JP2000215291A - Non-contact IC card and method of manufacturing the same - Google Patents

Abstract

(57) [PROBLEMS] To achieve excellent productivity and reduce costs without using a conductive adhesive, solder, anisotropic conductive film, or the like. SOLUTION: At the time of mounting an electronic circuit portion having at least an IC chip mounted thereon such that an antenna coil is formed on a substrate by a plating method and electrically connected to the antenna coil, Forming an underlying pattern having conductivity in the shape, arranging the terminals of the electronic circuit portion so as to be in contact with the underlying pattern, and plating using the underlying pattern, the underlying pattern and the electronic circuit portion A plating film is formed so as to cover the terminals.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card in which at least an electronic circuit section on which an IC chip is mounted and an antenna coil connected to the electronic circuit section are formed on a base material, and a method of manufacturing the same. About.

[0002]

2. Description of the Related Art Conventionally, an IC on which an IC chip is mounted
As a card, a so-called non-contact IC card, which transmits and receives information to and from a terminal device in a non-contact manner, has attracted attention.
Since the non-contact IC card transmits and receives information in a non-contact state with the terminal device, it is possible to avoid inconveniences such as contamination and damage of terminal portions of the IC chip, and the demand for the non-contact IC card is rapidly increasing.

More specifically, in this non-contact IC card, information is transmitted and received to and from a terminal device using an electromagnetic wave as a medium. That is, in this non-contact IC card, information is superimposed on an electromagnetic wave, and information is exchanged with the terminal device. Therefore, an antenna coil for receiving electromagnetic waves is formed in this non-contact IC card.

As shown in FIG. 5, such a conventional non-contact IC card has, for example, an antenna coil 100 formed in a coil shape by a so-called plating method, and an inner peripheral end portion 100a of the antenna coil 100. And an electronic circuit portion 101 connected to the outer peripheral side end portion 100b. Further, in this non-contact IC card, the electronic circuit section 101 is mounted on the outer peripheral side of the antenna coil 100 in a region where the coil is not formed.

At this time, in the conventional non-contact IC card,
The inner peripheral end portion 100 is set so as to cross the antenna coil 100.
A lead wire 102 was formed from a, and this lead wire 102 was connected to the electronic circuit unit 101. Therefore, in this non-contact IC card, an insulating layer 103 is formed in a predetermined area of the antenna coil 100 so that the lead wire 102 and the antenna coil 100 are not short-circuited, and the lead wire 102 is formed on the insulating layer 103. Had formed.

In the conventional IC card configured as described above, information superimposed on electromagnetic waves can be transmitted and received between the externally arranged terminal device and the electronic circuit unit 101.
At this time, the non-contact IC card receives and transmits the electromagnetic wave on which the information is superimposed via the antenna coil 100.

[0007] Specifically, when an electromagnetic wave on which information is superimposed is applied to the antenna coil 100, a current corresponding to the information is generated. As a result, in the non-contact IC card, information is written in the electronic circuit unit 101. In the non-contact IC card, when transmitting information, a current corresponding to the information is supplied from a power supply built in the electronic circuit unit 101. Thereby, the antenna coil 1
At 00, a predetermined current flows, and an electromagnetic wave on which information is superimposed is generated.

[0008]

By the way, in the above-mentioned non-contact IC card, the antenna coil 10
In forming 0, a plating method has been used. That is, when the antenna coil 100 is formed, first, a conductive underlying pattern having the same shape as the antenna coil is formed, and thereafter, plating is performed using the underlying pattern, and plating is performed so as to cover the underlying pattern. A film was formed. As a result, the antenna coil 100 is formed as a plating film formed on the underlying pattern.

[0009] In the non-contact IC card described above,
The electronic circuit unit 101 is mounted so as to be in electrical contact with the antenna coil 100 formed as described above. Specifically, the electronic circuit unit 101 was electrically connected to the antenna coil 100 via a conductive adhesive, solder, an anisotropic conductive film, or the like.

However, as described above, the electronic circuit section 10
In the non-contact IC card on which the electronic circuit unit 10 is mounted, the electronic circuit 10
1 is cumbersome and has a problem of low productivity. In addition, there is also a problem that the use of such a conductive adhesive, solder, or anisotropic conductive film increases the cost.

Accordingly, the present invention has been made in view of the above-mentioned situation, and has achieved excellent productivity and reduced cost without using a conductive adhesive, solder or anisotropic conductive film. And a method of manufacturing the same.

[0012]

A non-contact IC card according to the present invention, which has solved the above-mentioned problems, comprises at least an electronic circuit section on which an IC chip is mounted and an antenna coil connected to a terminal of the electronic circuit section. A non-contact IC card formed on a base material, wherein the antenna coil has conductivity and is formed by plating a base pattern formed in the shape of the antenna coil with the base pattern. The terminal of the electronic circuit portion is formed so as to be in contact with the base pattern and to be covered with the plating film.

In the contactless IC card according to the present invention configured as described above, the terminals of the electronic circuit section are in contact with the base pattern and are covered with the plating film. Therefore, the electronic circuit portion is securely mounted, and the terminals of the electronic circuit portion are electrically connected to the plating film.

Further, the method of manufacturing a non-contact IC card according to the present invention, which has solved the above-mentioned problem, comprises forming an antenna coil on a substrate by plating and electrically connecting the antenna coil to the antenna coil. In a method of manufacturing a non-contact IC card for mounting an electronic circuit section on which an IC chip is mounted, a conductive base pattern is formed in the shape of the antenna coil, and terminals of the electronic circuit section are brought into contact with the base pattern. And a plating film is formed so as to cover the base pattern and the terminals of the electronic circuit section by plating using the base pattern.

In the method of manufacturing a non-contact IC card according to the present invention having the above-described configuration, when forming an antenna coil using a base pattern, a plating film is formed so as to cover the terminals of the electronic circuit portion and the base pattern. Is formed. Thus, in this method, the antenna circuit is formed at the same time as the antenna coil is formed by plating.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a non-contact IC card according to the present invention will be described below in detail with reference to the drawings.

The contactless IC card shown in this embodiment is
As shown in FIGS. 1 and 2, a substrate 1 formed in a substantially rectangular shape
The electronic circuit unit 2 includes an electronic circuit unit 2 disposed thereon and an antenna coil 3 formed on the base material 1 and electrically connected to the electronic circuit unit 2 to transmit and receive information signals.

In this non-contact IC card, an outer peripheral end 3 a of the antenna coil 3 formed in a substantially coil shape is connected to one terminal 2 a of the electronic circuit section 2. In addition, the antenna coil 3 is bent toward the outer peripheral side at the bending point 5,
It is led out from the bent portion 5 toward the other terminal 2b of the electronic circuit section 2 and is connected to the other terminal 2b. That is, in the antenna coil 3, a portion connected to the other terminal 2b of the electronic circuit section 2 is the other end 3b.

At this time, in the non-contact IC card, the antenna coil 3 located between the bent portion 5 and the other terminal 2b is used.
An insulating film 6 is provided thereon. Therefore, the antenna coil 3 formed between the bent portion 5 and the other terminal 2b and the antenna coil 3 led out from the bent portion 5 toward the other terminal 2b of the electronic circuit portion 2 may be short-circuited. Is prevented.

In this non-contact IC card, the antenna coil 3 is formed by a so-called plating method. In this plating method, first, as shown in FIG. 3, a base pattern 10 having a predetermined shape is formed on the main surface of the substrate 1. The base pattern 10 is obtained by printing a conductive paste in a predetermined shape.

Next, plating using the conductive base pattern 10 is performed. At this time, as shown in FIG. 3, a pair of terminals 2a and 2b of the electronic circuit unit 2 are provided on the base pattern 10 at portions that become the outer end 3a and the inner end 3b of the antenna coil 3. Abut In other words,
When plating, a pair of terminals 2a and 2
b and the underlying pattern 10 are connected in advance.

At this time, the electronic circuit section 2 is preferably fixed on the substrate via an adhesive so that the lower surface of the electronic circuit section 2 is securely bonded to the substrate 1. This reliably prevents the electronic circuit section 2 from being detached from the substrate 1 before plating. Further, even after plating, the electronic circuit section 2 is fixed via an adhesive, so that the bonding state between the substrate 1 and the electronic circuit section 2 can be further strengthened.

Next, as shown in FIG.
The metal film 11 is formed by plating using 0. At this time, the plating is performed while supplying a predetermined current to the base pattern 10 and the pair of terminals 2a and 2b of the electronic circuit unit 2. Therefore, according to this plating, the underlying pattern 1
The metal film 11 is formed so as to cover the pair of terminals 2 a and 2 b of the electronic circuit unit 2.

Thus, the antenna coil 3 can be formed, and at the same time, the electronic circuit section 2 can be securely mounted. That is, according to this method, the electronic circuit unit 2 can be electrically connected to the antenna coil 3 by forming the antenna coil 3 by plating.

Therefore, according to this method, the step of mounting the electronic circuit section 2 after forming the antenna coil 3 can be omitted, and a non-contact IC card can be easily manufactured. In particular, in a case where the electronic circuit unit 2 is mounted after the antenna coil 3 is formed, a conductive adhesive is used to electrically connect the pair of terminals 2 a and 2 b of the electronic circuit unit 2 to the antenna coil 3. It was necessary to use materials such as an agent, a solder, and an anisotropic conductive film. However, according to this method, these materials are not required, and the pair of terminals 2a and 2b of the electronic circuit unit 2 and the antenna coil 3 can be electrically connected reliably. Therefore,
This method can reduce the number of parts and is excellent in productivity.

Although not shown, this non-contact IC card has an insulating resin layer formed so as to further cover the metal film 11 formed so as to cover the pair of terminals 2a and 2b of the electronic circuit section 2. It may be. By covering with the insulating resin layer as described above, the strength of the portion of the electronic circuit portion 2 that covers the pair of terminals 2a and 2b can be improved. This prevents the vicinity of the pair of terminals 2a and 2b from being disconnected due to an unexpected impact or the like, thereby improving the reliability of the non-contact IC card.

[0027]

As described above, in the non-contact IC card according to the present invention, the plating film forming the antenna coil is formed so as to cover the terminals of the electronic circuit section. For this reason, in this non-contact IC card, the terminal of the electronic circuit section is securely connected to the antenna coil.

Further, in the method for manufacturing a non-contact IC card according to the present invention, a plating film is formed so as to cover the underlying pattern and the terminals of the electronic circuit section by plating using the underlying pattern. Therefore, according to this method,
After forming the antenna coil, it is not necessary to electrically connect the terminal of the electronic circuit unit and the antenna coil. Therefore, the present method can reduce costs and simplify the manufacturing process, resulting in excellent productivity.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of a non-contact IC card according to the present invention.

FIG. 2 is a perspective view of a non-contact IC card.

FIG. 3 is a cross-sectional view of a main part showing a state where a base pattern for forming an antenna coil is formed.

FIG. 4 is an essential part cross-sectional view showing a state where a plating film is formed so as to cover a base pattern and terminals of an electronic circuit part.

FIG. 5 is a plan view of a conventional non-contact IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base material 2 Electronic circuit part 3 Antenna coil 10 Base pattern 11 Metal film

Claims (4)

[Claims] 1. A non-contact IC card having at least an electronic circuit section on which an IC chip is mounted and an antenna coil connected to a terminal of the electronic circuit section on a base material, wherein the antenna coil Is composed of a base pattern having conductivity and formed in the shape of the antenna coil, and a plating film formed by plating using the base pattern. The terminal of the electronic circuit portion is formed of the base pattern. A non-contact IC card formed so as to be in contact with and covered by the plating film. 2. The non-contact IC card according to claim 1, wherein the plating film covering the terminals of the electronic circuit section is covered with an insulating material. 3. A method for manufacturing a non-contact IC card in which an antenna circuit is mounted on at least an IC chip so that an antenna coil is formed on a substrate by plating and electrically connected to the antenna coil. In the above, an underlayer pattern having conductivity is formed in the shape of the antenna coil, terminals of the electronic circuit portion are disposed so as to be in contact with the underlayer pattern, and plating is performed using the underlayer pattern, whereby the underlayer pattern is formed. And forming a plating film so as to cover the terminals of the electronic circuit section. 4. The method for manufacturing a non-contact IC card according to claim 3, wherein the terminals of the electronic circuit section are arranged so as to be in contact with the base pattern via an adhesive.