JP2000288901A - Wire with hole for wire saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To sufficiently interpose abrasive grains between a wire and a workpiece by forming holes on the surface of the wire. SOLUTION: Holes 32 are formed on the surface of this wire 12. The holes 32 can be formed by any method, but shot blast or electric discharge machining is generally considerable. The holes 32 can have undefined shapes and proper depths or sizes, on condition that the strength of the wire 12 is never deteriorated to a fixed level or more by the formation of the holes 32. When the holes 32 are formed on the surface of the wire 12, abrasive grains are fitted to the holes 32 and penetrated into a workpiece. The abrasive grains are interrupted by the walls of the holes 32 and prevented from running out according to the movement of the wire 12. Accordingly, the cutting effect by abrasive grains can be enhanced to improve the cutting property.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a perforated wire used for a wire saw that uses a wire as a cutting tool.

[0002]

2. Description of the Related Art When a wafer or the like is manufactured using a single crystal or polycrystal of silicon, the block is sliced into a large number and products are obtained.
According to a wire saw using a wire having a small diameter of less than 1 mm (a copper-plated piano wire is often used) as a cutting tool, a cutting width is small and an economical product can be obtained.

[0003]

The principle of cutting a wire saw is that abrasive grains (which constitute an abrasive slurry by being dispersed in a dispersion medium) are interposed between a moving wire and a workpiece.
The workpiece is cut by the grinding action of the abrasive grains, but if the wire with a circular cross section is moved directly while hitting the workpiece, the contact between the wire and the workpiece The resistance prevents the abrasive slurry from being successfully introduced into the friction surface.

For this reason, the following wires have been devised. One is to fix the abrasive grains on the surface of the wire with electrodeposition or an adhesive, but this will damage the surface of the drum or roller on which the wire is stretched, and accordingly the tension control of the wire Etc. may not work well. In addition, there is a disadvantage that the life of the wire due to wear of the fixed abrasive is short, and it is not economical.

The second is a method of forming a spiral groove on the surface of a wire or twisting a thin wire as disclosed in Japanese Patent Application Laid-Open No. 8-71908 to form a single wire. Then, grooves and dents are formed on the surface of the wire, and the abrasive slurry enters the wires.Since these grooves and dents are continuous in a spiral, the abrasive grains are formed by the contact resistance between the wire and the workpiece. Escapes in the axial direction and may not provide sufficient grinding ability. It can also be pointed out that the manufacturing cost is high. The present invention has been made to solve such a problem, and is intended to allow abrasive grains to sufficiently intervene on a friction surface between a wire and a workpiece.

[0006]

Under the above-mentioned problems, the present invention provides a wire with a hole for a wire saw, wherein a hole is formed in the surface of the wire. According to this, since the hole is recessed from the surface, the abrasive grains enter the hole and the carryability into the workpiece increases, and the abrasive grains entering the hole have a contact resistance, Is hardly escaped by being stopped by the wall of the hole. Therefore, a great improvement in cutting efficiency can be expected.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 3 is an explanatory view of a wire saw showing an example of the present invention, and FIG. 4 is an explanatory view of a main part thereof. However, since the wire saw itself is already well known, only a brief description will be given here.

That is, one wire 12 fed from the bobbin 10 is connected to a dancer roll type tension adjusting device 14.
Via the (in this example, three are arranged in a triangle)
Are spirally wound along guide grooves into which the wires 12 formed on the sheaves 16, 18, and 20 are fitted to form a row of wires at a predetermined pitch in a cutting zone A formed by the sheaves 16, 18, and 20. Then, it is wound around the bobbin 24 again through the tension adjusting device 22. The bobbin 10 rotates in one direction to continuously pay out the wire 12, and the bobbin 24
Also rotates in one direction to continuously wind the wire 12. Along with this, the wire 12 in the cutting zone A also travels in one direction.

In this case, the traveling speed of the wire 12 is 800
The rotation speed of both bobbins 10, 24 is controlled so as to keep this speed constant. Below the wire 12 stretched between the two sheaves 18 and 20 in the cutting zone A, a workpiece 26 is fixedly provided on a table 28 or the like, and the table 28 gradually rises. Then, the wire 12 cuts the workpiece 26. In this case, when the remaining wire 12 of the unwinding bobbin 10 is reduced, the winding bobbin 24 is now unwound.
And the wire 12 is caused to run in the reverse direction. Such reciprocation is repeated until the cutting is completed.

When the workpiece 26 is cut by the wire 12, abrasive grains are applied to the contact portion in order to increase the cutting performance. As the abrasive grains, particles such as blue abrasive are used and dispersed in a dispersion medium to form a slurry. The abrasive slurry is poured onto the workpiece 26 from the abrasive supply pipe 30. However, in this method, since the abrasive slurry does not enter the cutting groove sufficiently, recently, the abrasive slurry is poured into the wire 12 immediately before entering the workpiece 26 and is carried on the wire 12 to the cutting groove. There are many methods. The wire 12 after cutting the workpiece 26
The abrasive grains attached thereto are washed away by a cleaning device (not shown).

Although the abrasive slurry used heretofore has been an oil-soluble slurry using an oily dispersion medium as a dispersion medium, it is preferable to use a water-soluble slurry dispersed in a water-based slurry. According to the water-soluble slurry, there are advantages in that the dispersion medium and the abrasive grains can be easily separated, and that the dispersion medium after separation does not contain a difficult-to-treat harmful substance. In this regard, the water-soluble slurry can be said to be environmentally friendly. In addition, the water-soluble slurry can easily perform a washing operation of washing away abrasive particles attached to the wire 12 after cutting.

The present invention adopts the following as the wire 12 described above. FIG. 1 shows a wire 12 according to the invention.
FIG. 2 is an enlarged external view showing one example. In the present invention, a hole 32 is formed in the surface of the wire 12.
The holes 32 may be formed by any method, but generally, shot brass or electric discharge machining can be considered. Further, it may be formed by press working with a distraction roller or the like. According to the shot brass, the effect of hardening the surface of the wire 12 and increasing the overall strength can be expected,
Another advantage is that the manufacturing cost is not very high.

In this case, the shape of the hole 32 may be indefinite, and the depth and size may be appropriate. However, at least the condition that the strength of the wire 12 is not reduced by a certain amount or more by the formation of the hole 32 is provided. Becomes In addition, the arrangement of the holes 32 may be random, and the density may be appropriate.
If the above-mentioned suppression of the reduction in strength is satisfied, it is preferable to form as high a density as possible. However, it is suitable that each hole 32 is formed as independently as possible.

FIG. 2 is an enlarged sectional view showing a state in which the workpiece 26 is cut using the wire 12 described above. If the hole 32 is formed in the surface of the wire 12 as described above, At this time, the abrasive grains enter the hole 32 and enter the workpiece 26, and the abrasive grains are blocked by the wall of the hole 32 and do not escape outside even when the wire 12 moves.
Therefore, the grinding action by the abrasive grains is enhanced, and the cutting property is improved.

[0015]

As described above, when the wire according to the present invention is used, since the abrasive grains enter the holes formed on the surface of the wire, the ability to carry the abrasive grains into the workpiece is enhanced,
The hole walls prevent the abrasive grains from escaping to the outside due to the contact resistance, and greatly improve the cutting performance.

[Brief description of the drawings]

FIG. 1 is an enlarged external view of a wire showing an example of the present invention.

FIG. 2 is an enlarged sectional view showing a state in which a workpiece is cut using a wire according to an example of the present invention.

FIG. 3 is an explanatory diagram of a wire saw.

FIG. 4 is an explanatory diagram of a main part of the wire saw.

[Explanation of symbols]

 12 wires 32 holes

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3C058 AA05 AA07 AA09 AA11 AA14 AA18 CA01 CB03 CB05 DA02 DA03 3C059 AA01 HA14

Claims (3)

[Claims] 1. A wire with a hole for a wire saw, wherein a hole is formed in the surface of the wire. 2. The wire with a hole for a wire saw according to claim 1, wherein the holes are formed by shot blasting. 3. The wire with a hole for a wire saw according to claim 1, wherein the holes are formed by electric discharge machining.