JP2000283670A - heatsink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance heat dissipation efficiency while reducing the floor occupation area by constituting a heat sink of upstanding heat carriers, and a plurality of planar heat dissipation fins fixed to the heat carrier while inclining. SOLUTION: The heat sink 1 comprises a plurality of heat carriers 2 composed of a heat transfer pipe, e.g. a steel pipe, or a thermal conductor, e.g. a heat pipe, and a plurality of planar fins 3. The fins 3 are fixed to the heat carriers 2 while inclining. The fin 3 is subjected, at a predetermined part thereof, to oblique burring and a resulting obliquely burred part 5 is utilized for fixing the fins 3 to the heat carriers 2. Each fin 3 is arranged to incline by a predetermined angle against a horizontal plane when the heat carriers 2 are used while being raised vertically. Furthermore, temperature of outdoor air is raised by the heat generated from a part to be cooled through the heat carriers 2 and the fins 3. The fins 3 are cooled with outdoor air while making smooth convection of the outdoor air thus keeping the temperature of the part to be cooled at a low level.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a heat sink used for heat radiation and cooling of electronic devices and components thereof mounted on various electronic and electric devices.

[0002]

2. Description of the Related Art Cooling of small parts such as semiconductor elements mounted on various electronic / electrical devices typified by computers and the like, or cooling of large parts such as semiconductor elements used in rectifiers for power transformers and power supplies for vehicles. In recent years, the problem has been attracting attention as an important issue. As a cooling method for such a semiconductor element or the like that requires cooling, a method of attaching a fan to an equipment housing in which it is mounted to cool air in the equipment housing, or a method of cooling a semiconductor element or the like to be cooled. A typical method is to attach a (heat sink) for cooling.

[0003]

Various types of heat sinks for cooling components such as semiconductor elements to be cooled (hereinafter referred to as components to be cooled) have been proposed and put into practical use. The heat sink 81 shown in FIG. 20 is an example of this, and is made of an extruded aluminum material. In the figure, the bottom surface is formed flat to be a contact surface 85 with the component 84 to be cooled, and the heat radiation surface 86 is formed as a chevron or irregular surface on the flat side. And This heat sink is disposed so that the heat radiating surface 86 faces upward or sideways so that the heat radiating surface 86 is in contact with the outside air. Component to be cooled 84
When the temperature rises, the heat from the component to be cooled is transmitted to the heat sink 81, and when the temperature of the heat radiation surface 86 of the heat sink 81 rises, the temperature of the outside air touching it rises and buoyancy is generated between the outside air and the surrounding air. Airflow occurs. As described above, the heat radiating surface 86 of the heat sink 81 faces upward,
Or, by arranging it sideways, the rising air current rises without being hindered by the heat sink 81, new cold outside air flows into the heat radiation surface 86, and the heat radiation surface 86 is air-cooled by natural convection.

However, in the heat sink 81 made of the extruded material, the thickness of the heat radiating surface 86 and the contact surface 85 of the component to be cooled, which is the base plate of the heat sink, is increased.
The number of irregularities formed on the heat radiating surface is limited, and the height of the irregularities is limited due to manufacturing restrictions.
6 cannot take a large surface area, it is difficult to increase the cooling efficiency, and the weight is heavy.

A heat sink having the structure shown in FIG. 21 has been proposed and put into practical use as a heat sink for solving the drawbacks of the heat sink due to such an extruded material. A heat sink 91 shown in FIG. 21 is a heat transfer tube or heat pipe (hereinafter, referred to as a heat transfer body) 92 such as a copper tube, an aluminum tube, an iron tube, and a stainless steel tube.
A plurality of thin flat plates having holes 97 formed by burring are mounted as fins 93 at right angles to the heat transfer body. For cooling the component to be cooled 94 by the heat sink 91, the component to be cooled 94 is attached so as to contact the heat absorbing side 95 of the heat transfer body 92. The heat from the component to be cooled 94 moves from the heat absorbing side 95 of the heat transfer body 92 to the heat radiating side 96, radiates heat to the outside air through the fins 93, and
Is cooled by the natural convection of the outside air, and radiates the heat of the component to be cooled. The heat sink 91 of this structure has an advantage that the heat transfer area can be increased since the thin fins 93 are directly attached to the periphery of the heat transfer body 92, and therefore, it is easy to reduce the size of the device.

However, since the heat sink 91 has the fins 93 mounted at a substantially right angle to the heat transfer body 92, when the heat transfer body 92 is installed vertically, the fins 93 are mounted.
Is horizontal. For this reason, the temperature of the fins 93 rises due to the heat from the heat transfer body 92, and when the outside air warmed by the temperature rise of the fins tries to move upward, it cannot be moved smoothly due to the obstruction of the upper fins, and the warming is not possible. The outside air moves in the horizontal direction along the fin surface. As described above, the convection between the heated outside air and the unheated outside air (outside air around the fins) is not performed smoothly, and this phenomenon becomes more remarkable as the fins are arranged closer to each other. The result is a significant loss.

For this reason, in order to smooth the air cooling by natural convection, the heat transfer body 92 of the heat sink 91 is installed horizontally, and the fins 93 are arranged vertically to improve the heat radiation efficiency. There is. However, when the heat transfer bodies 92 of the heat sink 91 are arranged in the horizontal direction, the heat transfer bodies 92 become longer in the horizontal direction, so that the installation area of the floor upper surface is increased, and the floor area occupancy is deteriorated.

[0008]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the conventional heat sink, and provides a heat sink which is excellent in heat radiation efficiency and does not take up an occupied floor area. According to a first aspect of the present invention, there is provided a heat transfer body that stands vertically.
A heat sink comprising a plurality of plate-shaped radiating fins that are inclinedly attached to the heat transfer body.

The heat transfer body and the heat radiating fin are joined by providing a burr portion on the heat radiating fin by a burring process or the like at a predetermined angle with respect to the fin body, and connecting the heat transfer body to a burring hole having the inclined burr portion. Wherein the fins are attached to the heat transfer member at an angle depending on the angle of the burr portion. It is preferable to join the heat transfer body and the plurality of fins with a good heat transfer bonding agent because the joining can be performed both mechanically and thermally.

A second invention of the present application is directed to a heat transfer member that stands vertically, one or a plurality of narrow heat-dissipating substrates attached at right angles to the heat transfer member, ,
The heat sink further comprises a plurality of heat radiation fins provided so as to protrude from the heat radiation substrate. The radiating fins may be provided on the upper surface of the radiating substrate, provided on the lower surface of the radiating substrate, or provided with the radiating substrate interposed therebetween. Further, it is preferable to dispose the radiating fins provided on the plurality of radiating substrates attached to the heat transfer body in a grid pattern on the upper and lower sides or in a state where they do not overlap with each other, because the improvement of the radiating effect can be expected.
A third invention of the present application is directed to a heat transfer body that stands vertically, one or more narrow heat dissipation boards provided at right angles to the heat transfer body, and a predetermined angle to the heat dissipation board. In addition, the heat sink includes a plurality of heat radiation fins provided so as to protrude from the heat radiation substrate. It is preferable that the heat radiation fins provided on the heat radiation substrate are arranged in a staggered manner above and below the heat radiation fins, because the air flow is disturbed and the heat radiation effect can be further improved.

As described above, according to the present invention, since the plate-shaped radiating fins are provided on the vertically-moving heat transfer body in an inclined manner or in parallel with the heat transfer body (vertically), the cooling target transmitted to the radiator fins is provided. The heat from the components is transferred to the outside air, the warmed outside air flows out to the atmosphere along the flat fins, and the cool air around the fins flows between the fins along the vertically or obliquely arranged fins. Convection of the air becomes smooth, and the heat radiation efficiency is improved. In addition, since the fins are mounted vertically or obliquely, the heat sink itself is slightly higher in the height direction but shorter in the horizontal direction, so that the occupied area of the floor surface is reduced, and thus the heat dissipation efficiency is reduced. In addition to the improvement, the heat sink itself can be designed to be small, and the floor area occupied by electric and electronic equipment incorporating the heat sink of the present invention can be reduced.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. Reference numeral 1 denotes a heat sink, which is a heat transfer tube such as a copper tube, an aluminum tube, an iron tube, a stainless steel tube, or a heat pipe or a heat transfer made of a heat conductor. It comprises a body 2 and a plurality of flat fins 3. The plurality of flat fins 3 are attached obliquely to the heat transfer body 2. The angle θ to be inclined is set in consideration of the heat dissipation efficiency depending on the purpose of use, the place of use, and the like.
The degree is optimal. If the inclination angle θ of the fins 3 is smaller than 30 °, the convection effect of the air flow cannot be expected. If it is 65 ° or more, the inclination becomes too steep, the length in the length direction becomes too long, and the manufacturing efficiency is reduced. This is because it becomes slightly worse. In the figure, reference numeral 4 denotes a component to be cooled.

As shown in FIG. 2, the heat transfer body 2 and the fins 3 are attached by oblique burring to predetermined portions of the flat fins 3 and oblique burrs 5 formed by oblique burring. It is attached to the heat transfer body 2. In this manner, by forming the burr portion formed by the burring process as the slanted burr portion 5, the inclination angle of the plurality of fins 3 can be fixed accurately, easily, and easily. In addition, by increasing the height of the slanted burrs 5, thermal contact with the heat transfer body is improved, and the performance as a heat sink is improved.

As a method of joining the heat transfer body 2 and the plate-like fins 3, in addition to the method of forming the above-mentioned slanted burr portion 5 by burring and joining, as shown in FIG. It is also possible to carry out by using an agent, for example, soldering, and it is also possible to use both burring and bonding (soldering) with an adhesive. FIG. 3 shows a state in which the soldering 6 and the oblique burr portion 5 formed by burring are combined and joined. FIG. 3A shows an example in which the solder 6 is applied on the side opposite to the burr portion 5, and FIG. An example in which solder 6 is applied to the same location as the part 5 is shown. In the case of joining by soldering, when a heat pipe is used as a heat transfer body, the soldering is performed in a temperature range where the heat pipe is not damaged (for example, 150 ° C. to 150 ° C.).
230 ° C). By joining the heat transfer body 2 and the fins 3 with an adhesive having good heat conductivity, the heat transfer body 2 and the fins 3 are connected very well thermally,
The function as a heat sink is further improved.

FIGS. 4 and 5 show another embodiment of the present invention. The embodiment shown in FIG. 4 is characterized in that the positions of the fins 3 attached to the heat transfer body 2 are unbalanced. FIG. 4A shows a front-rear direction with respect to the inclination, and FIG.
Are arranged unbalanced in the left-right direction. The balance can be appropriately changed depending on the size and the position of the device into which the component 4 to be cooled is incorporated. FIG. 5 shows an embodiment in which the flat fins 3 are corrugated. By providing the waves 3A in this manner, the surface area of the fins 3 can be increased, and thus the size of the entire heat sink can be reduced.

FIGS. 6 and 7 show another embodiment (shape) of the fin 3 of the present invention. FIG. 6 shows an embodiment in which a rectangular through hole 68 is provided in the fin 3, and FIG. Through hole 7
In the embodiment in which the fins 3 are provided, the through-holes of an appropriate shape are provided in the fins 3 so that the outside air warmed by the fins 3 can easily escape upward, and the convection around the fins can be further improved. It is something devised. However, the size and number of the through-holes reduce the radiating area of the fin. For this reason, there is a method in which a through hole is provided by bending to prevent a reduction in the heat radiation area. These choices are determined in consideration of the balance between the heat radiation area and the convection of the outside air. The cooling effect can be further improved by considering the movement of the air flow and the heat radiation effect by, for example, changing the position of the through hole by the upper and lower fins. In addition to the above-described embodiment, the fin 3 can be deformed according to the position and location where the component to be cooled 4 and the heat sink 1 are installed by appropriately twisting or bending the flat fin material.

FIGS. 8 to 11 show an embodiment of the second invention of the present application. In FIG. 8, reference numeral 27 denotes a heat radiating substrate. ). Reference numeral 23 denotes a fin provided on the upper surface of the heat dissipation board 27 at right angles to the heat dissipation board 27. The fins 23 extend from the heat dissipation board 27 to the outside except for a part joined to the heat dissipation board as is apparent from the drawing. It protrudes greatly. Reference numeral 25 in the figure denotes a burr. FIG. 9 shows an embodiment in which the fins 23 in FIG. 8 are provided below the heat radiating substrate 27, and FIG. 10 shows a state in which the heat radiating substrate 27 is attached to the heat transfer body 22. The heat dissipating board 27 provided with the plurality of fins 23 and the heat transfer body 22 are joined by fitting the heat transfer body 22 into a burring hole provided on the heat dissipating board 27, and the burr part 25 is used for thermal connection. To join. The burring process is performed at right angles to the heat dissipation substrate 27, and is technically easy. If necessary, the joining portion between the burr portion 25 and the heat transfer body 22 may be reinforced with a good heat conductive joining agent 26 such as solder (FIG. 10C).

FIG. 11 shows a case where a plurality of fins 2
3 is an embodiment in which the fins 23 are attached with the heat dissipation substrate 27 interposed therebetween.
There is an advantage that the distance between the heat radiation substrates 27 attached to the second substrate 2 can be increased. 12 and 13 show an embodiment showing an example of arrangement of fins 23 attached to a heat transfer body. FIG. 12 shows an example in which upper and lower fins 23 are orthogonally arranged like a grid, and FIG. This is an example of arrangement in a shape. By appropriately arranging the positions of the upper and lower fins in this manner, the airflow between the heated outside air and the cooled outside air can be adjusted, and
The degree of freedom of storage in an electronic device or the like can be increased.

FIG. 14 to FIG. 16 show a third invention of the present application.
3 is attached at an angle. FIG. 14 shows the fin 3 tilted in the same direction (rightward or leftward) by a predetermined angle.
3 is an embodiment where 3 is attached. FIG.
16 shows an embodiment in which the fins 33 are arranged to be inclined outward from the vicinity of the center, and FIG. 16 shows an embodiment in which the fins 33 are inclined inward from the vicinity of the center. As described above, by providing the fins 33 at a predetermined angle (30 ° to 65 °) on the heat radiating substrate 37, the flow of the outside air is partially disturbed as shown by the thin line 38 in the drawing, and the heat radiating effect can be improved. .

FIG. 17 shows another embodiment of the present invention, in which a radiating board 47 and fins 43 are integrally formed, and the fins 43 are fixed to the radiating board 47 at a base 49 of the radiating board 47. This is an example of twisting at an angle (including 90 °) to improve airflow. In the drawing, reference numeral 45 denotes a burr portion. FIG. 18 shows a fin 43 provided integrally with the heat dissipation board 47 and a base 49a of the heat dissipation board 47 and another place 49.
b to form a fin structure inclined at a predetermined angle with respect to the heat transfer body. In this manner, the heat transfer board 47 and the fins 43 are integrally formed and the fin portions are processed to form the heat transfer body. It is possible to form a heat dissipation structure having a predetermined angle with respect to. FIG. 19 shows an example in which a looper 48 (cut and raised) is provided on the fin 43 to make the flow of the air flow smoother without significantly reducing the area of the fin.

The heat sink of the present invention is used by erecting the heat transfer body vertically. By using the heat transfer body standing upright, the fins can be fixed at an angle (90
°). By disposing the fins at a fixed angle to the horizontal plane, the heat generated from the component to be cooled can be increased by the heat transfer body and the outside air warmed through the fins, and the convection of the outside air around the fins becomes smooth. The fins are cooled by the outside air, so that the temperature of the component to be cooled can be kept low.

In the above, the shapes of the fins and the like have been described as being independent from each other. However, it is needless to say that various fins can be formed by combining these fins, and the design width of the heat sink can be expanded.

[0023]

As described in detail above, the heat sink of the present invention has an excellent heat radiation effect on the floor occupied area, and the fin shape can be arbitrarily selected. By increasing the degree of freedom in design in this way, the entire equipment (equipment) can be made compact, and the total cost can be reduced. The heat sink can be easily assembled by burring and, if necessary, bonding with a good heat-conductive bonding agent, for example, by adding soldering.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a first embodiment of the present invention,
(A) is a front view, (B) is a plan view.

FIG. 2 is an enlarged explanatory view showing a connection state between a heat transfer body and a fin according to the present invention.

FIGS. 3A and 3B are enlarged explanatory views of another embodiment showing a connection state between a heat transfer body and a fin according to the present invention, respectively.

FIGS. 4A and 4B are explanatory views showing a second embodiment of the present invention, wherein FIG. 4A is a front view, and FIG. 4B is a plan view.

FIG. 5 is an explanatory view showing a third embodiment of the present invention,
(A) is a front view, (B) is a plan view, (C) is a fin 1
It is a side view of a sheet.

FIG. 6 is an explanatory view showing one embodiment of a fin used in the present invention.

FIG. 7 is an explanatory view showing another embodiment of the fin used in the present invention.

FIG. 8 is an embodiment of a fin used in the second embodiment of the present invention, wherein (a) is a front view, (b) is a plan view, and (c).
Is a side view.

FIG. 9 is a front view showing another embodiment of the fin used in the second embodiment of the present invention.

FIG. 10 is an explanatory diagram showing a second embodiment of the present invention,
(A) is a front view, (B) is a plan view, and (C) is a partially enlarged view.

FIG. 11 is a front view showing a third embodiment of the fin used in the second embodiment of the present invention.

FIG. 12 is a front view showing a first arrangement example of fins used in the second embodiment of the present invention.

FIG. 13 is a front view showing a second arrangement example of the fins used in the second embodiment of the present invention.

FIG. 14 is a front view showing a first arrangement example of fins used in the third embodiment of the present invention.

FIG. 15 is a front view showing a second arrangement example of the fins used in the third embodiment of the present invention.

FIG. 16 is a front view showing a third arrangement example of the fins used in the second embodiment of the present invention.

FIG. 17 is an explanatory view showing another embodiment of the fin used in the present invention, wherein (A) is a front view and (B) is a side view.

FIG. 18 is an explanatory view showing another embodiment of the fin used in the present invention, wherein (A) is a front view and (B) is a side view.

FIG. 19 is an explanatory view showing another embodiment of the fin used in the present invention, wherein (A) is a front view and (B) is a side view.

FIG. 20 is an explanatory view showing an example of a conventional heat sink.
(A) is a front view, (B) is a side view, and (C) is a plan view.

21A and 21B are explanatory views showing another example of the conventional heat sink, wherein FIG. 21A is a front view and FIG. 21B is a plan view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat sink 2, 12, 22, 32, 42 Heat transfer body 3, 13, 23, 33, 43 Fin 4 Component to be cooled 5 Burr 6 Solder

Claims (11)

[Claims] 1. A heat sink comprising: a vertically-moving heat transfer body; and a plurality of radiating fins mounted at an angle to the heat transfer body. 2. The radiating fin is provided with a burr portion inclined by a predetermined angle with respect to the fin body by burring, and the heat transfer body is inserted and fixed into a burring hole having the inclined burr portion. The heat sink according to claim 1, wherein 3. The heat sink according to claim 1, wherein the heat transfer body and the radiating fin are joined with a bonding agent having good heat conductivity. 4. A heat-moving body that stands vertically, one or more narrow heat-dissipating boards attached at right angles to the heat-moving body, and a plurality of heat-dissipating boards provided at right angles to the heat-dissipating board. A heat sink comprising a heat radiating fin. 5. The heat sink according to claim 4, wherein the heat radiation fin is provided on an upper surface of the heat radiation substrate. 6. The heat sink according to claim 4, wherein the heat radiation fin is provided on a lower surface of the heat radiation substrate. 7. The heat sink according to claim 4, wherein the heat radiating fins are provided with a heat radiating substrate interposed therebetween. 8. The heat radiating fins provided on a plurality of heat radiating substrates attached to a heat transfer body are arranged in a grid pattern on the upper and lower sides thereof. A heat sink according to any of the above. 9. The heat radiating fins provided on a plurality of heat radiating substrates attached to a heat transfer body are arranged so as not to overlap each other on the upper and lower sides thereof. Heat sink. 10. A heat-moving body that stands upright, one or more narrow heat-dissipating boards provided at right angles to the heat-moving body, and a plurality of heat-dissipating boards provided at a predetermined angle on the heat-dissipating board. A heat sink comprising: a plurality of radiation fins. 11. The heat sink according to claim 10, wherein the heat radiating fins provided on the plurality of heat radiating substrates attached to the heat moving body are arranged in a staggered manner above and below the heat radiating fins.