JP2000216012A - Manufacture of surface mounting detection resistor - Google Patents
Manufacture of surface mounting detection resistorInfo
- Publication number
- JP2000216012A JP2000216012A JP11054501A JP5450199A JP2000216012A JP 2000216012 A JP2000216012 A JP 2000216012A JP 11054501 A JP11054501 A JP 11054501A JP 5450199 A JP5450199 A JP 5450199A JP 2000216012 A JP2000216012 A JP 2000216012A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- resistance
- strip material
- detection resistor
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000000956 alloy Substances 0.000 claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 229910000510 noble metal Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000005304 joining Methods 0.000 claims description 2
- 229910001120 nichrome Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 3
- 229910001316 Ag alloy Inorganic materials 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 238000005520 cutting process Methods 0.000 claims 1
- 239000002305 electric material Substances 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000002788 crimping Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 101000777301 Homo sapiens Uteroglobin Proteins 0.000 description 1
- 102100031083 Uteroglobin Human genes 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は抵抗合金よりなる抵抗素
子部と比抵抗値の小さい金属導体よりなる接続端子部を
圧着、メッキ等で端子部を結合してなる抵抗素子、特に
電気抵抗を小さくする目的で使用される低抵抗の製法、
並びにこの方法により作製された抵抗素子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistance element formed by bonding a resistance element part made of a resistance alloy and a connection terminal part made of a metal conductor having a small specific resistance by crimping, plating or the like. Low resistance manufacturing method used for the purpose of making small,
Further, the present invention relates to a resistance element manufactured by this method.
【０００２】[0002]
【従来の技術】大電流の測定には低抵抗、或いはミリオ
ーム領域の抵抗を用いて電圧降下を測定するか、金属性
の抵抗素子をより高導電率の二つの金属接続端子部の間
に接続した抵抗素子が用いられている。また一般的には
四端子法では、電流用端子と電圧用端子がそれぞれ別個
に設けられた抵抗素子が使用されている。2. Description of the Related Art For measuring a large current, a voltage drop is measured using a low resistance or a resistance in a milliohm region, or a metallic resistance element is connected between two metal connection terminals having higher conductivity. A resistance element is used. In general, in the four-terminal method, a resistance element in which a current terminal and a voltage terminal are separately provided is used.
【０００３】[0003]
【発明が解決しようとする課題】従来技術では、この様
な素子の作製は異種金属の接合が素子作製後、端子部を
半田、溶接等で接続する場合、オーミック・コンタクト
が充分得られない欠点があった。この欠点の改善にクラ
ッド接合を採用する事により、高精度の抵抗素子の製作
が容易になった。According to the prior art, such a device is manufactured by a disadvantage that when the terminals of the dissimilar metals are connected by soldering, welding, or the like after the device is manufactured, a sufficient ohmic contact cannot be obtained. was there. By adopting clad bonding to improve this defect, it has become easy to manufacture a highly accurate resistance element.
【０００４】[0004]
【課題を解決するための手段】異種金属の接合が抵抗用
合金とその長さ方向の一端面あるいは両端面に沿って導
電性金属を端面同士溶接する方法は、曲げ加工を伴うと
工程で抵抗値の安定性に欠ける欠点があった。A method for welding a conductive metal to one end surface or one end surface of a resistance alloy along one or both end surfaces in a longitudinal direction is a method of joining a dissimilar metal to a resistance alloy. There was a disadvantage that the stability of the value was lacking.
【０００５】[0005]
【０００６】[0006]
【請求項１】本発明を図面を参照して以下詳細説明す
る。抵抗合金の帯状材料と、その長さ方向の一端面あ
るいは両端面に沿って銅の帯上材料とを連続的に圧着
して一体化した帯状材料とし、次いで帯状材料の長さ方
向を横断するように各素子を任意の個数ずつ切断分離し
た後、素子数と同数の絶縁基板を耐熱接着剤（ポリイミ
ド樹脂等）を用いて基板と帯状金属板を固着した後、個
々の素子両端部を基板両端面に沿って［コ］の字型に折
り曲げる。次いで素子表面を絶縁皮膜（高粘度ポリイミ
ド樹脂）で絶縁保護した後、両端子部を一括、ハンダメ
ッキし素子を一個ずつ分離切断する。The present invention will be described below in detail with reference to the drawings. A strip material of a resistance alloy and a copper strip material are continuously pressed along one or both end faces in the length direction to form an integrated strip material, and then traverse the length direction of the strip material. After each element is cut and separated by an arbitrary number as described above, the same number of insulating substrates as the number of elements are fixed to the substrate and the strip-shaped metal plate using a heat-resistant adhesive (polyimide resin or the like), and then both ends of each element are bonded to the substrate. Fold it in the shape of [U] along both end faces. Next, after the element surface is insulated and protected with an insulating film (high-viscosity polyimide resin), both terminals are collectively solder-plated to separate and cut the elements one by one.
【０００７】[0007]
【請求項２】本発明は電気材料と銅合金、及び銀、金等
の貴金属合金の接合がオーミック・コンタクトし難い抵
抗合金母材（例えばニクロム系合金材料）の場合は、母
材の表面にニッケル鍍金を中間層とした後、貴金属合金
を圧着接合ある事により、安定した接合クラッド材が得
られる為、安定した低抵抗値の面実装検出用抵抗器の作
製が容易となる。2. The present invention relates to a resistance alloy base material (for example, a nichrome alloy material) in which an electrical material and a copper alloy or a noble metal alloy such as silver or gold are hardly in ohmic contact. After the nickel plating is used as the intermediate layer, by bonding the noble metal alloy by pressure bonding, a stable bonding clad material can be obtained, thereby facilitating the production of a stable low-resistance surface mount detection resistor.
【０００８】[0008]
【発明の効果】本発明の電気抵抗は抵抗素子部と接続端
子部との接続を圧着によるクラッド法をおこなっている
ので非常に安定した、抵抗素子が製作可能である。また
帯状材料の為、連続加工が容易で二端子、及び四端子加
工の機械的にも、電気的にも安定した面実装用検出抵抗
器の量産が容易となる。According to the electric resistance of the present invention, an extremely stable resistance element can be manufactured because the connection between the resistance element part and the connection terminal part is performed by the clad method by crimping. In addition, since the belt-shaped material is used, continuous processing is easy, and the mass production of two-terminal and four-terminal processing mechanically and electrically stable detection resistors for surface mounting becomes easy.
【図１】素子の平面図及び傾面図FIG. 1 is a plan view and an inclined view of an element.
【図２】素子の断面図FIG. 2 is a sectional view of an element.
【符号の説明】 金属板 クラッド材 絶縁基板 接着剤 絶縁保護材料[Explanation of symbols] Metal plate Clad material Insulating substrate Adhesive Insulation protection material
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E032 BA12 BB01 CA02 CC03 CC05 CC11 CC14 CC16 DA01 5E336 AA04 BB01 BB02 CC32 CC43 CC52 GG11 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E032 BA12 BB01 CA02 CC03 CC05 CC11 CC14 CC16 DA01 5E336 AA04 BB01 BB02 CC32 CC43 CC52 GG11
Claims (6)
一端面あるいは両端面に沿って銅の帯上材料とを連続
的に圧着して一体化した帯状材料とし、次いで帯状材料
の長さ方向を横断するように各素子を一個ずつ切断分離
する事を特徴とする製造方法。1. A strip material of a resistance alloy and a copper strip material are continuously pressed together along one end face or both end faces in the longitudinal direction of the strip material to form an integrated strip material. A method of cutting and separating each element one by one so as to cross the length direction.
て、該抵抗合金帯状材料に導体状材料を電気メッキ（無
電解メッキを含む）により結合させることを特徴とする
製造方法。2. The method of manufacturing an electric resistor according to claim 1, wherein a conductive material is bonded to said resistance alloy strip material by electroplating (including electroless plating).
て、該抵抗合金帯状材料に導体状材料を電気材料として
銅、銀合金を用いて作製した面実装検出用抵抗器。3. A surface mount detecting resistor according to claim 1, wherein said conductive material is made of copper or silver alloy as an electric material.
て、該抵抗合金帯状材料に導体状材料を電気材料として
銅合金、及び銀、金等の貴金属合金の接合がオーミック
・コンタクトし難い、抵抗合金母材（例えばニクロム系
合金材料）の場合は、母材の表面にニッケル鍍金を中間
層として積層した後、貴金属合金帯を接合して作製した
面実装検出用抵抗器。4. A method of manufacturing an electrical resistor according to claim 1, wherein the conductive material is used as an electrical material and the copper alloy and a noble metal alloy such as silver or gold are joined to the resistance alloy strip material by ohmic contact. In the case of a resistive alloy base material (for example, a nichrome-based alloy material) that is difficult, a surface-mounting detection resistor manufactured by laminating nickel plating as an intermediate layer on the surface of the base material and then joining a noble metal alloy band.
と絶縁物の基板を接着し、次いで、電気抵抗両端面を基
板端面に沿って折り曲げ、更に基板両端裏面に折り曲げ
素子として面実装が容易な面実装検出用抵抗器。5. The claim 1.2.3.4. 3. A surface-mounting detection resistor, which is formed by bonding an electric resistance and an insulating substrate described in the above item, and then bending both end surfaces of the electric resistance along the substrate end surface, and furthermore, easily bending the surface as a bending element on both back surfaces of both ends of the substrate.
リイミド型｛（Ａ−Ｂ）ｍ（Ｃ−Ｄ）ｎ｝ｐを用いた面
実装検出用抵抗器。6. A surface mount detection resistor using a block polyimide type {(AB) m (CD) n} p as an adhesive according to claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11054501A JP2000216012A (en) | 1999-01-26 | 1999-01-26 | Manufacture of surface mounting detection resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11054501A JP2000216012A (en) | 1999-01-26 | 1999-01-26 | Manufacture of surface mounting detection resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000216012A true JP2000216012A (en) | 2000-08-04 |
Family
ID=12972391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11054501A Pending JP2000216012A (en) | 1999-01-26 | 1999-01-26 | Manufacture of surface mounting detection resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000216012A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003107361A1 (en) * | 2002-06-13 | 2003-12-24 | ローム株式会社 | Chip resistor having low resistance and its producing method |
| WO2004001774A1 (en) * | 2002-06-19 | 2003-12-31 | Rohm Co., Ltd. | Chip resistor having low resistance and its producing method |
| JP2005286167A (en) * | 2004-03-30 | 2005-10-13 | Koa Corp | Laminated alloy for resistance, and manufacturing method thereof |
-
1999
- 1999-01-26 JP JP11054501A patent/JP2000216012A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003107361A1 (en) * | 2002-06-13 | 2003-12-24 | ローム株式会社 | Chip resistor having low resistance and its producing method |
| US7342480B2 (en) | 2002-06-13 | 2008-03-11 | Rohm Co., Ltd. | Chip resistor and method of making same |
| WO2004001774A1 (en) * | 2002-06-19 | 2003-12-31 | Rohm Co., Ltd. | Chip resistor having low resistance and its producing method |
| US7221254B2 (en) | 2002-06-19 | 2007-05-22 | Rohm Co., Ltd. | Chip resistor having low resistance and method of making the same |
| JP2005286167A (en) * | 2004-03-30 | 2005-10-13 | Koa Corp | Laminated alloy for resistance, and manufacturing method thereof |
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