JP2000232125A - Wire bonding equipment - Google Patents

Abstract

(57) Abstract: In a wire bonding apparatus for bonding using a capillary, a structure in which the mounting angle of the capillary to a bonding horn can be adjusted to an arbitrary predetermined angle or a cleaning pad is provided. An object of the present invention is to reduce uneven adhesion of dirt and uneven wear in the SMD mounting process to the tip of the capillary to improve the bonding reliability and the number of times the capillary can be used. SOLUTION: An attachment portion in which the capillary 1 is fitted and attached to the bonding horn 2 is formed in an uneven shape so that a cross section thereof is meshed at a predetermined angle, and the capillary is provided at a predetermined number of times of bonding. 1 is removed from the bonding horn 2, and the capillary 1 is intermittently rotated, and the concave and convex portions are further aligned with the bonding horn 2 to be locked.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus for bonding a metal wire fed from a tip of a capillary to a region to be bonded.

[0002]

2. Description of the Related Art FIG. 7 is a structural view of a conventional wire bonding apparatus, in which (a) is a perspective view and (b) is a sectional view.

The capillary 1 is formed of a metal material in a cylindrical shape, the lower end 1b is tapered and the upper end outer peripheral portion 1a is formed in a cylindrical shape having an outer diameter smaller than the central outer diameter. . A small hole 1c is machined in the center of the cylinder, and a metal wire is inserted into the hole 1c.

The bonding horn 2 is formed of a metal material in the shape of an elongated arm, and its front end 2c has a fitting hole 2a for mounting the capillary 1 and a lateral direction for pressing and fixing the mounted capillary 1. Screw holes 2b are respectively formed. Also the rear part 2 of this bonding horn 2
“d” is attached and fixed to the capillary drive control unit 100.

The holding table 3 holds a substrate on which electronic components such as SMDs and bare chips are mounted, and is installed in a bonding station 120.

The fixing screw 5 fixes the capillary 1 mounted on the bonding horn 2. The screw portion 5 a of the fixing screw 5 is screwed into a screw hole 2 b provided on the bonding horn 2, and the upper part of the capillary 1 is fixed. Tip outer periphery 1
a is pressed.

The substrate 10 has electronic components such as SMDs and bare chips mounted thereon, and is mounted on the holding table 3 to bond a bonding pad such as a bare chip with wires.

[0008] A bonding horn 2 is installed in the capillary drive control unit 100, and the vertical drive of the bonding horn 2 is microcomputer-controlled by the capillary drive control unit 100. The capillary drive control section 100 is installed on an XY drive table 110.

A capillary drive controller 100 equipped with a capillary 1 and a bonding horn 2 is provided on the XY drive table 110. In order to automatically move the capillary 1 to the bonded area,
The XY drive table 110 is connected to the capillary drive controller 1
00 is automatically controlled in the XY directions.

[0010] The bonding station 120 is a substrate 1
This is a station for installing the holding table 3 holding 0 and performing a bonding operation.

Next, the procedure for assembling the wire bonding apparatus will be described.

First, the outer peripheral portion 1a of the upper end of the capillary 1 is inserted into the fitting hole 2a of the bonding horn 2, and then the fixing screw 5 is screwed into the screw hole 2b of the bonding horn 2 to make the outer peripheral portion of the upper end of the capillary 1. 1a, the capillary 1 is mounted and fixed to the bonding horn 2.
Then, the substrate 10 on which electronic components such as SMDs and bare chips are mounted is set on the holding table 3, and the holding table 3 is set on the bonding station 120.

In this wire bonding apparatus, a metal wire is inserted into a small hole 1c provided at the center of the capillary 1, and the tip 1b of the capillary 1 is pressed against a bonding pad such as a bare chip which is a region to be bonded. In addition, a bonding operation is performed by applying ultrasonic vibration. In this work, the capillary 1
The positioning of the tip 1b of the capillary 1 on an electronic component is automatically performed by the XY drive table 110, and the pressing of the tip 1b of the capillary 1 on the bonding pad such as the bare chip and the ultrasonic vibration are automatically performed by the capillary drive control unit 100. Done.

In this wire bonding apparatus, the substrate 1
The dirt generated by the SMD mounting process to the substrate 1 or the cleaning process of the substrate 10 adheres and accumulates in a certain direction on the surface of the tip 1b of the capillary 1, so that a good bonding state cannot be obtained and the reliability of the bonding is not obtained. Had a problem. As shown in FIG. 7B, the stains are generated in a direction perpendicular to the direction of the ultrasonic vibration generated by the capillary 1. Further, the wear of the surface of the tip 1b becomes uneven, and there is a possibility that the number of serviceable bonding times of the capillary 1 may be reduced.

[0015]

As described above, in the conventional wire bonding apparatus, dirt is generated and accumulated in a certain direction on the tip surface of the capillary, and the wear on the tip surface becomes uneven. The capillary needed to be replaced. Further, in order to solve such a problem, as shown in JP-A-5-90321, a rotating means for rotatably supporting a capillary and rotating the capillary every predetermined number of times of bonding is provided in a bonding horn, There is also a technology to make the wear of the capillary surface uniform, but the rotation means, which is a large-scale mechanism such as a motor, is provided on the bonding horn, which increases costs and reduces the accuracy of bonding due to the load applied to the bonding horn. Problems arise.

An object of the present invention is to reduce dirt and abrasion on the tip surface of the capillary without increasing the cost,
An object of the present invention is to improve the bonding reliability and the number of serviceable bonding times of the capillary.

[0017]

In order to achieve the above object, the present invention provides a capillary and a bonding horn that rotatably supports the capillary, and covers a thin metal wire fed from the tip of the capillary. In a wire bonding apparatus for bonding to a bonding region, a plurality of convex protrusions are formed on a cross section of the capillary,
The bonding horn is characterized in that a plurality of concave grooves are formed to be fitted in correspondence with the convex protrusions of the capillary.

Further, in a wire bonding apparatus having a capillary and a bonding horn rotatably supporting the capillary, and bonding a thin metal wire drawn out from the tip of the capillary to a bonded region, the wire bonding apparatus may be provided with a capillary. Is provided with a scale mark serving as a reference, and a scale mark corresponding to the scale mark of the capillary is provided on the surface of the bonding horn on which the capillary is mounted.

In a wire bonding apparatus having a capillary and a bonding horn rotatably supporting the capillary, the thin capillary drawn out from the tip of the capillary is bonded to a bonded area. And a screw hole into which the capillary is screwed is provided in the bonding horn.

In a wire bonding apparatus having a capillary and a bonding horn rotatably supporting the capillary, and bonding a thin metal wire drawn out from the tip of the capillary to a bonded area, the capillary may include the capillary. An adjustment knob larger than the diameter of the capillary is provided, and the capillary is rotated in conjunction with the rotation of the adjustment knob.

Further, in a wire bonding apparatus having a capillary and a bonding horn rotatably supporting the capillary, and bonding a thin metal wire drawn out from the tip of the capillary to a bonding target area, a wire bonding apparatus may be used. A cleaning pad provided with a roughened surface, and a capillary moving bonding means for moving the capillary to above the cleaning pad every predetermined number of times of bonding to perform bonding on the surface of the cleaning pad. And characterized in that:

Further, in a wire bonding apparatus having a capillary and a bonding horn rotatably supporting the capillary, and bonding a fine metal wire drawn out from the tip of the capillary to a bonding target area, a wire bonding apparatus may be used. A cleaning pad provided with a roughened surface, and a cleaning pad moving bonding for moving the cleaning pad to below the capillary and performing bonding on the surface of the cleaning pad every predetermined number of times of bonding. Means.

[0023]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a structural view of a wire bonding apparatus according to a first embodiment of the present invention, in which (a) is a perspective view, (b) is a sectional view, and FIG. 2 shows a second embodiment of the present invention. FIG. 3 is a block diagram of a wire bonding apparatus showing a third embodiment of the present invention, FIG. 4 is a block diagram of a wire bonding apparatus showing a fourth embodiment of the present invention,
FIG. 5 is a configuration diagram of a wire bonding apparatus showing a fifth embodiment of the present invention, and FIG. 6 is a configuration diagram of a wire bonding apparatus showing a sixth embodiment of the present invention.

The same components from the first embodiment to the sixth embodiment will be described in the first embodiment, and the description will be omitted in the other embodiments.

A wire bonding apparatus according to a first embodiment will be described with reference to FIG.

The capillary 1 is formed of a metal material in the shape of a column, and its lower end 1b is tapered and thin, and the cross section of the upper end outer peripheral portion 1a has convex projections at several intervals at a predetermined angle. , Respectively. The lower outer peripheral portion 1d of the outer peripheral portion 1a has the same outer diameter as that of the outer peripheral portion 1a in cross section, and is formed in a cylindrical shape smaller than the outer diameter of the central outer peripheral portion 1h.

An outer peripheral portion 1a having a convex protrusion provided on the capillary 1 is engaged with a hole 2a having a concave groove provided on the bonding horn 2 so that the capillary 1 can be formed at an arbitrary angle. Can be installed.

A small hole 1c is formed in the center of the cylinder, and a metal wire is inserted into the hole 1c.

The bonding horn 2 is formed in a slender arm shape from a metal material, and a front end portion 2c is formed with a hole 2a having a concave groove engaged with the outer peripheral portion 1a of the capillary 1. . The bonding horn 2 has a fitting hole 2e into which the outer peripheral portion 1d of the capillary 1 is inserted, and a horizontal screw hole 2b for pressing and fixing the mounted capillary 1 with a fixing screw 5 in the concave groove. Are formed at the lower positions of the holes 2a having the following.
The rear portion 2d of the bonding horn 2 is attached and fixed to the capillary drive control section 100.

The holding table 3 holds the substrate 10 on which electronic components such as SMDs and bare chips are mounted, and is set in a bonding station 120.

The fixing screw 5 has a screw portion 5a which is screwed into a screw hole 2b provided in the bonding horn 2 and a knob portion 5b which can be screwed manually.
Is screwed into the screw hole 2b, the outer peripheral portion 1d of the tip of the capillary 1 is pressed by the screw portion 5a of the fixing screw 5, and the capillary 1 mounted on the bonding horn 2 is fixed.

The substrate 10 has electronic components such as SMDs and bare chips mounted thereon. The substrate 10 is mounted on the holding table 3 and a bonding pad such as a bare chip is wire-bonded.

A bonding horn 2 is installed in the capillary drive control unit 100. The capillary drive control unit 100 controls the vertical movement and ultrasonic vibration of the capillary 1 and the bonding horn 2 by a microcomputer.
The capillary drive control unit 100 includes an XY drive table 1
10 is installed.

A capillary drive control unit 100 equipped with a capillary 1 and a bonding horn 2 is provided on the XY drive table 110. The capillary drive control unit 100 automatically moves the capillary 1 to the bonded area. This is for automatically controlling the driving of the unit 100 in the X and Y directions.

The bonding station 120 is a substrate 1
This is a station for installing the holding table 3 holding 0 and performing a bonding operation.

Next, an assembling procedure of the present wire bonding apparatus will be described.

First, the outer peripheral portion 1a of the upper end having a convex projection provided on the capillary 1 is connected to the bonding horn 2
(At this time, the lower outer peripheral portion 1d of the capillary 1 is fitted into the fitting hole 2e of the bonding horn 2), and then the fixing screw 5 is attached to the bonding horn. 2 is screwed into the screw hole 2b and the lower peripheral portion 1d of the capillary 1 is fixed to the fixing screw 5
, And the capillary 1 is mounted and fixed to the bonding horn 2. Then, the substrate 10 on which electronic components such as SMDs and bare chips are mounted is set on the holding table 3, and the holding table 3 is set on the bonding station 120.

In this wire bonding apparatus, a metal wire is inserted into a small hole 1c provided at the center of the capillary 1, and the tip 1b of the capillary 1 is pressed against a bonding pad such as a bare chip, which is a region to be bonded. In addition, a bonding operation is performed by applying ultrasonic vibration. In this work, the capillary 1
The positioning of the tip 1b of the capillary 1 on an electronic component is automatically performed by the XY drive table 110, and the pressing of the tip 1b of the capillary 1 on the bonding pad such as the bare chip and the ultrasonic vibration are automatically performed by the capillary drive control unit 100. Done.

In the wire bonding apparatus according to the present embodiment, dirt generated by the SMD mounting process on the substrate 10 or the cleaning process of the substrate 10 causes the surface of the tip 1b of the capillary 1 to become dirty as shown in FIG. However, the capillary 1 is rotated so that dirt does not concentrate. As a method, first, at every predetermined number of times of bonding, the fixing screw 5 is loosened, the pressing of the fixing screw 5 to the capillary 1 by the screw portion 5a is released, and the capillary 1 is once removed from the bonding horn 2. Remove it.

Next, while the removed capillary 1 is intermittently shifted (turned) to a predetermined angle, the upper outer peripheral portion 1a and the lower outer peripheral portion 1d of the capillary 1 are connected to the bonding horn 2 respectively. If the capillary 1 is fitted into the hole 2a and the fitting hole 2e, and the capillary 1 is tightened again with the fixing screw 5 and attached, the place where the dirt adheres to the surface of the tip 1b is shifted, so that accumulation of dirt can be prevented. it can.

Thus, the tip surface 1 of the capillary 1
It is possible to reduce dirt and abrasion on b, improve the reliability of bonding, and improve the number of serviceable bonding times of the capillary 1. In addition, since a large-scale rotating mechanism is not provided in the bonding horn 2, it is possible to prevent an increase in cost and improve the accuracy of bonding.

A wire bonding apparatus according to a second embodiment will be described with reference to FIG.

The holding table 3 used in the second embodiment and the substrate 10
, The capillary drive control unit 100, the XY drive table 110, and the bonding station 120 are the same as those in the first embodiment, and a description thereof will be omitted.

The capillary 1 is formed of a metal material in a cylindrical shape, and its lower end 1b is tapered and the upper end outer peripheral portion 1a is formed in a cylindrical shape having an outer diameter smaller than the outer diameter of the central portion 1h. It is formed and attached to the bonding horn 2. A scale mark 1e serving as a reference is provided at a predetermined angle on the upper end outer peripheral portion 1a and the upper surface, and the upper end outer peripheral portion 1a is fitted into a fitting hole 2a provided in the bonding horn 2. The position angle in the closed state is easy to understand. A small hole 1c is machined in the center of the cylinder, and a metal wire is inserted into the hole 1c.

The bonding horn 2 is made of a transparent resin material and formed into an elongated arm shape, and a front end 2c of the bonding horn 2 has a fitting hole 2 into which the outer peripheral portion 1a of the capillary 1 is fitted.
a, and a horizontal screw hole 2 b for pressing and fixing the mounted capillary 1 with a fixing screw 5.
Scale marks 2f are provided at predetermined angles on the outer front surface (having a semicircular shape) of the front end portion 2c of the bonding horn 2, and the scale mark 1e and the scale mark 2 are provided.
By making f correspond to the position angle, the position angle in the state where the capillary 1 is mounted is easily understood. The rear portion 2d of the bonding horn 2 is attached and fixed to the capillary drive control section 100.

The fixing screw 5 has a screw portion 5a which is screwed into a screw hole 2b provided in the bonding horn 2 and a knob portion 5b which can be screwed manually.
Is screwed into the screw hole 2b, the tip outer peripheral portion 1a of the capillary 1 is pressed by the screw portion 5a of the fixing screw 5, and the capillary 1 mounted on the bonding horn 2 is fixed.

Next, the procedure for assembling the present wire bonding apparatus will be described.

First, the outer peripheral portion 1a of the upper end of the capillary 1 is fitted into the fitting hole 2a of the bonding horn 2 and inserted.
Next, the fixing screw 5 is screwed into the screw hole 2 b of the bonding horn 2, and the upper end outer peripheral portion 1 a of the capillary 1 is pressed by the screw portion 5 a of the fixing screw 5.
Is attached and fixed to the bonding horn 2. The bonding horn 2 of the capillary 1 in this mounted state
The position angle to is marked by the scales 1e and 2f provided respectively. Then, the substrate 10 on which electronic components such as SMDs and bare chips are mounted is placed on the holding table 3, and the holding table 3 is attached to the bonding station 120.
Installed in

The bonding operation by this wire bonding apparatus is the same as that of the first embodiment, and the description is omitted.

In the wire bonding apparatus according to the present embodiment, dirt generated by the SMD mounting process on the substrate 10 or the cleaning process of the substrate 10 adheres to the surface of the tip 1b of the capillary 1 as shown in FIG. However, the capillary 1 is rotated so that dirt is not concentrated. First, the fixing screw 5 is once loosened from the screw hole 2b of the bonding horn 2 every predetermined number of times of bonding, and the scale 1e of the capillary 1 is set to the bonding horn 2 made of a transparent resin material. With the capillary 1 shifted (turned) from the bonding horn 2 to an arbitrary predetermined angle so as to match the scale 2f different from the previous time, the fixing screw 5 is again screwed into the screw hole of the bonding horn 2. 2b into the capillary 1
Is attached to the bonding horn 2, the tip 1b
Since the places where dirt adheres to the surface of the substrate are shifted, accumulation of dirt can be prevented.

As a result, the tip surface 1 of the capillary 1
It is possible to reduce dirt and abrasion on b, improve the reliability of bonding, and improve the number of serviceable bonding times of the capillary 1. In addition, the mounting angle can be easily adjusted while looking at the scale, and since a large-scale rotating mechanism is not provided in the bonding horn 2, the cost can be prevented and the accuracy of bonding can be improved.

Incidentally, the bonding horn 2 may not be made of a transparent material as long as the scales 1e and 2f can be visually recognized. Further, contrary to the present embodiment, a plurality of scales 2f may be provided on the capillary 1 side, and a scale 1e may be provided on the bonding horn 2 side.

A wire bonding apparatus according to a third embodiment will be described with reference to FIG.

The holding table 3 used in the third embodiment and the substrate 10
, The capillary drive control unit 100, the XY drive table 110, and the bonding station 120 are the same as those in the first embodiment, and a description thereof will be omitted. Since the fixing screw 5 is not used, the description will be omitted.

The capillary 1 is formed of a metal material in a cylindrical shape, the lower end 1b is tapered and the outer periphery 1a extending from the center to the upper part is formed in a screw shape, and the screw of the bonding horn 2 is formed. It is screwed into the hole 2a and mounted.

According to the degree of screwing, the mounting position angle of the capillary 1 to the bonding horn 2 is arbitrarily adjusted, and the outer peripheral portion 1 having the thread shape of the capillary 1 is adjusted.
The capillary 1 is attached and locked to the bonding horn 2 by a screwing press on the bonding horn 2 by a fixing nut 6 previously screwed into a. A small hole 1c is machined in the center of the cylinder, and a metal wire is inserted into the hole 1c.

The bonding horn 2 is formed of a metal material into an elongated arm shape, and has a front end 2c formed with a screw hole 2a into which the outer peripheral portion 1a having the screw shape of the capillary 1 is screwed. The rear portion 2d of the bonding horn 2 is attached and fixed to the capillary drive control section 100.

The fixing nut 6 has a screw hole 6a formed on the inner surface, and an outer peripheral portion 1a having a screw shape of the capillary 1.
The capillary 1 is mounted and locked on the bonding horn 2 in advance. The locking by the fixing nut 6 is performed by screwing the fixing nut 6 into the capillary 1 and pressing the bonding horn 2 while the capillary 1 is screwed into the bonding horn 2 at an arbitrary angle. Will be

Next, the procedure for assembling the present wire bonding apparatus will be described.

First, the fixing nut 6 is screwed into the screw-shaped outer peripheral portion 1a of the capillary 1 in advance with the screw hole 6a, and the screw-shaped outer peripheral portion 1a of the capillary 1 is attached to the bonding horn 2 in a temporarily attached state. Screw hole 2
a is screwed in so as to have an arbitrary predetermined angle. Next, the fixing nut 6 previously screwed and attached to the capillary 1 is turned into a screw until it is pressed against the bonding horn 2, and the capillary 1 is mounted and locked on the bonding horn 2 at an arbitrary angle. Then, the substrate 10 on which electronic components such as SMDs and bare chips are mounted is set on the holding table 3, and the holding table 3 is set on the bonding station 120.

The bonding operation by this wire bonding apparatus is the same as that of the first embodiment, and the description is omitted.

In the wire bonding apparatus according to the present embodiment, dirt generated by the SMD mounting process on the substrate 10 or the cleaning process of the substrate 10 adheres to the surface of the tip 1b of the capillary 1 as shown in FIG. However, the pressing of the bonding horn 2 is released by rotating the fixing nut 6 in the opposite direction every predetermined number of times of bonding, and the capillary 1 is intermittently shifted (turned) to an arbitrary predetermined angle. If the fixing nut 6 is screwed in again and pressed against the bonding horn 2 and the capillary 1 is mounted and locked on the bonding horn 2, the location of the dirt adhering to the surface of the tip 1b is displaced. Can be prevented.

Thus, the tip surface 1 of the capillary 1
It is possible to reduce dirt and abrasion on b, improve the reliability of bonding, and improve the number of serviceable bonding times of the capillary 1. Further, since a large-scale rotating mechanism is not provided in the bonding horn 2, an increase in cost can be prevented, and the accuracy of bonding can be improved. Fourth Embodiment A wire bonding apparatus according to a fourth embodiment will be described with reference to FIG. The holding table 3, the substrate 10, the capillary drive control unit 100, the XY drive table 110, and the bonding station 120 used in the fourth embodiment
The description is omitted because it is the same as the embodiment, and the description is omitted because the fixing screw 5 is not used. The capillary 1 is formed of a metal material in a cylindrical shape, and its lower end 1b is tapered and thin, the outer peripheral portion 1a extending from the lower portion to the central portion is cylindrical, and the upper outer peripheral portion 1g is smaller than the outer peripheral portion 1a. , Respectively.

An adjustment knob 7 is fitted into and attached to an outer peripheral portion 1 g of the upper end of the capillary 1.
a, the capillary 1 is attached to the bonding horn 2 with the slide plate 13 and the lock spring 8 mounted thereon.
Then, the holder 9 is inserted and mounted on the capillary 1.

The holder 9 is provided with the bonding horn 2
Is attached to the capillary 1 by pressing the lock spring 8 so as to be distorted, and the bonding horn 2 is pressed by the reaction force due to the distortion of the lock spring 8, and the capillary 1 is moved to the bonding horn 2. The mounting is locked. A small hole 1c is machined in the center of the column of the capillary 1, and a metal wire is inserted into the hole 1c.

The bonding horn 2 is formed of a metal material into an elongated arm shape, and has a front end portion 2c formed with a fitting hole 2a into which the outer peripheral portion 1a of the capillary 1 is fitted. Also the rear part 2 of this bonding horn 2
“d” is attached and fixed to the capillary drive control unit 100.

The adjustment knob 7 is formed in a disk shape and has a diameter larger than the diameter of the capillary 1 so as to be easily gripped. A fitting hole 7a is formed on the inner surface, and a screw hole is formed on the outer side surface in a lateral direction. 7b are formed, the fitting hole 7a is fitted into the outer peripheral portion 1g of the capillary 1, and the mounting screw 12 is screwed into the screw hole 7b, whereby the outer peripheral portion 1g of the capillary 1 is pressed. The adjustment knob 7 is attached and fixed to the capillary 1.

The adjustment knob 7 is used for the bonding horn 2
This is for manually adjusting the mounting position angle of the capillary 1 to the device.

The lock spring 8 is formed of a coil-shaped spring material, and the bonding horn 2 and the slide plate 1 are formed.
3 and the outer peripheral portion 1a of the capillary 1
Has been inserted.

The lock spring 8 is pressed by the holder 9 via the bonding horn 2 and is distorted.
Due to the reaction force due to this distortion, the lock spring 8 presses the bonding horn 2, and the capillary 1 is mounted and locked on the bonding horn 2 at a predetermined arbitrary angle.

The holder 9 is formed with a fitting hole 9a on the inner surface and a lateral screw hole 9b on the outer peripheral surface into which the fixing screw 11 is screwed. The holder 9 is fitted into the outer peripheral portion 1a of the capillary 1 through the fitting hole 9a, presses the bonding horn 2, and deflects the lock spring 8 through the bonding horn 2.

In a state where the lock spring 8 is distorted, the fixing screw 11 is screwed into the screw hole 9b of the holder 9 and the outer peripheral portion 1a of the capillary 1 is pressed, so that the holder 9 is attached to the capillary 1. Installed and fixed.

The slide plate 13 is formed in a donut-shaped thin plate having a fitting hole 13a formed on the inner surface thereof. The slide plate 13 is sandwiched between the adjustment knob 7 and the lock spring 8 and has an outer peripheral portion of the capillary 1. 1a. When the slide plate 13 receives the distorted reaction force of the lock spring 8 and adjusts the rotation angle of mounting the capillary 1 to the bonding horn 2 by the adjustment knob 7, the slide plate 13 and the It is used to make the contact surface with the adjustment knob 7 slippery and to easily adjust the rotation angle.

Next, the procedure for assembling the present wire bonding apparatus will be described.

First, the fitting hole 7a of the adjusting knob 7 is fitted into the outer peripheral portion 1g of the upper end of the capillary 1 by fitting, and then the fixing screw 12 is screwed into the screw hole 7b of the adjusting knob 7 to screw the capillary 1 into place. The adjustment knob 7 is attached and fixed to the capillary 1 by pressing the outer peripheral portion 1g of the upper end. Then, with the slide plate 13 and the lock spring 8 inserted into the outer peripheral portion 1a of the capillary 1, the outer peripheral portion 1a of the capillary 1 is fitted into the fitting hole 2a of the bonding horn 2,
Next, the holder 9 is fitted into the outer peripheral portion 1a from the tip side of the capillary 1 through the fitting hole 9a of the holder 9.

After the bonding horn 2 is pressed by the fitted holder 9 to distort the lock spring 8, a fixing screw 11 is screwed into a screw hole 9 b of the holder 9, and an outer peripheral portion of the capillary 1 is screwed. 1a is pressed by the fixing screw 11, and the holder 9 is attached and fixed to the capillary 1.

The reaction force due to the distortion of the lock spring 8 presses the bonding horn 2, the slide plate 13 and the adjustment knob 7, respectively, and the capillary 1 linked to the adjustment knob 7 is a predetermined arbitrary one. It is mounted and locked to the bonding horn 2 at an angle position. Then, the substrate 10 on which electronic components such as SMDs and bare chips are mounted is set on the holding table 3, and the holding table 3 is set on the bonding station 120.

The bonding operation by this wire bonding apparatus is the same as that of the first embodiment, and the description is omitted.

In the wire bonding apparatus according to the present embodiment, dirt generated in the SMD mounting process on the substrate 10 or the cleaning process of the substrate 10 adheres to the surface of the tip 1b of the capillary 1 as shown in FIG. However, every time a predetermined number of bondings are performed, the capillary 1 held by the reaction force due to the distortion of the lock spring 8 is intermittently shifted to an arbitrary predetermined angle by rotating the adjustment knob 7 (rotation). Let it do). With this rotation, the holder 9 attached and fixed to the capillary 1 also rotates. In this rotated state, the capillary 1 is pressed and held against the bonding horn 2 by the reaction force due to the distortion of the lock spring 8 (the angle of the capillary 1 in this state is shifted unless an external force for rotation is applied). Is not maintained), and the location of dirt adhering to the surface of the tip 1b is shifted, so that accumulation of dirt on the tip surface 1b can be prevented.

Thus, the tip surface 1 of the capillary 1
It is possible to reduce dirt and abrasion on b, improve the reliability of bonding, and improve the number of serviceable bonding times of the capillary 1. Further, since the mounting angle can be adjusted only by turning the adjustment knob 7, the work becomes easy. In addition, since a large-scale rotating mechanism is not provided in the bonding horn 2, an increase in cost can be prevented, and the accuracy of bonding can be improved.

A wire bonding apparatus according to a fifth embodiment will be described with reference to FIG.

FIG. 7 shows a wire bonding apparatus according to this embodiment.
5, a cleaning pad 4 is provided in advance, as shown in FIG. 5, and the capillary 1 is moved above the cleaning pad 4 as shown in FIG. Thus, the dirt on the front end surface 1b is cleaned. This embodiment may be applied to the first to fourth embodiments.

The capillary 1, the bonding horn 2, the fixing screw 5, the substrate 10, and the bonding station 120 used in the fifth embodiment are the same as those in the conventional example, so that the description will be omitted.

The holding table 3 holds the substrate 10 on which electronic components such as SMDs and bare chips are mounted, and the cleaning pad 4, and is set in a bonding station 120.

The cleaning pad 4 has a roughened surface formed by adhering a diamond powder 4c to a plate 4a molded of a ceramic resin material via an adhesive 4b, and the friction is caused by ultrasonic vibration. This is for cleaning dirt on the tip surface 1b of the capillary 1 and is set on the holding table 3.

The capillary horn control unit 100 is provided with a bonding horn 2 for controlling the vertical movement and ultrasonic vibration of the capillary 1 and the bonding horn 2 by a microcomputer. This capillary drive control unit 1
00 is installed on the XY drive table 110, and the XY drive table 110 is provided every predetermined number of times of bonding.
Is driven, the capillary drive control unit 100
Is moved, whereby the capillary 1 is moved to above the cleaning pad 4 as shown in FIG.

The XY drive table 110 has a capillary drive control unit 100 equipped with a capillary 1 and a bonding horn 2. To automatically move the capillary 1 to the bonded area, the capillary drive control unit 100 is used. Are automatically controlled in the X and Y directions. The XY drive table 110 is provided so that the capillary 1 is positioned above the cleaning pad 4 every predetermined number of times of bonding.
Is controlled. The operations of the capillary drive control unit 100 and the XY drive table 110 are controlled by a program created in advance.

Next, an assembling procedure of the present wire bonding apparatus will be described.

First, the upper end outer peripheral portion 1a of the capillary 1 is inserted into the fitting hole 2a of the bonding horn 2, and then the fixing screw 5 is screwed into the screw hole 2b of the bonding horn 2 so that the upper end outer peripheral portion of the capillary 1 is removed. 1a, the capillary 1 is mounted and fixed to the bonding horn 2.
Then, the substrate 10 on which electronic components such as SMDs and bare chips are mounted and the cleaning pad 4 provided in advance are held by the holding table 3, and the holding table 3 is set in the bonding station 120.

The bonding operation by this wire bonding apparatus is performed by using a small hole 1 provided in the center of the capillary 1.
c, insert a metal wire into the tip 1b of the capillary 1.
Is pressed against a bonding pad such as a bare chip, which is a region to be bonded, and ultrasonic vibration is applied to perform a bonding operation. In this operation, the positioning of the capillary 1 to an electronic component such as a bare chip is performed by the XY drive table 1.
10 automatically, the tip 1b of the capillary 1
The pressing of the bare chip and the like onto the bonding pad and the ultrasonic vibration are automatically performed by the capillary drive control unit 100.

Then, the XY drive table 110 moves the capillary 1 above the cleaning pad 4 as shown in FIG. Then, the capillary drive control unit 100 controls the capillary 1
Is pressed against the surface of the cleaning pad 4 and temporary bonding (friction by ultrasonic vibration) is performed to clean the tip surface 1b of the capillary 1 for dirt.

In the wire bonding apparatus according to the present embodiment, dirt generated by the SMD mounting process on the substrate 10 or the cleaning process of the substrate 10 adheres to the surface of the tip 1b of the capillary 1 as shown in FIG. However, the capillary 1 is moved to a position above the cleaning pad 4 as shown in FIG. 2A at every predetermined number of times of bonding to clean the tip surface 1b of the capillary 1 for dirt.

Thus, the tip surface 1 of the capillary 1
It is possible to reduce dirt on b, improve the reliability of bonding, and improve the number of serviceable bonding times of the capillary 1. In addition, labor for removing and rotating the capillary 1 by manual operation can be omitted, and workability can be improved.
Furthermore, since a large-scale rotating mechanism is not provided in the bonding horn 2, it is possible to prevent an increase in cost and improve the accuracy of bonding.

This embodiment can also be applied to the first to fourth embodiments.

A wire bonding apparatus according to a sixth embodiment will be described with reference to FIG.

The wire bonding apparatus of the sixth embodiment differs from the wire bonding apparatus of the fifth embodiment shown in FIG. 5 in that a cleaning pad 4 and a moving table 14 are provided in advance as shown in FIG. Then, the cleaning pad 4 is moved to a position below the capillary 1 as shown in FIG. 1B to clean the tip surface 1b of the capillary 1 from dirt. This embodiment may be applied to the first to fourth embodiments.

The capillary 1, the bonding horn 2, the cleaning pad 4, and the fixing screw 5 used in the sixth embodiment are used.
, The substrate 10 and the bonding station 120 are the same as those in the fifth embodiment, and the description is omitted.

The holding table 3 holds the substrate 10 on which electronic components such as SMDs and bare chips are mounted and the cleaning pad 4, and is set on the moving table 14.

The moving table 14 holds the holding table 3 on which the substrate 10 and the cleaning pad 4 are installed. The moving table 14 moves the cleaning pad 4 below the capillary 1 every predetermined number of times of bonding. is there. The operation of the moving table 14 is controlled by a program created in advance.

The capillary drive control unit 100 and the X
The Y drive table 110 normally controls the capillary 1 so as to bond electronic components on the substrate 10 according to a predetermined program. On the other hand,
The capillary drive control unit 100, the XY drive table 1
Reference numeral 10 controls the capillary 1 so that the cleaning pad 4 moved below the capillary 1 by the moving table 14 is also bonded.

Next, the procedure for assembling the wire bonding apparatus will be described.

First, the outer peripheral portion 1a of the upper end of the capillary 1 is inserted into the fitting hole 2a of the bonding horn 2, and then the fixing screw 5 is screwed into the screw hole 2b of the bonding horn 2 so that the outer peripheral portion of the upper end of the capillary 1 is removed. 1a, the capillary 1 is mounted and fixed to the bonding horn 2.
Then, the substrate 10 on which electronic components such as SMDs and bare chips are mounted and the cleaning pad 4 provided in advance are held by the holding table 3, and the holding table 3 is set on the moving table 14.

The bonding operation by this wire bonding apparatus is performed by using a small hole 1 provided in the center of the capillary 1.
c, insert a metal wire into the tip 1b of the capillary 1.
Is pressed against a bonding pad such as a bare chip, which is a region to be bonded, and ultrasonic vibration is applied to perform a bonding operation. In this operation, the positioning of the capillary 1 to an electronic component such as a bare chip is performed by the XY drive table 1.
10 automatically, the tip 1b of the capillary 1
The pressing of the bare chip and the like onto the bonding pad and the ultrasonic vibration are automatically performed by the capillary drive control unit 100.

Then, the moving table 14 moves the cleaning pad 4 below the capillary 1 as shown in FIG. Then, the capillary drive control section 100, the XY drive table 1
Reference numeral 10 denotes a temporary bonding (friction by ultrasonic vibration) by pressing the tip of the capillary 1 against the surface of the cleaning pad 4.
To clean the tip surface 1b of the capillary 1 for dirt.

In the wire bonding apparatus according to the present embodiment, dirt generated by the SMD mounting process on the substrate 10 or the cleaning process of the substrate 10 adheres to the surface of the tip 1b of the capillary 1 as shown in FIG. However, by moving the cleaning pad 4 to below the capillary 1 as shown in B in the figure at every predetermined number of bondings, temporary bonding (friction by ultrasonic vibration) is performed on the cleaning pad 4. The tip surface 1b of the capillary 1 is cleaned of dirt.

As a result, the tip surface 1 of the capillary 1
It is possible to reduce dirt on b, improve the reliability of bonding, and improve the number of serviceable bonding times of the capillary 1. In addition, labor for removing and rotating the capillary 1 by manual operation can be omitted, and workability can be improved.
Furthermore, since a large-scale rotating mechanism is not provided in the bonding horn 2, it is possible to prevent an increase in cost and improve the accuracy of bonding.

This embodiment can also be applied to the first to fourth embodiments.

[0109]

As described above, according to the present invention, S can be applied to the tip of the capillary without increasing the cost.
It is possible to reduce uneven adhesion and uneven wear of dirt in the MD mounting process and the substrate cleaning process, thereby improving bonding reliability and improving the number of times the capillary can be used.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a wire bonding apparatus showing a first embodiment of the present invention.

FIG. 2 is a configuration diagram of a wire bonding apparatus showing a second embodiment of the present invention.

FIG. 3 is a configuration diagram of a wire bonding apparatus showing a third embodiment of the present invention.

FIG. 4 is a configuration diagram of a wire bonding apparatus showing a fourth embodiment of the present invention.

FIG. 5 is a configuration diagram of a wire bonding apparatus showing a fifth embodiment of the present invention.

FIG. 6 is a configuration diagram of a wire bonding apparatus showing a sixth embodiment of the present invention.

FIG. 7 is a configuration diagram of a conventional wire bonding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Bonding horn 2 ... Capillary 3 ... Holder 4 ... Cleaning pad 5 ... Fixing screw 6 ... Fixing nut 7 ... Adjustment knob 8 ... Lock spring 9 ...・ Holder 10 ・ ・ ・ Substrate 11 ・ ・ ・ Fixing screw 12 ・ ・ ・ Fixing screw 13 ・ ・ ・ Slide plate 14 ・ ・ ・ Mounting table 100 ・ ・ ・ Capillary drive control unit 110 ・ ・ ・ XY table 120 ・ ・ ・ Bonding station

Claims (6)

[Claims] 1. A wire bonding apparatus comprising: a capillary; and a bonding horn rotatably supporting the capillary, and bonding a thin metal wire drawn out from a tip of the capillary to a bonded region, wherein the capillary has a cross section. A wire bonding apparatus, wherein a plurality of convex protrusions are formed, and a plurality of concave grooves are formed in the bonding horn so as to be fitted in correspondence with the convex protrusions of the capillary. 2. A wire bonding apparatus comprising: a capillary; and a bonding horn rotatably supporting the capillary, and bonding a thin metal wire drawn out from a tip of the capillary to a bonded region, wherein the capillary has a surface. Is a reference mark, and a scale mark corresponding to the scale mark of the capillary is provided on the surface of the bonding horn on which the capillary is mounted. 3. A wire bonding apparatus comprising: a capillary; and a bonding horn rotatably supporting the capillary, and bonding a thin metal wire drawn out from a tip of the capillary to a bonded area, wherein the capillary has a screw shape. Forming a screw portion having
The bonding horn is provided with a screw hole into which the capillary is screwed. 4. A wire bonding apparatus comprising: a capillary; and a bonding horn rotatably supporting the capillary, and bonding a thin metal wire drawn from a tip of the capillary to a bonded region, wherein the capillary includes A wire bonding apparatus, wherein an adjustment knob larger than the diameter of the capillary is provided, and the capillary is rotated in conjunction with rotation of the adjustment knob. 5. A wire bonding apparatus comprising: a capillary; and a bonding horn rotatably supporting the capillary, and bonding a thin metal wire drawn from a tip of the capillary to a bonding target area, wherein the wire bonding apparatus has a predetermined position. A cleaning pad provided with a roughened surface, and a capillary moving bonding means for moving the capillary to a position above the cleaning pad and performing bonding on the surface of the cleaning pad every predetermined number of times of bonding. And a wire bonding apparatus comprising: 6. A wire bonding apparatus having a capillary and a bonding horn rotatably supporting the capillary, and bonding a thin metal wire drawn out from the tip of the capillary to a bonded area, wherein the wire bonding apparatus has a predetermined position. A cleaning pad provided with a roughened surface, and a cleaning pad moving bonder for moving the cleaning pad to below the capillary and performing bonding on the surface of the cleaning pad every predetermined number of times of bonding. And a wire bonding apparatus.