JP2000286362A - Printed circuit board for ultra-thin BGA type semiconductor plastic package - Google Patents

Abstract

(57) [Abstract] (with correction) [Problem] To produce a printed wiring board for a BGA type semiconductor plastic package which is extremely thin, hardly warps, and has excellent heat resistance, electrical insulation after moisture absorption, migration resistance, and the like. . SOLUTION: As a substrate of a semiconductor plastic package, a circuit board is formed using a glass cloth base material double-sided copper-clad laminate having a thickness of 0.04 to 0.15 mm, and a glass cloth base material having the same thickness is formed on both surfaces after surface treatment. Thermosetting resin composition e
Is laminated and molded, and after removing portions of the bonding pad f and the ball pad g by a sand blast method, a noble metal plating is applied to obtain a printed wiring board. Further, a polyfunctional cyanate resin composition is used as the resin for the copper burr laminate and the prepreg.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a printed wiring board for a chip scale package (CSP), which is mounted on a small printed wiring board having substantially the same size. The obtained printed wiring board has a semiconductor chip mounted thereon and is used for applications such as microcontrollers, ASICs, and memories. This package is connected to a motherboard printed wiring board using solder balls, and is used as an electronic device or the like.

[0002]

2. Description of the Related Art Conventionally, a chip scale package (CSP)
As the base material, a thin plate such as a glass epoxy material, a polyimide film material, and a ceramic material is mainly used.
These packages have a solder ball spacing of 0.8m
m or more, but the solder ball pitch and circuit line / space are becoming increasingly narrower in recent years in order to achieve thinner, smaller, and lighter weight. Electrical insulation, migration resistance, etc., have become problems. In addition, conventional plastic ball grid arrays (P-BGA), the adhesion of solder balls such as CSP to the base material became weaker as the size of the solder ball pad became smaller, and this was the cause of failure. . Further, since the substrate is thin, warpage is unavoidable due to variations in the thickness of the solder resist on the front and back and differences in the residual ratio of the copper foil.

[0003]

SUMMARY OF THE INVENTION The present invention provides a printed circuit board for CSP in which the above problems are greatly improved.

[0004]

SUMMARY OF THE INVENTION The present invention provides a semiconductor chip scale package having a thickness of 15 mm.
A glass cloth substrate double-sided copper-clad laminate having an insulating layer of 0 μm to 40 μm is used, and at least a semiconductor chip bonding terminal, a solder ball connection pad, a bonding terminal, a copper foil circuit connecting the pad and a through-hole conductor are arranged. After making a circuit board made of, a glass cloth base thermosetting resin prepreg is laminated on the entire front and back, heating, pressing,
Preferably, after lamination molding under vacuum, at least a part of the surface of the bonding terminal and a part of the solder ball connection pad, the glass cloth and the thermosetting resin are removed to expose the circuit, and then nickel plating and gold plating are performed. To provide a printed wiring board for an ultra-thin BGA type semiconductor plastic package. Further, the present invention provides heat resistance and moisture absorption by using a polyfunctional cyanate ester and a thermosetting resin composition containing the cyanate ester prepolymer as an essential component as a resin used for the double-sided copper-clad laminate. Provided is a printed wiring board for CSP having excellent properties such as electrical insulation and migration resistance.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a substrate for a semiconductor chip scale package having a thickness of 150 μm to 60 μm.
Using a glass cloth substrate double-sided copper-clad laminate having an m insulating layer, at least a semiconductor bonding terminal, a solder ball connection pad, and a circuit board on which the bonding terminal and the pad are arranged are prepared, and the entire front and back surfaces are made of a glass cloth base. The thermosetting resin prepregs are laminated and molded by heating, pressurizing, preferably under vacuum, and then a glass cloth of at least a part of the surface of the bonding terminal and a part of the surface of the solder ball connecting pad is heat-cured. Remove the conductive resin to expose the circuit,
This is a printed wiring board in which the surface of the terminal copper foil is pre-treated as necessary and plated with nickel and gold. A semiconductor chip is bonded and fixed on the above-mentioned printed wiring board with a heat conductive adhesive and connected by wire bonding, and the surface is sealed with a sealing resin, or bumps on the lower surface of the semiconductor are printed by flip chip bonding. After being melt-bonded to the terminals of the board and the lower surface of the semiconductor chip is bonded and fixed with an underfill resin, a solder ball is melt-bonded to the back surface to form a semiconductor plastic package. In addition, as the thermosetting resin composition of the double-sided copper-clad laminate, by using a polyfunctional cyanate ester resin composition, heat resistance, electrical insulation after pressure cooker, excellent migration resistance, etc. A printed wiring board is obtained.

Examples of the double-sided copper-clad laminate of the present invention include a double-sided copper-clad board obtained by impregnating a generally known glass woven fabric with a thermosetting resin and drying, and a multilayer board thereof.
As glass fiber, generally known glass fiber, for example,
Woven fabrics such as E, S, and D glass fibers are used, and the thickness is generally 30 to 150 μm. This glass cloth is prepared such that the resin composition is adhered to the B-stage under heating, and then the thickness becomes 40 to 150 μm after lamination. Also, a blending using these yarns can be used. In the base material, a thin material is preferably a material having a high density. The thickness is 50
± 10μm, weight 35-60g / m ² , air permeability 5-25cm
^It is preferable to use one or more sheets of ³ / cm ² · sec.
Alternatively, a single glass woven fabric having a thickness of 40 to 150 μm may be used. There is no particular limitation on the weave,
Plain weave is preferred. ±

[0007] As the resin of the thermosetting resin composition used in the present invention, generally known thermosetting resins are used. Specifically, an epoxy resin, a polyfunctional cyanate ester resin, a polyfunctional maleimide-cyanate ester resin, a polyfunctional maleimide resin, an unsaturated group-containing polyphenylene ether resin, and the like, and one or more kinds Are used in combination. From the viewpoints of heat resistance, migration resistance, electrical properties after moisture absorption, and the like, a polyfunctional cyanate ester resin composition is preferred.

The polyfunctional cyanate compound which is a preferred thermosetting resin component of the present invention is a compound having two or more cyanato groups in a molecule. Specific examples include 1,3- or 1,4-dicyanatobenzene, 1,3,5-tricyanatobenzene, 1,3-, 1,4-, 1,6-, 1,8-, 2 , 6- or 2,7-
Dicyanatonaphthalene, 1,3,6-tricyanatonaphthalene, 4,4-dicyanatobiphenyl, bis (4-dicyanatophenyl) methane, 2,2-bis (4-cyanatophenyl) propane, 2,2- Bis (3,5-dibromo-4-cyanatophenyl) propane, bis (4-cyanatophenyl) ether, bis (4-cyanatophenyl) thioether, bis (4-cyanatophenyl) sulfone, tris (4-cy (Anatophenyl) phosphite, tris (4-cyanatophenyl) phosphate, and cyanates obtained by reacting novolak with cyanogen halide.

In addition to these, Japanese Patent Publication Nos. 41-1928 and 43-1846
8, polyfunctional cyanate compounds described in JP-A-44-4791, JP-A-45-11712, JP-A-46-41112, JP-A-47-26853 and JP-A-51-63149 can also be used. Further, a prepolymer having a molecular weight of 400 to 6,000 and having a triazine ring formed by trimerization of a cyanato group of these polyfunctional cyanate compounds is used. This prepolymer is obtained by polymerizing the above-mentioned polyfunctional cyanate ester monomer with a catalyst such as an acid such as a mineral acid or a Lewis acid; a base such as a tertiary amine such as sodium alcoholate; or a salt such as sodium carbonate. It can be obtained by: The prepolymer also contains some unreacted monomers and is in the form of a mixture of the monomer and the prepolymer, and such a raw material is suitably used for the purpose of the present invention. Generally, it is used after being dissolved in a soluble organic solvent.

As the epoxy resin, generally known epoxy resins can be used. Specifically, liquid or solid bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, alicyclic epoxy resin; butadiene, pentadiene, vinylcyclohexene, dicyclopentyl ether, etc. And polyglycidyl compounds obtained by reacting a polyol, a hydroxyl-containing silicone resin with an epohalohydrin, and the like. These may be used alone or in combination of two or more.

As the polyimide resin, generally known ones can be used. Specific examples include a reaction product of a polyfunctional maleimide and a polyamine, and a polyimide having a terminal triple bond described in JP-B-57-005406. These thermosetting resins may be used alone, but it is preferable to use them in an appropriate combination in consideration of the balance of properties.

Various additives can be added to the thermosetting resin composition of the present invention, if desired, as long as the inherent properties of the composition are not impaired. These additives include polymerizable double bond-containing monomers such as unsaturated polyesters and prepolymers thereof; polybutadiene, epoxidized butadiene, maleated butadiene, butadiene-
Low molecular weight liquid to high molecular weight elastic rubbers such as acrylonitrile copolymer, polychloroprene, butadiene-styrene copolymer, polyisoprene, butyl rubber, fluororubber, natural rubber; polyethylene, polypropylene, polybutene, poly-4-methyl Penten, polystyrene, AS
Resin, ABS resin, MBS resin, styrene-isoprene rubber,
Polyethylene-propylene copolymer, 4-fluoroethylene-
6-fluorinated ethylene copolymers; high molecular weight prepolymers or oligomers such as polycarbonate, polyphenylene ether, polysulfone, polyester, and polyphenylene sulfide; and polyurethane are exemplified and used as appropriate. In addition, other known organic fillers, dyes,
Pigments, thickeners, lubricants, defoamers, dispersants, leveling agents,
Various additives such as a photosensitizer, a flame retardant, a brightener, a polymerization inhibitor, and a thixotropy-imparting agent are used in an appropriate combination as required. If necessary, the compound having a reactive group is appropriately blended with a curing agent and a catalyst. As the inorganic insulating filler, generally known ones can be used. Specifically, natural silica, calcined silica, silica such as amorphous silica and white carbon, titanium white, aerosil, clay, talc, wollastonite, natural mica, synthetic mica, kaolin, alumina, pearlite, aluminum hydroxide, Magnesium hydroxide and the like. The addition amount is 10 to 80% by weight of the total composition, preferably 20 to 7%.
0% by weight. The particle diameter is preferably 1 μm or less. In the present invention, a mixture of aluminum hydroxide and magnesium hydroxide is suitable for imparting flame resistance, for CO2 laser drilling, and the like, and is preferably used.

The thermosetting resin composition of the present invention can be cured by heating itself, but has a low curing rate and is inferior in workability and economic efficiency. Can be used. The amount used is 0.005 to 10 parts by weight, preferably 0.01 to 5 parts by weight, per 100 parts by weight of the thermosetting resin.

The glass substrate-reinforced copper-clad laminate is first impregnated with a thermosetting resin composition and dried to form a B-stage to prepare a prepreg. Next, copper foils are arranged on both sides of the prepreg, and are laminated under heat, pressure, or preferably under vacuum to form a copper-clad laminate. The thickness of the copper foil on both sides is preferably 3 to 18 μm. Thickness 40 ~ 150μ
m glass cloth-based copper-clad laminate is thin,
Due to the thickness variation of the upper and lower solder resists, and furthermore, the difference in the residual ratio of copper foil, the probability of warpage is high,
The workability was poor as a printed wiring board, and the defect occurrence rate was high. In the present invention, instead of this solder resist, a glass cloth base thermosetting resin prepreg is disposed on the front and back of a printed circuit board on which a circuit is formed, a through hole is formed, and surface chemical treatment is performed as necessary, and By disposing a release film on the substrate and laminating and integrating them under heat, pressure, and preferably under vacuum, a printed wiring board with significantly improved warpage could be provided.

[0015] A part of the front surface of the bonding terminal and the thermosetting resin layer of the glass cloth base material on the surface layer of the solder ball connection pad on the back surface are preferably removed by sandblasting.
Thereafter, if necessary, the surface of the copper foil is treated by soft etching or the like, and nickel plating and gold plating are performed by a standard method.

[0016]

The present invention will be specifically described below with reference to examples and comparative examples. Unless otherwise specified, “parts” indicates parts by weight.

Example 1 900 parts of 2,2-bis (4-cyanatophenyl) propane,
100 parts of (maleimidophenyl) methane are melted at 150 ° C.
The mixture was reacted for 4 hours with stirring to obtain a prepolymer. This was dissolved in a mixed solvent of methyl ethyl ketone and dimethylformamide. Add bisphenol A type epoxy resin (trade name: Epicoat 1001, Yuka Shell Epoxy Co., Ltd.)
) And 600 parts of a cresol novolac type epoxy resin (trade name: ESCN-220F, manufactured by Sumitomo Chemical Co., Ltd.) were uniformly mixed and dissolved. Further, as a catalyst, zinc octylate 0.4
Was added and dissolved and mixed to obtain Varnish A. To this, 500 parts of inorganic filler (trade name: calcined talc, manufactured by Nippon Talc Co., Ltd.)
And 8 parts of a black pigment were added, and the mixture was uniformly stirred and mixed to obtain Varnish B. This varnish is 50 μm thick (weight: 53 g / m ² , air permeability:
7 cm ³ / cm ² · sec.) Impregnated in glass woven fabric and dried at 150 ° C., gelation time (at 170 ° C.) 120 seconds, resin content 51%
A prepreg C1 of wt% and a prepreg C2 having a gelation time of 103 seconds and a resin composition content of 60 wt% were prepared.

An electrolytic copper foil (FIG. 1, a) having a thickness of 12 μm is arranged above and below the two prepregs C1 (FIG. 1, b) which are stacked on each other.
Laminate molding was performed for 2 hours under a vacuum of 20 kgf / cm ² , 30 mmHg or less at ℃ to obtain a double-sided copper-clad laminate D having an insulating layer thickness of 121 μm (step of FIG. 1 (1)). Using this, a through hole for a through hole (FIG. 1, d) having a hole diameter of 150 μm was drilled, and the whole was plated with copper. A circuit (FIG. 1, c) was formed on both surfaces, and a black copper oxide treatment was performed to obtain a printed wiring board E (step of FIG. 1 (2)). The prepreg C on both sides of this printed wiring board E
2 and then place a release film on the outside of it, perform laminate molding in the same way (steps in FIGS. 1 (3) and (4)), and peel off the release film. The paint was applied and dried. Then, except for the bonding pad portion on the front surface (Fig. 1, f) and the ball pad portion on the back surface (Fig. 1, g),
After curing by UV irradiation, developing with an alkaline aqueous solution to remove the resist in the bonding pad portion and ball pad portion, and removing the glass cloth base thermosetting resin composition by sandblasting to remove the bonding pad Then, the solder ball pad was exposed (step of FIG. 1 (5)). Thereafter, the exposed surface of the copper foil was soft-etched and nickel-plated and gold-plated by a conventional method to obtain a printed wiring board F of 25 mm square. Table 1 shows the evaluation results of the printed wiring board F.
Shown in A 15 mm square semiconductor chip (FIG. 1, j) is adhered to the surface of the printed wiring board F with a silver paste (FIG. 1, k).
After wire bonding, the entire surface was resin-sealed with an epoxy resin compound (FIG. 1, h) to obtain a semiconductor plastic package G (step of FIG. 1 (6)).

EXAMPLE 2 Aluminum varnish and magnesium hydroxide (average particle size: 10.8 μm) were added to varnish A of Example 1 for 3290 minutes each.
And 1410 parts as a mixture, and thoroughly stirred and mixed to obtain Varnish H. This was impregnated into the glass woven fabric of Example 1,
After drying, prepreg I having a gelation time of 150 seconds and a resin composition content of 71% by weight was obtained. Prepreg J having a gelation time of 35 seconds and a resin composition content of 60% by weight was obtained. Prepreg J
And 12 μm electrolytic copper foils were placed on the front and back sides in the same manner as in Example 1.
A 9 μm double-sided copper-clad laminate was prepared. On this, a mixed solution of water and methanol of a water-soluble polyether resin composition containing 40% by volume of copper oxide powder (average particle size: 0.8 μm) is applied to a thickness of 40 μm, and dried to form a coating film. Then, a carbon dioxide gas laser having an energy of 35 mJ / pulse was irradiated from above on it by four shots to form a through hole having a hole diameter of 100 μm.
The copper foil burr generated in the hole and the copper foil surface were dissolved and removed by etching to make the copper foil thickness 3 μm and also remove the burr. A copper plating of 15 μm was adhered to the whole to form a circuit on both sides. Similarly, apply UV resist to the entire surface and dry the surface, dry the surface, irradiate UV light on the surface of the cloth other than the semiconductor flip chip bumps and the ball pad on the back, and develop with an alkaline aqueous solution in the same manner. And the thermosetting resin composition is removed, and similarly plated with nickel and gold, and the printed wiring board K
And Table 1 shows the evaluation results. A 15 mm square semiconductor chip is mounted on the 16 mm square printed wiring board K by flip chip bonding, the lower side of the semiconductor is filled and fixed with an underfill resin (FIG. 2, m), and the solder balls are melted on the back surface. It was fixed to form a semiconductor plastic package L (FIG. 2).

Comparative Example 1 In Example 1, a UV selective thermosetting resist was applied to the front and back surfaces of the printed wiring board C twice so as to have a thickness of 50 μm, and dried repeatedly. After exposure, the semiconductor chip bonding pads and the solder ball pads on the back surface were exposed. After developing and removing the part, and after thermosetting, apply nickel plating and gold plating to the printed wiring board
M. Similarly, a semiconductor chip was mounted, wire-bonded, and resin-sealed to obtain a semiconductor plastic package N. Table 1 shows the evaluation results.

Comparative Example 2 In Example 1, 700 parts of an epoxy resin (trade name: Epicoat 5045), 300 parts of an epoxy resin (trade name: ESCN-220F), and dicyandiamide 35 were used as the thermosetting resin composition.
And 1 part of 2-ethyl-4-methylimidazole was dissolved in a mixed solvent of methyl ethyl ketone and dimethylformamide, and the mixture was uniformly stirred and mixed. 48g /
A prepreg O having a gelling time of 150 seconds was prepared by impregnating a glass cloth having m ² , a thickness of 51 μm, and an air permeability of 50 cm ³ / cm ² · sec. This prepreg
Use two O, place 12μm electrolytic copper foil on both sides, 190
Laminate molding was performed under a vacuum of 20 kgf / cm ² , 30 mmHg or less at 20 ° C. to produce a double-sided copper-clad laminate. Thereafter, processing was performed in the same manner as in Comparative Example 1 to produce a printed wiring board P, and a semiconductor chip was mounted, wire-bonded, and resin-sealed on the front surface, and a solder ball was bonded on the back surface to obtain a semiconductor plastic package Q. Table 1 shows the evaluation results.

[0022] Table 1 Item implementation example comparisons Example 1 2 1 2 Glass transition temperature (℃) 235 235 235 160 Viscoelastic ^{(x10 10 dyne / cm 2)} 2.0 1.9 over 1.2 insulation resistance after pressure cooker treatment (Omega ) Normal 4x10 ¹⁴ー ー 6x10 ¹⁴ 200hrs.After treatment 6x10 ¹² 2x10 ¹¹ 500hrs.After treatment 6x10 ¹¹ー ー <1x10 ⁸ 700hrs.After treatment 4x10 ¹⁰ー ー 1,000hrs.After treatment 2x10 ¹⁰ー ー ーNormal 6x10 ¹³ー ー 2x10 ¹³ 200hrs.After treatment 5x10 ¹¹ー ー 7x10 ⁹ 300hrs.After treatment 3x10 ¹¹ー ー <1x10 ⁸ 500hrs.After treatment 1x10 ¹¹ー ー ー 1,000hrs.After treatment 9x10 ¹⁰ー ー ー(UL94) ー V-0 ー ー

[0023] Table 1 (Continued) Item implementation example comparisons Example 1 2 1 2 warpage (250X250mm) printed circuit board (mm) F 0.6 K 0.5 M 9 P 15 semiconductor plastic package (μm) G <150 L < 150 N 850 Q 1020

<Measurement method> 1) Glass transition temperature: measured by a DMA method. 2) Viscoelasticity: DM using a laminated board with copper foil etched away
Measured at A. 3) Insulation resistance after pressure cooker treatment: line /
A comb-shaped pattern having a space of 50/50 μm was created, and the prepregs used were arranged on each of the patterns, and the laminated and molded products were treated at 121 ° C. and 2 atm for a predetermined time, and then heated at 25 ° C.
Post-treatment was performed at 60% RH for 2 hours, and the insulation resistance between the terminals was measured 60 seconds after 500 VDC was applied. 4) Migration resistance: 85 ° C, 85% R for the test piece of 3) above
H, 50 VDC was applied and the insulation resistance value between the terminals was measured. 5) Warpage:-Printed wiring board The maximum value of the warpage was measured by placing a work size of 250 x 250 mm on the surface plate.・ Semiconductor plastic package The maximum warpage when a semiconductor chip of 15 mm square was mounted on a 16 mm square or 25 mm square printed wiring board was measured. 6) Flame resistance The copper foil was removed by etching and tested according to UL94.

[0025]

According to the present invention, at least a semiconductor chip bonding terminal, a solder ball connection pad, and a glass cloth substrate double-sided copper-clad laminate having a thickness of 0.15 mm or less and 0.04 mm or more are used as a substrate of a semiconductor chip scale package. After creating a circuit board on which bonding terminals and copper foil circuits connecting the pads and through-hole conductors are arranged,
Heating and pressing the glass cloth substrate prepreg on the entire front and back surfaces, preferably after laminating under vacuum, at least,
A part of the surface of the bonding terminal and a part of the surface of the solder ball connection pad, the glass cloth and the thermosetting resin composition are removed by a sandblast method or the like, and the printed wiring board is manufactured by performing noble metal plating. As a result, the printed wiring board was less warped, and a semiconductor plastic package having a semiconductor chip mounted thereon by wire bonding or flip chip bonding could be obtained with less warpage. Furthermore, by using a polyfunctional cyanate ester as the thermosetting resin composition and the cyanate ester prepolymer as an essential component, it is excellent in heat resistance, electric insulation after pressure cooker treatment, migration resistance and the like. Was obtained, and a product suitable for mass production was obtained.

[Brief description of the drawings]

FIG. 1 is a manufacturing process diagram of a printed wiring board and a semiconductor plastic package of Example 1.

FIG. 2 is an explanatory diagram of a semiconductor plastic package using a printed wiring board according to a second embodiment.

[Explanation of symbols]

 a copper foil b glass cloth base thermosetting resin layer c circuit d through hole e prepreg C2 f semiconductor chip bonding pad part g solder ball pad part h sealing resin i bonding wire j semiconductor chip k silver paste l solder ball m under Fill resin n bump

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H05K 3 / 46K Q T H01L 21/92 602L (72) Inventor Katsuji Komatsu Katsushika Tokyo 6-1-1 Shinjuku-ku, Tokyo Mitsubishi Gas Chemical Co., Ltd. Tokyo factory F-term (reference) 5E346 AA06 AA12 AA15 AA26 BB01 BB16 CC12 CC16 DD02 EE06 EE09 GG15 GG28 HH08

Claims (6)

[Claims] At least a semiconductor chip bonding terminal, a solder ball connection pad, and a copper for connecting a bonding terminal to the pad using a glass cloth substrate double-sided copper-clad laminate having an insulating layer having a thickness of 150 μm to 40 μm. After preparing a circuit board on which a foil circuit and a through-hole conductor are arranged, a glass cloth base thermosetting resin prepreg is superimposed on the entire front and back surfaces, pressed, and laminated and formed under heating. A printed wiring board for an ultra-thin BGA type semiconductor plastic package, wherein a part of the circuit board is exposed by removing a part of the glass cloth and a thermosetting resin on a surface of a solder ball connection pad. 2. The glass cloth used for the glass-clad base material double-sided copper-clad laminate has a thickness of 50 ± 10 μm and a weight of 35 to 50 g / g.
^{2. The} printed wiring board for an ultra-thin BGA type semiconductor plastic package according to claim 1, wherein one or more woven fabrics having m ² and air permeability of 5 to 25 cm ³ / cm ² · sec are combined. 3. The printed wiring board for an ultra-thin BGA type semiconductor plastic package according to claim 1, which is produced by removing a glass cloth and a thermosetting resin composition by a sandblast method. 4. The thermosetting resin composition of a glass cloth substrate double-sided copper-clad board is a thermosetting resin composition containing a polyfunctional cyanate ester and the cyanate ester prepolymer as essential components. The printed wiring board for ultra-thin BGA type semiconductor plastic package according to 1. 5. The printed wiring board for an ultra-thin BGA type semiconductor plastic package according to claim 1, wherein the resin composition of the copper-clad laminate contains 10 to 80% by weight of an insulating inorganic filler. . 6. The ultra-thin BG according to claim 5, wherein the insulating inorganic filler is aluminum hydroxide or magnesium hydroxide.
Printed wiring board for A type semiconductor plastic package.