JP2000222550A - Non-contact data carrier and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce a non-contact data carrier which has less warp and surface ruggedness and is superior in printability. SOLUTION: Internal parts 3 are interposed between first resin sheets 31a which has an elastic modulus lower than that of second resin sheets 32a which form an outer layer. Next, second resin sheets 32a are put over both sides of first resin sheets 31a, and they are subjected to hot press to form second resin layers, which have a modulus of bending elasticity higher than that of the first resin layer, on both faces of the first resin layer, thus forming a sealing resin layer 30 where internal parts 3 are sealed. Thereafter, they are stamped out into a prescribed size to obtain a contactless data carrier.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-contact data carrier and a method for manufacturing the non-contact data carrier. More specifically, the present invention relates to a non-contact data carrier which has an IC chip as a main internal component and transmits and receives signals to and from an external device in a non-contact manner, and a method for manufacturing the non-contact data carrier.

[0002]

2. Description of the Related Art A non-contact data carrier system is composed of a transponder which is called a non-contact data carrier and an interrogator connected to a host. , Induction electromagnetic field, microwave (radio wave)
It is characterized in that communication is performed in a non-contact manner via a transmission medium such as the one described above. This non-contact data carrier system possesses a transponder or attaches it to various articles, remotely reads information about the person or article possessed by the interrogator and provides it to the host, and performs information processing on the person or article. Realize.

[0003] As an information transmission system of a non-contact data carrier system, an electromagnetic coupling system, an electromagnetic induction system, a microwave system, an optical communication system, and the like are generally known. Among these methods, in the electromagnetic coupling method, the electromagnetic induction method, and the microwave method, the energy of the transmission signal from the interrogator can be used as the driving power of the transponder. Since the transmission signal itself can be used as a drive source, there is no deterioration in response capability due to a decrease in battery output as compared with other similar systems that require a drive source such as a battery in the transponder. There is a great advantage that there is no limit on the use of the transponder due to battery life.

FIG. 3 shows an overall schematic configuration of a contactless data carrier system. As shown in FIG. 1, the contactless data carrier system includes an interrogator 10 and a transponder (contactless data carrier) 20.

The interrogator 10 includes a main controller 11 for controlling the entire interrogator 10, an interface 11 for controlling data input / output with the host device, and tag information received from the non-contact data carrier 20. Read / store
A storage unit 13 such as a writable RAM, for converting transmission information from a parallel signal to a serial signal;
The signal conversion unit 14 converts the received signal from the serial signal 0 into a parallel signal from a serial signal, and converts the transmission signal into, for example, ASK (Am
Plitude Shift Keying) method, FSK (Frequency Shif)
t Keying) Modulation unit 1 that modulates the signal for transmission using the method
5, a demodulation unit 16 for demodulating a received signal, a transmission antenna 17, and a reception antenna 18.

The transponder (contactless data carrier) 20
A main control unit 21 for controlling the entire non-contact data carrier 20, a storage unit 22 such as an EEPROM for storing tag information which does not require a power supply backup, converting transmission information from a digital signal to an analog signal, and an interrogator 10; A signal converter 23 for converting a received signal from an analog signal to a digital signal, a modulator 24 for modulating a transmission signal into a signal for transmission by an ASK method, an FSK method or the like, and a demodulator 25 for demodulating a received signal. , A transmission antenna 26, and a reception antenna 27.

The basic communication procedure of this contactless data carrier system is as follows. First, the interrogator 10
An interrogation signal for reading tag information from the non-contact data carrier 20 is issued. The contactless data carrier 20
When it enters the receivable range of the interrogation signal, it receives it,
The tag information stored in the storage unit 22 is transmitted as a response signal. The interrogator 10 receives and decodes this response signal and sends it to the host device as tag identification information.

FIG. 4 is a plan view showing a schematic configuration of such a transponder 20, and FIG. 5 is a sectional view showing a schematic configuration of the transponder 20. As described above, the transponder 20 (non-contact data carrier) is mainly composed of an antenna and a circuit component for transmitting and receiving signals to and from the interrogator 10, and usually takes into consideration durability and environmental resistance. The transmission / reception antenna 2 and the internal components 3 such as the circuit components 1 are hermetically sealed by a resin layer 4 or the like. As the transmitting / receiving antenna 2, a coil formed of a copper conductor is frequently used in terms of price and productivity, and as the circuit component 1, for example, a copper circuit pattern and a terminal portion are formed on the surface of an epoxy substrate 1a. In general, an IC chip 1b is wire-bonded. Usually, two end wires (conductor portions) of a coil formed of a copper wire having an outer diameter of 30 to 200 μm are connected to the terminal portion of the circuit component 1 by welding or soldering. As a resin material for hermetically sealing these internal components 3, a thermoplastic resin such as a vinyl chloride resin, a polyethylene terephthalate resin, an acrylonitrile-butadiene-styrene copolymer resin, or an epoxy resin, a phenol resin, or a silicone resin Thermosetting resin is used. In the figure, 1c is an IC chip 1
b shows a conducting wire connecting the antenna 2.

The transponder 20 is normally sealed by sandwiching the coil (transmitting / receiving antenna 2) and the circuit component 1 between two resin sheets made of a thermoplastic resin or a thermosetting resin. That is, the resin sheets are overlapped from above and below the transmitting / receiving antenna 2 and the circuit component 1, and the internal component 3 is sandwiched between the two resin sheets.

Next, the transmitting / receiving antenna 2 and the circuit component 1 are hermetically sealed by the resin layer 4 by further sandwiching the resin sheet sandwiching the internal component 3 between two stainless steel plates and hot pressing the stainless steel plate from both sides. After that, the transponder 20 is manufactured by punching it into a predetermined size.

[0011]

By the way, in recent years, the non-contact data carrier 20 has been increasingly required to have a good warp and smoothness due to a reduction in thickness. If these are bad, the printability will be poor and the card will be difficult to use.

However, when a product is press-molded, warpage is likely to occur due to the difference in thermal shrinkage between the transmitting / receiving antenna 2 and the sealing resin layer. To suppress this warpage, it is effective to use a resin with a high elastic modulus to increase the strength of the resin layer.However, increasing the strength of the sealing resin layer leads to low fluidity during pressing and damage to inner layer parts. It was easy to occur, causing defective products.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a non-contact data carrier which has less card warpage and surface irregularities, has excellent printability, and a method of manufacturing the same.

[0014]

According to the present invention, the bending elastic modulus of the second resin layer (outer layer) is made higher than the bending elastic modulus of the first resin layer (inner layer). Another object of the present invention is to provide a non-contact data carrier excellent in card warpage and surface smoothness.

A non-contact data carrier according to the present invention includes a circuit component including a storage element for storing information, an antenna for transmitting and receiving signals to and from an external device in a non-contact manner, and electrically connecting the antenna and the circuit component. In a card-shaped non-contact data carrier in which an internal component in which a lead wire portion connected to the internal component is disposed on substantially the same plane is sealed with a sealing resin layer, the sealing resin layer includes a first resin layer, A second resin layer provided on both sides of the first resin layer, wherein a flexural modulus of the second resin layer is higher than a flexural modulus of the first resin layer. I have.

According to a second aspect of the present invention, the first resin layer (inner layer) of the sealing resin layer has a flexural modulus of 5,000 to 30,000 kg / cm ^2. On the other hand, the flexural modulus of the second resin layer (outer layer) is 30,000.
８０80,000 kg / cm ² .

Further, the invention according to claim 3 is characterized in that the first and second resin layers are thermoplastic resin layers.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a non-contact data carrier, wherein the first resin is provided on an upper surface and a lower surface of an internal part. After laminating the resin sheets forming the layers, the resin sheet forming the second resin layer is sandwiched between the resin sheets sandwiching the internal components, and the internal components are sealed by hot pressing. And

According to a fifth aspect of the present invention, the first resin layer (inner layer) of the sealing resin layer has a flexural modulus of 5,000 to 30,000 kg / cm ^2. On the other hand, the flexural modulus of the second resin layer (outer layer) is 30,000.
８０80,000 kg / cm ² .

The invention according to claim 6 is characterized in that the first and second resin layers are thermoplastic resin layers.

[0021]

FIG. 1 is a sectional view showing the structure of a non-contact data carrier according to the present invention, and FIG. 2 is an explanatory sectional view showing a method of manufacturing the non-contact data carrier. As shown in FIG. 1, the non-contact data carrier 20 includes an internal component 3 including a circuit component 1 and a transmitting / receiving antenna 2 and a sealing resin layer 30.
Is sealed. The circuit component 1 is formed by forming a copper circuit pattern and a terminal portion on the surface of an epoxy substrate 1a and soldering an IC chip 1b thereto. The IC chip 1b incorporates each functional circuit unit except the transmitting / receiving antenna 2 in the configuration of the transponder shown in FIG. As the transmitting / receiving antenna 2, for example, a coil made of copper is used.

In the non-contact data carrier 20 shown in FIG. 1, the sealing resin layer 30 for sealing the internal components 3 is formed on both surfaces of the first resin layer 31 with the internal components 3 interposed therebetween. This is a three-layer structure in which 32 and 32 are formed. The second resin layer 32 is configured to have a higher flexural modulus than the first resin layer 31. Further, in the non-contact data carrier 20, the internal component 3 is embedded in the first resin layer 31.

That is, as a method of manufacturing the non-contact data carrier 20, the internal component 3 is
In order to adopt a method of sealing the internal component 3 by sandwiching the inside and hot pressing, it is important to use a resin having higher fluidity from the viewpoint of reducing unevenness. On the other hand, if the internal components are sealed only with a resin having a high fluidity, the surface smoothness and the warpage will deteriorate.

Therefore, in the present invention, the sealing resin layer 30 for sealing the internal component 3 is composed of an inner layer having a low elastic modulus, that is, the first resin layer 31, and an outer layer having a higher elastic modulus, that is, the first resin layer 31. By having a three-layer structure with two resin layers 32,
It is intended to reduce surface irregularities and to reduce warpage.

That is, since the second resin layer 32 has a structure having a higher flexural modulus than the first resin layer 31, the first resin flows at the time of hot pressing, and the resin is quickly dispersed around the internal component 3. To form a smooth resin layer, and at the same time, the second resin layer improves planar smoothness and warpage.

The first resin layer 31 and the second resin layer 3
As the resin used for the second resin layer 2, for example, the first resin layer 3
1 (inner layer) is made of PETG (copolymer of polycyclohexylene terephthalate), PVC (polyvinyl chloride), A
There are thermoplastic resins such as BS (acrylonitrile-butadiene-styrene copolymer resin), as well as hot melt adhesives of acrylic, polyolefin, polyester and thermoplastic resins. The second resin layer 32 (outer layer)
There are PVC, PET, ABS and the like.

At this time, the second resin layer 32 preferably has a higher flexural modulus than the first resin layer 31. That is, while the flexural modulus of the thermoplastic resin of the first resin layer (inner layer) is 5,000 to 30,000 kg / cm ² ,
The flexural modulus of the thermoplastic resin of the resin layer (outer layer) is 30,
000-80,000 kg / cm ² . Here, the flexural modulus of the first resin layer (inner layer) is preferably 10,000.
0 to 25,000 kg / cm ² , more preferably 15.0 kg / cm ²
It is preferably from 00 to 20,000 kg / cm ² . On the other hand, the flexural modulus of the second resin layer (outer layer) is preferably 35,000 to 75,000 kg / cm ² , more preferably 40,000 to 70,000 kg / cm ² . That is optimal.

Even if the first and second resin layers are made of the same resin, the present invention can be applied to the present invention as needed by changing the elastic modulus by filling with a molecular weight or an inorganic filler. An adhesive can be used when heat fusion is not performed using a combination of different materials.

As described above, the combination of the resin forming the second resin layer 32 and the resin having a high elastic modulus is not particularly limited. For example, the second resin layer 32 may be formed of a polyvinyl chloride resin ( PVC), first resin layer 31
As a combination of amorphous polyester resins. In particular, it is preferable to use a polyvinyl chloride resin for the second resin layer 32. This is because the use of a polyvinyl chloride resin makes it possible to obtain an inexpensive surface with excellent printability.

The amorphous polyester resin has good fluidity, and generally, the elastic modulus of the amorphous polyester resin is smaller than that of the polyvinyl chloride resin. Therefore, the non-contact data carrier 2 is less warped even when hot pressed.
This has the advantage that it can be easily manufactured into a flat plate. Examples of the amorphous polyester resin include a copolymer of polycyclohexylene terephthalate (PCT) and polyethylene terephthalate (PET).

The non-contact data carrier 20 of the present invention is manufactured, for example, as follows.

First, the terminal of the circuit component 1 and the transmitting / receiving antenna 2 are electrically connected by a conductor (coil end line) so that the circuit component 1 and the transmitting / receiving antenna 2 are arranged on substantially the same plane. The internal component 3 is manufactured. Next, the internal component 3 is sandwiched between first resin sheets 31 a having a low elastic modulus, which form the first resin layer 31.

Next, a second resin sheet 32a having a higher flexural modulus than the first resin sheet 31a is superposed on the outer surface of the first resin sheet 31a superposed so as to sandwich the internal component 3. , The second resin sheet 32
The first resin sheet 31a sandwiching the internal component 3 is sandwiched by a.

Each of the first resin sheet 31a and the second resin sheet 32a has a thickness of 0.1 mm.
Those having a size of about 01 mm to 0.30 mm are preferably used. If the thickness is less than 0.01 mm, it is not easy to handle. On the other hand, if the thickness exceeds 0.30 mm, the thickness of the obtained sealing resin layer 30, that is, the thickness of the non-contact data carrier 20 is made constant. Becomes difficult. Further, in the present invention, two types of resin sheets 31a and 32a are overlapped from the upper and lower surfaces of the internal component 3, and the internal component 3 is sandwiched and hot pressed. For this reason, it is difficult to set the thickness of the non-contact data carrier 20 to a certain value or less with a thick resin sheet exceeding 0.30 mm.
A resin sheet of 5 mm to 0.2 mm is used.

In this manner, the internal component 3 is replaced with the first resin sheet 3
After being sandwiched in a sandwich shape by 1a and further sandwiched by a second resin sheet 32a, hot pressing is performed. The hot pressing is performed on the second resin sheet 32.
a, which is sandwiched between a pair of stainless steel plates 51 from the outer surface side under a constant pressure and a constant temperature, and a second resin layer having a high flexural modulus is provided on both surfaces of the first resin layer 31 having a low flexural modulus. The sealing resin layer 30 provided with 32 is formed. Thereafter, the non-contact data carrier 20 in the form of a card is formed by punching into a predetermined size.

In this method, at the time of hot pressing, the first resin sheet 31a having higher fluidity quickly flows out, rapidly surrounds the periphery of the internal component 3, and the relatively flat first resin layer 31 is formed. It is formed. And the second
The resin layer 32 is formed integrally with the first resin layer 31. As a result, the non-contact data carrier 20 with less unevenness on the surface and less warpage is obtained.

[0037]

Next, an embodiment will be described.

(Example 1) A plane dimension of mounting a 400 μm-thick IC chip 1b is 5 mm × 5 mm, and a thickness is 0.3 mm.
Circuit board 1 and an antenna 2 formed of a copper wire having an outer diameter of 25 μm and wound in a loop shape having a diameter of 15 mm and a thickness of 0.3 mm by welding using a copper conducting wire 1 c having an outer diameter of 25 μm. The internal component 3 was produced. This internal part 3 is formed of a 150 μm thick resin sheet 31 a (bending elastic modulus 2) made of Sunroid Vip PETG (trade name, manufactured by Tsutsunaka Plastics Co., Ltd.) which is a copolymer of PCT and PET
3,000 kg / cm ² ). Next, on both surfaces of the resin sheet 31a, a 250 μm thick resin sheet 32a (trade name “M sheet” manufactured by Unitika Co., Ltd.) having an elastic modulus increased by filling PET with an inorganic filler (flexural modulus 4
000 kg / cm ² ).

Thereafter, the stainless steel plates 51, 51 are superimposed on the outer surface of the resin sheet 32a, respectively, heated at 130 ° C., heated at a pressure of 10 kg / cm ² for 10 minutes, pressurized, and cooled to room temperature. As a result, a sheet-like sealed internal component was obtained. Finally, this internal component sealed body is punched out,
A contactless data carrier in card form was obtained.

(Example 2) A plane dimension of mounting a 400 μm-thick IC chip 1 b is 5 mm × 5 mm, and a thickness is 0.3 mm.
Circuit board 1 and an antenna 2 formed of a copper wire having an outer diameter of 25 μm and wound in a loop shape having a diameter of 15 mm and a thickness of 0.3 mm by welding using a copper conductive wire 1 c having an outer diameter of 25 μm. The internal component 3 was produced. This internal component 3 is formed of a 200 μm thick resin sheet 31a made of Sunroid Vip PETG (trade name, manufactured by Tsutsunaka Plastics Co., Ltd.), which is a copolymer of PCT and PET (flexural modulus 2
5,000 kg / cm ² ) Insert.

Next, PET is filled with an inorganic filler on both sides of the resin sheet, and a 200 μm thick resin sheet 32a (bent) made of Sunroid Vip PVC (trade name, manufactured by Tsutsunaka Plastics Co., Ltd.) having a higher elastic modulus than PETG. The modulus of elasticity was 40,000 kg / cm ² ).

Thereafter, the stainless steel plates 51, 51 are superimposed on the outer surface of the PVC sheet, respectively, and heated and pressurized at a pressure of 10 kg / cm ² for 10 minutes while heating to 110 ° C., and then cooled to room temperature. A sheet-shaped sealed internal component was obtained. Finally, the internal component sealed body was punched to obtain a card-shaped non-contact data carrier.

Comparative Example 1 A non-contact data carrier card was molded under the same conditions as in Example 1 using PETG for both the first and second resin layers.

Comparative Example 2 A non-contact data carrier card was molded under the same conditions as in Example 1 using a PVC sheet (trade name, manufactured by Tsutsunaka Plastics Co., Ltd.) for both the first and second resin layers.

The warpage of the non-contact data carrier card and the responsiveness of the internal parts produced under the conditions shown in Examples 1 and 2, Comparative Example 1 and Comparative Example 2 are shown in Table 1. Was.

[0046]

[Table 1] As can be seen from Table 1, the non-contact data carrier card according to the present invention has a small warpage without damaging the internal components and has a good response.

[0047]

According to the present invention, the sealing resin layer for sealing the internal component comprises a second resin layer having a high flexural modulus as an outer layer and a first resin having a low flexural modulus as an inner layer. Since it is formed of a layer, it is possible to obtain a non-contact data carrier with less surface irregularities and warpage during molding.

Further, since a non-contact data carrier with less unevenness and warpage can be obtained, the surface has excellent printability.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a configuration of a contactless data carrier of the present invention;

FIG. 2 is an explanatory view showing a method of manufacturing the non-contact data carrier of FIG. 1,

FIG. 3 is a block diagram showing a general overall configuration of a contactless data carrier system;

FIG. 4 is a plan view showing the configuration of the contactless data carrier of FIG. 3;

FIG. 5 is a sectional view showing the configuration of the non-contact data carrier of FIG. 3;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Circuit component 2 ... Transmission / reception antenna 3 ... Internal component 20 ... Non-contact data carrier 30 ... Sealing resin layer 31 ... First resin layer 31a ... Resin sheet 32 ... Second resin layer 32a ... Second resin sheet 51 ... Stainless steel plate

Claims (6)

[Claims] A circuit component including a storage element for storing information, an antenna for transmitting and receiving a signal without contacting an external device, and a conductor for electrically connecting the antenna and the circuit component are substantially provided. In a card-shaped non-contact data carrier in which internal components arranged on the same plane are sealed with a sealing resin layer, the sealing resin layer includes a first resin layer and a first resin layer. A non-contact data carrier, comprising: a second resin layer provided on both sides; a flexural modulus of the second resin layer being higher than a flexural modulus of the first resin layer. 2. The flexural modulus of the first resin layer of the sealing resin layer is 5,000 to 30,000 kg / cm ² , and the flexural modulus of the second resin layer is 30,000 kg / cm ² . ~ 80,0
^2. The non-contact data carrier according to claim 1, wherein the carrier is 00 kg / cm ² . 3. The non-contact data carrier according to claim 1, wherein the first and second resin layers are thermoplastic resin layers. 4. A circuit component including a storage element for storing information, an antenna for transmitting / receiving a signal in a non-contact manner with an external device, and a conductor part for electrically connecting the antenna and the circuit component are substantially formed. A method for manufacturing a card-shaped non-contact data carrier in which an internal component arranged on the same plane is sealed with a sealing resin layer, wherein the first resin layer is provided on upper and lower surfaces of the internal component. After laminating the resin sheets to be formed, sandwiching the outside of the resin sheet sandwiching the internal component with the resin sheet forming the second resin layer, and sealing the internal component by hot pressing. A method for manufacturing a non-contact data carrier. 5. The flexural modulus of the first resin layer of the sealing resin layer is 5,000 to 30,000 kg / cm ² , and the flexural modulus of the second resin layer is 30,000 kg / cm ² . ~ 80,0
5. The method for producing a non-contact data carrier according to claim 4, wherein the pressure is 00 kg / cm ² . 6. The method for manufacturing a non-contact data carrier according to claim 4, wherein said first and second resin layers are thermoplastic resin layers.