JP2000208563A - Film carrier tape - Google Patents

Abstract

(57) [Problem] To provide a film carrier tape having good handling and punching properties. SOLUTION: It is made of polyimide containing biphenyltetracarboxylic acids and phenylenediamine as main components, and has a thickness of 45 to 130 μm and a tensile modulus of 550 to 1300 k.
g / mm2, elongation 45-90%, and tear propagation resistance (Elmendorf) of 550-1500 g / m
A film carrier tape having an adhesive provided on at least one surface of an aromatic polyimide film having a protective film layer thereon.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aromatic polyimide having a high tear propagation resistance (Elmendorf), which comprises a polyimide prepared mainly from a polyimide, for example, biphenyltetracarboxylic dianhydride or a derivative thereof and phenylenediamine. The present invention relates to a film carrier tape having an adhesive layer provided on at least one surface of a polyimide film, and having a protective film layer thereon.

[0002]

2. Description of the Related Art Aromatic polyimide films have high heat resistance,
Because of its excellent properties such as cold resistance, chemical resistance, electrical insulation, and mechanical strength, it is widely used in various fields. Among them, an aromatic polyimide film comprising a biphenyltetracarboxylic acid component and a phenylenediamine component is known to have particularly high heat resistance and a high elastic modulus. Therefore, when such an aromatic polyimide film is particularly focused on its excellent heat resistance and elastic modulus, tape-automated bonding (T
It can be said that it is suitable as a support for use in the production of a film carrier tape for AB).

However, in the field where the polyimide film is used, the demand for higher precision and higher productivity has led to the running of a laminate in which a conductor (usually a copper foil) and a polyimide film are laminated with an adhesive. Stability (e.g., tearing problems) and buckling of the film during punching are problems. And it is pointed out that these are caused, in part, by the low elongation of the polyimide film. Further, it is known that a polyimide film has a property in which elastic modulus and elongation are contradictory, and a film having a large elastic modulus has a small elongation, and a film having a large elasticity has a small elastic modulus.

For this reason, various improvements have been made to polyimide films. For example, Japanese Patent Application Laid-Open No. 61-26402
No. 7 discloses biphenyltetracarboxylic dianhydride and p
-A method for producing a dimensionally stable polyimide film by reheating a polyimide film obtained from phenylenediamine under low tension. In addition, special fair 4
JP-A-6213 describes a polyimide film having a linear expansion coefficient ratio (feed direction / perpendicular direction) and a linear expansion coefficient in the feed direction within a specific range and having excellent dimensional stability. Further, Japanese Patent Publication No. Sho 62-60416 and Japanese Patent Publication No. Sho 6
JP-A-3-5421 and JP-B-63-5422 describe a method for improving the releasability of an aromatic polyamic acid film during casting by a casting method. Japanese Patent Publication No. 3-20130 describes a three- to four-component polyimide film of biphenyltetracarboxylic acids and pyromellitic acids with phenylenediamine and diaminodiphenyl ether. JP-A-4-339835 describes a production method in which a substituted or unsubstituted nitrogen-containing heterocyclic compound is added. However, according to these known techniques, the resulting aromatic polyimide film has improved thermal properties such as linear expansion coefficient and dimensional stability and tensile modulus, but has insufficient elongation and tear propagation resistance (Elmendorf). On the contrary, heat resistance and tensile modulus are reduced.

For this reason, pyromellitic dianhydride and benzophenone tetracarboxylic dianhydride or biphenyltetracarboxylic dianhydride are combined as a tetracarboxylic acid component, and a linear diamine (for example, phenylenediamine) is used as a diamine component. TAB tape using a film made of a polyimide in combination with a flexible diamine (for example, diaminodiphenyl ether), or a polyimide film having improved flex resistance made of a polyimide containing an organic phosphorus compound; Alternatively, there has been proposed a film having excellent punchability, which is made of a polyimide film having an end crack resistance of 50 to 70 kgf / 20 mm. That is, the first TAB tape is disclosed in JP-A-5-26.
Japanese Patent Application Laid-Open No. 3049/1990 discloses a polyimide film having a second improved bending resistance, and Japanese Patent Application Laid-Open No. 2-28257 discloses a polyimide film having a third excellent punching property.
No. 110, respectively. However, these known polyimide films have insufficient elongation and tear propagation resistance (Elmendorf), low tensile strength and tensile elasticity, insufficient bending resistance, and insufficient adhesiveness. And none of them are satisfactory.

[0006] Therefore, with the prior art, it has not been possible to obtain an aromatic polyimide film that satisfies both tensile modulus, elongation and tear propagation resistance (Elmendorf).

[0007]

An object of the present invention is to use an aromatic polyimide film having high dimensional accuracy and satisfying both tensile modulus, elongation and tear propagation resistance (Elmendorf) as a substrate film. Another object of the present invention is to provide a film carrier tape having good handling and punching properties.

[0008]

SUMMARY OF THE INVENTION The present invention relates to a polyimide comprising biphenyltetracarboxylic dianhydride or a derivative thereof and phenylenediamine as main components, having a thickness of 45 to 130 .mu.m, and a tensile modulus of elasticity. Is 550-1300 kg / mm2 and elongation is 45-90%
And a tear propagation resistance (Elmendorf) of 55
The present invention relates to a film carrier tape having an adhesive layer provided on at least one side of an aromatic polyimide film having a thickness of 0 to 1500 g / mm and having a protective film layer thereon.

Further, according to the present invention, the thickness is 45-130 μm.
m and the tensile modulus is 550-1300 kg / mm
2, the elongation was 45-90% and the coefficient of linear expansion (50-
200 ° C) is 5 × 10-6-25 × 10-6 cm / cm / ° C
And a tear propagation resistance (Elmendorf) of 55
The present invention relates to a film carrier tape having an adhesive layer provided on at least one side of an aromatic polyimide film having a thickness of 0 to 1500 g / mm and having a protective film layer thereon.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be listed below. 1) The heat shrinkage of the aromatic polyimide film is 0.00
2-0.4%, and the specific crack resistance is 14-25 kg /
The above film carrier tape having a thickness of 20 mm / 10 μm.
H. 2) The above-mentioned film carrier tape, wherein the aromatic polyimide film contains 0.1 to 5% by weight of an inorganic filler. 3) The surface of the film that is in contact with the adhesive is a corona discharge treatment,
The above film carrier tape, which has been subjected to at least one surface treatment of vacuum or normal pressure plasma treatment.
H. 4) The above-mentioned film carrier tape, wherein the adhesive is a thermoplastic adhesive or a thermosetting adhesive.

In the present invention, the biphenyltetracarboxylic acid component includes 2,3,3 ′, 4′-biphenyltetracarboxylic acid, 3,3 ′, 4,4′-biphenyltetracarboxylic acid, halides thereof, Their dianhydrides or their esters can be used, and among them, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride is preferably used. Examples of the aromatic tetracarboxylic acid component that can be used in combination with the biphenyltetracarboxylic acid component include pyromellitic dianhydride. When pyromellitic dianhydride is used in combination, the content is preferably 50 mol% or less in the tetracarboxylic acid component.

Other aromatic tetracarboxylic acid components may be used as long as the effects of the present invention are not impaired. Such aromatic tetracarboxylic acid components include 3,3 ′,
4,4′-benzophenonetetracarboxylic dianhydride,
2,2 ', 3,3'-benzophenonetetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl ) Propane dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, bis (2,3
-Dicarboxyphenyl) ether dianhydride, 2,3
6,7-naphthalenetetracarboxylic dianhydride, 1,
4,5,8-naphthalenetetracarboxylic dianhydride,
2,2-bis (3,4-dicarboxyphenyl) -1,
1,1,3,3,3-hexafluoropropane dianhydride, 2,2-bis (2,3-dicarboxyphenyl)
Examples thereof include 1,1,1,3,3,3-hexafluoropropane dianhydride.

The phenylenediamine used in the present invention may be any of o-phenylenediamine, m-phenylenediamine and p-phenylenediamine. Other aromatic diamines may be used as long as the effects of the present invention are not impaired. Such aromatic diamine components include diaminodiphenyl ether, 4,4′-
Diaminodiphenylpropane, 4,4′-diaminodiphenylethane, 4,4′-diaminodiphenylmethane,
Bis [4- (4-aminophenoxy) phenyl] propane, 2,2′-bis [4- (aminophenoxy) phenyl] 1,1,1,3,3,3-hexafluoropropane, bis [4- ( 4-aminophenoxy) phenyl] ether and the like.

In the present invention, the aromatic polyimide film has a thickness of 45-125 μm, preferably about 50-75 μm. When the thickness of the aromatic polyimide film is smaller than the lower limit, the self-supporting property is low, and when the thickness is larger than the upper limit, the film carrier tape required to have high precision is required.
Not preferred If the values of the tensile modulus, elongation, and tear propagation resistance (Elmendorf) of the aromatic polyimide film are out of the above ranges, the object of the present invention cannot be achieved. Further, when the heat shrinkage and the specific edge crack resistance of the aromatic polyimide film are within the above ranges, dimensional stability and handling under various environments are good.

The aromatic polyimide film according to the present invention can be manufactured, for example, as follows.
Preferably, first, the biphenyltetracarboxylic acid and phenylenediamine, preferably paraphenylenediamine, are dissolved in an organic polar solvent usually used for producing a polyimide such as N, N-dimethylacetamide or N-methyl-2-pyrrolidone. Polymerization is preferably carried out at 10 to 80 ° C for 1 to 30 hours, and the logarithmic viscosity of the polymer (measuring temperature: 30 ° C, concentration: 0.5 g / 100 ml solvent, solvent: N-methyl-2)
-Pyrrolidone) 0.1-5, polymer concentration 15-2
5% by weight and a rotational viscosity (30 ° C.) of 500 to 450
A polyamic acid (imidation ratio: 5% or less) solution having 0 poise is obtained.

Next, for example, 1,2-dimethylimidazole is preferably added to the polyamic acid solution obtained as described above, in particular, in an amount of 0.005-2 times equivalent to the amic acid unit of the polyamic acid. , Preferably 0.005-
0.8 equivalent, especially about 0.02-0.8 equivalent is contained. A part of 1,2-dimethylimidazole is converted to imidazole, benzimidazole, N-methylimidazole, N-benzyl-2-methylimidazole, 2-methylimidazole, 2-ethyl -4-methylimidazo-
, 5-methylbenzimidazole, isoquinoline,
It may be replaced with 3,5-dimethylpyridine, 3,4-dimethylpyridine, 2,5-dimethylpyridine, 2,4-dimethylpyridine, 4-n-propylpyridine or the like.

In the above polyamic acid solution, a phosphorus compound is added preferably in an amount of 0.01-5 parts by weight, more preferably 0.01-3 parts by weight, especially 0.01-1 part by weight, per 100 parts by weight of the polyamic acid. An organic phosphorus compound, preferably a (poly) phosphate ester, an amine salt of a phosphate ester or an inorganic phosphorus compound is added in a ratio of parts by weight, and more preferably an inorganic filler, particularly 100 parts by weight of polyamic acid, is added. 0.1-3 parts by weight of colloidal silica, silicon nitride, talc, titanium oxide, calcium phosphate (preferably having an average particle size of 0.005-5 μm, particularly 0.005-2 μm
m) is added to obtain a polyimide precursor solution composition.

The polyimide precursor solution composition is continuously cast on a glass or metal support having a smooth surface to form a thin film of the solution. To adjust the temperature: 100-200
C., time: 1 to 30 minutes after drying, the solidified film has a volatile content of about 30 to 50% by weight and an imidization rate of about 5 to 80% in the solidified film. A solidified film is formed, and the solidified film is peeled from the support surface. The solidified film is further dried under controlled drying conditions to obtain a temperature of room temperature (25 ° C.)-250.
C., Time: A drying step of drying for about 0.5 to 30 minutes may be added. By holding both edges in the width direction of the solidified film and maintaining the stretched state in at least a part of these drying steps, the width direction (TD) and both directions (MD, T
You may stretch a little to D).

The aromatic polyimide film of the present invention can be obtained by heating the solidified film to a high temperature, preferably in a curing furnace, to complete drying and imidization. That is, the solidified film obtained as described above is further dried, if necessary, and in a state where both edges in the width direction of the dried film are gripped, the maximum heating temperature in a curing furnace: about 400 to 500 ° C. Especially 47
The dried film is heated and dried and imidized under the condition that a temperature of about 5 to 500 ° C. is 0.5 to 30 minutes,
A long aromatic polyimide film can be suitably produced by completing imidization at a residual volatile matter amount of about 0.4% by weight or less.

The aromatic polyimide film obtained as described above is preferably used under low tension or no tension.
It is heated at a temperature of about 00 to 400 ° C., subjected to a stress relaxation treatment, and wound up.

The above-mentioned aromatic polyimide film is made of a polyimide precursor solution obtained by adding an imidization catalyst to the above-mentioned polyamic acid, and is formed into a long film by a solution casting method. And the tear propagation resistance (Elmendorf) can be set to the value specified in the present invention.

It is preferable that at least one surface of the aromatic polyimide film in the present invention is subjected to corona discharge treatment, low-temperature or normal-pressure plasma discharge treatment, particularly plasma discharge treatment. In the plasma discharge treatment, the film surface is not treated, or acetone or isopropyl alcohol is used.
Or after treatment with an organic solvent such as ethyl alcohol or ethyl alcohol.

The pressure of the atmosphere in which the plasma discharge treatment is performed is not particularly limited, but is preferably in the range of 0.1 to 100 Torr. The gas composition of the atmosphere in which the plasma treatment is performed is not particularly limited, but preferably contains oxygen. Alternatively, at least 20 mol% of a rare gas may be contained. Noble gases include He, Ne, Ar,
Although Xe is mentioned, Ar is preferable. Noble gas to C
O2, N2, H2, H2O and the like may be used as a mixture.
The plasma irradiation time for performing the plasma processing is 1 second-10.
Of the order of minutes.

The adhesive in the present invention may be thermosetting or thermoplastic, such as epoxy resin or NBR.
A phenolic resin, a phenol-butyral resin,
Epoxy-NBR resin, epoxy-phenolic resin, epoxy-nylon resin, epoxy-polyester resin, epoxy-acrylic resin, acrylic resin, polyamide-epoxy-phenolic resin, polyimide resin, Thermosetting adhesives such as polyimide-epoxy resin and polyimidesiloxane-epoxy resin, and thermoplastic adhesives such as polyamide-based resin, polyester-based resin, polyimide-based adhesive, and polyimidesiloxane-based adhesive are exemplified. In particular, polyimide adhesives, polyimide-epoxy resin adhesives, polyimidesiloxanes
Epoxy resin adhesives and epoxy resin adhesives are preferably used.

In the film carrier tape having a protective film layer according to the present invention, for example, the above-mentioned adhesive solution is applied onto the above-mentioned aromatic polyimide film surface, and the applied layer is coated with 8.
By drying at a temperature of about 0 to 200 ° C. for 20 seconds to 100 minutes, the adhesive is substantially removed to 1% by weight or less, preferably 0.5% by weight or less. A thin film (dry film or sheet having a thickness of about 1 to 200 μm) is formed, and a resin film such as a commercially available aromatic polyimide film, aromatic polyester, polyethylene, polypropylene, or polybutene-1 is formed on the thin film.
It can be obtained by laminating a pair of rolls heated to a temperature of 0 to 200 ° C. Alternatively, a laminated sheet in which a thin film layer of an adhesive is formed on the above-mentioned heat-resistant film or thermoplastic film and an aromatic polyimide film of the present invention as a transfer destination are superimposed on each other at about 20-200 ° C. By passing between a pair of rolls (laminate rolls) heated to a temperature, the thin film layer of the adhesive is transferred to an aromatic polyimide film as a transfer destination,
A film carrier tape having a protective film layer can also be obtained.

The film carrier tape having a protective film layer of the present invention has flexibility and can be wound around a paper tube or the like, or can be punched by a punching method or the like.

In order to form a laminate (sheet) with a metal foil such as a copper foil using the film carrier tape of the present invention, for example, a thin film adhesive formed as described above is used. The aromatic polyimide film and the metal foil are laminated (laminated) under pressure (0.2-8 kg / cm 2) at a temperature of 80-200 ° C., particularly 100-180 ° C., via an agent. The plate can be easily and continuously manufactured without any hindrance.

[0028]

Embodiments of the present invention will be described below. In each of the following examples, the physical properties of the polyimide film were measured by the following methods. The following measured values are measured at 25 ° C. unless otherwise specified.

Elongation: Measured according to ASTM D882-83 (MD) Tensile Modulus: Measured according to ASTM D882-83 (MD) Tear Propagation Resistance (Elmendorf): ASTM D19
Measured according to 22-67 (MD)

Tensile strength: Measured according to ASTM D882-83 (MD) Heat shrinkage: Measured according to JIS C2318 (200
℃) Dielectric breakdown voltage: Measured according to JIS C2318

Edge crack resistance: Measured according to JIS C2318 (MD) The edge crack resistance (or specific edge crack resistance) is measured according to JIS C23.
It means the average value of the crack resistance (or the specific crack resistance) of the samples (5 pieces) measured according to 18. In particular,
1.00 ± 0.05m upper thickness of constant speed tension type tensile tester
The center line of the m-shaped V-shaped notch plate test fitting is aligned with the center line of the upper grip, and the handle is attached so that the distance between the cut top and the lower grip is about 30 mm. About 20m in width
Approximately 200 mm long test piece is passed through the hole of the bracket, folded into two parts, clamped at the lower part of the tester, pulled at a speed of about 200 mm per minute, and the force at the time of tearing is measured. It is called tear resistance. Five test pieces were taken from the longitudinal direction and the transverse direction over the entire width, respectively, and the average value of the end crack resistance was determined, which is shown as the end crack resistance value. The specific edge tear resistance indicates an edge tear resistance per film thickness (10 μm conversion).

Measurement of linear expansion coefficient (50-200 ° C.): 30
A sample that was heated at 0 ° C. for 30 minutes to relax the stress was applied to a TMA device (tensile mode, 2 g load, sample length 10 mm, 20 ° C.).
/ Min)

Tear strength: A 5 cm long cut was made using a razor blade on one side of a film cut into a square of 7.5 cm × 7.5 cm. The load at the time of pulling at both sides of the cut with a tensile tester at a speed of 200 mm / min was measured, and the load at which tearing occurred was defined as tear strength (g). Bending resistance (MIT): Measured in accordance with ASTM D2176 (MD) Punching property: Good when there is no buckling, deformation or breakage in the film upon punching, good when there is no problem, slightly bad when there is a little problem Something was bad. Adhesive strength: 180 ° peel strength was measured at a tensile speed of 50 mm / min.

Reference Example 1 In a reaction vessel, N, N-dimethylacetamide (100 parts by weight), p-phenylenediamine (5.897 parts by weight) and 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride 019 parts by weight, and added at 40 ° C. under a nitrogen stream.
For 3 hours to cause a polymerization reaction, polymer concentration of 18% by weight, logarithmic viscosity of the polymer (measuring temperature: 30 ° C., concentration:
0.5 g / 100 ml solvent, solvent: N, N-dimethylacetamide (1.3), solution viscosity 1800 poise (30
C., rotational viscometer). In this polyamic acid solution, monostearyl phosphate triethanolamine salt at a ratio of 0.1 part by weight to 100 parts by weight of the polyamic acid and an average particle diameter of 0 part by weight (based on solid content) of 0.5 part by weight. 0.08 μm of colloidal silica was added and uniformly mixed to obtain a polyamic acid solution composition. Furthermore, in this polyamic acid solution composition,
2.39 kg of 1,2-dimethylimidazole (0.1 equivalents per unit of polyamic acid) was added to 100 parts by weight of polyamic acid, and the mixture was stirred at 40 ° C. for 2 hours to obtain a polyimide precursor solution composition. I got

The polyimide precursor solution composition was continuously extruded through a slit of a T-die to form a thin film on a smooth metal support. After heating this thin film at 140 ° C. for 20 minutes, it was peeled off from the support to form a self-supporting film. The film was continuously passed through a heating furnace with both ends of the film restrained. At this time, the residence time in the heating furnace is set to 1
The maximum heating temperature in the heating furnace was set to 480 ° C. for 3 minutes. Thus, a long aromatic polyimide film having a thickness of 50 μm was obtained. The resulting polyimide film was subjected to plasma treatment under the conditions of a plasma irradiation time of 1 minute, a microwave oscillation output of 1 kW, a plasma generation vacuum of 0.8 Torr, and a plasma processing gas of oxygen to obtain a modified polyimide film. Obtained.

The physical properties of the modified polyimide film are shown below. Tensile modulus (MD): 890 kg / mm2 Elongation (MD): 60% Tear propagation resistance (Elmendorf) (MD): 710 g
/ Mm Tensile strength (MD): 56 kg / mm2 Heat shrinkage (200 ° C): 0.05% Dielectric breakdown voltage: 11.1 kv Edge crack resistance (MD): 82 kg / 20 mm Linear expansion coefficient (50-200 ° C) 1.7 × 10-5cm /
cm / ° C. Tear strength (MD): 21 g Number of times of bending resistance (× 10 4 times):> 10

Reference Example 2 In a reaction vessel, using N-methyl-2-pyrrolidone as a solvent, 2,3,3 ', 4'-biphenyltetracarboxylic dianhydride and 2,2'-bis (4-aminophenoxy) ) Propane (60 mol%) and diaminopolysiloxane (40
Mol%, Mw = 950) to obtain a polyimidesiloxane. This polyimide siloxane had a tensile modulus of 57 kg / mm 2 and a Tg of 190 ° C. as a film. 55 parts of this polyimidesiloxane, 30 parts of bisphenol F type epoxy resin (EP807, manufactured by Yuka Shell Co., Ltd.) as an epoxy resin, and 18 parts of phenol novolak type curing agent (H-1, manufactured by Meiwa Kasei Co., Ltd.) as a curing agent. 2-
0.1 part of phenylimidazole was charged into 200 parts of THF (tetrahydrofuran) and stirred at 30 ° C. for about 2 hours to obtain a uniform adhesive solution.

Example 1 The adhesive solution obtained in Reference Example 2 was applied to polyethylene terephthalate.
125μ on a PET film with a doctor blade
m, and then the coated layer was dried by heating at 80 ° C. for 10 minutes.
29. Laminate the sheet (25 μm) at 90 ° C.
Slit to a width of 6 mm, and a thickness of about 20 on PET film
An adhesive tape having a μm adhesive layer and a protective film layer was obtained. The adhesive tape from which one protective film layer of the adhesive tape was peeled was laminated at 130 ° C. on a tape obtained by slitting the modified polyimide film obtained in Reference Example 1 to a width of 35 mm. Thus, a film carrier tape having a protective layer was obtained. This film carrier tape exhibited the same bending resistance as the modified polyimide film. Sprocket holes and device holes are made in the film carrier tape having the protective layer, the protective layer is peeled off, and a 31 mm-wide copper foil (35 μm) is formed.
m) are superimposed and passed through a laminator-roll heated to 130 ° C. while applying pressure, and the resulting laminate is pressed at 100 ° C. for 1 hour at 120 ° C.
For 1 hour and at 180 ° C. for 5 hours in a stream of nitrogen to cure the adhesive and produce a laminate. The adhesive strength of the obtained laminate and the punching characteristics during the production of the laminate are shown below. Adhesive strength: 1.6 kg / cm Punching property: good

REFERENCE EXAMPLE 3 Reference Example 1 except that the conditions for extruding from the slit of the T-die were changed.
In the same manner as in the above, a modified aromatic polyimide film having a thickness of 75 μm was obtained. The physical properties of this aromatic polyimide film are summarized below. Tensile modulus (MD): 840 kg / mm2 Elongation (MD): 68% Tear propagation resistance (Elmendorf) (MD): 820 g
/ Mm Tensile strength (MD): 48 kg / mm2 Heat shrinkage (200 ° C): 0.05% Dielectric breakdown voltage: 10.9 kv Edge crack resistance (MD): 110 kg / 20 mm Linear expansion coefficient (50-200 ° C) 1.8 × 10-5cm /
cm / ° C. Tear strength (MD): 42 g Number of times of bending resistance (× 10 4 times):> 10

Example 2 The procedure of Example 1 was repeated, except that the thickness of the aromatic polyimide film was 75 μm, which was obtained in Reference Example 3.
A film carrier tape having a protective layer was obtained. This film carrier tape exhibited the same bending resistance as the modified polyimide film. Sprocket holes and device holes were formed in the film carrier tape having the protective layer, and the protective layer was peeled off. A laminated board was manufactured in the same manner as in Example 1.
The adhesive strength of the obtained laminate and the punching workability during the production of the laminate are shown below. Adhesive strength: 1.7 kg / cm Punching property: good

Comparative Reference Example 1 A modified aromatic polyimide film having a thickness of 50 μm was obtained in the same manner as in Reference Example 1 except that 1,2-dimethylimidazole was not added. The physical properties of this aromatic polyimide film are summarized below. Tensile modulus (MD): 850 kg / mm2 Elongation (MD): 43% Tear propagation resistance (Elmendorf) (MD): 510 g
/ Mm Tensile strength (MD): 48 kg / mm2 Heat shrinkage (200 ° C): 0.07% Dielectric breakdown voltage: 10.9 kv Edge crack resistance (MD): 66 kg / 20 mm Linear expansion coefficient (50-200 ° C) : 1.4 × 10 −5 cm /
cm / ° C. Tear strength (MD): 16 g Number of bending resistance (× 10 4 times): 5.6

Comparative Example 1 A film carrier tape having a protective layer was obtained in the same manner as in Example 1 except that the aromatic polyimide film obtained in Comparative Reference Example 1 was used. Sprocket holes and device holes were formed in the film carrier tape having the protective layer, and the protective layer was peeled off. A laminated board was manufactured in the same manner as in Example 1. The adhesive strength of the obtained laminate and the punching workability during the production of the laminate are shown below. Adhesive strength: 1.5 kg / cm Punching property: slightly unfavorable

[0043]

Since the present invention is configured as described above, the following effects can be obtained. The film carrier tape of the present invention has a good punching property, and maintains the adhesiveness, and can be processed with high precision.

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 4F100 AK41 AK49A AS00B AS00C BA02 BA03 BA06 BA07 BA10B BA10C CA23 EJ55 EJ61 JA02A JB13 JB16 JJ03 JK03A JK07 JK07A JK08A JL04 JL05 YY00A 4J043BA02 QB12 QB12 TAB UA132 UA151 UA662 UA672 UB011 UB021 UB061 UB121 UB131 UB141 UB402 VA011 VA012 VA021 VA022 VA031 VA041 VA051 VA062 VA081 VA091 VA102 XA16 XB12 XB20 YA06 ZA32 ZB11 ZB60 5F044 MM06 A26 BA06

Claims (6)

[Claims] 1. A polyimide comprising biphenyltetracarboxylic dianhydride or a derivative thereof and phenylenediamine as main components, and having a thickness of 45 to 130 μm.
Having a tensile modulus of 550-1300 kg / mm 2
A film carrier having an adhesive layer provided on at least one surface of an aromatic polyimide film having an elongation of 45-90% and a tear propagation resistance (Elmendorf) of 550-1500 g / mm, and having a protective film layer thereon Tape. 2. An aromatic polyimide film having a heat shrinkage of 0.002-0.4% and a specific edge crack resistance of 14-2.
2. The film carrier tape according to claim 1, which has a weight of 5 kg / 20 mm / 10 [mu] m. 3. The film carrier tape according to claim 1, wherein the aromatic polyimide film contains 0.1 to 5% by weight of an inorganic filler. 4. The film carrier tape according to claim 1, wherein the surface of the film which is in contact with the adhesive has been subjected to at least one of corona discharge treatment, vacuum or normal pressure plasma treatment. 5. The film carrier tape according to claim 1, wherein the adhesive is a thermoplastic adhesive or a thermosetting adhesive.
H. 6. Thickness is 45-130 μm, tensile modulus is 550-1300 kg / mm 2 and elongation is 45-130 kg / mm 2.
90% and a coefficient of linear expansion (50-200 ° C.) of 5 × 1
0-6-25 x 10-6 cm / cm / C and a tear propagation resistance (Elmendorf) of 550-1500 g / m
A film carrier tape having an adhesive layer provided on at least one surface of an aromatic polyimide film having a protective film layer thereon.