JP2000299539A - Printed wiring board - Google Patents

Abstract

(57) [Summary] To facilitate positioning and position confirmation of electronic components. An electronic component has seven lead terminal electrodes provided in only one direction. This electronic component printed wiring board is provided with lands corresponding to the lead terminal electrodes 20, and has lands 31 and 3 with marks at both ends.
2, others are normal lands 41, 42, 43, 44, 4
5 At the time of mounting the electronic component, the left and right alignment can be performed by adjusting each land so that the center of the lead terminal electrode 20 coincides. On the upper and lower sides, the positioning is performed such that the tip of the lead terminal electrode 20 is located at the corner of the land indicated by the key-shaped alignment marks provided on the marked lands 31 and 32.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly, to a printed wiring board on which electronic components of a surface mount type are mounted.

[0002]

2. Description of the Related Art Conventionally, when mounting electronic components on a printed wiring board, the electronic components are positioned in accordance with electronic component mounting lands formed on the printed wiring board, and the components are mounted on the wiring board by soldering. Lands (hereinafter referred to as lands) are connected to lead terminal electrodes of electronic components.

[0003] The positioning of a conventional electronic component will be described. FIG. 4 shows an example of conventional positioning of an electronic component in which lead terminal electrodes are provided vertically and horizontally. (A) is a figure which showed the basic positioning of the electronic component in which the lead terminal electrode was provided symmetrically up, down, left and right. (B) is an example of positioning when lead terminal electrodes are provided symmetrically in the vertical and horizontal directions of the electronic component. (C) is an example of positioning when lead terminal electrodes are provided symmetrically above and below an electronic component.

The positioning of the electronic component 10 at the time of mounting on the printed wiring board is performed by adjusting the lead terminal electrode 20 of the electronic component 10 at a predetermined position on the land 40 formed on the printed wiring board. Will be In the case where the lead terminal electrodes are vertically symmetrical, as shown in (a), the distance between the tip of the lead terminal electrode 20 in the X direction and the end of the land 40, X1 and X2, and Y The distance between the tip of the lead terminal electrode 20 and the end of the land 40 in the direction,
Positioning is performed so that Y1 and Y2 match.

When lead terminal electrodes are provided symmetrically in the vertical and horizontal directions of the electronic component as shown in FIG.
0 and the lead terminal electrode 20 placed on the land 40 which is the center
Can be positioned so as to coincide with the center of. Alternatively, as shown in (c), when the lead terminal electrodes are provided symmetrically above and below the electronic component, the center of the land 40 and the center of the lead terminal electrode 20 coincide in the X direction as described above. Position so that In the Y direction, positioning is performed so that the distance between the tip of the lead terminal electrode 20 and the end of the land 40, Y1 and Y2, coincide.

Next, positioning of an electronic component having lead terminal electrodes provided in two or more asymmetric directions will be described. FIG.
Is an example of conventional positioning of an electronic component in which lead terminal electrodes are provided in two or more directions. (A) is a figure which showed the basic positioning of the electronic component in which the lead terminal electrode was provided in two or more directions, and (b) is the specific example.

When the lead terminal electrodes are provided in two or more asymmetric directions, as shown in FIG. 1A, each lead terminal electrode 20 and land 40 in each asymmetric direction are provided.
Positioning is performed so that the intervals between the two coincide with each other. In this example, the positioning is performed so that the distance between X1 and X2 in the figure in the X direction matches the distance between Y1 and Y2 in the figure in the Y direction. That is, the positioning is performed such that the land 40 in each direction coincides with the center of the lead terminal electrode 20. A specific example will be described in (b). In the case as shown in the figure, the X direction corresponds to each land 40 arranged in the X direction and the lead terminal electrode 2.
Positioning is performed so that the centers of 0 coincide. In the Y direction, the end of the lead terminal electrode 20 and the end of the land 40, Y
Positioning is performed so that 1 and Y2 match.

[0008]

However, in the conventional positioning of an electronic component at the time of mounting the electronic component on a printed wiring board, the positioning and position confirmation are not easy depending on the arrangement of the lead terminal electrodes of the electronic component. There is. For example, when mounting an electronic component in which the lead terminal electrodes of the electronic component are provided in only one direction, it is difficult to position the electronic component. In addition, even when the position of the electronic component is confirmed after mounting, it is difficult to confirm the position because there is no mark.

As an example, the positioning of an electronic component having lead terminal electrodes provided in only one direction will be described. FIG.
Is an example of conventional positioning of an electronic component in which lead terminal electrodes are provided in only one direction. In this case, the electronic component 10
Are arranged in the X direction, and the lead terminal electrodes 20 are not provided in other directions.
The positioning in the X direction is performed by using each land 40 and the lead terminal electrode 2.
The adjustment can be performed by adjusting the center of 0 so as to match. However, in the Y direction, there is no standard and alignment cannot be performed. Similarly, the position of the electronic component cannot be confirmed after mounting.

The present invention has been made in view of the above points, and has as its object to provide a printed wiring board that facilitates positioning and confirmation of electronic components.

[0011]

According to the present invention, in order to solve the above-mentioned problems, in a printed wiring board on which a surface-mount type electronic component is mounted, the electronic component mounting position is mounted on a component mounting land on which the electronic component is mounted. A printed wiring board provided with an alignment mark indicating the following.

In a printed wiring board having such a configuration, a positioning mark serving as a mark of a mounting position of an electronic component is provided on a component mounting land for mounting an electronic component. When mounting an electronic component, the electronic component is mounted in accordance with the alignment mark provided on the component mounting land. Similarly, when confirming the mounting position of the electronic component, the alignment mark is used.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a printed circuit board provided with a marked component mounting land according to the present invention. On the printed wiring board of the present invention, there are marked component mounting lands (hereinafter referred to as marked lands) 31 and 32 provided with marks indicating the mounting positions of the electronic components, and lands 41, 42, 43, 44, 45 are provided. Marked lands 31, 32 and lands 41, 42, 4
On 3, 44 and 45, the corresponding lead terminal electrodes 20 of the electronic component 10 are mounted.

The electronic component 10 is a surface mount type component mounted on a printed wiring board,
Has zero. The electronic component 10 is mounted on a printed wiring board by connecting the lead terminal electrodes 20 of the electronic component and lands by soldering.

The lands 31 and 32 with marks are arranged at positions corresponding to the endmost ones of the lead terminal electrodes 20 of the electronic component 10, and have a key-like shape at a position corresponding to the leading end position of the lead terminal electrodes 20. It has a shape. Land 4
1, 42, 43, 44, and 45 are arranged corresponding to the other lead terminal electrodes 20 of the electronic component 10.

The operation of mounting an electronic component on a printed wiring board having a land with a mark having such a configuration will be specifically described. The electronic component 10 shown in the figure has seven lead terminal electrodes 20 provided only in one direction. The electronic component printed wiring board is provided with lands corresponding to the lead terminal electrodes 20, lands 31 and 32 with marks at both ends, and other lands 41, 42, 43 and
44 and 45. At the time of mounting electronic components,
The alignment in the direction can be performed by adjusting each land so that the center of the lead terminal electrode 20 matches. Next, alignment in the vertical direction, that is, in the Y direction, is performed such that the tip of the lead terminal electrode 20 is positioned on the same line as the corner of the land which is a key-shaped alignment mark provided on the marked lands 31 and 32. Adjust and align.

As described above, according to the present invention, the alignment in the Y direction may be performed accurately and easily by adjusting the position so that the tip of the lead terminal electrode 20 is aligned with the alignment mark. be able to.

The mounting position after the mounting of the electronic component 10 can be confirmed by visually checking whether the alignment mark and the lead terminal electrode 20 are on the same line. In this way, the mounting position can be easily confirmed.

The alignment mark is formed by changing the shape of the land for mounting electronic components. As described above, since the alignment mark is the land for mounting electronic components, the position of the mark does not shift when the mark is formed.

Since the marked lands 31, 32 are provided for the lead terminal electrodes 20 at both ends, it is not necessary to change the interval between the lead terminal electrodes of the electronic component 10. That is, a conventional electronic component can be used as it is.

Next, a specific example of the marked land will be described. FIG. 2 is a view showing a marked component mounting land of the present invention when formed by a resist narrowing type manufacturing method. A mark is formed on the marked land 30 so as to indicate the tip position of the lead terminal electrode 20.
Subsequently, except for the marked land 30, the resist layer 5
0 is formed. (A) and (b) are examples in which a key-like alignment mark is formed. (C)
This is an example of a case where a concave alignment mark is formed.

FIG. 3 is a view showing a marked component mounting land of the present invention when formed by an over-resist type manufacturing method. The same components as those in FIG. 2 are denoted by the same reference numerals, and description thereof is omitted. In both (a) and (b), a key-like alignment mark is formed on the land. further,
In (a), a resist layer is formed in accordance with a key-shaped alignment mark.

In the above description, the case where the lead terminal electrode of the electronic component is provided in only one direction has been described.
Electronic components with lead terminal electrodes provided symmetrically up and down, left and right,
Also, a mark can be formed on a component mounting land on which an electronic component on which lead terminal electrodes are provided in two or more asymmetric directions is mounted. Normally, rather than adjusting the position so that the center of the lead terminal electrode of the electronic component and the center of the land coincide, that is, the distance between the end of the lead terminal electrode and the end of the land is equal vertically or horizontally. It is easier and more accurate to align the position of the alignment mark with the tip of the lead terminal electrode. As described above, according to the present invention, accurate positioning can be performed regardless of the arrangement of the lead terminal electrodes of the electronic component.

[0024]

As described above, according to the present invention, the printed circuit board is provided with the alignment mark serving as a mark of the mounting position of the electronic component on the component mounting land for mounting the electronic component. When mounting an electronic component, the electronic component is positioned in accordance with a positioning mark provided on the component mounting land. As described above, by providing the alignment mark indicating the mounting position on the component mounting land, the mounting position can be easily determined, and the electronic component can be mounted at a correct position. As a result, mounting defects can be reduced. Similarly, the position of the electronic component after mounting can be easily confirmed.

[Brief description of the drawings]

FIG. 1 is a plan view of a printed wiring board provided with a marked component mounting land according to the present invention.

FIG. 2 is a diagram showing a marked component mounting land of the present invention when formed by a resist narrowing type manufacturing method.

FIG. 3 is a view showing a marked component mounting land of the present invention when formed by an over-resist type manufacturing method.

FIG. 4 is an example of conventional positioning of an electronic component in which lead terminal electrodes are provided symmetrically in the vertical and horizontal directions.

FIG. 5 is an example of conventional positioning of an electronic component in which lead terminal electrodes are provided in two or more directions.

FIG. 6 is an example of conventional positioning of an electronic component in which lead terminal electrodes are provided in only one direction.

[Explanation of symbols]

10 electronic parts, 20 lead terminal electrodes, 31, 32 ...
Lands for mounting electronic components with marks (lands with marks), 40, 41, 42, 43, 44, 45 ... Lands for mounting electronic components (lands)

Claims (4)

[Claims] 1. A printed wiring board on which a surface mount type electronic component is mounted, wherein a positioning mark indicating the electronic component mounting position is provided on a component mounting land on which the electronic component is mounted. substrate. 2. The printed wiring board according to claim 1, wherein the alignment mark indicates a position where a tip of a lead terminal electrode of the electronic component is arranged. 3. The alignment mark is formed by making the shape of the component mounting land into a key shape or a concave shape having a corner on a line on which the lead terminal electrode tip is arranged. The printed wiring board according to claim 2. 4. The printed wiring board according to claim 1, wherein the alignment mark is formed on a component mounting land located at the end of the component mounting land.