing the screws together, the pair of base plates can be integrated, which has an effect such as simplification of manufacturing.

[Brief description of the drawings]

FIG. 1 is an exploded front view of an IC socket according to the present invention.

FIG. 2 is a longitudinal sectional view of a probe.

FIG. 3 is a front view showing a state where FIG. 1 is assembled;

FIG. 4 is an exploded front view of a state in which an IC is mounted on a printed circuit board using the IC socket of the present invention.

FIG. 5 is a front view showing a state where the above is assembled.

FIG. 6 is a partially enlarged sectional view of FIG. 5;

FIG. 7 is a sectional view of another probe.

[Description of Signs] 1 Probe 11 Cylindrical part 11a Ring-shaped step part 12 First terminal 13 Second terminal 14 Spring 2 Base plate 21 Large diameter hole 22 Small diameter hole 23 Screw hole 24 Screw insertion hole 4 IC (package) 41 Bump 5 Printed circuit board

Claims (2)

[Claims] 1. By accommodating an IC in a socket,
An IC socket for connecting the bumps of the IC and the pattern of the printed board via a probe in the socket; a first terminal contacting the bumps of the IC and a second terminal contacting the pattern of the printed board; A probe in which a ring-shaped step is formed on the outer periphery of a cylindrical portion in which a spring that biases springs in directions repelling each other is formed; a large-diameter hole in which the ring-shaped step of the probe is stored; A pair of base plates made of an insulating material having a large number of probe receiving holes formed of a small-diameter hole communicating with the large-diameter hole and accommodating the cylindrical portion; An IC socket, wherein a probe is accommodated in a state where a ring-shaped step portion of a probe is accommodated, a small-diameter hole side of another base plate is overlapped with a large-diameter hole side of the one base plate. 2. A screw insertion hole is formed in the one base plate, a screw hole is formed in the other base plate, a screw is inserted through the screw hole insertion hole, and the screw is screwed into the screw hole. 2. The IC socket according to claim 1, wherein said pair of base plates are integrated.