JP2000294450A - Manufacture of laminated metallized film capacitor - Google Patents
Manufacture of laminated metallized film capacitorInfo
- Publication number
- JP2000294450A JP2000294450A JP10078799A JP10078799A JP2000294450A JP 2000294450 A JP2000294450 A JP 2000294450A JP 10078799 A JP10078799 A JP 10078799A JP 10078799 A JP10078799 A JP 10078799A JP 2000294450 A JP2000294450 A JP 2000294450A
- Authority
- JP
- Japan
- Prior art keywords
- film
- metallized
- electrode
- metallized film
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011104 metalized film Substances 0.000 title claims abstract description 132
- 239000003990 capacitor Substances 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000010408 film Substances 0.000 claims abstract description 201
- 150000002500 ions Chemical class 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 230000005611 electricity Effects 0.000 claims abstract description 8
- 230000003068 static effect Effects 0.000 claims abstract description 8
- 238000010030 laminating Methods 0.000 claims description 29
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 12
- -1 polypropylene Polymers 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【001】[0101]
【発明の属する技術分野】この発明は金属化フィルムコ
ンデンサに係り、特に、誘電体フィルムの一面に電極膜
を形成した片面金属化フィルムを多数枚積層して形成さ
れる積層型金属化フィルムコンデンサの製造方法、及び
誘電体フィルムの両面に電極膜を形成した両面金属化フ
ィルムと誘電体フィルムとを交互に多数枚積層して形成
される積層型金属化フィルムコンデンサの製造方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metallized film capacitor, and more particularly to a laminated metallized film capacitor formed by laminating a large number of single-sided metallized films each having an electrode film formed on one surface of a dielectric film. The present invention relates to a manufacturing method and a method for manufacturing a laminated metallized film capacitor formed by alternately laminating a large number of double-sided metallized films in which electrode films are formed on both surfaces of a dielectric film and dielectric films.
【002】[0092]
【従来の技術】図16及び図17に示すように、従来の
金属化フィルムコンデンサ80は、ポリプロピレンやポリ
エチレン、ポリイミド等より成る誘電体フィルム81の表
面に、それぞれアルミニウムや亜鉛等より成る電極膜82
を10nm〜80nmの厚さで被着させた金属化フィルム84を積
層した後に、巻取機によって巻回して終端部を止着し、
これに加熱及び加圧処理を施してコンデンサ素子86を形
成し、該コンデンサ素子86の両端面に金属材料を溶射し
てリード端子接続用の外部電極(メタリコン電極)88
a,88bを形成して成る。上記誘電体フィルム81の表面
には、一方の側辺に沿って所定の幅でマージン部90(す
なわち電極膜82に覆われない部分)が確保されている。
また、他方の誘電体フィルム81の表面にも、上記とは反
対側の側辺に沿って同様のマージン部90が確保されてい
る。2. Description of the Related Art As shown in FIGS. 16 and 17, a conventional metallized film capacitor 80 comprises a dielectric film 81 made of polypropylene, polyethylene, polyimide, or the like, and an electrode film 82 made of aluminum, zinc, or the like, respectively.
After laminating the metallized film 84 applied with a thickness of 10 nm to 80 nm, wound by a winder to secure the end,
This is subjected to heat and pressure treatment to form a capacitor element 86, and a metal material is sprayed on both end surfaces of the capacitor element 86 to form external electrodes (metallicon electrodes) 88 for connecting lead terminals.
a, 88b. On the surface of the dielectric film 81, a margin portion 90 (that is, a portion that is not covered by the electrode film 82) is secured with a predetermined width along one side.
A similar margin 90 is also provided on the surface of the other dielectric film 81 along the side opposite to the above.
【003】この巻回型金属化フィルムコンデンサ80の内
部においては、各電極膜82がそれぞれ誘電体フィルム81
を間に介して重複するように配置されている。また、積
層された各電極膜82の一方の端部は、それぞれ交互に左
右の外部電極88a,88bに接続している。Inside the wound metallized film capacitor 80, each electrode film 82
Are arranged so as to overlap each other. One end of each of the laminated electrode films 82 is alternately connected to the left and right external electrodes 88a and 88b.
【004】[0093]
【発明が解決しようとする課題】ところで、上記従来の
金属化フィルムコンデンサ80の場合、誘電体フィルム81
の両面に配置されコンデンサ電極として機能する各電極
膜82は、一方の誘電体フィルム81には蒸着されているた
め密に接続されているといえるが、他方の誘電体フィル
ム81に対しては単に接触しているだけであり、図17中
の円形拡大部に示すように、両者間には部分的に隙間92
が存在していることとなる。このため、一対のコンデン
サ電極としての電極膜82,82間には、誘電体のみならず
余計な空間が介在することとなり、静電容量の損失が生
じると共に、その空間距離のバラツキによって電荷の蓄
積が不均一となり、いわゆる電荷集中が惹起されるため
にコンデンサとしての特性が不安定となっていた。By the way, in the case of the above-mentioned conventional metallized film capacitor 80, the dielectric film 81
Each electrode film 82 disposed on both surfaces of the electrode film 82 and functioning as a capacitor electrode is said to be densely connected because it is vapor-deposited on one of the dielectric films 81, but is simply connected to the other dielectric film 81. They are only in contact with each other, and as shown by the circular enlarged portion in FIG.
Exists. For this reason, not only a dielectric but also an extra space is interposed between the electrode films 82, 82 as a pair of capacitor electrodes, causing loss of capacitance and accumulation of electric charge due to variation in the spatial distance. Are not uniform, and so-called charge concentration is caused, so that the characteristics as a capacitor are unstable.
【005】もちろん、上記のように一対の金属化フィル
ム84,84を積層・巻回した後に加熱及び加圧工程を施す
ことによって、一方の誘電体フィルム81を他方の電極膜
82に融着させ、この隙間92を極力排除する努力はなされ
ているが、コンデンサ素子全体に対する加熱・加圧処理
によって、電極膜82と誘電体フィルム81との間の部分的
な隙間92を一律に排除することは困難であった。また、
誘電体フィルム81がポリエチレンやポリプロピレンなど
比較的融点の低い材質より構成される場合には、この熱
圧着工程もある程度の成果をあげることができるが、ポ
リイミドのように高耐熱性樹脂よりなる場合には、そも
そもこの方法を用いることができない。このため、巻回
時に一方の誘電体フィルム81と他方の電極膜82との間に
専用の接着剤を被着させ、コンデンサ素子形成後に全体
を加熱して接着剤の溶剤を蒸発させ、以て電極膜82と誘
電体フィルム81間を接合することが試みられている。と
ころが、この場合にはコンデンサ素子86の両端部付近に
被着された接着剤が先に固化して栓をしてしまい、中心
付近のガス化した溶剤が外部に抜け出なくなり、却って
誘電体フィルム81と電極膜82間の隙間を拡張してしまう
危険性があった。Of course, as described above, a pair of metallized films 84, 84 are laminated and wound, and then subjected to a heating and pressing step, so that one dielectric film 81 is connected to the other electrode film.
Efforts have been made to eliminate the gap 92 as much as possible by fusing it to the electrode 82, but by uniformly heating and pressing the entire capacitor element, the partial gap 92 between the electrode film 82 and the dielectric film 81 is uniform. Was difficult to eliminate. Also,
If the dielectric film 81 is made of a material having a relatively low melting point such as polyethylene or polypropylene, this thermocompression bonding step can also achieve a certain result, but when it is made of a high heat-resistant resin such as polyimide, Cannot use this method in the first place. For this reason, a special adhesive is applied between one dielectric film 81 and the other electrode film 82 at the time of winding, and after forming the capacitor element, the whole is heated to evaporate the solvent of the adhesive. Attempts have been made to bond between the electrode film 82 and the dielectric film 81. However, in this case, the adhesive applied near both ends of the capacitor element 86 solidifies first and plugs, so that the gasified solvent near the center does not escape to the outside, and rather the dielectric film 81 There is a danger that the gap between the electrode film 82 and the electrode film 82 will be expanded.
【006】この発明は、従来例の抱える上記の問題を解
決するために案出されたものであり、製造過程において
金属化フィルムコンデンサの電極膜と誘電体フィルムと
の間に余計な隙間が生ずることを有効に防止できる方法
を実現することを目的としている。The present invention has been devised in order to solve the above-mentioned problems of the prior art, and an extra gap is produced between the electrode film of the metallized film capacitor and the dielectric film in the manufacturing process. It is intended to realize a method that can effectively prevent such a situation.
【007】007
【課題を解決するための手段】上記の目的を達成するた
めに、この発明に係る積層型金属化フィルムコンデンサ
の製造方法は、誘電体フィルムの一面に電極膜を形成し
た金属化フィルムを複数枚積層させてコンデンサ素子と
なし、該コンデンサ素子の両端に外部電極を形成し、誘
電体フィルムを間に挟んで対向配置された各電極膜を交
互に異なる外部電極と接続させた積層型金属化フィルム
コンデンサの製造方法であって、各金属化フィルムを積
層させるに際し、各金属化フィルムを帯電させた上で重
ね合わせることにより、各金属化フィルムの誘電体フィ
ルムと他の金属化フィルムの電極膜との間を静電気を利
用して密に接合させること特徴としている。例えば、一
の金属化フィルムを接地された導電性のプレート上に載
置させ、当該金属化フィルムの上面にイオンを照射して
帯電させた後、この上に他の金属化フィルムを重ね合わ
せる工程を、必要回数繰り返すことが該当する。In order to achieve the above-mentioned object, a method of manufacturing a laminated metallized film capacitor according to the present invention comprises a plurality of metallized films each having an electrode film formed on one surface of a dielectric film. A laminated metallized film in which external electrodes are formed at both ends of the capacitor element by laminating the capacitor elements, and each of the electrode films facing each other with the dielectric film interposed therebetween is alternately connected to different external electrodes. A method of manufacturing a capacitor, when laminating each metallized film, by charging each metallized film and then superimposing, the dielectric film of each metallized film and the electrode film of the other metallized film and It is characterized by tightly joining the gaps using static electricity. For example, a step of placing one metallized film on a grounded conductive plate, irradiating the upper surface of the metallized film with ions, and then charging another metallized film thereon. Is repeated a required number of times.
【008】また、この発明に係る他の積層型金属化フィ
ルムコンデンサの製造方法は、誘電体フィルムの両面に
電極膜を形成した金属化フィルムと誘電体フィルムとを
交互に複数枚積層させてコンデンサ素子となし、該コン
デンサ素子の両端に外部電極を形成し、誘電体フィルム
を間に挟んで対向配置された各電極膜を交互に異なる外
部電極と接続させた積層型金属化フィルムコンデンサの
製造方法であって、各金属化フィルムと誘電体フィルム
とを積層させるに際し、各金属化フィルム及び誘電体フ
ィルムを帯電させた上で重ね合わせることにより、各金
属化フィルムの電極膜と誘電体フィルムとの間を静電気
を利用して密に接合させること特徴としている。この場
合にも、一のフィルムを接地された導電性のプレート上
に載置させ、当該フィルムの上面にイオンを照射して帯
電させた後、この上に他のフィルムを重ね合わせる工程
を必要回数繰り返すことにより、金属化フィルムの電極
膜と誘電体フィルムとの間が密に接合されたコンデンサ
素子が得られる。Another method of manufacturing a laminated metallized film capacitor according to the present invention is directed to a method of manufacturing a laminated metallized film capacitor by alternately laminating a plurality of metallized films having dielectric films formed on both surfaces of a dielectric film and dielectric films. A method of manufacturing a laminated metallized film capacitor in which external electrodes are formed at both ends of the capacitor element and electrode films opposed to each other with a dielectric film interposed therebetween are alternately connected to different external electrodes. When laminating each metallized film and the dielectric film, each metallized film and the dielectric film are charged and then superimposed to form an electrode film and a dielectric film of each metallized film. It is characterized by tightly joining the gaps using static electricity. In this case as well, the step of placing one film on a grounded conductive plate, irradiating the upper surface of the film with ions, charging the film, and superimposing another film on the film is performed as many times as necessary. By repeating, a capacitor element in which the electrode film of the metallized film and the dielectric film are tightly joined is obtained.
【009】上記のように、この発明に係る製造方法にあ
っては、各フィルムを強制的に帯電させることにより、
静電気の吸引力を用いて金属化フィルムの電極膜と誘電
体フィルムとを密着接合することができる。しかも、各
フィルムを積層させる際に、その都度このような静電接
合工程が繰り返されるため、コンデンサ素子形成後に各
フィルム間を密着させる従来の方法と異なり、コンデン
サ素子内部の全域に亘って満遍なく密着状態を実現する
ことが可能となる。As described above, in the manufacturing method according to the present invention, by forcibly charging each film,
The electrode film of the metallized film and the dielectric film can be tightly joined to each other by using the attraction of static electricity. In addition, when each film is laminated, such an electrostatic bonding process is repeated each time, so that unlike the conventional method in which each film is closely adhered after the capacitor element is formed, the film is uniformly adhered over the entire area inside the capacitor element. The state can be realized.
【0010】上記金属化フィルムに予め多数の電極膜を
所定の間隔をおいて形成しておき、各フィルムを積層さ
せた後に、このフィルムの積層体を各金属膜単位で切断
することによって、多数のコンデンサ素子を効率的に形
成することができる。この場合、展開配置された一のフ
ィルムを帯電させた後、巻回された他のフィルムを当該
帯電面上で転がして重ね合わせるようにしてもよい。[0010] A large number of electrode films are formed on the metallized film in advance at predetermined intervals, and after laminating the films, the laminated body of the film is cut into metal film units to obtain a large number. Can be efficiently formed. In this case, after charging one developed film, the other wound film may be rolled on the charged surface and overlapped.
【0011】[0011]
【発明の実施の形態】図1は、この発明に係る片面金属
化フィルム10を示すものであり、ポリプロピレンやポリ
エチレン、ポリイミド等より成るシート状の誘電体フィ
ルム12の一面に、矩形状の電極膜14が所定の間隔をおい
て多数配置されている。各電極膜14は、誘電体フィルム
12の一面に、アルミニウムや亜鉛等の金属材料を蒸着さ
せることによって形成されている。FIG. 1 shows a single-sided metallized film 10 according to the present invention. A rectangular electrode film is formed on one surface of a sheet-like dielectric film 12 made of polypropylene, polyethylene, polyimide or the like. A large number 14 are arranged at predetermined intervals. Each electrode film 14 is a dielectric film
It is formed by evaporating a metal material such as aluminum or zinc on one surface of 12.
【0012】この片面金属化フィルム10を多数枚積層さ
せた後、この積層体を図中の点線に沿って各電極膜14単
位で切り分けることにより、図2に示すように、1個の
コンデンサ素子16が得られる。各片面金属化フィルム10
に形成された電極膜14は、それぞれ同じ位置に配置され
ているのではなく、上下に積層された各電極膜14の左右
端部が交互に突出するように、ずらして配置されてい
る。このため、コンデンサ素子16の両端面に金属溶射を
施して外部電極(メタリコン電極)18a,18bを形成す
ると、誘電体フィルム12を間に挟んで、一方の電極膜14
は外部電極18aに接続されると共に、他方の電極膜14は
外部電極18bに接続されることとなり、積層型金属化フ
ィルムコンデンサ20として完成することとなる。After laminating a large number of the single-sided metallized films 10, the laminated body is cut in units of each electrode film 14 along a dotted line in FIG. 16 is obtained. Each one side metallized film 10
The electrode films 14 are not arranged at the same position, but are shifted so that the left and right ends of the vertically stacked electrode films 14 alternately protrude. Therefore, when metal electrodes are sprayed on both end surfaces of the capacitor element 16 to form external electrodes (metallicone electrodes) 18a and 18b, one of the electrode films 14 is sandwiched with the dielectric film 12 interposed therebetween.
Is connected to the external electrode 18a, and the other electrode film 14 is connected to the external electrode 18b. Thus, the multilayer metallized film capacitor 20 is completed.
【0013】ところで、コンデンサ20内において、一の
片面金属化フィルム10の電極膜14と他の片面金属化フィ
ルム10の誘電体フィルム12との間に隙間が形成されない
ようにするためには、シート状の片面金属化フィル10を
積層する際に、各シート間を密着させることが有効であ
る。このため、本発明においては、図3〜図8に示す静
電接合工程を設けている。まず、シート状の片面金属化
フィルム10Aを、電極膜形成面を下にして銅などよりな
る金属プレート22上に載置する。この金属プレート22は
接地されているため、ある程度の分極作用が自然に生
じ、片面金属化フィルム10Aの下面側に負の電荷が現れ
ると共に、上面側に正の電荷が現れる。つぎに、この片
面金属化フィルム10Aの上面に向けて、イオン生成器24
より正イオンを照射させる。この結果、誘電体フィルム
12Aの表面は正の電荷がより強く帯電することとなり、
上記分極作用が強調される形となる。Incidentally, in order to prevent a gap from being formed between the electrode film 14 of the one-sided metallized film 10 and the dielectric film 12 of the other one-sided metallized film 10 in the capacitor 20, a sheet is required. When laminating the single-sided metallized fills 10 in a shape, it is effective to bring the sheets into close contact. For this reason, in the present invention, the electrostatic bonding process shown in FIGS. 3 to 8 is provided. First, the sheet-shaped single-sided metallized film 10A is placed on a metal plate 22 made of copper or the like with the electrode film forming surface facing down. Since the metal plate 22 is grounded, a certain degree of polarization occurs naturally, and a negative charge appears on the lower surface of the single-sided metallized film 10A and a positive charge appears on the upper surface. Next, toward the upper surface of the single-sided metallized film 10A, the ion generator 24
Irradiate with more positive ions. As a result, the dielectric film
The surface of 12A will be more positively charged,
The polarization action is emphasized.
【0014】この状態において、図4に示すように、他
の片面金属化フィルム10Bを電極膜形成面を下にして近
づけると、その電極膜形成面には、正の電荷が強く帯電
した誘電体フィルム12Aの影響を受けて負の電荷が現れ
る。図5に示すように、このまま片面金属化フィルム10
Bを誘電体フィルム12Aの上面に載置させると、片面金
属化フィルム10Aの誘電体フィルム12Aと、片面金属化
フィルム10Bの電極膜14Bとが引き合い、クーロン力に
よって密着接合されることとなる。In this state, as shown in FIG. 4, when the other one-sided metallized film 10B is brought close to the electrode film forming surface, the positively charged dielectric material is strongly charged on the electrode film forming surface. A negative charge appears under the influence of the film 12A. As shown in FIG.
When B is placed on the upper surface of the dielectric film 12A, the dielectric film 12A of the one-sided metallized film 10A and the electrode film 14B of the one-sided metallized film 10B are attracted to each other and are closely joined by Coulomb force.
【0015】つぎに、図6に示すように、片面金属化フ
ィルム10Bの上面に対してイオン生成器24から正イオン
を照射し、正の電荷を帯電させた後、図7に示すよう
に、他の片面金属化フィルム10Cを近づけると、誘電体
フィルム12Bの上面に帯電した正の電荷の影響で、片面
金属化フィルム10Cの下面側に負の電荷が現れる。図8
に示すように、このまま片面金属化フィルム10Cを誘電
体フィルム12Bの上面に載置させると、片面金属化フィ
ルム10Bの誘電体フィルム12Bと片面金属化フィルム10
Cの電極膜14Cとが、クーロン力によって隙間なく接合
されることとなる。Next, as shown in FIG. 6, after the upper surface of the single-sided metallized film 10B is irradiated with positive ions from the ion generator 24 to charge it with a positive charge, as shown in FIG. When the other one-sided metallized film 10C is brought closer, a negative charge appears on the lower surface side of the one-sided metallized film 10C due to the effect of the positive charge charged on the upper surface of the dielectric film 12B. FIG.
When the single-sided metallized film 10C is placed on the upper surface of the dielectric film 12B, the dielectric film 12B of the single-sided metallized film 10B and the single-sided
The C electrode film 14C is joined without any gap by the Coulomb force.
【0016】以上の工程を何度も繰り返すことにより、
多数積層された各片面金属化フィルム10,10間が、密着
状態となる。なお、上記イオン生成器24から照射された
正イオンが、シート状に拡がった誘電体フィルム12A〜
12Cの表面に満遍なく分布されるためには、多数のイオ
ン生成器24を用意するか、イオン生成器24側あるいは金
属プレート22側を移動させることにより、イオン生成器
24によって誘電体フィルム12A〜12Cの表面が走査され
るように構成すればよい。また、各片面金属化フィルム
10を積層するに際し、正確な位置決めを実現するため、
金属プレート22の表面に所定本数の位置決めピンを立設
させておくと共に、各片面金属化フィルム10に位置決め
用の貫通孔を穿設しておき、この貫通孔を位置決めピン
に挿通させるようにすることが望ましい(図示省略)。By repeating the above steps many times,
A large number of laminated single-sided metallized films 10, 10 are in close contact with each other. In addition, the positive ions irradiated from the ion generator 24 are applied to the dielectric films 12A to
In order to be distributed evenly on the surface of 12C, a large number of ion generators 24 are prepared, or the ion generators 24 or the metal plate 22 are moved.
What is necessary is just to constitute so that the surface of the dielectric films 12A-12C may be scanned by 24. In addition, each single-sided metallized film
In order to achieve accurate positioning when laminating 10,
A predetermined number of positioning pins are erected on the surface of the metal plate 22, and a through hole for positioning is formed in each single-sided metallized film 10, and this through hole is inserted through the positioning pin. It is desirable (not shown).
【0017】上記イオン生成器24は、対向配置された放
電電極間(針状電極−平面状電極間)に交流高電圧を印
加させてコロナ放電を発生させ、これによって生成され
た正イオンを気流に乗せて被照射対象物まで導く仕組み
のものである。The ion generator 24 generates a corona discharge by applying an alternating high voltage between the discharge electrodes (between the needle electrode and the planar electrode) disposed opposite to each other, and generates positive ions generated by the air current. And a guide to the object to be irradiated.
【0018】上記のように、イオン生成器24によって各
片面金属化フィルム10の上面に正イオンを照射するよう
に構成したため、積層された各片面金属化フィルムの電
極膜14と誘電体フィルム12間は、クーロン力によって比
較的強固に接合されている。このため、この後に各電極
膜14単位でカッティングを施したり、加圧工程や外部電
極形成工程を経ても、各片面金属化フィルムの電極膜14
と誘電体フィルム12間が容易に剥離することはない。図
2の円形拡大部に示すように、完成した積層型金属化フ
ィルムコンデンサ20内においては、一の片面金属化フィ
ルム10の電極膜14と、他の片面金属化フィルム10の誘電
体フィルム12との間に隙間が生じることを有効に防止す
ることができる。なお、上記のようにシート状の片面金
属化フィルム10を多数枚積層させ、これを各電極膜14単
位で切り分けて個々のコンデンサ素子16となした後に、
電極膜14が露出していない切断面にポリイミドやシリコ
ン等からなる樹脂接着剤を塗布することにより、密に積
層された金属化フィルム10間をさらに強固に固着させる
ようにしてもよい。As described above, since the ion generator 24 is configured to irradiate the upper surface of each single-sided metallized film 10 with positive ions, the distance between the electrode film 14 and the dielectric film 12 of each laminated single-sided metallized film is increased. Are relatively firmly joined by Coulomb force. For this reason, after this, even if cutting is performed for each electrode film 14 unit or a pressing step or an external electrode forming step is performed, the electrode film 14 of each single-sided metallized film can be cut.
And the dielectric film 12 are not easily separated. As shown in the circular enlarged portion of FIG. 2, in the completed laminated metallized film capacitor 20, the electrode film 14 of one single-sided metallized film 10 and the dielectric film 12 of the other single-sided metallized film 10 It is possible to effectively prevent a gap from occurring between them. Note that, as described above, a large number of sheet-shaped single-sided metallized films 10 are laminated, and after each of the electrode films 14 is cut into individual capacitor elements 16,
By applying a resin adhesive made of polyimide, silicon, or the like to the cut surface where the electrode film 14 is not exposed, the metallized films 10 that are densely stacked may be further firmly fixed.
【0019】上記にあっては、シート状の誘電体フィル
ム12の一面に多数の電極膜14を形成した片面金属化フィ
ルム10を積層させてコンデンサ素子16を形成する例を示
したが、シート状の誘電体フィルム12の両面に多数の電
極膜14を所定のパターンで形成した両面金属化フィルム
と、電極膜14の形成されていないシート状の誘電体フィ
ルム12とを交互に積層させても、同様のコンデンサ素子
16を得ることができる。そして、図9〜図14に示すよ
うに、この両面金属化フィルム26と誘電体フィルム12と
を積層させる際にも、クーロン力を利用した静電接合工
程を付加することによって、両面金属化フィルム26の各
電極膜14と誘電体フィルム12との間の密着性を高めるこ
とが可能となる。In the above description, an example is shown in which a capacitor element 16 is formed by laminating a single-sided metallized film 10 having a large number of electrode films 14 formed on one surface of a sheet-shaped dielectric film 12. Even if a double-sided metallized film in which a large number of electrode films 14 are formed in a predetermined pattern on both surfaces of the dielectric film 12 and a sheet-like dielectric film 12 on which the electrode film 14 is not formed is alternately laminated, Similar capacitor element
You can get 16. Then, as shown in FIGS. 9 to 14, when the double-sided metallized film 26 and the dielectric film 12 are laminated, an electrostatic bonding process using Coulomb force is added to the double-sided metallized film 26. It is possible to increase the adhesion between each electrode film 14 and the dielectric film 12.
【0020】まず、図9に示すように、接地された金属
プレート22の表面に両面金属化フィルム26Aを載置す
る。この両面金属化フィルム26Aの一面に形成された各
電極膜14Dと、他面に形成された各電極膜14Eとは、誘
電体フィルム12Dを間に挟んでそれぞれの端部が左右に
ずれるように配置されている。この両面金属化フィルム
26Aの上面に対して、イオン生成器24より正イオンが照
射されると、上面側が強く正に帯電すると共に、下面側
に負の電荷が現れる。図10に示すように、この両面金
属化フィルム26Aの上面に誘電体フィルム12Eを近づけ
ると、両面金属化フィルム26Aの上面に帯電した正の電
荷の影響で、誘電体フィルム12Eの下面側に負の電荷が
現れる。そして、このまま誘電体フィルム12Eを両面金
属化フィルム26A上に載置させると、両面金属化フィル
ム26Aの電極膜14Eと誘電体フィルム12Eの下面とが、
クーロン力によって隙間なく接合されることとなる(図
11)。First, as shown in FIG. 9, a double-sided metallized film 26A is placed on the surface of a grounded metal plate 22. Each electrode film 14D formed on one surface of the double-sided metallized film 26A and each electrode film 14E formed on the other surface are shifted left and right with the dielectric film 12D interposed therebetween. Are located. This double-sided metallized film
When the upper surface of 26A is irradiated with positive ions from the ion generator 24, the upper surface side is strongly positively charged and a negative charge appears on the lower surface side. As shown in FIG. 10, when the dielectric film 12E is brought close to the upper surface of the double-sided metallized film 26A, a negative charge is applied to the lower surface side of the dielectric film 12E due to the positive charge charged on the upper surface of the double-sided metallized film 26A. Appears. When the dielectric film 12E is placed on the double-sided metallized film 26A as it is, the electrode film 14E of the double-sided metallized film 26A and the lower surface of the dielectric film 12E are
The joint is formed without any gap by the Coulomb force (FIG. 11).
【0021】つぎに、図12に示すように、誘電体フィ
ルム12Eの上面に対してイオン生成器24で正イオンを照
射し、正の電荷を帯電させた後、図13に示すように、
他の両面金属化フィルム26Bを誘電体フィルム12Eの上
面に近づけると、この誘電体フィルム12Eの上面に帯電
した正の電荷の影響で、両面金属化フィルム26Bの下面
側に負の電荷が現れる。図14に示すように、このまま
両面金属化フィルム26Bを誘電体フィルム12Eの上面に
載置させると、誘電体フィルム12Eの上面と両面金属化
フィルム26B下面の電極膜14Fとが、クーロン力によっ
て隙間なく接合されることとなる。Next, as shown in FIG. 12, the upper surface of the dielectric film 12E is irradiated with positive ions by the ion generator 24 to charge it with a positive charge. Then, as shown in FIG.
When the other double-sided metallized film 26B is brought closer to the upper surface of the dielectric film 12E, a negative charge appears on the lower surface side of the double-sided metallized film 26B due to the positive charge charged on the upper surface of the dielectric film 12E. As shown in FIG. 14, when the double-sided metallized film 26B is placed on the upper surface of the dielectric film 12E, the upper surface of the dielectric film 12E and the electrode film 14F on the lower surface of the double-sided metallized film 26B are separated by Coulomb force. It will be joined without.
【0022】以上の工程を必要回数繰り返して、両面金
属化フィルム26と誘電体フィルム12を一定の厚さまで積
層させた後、このシート状の積層体を各電極膜14単位で
切り分けることにより、図2に示したのと同様の構成を
備えたコンデンサ素子16を得ることができる。なお、各
両面金属化フィルム26と誘電体フィルム12とを積層配置
させる際には、図示は省略したが、金属プレート22の表
面に位置決め用のピンを所定本数立設させると共に、各
フィルムに対応する位置決め用の貫通孔を設けておき、
各貫通孔を位置決めピンに挿通させることにより、正確
な位置決めを実現することが望ましい。The above steps are repeated as many times as necessary to laminate the double-sided metallized film 26 and the dielectric film 12 to a certain thickness, and then cut this sheet-like laminate into each electrode film 14 to obtain a diagram. A capacitor element 16 having the same configuration as that shown in FIG. 2 can be obtained. When laminating each double-sided metallized film 26 and the dielectric film 12, although not shown, a predetermined number of positioning pins are erected on the surface of the metal plate 22, and corresponding to each film. To provide a through hole for positioning
It is desirable to realize accurate positioning by inserting each through hole into a positioning pin.
【0023】このコンデンサ素子16の場合にも、各電極
膜14と誘電体フィルム12との間がクーロン力によって隙
間なく接合されているため、両端面に外部電極18a,18
bを形成して積層型金属化フィルムコンデンサ20として
完成させた際に、電極膜14,14間には誘電体フィルム12
のみが介在することとなり、余計な隙間の存在によって
特性が不安定となることがない。Also in the case of the capacitor element 16, since the electrode films 14 and the dielectric film 12 are joined without any gap by Coulomb force, the external electrodes 18a, 18
b, the dielectric film 12 is interposed between the electrode films 14 when the multilayer metallized film capacitor 20 is completed.
Only the intervening portion, and the characteristics do not become unstable due to the existence of the extra gap.
【0024】上記にあっては、片面金属化フィルム10同
士あるいは両面金属化フィルム26と誘電体フィルム12と
を積層させるに際し、各フィルムを平面状に展開させた
状態で積層配置させる例を示したが、この発明は必ずし
もこれに限定されるものではない。すなわち、図15に
示すように、一方のフィルムX(片面金属化フィルム1
0、両面金属化フィルム26、あるいは誘電体フィルム1
2)を接地された金属プレート22上に載置し、その上面
をイオン生成器24で走査して満遍なく正に帯電させてお
く。つぎに、巻回された他方のフィルムY(片面金属化
フィルム10、両面金属化フィルム26、あるいは誘電体フ
ィルム12)の終端部を帯電済みのフィルムXの端部に合
わせて固定した後、矢印方向に転がして広げて行けば、
巻回されたフィルムYの外面(下面)に負の電荷が現
れ、展開配置されたフィルムXの上面に帯電した正の電
荷と引き合うため、一方のフィルムXと他方のフィルム
Yとの密着状態が実現できる。In the above, an example has been shown in which, when the single-sided metallized films 10 or the double-sided metallized film 26 and the dielectric film 12 are laminated, the respective films are laminated and arranged in a state of being developed in a plane. However, the present invention is not necessarily limited to this. That is, as shown in FIG. 15, one film X (single-sided metallized film 1)
0, double-sided metallized film 26, or dielectric film 1
2) is placed on a grounded metal plate 22, and its upper surface is scanned by an ion generator 24 to be uniformly charged positively. Next, the other end of the wound film Y (single-sided metallized film 10, double-sided metallized film 26, or dielectric film 12) is fixed to the end of charged film X, and then fixed by an arrow. If you roll in the direction and spread,
Since a negative charge appears on the outer surface (lower surface) of the wound film Y and attracts the positive charge charged on the upper surface of the film X which is deployed and arranged, the close contact state between one film X and the other film Y is reduced. realizable.
【0025】この方法によれば、下側に配置されたフィ
ルムXと、上側に重ねられるフィルムYとの位置決めが
比較的容易であり、端部間の位置決め固定さえ正確に行
っておけば、後は上側のフィルムYを転がして展開して
行くだけで済む利点がある。このため、比較的長尺のフ
ィルム同士を密着接合させた状態で積層させることが可
能となり、積層型金属化フィルムコンデンサの製造効率
を向上させることができる。なお、フィルムXとフィル
ムYとの位置決め固定は、例えば、金属プレート22の表
面に立設された複数の位置決めピンに両フィルムに形成
された複数の貫通孔を挿通させることによって実現され
る。According to this method, the positioning of the film X disposed on the lower side and the film Y superposed on the upper side is relatively easy, and if the positioning and fixing between the ends are accurately performed, the subsequent steps can be performed. Has the advantage that it is only necessary to roll and unfold the upper film Y. For this reason, it is possible to laminate relatively long films in a state of being closely bonded to each other, and it is possible to improve the production efficiency of the laminated metallized film capacitor. Note that the positioning and fixing of the film X and the film Y are realized by, for example, inserting a plurality of through holes formed in both films through a plurality of positioning pins erected on the surface of the metal plate 22.
【0026】[0026]
【発明の効果】この発明に係る積層型金属化フィルムコ
ンデンサの製造方法によれば、金属化フィルムの電極膜
と誘電体フィルムとを、熱圧着工程や接着工程を用いる
ことなく、静電気による吸着作用を利用して密に接合す
ることができる。しかも、各フィルムを積層させる際
に、その都度このような静電接合工程が繰り返されるた
め、コンデンサ素子形成後に各フィルム間を密着させる
従来の方法と異なり、コンデンサ素子内部の全域に亘っ
て満遍なく密着状態を実現することができる。この結
果、コンデンサ素子内部における電極膜間には誘電体フ
ィルムのみが介在することとなり、余計な隙間が一切存
在しないこととなるため、特性の安定した積層型金属化
フィルムコンデンサを得ることが可能となる。According to the method for manufacturing a laminated metallized film capacitor according to the present invention, the electrode film of the metallized film and the dielectric film can be adsorbed by static electricity without using a thermocompression bonding step or an adhesion step. Can be tightly joined by utilizing In addition, when each film is laminated, such an electrostatic bonding process is repeated each time, so that unlike the conventional method in which each film is closely adhered after the capacitor element is formed, the film is uniformly adhered over the entire area inside the capacitor element. State can be realized. As a result, only the dielectric film is interposed between the electrode films inside the capacitor element, and there is no extra gap, so that it is possible to obtain a laminated metallized film capacitor having stable characteristics. Become.
【図1】片面金属化フィルムを示す斜視図である。FIG. 1 is a perspective view showing a single-sided metallized film.
【図2】積層型金属化フィルムコンデンサの内部構造を
示す断面図である。FIG. 2 is a cross-sectional view showing the internal structure of a laminated metallized film capacitor.
【図3】片面金属化フィルムの積層工程を示す断面図で
ある。FIG. 3 is a cross-sectional view showing a step of laminating a one-sided metallized film.
【図4】片面金属化フィルムの積層工程を示す断面図で
ある。FIG. 4 is a cross-sectional view showing a step of laminating a one-sided metallized film.
【図5】片面金属化フィルムの積層工程を示す断面図で
ある。FIG. 5 is a cross-sectional view showing a step of laminating a single-sided metallized film.
【図6】片面金属化フィルムの積層工程を示す断面図で
ある。FIG. 6 is a cross-sectional view showing a step of laminating a single-sided metallized film.
【図7】片面金属化フィルムの積層工程を示す断面図で
ある。FIG. 7 is a cross-sectional view showing a step of laminating a one-sided metallized film.
【図8】片面金属化フィルムの積層工程を示す断面図で
ある。FIG. 8 is a cross-sectional view showing a step of laminating a one-sided metallized film.
【図9】両面金属化フィルムと誘電体フィルムとのの積
層工程を示す断面図である。FIG. 9 is a sectional view showing a step of laminating a double-sided metallized film and a dielectric film.
【図10】両面金属化フィルムと誘電体フィルムとのの
積層工程を示す断面図である。FIG. 10 is a sectional view showing a step of laminating a double-sided metallized film and a dielectric film.
【図11】両面金属化フィルムと誘電体フィルムとのの
積層工程を示す断面図である。FIG. 11 is a sectional view showing a step of laminating a double-sided metallized film and a dielectric film.
【図12】両面金属化フィルムと誘電体フィルムとのの
積層工程を示す断面図である。FIG. 12 is a sectional view showing a step of laminating a double-sided metallized film and a dielectric film.
【図13】両面金属化フィルムと誘電体フィルムとのの
積層工程を示す断面図である。FIG. 13 is a sectional view showing a step of laminating a double-sided metallized film and a dielectric film.
【図14】両面金属化フィルムと誘電体フィルムとのの
積層工程を示す断面図である。FIG. 14 is a cross-sectional view showing a step of laminating a double-sided metallized film and a dielectric film.
【図15】展開した一のフィルム上において巻回された
他のフィルムを転がして両者を積層させる様子を示す説
明図である。FIG. 15 is an explanatory view showing a state where another wound film is rolled on one developed film and both films are laminated.
【図16】従来の巻回型金属化フィルムコンデンサの形
成過程を示す斜視図である。FIG. 16 is a perspective view showing a process of forming a conventional wound metallized film capacitor.
【図17】従来の巻回型金属化フィルムコンデンサの内
部構造を示す断面図である。FIG. 17 is a sectional view showing an internal structure of a conventional wound metallized film capacitor.
10 片面金属化フィルム 12 誘電体フィルム 14 電極膜 16 コンデンサ素子 18a 外部電極 18b 外部電極 20 コンデンサ 22 金属プレート 24 イオン生成器 26 両面金属化フィルム X 展開フィルム Y 巻回フィルム 10 Single-sided metallized film 12 Dielectric film 14 Electrode film 16 Capacitor element 18a External electrode 18b External electrode 20 Capacitor 22 Metal plate 24 Ion generator 26 Double-sided metallized film X Deployment film Y Rolled film
Claims (5)
た金属化フィルムを複数枚積層させてコンデンサ素子と
なし、該コンデンサ素子の両端に外部電極を形成し、誘
電体フィルムを間に挟んで対向配置された各電極膜を交
互に異なる外部電極と接続させた積層型金属化フィルム
コンデンサの製造方法であって、 各金属化フィルムを積層させるに際し、各金属化フィル
ムを帯電させた上で重ね合わせることにより、各金属化
フィルムの誘電体フィルムと他の金属化フィルムの電極
膜との間を静電気を利用して密に接合させること特徴と
する積層型金属化フィルムコンデンサの製造方法。A capacitor element is formed by laminating a plurality of metallized films each having an electrode film formed on one surface of a dielectric film, external electrodes are formed at both ends of the capacitor element, and the dielectric film is interposed therebetween. A method of manufacturing a laminated metallized film capacitor in which each electrode film arranged oppositely is alternately connected to a different external electrode.When laminating each metallized film, each metallized film is charged and then laminated. A method for producing a laminated metallized film capacitor, wherein the dielectric film of each metallized film and the electrode film of another metallized film are tightly joined together by utilizing static electricity.
た金属化フィルムと誘電体フィルムとを交互に複数枚積
層させてコンデンサ素子となし、該コンデンサ素子の両
端に外部電極を形成し、誘電体フィルムを間に挟んで対
向配置された各電極膜を交互に異なる外部電極と接続さ
せた積層型金属化フィルムコンデンサの製造方法であっ
て、 各金属化フィルムと誘電体フィルムとを積層させるに際
し、各金属化フィルム及び誘電体フィルムを帯電させた
上で重ね合わせることにより、各金属化フィルムの電極
膜と誘電体フィルムとの間を静電気を利用して密に接合
させること特徴とする積層型金属化フィルムコンデンサ
の製造方法。2. A capacitor element is formed by alternately laminating a plurality of metallized films each having an electrode film formed on both surfaces of a dielectric film and dielectric films, forming external electrodes at both ends of the capacitor element. A method of manufacturing a laminated metallized film capacitor in which each of the electrode films facing each other with a body film interposed therebetween is alternately connected to different external electrodes, wherein each metallized film and a dielectric film are laminated. By stacking each metallized film and dielectric film after charging, the electrode film of each metallized film and the dielectric film are tightly joined by utilizing static electricity. Manufacturing method of metallized film capacitor.
ィルムを載置させ、当該フィルムの上面にイオンを照射
して当該フィルムを帯電させた後、他のフィルムを重ね
合わせることを特徴とする請求項1または2に記載の積
層型金属化フィルムコンデンサの製造方法。3. A film is placed on a grounded conductive plate, the film is charged by irradiating ions on the upper surface of the film, and then the other film is superimposed. The method for producing a laminated metallized film capacitor according to claim 1.
膜が所定の間隔をおいて形成されており、各フィルムを
積層させた後に、このフィルムの積層体を各金属膜単位
で切断し、以て多数のコンデンサ素子となすことを特徴
とする請求項1〜3の何れかに記載の積層型金属化フィ
ルムコンデンサの製造方法。4. A large number of electrode films are formed on the metallized film in advance at predetermined intervals, and after laminating the films, the laminated body of the film is cut into metal film units. The method for producing a laminated metallized film capacitor according to any one of claims 1 to 3, wherein a large number of capacitor elements are formed.
た後、巻回された他のフィルムを当該帯電面上で転がし
て重ね合わせることを特徴とする請求項4に記載の積層
型金属化フィルムコンデンサの製造方法。5. The multi-layer metallization according to claim 4, wherein, after charging one of the unfolded films, the other wound film is rolled and overlapped on the charged surface. Manufacturing method of film capacitor.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10078799A JP3656210B2 (en) | 1999-04-08 | 1999-04-08 | Manufacturing method of multilayer metallized film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10078799A JP3656210B2 (en) | 1999-04-08 | 1999-04-08 | Manufacturing method of multilayer metallized film capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000294450A true JP2000294450A (en) | 2000-10-20 |
| JP3656210B2 JP3656210B2 (en) | 2005-06-08 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012231112A (en) * | 2011-04-26 | 2012-11-22 | Samsung Electro-Mechanics Co Ltd | Multilayer thin film for ceramic electronic component and manufacturing method for the film |
| JP5588579B1 (en) * | 2013-05-21 | 2014-09-10 | 日機装株式会社 | Laminating apparatus and laminating method |
| KR101440008B1 (en) | 2013-05-21 | 2014-09-12 | 니기소 가부시키가이샤 | Lamination device and lamination method |
| JP2016134477A (en) * | 2015-01-19 | 2016-07-25 | トヨタ自動車株式会社 | Metalization film capacitor |
| CN113311623B (en) * | 2020-02-27 | 2023-11-21 | 夏普株式会社 | display panel |
-
1999
- 1999-04-08 JP JP10078799A patent/JP3656210B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012231112A (en) * | 2011-04-26 | 2012-11-22 | Samsung Electro-Mechanics Co Ltd | Multilayer thin film for ceramic electronic component and manufacturing method for the film |
| US8974901B2 (en) | 2011-04-26 | 2015-03-10 | Samsung Electro-Mechanics Co., Ltd. | Multilayer thin film for ceramic electronic component and method of manufacturing the same |
| JP5588579B1 (en) * | 2013-05-21 | 2014-09-10 | 日機装株式会社 | Laminating apparatus and laminating method |
| KR101440008B1 (en) | 2013-05-21 | 2014-09-12 | 니기소 가부시키가이샤 | Lamination device and lamination method |
| TWI462366B (en) * | 2013-05-21 | 2014-11-21 | Nikkiso Co Ltd | Lamination device and lamination method |
| WO2014188607A1 (en) * | 2013-05-21 | 2014-11-27 | 日機装株式会社 | Lamination device and lamination method |
| EP2889948A4 (en) * | 2013-05-21 | 2015-07-01 | Nikkiso Co Ltd | DEVICE AND METHOD FOR STRATIFICATION |
| US9472825B2 (en) | 2013-05-21 | 2016-10-18 | Nikkiso Co., Ltd. | Lamination device and lamination method |
| JP2016134477A (en) * | 2015-01-19 | 2016-07-25 | トヨタ自動車株式会社 | Metalization film capacitor |
| CN113311623B (en) * | 2020-02-27 | 2023-11-21 | 夏普株式会社 | display panel |
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| Publication number | Publication date |
|---|---|
| JP3656210B2 (en) | 2005-06-08 |
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