JP2000223460A - Wafer cleaning apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable suitably cleaning both the surface and the back of a wafer. SOLUTION: The peripheral part of a wafer W is held in a state in which a base member 2 and the wafer W are isolated with a holding member 6 installed on the base member 2. A first cleaning brush 21 for cleaning a first cleaning surface WF1 of a side facing the base member 2, out of the surface of the wafer W held with the holding member 6 is movably arranged and retained between the wafer W and the base member 2 by a first cleaning apparatus retaining arm 22, along a first cleaning surface WF1. While a wafer holding mechanism 1 and the wafer W held with the mechanism 1 are rotated by a rotating motor 11 via a hollow rotating shaft 9 linked with the base member 2, the first cleaning brush 21 is moved along the first cleaning surface WF1, by the moving power of a rotating motor 16. The first cleaning surface WF1 of the wafer W is cleaned with the first cleaning brush 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus for cleaning substrates such as semiconductor wafers, glass substrates for liquid crystal displays, glass substrates for photomasks, and substrates for optical disks.

[0002]

2. Description of the Related Art In a substrate cleaning apparatus of this type, a substrate to be cleaned is cleaned with a cleaning tool such as a cleaning brush while the substrate is held in a horizontal position by a spin chuck and rotated around a vertical axis. It is configured as follows.

Here, for example, in the case of a vacuum chuck type spin chuck, there is provided a base member having a suction surface which is in close contact with the center of one surface (usually the lower surface) of the substrate,
Further, in the case of a mechanical spin chuck, the spin chuck has a holding member for holding a peripheral portion of the substrate, and includes a base member disposed close to one surface (usually, a lower surface) of the substrate for supporting. .

The base member of the spin chuck hinders the cleaning of the cleaning surface of the substrate with a cleaning tool such as a cleaning brush. Therefore, of the surface of the substrate held by the spin chuck, the base member facing the base member. The surface (usually the lower surface) could not be cleaned. Therefore, the conventional substrate cleaning apparatus is configured to perform cleaning using only the surface (usually the upper surface) opposite to the surface facing the base member among the surfaces of the substrate held by the spin chuck. Have been.

[0005]

However, the prior art having such a structure has the following problems. For example, when cleaning both the front surface and the back surface of a substrate, conventionally, a substrate cleaning device (front surface cleaning device) that cleans the front surface of the substrate by holding the substrate with the front surface up and holding it on a spin chuck, Substrate cleaning device (back surface cleaning device) for cleaning the back surface of the substrate while holding it on the spin chuck
Then, a substrate reversing device for reversing the surface of the substrate facing upward on the front surface and the back surface is required.

[0006] First, the back surface of the substrate is cleaned by one substrate cleaning device, for example, a back surface cleaning device, and when the back surface cleaning is completed, the substrate is transported from the back surface cleaning device to the substrate reversing device, and the substrate reversing device is used. After reversing the surface of the substrate facing upward from the back surface to the front surface, a step of transporting the substrate from the substrate reversing device to the front surface cleaning device and cleaning the surface of the substrate is required.

That is, conventionally, the number of devices required for cleaning the front and back surfaces of a substrate increases, and accordingly the installation area (footprint) of the device increases, and the time required for cleaning the front and back surfaces of the substrate increases. And the throughput is reduced.

Further, for example, a substrate is taken out of a cassette in which a large number of substrates are housed in a horizontal posture with the surface facing upward, the front and rear surfaces of the substrate are washed, and then the cassette is again placed with the surface facing upward. In the case of returning to the above, it is necessary to reverse the surface of the substrate from the front surface to the back surface even before cleaning the back surface of the substrate by the back surface cleaning apparatus, which further lowers the throughput. Moreover, when a substrate reversing device for reversing the surface of the substrate facing upward from the front surface to the rear surface and a substrate reversing device for reversing the surface of the substrate facing upward from the rear surface to the front surface are separately provided, a further increase in the footprint is required. This will lead to an increase.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and provides a substrate cleaning apparatus capable of cleaning the front and rear surfaces of a substrate with a reduced footprint and improved throughput. With the goal.

[0010]

The present invention has the following configuration in order to achieve the above object. That is, the invention according to claim 1 is a substrate cleaning apparatus for performing a cleaning process on a substrate, wherein the peripheral portion of the substrate is separated from the base member in a state where the base member and the substrate are separated by a holding member provided on the base member. Substrate holding means for holding, rotation driving means for rotating the substrate holding means via a hollow rotary shaft connected to the base member, and the base member of the surface of the substrate held by the holding member A first cleaning tool for cleaning a surface facing the surface (hereinafter, this surface is referred to as a “first cleaning surface”), and the first cleaning tool between the substrate held by the holding member and the base member. A first cleaning tool supporting means for disposing a cleaning tool and movably supporting the first cleaning tool along the first cleaning surface; and a substrate held by the holding member with the base member interposed therebetween. Located in the space opposite to the space where it is located Moving drive means for driving the movement of the first cleaning tool along the first cleaning surface; moving power transmitting means for transmitting the moving power by the moving drive means via a hollow portion in the rotating shaft; It is characterized by having.

According to a second aspect of the present invention, in the substrate cleaning apparatus of the first aspect, the first cleaning tool is a cleaning brush.

According to a third aspect of the present invention, there is provided the substrate cleaning apparatus according to the second aspect, further comprising brush rotating means for rotating the cleaning brush.

According to a fourth aspect of the present invention, in the substrate cleaning apparatus according to the third aspect, the brush rotating means includes:
Brush rotation driving means disposed in a space opposite to a space in which the substrate held by the holding member is disposed with the base member interposed therebetween, for rotating and driving the cleaning brush, and a hollow portion in the rotation shaft. And a rotary power transmitting means for transmitting the rotary power by the brush rotary driving means via the rotary power transmission means.

According to a fifth aspect of the present invention, in the substrate cleaning apparatus according to any one of the first to fourth aspects, the surface of the substrate held by the holding member, the side opposite to the first cleaning surface. And a second cleaning tool for cleaning the surface.

According to a sixth aspect of the present invention, in the substrate cleaning apparatus of the fifth aspect, the second cleaning tool is a cleaning brush.

[0016]

The operation of the first aspect of the invention is as follows. The peripheral portion of the substrate is held in a state where the base member and the substrate are separated by a holding member provided on the base member constituting the substrate holding means. Among the surfaces of the substrate held by the holding member, a first cleaning tool for cleaning the first cleaning surface on the side facing the base member is provided by first cleaning tool support means.
It is movably disposed and supported between the substrate held by the holding member and the base member along the first cleaning surface.

Then, while rotating the substrate holding means and the substrate held thereon through a hollow rotary shaft connected to the base member by the rotary driving means, the moving power of the moving driving means causes the first cleaning surface to be moved. The first cleaning tool is moved along, and the first cleaning surface of the substrate is cleaned by the first cleaning tool.

The moving driving means is disposed in a space opposite to the space in which the substrate held by the holding member is disposed with the base member interposed therebetween, and the moving power by the moving driving means is transmitted by the moving power transmitting means. It is transmitted through a hollow part in the rotating shaft.

According to the second aspect of the present invention, the first cleaning surface of the substrate held by the holding member is cleaned by the cleaning brush.

According to the third aspect of the present invention, when cleaning the first cleaning surface, the cleaning brush (first cleaning tool) is further rotated by the brush rotating means.

According to the fourth aspect of the present invention, the brush rotation driving means for rotatingly driving the cleaning brush is provided in the space opposite to the space where the substrate held by the holding member is disposed with the base member interposed therebetween. The rotating power provided by the brush rotating drive means is transmitted by the rotating power transmitting means via a hollow portion in the rotating shaft.

According to the fifth aspect of the present invention, the first cleaning surface of the substrate held by the holding member is cleaned by the first cleaning tool, and the first cleaning surface of the substrate held by the holding member is cleaned. The opposite surface is cleaned with a second cleaning tool.

According to the sixth aspect of the present invention, the surface of the substrate held by the holding member, opposite to the first cleaning surface, is cleaned with the cleaning brush.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing the overall configuration of a substrate cleaning apparatus according to one embodiment of the present invention.
FIG. 3 is a plan view thereof, FIG. 3 is an enlarged vertical sectional view of the inside of the first cleaning tool support arm, and FIG. 4 is a view for explaining the principle of switching between holding and release of the substrate by the holding member.

A substrate holding mechanism 1 corresponding to a substrate holding means for holding a substrate W has a disk-shaped base member 2 and a plurality of (e.g., FIG. 2 as shown in FIG. 2). In FIG. 1, only two holding mechanisms 3 are illustrated in order to avoid complicating the drawing.

Each holding mechanism 3 is provided with a holding magnet 5 and a holding member 6 at the upper end of a support shaft 4 erected on the base member 2 so as to be rotatable around a vertical axis H. I have.
Each holding member 6 includes a support portion 7 for placing and supporting the peripheral portion of the substrate W and a holding portion 8 for pressing and holding the outer peripheral edge of the substrate W supported by the support portion 7. With such a configuration, the base member 2 and the substrate W are separated from each other so that a space sufficient for disposing a cleaning brush or the like is formed between the base member 2 and the substrate W by the holding member 6. Holds the peripheral portion of the substrate W. The switching between the holding of the substrate W by the holding member 6 (holding portion 8) and the release thereof is realized by the fluctuation of the holding magnet 5 as described later in detail.

The base member 2 is connected to a hollow rotary shaft 9 which is rotatably provided upright. This rotating shaft 9 is
A belt transmission mechanism 10 is operatively connected to a rotation motor 11 corresponding to a rotation drive unit. Rotary motor 1
By rotating the substrate 1, the substrate holding mechanism 1 and the substrate W held in a horizontal position by the rotation shaft 9 are rotated around a vertical axis J.

In the hollow portion of the rotary shaft 9, a first hollow transmission shaft 12 rotatably provided, a second hollow transmission shaft 13 rotatably provided, and a supply pipe 14 are provided. In this order, the shafts 9, 12, and 13 are provided concentrically so that the shafts 9, 12, and 13 can rotate independently around the axis J without interfering with each other.

The first transmission shaft 12 loosely inserted inside the rotation shaft 9 is linked to a rotation motor 16 corresponding to a movement driving means by a belt transmission mechanism 15 and drives the rotation motor 16 to rotate. It is configured to be rotated around the axis J.

The second transmission shaft 12 inserted inside the first transmission shaft 12
The transmission shaft 13 is connected to a rotation motor 18 corresponding to a brush rotation driving means by a belt transmission mechanism 17 so as to rotate around the axis J by driving the rotation motor 18 to rotate. .

The rotary motors 11, 16, 18
Is composed of, for example, an electric motor or an air motor.

The supply pipe 14 inserted inside the second transmission shaft 13 and the nozzle support 19 provided at the upper end thereof are provided with a gas such as an inert gas (such as nitrogen gas), A supply path (not shown) for supplying a cleaning liquid such as water is formed, and a gas supply nozzle 20a and a chemical supply nozzle arranged on the nozzle support portion 19 are provided from a gas supply source, a chemical supply source, and a pure water supply source (not shown). 20b, pure water supply nozzle 20
Gas, chemical solution, and pure water can be individually supplied to c. Each nozzle 20a, 20b, 20c is provided with a holding member 6
Of the surface of the substrate W held on the surface of the substrate W, a gas, a chemical solution, and pure water are spouted and supplied toward the vicinity of the rotation center of the first cleaning surface WF1 (the lower surface in this embodiment) which is the surface facing the base member 2. It is configured as follows.

Between the substrate W held by the holding member 6 and the base member 2, the first of the substrate W held by the holding member 6
Corresponds to a first cleaning tool for cleaning the cleaning surface WF1;
A first cleaning brush 21 for cleaning the back surface of the substrate W, such as a nylon brush, for example, is arranged at a height enough to contact the first cleaning surface WF <b> 1 of the substrate W held by the holding member 6. The first cleaning brush 21 is provided with a first cleaning tool support arm 22 corresponding to a first cleaning tool support means.
It is movably supported along the cleaning surface WF1.

The first cleaning tool support arm 22 has a first arm segment 22 that supports the first cleaning brush 21 at the tip.
a, and a second arm segment 22b whose base end is connected to and supported by the upper end of the first transmission shaft 12 so as to be integrally rotatable. The proximal end of the first arm segment 22a is rotatably connected to the distal end of the second arm segment 22b.

As shown in FIG. 3, a first power transmission mechanism 23 and a second power transmission mechanism 24 are provided in the first cleaning tool support arm 22.

The first power transmission mechanism 23 includes a pulley 30 fixed to the second arm segment 22b with the second transmission shaft 13 loosely inserted into the base end of the second arm segment 22b. Timing that is bridged between the rotation support shaft 31 vertically fixed to the base end of the first arm segment 22a, the pulley 32 fixed to the lower end of the rotation support shaft 31, and the pulleys 30, 32 And a belt 33.

Then, the rotation of the first transmission shaft 12 causes the second arm segment 22b to move in the plane J
Is pivoted about a fulcrum in a predetermined direction (for example, counterclockwise) by a predetermined angle (θ), the first arm segment 2
The diameter of the pulleys 30 and 32 and the timing belt 33 are set so that 2a swings about the rotation axis K of the rotation support shaft 31 in the opposite direction (clockwise) by twice the angle (θ × 2). And the like are designed.

The length between the center axis Q1 of the first cleaning brush 21 and the axis K (effective length of the first arm segment 22a) and the length between the axis K and the axis J ( (The effective length of the second arm segment 22b) is set to the same length L.

Thus, while bending the first and second arm segments 22a and 22b, the first cleaning brush 21 is moved along the first cleaning surface WF1 in one horizontal axis (see the locus C in FIG. 2). It can be moved linearly in the X direction (FIGS. 1 and 2). The first arm segment 22
a so that the first cleaning brush 21 can be arranged at a standby position outside the holding mechanism 3 (a position indicated by a two-dot chain line in FIGS. 1 and 2) in a state where the first arm a and the second arm segment 22b extend linearly. , The effective length L of the first and second arm segments 22a and 22b is determined.

The first power transmission mechanism 23, the first transmission shaft 12, and the belt transmission mechanism 15 correspond to the moving power transmission means in the present invention, and are held by the holding member 6 with the base member 2 interposed therebetween. First cleaning brush 2 by rotating motor 16 disposed in a space opposite to the space in which substrate W is disposed
1 is configured to be transmitted via the hollow portion of the rotating shaft 9.

The second power transmission mechanism 24 is rotatably connected to the upper end of the second transmission shaft 13 in a state where the supply pipe 14 is loosely inserted into the base end of the second arm segment 22b. Pulley 40 and second arm segment 22b
A pulley 41 rotatably supported in a state in which the rotation support shaft 31 is loosely inserted into the front end side of the inside, a timing belt 42 bridged between the pulleys 40 and 41, and a first arm segment 22a. A pulley 43 rotatably supported in a state in which the rotation support shaft 31 is loosely inserted into the base end of the rotation support shaft 31;
The first cleaning brush 21 has a hollow connecting shaft 44 for connecting the pulleys 41 and 43 so as to be integrally rotatable with the first cleaning brush 21 inserted therein, and a rotating shaft center at a tip end side in the first arm segment 22a.
A pulley 45 rotatably supported in a state of being aligned with the center axis Q1, a timing belt 46 bridged between the pulleys 43, 45, the pulley 45 and the first cleaning brush 2
1 and a connecting portion 47 connecting the first and second connecting portions 1 and 2 to each other.

Then, by rotating the second transmission shaft 13, the pulleys 40, 41, 43, 45 are passed through the timing belt 42, the connecting shaft 44, and the timing belt 46.
Is rotated, and the first cleaning brush 21 is
Are rotated about the central axis Q1.

The second power transmission mechanism 24, the second transmission shaft 13 and the belt transmission mechanism 17 correspond to the brush rotation power transmission means in the present invention, and are held by the holding member 6 with the base member 2 interposed therebetween. The rotation power of the first cleaning brush 21 by the rotation motor 18 disposed in a space opposite to the space where the substrate W is disposed is transmitted through the hollow portion of the rotation shaft 9.

A cup 50 is arranged around the substrate holding mechanism 1 and the substrate W held by the mechanism. The cup 50 is separated into a fixed lower cup 51 and an upper cup 53 which can be moved up and down by an actuator 52 such as an air cylinder.

An annular operating magnet 54 is provided on the upper cup 53.
And the annular auxiliary operation magnet 55 are provided at different height positions. The upper cup 53 is moved up and down to hold the holding magnet 5.
Of the operating magnets 54 and 55 with respect to the position, and the magnetic force from the operating magnets 54 and 55 on the holding magnet 5 according to the positional relationship causes the substrate W by the holding member 6 (holding portion 8). Can be switched between holding and releasing. This principle will be described with reference to FIG.

The holding section 8 is provided on the supporting section 7 eccentrically with respect to the axis H. Then, when the holding member 6 is rotated around the axis H, and the side surface (holding side surface) 8a on the long side from the axis H faces inward (the axis J side),
The holding portion 8 presses and urges the outer peripheral edge of the substrate W to hold the substrate W (FIG. 4B), while the side surface (release side surface) 8b on the short side from the axis H is on the inside. When the substrate W faces (the axis J side), the holding of the substrate W by the holding unit 8 is released (FIG. 4C).

The holding magnet 5 is formed of, for example, a bar-shaped permanent magnet, and is arranged such that the holding side surface 8a has the N pole. The holding magnet 5 and the holding member 6 are integrally rotated around the axis H by the support shaft 4.

On the other hand, the operating magnet 54 and the auxiliary operating magnet 55
Is constituted by an annular permanent magnet, an electromagnet arranged in an annular shape, and the like. The operating magnet 54 is arranged so that the inner side (the axis J side) is the N-pole, and the auxiliary operating magnet 55 is the inner side (shaft). Core J
Side) is arranged to be an S pole.

With the above structure, as shown in FIG. 1, the upper cup 53 is raised, and as shown in FIGS. 1 and 4 (b), when the operating magnet 54 is located on the side of the holding magnet 5. Thus, the holding magnet 5 receives a large magnetic force from the operating magnet 54. Accordingly, in the state shown in FIG. 4B, the support shaft 4, the holding magnet 5, and the holding member 6 rotate around the axis H so that the S pole of the holding magnet is attracted to the N pole of the operating magnet 54. , Holding side surface 8 on the N pole side of holding magnet 5
a is directed toward the axis J opposite to the operation magnet 54, and the substrate W is held.

When the upper cup 53 is lowered, FIG.
As shown in (c), the operating magnet 54 is positioned at a height lower than the holding magnet 5 and the auxiliary operating magnet 5
5 is located beside the holding magnet 5. At this time, the magnetic line of force of the operating magnet 54 moves from the N pole to the axis J as shown by the arrow M.
After proceeding in the direction, the direction is changed and the vehicle travels from the substantially axial center toward the upper cup 54 at the position of the holding magnet 5. Therefore, in the state shown in FIG. 4C, the S pole of the holding magnet 5 is directed toward the axis J, contrary to the state shown in FIG. 4B. Furthermore, in this embodiment, since the auxiliary operation magnet 55 is disposed with the S pole facing the holding magnet 5, a stronger force is applied so that the S pole of the holding magnet 5 faces the axis J. Will receive it. As a result, the support shaft 4, the holding magnet 5, and the holding member 6 are surely rotated around the axis H so that the S pole of the holding magnet 5 faces the axis J, and the S magnet of the holding magnet 5 is rotated. The release side surface 8b on the pole side is directed toward the axis J, and the holding of the substrate W is released.

As described above, by raising and lowering the upper cup 53, the holding and release of the substrate W can be switched.

As is apparent from the above description, the auxiliary operation magnet 55 is provided to more reliably release the holding of the substrate W, so that the operation magnet 54 alone holds and releases the substrate W. May be omitted, the auxiliary operation magnet 55 may be omitted.

As shown in FIG. 2, a support arm 61 for supporting a cleaning liquid supply nozzle 60 for supplying a cleaning liquid for cleaning the first cleaning brush 21 is provided beside the cup 50. The support arm 61 can be moved up and down by a drive mechanism 62 and can swing about a vertical axis S as a fulcrum. This moves the cleaning liquid supply nozzle 60 over the upper cup 50 and moves as shown by the arrow R in FIG. 2, and waits at the standby position inside the cup 50 and outside the holding mechanism 3. The first cleaning brush 21 can be moved above the first cleaning brush 21 and the standby first cleaning brush 21 can be cleaned with the cleaning liquid.

With the above structure, the first cleaning surface W on the side facing the base member 2 among the surfaces of the substrate W held by the holding member 6
F1 can be cleaned with the first cleaning brush 21,
In this embodiment, the substrate W held by the holding member 6 is further provided.
Of the first cleaning surface WF1 facing the base member 2
A second cleaning surface cleaning mechanism 100 for cleaning the surface WF2 opposite to the surface (the upper surface in the present embodiment, hereinafter, this surface is referred to as a second cleaning surface).

The second cleaning surface cleaning mechanism 100 is configured as follows. First, a second cleaning brush 101, such as a PVA brush, for cleaning the surface of the substrate W, which corresponds to a second cleaning tool for cleaning the second cleaning surface WF2 of the substrate W held by the holding member 6, is used. Have.

The second cleaning brush 101 is
2 and is supported by the second cleaning tool support arm 103 through the second cleaning tool support arm 103. A rotation motor 104 is provided in the support section 102, and is configured to be able to rotate the second cleaning brush 101 around its center Q2.

In the second cleaning tool supporting arm 103, a one-axis direction moving mechanism 105 such as a conveyor is provided. The support unit 1 is driven by the one-axis direction driving mechanism 105.
02, the second cleaning brush 101 can be moved linearly in the horizontal one axis direction (the X direction in FIGS. 1 and 2) along the second cleaning surface WF2 of the substrate W held by the holding member 6. It is configured to be able to.

The second cleaning tool support arm 103 is configured to be able to move up and down by a drive mechanism 106 and to be movable in the Y direction in FIG. Thereby, the second cleaning brush 1
01 can move over the upper cup 53 between a standby position outside the cup 50 and a position where the substrate W held by the holding member 6 is washed.

At a standby position of the second cleaning brush 101, a standby pot 107 is provided.
01 can be cleaned.

The holding member 6 is provided outside the cup 50.
A gas supply nozzle 108a, a chemical solution supply nozzle 108b, which ejects a gas such as an inert gas (such as a nitrogen gas), a chemical solution, and pure water toward the vicinity of the rotation center of the second cleaning surface WF2 of the substrate W held by the nozzle W. A pure water supply nozzle 108c is also provided.

Next, the operation of the embodiment apparatus having the above configuration will be described. During the non-processing in which the cleaning process is not performed on the substrate W, the first cleaning brush 21 is located at the standby position inside the cup 50 and outside the holding mechanism 3 and the cleaning liquid supply unit nozzle 60 is The first cleaning brush 21 is located above the first cleaning brush 21 and is cleaned with the cleaning liquid supplied from the cleaning liquid supply nozzle 60. In addition, the second cleaning brush 101 includes a standby pot 107.
It is housed in and washed. In this embodiment,
A well-known rotation control mechanism (not shown) for stopping the rotation of the substrate holding mechanism 1 at a predetermined position is provided, and the holding mechanism 3 is always in the positional relationship shown in FIG.
Is stopped, so that the first cleaning brush 21 can be moved between the outside and the inside of the holding mechanism 3 without interfering with the holding mechanism 3.

When performing the cleaning process on the substrate W,
The cleaning liquid supply nozzle 60 is retracted outside the cup 50,
The first cleaning brush 21 is moved to a predetermined position inside the holding mechanism 3. The predetermined position is, for example, the first cleaning brush 2
1 is a position where the central axis Q1 coincides with the axis J. Then, the upper cup 53 is lowered to make each holding member 6 protrude above the upper cup 53. In this state, the substrate W before the cleaning process is carried in by a substrate transport device (not shown),
The peripheral portion of the substrate W is placed on the support portion 7 of each holding member 6,
The substrate W is delivered to each holding member 6 with the surface facing upward.

When the transfer of the substrate W is completed and the substrate transfer device is retracted, the upper cup 53 is raised. This allows
As described above, the substrate W is held by each holding member 6 (see FIGS. 1 and 4B).

Next, the second cleaning brush 101 is pulled up from the standby pot 107 and the substrate W held by the holding member 6 is lifted.
Is moved to a predetermined position on the second cleaning surface WF2. The predetermined position is, for example, the center axis Q2 of the second cleaning brush 101.
Is a position that coincides with the axis J.

Then, the rotation motor 11 is driven to rotate, and the substrate holding mechanism 1 and the substrate W held thereby are rotated around the axis J via the rotation shaft 9, and each nozzle 20 a,
The first cleaning brush 21 is brought into contact with the first cleaning surface WF1 while supplying a cleaning liquid (chemical solution, pure water) or gas to both the front and back surfaces of the substrate W according to a predetermined procedure from 20b, 20c, 108a, 108b, 108c. In this state, the first cleaning surface WF1 is reciprocated between the center and the peripheral portion thereof along the first cleaning surface WF1, and the second cleaning brush 101 is brought into contact with the second cleaning surface WF2. By reciprocating between the center and the peripheral edge of the second cleaning surface WF2 along the cleaning surface WF2, the front and back surfaces of the substrate W are simultaneously cleaned. At this time, the first cleaning brush 21 and / or the second cleaning brush 101 may be rotated around Q1 and Q2.

The cleaning liquid supplied near the center of rotation of the first and second cleaning surfaces WF1 and WF2 is spread over the entire first and second cleaning surfaces WF1 and WF2 by centrifugal force.
At this time, since the peripheral speed of the rotation center of the first and second cleaning surfaces WF1 and WF2 is “0”, the cleaning liquid tends to remain there, but the gas ejected from the gas supply nozzles 20a and 108a causes The cleaning liquid remaining at the rotation centers of the first and second cleaning surfaces WF1 and WF2 is blown off to the periphery, and the cleaning liquid remaining at the rotation centers of the first and second cleaning surfaces WF1 and WF2 can be prevented.

In the above-mentioned cleaning, the centers Q1 and Q2 of the first and second cleaning brushes 21 and 101 are moved along the same moving locus (trajectory C shown in FIG. 2). 2 Move the cleaning brushes 21 and 101 to the same movement start position (the center Q of the first and second cleaning brushes 21 and 101).
1 and 2 at the same moving speed from the position where Q2 coincides with the axis J), and the first and second cleaning brushes 2 sandwich the substrate W.
The first and second cleaning brushes 21 and 101 may be moved while always maintaining the state in which the first and second cleaning devices 101 face each other. By moving the first and second cleaning brushes 21 and 101 in this manner, the deflection of the substrate W can be suppressed, and the amount of pressing of the cleaning brushes 21 and 101 with respect to the substrate W can be made uniform over the entire surface of the substrate. The entire back surface can be uniformly cleaned.

When the cleaning of the substrate W is completed, first,
The center Q1, Q2 of the second cleaning brush 21, 101 is the substrate W
The first and second cleaning brushes 21 and 1
01 is stopped and the nozzles 20a, 20b, 20
The supply of the cleaning liquid or gas from c, 108a, 108b, and 108c is stopped, and the rotation of the substrate holding mechanism 1 (substrate W) is stopped. Then, the second cleaning brush 101 is returned to the standby pot 107.

Thereafter, the upper cup 53 is lowered. This releases the holding of the substrate W by the holding member 6 as described above (see FIG. 4C). Then, the substrate W subjected to the cleaning process is received from the holding member 6 by the substrate transport device, and is carried out of the device.

As described above, according to the present embodiment, both the front and back surfaces of the substrate W can be cleaned by one apparatus.
When cleaning both the front and back surfaces of the substrate W, a substrate reversing device, which is conventionally required, is not required. In addition, cleaning of the front and back surfaces of the substrate W, which is conventionally performed by two devices, a front surface cleaning device and a back surface cleaning device, is performed. This can be performed by only one apparatus, and the number of apparatuses required for cleaning both the front and back surfaces of the substrate W can be greatly reduced, and the footprint can be extremely reduced. Further, according to the present embodiment, since the cleaning of the front and back surfaces of the substrate W can be performed at the same time, the step of inverting the front surface and the back surface of the substrate W can be omitted, and the cleaning is performed twice for each side. Steps can be performed at the same time, and the transfer of the substrate to a plurality of apparatuses can be omitted. Therefore, the processing time for cleaning the front and back surfaces of the substrate W can be greatly reduced, and the throughput can be greatly reduced. Can be improved.

Further, according to the present embodiment, both the front and back surfaces of the substrate W can be simultaneously cleaned with a cleaning brush suitable for each surface.

Further, according to the present embodiment, the first cleaning surface WF
A rotating motor 16 for driving the movement of the first cleaning brush 21 along the first member 1 is disposed in a space opposite to the space where the substrate W held by the holding member 6 is arranged with the base member 2 interposed therebetween; Since the moving power of the rotary motor 16 is transmitted by the belt transmission mechanism 15, the first transmission shaft 12, and the first power transmission mechanism 23 through the hollow portion in the rotation shaft 9, the moving power is held by the holding member 6. Substrate W and base member 2
Can be reduced, and the space can be prevented from being complicated, and the rotating motor 16 serving as a source of particles can be kept away from the substrate W to be cleaned. Pollution can also be prevented.

Further, according to this embodiment, the rotation of the substrate holding mechanism 1 by the rotary motor 11 is performed via the rotary shaft 9 connected to the base member 2 constituting the substrate holding mechanism 1. In addition, the rotating motor 11 serving as a source of particles can be kept away from the substrate W to be cleaned, and the contamination of the substrate W can be further prevented.

According to the present embodiment, the rotary motor 18 for rotating the first cleaning brush 21 is connected to the base member 2.
Is disposed in a space opposite to the space in which the substrate W held by the holding member 6 is arranged, and the rotation power of the rotation motor 18 is transmitted by the belt transmission mechanism 17, the second transmission shaft 13, and the second transmission shaft 13. Since the power transmission mechanism 24 is configured to transmit the power via the hollow portion in the rotating shaft 9, it is possible to prevent the space between the substrate W held by the holding member 6 and the base member 2 from becoming complicated. In addition, the rotation motor 18 serving as a particle generation source can be kept away from the substrate W to be cleaned to further prevent contamination of the substrate W.

Further, according to the present embodiment, the first and second cleaning brushes 21 and 101 are configured to be rotatable, so that the first and second cleaning surfaces WF1 and WF2 are cleaned by the first and second cleaning brushes. It can be performed while rotating 21, 101,
Various and high-precision cleaning of the first and second cleaning surfaces WF1 and WF2 can be performed.

In the above-described embodiment, the cleaning is performed by holding the substrate W with the surface thereof facing upward, but the first cleaning brush 21 is configured by a cleaning brush for cleaning the surface of the substrate W. If the second cleaning brush 101 is constituted by a cleaning brush for cleaning the rear surface of the substrate W, it is also possible to perform cleaning while holding the rear surface of the substrate W upward.

The nozzles 20a-20c, 108a-
The number of 108c and the type of supply fluid may be appropriately changed.

Further, in the above embodiment, the rotation motor 18 for rotating the first cleaning brush 21 is connected to the base member 2.
Is arranged in a space opposite to the space where the substrate W held by the holding member 6 is arranged, and the rotation power of the rotation motor 18 is transmitted through a hollow portion in the rotation shaft 9. However, for example, the rotation motor 18 may be provided in the first cleaning tool support arm 22 so that the rotation power is transmitted by a belt transmission mechanism or the like.

In the above embodiment, the first cleaning tool supporting arm 22 is constituted by articulated arms 22a and 2b.
The first cleaning brush 21 is moved along the first cleaning surface WF1 by bending and extending the articulated arms 22a and 22b. For example, a mechanism as shown in FIGS. 5 and 6 is used. It is also possible to move the first cleaning brush 21.

FIG. 5A shows the first cleaning tool support arm 22.
, A driven pulley 70 rotatably connected to the first transmission shaft 12, a driven pulley 71, and these pulleys 70 and 7.
1 and the conveyor 72 and the first cleaning brush 21 are connected via the connecting portion 47 to rotate the first transmission shaft 12 around the axis J. Thus, the first cleaning brush 21 is configured to be moved in one horizontal axis direction.

FIG. 5B shows a state in which a worm gear 80 is attached to the upper end of the first transmission shaft 12, and a screw shaft 81 meshing with the worm gear 80 is horizontally arranged in the first cleaning tool support arm 22. And a guide shaft 82
Is arranged. Further, a nut 83 provided on the connecting portion 47 supporting the first cleaning brush 21 is screwed to the screw shaft 81, and a guide portion 84 provided on the connecting portion 47 is slidably inserted through the guide shaft 82. Then, the first transmission shaft 12
Is rotated about the axis J, the rotation about the vertical axis J is converted by the worm gear 80 into rotation about the horizontal axis, and the screw shaft 81 is rotated, so that the first cleaning brush 21 is moved horizontally. It is configured to move in one axis direction.

FIG. 6 shows that the first cleaning tool support arm 22 is connected to the base arm 22c, and the base end of the swing arm 22d is connected to the distal end of the base arm 22c via the rotating shaft 90. With the vertical axis P deviated from J as the fulcrum,
Swing arm 22 supporting first cleaning brush 21 at the tip
It is configured to swing d. Base arm 22
A belt transmission mechanism 91 that transmits the rotation of the first transmission shaft 12 to the rotation support shaft 90 is provided in c. Accordingly, when the first transmission shaft 12 is rotated around the axis J, the swing arm 22d is swung around the axis P, and the first cleaning brush 21 is rotated as shown by an arrow F in FIG. To the first cleaning surface W
It can be moved in an arc along F1 (between the center and the peripheral portion of the first cleaning surface WF1).

The first cleaning brush 21 can be moved by another mechanism.

The second cleaning brush 101 can also be moved along the second cleaning surface WF2 except for the configuration shown in the above embodiment.

For example, utilizing the horizontal movement of the second cleaning tool support arm 103 in the Y direction by the drive mechanism 106, the second
It is also possible to move the cleaning brush 101 in the Y direction along the second cleaning surface WF2. According to this configuration, the one-axis direction driving mechanism 105 can be omitted.

Further, the second cleaning tool support arm 103 can be moved up and down, and the base end is rotated around a vertical axis at a position outside the cup 50 to swing around the axis. If the second cleaning brush 101 is supported at the tip of the second cleaning tool support arm 103, the second cleaning brush 10
1 can be moved in an arc along the second cleaning surface WF2 (between the center and the peripheral portion of the second cleaning surface WF2).

In the above embodiment, the rotation motor 11
Is transmitted by the belt transmission mechanism 10, but the rotation shaft 9 may be rotated by a rotation motor 160 as shown in FIG. 7, for example. In the rotary motor 160, an annular rotor 162 rotatable with respect to the stator 161 is provided concentrically inside the annular stator 161. Then, the rotating shaft 9 is inserted into a hollow portion at the center of the rotor 162, and the rotor 102 and the rotating shaft 9 are connected so as to be integrally rotatable. Thus, the rotation power of the rotation motor 160 can be directly transmitted to the rotation shaft 9 without using the belt transmission mechanism.

Also, with the same configuration, the first transmission shaft 1
The second and second transmission shafts 13 may be configured to rotate.

Further, in the above embodiment, the cup 50 is divided into the lower cup 51 and the upper cup 53, and only the upper cup 53 can be moved up and down. For example, as shown in FIG.
The cup 50 may be formed as a single unit, and the entire cup 50 may be moved up and down.

In FIGS. 1 and 8, etc.
The configuration may be such that the 0 (upper cup 53) side is fixed and the substrate holding mechanism 1 side is moved up and down.

Further, for example, when the entire cup 50 and the substrate holding mechanism 1 are configured to be able to move up and down relatively, for example,
As shown in FIG. 8, the support shaft 4 of the holding mechanism 3 is connected to the base member 2.
The holding magnet 5 is provided below the base member 2 so that the operating magnet 54 can be more axially centered than the holding magnet 5.
It may be arranged on the side.

In the configuration shown in FIG. 8, the polarity of the holding magnet 5 is reversed from that in the above embodiment (the holding side surface 8a side of the holding portion 8 is set to S pole), and the polarity of the operation magnet 54 is set to S axis on the axis J side. If it is a pole, the entire cup 50 and the substrate holding mechanism 1 are moved up and down relatively to release the holding of the substrate W when the holding member 6 is projected above the cup 50, and the substrate holding mechanism 1 When housed in the cup 50, the substrate W can be held.

In the above configuration, the entire cup 50 and the substrate holding mechanism 1 are moved up and down relative to each other so that the holding member 6
Is projected above the cup 50, the holding magnet 5
Auxiliary operation magnet 55 may be provided so as to be located on the side of. In this case, the polarity of the auxiliary operation magnet 55 may be such that the side of the axis J is the N pole.

In the above embodiment, the holding and release of the substrate W by the holding member 6 are switched by using the magnetic force. However, the holding and release of the substrate W by the holding member 6 are switched by another mechanism. May be configured.

In the above embodiment, the six holding mechanisms 3
Although the (holding member 6) is provided, the number of holding members is not limited thereto, and the substrate W can be held if three or more holding members 6 are provided.

In the above embodiment, all the holding members 6
Is movable, that is, the posture is changed (rotated around the axis H)
Thus, the configuration is such that switching between holding and release of the substrate W is performed. However, among the plurality of holding members 6, at least one holding member 6 only needs to be movable, and the remaining holding members 6 are fixed, that is, A configuration that is fixed to the base member 2 and does not change may be used. For example, as shown in FIG. 8, the fixed holding member 6 includes a support portion 7 that supports the peripheral portion of the substrate W on an upper end portion of the support shaft 4 fixed to the base member 2 and a support portion 7 that supports A holding member 6 having an abutting portion 600 that abuts on the outer peripheral edge of the substrate W is attached.
When the substrate W is pressed against the holding portion 8 of the movable holding member 6, the substrate W is held between the holding portion 8 of the movable holding member 6 and the contact portion 600 of the fixed holding member 6. And hold it.

The structure of the holding member 6 is not limited to that of the above-described embodiment. For example, the holding member 6 may be configured such that an upper claw and a lower claw configured to be vertically movable can hold the peripheral portion of the substrate W therebetween. There may be.

The base member 2 is not limited to a disk-shaped member, but is formed, for example, in a star shape, and is configured so that a holding mechanism 3 is provided at a distal end portion of a portion extending radially around the base member. Is also good.

In the above embodiment, the first cleaning tool is constituted by the cleaning brush. However, instead of the cleaning brush, another cleaning tool such as an ultrasonic cleaning nozzle or a high-pressure jet nozzle may be used as the first cleaning surface WF1. And the cleaning tool may be used to clean the first cleaning surface WF1. Similarly, the second cleaning tool may be constituted by a cleaning tool other than the cleaning brush. Further, the first cleaning tool and the second cleaning tool may be of the same type, or different types, for example, the first cleaning tool is configured by a cleaning brush, and the second cleaning tool is configured by an ultrasonic cleaning nozzle. You may do so.

In the above embodiment and its modifications, the second embodiment
Although the cleaning surface cleaning mechanism 100 is provided to simultaneously clean both the front and back surfaces of the substrate W, the second cleaning surface cleaning mechanism 1 is used.
00, the first of the substrate W held by the holding member 6
A device that can clean only the cleaning surface WF1 may be used. According to such an apparatus, the first cleaning surface WF1 of the substrate W facing the base member 2 which has conventionally been unable to be cleaned by the cleaning tool because the base member is in the way is cleaned by the first cleaning tool. It is possible.

Therefore, if the substrate cleaning apparatus having such a configuration and the conventional substrate cleaning apparatus are provided, it is possible to clean the front and back surfaces of the substrate W without reversing the surface of the substrate W. Therefore, when cleaning the front and back surfaces of the substrate W, the substrate reversing device can be omitted, the number of devices required for cleaning the front and back surfaces of the substrate W can be reduced, and the footprint can be reduced accordingly. can do.
In addition, the step of inverting the surface of the substrate W can be omitted, and the transfer of the substrate to the substrate inverting device is not required. Throughput can be improved as compared with the conventional case.

In the above-described embodiment and the modification, the substrate W is held above the base member 2.
A configuration in which the substrate W is held below the base member 2 may be employed.

[0103]

As is apparent from the above description, according to the first aspect of the present invention, the state in which the base member and the substrate are separated by the holding member provided on the base member constituting the substrate holding means. The first cleaning tool for cleaning the first cleaning surface on the side facing the base member of the surface of the substrate held by the holding member is held by the first cleaning tool support means. The substrate holding means and the substrate holding means are movably disposed and supported between the substrate held by the member and the base member along the first cleaning surface, and are connected to the base member by a rotation driving means via a hollow rotary shaft. Since the first cleaning tool is moved along the first cleaning surface by the moving power of the moving driving unit while rotating the held substrate, the cleaning is conventionally performed by the cleaning tool because the base member is in the way. Can do Surface on the side of the substrate facing never been a base member (the first cleaning surface) has become possible to clean the first cleaning member.

Therefore, if the apparatus for cleaning a substrate according to the first aspect of the present invention and the conventional apparatus for cleaning a substrate are provided, the front and back surfaces of the substrate can be cleaned without reversing the surface of the substrate. it can. Therefore, when cleaning both the front and back surfaces of the substrate, the substrate reversing device can be omitted, the number of devices required for cleaning the front and back surfaces of the substrate can be reduced, and the footprint can be reduced accordingly. In addition, the step of inverting the surface of the substrate can be omitted, and the transfer of the substrate to the substrate inverting device becomes unnecessary, so that the time required for cleaning both the front and back surfaces of the substrate can be reduced, and the throughput can be improved You can also.

According to the first aspect of the present invention, the movement driving means for driving the movement of the first cleaning tool along the first cleaning surface is provided on the substrate held by the holding member with the base member interposed therebetween. Is arranged in the space on the opposite side of the space in which is disposed, and the moving power by the moving driving means is transmitted by the moving power transmitting means through the hollow portion in the rotating shaft, so that the moving power is held by the holding member. The number of members arranged in the space between the substrate and the base member can be reduced, and the space can be prevented from being complicated, and the movement driving means serving as a source of particles can be kept away from the substrate to be cleaned, Substrate contamination can also be prevented.

Further, according to the first aspect of the present invention,
Since the rotation of the substrate holding means by the rotation driving means is performed via the rotation shaft connected to the base member constituting the substrate holding means, the rotation driving means serving as a source of particles is kept away from the substrate to be cleaned. It is possible to further prevent contamination of the substrate.

According to the second aspect of the present invention, the first cleaning surface of the substrate held by the holding member can be cleaned with the cleaning brush.

According to the third aspect of the present invention, a brush rotating means for rotating the cleaning brush (first cleaning tool) is further provided, so that the cleaning of the first cleaning surface can be performed while rotating the cleaning brush. Therefore, various and high-precision cleaning of the first cleaning surface can be performed.

According to the fourth aspect of the present invention, the brush rotation driving means for rotating and driving the cleaning brush is disposed in a space opposite to the space where the substrate held by the holding member is disposed with the base member interposed therebetween. The rotating power transmitted by the brush rotation driving means is arranged to be transmitted through the hollow portion in the rotating shaft by the rotating power transmission means, so that the space between the substrate held by the holding member and the base member is reduced. The complexity can be avoided, and the brush rotation driving means, which is a source of particles, can be kept away from the substrate to be cleaned, thereby further preventing contamination of the substrate.

According to the fifth aspect of the present invention, the apparatus further includes the second cleaning tool for cleaning the surface of the substrate held by the holding member on the side opposite to the first cleaning surface. Thus, both the front and back surfaces of the substrate can be cleaned at the same time. Therefore, the number of devices required for cleaning the front and back surfaces of the substrate can be further reduced, the footprint can be further reduced accordingly, the time required for cleaning the front and back surfaces of the substrate can be further reduced, and the throughput can be reduced. Can be further improved.

According to the sixth aspect of the present invention, the surface of the substrate held by the holding member, opposite to the first cleaning surface, can be cleaned with the cleaning brush. Therefore, it is possible to simultaneously clean the front and back surfaces of the substrate with a cleaning brush, or to clean one surface of the substrate with a cleaning brush and the other surface with a cleaning tool other than the cleaning brush. Various cleanings can be performed on the front and back surfaces of the device.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing an overall configuration of a substrate cleaning apparatus according to one embodiment of the present invention.

FIG. 2 is a plan view of the apparatus according to the embodiment.

FIG. 3 is an enlarged vertical sectional view of the inside of a first cleaning tool support arm.

FIG. 4 is a diagram for explaining the principle of switching between holding and release of a substrate by a holding member.

FIG. 5 is a longitudinal sectional view showing a schematic configuration of a modification of the mechanism for moving the first cleaning brush along the first cleaning surface.

FIG. 6 is a longitudinal sectional view and a plan view showing a schematic configuration of another modification of the mechanism for moving the first cleaning brush along the first cleaning surface.

FIG. 7 is a longitudinal sectional view illustrating a schematic configuration of a modified example of a rotation motor that rotates a rotation shaft.

FIG. 8 is a longitudinal sectional view showing a schematic configuration of a modified example of a cup, a holding member, a switching mechanism for holding and releasing a substrate, and the like.

[Explanation of symbols]

 1: substrate holding mechanism 2: base member 6: holding member 9: rotating shaft 10, 15, 17: belt transmission mechanism 11, 16, 18: rotating motor 12: first transmission shaft 13: second transmission shaft 21: First cleaning brush 22: First cleaning tool support arm 23: First power transmission mechanism 24: Second power transmission mechanism 101: Second cleaning brush W: Substrate WF1: First cleaning surface WF2: Second cleaning surface

Claims (6)

[Claims] 1. A substrate cleaning apparatus for performing a cleaning process on a substrate, comprising: a substrate holding unit configured to hold a peripheral portion of the substrate in a state where the base member and the substrate are separated by a holding member provided on the base member. A rotation driving unit that rotates the substrate holding unit via a hollow rotary shaft connected to the base member; and a surface of the substrate held by the holding member that faces the base member ( Hereinafter, this surface is referred to as a “first cleaning surface”), and the first cleaning device is disposed between the base member and the substrate held by the holding member. A first cleaning tool supporting means movably supporting the first cleaning tool along the first cleaning surface; and a space opposite to a space where the substrate held by the holding member is disposed with the base member interposed therebetween. The first cleaning surface is disposed in the side space, Moving drive means for driving the movement of the first cleaning tool along; and moving power transmitting means for transmitting moving power by the moving driving means via a hollow portion in the rotating shaft. Substrate cleaning equipment. 2. The substrate cleaning apparatus according to claim 1, wherein the first cleaning tool is a cleaning brush. 3. The substrate cleaning apparatus according to claim 2, further comprising brush rotating means for rotating said cleaning brush. 4. The substrate cleaning apparatus according to claim 3, wherein the brush rotating unit is disposed in a space opposite to a space where the substrate held by the holding member is arranged with the base member interposed therebetween. A brush rotation driving means for rotating and driving the cleaning brush; and a rotation power transmission means for transmitting rotation power by the brush rotation driving means through a hollow portion in the rotation shaft. Substrate cleaning equipment. 5. The substrate cleaning apparatus according to claim 1, wherein, of the surfaces of the substrate held by the holding member, a surface of the substrate opposite to the first cleaning surface is cleaned. 2. A substrate cleaning apparatus further comprising a cleaning tool. 6. The substrate cleaning apparatus according to claim 5, wherein the second cleaning tool is a cleaning brush.