JP2000228544A - Semiconductor light emitting device - Google Patents

Abstract

(57) [Problem] To provide a lens function by a resin sealing body by providing a wavelength conversion material layer for converting the emission wavelength of a semiconductor light emitting element to another wavelength on or near the surface of a primary resin sealing body. , So that the wavelength of the light emitting element is converted to a desired wavelength. The semiconductor light emitting device includes a cup (10) for housing and mounting the semiconductor light emitting element (2), a primary resin sealing body (3) for sealing the semiconductor light emitting element (2) mounted in the cup (10),
A secondary resin sealing body 6 that seals the primary resin sealing body 3 and has a lens function. A wavelength conversion material layer 4 for converting the emission wavelength of the semiconductor light emitting element to another wavelength is provided on or near the surface of the primary resin sealing body 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor light-emitting device such as a light-emitting diode having a lens-type resin-sealed body, and more particularly, to a semiconductor that converts the wavelength of light emitted from a light-emitting element and emits the light to the outside of the lens. The present invention relates to a light emitting device.

[0002]

2. Description of the Related Art In recent years, a semiconductor light emitting device which converts light emitted from a light emitting element into a wavelength and emits the light to the outside of a lens has recently been capable of emitting a neutral color of red, green, blue or a mixed color of white or the like. A device is desired. In order to realize a neutral color or a mixed color, a fluorescent substance which emits fluorescence when excited by light emission of the semiconductor light emitting element is added to the resin sealing body, and the wavelength of the light of the semiconductor light emitting element is converted to the outside of the resin sealing body. Semiconductor light emitting devices that emit light have been proposed.

For example, as shown in FIG. 5, a semiconductor light emitting device disclosed in Japanese Patent Application Laid-Open No. 7-99345 has a first lead frame 11 having a dish-shaped cup 10 at one end.
Lead frame 1 having a thin wire connection portion at one end
2 and a semiconductor light emitting element 2 fixed on the cup 10
A conductive wire 13 for electrically connecting between an electrode formed on the semiconductor light emitting element 2 and the fine wire connecting portion; a semiconductor light emitting element 2, the wire 13, the first lead frame 11, and the second lead And a resin sealing body 15 that seals one end of the frame 12.

According to this device, the light emitting element is sealed with the primary resin mixed with the fluorescent substance, and the primary resin sealing body 1 is sealed.
6 is further surrounded by a secondary resin sealing body 17, the wavelength of the light emitting element is converted to a desired wavelength in the primary resin sealing body 16, and the light is reflected by the cup 10. Since the reflected light is condensed by the lens formed by the secondary resin sealing body 17, the condensing efficiency of the converted light is improved. Also, the primary resin sealing body 1
6 is filled into the cup 10 so as to be lower than a horizontal plane at the edge of the cup 10, and light incident from the outside is
It is described that color mixing of the light emitting device can be prevented because the light is not blocked by the edge of 0 and does not reach the fluorescent substance.

However, in the semiconductor light emitting device disclosed in Japanese Patent Application Laid-Open No. 7-99345, the wavelength conversion material is mixed in the primary resin to form the primary resin sealing body 16, so that the wavelength conversion is performed in the resin. When dispersing the material, the fluorescent substance easily accumulates at the bottom of the primary resin sealing body 16 because the specific gravity of the wavelength conversion material is larger than the specific gravity of the resin, and the dispersibility of the fluorescent substance is poor. There is a disadvantage that the wavelength is not efficiently converted in the primary resin sealing body 16. In addition, there is a disadvantage that a large amount of a fluorescent substance is required, so that it becomes expensive.

Japanese Unexamined Patent Application Publication No. Hei 10-200165 discloses a semiconductor light emitting device having another configuration. In this semiconductor light emitting device, a fluorescent cover containing a fluorescent substance is attached to an outer surface of a resin sealing body that seals the semiconductor light emitting element, and the fluorescent cover has a wavelength different from light emitted from the semiconductor light emitting element. It is said that light is extracted.

However, the semiconductor light emitting device having such a configuration has a drawback that the function of the lens is impaired by the resin seal because the fluorescent cover is attached to the outer surface of the resin seal forming the lens. Also, there is a disadvantage that a white color with a uniform color tone cannot be obtained unless the concentration of the fluorescent substance is controlled on the surface of the resin sealing body due to the difference in the density of different light fluxes.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and an object of the present invention is to convert the wavelength of a light-emitting element into a desired wavelength and to collect the converted light. A semiconductor light emitting device (LED) that can improve the light efficiency, prevent color mixing of the light emitting device, and reduce the amount of the wavelength conversion material used to reduce the cost to convert the light emission of an inexpensive light emitting element to a different wavelength of light emission. ).

Another object of the present invention is to provide a semiconductor light emitting device capable of obtaining a white color having a uniform color tone without impairing the function of a lens by a resin sealing body.

[0010]

According to the first aspect of the present invention,
A cup for housing and mounting the semiconductor light emitting element, a primary resin sealing body for sealing the semiconductor light emitting element mounted in the cup, and a lens having a lens function for sealing the primary resin sealing body. A semiconductor light-emitting device comprising: a first resin-sealed body; and a surface or near the surface of the primary resin-sealed body, provided with a wavelength conversion material layer for converting the emission wavelength of the semiconductor light-emitting element to another wavelength. Therefore, the above object is achieved.

In one embodiment, the wavelength conversion material layer is formed by applying a resin composition containing a fluorescent substance, a resin and a thickener to the surface of a primary resin sealing body.

In one embodiment, the wavelength conversion material layer is formed by providing a fluorescent substance on the surface of a primary resin sealing body by vacuum evaporation.

In one embodiment, after the primary resin sealing body is filled with a resin composition containing a fluorescent substance and a resin in the cup, the resin is placed in a state where the opening side of the cup is on the lower side. It is formed by curing the composition.

In one embodiment, the primary resin encapsulant comprises a resin composition containing a fluorescent substance, a resin, microballoons having the fluorescent substance adhered to a surface thereof, and a thickener. And cured by filling.

According to a second aspect of the present invention, there is provided a cup for housing and mounting a semiconductor light emitting element, a primary resin sealing body for sealing the semiconductor light emitting element mounted in the cup, and a primary resin sealing body. A secondary resin sealing body that seals the stopper and has a lens function,
A method for manufacturing a semiconductor light emitting device having:
Filling the resin composition containing a microballoon having a fluorescent substance attached to its surface into the cup and curing the cup to form the primary resin sealing body, thereby achieving the above object. Is done.

The operation of the present invention is as follows.

In the semiconductor light emitting device of the present invention, the wavelength conversion material is not contained in the primary resin encapsulant filling the inside of the cup, and a layer of the wavelength conversion material is formed only on or near the surface thereof. A secondary resin sealing body surrounding the sealing body is provided.

Therefore, the wavelength can be converted into a desired wavelength by forming the layer of the wavelength exchange material on or near the surface of the primary resin sealing body in which the semiconductor light emitting element is sealed. The light flux emitted from the semiconductor light emitting element can be collected by a lens (secondary resin sealing body) made of resin.

By forming the wavelength conversion material layer only on or near the surface of the resin sealing body for primary filling, the amount of the wavelength conversion material used can be reduced and the cost can be reduced.

Further, by filling a resin and a resin composition containing a microballoon having a fluorescent substance adhered to its surface into a cup and curing the cup, the fluorescent substance can be uniformly dispersed in the primary resin sealing body. it can.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIG. 1 is a schematic view of a semiconductor light emitting device according to one embodiment of the present invention. This semiconductor light emitting device has a first lead frame 11 having a dish-shaped reflection cup 10 at one end.
Lead frame 1 having a thin wire connection portion at one end
2, a semiconductor light emitting device 2 made of a compound semiconductor fixed on the cup 10, a conductive wire 13 for electrically connecting an electrode formed on the semiconductor light emitting device 2 and a fine wire connection portion, A primary resin sealing body 3 filled in the cup 10 to seal the semiconductor light emitting element 2;
And a secondary resin sealing body 6 for sealing one ends of the first lead frame 11 and the second lead frame 12.

The semiconductor light emitting device 2 is die-bonded to a first lead frame 11 with a conductive paste, and wire-bonded to a second lead frame 12 with a conductive wire 13.

The primary resin encapsulant 3 is formed by curing a translucent resin such as an epoxy resin, and the light emission wavelength of the semiconductor light emitting element 2 is set on or near the surface of the primary resin encapsulant 3. A wavelength conversion material layer 4 for converting to a wavelength is provided.

This wavelength conversion material layer 4 is formed by applying a resin composition in the form of a mixture of a fluorescent substance, a resin and a thickener on the surface of the primary resin sealing body 3 and curing the resin composition.

As a method of applying the resin composition to the surface of the primary resin sealing body 3, a known application method can be adopted.

As the wavelength conversion material, known materials such as fluorescent dyes and fluorescent pigments can be used as long as they can convert the emission wavelength of the semiconductor light emitting element 2 to another wavelength. For example, there is a fluorescent substance composed of a substrate, an activator and a flux. As the substrate, an inorganic fluorescent substance such as an oxide such as a rare earth element such as zinc, cadmium, magnesium, silicon, or yttrium, a sulfide, a silicate, or a vanadate; Fluorescent substances. Activators include silver, copper,
Manganese, chromium, eurobium, zinc, aluminum, lead, phosphorus, arsenic, gold and the like can be mentioned. Examples of the flux include sodium chloride, potassium chloride, magnesium carbonate, barium chloride and the like. The addition amount of the wavelength conversion material is typically a very small amount of about 0.001 to several percent based on the resin composition.

As the semiconductor light emitting element 2, a conventionally known element that emits each color is used. For example, GaAlP-based,
If a GaP-based or GaN-based semiconductor light emitting device 2 is used,
The emission colors are red, green, and blue, respectively. Also, Ga
If the As-based semiconductor light emitting element 2 is used, an infrared light emitting device can be obtained.

The resin forming the primary resin sealing body 3 and the resin forming the secondary resin sealing body 6 may be the same or different. When the primary resin sealing member 3 and the secondary resin sealing member 6 are formed of different resins, the refractive indices of the primary resin sealing member 3 and the secondary resin sealing member 6 are sequentially reduced to refract air. It is preferable to set so as to be close to the rate. A material having a refractive index smaller than that of the semiconductor light emitting element 2 is preferably used for the primary resin sealing body 3.

The fabrication of the semiconductor light emitting device having the above structure can be performed as follows.

After the cup 10 is previously filled with a primary filling resin by pre-dipping, a powdery wavelength converting material is sprayed, and the wavelength converting material is applied to the surface of the primary resin sealing body 3 formed of the primary filling resin. The layer 4 is formed. After forming the wavelength conversion material layer 4, the resin is cured. Next, a resin for secondary filling is filled so as to surround the primary resin sealing body 3 to form a secondary resin sealing body 6 having a lens function.

In the semiconductor light emitting device thus obtained, the light flux emitted from the semiconductor light emitting element 2 as a point light source can be condensed by the lens-shaped secondary resin sealing body 6 made of resin. Moreover, it is possible to form the wavelength exchange material layer 6 on or near the surface of the primary resin sealing body 3 in which the semiconductor light emitting element 2 is sealed and convert the wavelength to a desired wavelength without impairing such characteristics. it can. Therefore, white with a uniform color tone can be obtained.

FIG. 2 shows another embodiment. Until the reflection cup 10 is filled with the primary filling resin by pre-dipping in advance, it is the same as in the embodiment shown in FIG. The resin for primary filling is once cured, and then the resin containing the wavelength conversion material is pre-dip (dipped and applied) to form a wavelength exchange material layer 5 on the surface of the primary resin sealing body 3 and cured again. .

Thereafter, a secondary resin sealing body 6 having a lens shape required by the secondary filling resin is formed, and a semiconductor light emitting device is manufactured.

In any case, a wavelength conversion material layer 4 is formed between the primary resin sealing member 3 and the secondary resin sealing member 6, and converts the emission wavelength of the semiconductor light emitting element 2 to a different wavelength. be able to.

In order to uniformly provide the wavelength conversion material on the surface of the primary resin sealing body 3 or near the surface, a resin composition obtained by mixing a wavelength conversion material, a resin and a thickener is used. It may be applied to the surface of the sealing body 3. As the thickener, for example, a known thickener such as a silicon-based thickener is used. By mixing the thickener, the dispersibility of the wavelength conversion material in the resin composition is improved.

Further, as shown in FIG. 3, the wavelength conversion material layer 4 may be formed by attaching a fluorescent substance to the surface of the primary resin sealing body 3 by vacuum evaporation.

As shown in FIG. 4, after filling the inside of the cup 10 with a resin composition containing a fluorescent substance and a resin, the resin composition is cured with the opening side of the cup 10 facing downward. By doing so, the wavelength conversion material layer 4 may be formed. That is, since the specific gravity of the wavelength conversion material is greater than that of the resin, the wavelength conversion material is deposited and hardened on the surface side (lower side) of the primary resin sealing body 3 filled in the cup 10, and Therefore, the wavelength conversion material layer 4 is formed on the surface of the primary resin sealing body 3, and a transparent resin portion is formed on the bottom of the sealing body 3 (on the bottom side of the cup 10). Also in this case, a thickener may be added to the resin composition.

Further, a resin composition containing a fluorescent substance, a resin, a microballoon having the fluorescent substance adhered to the surface thereof, and a thickener is filled in the cup 10 and cured to form a primary resin sealing body. 3 may be formed. In this case, the semiconductor conversion material adhering to the microballoon tends to migrate to the surface side of the primary resin sealing body 3 and the wavelength conversion material alone easily migrates to the bottom side of the sealing body. As a whole, the wavelength conversion material is uniformly dispersed in the stop body 3.

A plurality of wavelength converting materials may be added to and mixed with the resin composition, or one of them may be mixed with the resin composition in a state where one of them is attached to the microballoon. For example, white light is emitted by using a semiconductor light emitting element 2 that emits blue light and providing a layer of a material that converts to green and a layer of a material that converts to red on the surface side of the primary resin sealing body 3. be able to.

[0041]

According to the present invention, desired light directivity can be obtained by the shape of the lens of the cup and the secondary resin sealing body, and a decrease in luminance due to wavelength conversion can be suppressed to a minimum. .

Further, the wavelength of the light emitting element is converted to a desired wavelength, the efficiency of condensing the converted light is improved, the color mixing of the light emitting device can be prevented, and the amount of the wavelength converting material used is reduced to reduce the cost. It is possible to provide a light emitting device that converts light emission of an inexpensive light emitting element into different wavelengths. Further, it is possible to provide a semiconductor light emitting device capable of obtaining a uniform white color without impairing the function of the lens by the resin sealing body.

[Brief description of the drawings]

FIG. 1 is a schematic view illustrating a method for manufacturing a semiconductor light emitting device according to an embodiment of the present invention.

FIG. 2 is a schematic view illustrating a method for manufacturing a semiconductor light emitting device according to another embodiment of the present invention.

FIG. 3 is a schematic view of still another embodiment of the semiconductor light emitting device of the present invention.

FIG. 4 is a schematic view illustrating a method for manufacturing a semiconductor light emitting device according to still another embodiment of the present invention.

FIG. 5 is a schematic view of a conventional semiconductor light emitting device.

[Explanation of symbols]

 Reference Signs List 2 semiconductor light emitting element 3 primary resin sealing member 4 wavelength conversion material layer 6 secondary resin sealing member 10 cup 11 first lead frame 12 second lead frame

Claims (6)

[Claims] 1. A cup for housing and mounting a semiconductor light emitting element, a primary resin sealing body for sealing the semiconductor light emitting element mounted in the cup, and sealing the primary resin sealing body. A secondary resin sealing body having a lens function, comprising: a wavelength conversion material for converting the emission wavelength of the semiconductor light emitting element to another wavelength on or near the surface of the primary resin sealing body. A semiconductor light emitting device provided with a layer. 2. The semiconductor light emitting device according to claim 1, wherein the wavelength conversion material layer is formed by applying a resin composition containing a fluorescent substance, a resin, and a thickener to the surface of the primary resin sealing body. apparatus. 3. The semiconductor light emitting device according to claim 1, wherein the wavelength conversion material layer is formed by providing a fluorescent substance on a surface of the primary resin sealing body by vacuum evaporation. 4. The primary resin encapsulant fills the cup with a resin composition containing a fluorescent substance and a resin, and then cures the resin composition with the opening side of the cup facing down. The semiconductor light emitting device according to claim 1, wherein the device is formed by: 5. The method according to claim 1, wherein the primary resin sealing body includes a fluorescent substance, a resin, and a microballoon having the fluorescent substance adhered to a surface thereof.
2. The semiconductor light emitting device according to claim 1, wherein the semiconductor light emitting device is formed by filling a resin composition containing a thickener into the cup and curing the cup. 6. A cup for accommodating and mounting a semiconductor light emitting element, a primary resin sealing body for sealing the semiconductor light emitting element mounted in the cup, and sealing the primary resin sealing body. A method of manufacturing a semiconductor light emitting device having a secondary resin sealing body having a lens function, wherein a resin and a resin composition containing a microballoon having a fluorescent substance adhered to the surface thereof are filled in the cup. Forming the primary resin sealing body by curing the semiconductor light emitting device.