JP2000294669A - Wiring board, method of manufacturing semiconductor device using the same, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board provided with a plurality of package substrates, which has high performance and high reliability, a method of manufacturing a semiconductor device using the same, and a semiconductor device. . SOLUTION: A wiring board 1 provided with a plurality of package boards 2, wherein a slit 4 is provided around the package board 2, and a part of the slit 4 is provided around the package board 2 and the wiring board 1. A connecting portion 5 mechanically connecting the portion 3 is provided, and a counterbore 6 is provided on a part of the connecting portion 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board, a method of manufacturing a semiconductor device using the same, and a semiconductor device. More particularly, the present invention relates to a wiring board having a plurality of package substrates, which has high performance and high performance. The present invention relates to a reliable wiring board, a method for manufacturing a semiconductor device using the same, and a semiconductor device.

[0002]

2. Description of the Related Art The present inventors have studied a package substrate and a semiconductor device using the same. The following is a technique studied by the present inventors, and the outline is as follows.

That is, a recent LSI (Large Scale In)
In a semiconductor integrated circuit device such as an integrated circuit, when used in a workstation or a personal computer, it is necessary to improve the performance and increase the number of pins, so that a BGA (Ball Grid Array) or a CSP (Chip Size) is required.
Package).

In this case, when a semiconductor chip made of an LSI chip or the like is sealed in the package substrate by a potting method, a sealing agent is injected by a surface tension of a cut portion of an outer shape of the package substrate. We are working on hardening.

Therefore, one package substrate (1
1) (single) package substrate (individual) for one semiconductor chip, and one package substrate
At present, one semiconductor chip is mounted after mounting (installing) the semiconductor chips.

As a document describing a BGA type package as an LSI package, for example, see “Nikkei Electronics August 2, 1993,” p.
04.

[0007]

However, since the package substrate described above is a piece, the number of steps including the mounting process increases, the number of package substrates increases, and the handling is troublesome. It has occurred.

Also, in the method of mounting a semiconductor chip, when the semiconductor chip is mounted on one (one) of the package substrates, it takes a long time to set the package substrate and the like because it is in a single item, and the production efficiency is increased. However, there is a problem that the cost is high and the cost is high.

An object of the present invention is to provide a wiring board having a plurality of package substrates, which has high performance and high reliability, a method of manufacturing a semiconductor device using the same, and a semiconductor device. It is in.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0011]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, (1) The wiring board of the present invention is a wiring board provided with a plurality of package boards,
A slit is provided in the periphery of the package substrate, and a connection part that mechanically connects the package substrate and the peripheral part of the wiring board is provided in a part of the slit, and a recess is formed in a part of the connection part. It is provided.

(2) The method for manufacturing a semiconductor device using the wiring board according to the present invention is the method for manufacturing a wiring board according to the above (1), wherein the manufacturing process using the luter processing is performed as the manufacturing process of the slit and the concave portion. It has a manufacturing process using a process or a punching die or a manufacturing process using a lithography technique and a selective etching technique.

(3) The semiconductor device of the present invention is characterized in that (1)
A semiconductor chip is mounted on the surface of a package substrate of the wiring board using the wiring board described above.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, components having the same function are denoted by the same reference numerals, and redundant description will be omitted.

(First Embodiment) FIG. 1 is a schematic plan view showing a wiring board according to a first embodiment of the present invention. FIG.
FIG. 2 is a schematic cross-sectional view showing an enlarged cross section taken along the line AA in FIG. 1.

As shown in FIGS. 1 and 2, a wiring board 1 according to the present embodiment is a wiring board having a plurality of package substrates 2, and a slit which is a long cut around the package substrate 2. 4 are provided and the slit 4
Is provided with a connecting portion 5 for mechanically connecting the package substrate 2 and the peripheral portion 3 of the wiring board 1, and a counterbore (recess) 6 is provided on a portion of the connecting portion 5. It is characterized by having.

In this case, the counterbore 6 can be in the form of a connecting recess arranged on a part of the connecting portion 5. The counterbore 6 as a connecting recess is arranged on one side of the connecting portion 5. It is characterized by having.

The package substrate 2 is a rectangular package substrate, and an electronic component 7 such as a semiconductor chip, which is a chip of a semiconductor device, is provided at the center of the surface of the package substrate 2.
A plurality of bonding pads (pads, surface electrodes) 8 are arranged on the package substrate 2 around the center thereof, and a power ring 9 is arranged around the bonding pads 8. Have been.

The method of manufacturing the wiring board 1 according to the present embodiment
It is described next.

That is, wiring layers 1b and 1d made of a copper layer or the like are formed on the surface of a wiring board 1c which is an insulating plate made of a printed board or the like. In this case, the wiring layer 1b (1
The pattern of d) is formed.

Next, the wiring board plates 1a and 1e are laminated on the surface of the wiring board board 1c, and thereafter, through holes (through holes) are formed by drilling or the like, and the through holes are formed of a copper layer or the like. The wiring layer 1f is formed. Next, external electrodes 1g of the wiring board 1 (the package substrate 2 in the wiring board 1) are formed on the surfaces of the wiring board plates 1a and 1e. In this case, the pattern of the external electrode 1g is formed using a lithography technique and a selective etching technique.

In this case, the wiring board plates 1a,
1c and 1e, but according to design specifications, an embodiment using three or more layers of wiring board plates can be used, and an embodiment using only 1c as a single-layer plate can be used. Can be.

After that, a nickel (Ni) and gold (Au) layer (conductive layer) is deposited on the surface of the wiring board plate 1e by plating, and then the outer periphery of a region to be the package substrate 2 is filtered. The slit 4 and the counterbore 6 are formed by a manufacturing process using processing, a manufacturing process using a punching die, or a manufacturing process using lithography technology and selective etching technology. Further, a bonding pad 8 and a power ring 9 which are patterned gold layers are formed.

In this case, in the method of manufacturing the wiring board 1 of the present embodiment, the manufacturing process of the slit 4 and the counterbore 6 includes a manufacturing process using luter processing, a manufacturing process using a punching die, and a lithography technique. It is characterized by having a manufacturing process using a selective etching technique.

Further, in the method of manufacturing the wiring board 1 according to the present embodiment, a lead for applying a gold plating process to a gold layer (conductive layer) as the bonding pad 8 is drawn out from the inner layer circuit, and the lead is inserted into the slit 4 and the seat. It is characterized by having a manufacturing process of cutting by the boring 6. In another embodiment of the present embodiment, the surface of the wiring board plate 1e is
A manufacturing process of depositing a gold layer (conductive layer) using a CVD (Chemical Vapor Deposition) method or a sputtering method can be applied according to design specifications.

According to the above-described wiring board 1 of the present embodiment, the wiring board 1 having the plurality of package boards 2
In addition, a slit 4 is provided around the package substrate 2, and a connecting portion 5 that mechanically connects the package substrate 2 and the peripheral portion 3 of the wiring substrate 1 to a part of the slit 4.
Is provided, and the counterbore 6 is provided in a part of the connecting portion 5, so that a plurality of package substrates 2 are present on the same sheet, and the package substrates 2 do not become individual pieces,
Handling of the wiring board can be facilitated.

According to the wiring board 1 of the present embodiment, the counterbore 6 is provided in a part of the connecting portion 5 so that the electronic component such as a semiconductor chip mounted on the package board 2 is mounted. When a sealing agent is injected at the time of sealing to perform sealing, the sealing agent can be formed by surface tension using the counterbore 6 and the slit 4 which are connection concave portions, so that excellent mounting can be performed. Thus, an electronic device including a high-performance and highly reliable semiconductor device can be formed.

According to the wiring board 1 of the present embodiment, since the slit 4 and the counterbore 6 exist between the peripheral portion 3 and the package board 2, the wiring board 1, the package board 2, and the mounting body are provided. In the package manufacturing process as described above, the package substrate 2 can have a strength that does not separate into individual pieces.

According to the wiring board 1 of the present embodiment, after mounting electronic components such as a semiconductor chip on the package board 2, the package board 2 is manually mounted after the manufacturing process of the package as a mounting body. Since it has a structure that can be easily cut by cutting with a nipper, dicing by an automatic machine, or a split mold, an electronic device such as a semiconductor device can be manufactured through an easy manufacturing process, thereby reducing costs. be able to.

According to the method of manufacturing the wiring board 1 of the present embodiment, the manufacturing process of the slit 4 and the counterbore 6 may be selected from a manufacturing process using luter processing, a manufacturing process using a punching die, or a lithography technique. A manufacturing process using an etching technique, in which a lead wire for performing a gold plating process on a gold layer (conductive layer) as a bonding pad 8 is drawn out from an inner layer circuit, and the lead wire is cut by a slit 4 and a spot facing 6. By having the steps, the wiring board 1 can be manufactured through an easy manufacturing process, the cost can be reduced, and the wiring board 1 with high performance and high reliability can be manufactured.

(Embodiment 2) FIG. 3 is a schematic plan view showing a manufacturing process of a semiconductor device using a wiring board according to Embodiment 1 of the present invention. FIG. 4 is a schematic cross-sectional view showing an enlarged cross section taken along the line AA in FIG. A semiconductor device using the above-described wiring substrate 1 of the first embodiment and a method of manufacturing the same will be described with reference to FIGS.

As shown in FIG. 3 and FIG. 4, for example, an LSI is provided at the center of the package substrate 2 of the wiring substrate 1 of the first embodiment with an insulating adhesive 11 interposed therebetween.
A semiconductor chip 10 having a semiconductor element of a semiconductor integrated circuit device (semiconductor device) such as a semiconductor chip is mounted, and the semiconductor chip 10 is set at the center of the package substrate 2. In this case, 10a is a bonding pad (external electrode) arranged on the surface of the semiconductor chip 10.

Thereafter, as shown in FIG. 5, using a wire bonding apparatus, bonding pads 7a as external electrodes arranged on the surface of the semiconductor chip 10 and bonding pads 8 on the package substrate 2 of the wiring board 1 are formed. Are electrically connected using bonding wires 12. In this case, the bonding wire 12
The wire is made of gold or aluminum (Al).

Next, as shown in FIG. 6, using a potting method using a resin sealing device, a sealing agent 13 as a sealing resin is placed on the package substrate 2 of the wiring substrate 1.
Potting.

Thereafter, as shown in FIG. 7, a solder ball (ball) 14 as an external terminal (package electrode) is disposed on the external electrode 1g disposed on the back surface of the package substrate 2 in the wiring substrate 1. In this case, the wiring board 1 according to the present embodiment includes a solder ball 1 serving as an external terminal on the external electrode 1g disposed on the back surface of the package substrate 2.
The BGA substrate is provided by the arrangement of the BGA 4. In addition, as another aspect of the package substrate 2 in the wiring substrate 1 of the present embodiment, packages having various structures such as those of a package substrate including a CSP substrate in which the solder balls 14 are converted into pin wires in a wire state are provided. The substrate 2 can be used.

According to the semiconductor device of the present embodiment and the method of manufacturing the same, the method of manufacturing a semiconductor device using the wiring board 1 of the first embodiment having a plurality of package substrates 2 , A plurality of semiconductor chips 1
Since a semiconductor device having 0 can be manufactured using an easy and simple manufacturing process, a high-performance and high-reliability semiconductor device can be manufactured with a high manufacturing yield.

According to the semiconductor device of the present embodiment and the method of manufacturing the same, since the wiring substrate 1 of the first embodiment is used, a part of the slit 4 on the outer periphery of the package substrate 2 A connecting portion 5 for mechanically connecting the peripheral portion 3 of the substrate 1 is provided.
Is provided with a counterbore 6, so that when a sealing agent 13 made of a resin or the like for sealing for mounting the semiconductor chip 10 mounted on the package substrate 2 is potted, sealing is performed. Agent 13 is on the side of package substrate 2,
Stopping due to surface tension, the sealant 13 can be formed only on the mounting portion. In particular, the sealant 1 on the side of the counterbore 6
3 stops, so that the sealing agent 13 does not flow out to the peripheral portion 3 of the wiring board 1.

Therefore, according to the semiconductor device of the present embodiment and the method of manufacturing the same, the outflow of the sealant 13 is prevented, and the shape and thickness of the mounting portion made of the sealant 13 are made stable. Can be.

According to the semiconductor device of the present embodiment and the method of manufacturing the same, the method of manufacturing a semiconductor device using the wiring board 1 of the first embodiment having a plurality of package After manufacturing a semiconductor device having a plurality of semiconductor chips 10 using an easy and simple manufacturing process, the package substrate 2 can be easily cut by a nipper such as a manual operation, dicing by an automatic machine, or a split mold. Since it has a structure, a plurality of semiconductor devices can be manufactured in an easy manufacturing process, cost can be reduced, and a high-performance and high-reliability semiconductor device can be manufactured with a high manufacturing yield. it can.

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above embodiments, and various modifications may be made without departing from the gist of the invention. Needless to say, it can be changed.

For example, the wiring board of the present invention is a wiring board having a plurality of package boards,
According to design specifications, the number of package substrates can be determined, and the rectangular shape of the package substrate can be made various shapes.

Further, in the wiring board of the present invention, the bonding pads and the power ring in the plurality of package boards can have various modes according to the design specifications.

In the semiconductor device of the present invention, various semiconductor integrated circuit device chips other than the LSI chip can be applied as the semiconductor chip, and as the semiconductor element formed on the chip, a MOSFET, a CMOSFET, a bipolar transistor, , A MOS type, a CMOS type, and a B type.
The present invention can be applied to an iMOS type or BiCMOS type semiconductor integrated circuit device.

Further, the semiconductor device according to the present invention has a MOSF
DRAM (Dynamic Random Access Memor) that includes ET, CMOSFET, BiCMOSFET, etc.
y), various semiconductor integrated circuit devices having a memory system such as an SRAM (Static Random Access Memory) or a logic system.

[0046]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). According to the wiring substrate of the present invention, the wiring substrate includes a plurality of package substrates, wherein a slit is provided around the package substrate, and the package substrate and the peripheral portion of the wiring substrate are partially formed in the slit. Is provided with a concave portion in a part of the connecting portion, so that a plurality of package substrates are present on the same sheet, and the package substrates are separated into individual pieces. This makes it easier to handle the wiring board.

(2). According to the wiring board of the present invention, a connection part that mechanically connects the package substrate and the peripheral part of the wiring board is provided in a part of the slit on the outer periphery of the package substrate, and a part of the connection part is provided. Due to the provision of the concave portion, the surface tension utilizing the concave portion and the slit is used when injecting a sealing agent for sealing for mounting an electronic component such as a semiconductor chip mounted on the package substrate. In this case, the sealing agent can be formed, so that an excellent mounting can be performed, and an electronic device including a high-performance and highly reliable semiconductor device can be formed.

(3). According to the wiring board of the present invention, a connection part that mechanically connects the package substrate and the peripheral part of the wiring board is provided in a part of the slit on the outer periphery of the package substrate, and a part of the connection part is provided. Since the recess is provided, the slit and the recess exist between the peripheral portion and the package substrate, so that the package substrate is separated into individual pieces in the process of manufacturing the wiring substrate, the package substrate, and the package as a mounting body. Can have strength that does not separate.

(4). According to the wiring board of the present invention, after mounting an electronic component such as a semiconductor chip on a package substrate, after a manufacturing process of a package as a mounting body,
Manufacturing of electronic devices such as semiconductor devices with easy manufacturing process, because the package substrate has a structure that can be easily cut by nipper such as manual work, dicing by an automatic machine, and split mold. And cost can be reduced.

(5). According to the method of manufacturing a semiconductor device using the wiring board of the present invention, as a manufacturing process of slits and recesses, a manufacturing process using a luter process or a manufacturing process using a punching die or a lithography technique and a selective etching technique. With the manufacturing process used, a lead wire for applying a gold plating process to a gold layer (conductive layer) as a bonding pad is drawn out of the inner layer circuit, and the manufacturing process is performed by cutting the lead wire with a slit and a concave portion. In addition, the wiring board can be manufactured through an easy manufacturing process, and the cost can be reduced, and a high-performance and highly reliable wiring board can be manufactured.

(6). According to the semiconductor device of the present invention and the method of manufacturing the same, the method of manufacturing a semiconductor device using the wiring board of the present invention having a plurality of package substrates allows a semiconductor device having a plurality of semiconductor chips to be manufactured. Since the semiconductor device can be manufactured using an easy and simple manufacturing process, a high-performance and high-reliability semiconductor device can be manufactured with a high manufacturing yield.

(7). According to the semiconductor device of the present invention and the method of manufacturing the same, by using the wiring substrate of the present invention, the package substrate and the peripheral portion of the wiring substrate are mechanically connected to a part of the slit on the outer periphery of the package substrate Since the connecting portion is provided and a concave portion is provided in a part of the connecting portion, a sealing agent such as a resin for sealing for mounting the semiconductor chip mounted on the package substrate is used. At the time of potting, the sealant stops on the side surface of the package substrate due to surface tension, and the sealant can be formed only on the mounting portion. In particular, a state in which the sealant stops on the side surface of the concave portion and the sealant does not flow out to the peripheral portion of the wiring board can be achieved.

Therefore, according to the semiconductor device and the method of manufacturing the same of the present invention, the outflow of the sealing agent can be prevented, and the shape and thickness of the mounting portion made of the sealing agent can be stabilized. it can.

(8). According to the semiconductor device of the present invention and the method of manufacturing the same, the method of manufacturing a semiconductor device using the wiring board of the present invention having a plurality of package substrates allows a semiconductor device having a plurality of semiconductor chips to be manufactured. After manufacturing using an easy and simple manufacturing process, the package substrate can be easily cut by nipper such as manual work, dicing by an automatic machine or split die, etc. The device can be manufactured by an easy manufacturing process, the cost can be reduced, and a high-performance and high-reliability semiconductor device can be manufactured with a high manufacturing yield.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a wiring board according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view showing an enlarged cross section taken along the line AA in FIG.

FIG. 3 is a schematic plan view showing a manufacturing process of the semiconductor device using the wiring substrate according to the first embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view showing an enlarged cross section taken along line AA in FIG. 3;

FIG. 5 is a schematic cross-sectional view showing a manufacturing step of the semiconductor device using the wiring substrate according to the first embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view showing a manufacturing step of the semiconductor device using the wiring substrate according to the first embodiment of the present invention;

FIG. 7 is a schematic cross-sectional view showing a manufacturing step of the semiconductor device using the wiring substrate according to the first embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 1a Wiring board 1b Wiring layer 1c Wiring board 1d Wiring layer 1e Wiring board 1f Wiring layer 1g External electrode 2 Package board 3 Peripheral part 4 Slit 5 Connecting part 6 Counterbore (recess) 7 Electronic parts Reference Signs List 8 bonding pad 9 power ring 10 semiconductor chip 10a bonding pad 11 adhesive 12 bonding wire 13 sealant 14 solder ball

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takashi Miwa 3-16-1, Shinmachi, Ome-shi, Tokyo Inside the Device Development Center, Hitachi, Ltd. (72) Inventor Tomoaki Nose 6-16, Shinmachi, Ome-shi, Tokyo No. 3 In the Device Development Center, Hitachi, Ltd. (72) Mitsuhisa Harada Inventor 6-5-1, Nishishinjuku, Shinjuku-ku, Tokyo Japan CMK Corporation

Claims (8)

[Claims] 1. A wiring board comprising a plurality of package boards, wherein a slit is provided around the package board, and the package board and a peripheral portion of the wiring board are formed in a part of the slit. A wiring portion, wherein a connecting portion mechanically connecting the connecting portions is provided, and a concave portion is provided in a part of the connecting portion. 2. The wiring board according to claim 1, wherein the package board is a package board on which an electronic component is mounted, and wherein the concave portion is arranged on one side of the connecting portion. Wiring board. 3. The wiring board according to claim 2, wherein said electronic component is a semiconductor chip. 4. A method of manufacturing a semiconductor device using the wiring board according to claim 1, wherein the slit and the recess are manufactured by using a luting process. A method for manufacturing a semiconductor device, comprising a manufacturing process using a punching die or a manufacturing process using a lithography technique and a selective etching technique. 5. A method for manufacturing a semiconductor device using the wiring board according to claim 1, wherein a lead wire for performing gold plating on a conductive layer as a bonding pad is formed from an inner layer circuit. A method for manufacturing a semiconductor device, comprising a manufacturing step of drawing out and cutting the lead wire by the slit and the concave portion. 6. A semiconductor device using the wiring substrate according to claim 1, wherein a semiconductor chip is mounted on a surface of a package substrate in the wiring substrate. 7. The semiconductor device according to claim 6, wherein the package substrate in the wiring substrate is a BGA substrate. 8. The semiconductor device according to claim 6, wherein a semiconductor chip is mounted on a surface of the package substrate cut from the wiring substrate by a region of the concave portion in the wiring substrate. Semiconductor device.